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CN111604716A - Process method for processing PCB micro drill - Google Patents

Process method for processing PCB micro drill Download PDF

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Publication number
CN111604716A
CN111604716A CN202010475110.9A CN202010475110A CN111604716A CN 111604716 A CN111604716 A CN 111604716A CN 202010475110 A CN202010475110 A CN 202010475110A CN 111604716 A CN111604716 A CN 111604716A
Authority
CN
China
Prior art keywords
grinding
semi
station
processing
finished product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010475110.9A
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Chinese (zh)
Inventor
史德豪
王雪峰
王俊锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanyang Dingtai High Tech Co ltd
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Nanyang Dingtai High Tech Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Nanyang Dingtai High Tech Co ltd filed Critical Nanyang Dingtai High Tech Co ltd
Priority to CN202010475110.9A priority Critical patent/CN111604716A/en
Publication of CN111604716A publication Critical patent/CN111604716A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B51/00Tools for drilling machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/24Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of drills

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drilling Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

The invention discloses a process method for processing PCB micro-drill, which mainly comprises the following steps: firstly, before a tungsten steel bar raw material is fed into a four-station machine, the diameter of a blade part of the tungsten steel bar is processed to be 0.5mm from 1.1mm by using step grinding equipment, then a semi-finished product is processed in a rough grinding station according to the grinding amount of 0.1-0.3 mm, then a semi-finished product is processed in a fine grinding station according to the grinding amount of 0.1mm, then the semi-finished product is processed in a fine grinding station according to the grinding amount of 0.02-0.03mm, and finally a notch body diameter station on the semi-finished product is processed according to the grinding amount of 0.002 mm. The invention has the advantages that: the diameter of the edge part of a semi-finished product after welding is machined to 0.5mm from 1.1mm through step grinding, the grinding amount of a semi-finish grinding station of the edge part is reduced, the efficiency of the semi-finish grinding station of the edge part is improved, the machining speed of the semi-finish grinding station of the edge part and the machining speed of a notch body diameter station are matched, the integral machining efficiency of a single PCB drill bit is improved by 20%, the abrasion of a grinding wheel is weakened in the technological process, and the needle breakage does not occur any more.

Description

Process method for processing PCB micro drill
Technical Field
The invention belongs to the field of PCB micro-drilling processing, and particularly relates to a technology for processing a PCB micro-drilling semi-finished product.
Background
An enterprise processing the PCB hard alloy micro drill bit needs to process a tungsten steel bar material with the diameter of 0.1-0.4mm from 1.3-1.5mm through a four-station machine of edge coarse and fine grinding processing equipment. The four-station machine consists of a rough grinding station, a blade part semi-fine grinding station, a fine grinding station and a notch body diameter station, and the four-station machine gradually grinds tungsten steel bars to a proper required diameter in stages. In the existing processing method of the PCB micro drill, the rough processing grinding amount of a rough grinding station is 0.2-0.25mm, the processing grinding amount of a blade part semi-fine grinding station is 0.6-0.7mm, the processing grinding amount of a fine grinding station is 0.02-0.03mm, and the grinding amount of a notch body diameter station is 0.002mm, so that the efficiency of a blade rough and fine grinding device is restricted in rough grinding due to unbalanced grinding amount of the blade rough and fine grinding device.
The half finish grinding processing time of the rough and fine grinding equipment of the blade restricts the whole single-branch time. The analysis shows that the semi-fine grinding time is improved, the smaller the semi-fine grinding allowance to be processed is, the more the efficiency is improved, and the higher the processing speed of the blade semi-fine grinding station is and the efficiency is from the analysis of the cutting force of the grinding wheel of the blade semi-fine grinding station. However, after the processing speed of the semi-fine grinding station of the blade part is increased by a technician, the abrasion of the grinding wheel is fast, and the needle breakage occurs abnormally in the process, so that a process for weakening the abrasion of the grinding wheel, avoiding the occurrence of the needle breakage and balancing the processing speed of each station of the coarse and fine grinding equipment of the blade part is urgently needed to be developed.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a process method for processing the PCB micro drill, which can improve the efficiency of processing the PCB micro drill by equipment, weaken the abrasion of a grinding wheel and avoid the occurrence of broken pins.
A process method for processing PCB micro drill includes the following steps:
step 1), before a tungsten steel bar raw material is fed into a four-station machine, the diameter of a blade part of the tungsten steel bar is processed from 1.1mm to 0.5 mm;
step 2), processing the semi-finished product with the diameter of 0.5mm obtained in the step 1) in a rough grinding station;
step 3), processing the semi-finished product on the rough grinding station in the step 2) according to the grinding amount of 0.1-0.3 mm, and processing the tungsten steel bar to 0.2-0.4 mm;
step 4), processing the semi-finished product with the diameter of 0.2-0.4 mm obtained in the step 3) in a semi-fine grinding station;
step 5), processing the semi-finished product on the semi-fine grinding station of the blade part in the step 4) according to the grinding amount of 0.1mm, and processing the tungsten steel bar to 0.1-0.3 mm;
step 6), processing the semi-finished product with the diameter of 0.1-0.3 mm obtained in the step 5) in a fine grinding station;
step 7), processing the semi-finished product on the fine grinding station in the step 6) according to the grinding amount of 0.02-0.03mm, and processing the tungsten steel bar to 0.07-0.28 mm;
step 8), processing the semi-finished product with the diameter of 0.07-0.28 mm obtained in the step 7) in a cutting body diameter station;
and 9) processing the semi-finished product on the notch body diameter station in the step 8) according to the grinding amount of 0.002mm, and processing the tungsten steel bar to 0.068-0.278 mm.
Preferably, the blade part semi-finish grinding station in the step 5) uses three grinding wheels for grinding, and the grinding of the third grinding wheel is delayed for 1-2.5 seconds.
Preferably, the finishing station in step 7) is ground using three grinding wheels, two of which are ground.
Preferably, the two grinding wheels at the incision body diameter station in the step 9) are used for grinding at the speed of 20-25 min/mm.
The invention has the following advantages: will weld semi-manufactured goods cutting part diameter after grinding through the step by 1.1mm, process to 0.5mm, reduce the semi-finish grinding station mill output of cutting part 0.6mm, thereby promote the semi-finish grinding station efficiency of cutting part, promote through the efficiency at the semi-finish grinding station of cutting part, match the fine grinding station of sword and the processing speed of incision body footpath station, thereby reach the promotion of the whole machining efficiency of single PCB drill bit, compare in traditional technological method equipment machining efficiency and promote 20%, the board utilization ratio, artifical productivity greatly improves, emery wheel wearing and tearing weaken in the course of the technology, the broken needle no longer takes place.
Drawings
Fig. 1 is a schematic diagram of grinding wheel grinding of a fine grinding station in the process of processing PCB micro drill according to the present invention.
Fig. 2 is a schematic diagram of grinding wheel grinding at a notch body diameter station in the process of processing the PCB micro drill of the present invention.
In the figure: 1. a drill bit; 2. a first grinding wheel; 3. a second grinding wheel; 4. a third grinding wheel; 5. a fourth grinding wheel; 6. and a fifth grinding wheel.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Embodiment 1, as shown in fig. 1 and 2, PCB micro drill is processed according to the following steps,
step 1), before a tungsten steel bar raw material is fed into a four-station machine, processing the diameter of a blade part of the tungsten steel bar from 1.1mm to 0.5mm by using step grinding equipment (rough processing of the blade part);
step 2), processing the semi-finished product with the diameter of 0.5mm obtained in the step 1) in a rough grinding station;
step 3), processing the semi-finished product on the rough grinding station in the step 2) according to the grinding amount of 0.1-0.3 mm, placing the semi-finished product drill bit 1 on the rough grinding station, and directly grinding the semi-finished product drill bit by using a grinding wheel, so that the tungsten steel bar is processed to be 0.2-0.4 mm;
step 4), processing the semi-finished product with the diameter of 0.2-0.4 mm obtained in the step 3) in a semi-fine grinding station;
step 5), processing the semi-finished product on the edge part semi-finish grinding station in the step 4) according to the grinding quantity of 0.1mm, placing the semi-finished product drill bit 1 on the edge part semi-finish grinding station for grinding by using three grinding wheels, wherein the third grinding wheel carries out finish grinding after the grinding of the rest two grinding wheels is finished for 1-2.5 seconds, and processing the tungsten steel bar to 0.1-0.3 mm;
step 6), processing the semi-finished product with the diameter of 0.1-0.3 mm obtained in the step 5) in a fine grinding station;
step 7), processing the semi-finished product on the finish grinding station in the step 6) according to the grinding quantity of 0.02-0.03mm, placing a semi-finished product drill bit 1 in the finish grinding station, and grinding the semi-finished product drill bit by using a first grinding wheel 2, a second grinding wheel 3 and a third grinding wheel 4, wherein the drill bit 1 is placed between the first grinding wheel 2 and the second grinding wheel 3, the first grinding wheel 2 and the second grinding wheel 3 are started to grind the drill bit 1 at the same time, the first grinding wheel 2 and the second grinding wheel 3 ensure the cutting precision and the inclination, the third grinding wheel 4 is used for independent grinding after grinding is finished, the third grinding wheel 4 ensures the edge length, and the tungsten steel bar is processed to 0.07-0.28 mm;
step 8), processing the semi-finished product with the diameter of 0.07-0.28 mm obtained in the step 7) in a cutting body diameter station;
step 9), the semi-finished product on the notch body diameter station in the step 8) is processed according to the grinding amount of 0.002mm, the drill bit 1 is placed on the notch body diameter station and is cut by the fourth grinding wheel 5 and the fifth grinding wheel 6, the speed is adjusted to be 20-25min/mm from the original 30min/mm, and the tungsten steel bar is processed to be 0.068-0.278 mm.
As described above, although the embodiments of the present invention have been described in detail, it will be apparent to those skilled in the art that many modifications are possible without substantially departing from the spirit and scope of the present invention. Therefore, such modifications are also all included in the scope of protection of the present invention.

Claims (4)

1. A process method for processing PCB micro drill is characterized by comprising the following steps:
step 1), before a tungsten steel bar raw material is fed into a four-station machine, rough machining is carried out on a blade part by using step grinding equipment, and the diameter of the blade part of the tungsten steel bar is machined from 1.1mm to 0.5 mm;
step 2), processing the semi-finished product with the diameter of 0.5mm obtained in the step 1) in a rough grinding station;
step 3), processing the semi-finished product on the rough grinding station in the step 2) according to the grinding amount of 0.1-0.3 mm, and processing the tungsten steel bar to 0.2-0.4 mm;
step 4), processing the semi-finished product with the diameter of 0.2-0.4 mm obtained in the step 3) in a semi-fine grinding station;
step 5), processing the semi-finished product on the semi-fine grinding station of the blade part in the step 4) according to the grinding amount of 0.1mm, and processing the tungsten steel bar to 0.1-0.3 mm;
step 6), processing the semi-finished product with the diameter of 0.1-0.3 mm obtained in the step 5) in a fine grinding station;
step 7), processing the semi-finished product on the fine grinding station in the step 6) according to the grinding amount of 0.02-0.03mm, and processing the tungsten steel bar to 0.07-0.28 mm;
step 8), processing the semi-finished product with the diameter of 0.07-0.28 mm obtained in the step 7) in a cutting body diameter station;
and 9) processing the semi-finished product on the notch body diameter station in the step 8) according to the grinding amount of 0.002mm, and processing the tungsten steel bar to 0.068-0.278 mm.
2. The process method for processing the PCB micro drill according to claim 1, characterized in that: and 5) grinding by using three grinding wheels in the middle-edge part semi-finish grinding station, wherein the grinding of the third grinding wheel is delayed for 1-2.5 seconds.
3. The process method for processing the PCB micro drill according to claim 1, characterized in that: and 7) grinding by using three grinding wheels in the fine grinding station, wherein two grinding wheels are used for grinding.
4. The process method for processing the PCB micro drill according to claim 1, characterized in that: and 9) grinding the two grinding wheels at the incision body diameter station at the speed of 20-25 min/mm.
CN202010475110.9A 2020-05-29 2020-05-29 Process method for processing PCB micro drill Pending CN111604716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010475110.9A CN111604716A (en) 2020-05-29 2020-05-29 Process method for processing PCB micro drill

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010475110.9A CN111604716A (en) 2020-05-29 2020-05-29 Process method for processing PCB micro drill

Publications (1)

Publication Number Publication Date
CN111604716A true CN111604716A (en) 2020-09-01

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114273877A (en) * 2021-12-24 2022-04-05 南阳鼎泰高科有限公司 PCB micro-drill handle processing technique
CN114393454A (en) * 2022-01-25 2022-04-26 厦门厦芝科技工具有限公司 Groove micro-diameter drill bit processing method and groove micro-diameter drill bit

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2949538B1 (en) * 1979-12-10 1981-05-21 Schumag Gmbh, 5100 Aachen Device for centerless grinding of rotationally symmetrical surfaces on workpieces
DE19913163C1 (en) * 1999-03-24 2000-07-27 Thielenhaus Ernst Gmbh & Co Kg Double surface grinding machine has two concentric grinding discs and independent adjustment of discs in axial direction, and includes tool holder with alignment tools for both discs
CN1689739A (en) * 2004-04-21 2005-11-02 尖点科技股份有限公司 Micro-bit for semiconductor IC sheet material with composite material quality
JP2010042480A (en) * 2008-08-14 2010-02-25 Daido Steel Co Ltd Rolled bar surface polishing method
CN103302559A (en) * 2013-06-19 2013-09-18 贵州航天精工制造有限公司 Ultra-long stepped shaft processing method and auxiliary device by using centerless grinding machine
CN103394977A (en) * 2013-08-08 2013-11-20 湖南大学 Centerless grinding device for hard alloy bar
CN108581641A (en) * 2018-04-12 2018-09-28 常熟市创新陶瓷有限公司 A kind of grinding process pumping high-accuracy Ceramic shaft sleeve

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2949538B1 (en) * 1979-12-10 1981-05-21 Schumag Gmbh, 5100 Aachen Device for centerless grinding of rotationally symmetrical surfaces on workpieces
DE19913163C1 (en) * 1999-03-24 2000-07-27 Thielenhaus Ernst Gmbh & Co Kg Double surface grinding machine has two concentric grinding discs and independent adjustment of discs in axial direction, and includes tool holder with alignment tools for both discs
CN1689739A (en) * 2004-04-21 2005-11-02 尖点科技股份有限公司 Micro-bit for semiconductor IC sheet material with composite material quality
JP2010042480A (en) * 2008-08-14 2010-02-25 Daido Steel Co Ltd Rolled bar surface polishing method
CN103302559A (en) * 2013-06-19 2013-09-18 贵州航天精工制造有限公司 Ultra-long stepped shaft processing method and auxiliary device by using centerless grinding machine
CN103394977A (en) * 2013-08-08 2013-11-20 湖南大学 Centerless grinding device for hard alloy bar
CN108581641A (en) * 2018-04-12 2018-09-28 常熟市创新陶瓷有限公司 A kind of grinding process pumping high-accuracy Ceramic shaft sleeve

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
汪迪: "面向PCB精密刀具磨削加工的关键技术研究", 《工程科技Ⅰ辑》 *
韦海英等: "印制电路板硬质合金微钻棒材送料系统的摩擦性能设计", 《机械设计与研究》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114273877A (en) * 2021-12-24 2022-04-05 南阳鼎泰高科有限公司 PCB micro-drill handle processing technique
CN114273877B (en) * 2021-12-24 2023-04-25 南阳鼎泰高科有限公司 PCB micro-drill handle processing technique
CN114393454A (en) * 2022-01-25 2022-04-26 厦门厦芝科技工具有限公司 Groove micro-diameter drill bit processing method and groove micro-diameter drill bit

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Application publication date: 20200901

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