CN111605300B - Polyimide solar screen printing plate and preparation method thereof - Google Patents
Polyimide solar screen printing plate and preparation method thereof Download PDFInfo
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- CN111605300B CN111605300B CN202010449028.9A CN202010449028A CN111605300B CN 111605300 B CN111605300 B CN 111605300B CN 202010449028 A CN202010449028 A CN 202010449028A CN 111605300 B CN111605300 B CN 111605300B
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- screen
- polyester
- polyimide
- film
- printing plate
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 65
- 238000007650 screen-printing Methods 0.000 title claims abstract description 47
- 239000004642 Polyimide Substances 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 239000002131 composite material Substances 0.000 claims abstract description 47
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- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
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- 238000000576 coating method Methods 0.000 claims abstract description 27
- 229920000642 polymer Polymers 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
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- 239000004831 Hot glue Substances 0.000 claims abstract description 18
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- 238000001035 drying Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 35
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- -1 ether polyol Chemical class 0.000 claims description 8
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- 238000006068 polycondensation reaction Methods 0.000 claims description 5
- 229920000734 polysilsesquioxane polymer Polymers 0.000 claims description 5
- KLDXJTOLSGUMSJ-UNTFVMJOSA-N (3s,3ar,6s,6ar)-2,3,3a,5,6,6a-hexahydrofuro[3,2-b]furan-3,6-diol Chemical compound O[C@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-UNTFVMJOSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- KLDXJTOLSGUMSJ-JGWLITMVSA-N Isosorbide Chemical compound O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-JGWLITMVSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical group [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- 229960002479 isosorbide Drugs 0.000 claims description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 4
- 229920005862 polyol Polymers 0.000 claims description 4
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 claims description 4
- 150000005846 sugar alcohols Chemical group 0.000 claims description 4
- HEBKCHPVOIAQTA-NGQZWQHPSA-N D-Arabitol Natural products OC[C@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-NGQZWQHPSA-N 0.000 claims description 3
- HEBKCHPVOIAQTA-QWWZWVQMSA-N D-arabinitol Chemical compound OC[C@@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-QWWZWVQMSA-N 0.000 claims description 3
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000001384 succinic acid Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 3
- 239000000811 xylitol Substances 0.000 claims description 3
- 229960002675 xylitol Drugs 0.000 claims description 3
- 235000010447 xylitol Nutrition 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-ZXXMMSQZSA-N D-iditol Chemical compound OC[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-ZXXMMSQZSA-N 0.000 claims description 2
- HEBKCHPVOIAQTA-IMJSIDKUSA-N L-arabinitol Chemical compound OC[C@H](O)C(O)[C@@H](O)CO HEBKCHPVOIAQTA-IMJSIDKUSA-N 0.000 claims description 2
- JVWLUVNSQYXYBE-UHFFFAOYSA-N Ribitol Natural products OCC(C)C(O)C(O)CO JVWLUVNSQYXYBE-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
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- 239000010949 copper Substances 0.000 claims description 2
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- HEBKCHPVOIAQTA-ZXFHETKHSA-N ribitol Chemical compound OC[C@H](O)[C@H](O)[C@H](O)CO HEBKCHPVOIAQTA-ZXFHETKHSA-N 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 1
- 239000000565 sealant Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 18
- 239000004744 fabric Substances 0.000 description 14
- 239000002861 polymer material Substances 0.000 description 12
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- 238000007639 printing Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
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- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 5
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010329 laser etching Methods 0.000 description 3
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- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 2
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- 239000000203 mixture Substances 0.000 description 2
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- PNNNRSAQSRJVSB-BXKVDMCESA-N aldehydo-L-rhamnose Chemical compound C[C@H](O)[C@H](O)[C@@H](O)[C@@H](O)C=O PNNNRSAQSRJVSB-BXKVDMCESA-N 0.000 description 1
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- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
- B41C1/145—Forme preparation for stencil-printing or silk-screen printing by perforation using an energetic radiation beam, e.g. a laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/10—Printing plates or foils; Materials therefor metallic for lithographic printing multiple
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
- B41N1/14—Lithographic printing foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/241—Stencils; Stencil materials; Carriers therefor characterised by the adhesive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/032—Graining by laser, arc or plasma means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/06—Preparing for use and conserving printing surfaces by use of detergents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Textile Engineering (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
The invention provides a polyimide solar screen printing plate and a preparation method thereof, wherein the preparation method comprises the following steps: 1) and (3) pulling and compounding: firstly, stretching a polyester silk screen, fixing the polyester silk screen on a screen frame to form a polyester screen after standing, then compounding a metal silk screen to a compounding area in the middle of the polyester screen by using a hot melt adhesive film to form a compound gauze, and fixing the compound gauze on another screen frame to obtain a compound white plate; 2) coating an adhesive layer: uniformly coating the adhesive on the surface of the composite white plate or the polyimide film to form an adhesive layer; 3) film covering: a polyimide film with corresponding size and film thickness is flatly laid in a coating area of the composite white plate, then the composite white plate is flatly laid on a heating platform, the area of the heating platform is equal to the area of the composite white plate, the temperature is 70-130 ℃, the polyimide film and the composite white plate are pressed together under the pressure of 1-10kg, and a polymer composite layer is formed on the composite white plate; 4) drying: 5) laser: 6) and (6) cleaning, detecting and packaging.
Description
Technical Field
The invention relates to a solar screen printing plate, and particularly discloses a solar screen printing plate using a thermosetting adhesive and a polyimide film and a manufacturing method thereof.
Background
The solar screen printing technology is relatively fast updated in recent years, partial or all patterns of the existing screen printing plate for printing the solar crystalline silicon cell are made of diazo type photosensitive materials, the diazo type photosensitive materials are exposed and developed through ultraviolet rays, in the exposure process, the diazo type photosensitive materials are irradiated by the ultraviolet rays, the chemical molecular structures of the photosensitive materials are subjected to cross-linking and curing, the diazo type photosensitive materials do not have water solubility any more, the diazo type photosensitive materials are shielded by a film negative film and are not irradiated by the ultraviolet rays, the water solubility of the materials per se still exists, and after the exposed screen printing plate is washed by water, a negative and positive image is formed to form the. However, the process of the screen printing plate making process for printing the solar crystalline silicon cell is complex and various, the requirements on environment cleanliness, temperature and humidity in the plate making process are very strict, the yield is less than 50%, the screen printing plate manufacturing cost is extremely high, and the reduction is difficult.
In the manufacturing principle of the non-photosensitive screen printing plate, after a mesh cloth is formed by weaving a plurality of warps and wefts in a staggered manner, the mesh cloth is fixed to a screen frame in a stretching manner, then a polymer material layer is coated on the mesh cloth and formed, and finally a part of the polymer material layer is removed in a laser etching manner to form an opening pattern required in printing. When screen printing is carried out, an operator can utilize the scraper to apply pressure to scrape and print ink, so that the ink can print patterns on a printed object through the hollowed meshes and the opening patterns, and the purpose of printing is achieved. Patent CN206856238U discloses a printing screen structure, which is a non-photosensitive screen structure that directly uses laser beam to cut an opening pattern on the screen and processes the opening pattern for many times to increase the ink penetration of the screen. The screen printing plate comprises a high polymer material layer, the high polymer material layer covers the second side of the screen cloth and partially covers or does not cover the first side of the screen cloth, and the high polymer material layer comprises a plurality of opening patterns. Regarding the preparation method of the polymer material layer, the patent provides two methods, one of which is to combine the polymer material in the form of a film with the mesh fabric in a hot pressing manner, so that the polymer material covers the mesh fabric and forms the polymer material layer. Secondly, the polymer material in liquid form is combined with the mesh fabric in one of a wet coating mode, a groove-scraping coating mode, a soaking coating mode, a rotary coating mode, a spraying coating mode or a slit coating mode. For the first method using hot pressing, in actual production, due to the requirement of cost control, the mesh fabric is generally a composite mesh fabric composed of a metal mesh fabric and a polymer mesh fabric, and the two are formed by gluing with a hot melt adhesive film. By adopting a direct hot pressing method, in the hot pressing process, the hot melt adhesive film in the formed composite mesh cloth is melted, the bonding performance is poor, and the condition of uneven tension is caused, so that the yield is reduced. And the wet coating mode is adopted, so that the process is complex, high temperature is also required in the curing process, and secondly, the process cannot adopt high molecular materials with very high molecular weight, and if the low molecular weight high molecular materials are adopted, the mechanical strength cannot meet the requirement. In actual production, most of the polymer materials of the non-photosensitive screen are actually Polyimide (PI), and no other polymer materials can be compared with the Polyimide (PI) in the field of solar screens at present due to excellent high temperature resistance, wear resistance and solvent resistance. If PI is adopted in the patent, hot pressing or wet coating is adopted, the hot pressing needs high temperature of more than 400 ℃, wet coating PI also needs high temperature, the process is complex, and the yield is reduced.
Accordingly, some companies have attempted to achieve bonding of the wire mesh cloth to the polymer film by using adhesive bonding instead of direct hot pressing. Patent CN110039882A discloses a method for manufacturing a composite screen printing plate, which comprises the steps of pulling and compounding; manufacturing a film layer; coating an adhesive; laminating, drying, laser, cleaning and the like; wherein the second step of the film layer is prepared as follows: the preparation method comprises the steps of modulating a high-molecular composite material into liquid with fixed viscosity, coating the liquid on a PET film to prepare a film layer, drying the film layer in an oven at 50-100 ℃, and cutting the dried film layer into films with corresponding sizes to finish the preparation of the film layer. However, this technique is obviously not suitable for PI, because PI has high temperature resistance up to 400 ℃ and good solvent resistance, and it cannot be coated on PET film with melting point of only 250 ℃ and solvent resistance inferior to PI by automatic coating or automatic casting. Secondly, according to practical production experience, the adhesion and durability between the PI film and the steel wire mesh provided by the traditional polymer adhesive on the market are difficult to meet the requirements of printing ten thousand times. And the implementation of the process needs to greatly adjust the production equipment of the traditional process at present, and the process improvement cost is huge.
Other processes have been tried by some companies to overcome the above problems, for example, patent CN108749276A discloses a method for manufacturing polyimide solar screen, which includes the following steps: manufacturing a substrate, namely, hot-melting a metal wire mesh (3) and a polyimide film (1) together through high-temperature glue to form the substrate; manufacturing a screen printing plate, namely bonding the substrate and a polyester silk screen (5) together through hot melt adhesive to form the screen printing plate, then removing the polyester silk screen (5) in the middle position, and bonding the polyester silk screen (5) and a metal silk screen (3); and (3) pattern making, namely placing the screen printing plate on a laser cutting machine to cut patterns, wherein the patterns are positioned on the polyimide film (1). The patent is different from the traditional process at present, and creatively proposes that the steel wire mesh and the polyimide film are hot-melted into the substrate and then are bonded with the polyester wire mesh together through the hot-melted glue to form the screen printing plate. Through practical experimental study of the applicant, the technology is found to have two problems: 1. the hot melt adhesive layer between the metal wire mesh and the PI film is subjected to secondary heating under the same tension condition in the screen printing plate manufacturing stage, and the temperature is up to 180-200 ℃, so that the adhesion between the metal wire mesh and the PI film can be influenced; 2. the two times of adhesion use plastic hot melt adhesive materials, and the solvent resistance and the adhesiveness of the hot melt adhesive materials can not meet the requirement that the printing times are more than one hundred thousand times. And the implementation of the process needs to greatly adjust the production equipment of the traditional process at present, and the process improvement cost is huge.
Therefore, aiming at polyimide and a steel wire mesh, a special adhesive which has three properties, namely low-temperature curing, good adhesion and solvent resistance, is developed, so that the service life of the screen plate reaches more than fifteen thousand times becomes the requirement of practical production.
Disclosure of Invention
The invention provides a polyimide solar screen printing plate which comprises a screen frame (7) and a polyester screen mesh (2), wherein the polyester screen mesh (2) is stretched at the bottom of the screen frame (7), a silk-screen pattern area is arranged at the center of the polyester screen mesh (2), and the polyester screen mesh (2) is in a shape of Chinese character hui; the hot melt adhesive film further comprises a metal wire mesh (4), a hot melt adhesive film layer (6) and a polyimide film (1); the polyimide film (1) is fixed on the bottom surface of the metal silk screen (4), a high-molecular adhesive layer (8) is arranged between the polyimide film (1) and the metal silk screen (4), a plurality of wire grooves (11) are formed in the polyimide film (1), and the wire grooves (11) form printed patterns; the top surface of wire mesh (4) is fixed on polyester silk screen (2), wire mesh (4) are greater than silk screen pattern district, wire mesh (4) cover silk screen pattern district, return type region (5) and comprise polyester silk screen (2) and hot melt adhesive film layer (6), return type region (5) and silk screen pattern between regional (3) be five layer construction, be polyester silk screen (2) in proper order, hot melt adhesive film layer (6), wire mesh (4), polymer adhesive layer (8) and polyimide film layer (1).
The wire mesh is made of stainless steel, copper, tungsten steel, titanium or nickel.
The preparation method of the polyimide solar screen printing plate comprises the following steps:
1) and (3) pulling and compounding: firstly, stretching a polyester silk screen, fixing the polyester silk screen on a screen frame to form a polyester screen after standing, then compounding a metal silk screen to a compounding area in the middle of the polyester screen by using a hot melt adhesive film to form a compound screen gauze, obtaining certain silk screen tension under the action of a screen jacking machine, and fixing the compound screen gauze on another screen frame to obtain a compound white plate;
2) coating an adhesive layer: uniformly coating the prepared high-molecular adhesive on the surface of a composite white plate or a polyimide film to form an adhesive layer;
3) film covering: a polyimide film with corresponding size and film thickness is flatly laid in a coating area of the composite white plate, then the composite white plate is flatly laid on a heating platform, the area of the heating platform is equal to the area of the composite white plate, the temperature is 70-130 ℃, the polyimide film and the composite white plate are pressed together under the pressure of 1-10kg, and a polymer composite layer is formed on the composite white plate;
4) drying: placing the attached composite white plate into an oven for drying, controlling the time to be 30-90min, and taking out the dried composite white plate to finish the manufacture of the polymer composite layer;
5) laser: setting a corresponding graphic program and setting energy and time by adopting a laser machine, then placing the composite screen at a fixed position of equipment for laser, wherein a laser probe in the laser machine can emit monochromatic light with fixed wavelength, and performing laser etching on the polymer composite layer according to the program to etch the unnecessary graphic layer in the lines so as to form a complete hollowed-out graphic;
6) cleaning: spraying cleaning liquid on the surface of the laser-finished screen printing plate, washing by using a water gun, removing foreign matters remained in the lines, drying by blowing, and drying in an oven for 20-30min to obtain the solar screen printing plate;
7) detecting and packaging: and detecting parameters such as film thickness, line width, tension and the like of the corresponding composite screen printing plate, and normally packaging and using the composite screen printing plate when the specified requirements are met.
Wherein, the high molecular adhesive is a polyurethane adhesive, which comprises the following components in percentage by weight: hydroxyl functional polyurethane resin dispersion: 75 to 88 percent; blocked diisocyanate: 5.5% -10%; surfactant (b): 0.5 to 1 percent; tubular or flat plate-like silicone containing a polysilsesquioxane structure: 4% -5%; wherein, the hydroxyl functional polyurethane resin dispersion is prepared by the following components by weight ratio: and (3) polyester polyol Mn is 3000-4000: 79 to 82 percent; and (3) the polytetrahydrofuran ether polyol Mn is 2500-3000: 12 to 16 percent; aliphatic diisocyanate: 5 to 9 percent.
The polyester polyol is prepared by polycondensation of dicarboxylic acid, a first chain extender and a second chain extender; wherein the dicarboxylic acid is one or more of adipic acid, succinic acid and azelaic acid; the first chain extender is dihydric alcohol, and the second chain extender is alditol; the molar ratio of the first chain extender to the second chain extender is 1: 4-5.
Wherein the dihydric alcohol is one or more of 1, 4-butanediol, 1, 6-hexanediol and ethylene glycol.
Wherein the alditol is one or more selected from D-arabitol, L-arabitol, xylitol, ribitol, and D-iditol.
Wherein, the aliphatic diisocyanate is: 1, 6-Hexamethylene Diisocyanate (HDI) or isophorone diisocyanate (IPDI).
The blocked diisocyanate is prepared from the following components in parts by weight: alditol dianhydride: 10 to 15 percent; aliphatic diisocyanate: 50-60 percent; a sealing agent: 10 to 15 percent; the balance of solvent.
Wherein the aliphatic diisocyanate is: one or both of 1, 6-Hexamethylene Diisocyanate (HDI) and isophorone diisocyanate (IPDI); the blocking agent is preferably sodium bisulfite. The alditol dianhydride is at least one selected from the group consisting of isosorbide, isomannide, isoidide, and isodulcitol.
With respect to the advantageous effects of the present invention, the applicant and the research and development personnel of the supplier have conducted a great deal of research in the actual production in combination, and it has been unexpectedly found that the polymer adhesive prepared by the above method has excellent adhesive properties to polyimide. The high molecular adhesive can be heated and cured at a low temperature of 70-130 ℃, preferably 90-115 ℃, due to the selection of special polyols and end capping agents, and has extremely excellent adhesion to a PI film and excellent solvent resistance. Compared with the direct hot pressing process of the PI film, the high-molecular adhesive layer formed by the method disclosed by the invention penetrates through the metal wire mesh layer to form a coating structure, so that the metal wire mesh layer, the high-molecular adhesive layer and the PI film form an organic whole, and the bonding strength is high; and the PI is only sunk into meshes of the metal wire mesh layer by simple hot pressing, and cannot form complete coating, so the bonding strength is obviously inferior to that of the process of adding the high-molecular adhesive. Meanwhile, the adhesive is also characterized in that tubular or flat organosilicon containing a polysilsesquioxane structure is added, so that the adhesive has good stripping performance at 70-90 ℃, has good easy stripping performance, and is convenient to strip the PI film under the condition of not damaging a steel wire mesh during rework.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of a silk-screen pattern area;
Detailed Description
The technical solution of the invention will be described in detail with reference to the specific examples.
Preparation of macromolecular adhesive A-F
1. Preparation of Polymer adhesive A
The polyurethane adhesive comprises the following components in percentage by weight: hydroxyl functional polyurethane resin dispersion: 80 percent; blocked diisocyanate: 7.5 percent; surfactant (b): 0.7 percent; tubular or flat plate-like silicone containing a polysilsesquioxane structure: 4 percent and the balance of solvent. Wherein, the hydroxyl functional polyurethane resin is prepared by the following components by weight ratio: and (3) polyester polyol Mn is 3000-4000: 81 percent; and (3) the polytetrahydrofuran ether polyol Mn is 2500-3000: 13 percent; aliphatic diisocyanate: 6 percent. The polyester polyol is prepared by polycondensation of dicarboxylic acid, a first chain extender and a second chain extender; wherein the dicarboxylic acid is succinic acid; the first chain extender is 1, 4-butanediol, and the second chain extender is xylitol; the molar ratio of the first chain extender to the second chain extender is 1: 4. the aliphatic diisocyanate is isophorone diisocyanate (IPDI). The NCO-blocked diisocyanate is prepared from the following components in percentage by weight: isosorbide: 12 percent; aliphatic diisocyanate (HDI): 55 percent; sodium bisulfite as a blocking agent: 13 percent; solvent: and (4) the balance.
2. Preparation of Polymer adhesive B
And replacing the second chain extender with D-arabitol, and preparing the rest of the high-molecular adhesive A.
3. Preparation of Polymer adhesive C
The second chain extender is replaced by 1, 6-hexanediol, and the rest is the preparation of the high-molecular adhesive A.
4. Preparation of Polymer adhesive D
The isosorbide of the NCO-blocked diisocyanate was replaced with ethylene glycol, and the remainder was subjected to the preparation of a polymer binder A.
5. Preparation of Polymer adhesive E
Tubular or flat organosilicon containing polysilsesquioxane structure is replaced by conventional polydimethylsiloxane, and the preparation of the high-molecular adhesive A is carried out.
6. Preparation of Polymer adhesive F
The blocking agent sodium bisulfite is replaced by methyl ethyl ketoxime, and the rest is the same as the preparation of the macromolecular adhesive A.
Preparation of screen printing plate products A-F
The screen printing plate preparation method comprises the following steps:
1) and (3) pulling and compounding: firstly, stretching a polyester silk screen, fixing the polyester silk screen on a screen frame to form a polyester screen after standing, then compounding a metal silk screen to a compounding area in the middle of the polyester screen by using a hot melt adhesive film to form a compound screen gauze, obtaining certain silk screen tension under the action of a screen jacking machine, and fixing the compound screen gauze on another screen frame to obtain a compound white plate;
2) coating an adhesive layer: uniformly coating the prepared high-molecular adhesives A-F on the surface of a composite white plate or a polyimide film by using an automatic coating machine to form an adhesion layer;
3) film covering: a polyimide film with corresponding size and film thickness is flatly laid in a coating area of the composite white plate, the composite white plate is flatly laid on a heating platform, the area of the heating platform is equal to the area of the composite white plate, the composite white plate is heated to a proper thermosetting temperature, and then the polyimide film and the composite white plate are pressed under 5kg of pressure, so that a polymer composite layer is formed on the composite white plate;
4) drying: placing the attached composite white plate into an oven for drying, controlling the temperature at 100 +/-10 ℃ and the time at 60min, and taking out the dried composite white plate to finish the manufacture of the polymer composite layer;
5) laser: setting a corresponding graphic program and setting energy and time by adopting a laser machine, then placing the composite screen at a fixed position of equipment for laser, wherein a laser probe in the laser machine can emit monochromatic light with fixed wavelength, and performing laser etching on the polymer composite layer according to the program to etch the unnecessary graphic layer in the lines so as to form a complete hollowed-out graphic;
6) cleaning: spraying cleaning liquid on the surface of the laser-finished screen printing plate, washing by using a water gun, removing foreign matters remained in the lines, drying by blowing, and then placing in an oven to dry for 25min to obtain the solar screen printing plate;
7) detecting and packaging: and detecting parameters such as film thickness, line width, tension and the like of the corresponding composite screen printing plate, and normally packaging and using the composite screen printing plate when the specified requirements are met to obtain corresponding screen printing plate products A-F.
Performance evaluation:
(1) measuring the heating and curing temperature of the macromolecular adhesive;
(2) testing the service life of the screen printing plate: the number of times of printing is counted;
(3) solvent resistance test: and (3) soaking the silk-screen pattern area of the screen printing plate in a solvent for 96 hours, and observing whether the polymer adhesive layer between the PI film and the silk screen swells or not under a microscope.
(4) Easy peel test: after the temperature is kept at 80 ℃ for 2 hours, the PI film is separated from the silk screen, and whether the PI film is damaged or not is observed to judge the easy stripping property.
Screen printing plate A | Screen B | Screen printing plate C | Screen printing plate D | Screen printing plate E | Screen F | |
Curing temperature | 90-95℃ | 95-100℃ | 110-115℃ | 130℃ | 130℃ | Over 195 deg.C |
Service life | 15 ten thousand times | 14.5 ten thousand |
11 ten thousand times | 10.5 ten thousand times | 13.5 ten thousand times | 14 ten thousand times |
Solvent resistance | No swelling | No swelling | Swelling of the composition | Swelling of the composition | No swelling | No swelling |
Easy peelability | Good effect | Good effect | Good effect | Good effect | Difference (D) | Good effect |
Therefore, compared with the prior art, the service life and the solvent resistance of the solar screen printing plate adopting the special binder and the special process are greatly prolonged, the curing temperature is reduced, the stripping property is good, and the PI film can be stripped conveniently without damaging the steel wire mesh during rework.
Claims (9)
1. A preparation method of a polyimide solar screen printing plate is characterized by comprising the following steps:
1) and (3) pulling and compounding: firstly, stretching a polyester silk screen, fixing the polyester silk screen on a screen frame to form a polyester screen after standing, then compounding a metal silk screen to a compounding area in the middle of the polyester screen by using a hot melt adhesive film to form a compound screen gauze, obtaining certain silk screen tension under the action of a screen jacking machine, and fixing the compound screen gauze on another screen frame to obtain a compound white plate;
2) coating an adhesive layer: uniformly coating the prepared high-molecular adhesive on the surface of a composite white plate or a polyimide film to form a high-molecular adhesive layer;
3) film covering: taking a polyimide film with corresponding size and film thickness, flatly paving the polyimide film in a coating area of a composite white plate, flatly paving the composite white plate on a heating platform, wherein the area of the heating platform is equal to the area of the composite white plate, and the temperature is 70-130 ℃, and then carrying out lamination on the polyimide film and the composite white plate by using 1-10kg of pressure so as to form a polymer composite layer on the composite white plate;
4) drying; 5) laser; 6) cleaning; 7) detecting the package, wherein the high molecular adhesive is a polyurethane adhesive and comprises the following components in percentage by weight: hydroxyl functional polyurethane resin dispersion: 75 to 88 percent; blocked diisocyanate: 5.5% -10%; surfactant (b): 0.5 to 1 percent; tubular or flat plate-like silicone containing a polysilsesquioxane structure: 4% -5%; wherein, the hydroxyl functional polyurethane resin dispersion is prepared by the following components by weight ratio: and (3) polyester polyol Mn is 3000-4000: 79 to 82 percent; and (3) the polytetrahydrofuran ether polyol Mn is 2500-3000: 12 to 16 percent; aliphatic diisocyanate: 5% -9%; the polyester polyol is prepared by polycondensation of dicarboxylic acid, a first chain extender and a second chain extender; the first chain extender is dihydric alcohol, and the second chain extender is alditol; the blocked diisocyanate is prepared from the following components in parts by weight: alditol dianhydride: 10 to 15 percent; aliphatic diisocyanate: 50-60 percent; a sealing agent: 10 to 15 percent; the balance of solvent.
2. The preparation method of the polyimide solar screen printing plate according to claim 1, wherein the prepared polyimide solar screen printing plate comprises a screen frame (7) and a polyester screen mesh (2), wherein the polyester screen mesh (2) is stretched at the bottom of the screen frame (7), a silk-screen pattern area is arranged at the center of the polyester screen mesh (2), and the polyester screen mesh (2) is in a shape of Chinese character 'hui'; the hot melt adhesive film further comprises a metal wire mesh (4), a hot melt adhesive film layer (6) and a polyimide film (1); the polyimide film (1) is fixed on the bottom surface of the metal silk screen (4), a high-molecular adhesive layer (8) is arranged between the polyimide film (1) and the metal silk screen (4), a plurality of wire grooves (11) are formed in the polyimide film (1), and the wire grooves (11) form printed patterns; the top surface of wire mesh (4) is fixed on polyester silk screen (2), wire mesh (4) are greater than silk screen pattern district, wire mesh (4) cover silk screen pattern district, return type region (5) and comprise polyester silk screen (2) and hot melt adhesive film layer (6), return type region (5) and silk screen pattern between regional (3) be five layer construction, be polyester silk screen (2), hot melt adhesive film layer (6), wire mesh (4), polymer adhesive layer (8) and polyimide film (1) in proper order.
3. The method for preparing the polyimide solar screen printing plate according to claim 1, wherein the first chain extender is 1, 4-butanediol.
4. The method for preparing the polyimide solar screen printing plate according to claim 1, wherein the polyester polyol is prepared by polycondensation of dicarboxylic acid, a first chain extender and a second chain extender; the molar ratio of the first chain extender to the second chain extender is 1: 4-5.
5. The method for preparing the polyimide solar screen printing plate according to claim 1, wherein the polyester polyol is prepared by polycondensation of dicarboxylic acid, a first chain extender and a second chain extender; wherein the dicarboxylic acid is one or more of adipic acid, succinic acid and azelaic acid, the dihydric alcohol is one or more of 1, 6-hexanediol and ethylene glycol, and the alditol is one or more of D-arabitol, L-arabitol, xylitol, ribitol and D-iditol.
6. The method for preparing the polyimide solar screen printing plate according to claim 1, wherein the sealant is sodium bisulfite.
7. The method of claim 1, wherein the alditol dianhydride is at least one selected from the group consisting of isosorbide, isomannide, isoidide, and isogalactitol.
8. The method for preparing a polyimide solar screen printing plate according to claim 1, wherein the metal wire mesh is made of stainless steel, copper, tungsten steel, titanium or nickel.
9. A polyimide solar screen obtained by the preparation method of any one of claims 1 to 8.
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Denomination of invention: Polyimide solar screen and its preparation method Effective date of registration: 20220119 Granted publication date: 20210129 Pledgee: Bank of China Limited Dongtai Branch Pledgor: JIANGSU SHENGXI ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022980000752 |