CN111619899A - Automatic encapsulation equipment of wafer box - Google Patents

Abstract

An automatic packaging device for wafer boxes comprises a bag entering module, a bag taking device, a packaging platform and a sealing module. Get the bagging apparatus and snatch the wrapping bag to the packaging platform on, get the bagging apparatus and pull open the wrapping bag together and form an opening in coordination with the packaging platform, go into the bag module with the wafer box certainly in the wrapping bag is sent into to the opening, the sealing module will the opening is sealed. The invention realizes automation, liberates manpower, improves the standardization level of wafer box packaging, and simultaneously meets the industrial 4.0 requirements of intelligent manufacturing and unmanned manufacturing.

Description

Automatic encapsulation equipment of wafer box

Technical Field

The invention relates to the field of automation, in particular to automatic packaging equipment for a wafer box.

Background

The front-opening delivery box/full transparent wafer box can protect, transport and store wafers, prevent wafer collision and friction, provide safety protection during transportation, transportation and storage, have good air tightness and can prevent the generation of particulate matters. The specific structure of the wafer cassette generally includes a main body portion with a larger size for receiving the wafer and a head portion with a smaller size protruding and connected to the upper side of the main body portion. When wafers are transferred among different manufacturing factories, the wafers need to be loaded into a wafer box and the wafer box is packaged by an aluminum foil bag so as to ensure the cleanliness and humidity requirements in the transportation process; meanwhile, a label is required to be pasted on the wafer box for identification, and materials such as drying agents and humidity cards are required to be fixed on the wafer box, so that the requirements of wafer storage and transportation environments are met. At present, the operation is mainly completed in a manual mode, but the manual operation efficiency is low, and the problems of mistaken sticking, missed sticking, mistaken releasing, missed placing and the like are easy to occur.

Therefore, there is a need to provide a new automatic wafer cassette packaging apparatus to solve the above problems.

Disclosure of Invention

The invention aims to provide automatic packaging equipment for a wafer box, which has the advantages of releasing manpower, improving production efficiency and the like.

In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides an automatic encapsulation equipment of wafer box, includes into a bag module, gets bagging apparatus, packaging platform and seals the module, get the bagging apparatus and snatch the wrapping bag to packaging platform on, get the bagging apparatus and pull open the wrapping bag together with packaging platform and form an opening, it certainly to go into a bag module the wafer box in the packaging bag is sent into to the opening, it will to seal the module the opening is sealed.

As a further improved technical solution of the present invention, the bag taking device includes a first gripping device, the packaging platform includes a second gripping device, the first gripping device grips the upper layer of the packaging bag, the second gripping device grips the lower layer of the packaging bag, and the first gripping device moves away from the second gripping device to pull the upper and lower layers of the packaging bag apart to form the opening.

As a further improved technical solution of the present invention, the bag-in module includes a supporting mechanism and a first driving mechanism, the supporting mechanism is connected to the first driving mechanism, and the supporting mechanism slides towards the opening to feed the wafer cassette into the packaging bag under the driving of the first driving mechanism.

As a further improved technical solution of the present invention, the bag-in module includes a second driving mechanism connected to the supporting mechanism, the supporting mechanism is capable of being driven by the second driving mechanism and has a lower initial position and an upper jacking position, and the supporting mechanism is driven by the first driving mechanism at the jacking position.

As a further improved technical scheme of the invention, the sealing module comprises a suction nozzle, a pair of sealing knives and a pair of pressing strips, the suction nozzle extends into the packaging bag for air suction, the pressing strips press the suction nozzle and the opening close to the packaging bag, and the sealing knives seal the opening after the suction nozzle exits the packaging bag.

As a further improved technical solution of the present invention, the wafer packaging machine further includes a third conveying device, a shaping rotary platform, and a tape reel-off mechanism, wherein the third conveying device conveys the wafer cassette with the bag placed therein from the sealing module to the shaping rotary platform, and the tape on the tape reel-off mechanism winds the wafer cassette which is rotated on the shaping rotary platform and into which the bag is placed.

The technical scheme is further improved by the invention, the wafer labeling machine further comprises a label discharging device and a labeling robot, wherein the labeling robot takes labels from the label discharging device and labels the wafer cassettes before and/or after the wafers are put into the bag.

The technical scheme is further improved by the invention, the wafer cassette loading device further comprises a feeding platform and a discharging platform, wherein the feeding platform comprises a first placing platform and a limiting mechanism, the limiting mechanism positions the wafer cassette on the first placing platform, the discharging platform comprises a fork and a second placing platform, and the second placing platform is slidably positioned on the retractable fork.

The technical scheme is further improved by the invention, the wafer cassette loading and unloading device further comprises a product information identification sensor, a fourth carrying device and an inflation platform, wherein the product information identification sensor is positioned on the feeding platform, and the fourth carrying device determines whether to grab the wafer cassette onto the inflation platform for inflation or not according to the product information in the wafer cassette read by the product information identification sensor.

As a further improved technical solution of the present invention, the wafer processing apparatus further includes a first conveying device and a second conveying device, wherein the first conveying device conveys the wafer cassette on the feeding platform to the bag loading module, and the second conveying device conveys the wafer cassette loaded with the bag to the discharging platform.

Compared with the prior art, the automatic packaging equipment for the wafer box realizes the tearing of the packaging bag, the bag feeding of the wafer box and the sealing of the packaging bag after the wafer box is fed through the mutual matching of the bag feeding module, the bag taking device, the packaging platform and the sealing module, realizes automation in the whole process, liberates manpower, improves the standard level of packaging of the wafer box, and meets the industrial 4.0 requirements of intelligent manufacturing and unmanned manufacturing.

Drawings

Fig. 1 is a top view of the automatic packaging apparatus for a wafer cassette according to the present invention.

Fig. 2 is a perspective assembly view of the feeding platform of fig. 1.

Fig. 3 is a partially enlarged view of fig. 2.

Fig. 4 is a perspective assembly view of the pouch storage case of fig. 1.

Fig. 5 is a perspective assembly view of the bag extraction device of fig. 1.

Fig. 6 is a side view of the bag extractor.

Fig. 7 is a perspective assembly view of the packaging platform of fig. 1.

Fig. 8 is a top view of the wafer cassette placed on the packaging platform.

Fig. 9 is a perspective assembly view of the bag-in module of fig. 1.

Fig. 10 is a side view of the bag-in module.

Fig. 11 is a perspective assembly view of the sealing module in fig. 1.

Fig. 12 is a cross-sectional view of the capping module.

Fig. 13 is a perspective assembly view of the shaping rotary platform of fig. 1.

Fig. 14 is a side view of a wafer cassette placed on a shaping rotation stage.

Fig. 15 is a perspective assembly view of the tape roll unwinding mechanism of fig. 1 assembled on the shaping module.

Fig. 16 is a perspective assembly view of the tapping platform of fig. 1.

FIG. 17 is a top view of the tapping platform.

Fig. 18 is a schematic view of a set of support frames and support rails shared by the first and second handling devices.

Fig. 19 is a partially perspective assembly view of the first conveyance device.

Fig. 20 is a partially perspective assembly view of the second conveyance device.

Fig. 21 is a perspective assembly view of the third conveyance device.

Fig. 22 is a perspective assembly view of the fourth conveyance device.

Detailed Description

Referring to fig. 1 to 22, an automatic packaging apparatus 100 for a wafer cassette includes a machine frame (not shown), and a feeding platform 2, a first transporting device 3, a bag storing box 4, a bag feeding module 5, a bag taking device 6, a packaging platform 7, a sealing module 8, a third transporting device 9, a shaping rotary platform 10, a shaping module 11, a label printer 12, a label roll 13, a label tearing module 14, a labeling robot 15, a tape roll placing mechanism 16, a second transporting device 17, and a discharging platform 18 mounted on the machine frame.

Referring specifically to fig. 2, the feeding platform 2 positions the pod 200 after the pod 200 is placed in a precise position. The structure of the feeding platform 2 is as follows: comprises a bottom plate 21, a track 22, a first linear module 23, a first placing platform 24, a position detection sensor 25, a product information identification sensor 26 and a limiting mechanism 27. The bottom plate 21 is fixedly connected to a rack of the whole machine, the track 22 and the first linear module 23 are fixed on the bottom plate 21, the first placing platform 24 is slidably connected and supported on the track 22 and the first linear module 23, and the position detection sensor 25, the product information identification sensor 26 and the limiting mechanism 27 are arranged on the first placing platform 24. The first linear module 23 is connected with the first placing platform 24 so as to drive the first placing platform 24 to move, and the rail 22 gives the first placing platform 24 a supporting and guiding function at the other side relative to the first linear module 23. The bottom of the wafer box 200 is provided with a groove, and the limiting mechanism 27 extends into the groove at the bottom of the wafer box 200 and then rotates for positioning the wafer box 200 on the first placing platform 24. In this embodiment, three position detection sensors 25 are disposed around the limiting mechanism 27 and electrically connected to the electrical control center, and are used to detect whether the wafer cassette 200 is placed at a correct position; the product information recognition sensor 26 is disposed at one side of the limiting mechanism 27 and electrically connected to the electrical control center, and is configured to detect whether the wafer cassette 200 needs to be filled with nitrogen gas.

Referring to fig. 18 to 20, a first clamping mechanism 31 is disposed at a bottom end of the first transporting device 3 (in the embodiment, a robot), and a first supporting mechanism 171 is disposed at a bottom end of the second transporting device 17 (in the embodiment, a robot). The first clamping mechanism 31 is used for clamping the head of the wafer cassette 200 for clamping the wafer cassette 200, that is, the first transporting device 3 is used for transporting the wafer cassette 200 from the feeding platform 2 to the bag-in module 5 in a manner of clamping the head of the wafer cassette 200. The first bottom supporting mechanisms 171 are provided in two opposing left-right directions, that is, the second transfer device 17 transfers the wafer cassette 200 from the sealing module 8 or the shaping rotary table 10 to the discharge table 18 in such a manner as to support the main body of the wafer cassette 200 (similar to a case where one cassette is held with both hands).

In the first embodiment of the present invention, as shown in fig. 18, the first carrying device 3 and the second carrying device 17 share a set of supporting frame 201 and supporting rail 202; in the second embodiment of the present invention, which is not shown in the drawings, the first conveying device 3 and the second conveying device 17 may have the support frame 201 and the support rail 202 which are independent of each other. Referring to fig. 4 to 8, the bag taking device 6 picks up the bag on the bag storage box 4 to the packing platform 7, and the packing platform 7 and the bag taking device 6 together pull the upper and lower layers of the bag apart to form an opening.

The bag taking device 6 comprises a first gripping device 64 (a sucker connected with a vacuum system in the specific embodiment), the packaging platform 7 comprises a second gripping device 79 (a sucker connected with a vacuum system in the specific embodiment), the first gripping device 64 sucks the upper layer of the packaging bag, and the second gripping device 79 sucks the lower layer of the packaging bag to pull the upper layer and the lower layer of the packaging bag apart to form an opening.

The bag taking device 6 comprises a transverse unit 61, and the transverse unit 61 comprises a first driving member 611 (in the embodiment, a motor), a first pulley pair 612, a first belt 613, a first belt clamping plate 614, a first guide rail pair 615, a first sliding block 616, and a first moving frame 617. The first moving frame 617 is connected to the first belt 613 between the first pulley pair 612 through the first belt clamping plate 614, and the first driving member 611 drives the first pulley pair 612 so that the first belt 613 drives the first moving frame 617 to move in a first direction (in the specific embodiment, the first direction is a transverse direction in fig. 6). Because the first guide rail pair 615 is stationary, the first driving member 611 drives the first moving frame 617 to move in the first direction through the first pulley pair 612 and the first belt 613, and the first driving member 611 provides a driving force in the first direction, so that the first moving frame 617 can move in the first direction and is stationary in a direction different from the first direction. The first belt clamping plate 614 is fixedly connected to a first sliding block 616 that is slidably and limitedly disposed on the first rail pair 615. That is, the engagement between the first guide rail pair 615 and the first slider 616 limits the first direction movement of the first moving frame 617.

The bag taking device 6 includes a vertical unit 62, and the vertical unit 62 includes a second driving element 621 (in the embodiment, an air cylinder), a second pulley pair (not numbered), a second belt clamping plate (not numbered), a second guide rail pair 625, a second slider 626 and a lifting mechanism 627. The second slider 626 is connected to the first moving frame 617, the second guide rail pair 625 is connected to the lifting mechanism 627, and the second slider 626 slides on the second guide rail pair 625 in a limited manner. The lifting mechanism 627 is connected to the second belt between the second pair of pulleys through the second belt clamp plate, and the second driving member 621 drives the second pair of pulleys so that the second belt drives the lifting mechanism 627 to move in a second direction (in the specific embodiment, the second direction is the vertical direction in fig. 6) different from the first direction. The first driving member 611 drives the first moving frame 617 to move in the first direction, and the lifting mechanism 627 is disposed on the first moving frame 617 so as to be movable in the first direction together with the first moving frame 617; the second driving member 621 drives the lifting mechanism 627 to move in a second direction relative to the first moving frame 617, and the first grabbing device 64 is fixed to the lifting mechanism 627. That is, the first gripper device 64 on the bag-taking device 6 can move in both the first direction and the second direction. Because the second slider 626 is fixedly connected to the first moving frame 617, the second slider 626 is movable in the first direction but immovable in the second direction with the first moving frame 617; the second driving member 621 drives the lifting mechanism 627 to move in a second direction, which also drives the second guide rail pair 625 to move in a second direction relative to the second sliding block 626, i.e., relative to the first moving frame 617. The second driving element 621 provides a driving force in the second direction, and the cooperation between the second guide rail pair 625 and the second slider 626 limits the movement of the lifting mechanism 627 in the second direction.

Referring specifically to fig. 7 and 8, the packaging platform 7 includes a third driving member 71 (in the embodiment, a motor), a movable bottom plate 72, a packaging guide rail pair 74, a packaging screw pair 75, a supporting platform 76, a clamping plate mechanism 77, and an edge sealing and stripping mechanism 78. The third driving member 71 drives the movable bottom plate 72 to move in the first direction, the second grabbing device 79 is fixed on the movable bottom plate 72, and the first movable frame 617 is movably located above the movable bottom plate 72. The first moving frame 617 is horizontally movable in a first direction, on one hand, to a position of the pouch storage box to grasp the wafer box 200, and on the other hand, to a position above the moving bottom plate 72, so that the first grasping device 64 and the second grasping device 79 are located at opposite positions, that is, the first grasping device 64 is ensured to grasp an upper layer of the pouch while the second grasping device 79 is capable of grasping a lower layer of the pouch. The movable bottom plate 72 is in sliding fit with the packing guide rail pair 74, and the third driving member 71 is connected with the movable bottom plate 72 through the packing lead screw pair 75. The support platform 76 and the clamping mechanism 77 are fixed to the moving base plate 72. The chucking mechanisms 77 are located on both sides of the support platform 76 and can be brought close to each other to chuck and hold the wafer cassette 200 having the pocket in the position of the support platform 76. The supporting platform 76 is located on the movable bottom plate 72, and can move to the sealing module 8 along with the movable bottom plate 72 to seal the packaging bag with the box. The edge sealing and leveling mechanism 78 is fixed to the movable bottom plate 72, and the edge sealing and leveling mechanism 78 is capable of moving upward and is configured to push the edge seal of the packaging bag to move upward relative to the wafer box 200 after heat sealing is completed, so that the edge seal portion can be bent by 90 degrees to be attached to one side of the wafer box 200, and cannot extend straight forward to occupy the width of the wafer box 200 in the first direction, thereby facilitating the subsequent handling of the wafer box 200 into the bag by the third handling device 9.

In the specific tearing process, the first gripping device 64 faces downwards to suck the upper layer of the packaging bag, and after the second gripping device 79 faces upwards to suck the lower layer of the packaging bag, the second gripping device 79 is fixed and the first gripping device 64 moves upwards, namely, the bag taking device 6 cooperates with the packaging platform 7 to pull the upper layer and the lower layer of the packaging bag apart to form an opening. However, the suction force alone is not sufficient enough to hold the packaging bag, since the wafer box 200 is very likely to scratch the edge portion of the opening of the packaging bag when entering, so that the upper layer of the packaging bag is separated from the first gripping device 64 and/or the lower layer of the packaging bag is separated from the second gripping device 79. Therefore, it is necessary to position the upper layer of packages on the first gripper device 64 and the lower layer of packages on the second gripper device 79 by means of the components on the bag feeding module 5 to avoid scratching.

Referring to fig. 9 and 10, the bag-inserting module 5 includes a first frame 51, a supporting mechanism 52, and a bag-supporting mechanism 53. The bag opening mechanism 53 includes a bag opening frame 531, a forward/backward moving cylinder 532, an up/down opening cylinder 533, and a bag opening pressing plate 534. The first frame 51 is fixed on the whole machine frame, the bag opening frame 531 is fixed on the first frame 51, and the advancing and retreating cylinder 532, the up-down opening cylinder 533 and the bag opening pressing plate 534 are fixed on the bag opening frame 531. The bag stretching pressing plate 534 comprises an upper pressing plate 5341 and a lower pressing plate 5342 positioned below the upper pressing plate 5341, the forward and backward air cylinder 532 drives the upper pressing plate 5341 and the lower pressing plate 5342 to move in the same direction in a third direction (in the specific embodiment, the third direction is the transverse direction shown in fig. 10), that is, the forward and backward air cylinder 532 drives the upper pressing plate 5341 and the lower pressing plate 5342 in the same direction first, so that the upper pressing plate 5341 and the lower pressing plate 5342 extend into the openings torn by the first gripping device 64 and the second gripping device 79; next, the up-down opening cylinder 533 drives the upper pressing plate 5341 and the lower pressing plate 5342 to move away from each other in a second direction perpendicular to the third direction, that is, after the upper pressing plate 5341 and the lower pressing plate 5342 extend into the opening, the upper pressing plate 5341 positions the upper layer of the packaging bag upward on the first gripping device 64 and the lower pressing plate 5342 positions the lower layer of the packaging bag downward on the second gripping device 79.

The bag-in module 5 further includes a longitudinal moving guide rail pair 541, a first driving mechanism 542 (in the embodiment, a motor), a third pulley pair 543, and a first lead screw pair 544. The support mechanism 52 is slidably connected to the longitudinal movement rail pair 541 and connected to the nut of the first screw pair 544, and the first drive mechanism 542 drives the first screw pair 544 through the third pulley pair 543 to drive the support mechanism 52 to move along the longitudinal movement rail pair 541 in the third direction toward the bag opening mechanism 53, so that the wafer cassette 200 can be loaded into the packaging bag.

In the preferred embodiment of the present invention, since the wafer cassette 200 is labeled before the wafer cassette 200 is fed into the packaging bag, the bag feeding module 5 of the present invention further includes a labeling auxiliary mechanism 55. The auxiliary labeling mechanism 55 includes a conveying motor 551, two conveying lines 552 arranged in parallel driven by the conveying motor 551, and four gripper mechanisms 553. That is, the transfer line 552 extends in the third direction and transfers the wafer cassette 200. The clamping mechanisms 553 are distributed two by two on two outer sides of the extension direction of the conveying line 552, and include a first group of clamping mechanisms 5531 at the front end and a second group of clamping mechanisms 5532 at the rear end. The first set of grippers 5531 first grip the wafer cassette 200 to label the front of the wafer cassette 200, and then the conveyor line 552 transports the wafer cassette 200 to the position of the second set of grippers 5532, and the second set of grippers 5532 then grips the wafer cassette 200 to label the rear of the wafer cassette 200. After the label is applied, the wafer cassette 200 is transported to the end of the transport line 552 near the bag expanding mechanism 53. The invention is also provided with a blocking cylinder 57 and a first baffle plate 58 driven by the blocking cylinder 57, wherein the first baffle plate 58 extends upwards in the second direction to abut against the tail end of the conveying line 552, so as to prevent the wafer cassette 200 conveyed by the conveying line 552 from falling.

In the preferred embodiment of the present invention, the initial position of the support mechanism 52 is below the end of the delivery wire 552. The bag feeding module 5 of the present invention further includes an up-down moving rail pair 561, an up-down moving plate 562, a lifting plate 563, and a second driving mechanism 564 (in the specific embodiment, an air cylinder). The longitudinal moving guide rail pair 541 and the first lead screw pair 544 are fixed on the jacking plate 563, the middle of the jacking plate 563 is connected with the second driving mechanism 564, two ends of the jacking plate 563 are fixed on the up-down moving plate 562, and the up-down moving plate 562 is slidably connected on the up-down moving guide rail pair 561. Thus, when the wafer cassette 200 has been labeled to the end position of the transfer line 552, the second driving mechanism 564 can drive the lift plate 563 in the second direction to lift up the supporting mechanism 52 upward, so that the supporting mechanism 52 has a lifted position above the transfer line 552 where the supporting mechanism 52 is driven by the first driving mechanism 542 to feed the wafer cassette 200 into the packaging bag. Since the clamp mechanism 77 clamps the incoming cassette 200 at the position of the support platform 76, the force driving the support mechanism 52 is withdrawn so that the support mechanism 52 withdraws from the package, and then the support platform 76 moves the incoming cassette 200 with the movable bottom plate 72 to the sealing module 8 for the next evacuation heat-sealing operation.

Referring to fig. 11 and 12, the structure of the sealing module 8 is as follows: the device comprises a second frame 81, a second moving frame 82, a moving frame guide rail pair 821, a moving frame screw pair 822, an air exhaust mechanism 83, an air exhaust mechanism guide rail pair 831, an air exhaust mechanism screw pair 832, a pair of sealing knives 84, a set of sealing knife driving units 85, a pair of pressing strips 86, a set of pressing strip driving units 87, a sealing knife guide rail pair 88 and a pressing strip guide rail pair 89. The second frame 81 is fixed on the whole machine frame, the moving frame guide rail pair 821 is fixed on the second frame 81, and the second moving frame 82 is slidably connected on the moving frame guide rail pair 821 and connected with the moving frame lead screw pair 822, so that the second moving frame 82 can move in a third direction. The moving frame guide rail pair 821 and the moving frame screw pair 822 together constitute a driving device of the suction mechanism 83. The pumping mechanism guide rail pair 831 is fixed on the second moving frame 82, and the pumping mechanism 83 is slidably connected to the pumping mechanism guide rail pair 831 and fixed and connected with the pumping mechanism screw pair 832, so that the pumping mechanism 83 can also move in the third direction. The pressing strip 86 is used for limiting, the sealing knife 84 is used for sealing, and the pressing strip 86 and the sealing knife 84 jointly form a sealing device. The pressing bar 86 includes an upper pressing bar 861 and a lower pressing bar 862 oppositely arranged in the second direction, and the upper pressing bar 861 and the lower pressing bar 862 are connected with the second moving frame 82 through a pressing bar guide rail pair 89. In the specific embodiment, the upper press strip 861 and the lower press strip 862 are driven by the press strip driving unit 87 to approach each other, so as to press the upper and lower layers of the packaging bag and the suction nozzle 830 extending into the front end of the suction mechanism 83 between the upper and lower layers of the packaging bag, and the suction mechanism 83 vacuumizes the packaging bag. After the air in the packaging bag is exhausted, the air exhaust mechanism 83 moves reversely, the suction nozzle 830 withdraws from the packaging bag, the pressing strip 86 keeps pressing the upper layer and the lower layer of the packaging bag continuously, and then the heat sealing is carried out by the sealing knife 84. The seal blade 84 includes an upper seal blade 841 and a lower seal blade 842 disposed oppositely in the second direction, the upper seal blade 841 and the lower seal blade 842 being connected to the second moving frame 82 via a seal blade rail pair 88, the upper seal blade 841 and the lower seal blade 842 being capable of approaching each other by the driving of the seal blade driving unit 85 for heat sealing. After the heat seal is completed, the bead 86 and the sealing knife 84 are withdrawn in reverse.

In a preferred embodiment of the present invention, the package bag with the box and heat-sealed is conveyed to the shaping rotary table 10 by the third conveying device 9, shaped, and then conveyed to the discharge table 18 by the second conveying device 17, but in other embodiments, the package bag with the box and heat-sealed may be conveyed to the discharge table 18 directly by the second conveying device 17 without shaping.

Referring to fig. 21, a second bottom supporting mechanism 91 is disposed at a bottom end of the third carrying device 9 (in the embodiment, a robot). Accordingly, the third transfer device 9 is transferred from the sealing module 8 to the shaping rotary table 10 so as to hold the main body of the wafer cassette 200, as in the second transfer device 17.

Referring to fig. 13 to 15, the shaping rotary platform 10 cooperates with the shaping module 11 and the tape roll releasing mechanism 16 to further shape the packaged bag with a box.

Referring specifically to fig. 13 and 14, the structure of the shaping rotary platform 10 is as follows: comprises a base 101, a first rotating mechanism 102, a rotating table 103 and a clamping mechanism 104. The base 101 is fixed on a rack of the whole machine, the first rotating mechanism 102 is fixed on the base 101, the rotating table 103 is fixed on the first rotating mechanism 102, and the clamping mechanism 104 is fixed on the rotating table 103. In the preferred embodiment, the clamping mechanism 104 includes at least four, and in the particular embodiment six, clamping positions for the pouch-containing package 200 from four left, right, front, and rear orientations. The rotation of the first rotating mechanism 102 and the clamping of the clamping mechanism 104 cause the packaged package to be fixed to the rotating table 103 and to rotate together with the rotating table 103, so that the adhesive tape can be wound around the packaged package. Referring to fig. 15, the shaping module 11 has the following structure: comprises a second screw pair 111, a second linear module 112 connected to the second screw pair 111, and a slider pair 113 connected to the second linear module 112. The tape reel release mechanism 16 is disposed above the slider pair 113. The second screw pair 111, the second linear module 112 and the slider pair 113 are respectively driven by three motors to realize that the three-axis (X-axis, Y-axis and Z-axis) positioning and moving the tape roll releasing mechanism 16, so that the tape roll releasing mechanism 16 can move to the shaping rotary platform 10 in a three-dimensional space, and after the tape on the tape roll releasing mechanism 16 is attached to the packaging bag with the box, the shaping rotary platform 10 rotates to start to wind the tape on the packaging bag with the box.

In a preferred embodiment, referring to fig. 1, 9 and 10, the present invention has a two-labeling action. The method comprises the following steps: the label printer 12 prints the information labels of the products (the content on the information labels is different due to different products in the wafer cassette 200), which may be called as an information label discharging device; the label reel 13 and the label tearing module 14 are used cooperatively, the warning labels (the warning labels are all the same) wound on the label reel 13 are torn off by the label tearing module 14, and the combination of the label reel 13 and the label tearing module 14 can be called as a warning label discharging device. The structure of the label tearing module 14 is the prior art, and therefore, the present invention is not described in detail. The labeling robot 15 takes the information labels and/or the warning labels at the label discharging device away respectively and shifts the information labels and/or the warning labels to the bag entering module 5 to label the wafer cassette 200; after the wafer cassette 200 is bagged, heat-sealed and shaped, the labeling robot 15 further takes away the information label and/or the warning label from the label discharging device and shifts the information label and/or the warning label to the shaping rotary platform 10 to label the package bag which is packaged with the cassette and wound with the adhesive tape. Of course, in alternative embodiments, there may be only one labeling process, that is, after the labeling robot 15 takes the label from the label discharging device, only one label is attached to the wafer cassette 200 before the bag is inserted or only one label is attached to the wafer cassette 200 after the bag is inserted.

Referring to fig. 16 and 17, the discharging platform 18 has the following structure: including a fork 181, a second servo motor 182, a second stop 183, a second placement platform 184, and a detection photoelectric module 185. The fork 181 is fixed on the rack of the whole machine, and the second servo motor 182 is connected with the fork 181 to drive the fork 181 to move. The second placement platform 184 is slidably positioned on the fork 181, and the photoelectric module 185 and the second barrier 183 are fixed on the second placement platform 184, and are respectively used for detecting and fixing the packaging bag containing the box. In this embodiment, the fork 181 includes three sections, namely a front section fork 1811, a middle section fork 1812 and a rear section fork 1813, the front section fork 1811 can retract inward to the middle section fork 1812 and the middle section fork 1812 can further retract inward to the rear section fork 1813; of course, in other alternative embodiments, the forks 181 include two sections, a front section fork 1811 and a rear section fork 1813, and the front section fork 1811 can be retracted inwardly to the rear section fork 1813. That is, the forks 181 are retractable. Referring to fig. 1, the feeding platform 2 and the discharging platform 18 are disposed side by side adjacent to each other in the automatic pod packaging apparatus 100, and when a failure occurs in the automatic pod packaging apparatus 100, a maintenance worker first bends over to climb under the feeding platform 2 and reach under the fork 181 of the discharging platform 18, and at this time, the fork 181 is put in a retracted state. Under the shrink state of fork 181, can provide the space of a appearance for the maintenance personal, conveniently maintain the equipment inside.

In a preferred embodiment, referring to fig. 1 and 22, the automatic wafer cassette packaging apparatus 100 of the present invention further includes a fourth handling device 19 (in an embodiment, a robot) and an inflating platform 20, that is, before the wafer cassette 200 on the feeding platform 2 is grabbed to the bag inserting module 5, the present invention reads wafer information in the wafer cassette 200 according to a product information recognition sensor 26 on the feeding platform 2, determines whether to grab the wafer cassette 200 onto the inflating platform 20 to inflate nitrogen gas, and grabs the wafer cassette 200 inflated with nitrogen gas back to the feeding platform 2 from the inflating platform 20. The gas charging platform 20 is a nitrogen gas charging port, and the fourth carrying device 19 grabs the wafer cassette 200 onto the gas charging platform 20 to charge nitrogen gas, so as to plate a protective film on a wafer product used on high-end equipment, which is not necessary; the low-end product uses the wafer, and the nitrogen filling can be omitted. The construction of the inflatable platform 20 is conventional and, therefore, the present invention is not described in detail.

The lower end of the fourth carrying device 19 is provided with a second clamping jaw mechanism 191. That is, the fourth transfer device 19 transfers the wafer cassette 200 from the loading table 2 to the loading table 20 so as to grasp the head of the wafer cassette 200, as in the first transfer device 3. The fourth conveying device 9 also serves for conveying.

Referring to fig. 18, 19 and 22, the specific structure of the first carrying device 3 and the fourth carrying device 19 is different but the working principle is basically the same: that is, both the first gripper mechanism 31 and the second gripper mechanism 191 can move in the first direction and the second direction, and the first gripper mechanism 31 and the second gripper mechanism 191 can move to the position where the wafer cassette 200 is located and can be fitted into the V-shaped notch on the side of the head of the wafer cassette 200.

Referring to fig. 18, 20 and 21, the second carrying device 17 and the third carrying device 9 have different specific structures but basically the same working principle: that is, both the first and second bottom supporting mechanisms 171 and 91 can move in the first and second directions, and thus the first and second bottom supporting mechanisms 171 and 91 can be opened outward to give way to the main body portion below the head portion of the wafer cassette 200, move below the main body portion of the wafer cassette 200, and then return inward to support the wafer cassette 200.

Although there are differences in the specific structures as to how the first jaw mechanism 31 of the first conveying device 3, the first bottom holding mechanism 171 of the second conveying device 17, the second bottom holding mechanism 91 of the third conveying device 9, and the second jaw mechanism 191 of the fourth conveying device 19 move in the first direction and in the vertical direction, driving forces are essentially provided in the first direction and in the vertical direction, and meanwhile, guide rails are also provided in the first direction and in the vertical direction, so that the driving and guiding portions are well known to those skilled in the art, and the present invention is not described again.

However, the first clamping jaw mechanism 31 can rotate because the first conveying device 3 has the second rotating mechanism 32, the first clamping jaw mechanism 31 is connected below the second rotating mechanism 32, the second rotating mechanism 32 rotates to drive the first clamping jaw mechanism 31 to rotate, and therefore the first clamping jaw mechanism 31 can rotate the wafer cassette 200 to determine which surface is in front when the wafer cassette 200 enters the packaging bag; the fourth transfer device 19 does not have the rotation mechanism of the first transfer device 3, and the fourth transfer device 19 transfers the wafer cassette 200 to the gas charging stage 20 in a specific manner with the wafer surface in front, so that the second chuck mechanism 191 does not need to rotate.

In addition, the first bottom supporting mechanism 171 firstly opens outwards and then retracts inwards, and is controlled by a driving mechanism, the driving mechanism provides driving force, the first bottom supporting mechanism 171 opens outwards, the driving force retracts, and the first bottom supporting mechanism 171 retracts inwards; the second backing mechanism 91 is expanded and retracted, similarly.

Optionally, the second transfer device 17 further includes a pair of first holding mechanisms 173 arranged in the front-rear direction orthogonal to the first bottom supporting mechanism 171, wherein the first bottom supporting mechanism 171 supports the wafer cassette 200 from the left and right sides, and the first holding mechanisms 173 hold the two opposing surfaces of the wafer cassette 200 on the front and rear sides; similarly, the third transfer device 9 further includes a pair of second holding mechanisms 92 provided in the front-rear direction orthogonal to the second bottom supporting mechanisms 91, wherein the second bottom supporting mechanisms 91 support the wafer cassette 200 from the left and right sides, and the second holding mechanisms 92 sandwich the two opposing surfaces of the wafer cassette 200 from the front and rear sides.

In particular, the third handling device 9 differs from the second handling device 17 in that: the third carrying device 9 further comprises a pair of clamping plate mechanisms 93, and the clamping plate mechanisms 93 are used for clamping and positioning the sealed edges after the sealed edges of the heat-sealed packaging bags are folded by the sealed edge stripping mechanism 78. The second conveying device 17 conveys the edge after the adhesive tape is wound and shaped, and the edge sealing is wound and fixed by the adhesive tape, so that the clamping plate mechanism does not need to be arranged.

The automatic packaging equipment 100 for the wafer cassette further comprises an electric control center which is electrically connected with the feeding platform 2, the first carrying device 3, the packaging bag storage box 4, the bag feeding module 5, the bag taking device 6, the packaging platform 7, the sealing module 8, the third carrying device 9, the shaping rotary platform 10, the shaping module 11, the label printer 12, the label winding drum 13, the label tearing module 14, the labeling robot 15, the adhesive tape roll mechanism 16, the second carrying device 17, the discharging platform 18 and even the fourth carrying device 19, and the full-automatic operation of the automatic packaging equipment is realized through the control of the electric control center.

The working principle of the automatic packaging equipment 100 for the wafer box of the invention is as follows: firstly, placing a wafer box 200 on a feeding platform 2, locking the wafer box 200 after the feeding platform 2 confirms that the placing position of the wafer box 200 is accurate, and reading product information of the wafer box 200; the fourth carrying device 19 determines whether to grab the wafer cassette 200 onto the gas charging platform 20 for charging nitrogen gas according to the product information in the wafer cassette 200 read from the feeding platform 2, and grabs the wafer cassette 200 charged with nitrogen gas back onto the feeding platform 2 from the gas charging platform 20; the bag taking device 6 grabs the packaging bag onto the packaging platform 7, and the bag taking device 6 and the packaging platform 7 are cooperated to pull the upper layer and the lower layer of the packaging bag apart to form an opening; the first carrying device 3 carries the wafer box 200 on the feeding platform 2 to the bag feeding module 5, firstly the wafer box 200 is sent to a labeling station of the bag feeding module 5, the labeling robot 15 carries out a first labeling action including labeling an information label and/or a warning label on the wafer box 200, and then the labeled wafer box 200 is sent into a packaging bag from the opening; the packaged wafer box 200 is sent to the sealing module 8, and the sealing module 8 extracts air in the packaged packaging bag and heat-seals the opening to form a sealing edge; the third carrying device 9 carries the packed and heat-sealed packaging bags to the shaping rotary platform 10 for shaping and winding adhesive tapes; the labeling robot 15 performs a second labeling operation including labeling information labels and/or warning labels on the packaging bags wrapped with the adhesive tapes at the shaping rotary platform 10; the second carrying device 17 carries the packaging bag labeled for the second time to the discharging platform 18 and sends the packaging bag out of the machine.

According to the automatic packaging equipment 100 for the wafer box, the upper layer and the lower layer of the packaging bag are pulled open through the bag taking device 6 and the packaging platform 7 to form and completely open the opening of the packaging bag, the wafer box 200 is sent into the packaging bag through the bag feeding module 5, the sealing module 8 performs automatic air suction and automatic heat sealing on the packaging bag with the box, the electric control center controls the operation of the elements, and automatic bag feeding is achieved. The automatic feeding and discharging of the wafer box 200 are realized through the feeding platform 2 and the discharging platform 18, the wafer box 200 is conveyed among modules through the plurality of conveying devices 3, 17, 19 and 9, the whole packaging process is completely automated, manpower is liberated, the standard level of packaging the wafer box 200 is improved, and the industrial 4.0 requirements of intelligent manufacturing and unmanned manufacturing are met. Meanwhile, in the preferred embodiment of the present invention, the fourth handling device 19 grabs the wafer cassette 200 onto the gas charging platform 20 for charging nitrogen gas, so as to control the humidity; the sealing module 8 extracts air in the packed bag after being packed into the box and heat seals the opening, and then further performs the action of shaping and winding the adhesive tape, thereby isolating air, preventing water, oxygen and the like and achieving the effect of no pollution on the sealing edge; the invention also attaches an information label and/or a warning label to the wafer box 200 before and/or after the wafer box is put into the bag by the labeling robot 15, thereby achieving the function of information processing.

The above embodiments are only used for illustrating the present invention and not for limiting the technical solutions described in the present invention, and the understanding of the present specification should be based on the technical personnel in the technical field, such as the directional descriptions of "front", "back", "left", "right", "upper", "lower", etc., although the present specification has described the present invention in detail with reference to the above embodiments, the ordinary skilled in the art should understand that the technical personnel in the technical field can still make modifications or equivalent substitutions on the present invention, and all the technical solutions and modifications thereof without departing from the spirit and scope of the present invention should be covered in the claims of the present invention.

Claims (10)

1. The utility model provides an automatic encapsulation equipment of wafer box which characterized in that: including going into bag module (5), getting bagging apparatus (6), package platform (7) and sealing module (8), get bagging apparatus (6) and snatch the wrapping bag to package platform (7) on, get bagging apparatus (6) and pull open the wrapping bag together and form an opening in coordination package platform (7), it certainly with the wafer box to go into bag module (5) in the opening is sent into the package bag, it will to seal module (8) the opening is sealed.

2. The apparatus of claim 1, wherein: get bagging apparatus (6) and include first grabbing device (64), packing platform (7) include second grabbing device (79), first grabbing device (64) are grabbed the upper strata of wrapping bag just second grabbing device (79) are grabbed the lower floor of wrapping bag, and first grabbing device (64) are for second grabbing device (79) do the motion of deviating from and pull open the upper and lower two-layer formation of wrapping bag the opening.

3. The apparatus of claim 1, wherein: the bag feeding module (5) comprises a supporting mechanism (52) and a first driving mechanism (54), wherein the supporting mechanism (52) is connected with the first driving mechanism (54), and under the driving of the first driving mechanism (54), the supporting mechanism (52) slides towards the opening to feed the wafer box into the packaging bag.

4. The apparatus of claim 3, wherein: the bag feeding module (5) comprises a second driving mechanism (56) connected with the supporting mechanism (52), the supporting mechanism (52) can be driven by the second driving mechanism (56) and has a lower initial position and an upper jacking position, and the supporting mechanism (52) is driven by the first driving mechanism (54) at the jacking position.

5. The apparatus of claim 1, wherein: the sealing module (8) comprises a suction nozzle (830), a pair of sealing knives (841, 842) and a pair of pressing strips (861, 862), wherein the suction nozzle (830) extends into the packaging bag for air suction, the pressing strips (861, 862) press the suction nozzle (830) and the packaging bag close to the opening, and the sealing knives (841, 842) seal the opening after the suction nozzle (830) exits the packaging bag.

6. The apparatus of claim 1, wherein: the wafer packaging machine is characterized by further comprising a third carrying device (9), a shaping rotating platform (10) and a tape roll placing mechanism (16), wherein the third carrying device (9) carries the wafer boxes filled with the bags from the sealing module (8) to the shaping rotating platform (10), and tapes on the tape roll placing mechanism (16) wind the wafer boxes which rotate on the shaping rotating platform (10) and are filled with the bags.

7. The apparatus of claim 1, wherein: the automatic labeling machine further comprises label discharging devices (12, 13 and 14) and a labeling robot (15), wherein the labeling robot (15) takes labels from the label discharging devices (12, 13 and 14) and labels the wafer boxes before and/or after the wafers are put into the bag.

8. The apparatus of claim 1, wherein: the wafer box discharging device is characterized by further comprising a feeding platform (2) and a discharging platform (18), wherein the feeding platform (2) comprises a first placing platform (24) and a limiting mechanism (27), the limiting mechanism (27) positions the wafer box on the first placing platform (24), the discharging platform (18) comprises a fork (181) and a second placing platform (184), and the second placing platform (184) is slidably positioned on the retractable fork (181).

9. The apparatus for automatically packaging a wafer cassette according to claim 8, wherein: the wafer loading and unloading device is characterized by further comprising a product information identification sensor (26), a fourth carrying device (19) and an inflation platform (20), wherein the product information identification sensor (26) is located on the feeding platform (2), and the fourth carrying device (19) determines whether to grab the wafer box to the inflation platform (20) for inflation or not according to product information in the wafer box read by the product information identification sensor (26).

10. The apparatus for automatically packaging a wafer cassette according to claim 8, wherein: the wafer packaging machine further comprises a first conveying device (3) and a second conveying device (17), wherein the first conveying device (3) conveys wafer boxes on the feeding platform (2) to the bag feeding module (5), and the second conveying device (17) conveys the wafer boxes with bags to the discharging platform (18).

Images