CN111665658B - Array substrate, display substrate and display device - Google Patents
Array substrate, display substrate and display device Download PDFInfo
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- CN111665658B CN111665658B CN202010606795.6A CN202010606795A CN111665658B CN 111665658 B CN111665658 B CN 111665658B CN 202010606795 A CN202010606795 A CN 202010606795A CN 111665658 B CN111665658 B CN 111665658B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
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Abstract
The invention discloses an array substrate, a display substrate and a display device, wherein the array substrate comprises a substrate, an array layer and a planarization layer; the array substrate comprises a display area and a non-display area, the non-display area comprises a first concave part and a second concave part which are formed on the planarization layer, the first concave part is arranged on one side, close to the display area, of the second concave part, and the second concave part comprises at least one sub-groove; the second concave part comprises a first sub-area and a second sub-area, and the distance from the top surface of the sub-groove in the first sub-area to the substrate base plate is greater than the distance from the top surface of the sub-groove in the second sub-area to the substrate base plate in the direction perpendicular to the plane of the substrate base plate, wherein the second sub-area extends to the first edge of the non-display area far away from one side of the display area. Thereby make keeping away from first edge in the second depressed part and have certain difference in height to the sub-recess that is close to first edge, be favorable to carrying out the water conservancy diversion to the PI liquid that oozes out in the second depressed part, avoid PI liquid to cause the problem of pollution to the welding disc.
Description
Technical Field
The invention relates to the technical field of display, in particular to an array substrate, a display substrate and a display device.
Background
With the rapid progress of Display technology, Liquid Crystal displays have been widely popularized, and in the prior art, a material of an alignment Film used in a Thin Film Transistor Liquid Crystal Display (TFT-LCD) is generally Polyimide (PI). The liquid phase is coated on the array substrate by a coating tool. However, as the frame of the current display is narrower and narrower, the requirement on the manufacturing process of the alignment film is higher and higher, and since PI is in a liquid state during manufacturing, the PI has a phenomenon of liquid diffusion, which easily causes P1 to cover the bonding pad for binding the driving chip, and causes pollution to the bonding pad, thereby affecting the contact sensitivity of the driving chip, and causing problems such as abnormal display of the display. Therefore, it is desirable to provide an array substrate that can avoid the problem of PI spreading onto the bonding pad when the PI is in a liquid state.
Disclosure of Invention
In view of the above, the present invention provides an array substrate, a display substrate and a display device, so as to solve the problem that a bonding pad is contaminated due to easy diffusion when an alignment film is in a liquid state in a display device manufacturing process.
In a first aspect, the present application provides an array substrate, including a substrate, an array layer, and a planarization layer, which are sequentially stacked; the array substrate comprises a display area and a non-display area surrounding the display area, the non-display area comprises a first concave part and a second concave part which are formed on the planarization layer, the first concave part is arranged on one side, close to the display area, of the second concave part, the second concave part comprises at least one sub-groove, any sub-groove comprises a top surface, and the top surface is the surface of one side, far away from the substrate, of the sub-groove;
the second concave part comprises a first sub-area and a second sub-area, and the distance from the top surface of the sub-groove in the first sub-area to the substrate base plate is greater than the distance from the top surface of the sub-groove in the second sub-area to the substrate base plate in the direction perpendicular to the plane of the substrate base plate, wherein the second sub-area extends to a first edge of one side of the non-display area far away from the display area.
In a second aspect, the present application provides a display substrate, which includes a plurality of array substrates and a first region surrounding the array substrates;
wherein the array substrate is formed by cutting away the first region;
the first region comprises a third depressed portion, the third depressed portion is arranged on at least one side of each first region, and the second depressed portion is communicated with the third depressed portion through the first edge.
In a third aspect, the present application provides a display device comprising the array substrate;
the display device further comprises a color film substrate and a liquid crystal layer, wherein the liquid crystal layer is arranged between the array substrate and the color film substrate.
Compared with the prior art, the array substrate, the display substrate and the display device provided by the invention at least realize the following beneficial effects:
the first concave part and the second concave part are arranged in the non-display area of the array substrate, the second concave part extends to the first edge of one side, far away from the display area, of the non-display area, and the heights of a plurality of sub-grooves in the second concave part close to the first edge are smaller than the heights of a plurality of sub-grooves in the second concave part far away from the first edge; thereby make keeping away from first edge in the second depressed part and have certain difference in height to the sub-recess that is close to first edge, be favorable to carrying out the water conservancy diversion to the PI liquid that oozes out in the second depressed part, avoid PI liquid to cause the problem of pollution to the welding disc.
Of course, it is not necessary for any product in which the present invention is practiced to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic view illustrating a display substrate including an array substrate according to an embodiment of the present disclosure;
FIG. 2 is an AA' cross-sectional view of FIG. 1 according to an embodiment of the present application;
FIG. 3 is an enlarged partial view of the area X in FIG. 1 according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of a BB' of FIG. 3 according to an embodiment of the present disclosure;
fig. 5 is a cross-sectional view CC' of fig. 3 according to an embodiment of the present application;
FIG. 6 is another BB' cross-sectional view of FIG. 3 according to an embodiment of the present invention;
FIG. 7 is a schematic view of sweat permeating into the second recess according to the embodiments of the present application;
fig. 8 is a schematic view of a display device according to an embodiment of the present disclosure;
fig. 9 is a DD' cross-sectional view of fig. 8 according to an embodiment of the present application.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the prior art, since the PI is in a liquid state during manufacturing, the PI has a phenomenon of liquid diffusion, which easily causes the P1 to cover the bonding pad for binding the driving chip, and causes pollution to the bonding pad, thereby affecting the contact sensitivity of the driving chip, and causing display abnormality of the display. Therefore, it is desirable to provide an array substrate that can avoid the problem of PI spreading onto the bonding pads when the PI is in a liquid state.
In view of the above, the present invention provides an array substrate, a display substrate and a display device, so as to solve the problem that a bonding pad is contaminated due to easy diffusion when an alignment film is in a liquid state in a display device manufacturing process.
Fig. 1 is a schematic view of a display substrate including an array substrate according to an embodiment of the present disclosure, fig. 2 is an AA 'cross-sectional view of fig. 1 according to an embodiment of the present disclosure, fig. 3 is a partial enlarged schematic view of an X region of fig. 1 according to an embodiment of the present disclosure, fig. 4 is a BB' cross-sectional view of fig. 3 according to an embodiment of the present disclosure, and referring to fig. 1 to 4, an array substrate 1 is provided, in which the array substrate 1 includes a substrate 11, an array layer 12 and a planarization layer 13, which are sequentially stacked; the array substrate 1 comprises a display area 2 and a non-display area 3 surrounding the display area 2, the non-display area 3 comprises a first concave portion 4 and a second concave portion 5 formed on a planarization layer 13, the first concave portion 4 is arranged on one side, close to the display area 2, of the second concave portion 5, the second concave portion 5 comprises at least one sub-groove 51, any sub-groove 51 comprises a top surface 53, and the top surface 53 is the surface of one side, far away from the substrate 11, of the sub-groove 51;
referring to fig. 3 and fig. 4, the second recess 5 includes a first sub-region 511 and a second sub-region 512, and a distance H1 from the top surface 53 of the sub-recess 51 in the first sub-region 511 to the substrate 11 is greater than a distance H2 from the top surface 53 of the sub-recess 51 in the second sub-region 512 to the substrate 11 along a direction perpendicular to the plane of the substrate 11, wherein the second sub-region 512 extends to the first edge 111 of the non-display region 3 away from the display region 2.
With reference to fig. 1 to 4, in particular, the present application provides an array substrate 1, including a substrate 11, an array layer 12 and a planarization layer 13, wherein the array layer 12 is disposed on a side of the substrate 11 facing a light emitting direction of a display panel including the array substrate 1, and the array layer 12 is disposed between the substrate 11 and the planarization layer 13; it should be noted that the structure of the array layer 12 is common knowledge in the related art of the present application, and therefore, in order to simplify the drawings, fig. 2 simply shows the film structure included in the array substrate 1, and does not show the film structures included in the array layer 12, such as the source/drain metal layer, the gate metal layer, and the active layer.
The array substrate 1 provided by the present application includes a display area 2 and a non-display area 3, and the present application only exemplarily provides a structure in which the non-display area 3 is disposed around the display area 2; the non-display area 3 includes a second recess 5 of the first recess 4 formed in the planarization layer 13, wherein the second recesses 5 of the first recess 4 are all used for storing and guiding the PI liquid (the alignment film 21 is in a liquid state) to prevent the PI liquid from contaminating the devices included in the non-display area 3 of the array substrate 1. The first concave part 4 is arranged on one side of the second concave part 5 close to the display area 2, namely, compared with the arrangement position of the second concave part 5, the distance between the first concave part 4 and the display area 2 is shorter, so that the PI liquid will flow into the first concave part 4 when seeping from the display area 2 to the non-display area 3, and when the first concave part 4 is not enough to store the seeped PI liquid, the PI liquid will flow into the second concave part 5; the arrangement of the second recessed portion 5 realizes the flow-blocking effect of the first recessed portion 4 on the PI liquid, and further prevents the PI liquid from flowing to the area where the devices are arranged in the non-display area 3 of the array substrate 1, for example, the PI liquid can be prevented from flowing to the bonding area, so that the probability that the devices arranged in the non-display area 3 are polluted by the PI liquid is reduced.
Referring to fig. 3-4, the second recess 5 disposed in the planarization layer 13 provided by the present application includes at least one sub-recess 51, wherein each sub-recess 51 includes a top surface 53, where the top surface 53 refers to: the sub-groove 51 is internally away from the surface of the substrate base plate 11 side in the direction perpendicular to the plane of the substrate base plate 11. The present application can divide any of the second recesses 5 into at least a first sub-region 511 and a second sub-region 512, wherein the first sub-region 511 and the second sub-region 512 are closely connected; the present application may provide that the bottom surfaces 54 of all the sub-grooves 51 are coplanar, and the bottom surfaces 54 of all the sub-grooves 51 are parallel to the plane of the substrate base plate 11, and the distance H1 from the top surface 53 of the sub-groove 51 located in the first sub-zone 511 to the substrate base plate 11 is greater than the distance H2 from the top surface 53 of the sub-groove 51 located in the second sub-zone 512 to the substrate base plate 11 in the direction perpendicular to the plane of the substrate base plate 11, so that the PI liquid infiltrated into the second recess 5 has a tendency to flow into the second sub-zone 512 along the first sub-zone 511. It should be noted that, the present application does not limit the distance between the top surface 53 of the sub-recess 51 in the first sub-area 511 and the substrate 11 to be equal, and does not limit the distance between the top surface 53 of the sub-recess 51 in the second sub-area 512 and the substrate 11 to be equal, as long as the PI liquid seeped into the second recess 5 can be guided from the first sub-area 511 to the second sub-area 512, so as to prevent the PI liquid from flowing to the area where the components are disposed in the non-display area 3 of the array substrate 1, and further avoid the components disposed in the non-display area 3 from being contaminated by the PI liquid.
In addition, the second sub-region 512 in the second recess 5 of the present application directly extends to the first edge 111 of the non-display region 3 on the side away from the display region 2, where the first edge 111 is a cutting line when the array substrate 1 is cut from its mother board (corresponding to a display substrate mentioned later), where the first edge 111 may be located in the extending direction of the second recess 5, as shown in fig. 3, where the first edge 111 is located on the side of the second recess 5 away from the first sub-region 511, and the second recess 5 is connected to the first edge 111; the present application provides a solution that the extending direction of the second concave portion 5 and the extending direction of the first concave portion 4 are nearly parallel, and the extending direction of the first concave portion 4 is parallel to the lower side edge of the display area 2 as shown in fig. 3; however, the extending direction of the second concave portion 5 is not specifically limited in the present application, that is, the position of the first edge 111 is not limited in the present application, as long as the first concave portion 4 and the second concave portion 5 have the function of storing and guiding the PI liquid seeping into the non-display area 3.
It should be noted that fig. 1 not only shows an arrangement manner in which the first concave portion 4 and the second concave portion 5 are both disposed below the display area 2 (two figures on the left side of the first row in fig. 1); also shown is an arrangement in which a first recess 4 is provided around the display area 2 and a second recess 5 is provided below the display area 2 (shown in the right side view of the first row in fig. 1); this is only two arrangement modes of the first recess 4 and the second recess 5 illustrated in the present application, and the present application does not limit the arrangement shape of the first recess 4 and the second recess 5 and the area of the occupied non-display area 3, as long as the first recess 4 and the second recess 5 can collect and guide the oozing PI liquid.
It should be noted that, since the area shown in fig. 1 is small, all the components included in the array substrate 1 cannot be shown, and fig. 2 shows a part of the structure not shown in fig. 1, which is an enlarged cross-sectional view of fig. 1 based on the common general knowledge in the art. Fig. 3 to 4 only illustrate the sub-grooves 51 included in the second recess 5, and do not represent the number of the sub-grooves 51 included in the array substrate 1, and the number of the sub-grooves 51 included in any second recess 5 can be adjusted according to design requirements; the number of the sub-grooves 51 shown in fig. 4 of the present application is less than that of the sub-grooves 51 shown in fig. 3, only for the purpose that fig. 4 can more clearly show the arrangement of the sub-grooves 51 in the first sub-zone 511 and the second sub-zone 512, and does not represent that a part of the sub-grooves 51 in the cross section is not cut. In addition, the orthographic projection of the stator groove 51 on the substrate 11 is not limited to be circular, and may be set to be in a suitable shape such as a rectangle or a triangle.
Referring to fig. 1 to fig. 3, optionally, a first channel 41 is included between any sub-groove 51 and the first concave portion 4, and the first channel 41 communicates the first concave portion 4 and each sub-groove 51.
Specifically, a first channel 41 for guiding the PI liquid is arranged between any sub-groove 51 in the second depressed part 5 of the non-display area 3 and the first depressed part 4, the first and second recesses 4 and 5 are communicated by the first passage 41, and specifically, the first recess 4 and each sub-groove 51 are communicated by the first passage 41, so that the PI liquid seeps out into the first recess 4, and the storage capacity of the first recess 4 for the PI liquid reaches a certain limit, the PI liquid can flow from the first recess 4 into each sub-groove 51 of the second recess 5 through the first channel 41 to be stored, the second concave part 5 supplements the PI liquid storage capacity of the first concave part 4, so that the PI liquid is prevented from flowing to the area of the array substrate 1 where the components are arranged in the non-display area 3, and the possibility that the components arranged in the non-display area 3 are polluted by the PI liquid is favorably reduced.
It should be noted that, the number of the first channels 41 included between any sub-groove 51 and the first recessed portion 4 is not specifically limited in the present application, for example, only 1 first channel 41 may be provided between one sub-groove 51 and the first recessed portion 4, or 2 or more first channels 41 may be provided between one sub-groove 51 and the first recessed portion 4; the number of the first channels 41 included between any sub-groove 51 and the first recess 4 can be adjusted according to the user's requirement, as long as the first channels 41 can guide the PI liquid from the first recess 4 to the second recess 5. In addition, the volume of the inner space of the first channel 41, or the diameter/spacing of the inner space of the first channel 41, etc. are not limited, and can be adjusted accordingly as required.
Referring to fig. 5, which is a cross-sectional view CC' of fig. 3 provided in an embodiment of the present application, referring to fig. 1-5, optionally, in any of the first channels 41, in a direction perpendicular to the plane of the substrate base 11 along the direction in which the first recess 4 points to the sub-groove 51, distances between the bottom surface 411 of the first channel 41 and the substrate base 11 decrease sequentially.
Specifically, the present application provides a manner of arranging the first channel 41, specifically, in a direction perpendicular to the plane of the substrate base plate 11 along the direction in which the first concave portion 4 points to the sub-groove 51, the distance between the bottom surface 411 of the first channel 41 and the substrate base plate 11 is arranged to decrease sequentially; that is, the plane of the substrate base plate 11 is used as a reference plane, the height H3 of any first channel 41 near the first concave part 4 is greater than the height H4 of any first channel near the sub-groove 51, where the height refers to the distance between the bottom surface of the first channel 41 and the plane of the substrate base plate 11 in the direction perpendicular to the plane of the substrate base plate 11, and the bottom surface 411 of the first channel 41 refers to the surface of the inner space of the first channel 41 near the side of the substrate base plate 11.
The distance between the bottom surface 411 of any one first channel 41 and the substrate base plate 11 is sequentially reduced, so that the first channel 41 which is communicated between the first concave part 4 and the second concave part 5 has a good drainage function under the action of gravity, when the PI liquid collected in the first concave part 4 reaches a certain storage limit, the PI liquid can quickly and accurately flow into each sub-groove 51 in the second concave part 5 through the first channel 41 with the drainage function, and the second concave part 5 supplements the PI liquid collecting capacity of the first concave part 4, and the possibility that components and parts arranged in the non-display area 3 are polluted by the PI liquid is favorably reduced.
And this application has the first passageway 41 of good water conservancy diversion effect and has the second depressed part 5 of good water conservancy diversion effect to PI liquid through the setting for can also be smoothly guided to first edge 111 after spilling over the PI liquid water conservancy diversion in the first depressed part 4 to in the second depressed part 5, be favorable to blockking PI liquid and flow to the region that sets up components and parts in the non-display area 3, improved array substrate 1's preparation yield.
It should be noted that the number of the sub-grooves 51 shown in fig. 5 of the present application is less than the number of the sub-grooves 51 shown in fig. 3, which is only for the purpose that fig. 5 can more clearly show the arrangement of the sub-grooves 51 in the first sub-zone 511 and the second sub-zone 512, and does not represent that some of the sub-grooves 51 in the cross section are not cut.
Referring to fig. 2 and fig. 3, optionally, a second channel 52 is included between any two adjacent sub-grooves 51, and the second channel 52 communicates with the adjacent sub-grooves 51.
Specifically, in the second recessed portion 5, at least one second channel 52 may be disposed between any two adjacent sub-grooves 51, the second channel 52 is used for communicating the two adjacent sub-grooves 51, and the PI liquid in one sub-groove 51 is drained into the other sub-groove 51 through the second channel 52, so that the drainage rate of the PI liquid seeping into the second recessed portion 5 is accelerated, the PI liquid is prevented from overflowing out of the individual sub-groove 51, and the PI liquid overflows out of the second recessed portion 5 to have an adverse effect on the yield of the array substrate 1.
It should be noted that, in the present application, the number of the second channels 52 included between any two adjacent sub-grooves 51 is not specifically limited, and only when at least two sub-grooves 51 are included in the second recess 5, the second channels 52 are disposed in the array substrate 1; for the number of the second channels 52 included between any two adjacent sub-grooves 51, the user can adjust the number according to his or her needs. In addition, the volume of the inner space of the second channel 52 or the diameter/spacing of the inner space of the second channel 52 is not limited, and can be adjusted accordingly as required.
Referring to fig. 1-4, optionally, in any of the second channels 52, in the extending direction of the first sub-area 511 toward the second sub-area 512, the distance between the bottom surface 523 of the second channel 52 and the substrate 11 decreases in the direction perpendicular to the plane of the substrate 11.
Specifically, the present application provides a method for disposing the second channels 52, in which the distance between the bottom face 523 of any one of the second channels 52 and the substrate 11 decreases sequentially in the direction perpendicular to the plane of the substrate 11 along the extending direction of the first sub-region 511 toward the second sub-region 512; that is, for any second channel 52, the distance between the bottom surface 523 of the second channel 52 close to the first sub-area 511 and the substrate 11 is greater than the distance between the bottom surface 523 close to the second sub-area 512 and the substrate 11, so that the PI liquid collected in the sub-groove 51 close to the first sub-area 511 can flow rapidly and accurately into the groove close to the second sub-area 512 through the second channel 52 under the action of gravity. The drainage speed of the PI liquid seeping into the second concave portion 5 is accelerated, the PI liquid is prevented from overflowing from the individual sub-grooves 51, the PI liquid overflowing out of the second concave portion 5 has adverse effects on the yield of the array substrate 1, and the production yield of the array substrate 1 is improved.
Fig. 6 is another BB' cross-sectional view of fig. 3 provided in this embodiment of the application, and referring to fig. 1, fig. 2, fig. 3 and fig. 6, optionally, the depths of the sub-grooves 51 in the second recess 5 decrease in sequence in the direction perpendicular to the plane of the substrate base plate 11 along the extending direction of the first sub-region 511 toward the second sub-region 512.
Specifically, the present application provides a method for disposing the sub-grooves 51 in the second recess 5, along the extending direction of the first sub-region 511 towards the second sub-region 512, in the direction perpendicular to the plane of the substrate base plate 11, the depths of the sub-grooves 51 in the second recess 5 can be disposed to decrease sequentially; here, the bottom surfaces 54 of all the sub-grooves 51 may be coplanar, and the bottom surfaces 54 of all the sub-grooves 51 may also be located on the surface of the planarization layer 13 contacting the array layer 12, and the depth of the sub-grooves 51 in the second recess 5 is sequentially reduced, that is, along the extending direction of the first sub-region 511 toward the second sub-region 512, if the orthographic projections of all the sub-grooves 51 on the substrate 11 are the same, the capability of the sub-grooves 51 to store the PI solution is lower and lower; in other words, when the PI liquid in the sub-groove 51 on the first sub-region 511 reaches a certain limit, the PI liquid will flow into the sub-groove 51 on the second sub-region 512, so as to avoid the risk that the PI liquid collected in the sub-groove 51 flows into the region other than the second recess 5, and block the PI liquid from flowing into the region where the components are disposed in the non-display region 3 of the array substrate 1, which is beneficial to reducing the possibility that the components disposed in the non-display region 3 are contaminated by the PI liquid.
It should be noted that the number of the sub-grooves 51 shown in fig. 6 of the present application is less than that of the sub-grooves 51 shown in fig. 3, only for the purpose that fig. 6 can more clearly show the arrangement of the sub-grooves 51 in the first sub-zone 511 and the second sub-zone 512, and does not represent that a part of the sub-grooves 51 in the cross section is not cut.
Fig. 7 is a schematic view illustrating sweat permeating into the second concave portion according to an embodiment of the present application, please refer to fig. 1, fig. 3, fig. 6, and fig. 7, wherein the depths of the sub-grooves 51 in the second concave portion 5 decrease in sequence along the extending direction of the first sub-region 511 toward the second sub-region 512, that is, the depths of the sub-grooves 51 increase from the first edge 111 toward the extending direction of the first sub-region 511, which is beneficial for avoiding the possibility that sweat in the hand of a user permeates from the first region 101 to the inside of the array substrate 1 when the user holds the display device 200 including the array substrate 1, and the arrow direction shown in fig. 7 is the direction in which sweat permeates from the first region 101 to the inside of the array substrate 1; even if the abnormal conditions of sweat and PI liquid reaction take place, because this application design increases the sub-recess 51 structure that a plurality of heights increase in proper order, block the sweat layer upon layer, greatly increased the degree of difficulty of sweat infiltration.
Referring to fig. 3, it can be seen from fig. 1 that the areas of fig. 3 except for the display area 2 are the non-display areas 3, optionally, the non-display areas 3 further include at least one bonding pad 8, and the bonding pad 8 is disposed on a side of the second recess 5 away from the first recess 4;
the non-display area 3 further comprises a first protrusion 6, and the orthographic projection of the first protrusion 6 on the substrate base plate 11 is positioned between the orthographic projection of the second concave part 5 on the substrate base plate 11 and the orthographic projection of the pad 8 on the substrate base plate 11; and the first bump 6 is formed on the side of the planarization layer 13 away from the base substrate 11.
Specifically, the non-display area 3 of the array substrate 1 is also generally provided with at least one pad 8, and the pad 8 is disposed on a side of the second recess 5 away from the first recess 4, that is, the pad 8 is disposed on a side of the non-display area 3 away from the display area 2.
The application is further provided with a first bulge 6 in the non-display area 3 of the array substrate 1, wherein the first bulge 6 is arranged between the second concave part 5 and the area provided with the bonding pad 8, which can be specifically explained as that the orthographic projection of the first bulge 6 on the substrate 11 is positioned between the orthographic projection of the second concave part 5 on the substrate 11 and the orthographic projection of the bonding pad 8 on the substrate 11, the first bulge 6 is formed on one side of the planarization layer 13 away from the substrate 11, the PI liquid overflowing out of the second concave part 5 is blocked by the first bulge 6, so that when the PI liquid overflowing out of the second concave part 5 overflows to the position of the first bulge 6, the PI liquid is blocked back into each sub-groove 51 of the second concave part 5 by the first bulge 6, and the PI liquid overflowing out of the first concave part 4 and the second concave part 5 is further prevented from flowing to the area provided with the bonding pad 8 in the non-display area 3 of the array substrate 1, it is advantageous to reduce the possibility that the pads 8 provided in the non-display area 3 are contaminated by the PI liquid.
Referring to fig. 3, optionally, in an extending direction of the first sub-area 511 toward the second sub-area 512, a length of the first protrusion 6 is greater than or equal to a length of the second recess 5.
Specifically, in the present application, along the extending direction of the second concave portion 5, or along the extending direction of the first sub-region 511 towards the second sub-region 512, the length of the first protrusion 6 is set to be greater than or equal to the length of the second concave portion 5, so that the PI liquid seeping from any one of the sub-grooves 51 in the second concave portion 5 can be blocked by the first protrusion 6; that is, when the PI liquid overflowing the second concave portion 5 overflows to the position of the first protrusion 6, the first protrusion 6 blocks the PI liquid back to each sub-groove 51 of the second concave portion 5, so that the PI liquid overflowing the first concave portion 4 and the second concave portion 5 is further prevented from flowing to the area where the pads 8 are arranged in the non-display area 3 of the array substrate 1, and the possibility that the pads 8 arranged in the non-display area 3 are polluted by the PI liquid is favorably reduced.
Referring to fig. 1 to fig. 3, optionally, the non-display region 3 further includes a sealant 61, the sealant 61 is disposed on a side of the planarization layer 13 away from the substrate 11, and the first protrusion 6 is disposed on a side of the sealant 61 close to the display region 2.
Specifically, the non-display region 3 of the array substrate 1 is further provided with a sealant 61, wherein the sealant 61 is disposed on a side of the planarization layer 13 away from the substrate 11, and the sealant 61 can be used for bonding and fixing the planarization layer 13 and another film structure (for example, a color film substrate hereinafter) of the sealant 61 away from the planarization layer 13, so as to realize a fixing effect between films; in the present application, the first protrusion 6 for blocking the PI solution from leaking to the pad 8 is disposed on one side of the sealant 61 close to the display area 2. In the array substrate 1, the pad 8 is disposed on one side of the sealant 61 away from the display region 2, and the first protrusion 6 is disposed on one side of the sealant 61 close to the display region 2, so that a certain space can be ensured between the first protrusion 6 and the pad 8, when the PI liquid crosses the first protrusion 6 and seeps out to the pad 8 side, the sealant 61 can further block the PI liquid from flowing to the pad 8, which is beneficial to reducing the possibility that the pad 8 disposed in the non-display region 3 is polluted by the PI liquid.
Referring to fig. 3, optionally, in a direction perpendicular to the plane of the substrate base plate 11, the height of the first protrusion 6 is less than or equal to the thickness of the sealant 61.
Specifically, in the direction perpendicular to the plane of the substrate base plate 11, the height of the first protrusion 6 is set to be less than or equal to the thickness of the frame glue 61; when the height of the first protrusion 6 is equal to the thickness of the sealant 61, the PI solution seeping out of the second concave portion 5 at the position where the first protrusion 6 is disposed flows to the first protrusion 6, and the PI solution does not flow across the first protrusion 6 to the side of the bonding pad 8, so that the problem of pollution caused by the leakage of the PI solution to the bonding pad 8 is avoided to the utmost extent, and the manufacturing yield of the array substrate 1 is improved. When the height of the first protrusion 6 is greater than the thickness of the sealant 61, the introduction of the first protrusion 6 will affect the assembly of the array substrate 1 and the color film substrate, so that the height of the first protrusion 6 is set to be less than or equal to the thickness of the sealant 61, which is beneficial to the realization of the normal assembly of the subsequent array substrate 1 and the color film substrate.
Optionally, the first bump 6 and the planarization layer 13 are made in the same process.
Specifically, the first bump 6 and the planarization layer 13 may be made of the same material, or the first bump 6 and the planarization layer 13 may be made of the same material in the same process, so as to simplify the manufacturing process of the array substrate 1.
Referring to fig. 2 and 3, optionally, the distance between the orthographic projection of the pad 8 on the substrate base plate 11 and the first bump 6 on the substrate base plate 11 is D1, and 50 μm ≦ D1 ≦ 100 μm.
Specifically, the application provides a range of the distance between the pad 8 and the first bump 6, namely, the distance between the orthographic projection of the pad 8 on the substrate base plate 11 and the first bump 6 on the substrate base plate 11 is D1, and the application provides that the value of D1 can be in a range of 50 μm to 100 μm; so that a certain clearance space is included between the land 8 and the first bump 6 for preventing the PI liquid oozing toward the land 8 side across the first bump 6 from flowing toward the land 8. If the distance between the pad 8 and the first bump 6 is set to be smaller than 50 μm, the gap space between the first bump 6 and the pad 8 is too small, and even the sealant 61 with a certain thickness cannot be set; when the gap between the first bump 6 and the pad 8 is too small, if the PI liquid flows across the first bump 6 toward the pad 8, the PI liquid can easily flow to the position where the pad 8 is disposed, and the pad 8 is contaminated, which causes a decrease in the contact sensitivity of the driver chip, and causes a problem of abnormal display in the corresponding display device. The application limits that the distance between the bonding pad 8 and the first bump 6 is not more than 100 mu m, which is beneficial to ensuring that the area of the non-display area 3 of the array substrate 1 is small enough, so that the display panel using the array substrate 1 has the effect of a narrow frame, and the current design requirement for the narrow frame of the display panel is met.
The first concave part 4, the second concave part 5, the first channel 41, the second channel 52 and the first protrusion 6 can be manufactured by exposure and development, and can be manufactured by exposure of a gray-scale photomask/a halftone photomask; and can also be manufactured by the same process.
Because the planarization layer 13 adopts the negative photoresist at present, the completely exposed position is completely reserved, the partially exposed position is partially reserved, and the reserved proportion is related to the exposure amount; therefore, the first recess 4, the second recess 5, the first channel 41, the second channel 52 and the first protrusion 6 can be specifically manufactured as shown in the first embodiment:
each sub-groove 51 in the first recessed portion 4, the second recessed portion 5, the step portion for providing the pad 8, and the like: the design requires the planarization layer 13 to be completely removed, so the mask here adopts a completely opaque design, and the planarization layer 13 here receives 0% exposure, and as a result, the planarization layer 13 at the corresponding position is not left at all;
first projection 6: all the planarization layer needs to be left, so the mask adopts a completely transparent design, and the planarization layer 13 here receives 100% of exposure, and as a result, 100% of the planarization layer at the corresponding position is left;
the remaining position planarization layer 13 is designed: the 50% degree of retention is required, so the mask uses a 50% transmission design, and let the planarization layer 13 receive 50% exposure, with the result that 50% of the planarization layer at the corresponding position is retained.
The first concave portion 4, the second concave portion 5, the first channel 41, the second channel 52 and the first protrusion 6 can be specifically manufactured as shown in the following second embodiment:
each sub-groove 51 in the first recessed portion 4, the second recessed portion 5, the step portion for providing the pad 8, and the like: the design requires the planarization layer 13 to be completely removed, so the mask here adopts a completely opaque design, and the planarization layer 13 here receives 0% exposure, and as a result, the planarization layer 13 at the corresponding position is not left at all;
first projection 6: a new layer of planarization layer 13 is used for manufacturing, and all the layers need to be reserved, so the mask adopts a completely transparent design, the planarization layer 13 at the position receives 100% of exposure, and as a result, 100% of the planarization layer at the corresponding position is reserved;
the remaining position planarization layer 13 is designed: the 100% level of retention is required, so the mask uses a 100% transmission design, and let the planarization layer 13 receive 100% exposure, and as a result, 100% of the planarization layer at the corresponding position is retained.
Referring to fig. 1, based on the same inventive concept, the present application further provides a display substrate 100, where the display substrate 100 includes a plurality of array substrates 1 and a first region 101 surrounding the array substrates 1;
wherein, the array substrate 1 is formed by cutting away the first region 101;
the first regions 101 include third recesses 7, the third recesses 7 are disposed on at least one side of each of the first regions 101, and the second recesses 5 are communicated with the third recesses 7 through the first edges 111.
Specifically, the present application further provides a display substrate 100, where the display substrate 100 may be a mother board of the array substrate 1, that is, the array substrate 1 is obtained by cutting the display substrate 100. A display substrate 100 may include a plurality of array substrates 1 and a first region 101 surrounding the array substrates 1, at least one third recess 7 is disposed in the first region 101 of the display substrate 100, the third recess 7 is disposed on at least one side of the first region 101, and the second recess 5 is communicated with the third recess 7 through a first edge 111. In the manufacturing process of the array substrate 1, after the PI solution in the second recess 5 is drained to the position of the first edge 111, the PI solution may be left in the third recess 7 through the first edge 111, and the PI solution seeped out of the display area 2 and the non-display area 3 of the array substrate 1 is collected through the third recess 7.
In the manufacturing process of the array substrate 1, the third concave parts 7 are arranged in the first areas 101 surrounding the periphery of each array substrate 1 to accommodate the PI liquid, so that the condition that the welding pads 8 are polluted when the PI liquid is excessively seeped is avoided; and the area of the first region 101 is larger, which is beneficial to collecting a large amount of PI liquid.
It should be noted that fig. 1 only shows the respective installation forms of the third recessed portion 7, and the third recessed portion 7 installed in the display substrate 100 of the present application may be a single large-area receiving area, or the third recessed portion 7 may include a plurality of sub-recessed portions, and a channel may be further installed between any two sub-recessed portions that are adjacently installed for guiding the flow. The composition, area and arrangement position of the third recessed portion 7 are not particularly limited in the present application, as long as the third recessed portion 7 can communicate with the second recessed portion 5 for collecting the PI solution.
In the manufacturing process of the array substrate 1, after most of the PI liquid seeped out of the display area 2 is guided and collected into the third concave portion 7, all the first areas 101 in the display substrate 100 are cut off to form the array substrates 1, only a small amount of PI liquid is left in the obtained array substrate 1, the influence of pollution on the bonding pad 8 is not enough, and the manufacturing yield of the array substrate 1 is favorably ensured.
Fig. 8 is a schematic diagram of a display device according to an embodiment of the present application, fig. 9 is a DD' cross-sectional view of fig. 8 according to an embodiment of the present application, and referring to fig. 8 and 9, a display device 200 is further provided, which includes an array substrate 1;
the display device 200 further includes a color filter substrate 9 and a liquid crystal layer 91, and the liquid crystal layer 91 is disposed between the array substrate 1 and the color filter substrate 9.
Specifically, the present application further provides a display device 200, which includes the aforementioned array substrate 1; the display device 200 further includes a color filter substrate 9 and a liquid crystal layer 91 besides the array substrate 1, wherein the liquid crystal layer 91 is disposed between the array substrate 1 and the color filter substrate 9, and the display device 200 achieves the diversified display effect display through the deflection of the liquid crystal molecules 911 in the liquid crystal layer 91 and the cooperation of the color filter substrate 9. Fig. 9 also shows that the display device 200 includes the silver paste 81, one side of the silver paste 81 is in contact with the upper surface of the bonding pad 8, and the other side is in contact with the upper surface of the color filter substrate 9.
According to the embodiments, the array substrate, the display substrate and the display device provided by the invention at least achieve the following beneficial effects:
the first concave part and the second concave part are arranged in the non-display area of the array substrate, the second concave part extends to the first edge of one side, far away from the display area, of the non-display area, and the heights of a plurality of sub-grooves in the second concave part close to the first edge are smaller than the heights of a plurality of sub-grooves in the second concave part far away from the first edge; thereby make keeping away from first edge in the second depressed part to the sub-recess that is close to first edge have certain difference in height, be favorable to carrying out the water conservancy diversion to the PI liquid that oozes out in the second depressed part, avoid PI liquid to cause the problem of pollution to the welding disc.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. The array substrate is characterized by comprising a substrate, an array layer and a planarization layer which are sequentially stacked; the array substrate comprises a display area and a non-display area surrounding the display area, the non-display area comprises a first concave part and a second concave part which are formed on the planarization layer, the first concave part is arranged on one side, close to the display area, of the second concave part, the second concave part comprises at least one sub-groove, any sub-groove comprises a top surface, and the top surface is the surface of one side, far away from the substrate, of the sub-groove;
the second concave part comprises a first sub-area and a second sub-area, the distance from the top surface of the sub-groove in the first sub-area to the substrate base plate is larger than the distance from the top surface of the sub-groove in the second sub-area to the substrate base plate along the direction perpendicular to the plane of the substrate base plate, wherein the second sub-area extends to a first edge of one side of the non-display area far away from the display area;
a first channel is arranged between any sub-groove and the first concave part and is communicated with the first concave part and each sub-groove; in any first channel, in the direction in which the first concave part points to the sub-groove and in the direction perpendicular to the plane of the substrate base plate, the distances between the bottom surface of the first channel and the substrate base plate are sequentially reduced;
a second channel is arranged between any two adjacent sub-grooves and is communicated with the adjacent sub-grooves; in any of the second channels, along the extension direction of the first sub-area towards the second sub-area, in the direction perpendicular to the plane of the substrate base plate, the distance between the bottom surface of the second channel and the substrate base plate is reduced in sequence;
the non-display area further comprises at least one bonding pad, and the bonding pad is arranged on one side, far away from the first recessed portion, of the second recessed portion.
2. The array substrate of claim 1, wherein the depths of the sub-grooves in the second recess decrease sequentially in a direction perpendicular to the plane of the substrate base plate along the extending direction of the first sub-region toward the second sub-region.
3. The array substrate of claim 1,
the non-display area further comprises a first bulge, and the orthographic projection of the first bulge on the substrate base plate is positioned between the orthographic projection of the second concave part on the substrate base plate and the orthographic projection of the pad on the substrate base plate; and the first bulge is formed on one side of the planarization layer far away from the substrate base plate.
4. The array substrate of claim 3, wherein the first protrusion has a length equal to or greater than a length of the second recess along an extension direction of the first sub-region toward the second sub-region.
5. The array substrate according to claim 3, wherein the non-display region further comprises a sealant, the sealant is disposed on a side of the planarization layer away from the substrate, and the first protrusion is disposed on a side of the sealant close to the display region.
6. The array substrate according to claim 5, wherein the height of the first protrusion is less than or equal to the thickness of the sealant along a direction perpendicular to the plane of the substrate.
7. The array substrate of claim 6, wherein the first bump and the planarization layer are formed in the same process.
8. The array substrate of claim 7, wherein a distance between an orthographic projection of the pad on the substrate and the first bump on the substrate is D1, 50 μm ≦ D1 ≦ 100 μm.
9. A display substrate, wherein the display substrate comprises a plurality of array substrates according to any one of claims 1 to 8, and a first region surrounding the array substrates;
wherein the array substrate is formed by cutting away the first region;
the first region comprises third depressed parts, the third depressed parts are arranged on at least one side of each first region, and the second depressed parts are communicated with the third depressed parts through the first edges.
10. A display device comprising the array substrate according to any one of claims 1 to 8;
the display device further comprises a color film substrate and a liquid crystal layer, wherein the liquid crystal layer is arranged between the array substrate and the color film substrate.
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| CN112242099A (en) * | 2020-11-09 | 2021-01-19 | 上海中航光电子有限公司 | Array substrate, display panel and display device |
| CN112558360B (en) * | 2020-12-25 | 2022-08-30 | 厦门天马微电子有限公司 | Display panel and display mother board |
| CN113078173B (en) * | 2021-03-29 | 2024-10-22 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof, display panel and display device |
| CN113917747B (en) * | 2021-09-30 | 2022-11-01 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN114967260B (en) * | 2022-05-30 | 2023-10-13 | 京东方科技集团股份有限公司 | Array substrate and display device |
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