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CN111564465A - 显示面板的制备方法 - Google Patents

显示面板的制备方法 Download PDF

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CN111564465A
CN111564465A CN202010426471.4A CN202010426471A CN111564465A CN 111564465 A CN111564465 A CN 111564465A CN 202010426471 A CN202010426471 A CN 202010426471A CN 111564465 A CN111564465 A CN 111564465A
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陈柏良
林永富
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Century Technology Shenzhen Corp Ltd
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Century Technology Shenzhen Corp Ltd
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Priority to TW109116809A priority patent/TWI754283B/zh
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Priority to US17/026,627 priority patent/US20210366887A1/en
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Abstract

本发明实施例提供一种显示面板的制备方法，其包括：提供多个晶块；提供一驱动基板，所述驱动基板定义有多个接收区域，每一所述接收区域定义有间隔设置的多个导电块，每一所述接收区域用于接收一个所述晶块；将所述多个晶块转移至所述驱动基板上，其中每一所述晶块对应转移至一个所述接收区域上；以及图案化所述多个晶块，其中每一所述晶块图案化后形成彼此间隔的多个发光元件，每一所述发光元件位于一个所述导电块上并电性连接一个所述导电块。

Description

显示面板的制备方法
技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板的制备方法。
背景技术
目前，发光二极管(Light Emitting Diode，LED)等发光元件的尺寸越来越趋向于微小化，这使得将大量微小的发光元件转移到一驱动基板，进而得到一显示面板的技术难度越来越高。
发明内容
本发明实施例提供一种显示面板的制备方法，其包括以下步骤：
提供多个晶块；
提供一驱动基板，所述驱动基板定义有多个接收区域，每一所述接收区域定义有间隔设置的多个导电块，每一所述接收区域用于接收一个所述晶块；
将所述多个晶块转移至所述驱动基板上，其中每一所述晶块对应转移至一个所述接收区域上；以及
图案化所述多个晶块，其中每一所述晶块图案化后形成彼此间隔的多个发光元件，每一所述发光元件位于一个所述导电块上并电性连接一个所述导电块。
该显示面板的制备方法，将晶块转移到驱动基板上后，再对晶块进行图案化以形成多个发光元件。即，晶块与驱动基板上的接收区域的一次对位，可实现于驱动基板上转移多个发光元件。相较于将大量的微小的发光元件与驱动基板上的导电块一一对位并转移的方式，减少了对位次数，简化了制程，可大幅缩短制程时间，提升了巨量转移的良率。
附图说明
图1为本发明一实施例提供的显示面板的制备方法的流程示意图。
图2为本发明一实施例提供的显示面板的制备方法的步骤S1中，提供的多个晶块的俯视图。
图3为图2沿线III-III剖开的剖示图。
图4为本发明一实施例提供的显示面板的制备方法的步骤S2中，提供的驱动基板的俯视图。
图5为图4沿线V-V剖开的剖示图。
图6为本发明一实施例提供的显示面板的制备方法的步骤S3的俯视图。
图7为图6沿线VII-VII剖开的剖示图。
图8为本发明一实施例提供的显示面板的制备方法的步骤S4的剖示图。
图9为本发明一实施例提供的显示面板的剖示图。
图10为本发明另一实施例提供的显示面板的剖示图。
主要元件符号说明
显示面板 100a、100b
基底 10
释放层 20
晶块 30
第一电极层 31
N型掺杂的无机发光材料层 32
活性层 33
P型掺杂的无机发光材料层 34
第二电极层 35
发光元件 40
驱动基板 50
接收区域 50a
基板 51
驱动电路层 52
导电块 53
波长转换块 54
第一波长转换块 541
第二波长转换块 542
第三波长转换块 543
绝缘块 55
黑矩阵 56
盖板 57
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
图1为本发明实施例提供的显示面板的制备方法的流程示意图。如图1所示，该方法包括以下步骤。
S1：提供多个晶块30。
如图2所示，基底10上具有间隔设置的多个晶块30。基底10可以为晶块30的生长衬底，其材质可以为蓝宝石、石英等。
如图3所示，步骤S1包括提供一基底10；于所述基底10上形成释放层20；以及于所述释放层20远离所述基底10的表面上形成间隔设置的多个所述晶块30。所述晶块30包括依次层叠的第一电极层31、P型掺杂的无机发光材料层34、活性层33、N型掺杂的无机发光材料层32以及第二电极层35。
于一实施例中，释放层20可以为粘胶层，其材质为在激光照射、紫外光照射或加热状态下可以分解进而失去粘性的一类胶体。P型掺杂的无机发光材料层34例如为P型氮化镓层，活性层33例如为多量子阱层，N型掺杂的无机发光材料层32例如为N型氮化镓层。
S2：提供一驱动基板50。
如图4所示，所述驱动基板50定义有多个接收区域50a。每一所述接收区域50a用于接收一个所述晶块30。如图5所示，每一所述接收区域50a定义有间隔设置的多个导电块53。
于一实施例中，驱动基板50为薄膜晶体管基板51，其包括基板51位于基板51上的驱动电路层52(如，薄膜晶体管阵列层)以及位于驱动电路层52远离所述基板51的一侧的多个间隔设置的导电块53。导电块53电性连接驱动电路层52。
于一实施例中，基板51可以为玻璃、石英、硅片等硬质材料。于其他实施例中，基板51也可以为聚酰亚胺(polyimide，PI)或聚对苯二甲酸(Poly Ethylene Terephthalate,PET)等柔性材料。
S3：将所述多个晶块30转移至所述驱动基板50上。
于一实施例中，利用激光照射、紫外光照射或加热等方式处理所述释放层20，使每一所述晶块30对应转移至一个所述接收区域50a上。
如图6所示，步骤S3中，每一次转移一个晶块30于驱动基板50的一个接收区域50a上。
于一实施例中，驱动基板50上的接收区域50a的位置排布及尺寸大小与基底10上的晶块30的位置排布及尺寸大小相适应。步骤S3中，可以一次同时转移多个晶块30于驱动基板50上。
如图7所示，每一晶块30转移至对应的接收区域50a上后，第一电极层31覆盖一个所述接收区域50a内所有的所述导电块53。相邻的导电块53之间具有间隙。
S4：图案化所述多个晶块30。
如图8所示，所述第一电极层31、所述P型掺杂的无机发光材料层34、所述活性层33、所述N型掺杂的无机发光材料层32以及所述第二电极层35均被图案化。每一所述晶块30图案化后形成彼此间隔的多个发光元件40。每一发光元件40包括图案化后的所述第一电极层31、所述P型掺杂的无机发光材料层34、所述活性层33、所述N型掺杂的无机发光材料层32以及所述第二电极层35。并且，每一所述发光元件40位于一个所述导电块53上并通过第一电极层31电性连接一个所述导电块53。即，每一所述发光元件40通过导电块53电性连接驱动电路层52。
于一实施例中，发光元件40可为传统的LED、miniLED或者microLED。其中，microLED又称微型发光二极管，意指晶粒尺寸小于100微米的LED。miniLED又称次毫米发光二极管，其尺寸介于传统的LED和microLED之间，一般意指晶粒尺寸大致在100到200微米的LED。
于一实施例中，如图9所示，步骤S4后还包括于相邻的所述发光元件40之间形成绝缘块55，以及于所述发光元件40远离所述驱动基板50的一侧形成盖板57，进而得到显示面板100a。相邻的发光元件40之间通过绝缘块55得以绝缘间隔。所述盖板57用于保护驱动电路层52及发光元件40等，使其避免受潮。
于一实施例中，由同一个所述晶块30图案化后得到的所述发光元件40发同一种颜色光。部分所述晶块30图案化后得到的所述发光元件40发同一种颜色光，部分所述晶块30图案化后得到的所述发光元件40发不同种颜色光。例如，部分晶块30图案化后得到的发光元件40发蓝光，部分晶块30图案化后得到的发光元件40发红光，部分晶块30图案化后得到的发光元件40发绿光等。如此，得到的显示面板100a为彩色的显示面板。
于另一实施例中，所有的所述晶块30图案化后得到的所述发光元件40发同一种颜色光。例如，所有的所述晶块30图案化后得到的所述发光元件40均为发红光的发光元件40，或均为发绿光的发光元件40，或均为发蓝光的发光元件40等。如此，得到的显示面板100a为单色的显示面板。
于再一实施例中，所有的所述晶块30图案化后得到的所述发光元件40发同一种颜色光(如，蓝光)。驱动基板50定义有多个子像素(图未示)，如红色像素R、绿色像素G和蓝色像素B。如图10所示，步骤S4中，于相邻的所述发光元件40之间形成绝缘块55后还包括于每一所述发光元件40远离所述导电块53的一侧形成波长转换块54，于每相邻的两个所述波长转换块54之间形成黑矩阵56以及于所述发光元件40远离所述驱动基板50的一侧形成盖板57，进而得到显示面板100b。其中，相邻的发光元件40之间通过绝缘块55得以绝缘间隔。所述盖板57用于保护驱动电路层52及发光元件40等，使其避免受潮。
于一实施例中，所述波长转换块54的材质为量子点材料。例如，发光元件40为蓝光二极管。波长转换块54包括分别为红色量子点材料、绿色量子点材料及蓝色量子点材料的第一波长转换块541、第二波长转换块542及第三波长转换块543。如此，发光元件40发出的蓝光经过波长转换，实现显示面板100b的彩色显示。
于另一实施例中，波长转换块54的材质为光阻材料。例如，发光元件40为蓝光二极管。波长转换块54包括分别为红色光阻、绿色光阻及蓝色光阻的第一波长转换块541、第二波长转换块542及第三波长转换块543。如此，发光元件40发出的蓝光经过波长转换，实现显示面板100b的彩色显示。
上述的显示面板的制备方法，将晶块30转移到驱动基板50上后，再对晶块30进行图案化以形成多个发光元件40。即，晶块30与驱动基板50上的接收区域50a的一次对位，可实现驱动基板50上转移多个发光元件40。相较于将大量的微小的发光元件40与驱动基板50上的导电块53一一对位并转移的方式，减少了对位次数，简化了制程，可大幅缩短制程时间。另，由于减少了对位次数，进而提升了巨量转移的良率。
以上实施方式仅用以说明本发明的技术方案而非限制，尽管参照较佳实施方式对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换，而不脱离本发明技术方案的精神和范围。

Claims (10)

1.一种显示面板的制备方法，其特征在于，包括以下步骤：
提供多个晶块；
提供一驱动基板，所述驱动基板定义有多个接收区域，每一所述接收区域定义有间隔设置的多个导电块，每一所述接收区域用于接收一个所述晶块；
将所述多个晶块转移至所述驱动基板上，其中每一所述晶块对应转移至一个所述接收区域上；以及
图案化所述多个晶块，其中每一所述晶块图案化后形成彼此间隔的多个发光元件，每一所述发光元件位于一个所述导电块上并电性连接一个所述导电块。
2.如权利要求1所述的显示面板的制备方法，其特征在于，所述“提供多个晶块”的步骤包括：
提供一基底；
于所述基底上形成释放层；以及
于所述释放层远离所述基底的表面上形成间隔设置的多个所述晶块，每一所述晶块包括依次层叠的第一电极层、P型掺杂的无机发光材料层、活性层、N型掺杂的无机发光材料层以及第二电极层。
3.如权利要求2所述的显示面板的制备方法，其特征在于，还包括处理所述释放层，使每一所述晶块脱离所述基底并转移至所述驱动基板上。
4.如权利要求2所述的显示面板的制备方法，其特征在于，所述“将所述多个晶块转移至所述驱动基板上”的步骤中，每一所述晶块的所述第一电极层覆盖一个所述接收区域内所有的所述导电块。
5.如权利要求4所述的显示面板的制备方法，其特征在于，所述“图案化所述晶块”的步骤中，所述第一电极层、所述P型掺杂的无机发光材料层、所述活性层、所述N型掺杂的无机发光材料层以及所述第二电极层均被图案化。
6.如权利要求1所述的显示面板的制备方法，其特征在于，由同一个所述晶块图案化后得到的所述发光元件发同一种颜色光；
部分所述晶块图案化后得到的所述发光元件发同一种颜色光，部分所述晶块图案化后得到的所述发光元件发不同种颜色光。
7.如权利要求1所述的显示面板的制备方法，其特征在于，所有的所述晶块图案化后得到的所述发光元件发同一种颜色光。
8.如权利要求7所述的显示面板的制备方法，其特征在于，还包括于每一所述发光元件远离所述导电块的一侧形成波长转换块。
9.如权利要求8所述的显示面板的制备方法，其特征在于，还包括于每相邻的两个所述波长转换块之间形成黑矩阵。
10.如权利要求9所述的显示面板的制备方法，其特征在于，所述波长转换块的材质为量子点材料或光阻材料。
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