CN111522156B - Method and device for detecting substrate defects - Google Patents
Method and device for detecting substrate defects Download PDFInfo
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- CN111522156B CN111522156B CN202010321122.6A CN202010321122A CN111522156B CN 111522156 B CN111522156 B CN 111522156B CN 202010321122 A CN202010321122 A CN 202010321122A CN 111522156 B CN111522156 B CN 111522156B
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- 238000000034 method Methods 0.000 title claims abstract description 352
- 230000007547 defect Effects 0.000 title claims abstract description 180
- 230000008439 repair process Effects 0.000 claims abstract description 95
- 238000001514 detection method Methods 0.000 abstract description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 9
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
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Abstract
The embodiment of the invention discloses a method and a device for detecting substrate defects, wherein after a first substrate process, defects of a substrate in the first substrate process are identified, a first process defect file is generated, and the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process; acquiring first standard parameter information of a preset first substrate process; comparing the first parameter information with the first standard parameter information to determine whether the substrate subjected to the first substrate working procedure needs to be repaired or not; if yes, a first repair instruction is sent to the substrate repair equipment, so that the substrate repair equipment repairs defects of a first substrate process in the substrate according to the first process defect file, and an information field for distinguishing the substrate process is added into software of the substrate defect detection device, so that unnecessary repeated repair of the process meeting the condition is avoided, and repair productivity is saved.
Description
Technical Field
The invention relates to the technical field of production of display panels, in particular to a method and a device for detecting defects of a substrate.
Background
Liquid crystal display panels have been rapidly developed and widely used in recent years. Most of the liquid crystal display devices in the market are backlight type liquid crystal display devices, which include a liquid crystal display panel and a backlight module (backlight module). The Liquid Crystal display panel generally comprises a Color Filter substrate (CF), a thin film transistor substrate (TFT, thin Film Transistor), and a Liquid Crystal (LC) sandwiched between the Color Filter substrate and the thin film transistor substrate, and a Sealant (Sealant); the working principle is that the rotation of liquid crystal molecules of a liquid crystal layer is controlled by applying driving voltage on two glass substrates, and light rays of a backlight module are refracted out to generate pictures.
The color film substrate or the array substrate of the liquid crystal display panel is produced by a plurality of working procedures, and in the production process, the color film substrate or the array substrate plays a role of detecting the manufacturing process defects through an AOI (automatic optical inspection) device, and then the bad defects are repaired by a repairing device.
The existing substrate detection technology can not identify the process name or the substrate process name, but only can judge that all defects of the substrate process are repaired or all defects of the substrate process are not repaired, and any substrate process can not be repaired independently and custom. And (3) after the quality defects of the front substrate process are repaired, marks are left, the marks are considered as quality defects in the rear substrate process to enter a repairing link again, and the repairing capacity of the rear process is wasted.
Disclosure of Invention
The embodiment of the invention provides a method and a device for detecting defects of a substrate, which aim to solve the problem of waste of productivity caused by repeated repair of Cheng Zhonggong-sequence defects of the substrate.
In order to solve the above-mentioned problems, in a first aspect, the present application provides a method for detecting a substrate defect, including:
after a first substrate process, identifying a defect of the substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process;
acquiring first standard parameter information of a preset first substrate process;
comparing the first parameter information with the first standard parameter information to determine whether the substrate subjected to the first substrate working procedure needs to be repaired or not;
if yes, a first repair instruction is sent to the substrate repair equipment, so that the substrate repair equipment repairs defects existing in a first substrate process in the substrate according to the first process defect file.
Further, after the second substrate process, identifying a defect of the substrate in the second substrate process, and generating a second process defect file on the basis of the first process record file, wherein the second process defect file comprises an information field of the second substrate process and parameter information of the second substrate process;
Comparing the second parameter information with the second standard parameter information to determine whether the substrate subjected to the second substrate working procedure needs to be repaired or not;
if yes, sending a second repairing instruction to the substrate repairing equipment so that the substrate repairing equipment repairs defects existing in a second substrate process in the substrate according to the second process defect file
Further, the first parameter information includes first point position information of each pixel of the substrate, the first standard parameter information includes first standard point position information of each pixel of the substrate, comparing the first parameter information with the first standard parameter information, and determining whether the substrate after the first substrate process needs to be repaired includes:
respectively comparing the first point position information of each pixel with the first standard point position information to respectively determine whether the first standard point position information corresponding to the first point position information of each pixel is matched or not;
if the number of pixels, in which the first point position information and the corresponding first standard point position information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
Further, the first point position information of each pixel includes a first pixel coordinate of each pixel, and the first standard point position information of each pixel includes a first standard pixel coordinate of each pixel;
The first point position information of each pixel further comprises first form information corresponding to the first pixel coordinates of each pixel, and the first standard point position information of each pixel further comprises first standard form information corresponding to the first standard pixel coordinates of each pixel;
the comparing the first point position information of each pixel with the first standard point position information to determine whether the first standard point position information corresponding to the first point position information of each pixel is matched, includes:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point position information of the target pixel is matched with the first standard point position information.
Further, the method further comprises:
after the fact that the substrate after the first substrate process does not need to be repaired is determined, if a third repairing instruction for repairing the substrate after the first substrate process is obtained;
And sending a third repair instruction to the substrate repair equipment so that the substrate repair equipment repairs the defects existing in the first substrate process in the substrate according to the first process defect file.
In a second aspect, the present application provides a device for detecting a substrate defect, including:
a first identifying unit, configured to identify a defect of a substrate in a first substrate process after the first substrate process, and generate a first process defect file, where the first process defect file includes an information field of the first substrate process and first parameter information of the first substrate process;
a first obtaining unit, configured to obtain first standard parameter information of the preset first substrate process;
the first comparison unit is used for comparing the first parameter information with the first standard parameter information and determining whether the substrate subjected to the first substrate procedure needs to be repaired or not;
and the first sending unit is used for sending a first repairing instruction to the substrate repairing equipment if the substrate subjected to the first substrate working procedure needs to be repaired, so that the substrate repairing equipment repairs the defects of the first substrate working procedure in the substrate according to the first working procedure defect file.
Further, on the basis of the above detection device, the device further includes:
A second identifying unit, configured to identify a defect of the substrate in the second substrate process after the second substrate process, and generate a second process defect file based on the first process record file, where the second process defect file includes an information field of the second substrate process and parameter information of the second substrate process;
a second obtaining unit, configured to obtain second standard parameter information of the second substrate process;
the second comparison unit is used for comparing the second parameter information with the second standard parameter information and determining whether the substrate subjected to the second substrate procedure needs to be repaired or not;
and the second sending unit is used for sending a second repairing instruction to the substrate repairing equipment if the substrate subjected to the second substrate working procedure needs to be repaired, so that the substrate repairing equipment can repair the defects of the second substrate working procedure in the substrate according to the second working procedure defect file.
Further, the first parameter information includes first dot position information of each pixel of the substrate, the first standard parameter information includes first standard dot position information of each pixel of the substrate, and the first comparing unit is specifically configured to:
respectively comparing the first point position information of each pixel with the first standard point position information to respectively determine whether the first standard point position information corresponding to the first point position information of each pixel is matched or not;
If the number of pixels, in which the first point position information and the corresponding first standard point position information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
Further, the first point position information of each pixel includes a first pixel coordinate of each pixel, and the first standard point position information of each pixel includes a first standard pixel coordinate of each pixel;
the first point position information of each pixel further comprises first form information corresponding to the first pixel coordinates of each pixel, and the first standard point position information of each pixel further comprises first standard form information corresponding to the first standard pixel coordinates of each pixel;
the first comparison unit is specifically configured to:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point position information of the target pixel is matched with the first standard point position information.
Further, the device further comprises:
A third obtaining unit, configured to obtain a third repair instruction for repairing the substrate after the first substrate process if the user performs repair on the substrate after the first substrate process after determining that the substrate after the first substrate process does not need repair;
and the third sending unit is used for sending a third repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair defects of the first substrate process in the substrate according to the first process defect file.
The embodiment of the invention provides a method for detecting substrate defects, which is characterized in that after a first substrate process, defects of a substrate in the first substrate process are identified, a first process defect file is generated, and the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process; acquiring first standard parameter information of a preset first substrate process; comparing the first parameter information with the first standard parameter information to determine whether the substrate subjected to the first substrate working procedure needs to be repaired or not; if yes, a first repair instruction is sent to the substrate repair equipment, so that the substrate repair equipment repairs defects existing in a first substrate process in the substrate according to the first process defect file. According to the embodiment of the invention, on the basis that the original historical process cannot be identified, or the historical process can be identified, but only the whole process is repaired or not repaired, the information field for distinguishing the substrate process is added into the process defect file of the substrate, so that the information field of the substrate process can distinguish the defect file in each step of process, each step of process is further identified and distinguished, and any one or more processes can be repaired or not repaired in a self-defined mode based on the information field in the repairing process, unnecessary repeated repairing of the process meeting the condition is avoided, and the repairing capacity is saved.
The embodiment of the invention provides a substrate defect detection device, which comprises a first identification unit, a first acquisition unit, a first comparison unit and a first sending unit, wherein a first procedure defect file in the first identification unit comprises an information field of a first substrate procedure and first parameter information of the first substrate procedure, the first parameter information of the first substrate procedure is used for comparing with first standard parameter information to judge whether a substrate after the first substrate procedure needs to be repaired, and the information field of the first substrate procedure is used for distinguishing the substrate procedures, so that the substrate defect detection device provided by the embodiment can identify and distinguish each procedure and help repair equipment to self-define any procedure or multiple procedures. Unnecessary repeated repair of the working procedures meeting the conditions is avoided, so that the repair productivity is saved.
Drawings
Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a method for detecting defects of a substrate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a manufacturing process of a COA according to an embodiment of the present invention;
Fig. 3 is a schematic diagram of a manufacturing process of a POA according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The existing AOI detection technology can not identify the name of a substrate process or identify the name of the substrate process, but only judge that all defects of the substrate process are repaired or not repaired, and can not independently repair any substrate process in a self-defined way. And (3) after the quality defects of the front substrate process are repaired, marks are left, the marks are considered as quality defects in the rear substrate process to enter a repairing link again, and the repairing capacity of the rear substrate process is wasted.
Based on this, the embodiment of the invention provides a method and a device for detecting defects of a substrate, which aim to solve the problem of productivity waste caused by repeated repair of defects of Cheng Zhonggong sequence of the substrate, and are respectively described in detail below.
First, in an embodiment of the present invention, referring to fig. 1, fig. 1 is a schematic diagram of a method for repairing a substrate defect. Comprising the following steps:
s10, after a first substrate process, identifying defects of the substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process; the color film substrate or the array substrate of the liquid crystal display panel is produced by a plurality of processes, such as a BM process, an ITO process, a PS process and the like of the color film substrate, wherein the first substrate process can be the BM process, the ITO process and the PS process;
In this embodiment, the substrate may be a color film substrate or an array substrate, and the first substrate process may be any process of the color film substrate or the array substrate in the manufacturing process.
Specifically, the information field of the substrate process may be represented by BM, ITO, or PS, or may be represented by other names or marks that distinguish the substrate process, for example, marks 1, 2, and 3, which may represent BM process, ITO process, PS process, and the like, respectively.
Specifically, the first parameter information of the first substrate process may be a point location, a gray scale value, or other parameters that can represent defect information of the substrate.
S20, acquiring first standard parameter information of a preset first substrate process; specifically, the first standard parameter information is a series of parameters which correspond to the first parameter information and are used for judging whether the substrate is defective or not;
s30, comparing the first parameter information with the first standard parameter information to determine whether the substrate subjected to the first substrate procedure needs to be repaired or not;
and S40, if yes, sending a first repair instruction to the substrate repair equipment so that the substrate repair equipment repairs defects existing in a first substrate process in the substrate according to the first process defect file.
Specifically, the substrate repairing apparatus is a laser repairing apparatus.
The embodiment of the invention provides a method for detecting substrate defects, which is characterized in that after a first substrate process, defects of a substrate in the first substrate process are identified, a first process defect file is generated, and the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process; acquiring first standard parameter information of a preset first substrate process; comparing the first parameter information with the first standard parameter information to determine whether the substrate subjected to the first substrate working procedure needs to be repaired or not; if yes, a first repair instruction is sent to the substrate repair equipment, so that the substrate repair equipment repairs defects existing in a first substrate process in the substrate according to the first process defect file. According to the embodiment of the invention, on the basis that the original historical process cannot be identified, or the historical process can be identified, but only the whole process is repaired or not repaired, the information field for distinguishing the substrate process is added into the process defect file of the substrate, so that the information field of the substrate process can distinguish the defect file in each step of process, each step of process is further identified and distinguished, and any one or more processes can be repaired or not repaired in a self-defined mode based on the information field in the repairing process, unnecessary repeated repairing of the process meeting the condition is avoided, and the repairing capacity is saved.
Based on the foregoing embodiment, in another specific embodiment of the present application, the method for detecting a substrate defect further includes:
s50, after the second substrate process, identifying defects of the substrate in the second substrate process, and generating a second process defect file on the basis of the first process record file, wherein the second process defect file comprises information fields of the second substrate process and parameter information of the second substrate process;
specifically, the second substrate process is a process subsequent to the first substrate process, for example, in the COA substrate, when the first substrate process is a BM process, the second substrate process is an ITO process, and when the first substrate process is an ITO process, the second substrate process is a PS process.
S60, comparing the second parameter information with the second standard parameter information to determine whether the substrate subjected to the second substrate procedure needs to be repaired or not;
and S70, if yes, sending a second repairing instruction to the substrate repairing equipment so that the substrate repairing equipment repairs defects existing in a second substrate process in the substrate according to the second process defect file.
In another embodiment of the present application, the first parameter information includes first dot position information of each pixel of the substrate, specifically, the first dot position information may be represented by a dot position, a form corresponding to the dot position, and a gray scale value, the first standard parameter information includes first standard dot position information of each pixel of the substrate, and comparing the first parameter information with the first standard parameter information to determine whether the substrate after the first substrate process needs to be repaired includes:
Respectively comparing the first point position information of each pixel with the first standard point position information to respectively determine whether the first standard point position information corresponding to the first point position information of each pixel is matched or not;
if the number of pixels, in which the first point position information and the corresponding first standard point position information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired. In another specific embodiment, the first point location information of each pixel includes a first pixel coordinate of each pixel, and the first standard point location information of each pixel includes a first standard pixel coordinate of each pixel;
the first point position information of each pixel further comprises first form information corresponding to the first pixel coordinates of each pixel, and the first standard point position information of each pixel further comprises first standard form information corresponding to the first standard pixel coordinates of each pixel;
specifically, the first morphology information may include RB (reflective black), RW (reflective white), or TW (transmissive white).
The comparing the first point position information of each pixel with the first standard point position information to determine whether the first standard point position information corresponding to the first point position information of each pixel is matched, includes:
Respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point position information of the target pixel is matched with the first standard point position information.
Specifically, when the first dot position information of the target pixel in each pixel is matched with the corresponding first standard dot position information, determining the coordinates of the target pixel, acquiring the form information of the pixel at the coordinates of the target pixel, namely the first form information of the target pixel, then comparing with the first standard form information at the coordinates of the target pixel, judging whether the first dot position information of the target pixel is matched with the corresponding first standard form information, when the first form information of the target pixel is matched with the corresponding first standard form information, for example, when the first form information of the target pixel is different from the corresponding first standard form information, the first form information of the target pixel is RB (reflective black), and when the first form information of the target pixel is RW (reflective white), the first form information of the target pixel is not matched with the corresponding first standard form information, namely the first dot position information of the target pixel is not matched with the corresponding first standard form information.
Further, when the first morphological information of the target pixel and the corresponding first standard morphological information do not match,
the first point position information of each pixel further comprises a first gray scale value corresponding to a first pixel coordinate of each pixel, and the first standard point position information of each pixel further comprises a first standard gray scale value corresponding to a first standard pixel coordinate of each pixel;
the comparing the first point position information of each pixel with the first standard point position information to determine whether the first standard point position information corresponding to the first point position information of each pixel is matched, and the method further includes:
when the first form information of the target pixel in each pixel is not matched with the corresponding first standard form information, respectively comparing the first gray scale value with the first standard gray scale value to respectively determine whether the first gray scale value of each pixel in each pixel is matched with the corresponding first standard gray scale value;
and when the first gray scale value of the target pixel in each pixel is matched with the corresponding first standard gray scale value, determining that the first point position information of the target pixel is matched with the first standard point position information.
The repairing equipment can repair the defects, and can be controlled by a program or customized by a user.
In another embodiment of the present application, the method further comprises:
after the fact that the substrate after the first substrate process does not need to be repaired is determined, if a third repairing instruction for repairing the substrate after the first substrate process is obtained;
and sending a third repair instruction to the substrate repair equipment so that the substrate repair equipment repairs the defects existing in the first substrate process in the substrate according to the first process defect file.
Specifically, the inspection device that recognizes the defect of the substrate in the substrate process is AOI.
The repair device repairs the defect, and one or more defects can be repaired at the same time.
In another embodiment of the present application, the patching instruction includes:
the number of repair items may be zero, one or more than one.
The substrate repairing device can repair defects, which can be generated in the current process or in the historical process.
Specifically, the defect in the second substrate step may be an unrepaired defect generated in the first substrate step or a defect generated in the second substrate step
In the embodiment of the present invention, referring to fig. 2, the COA substrate is divided into an upper substrate and a lower substrate, and fig. 2 shows a manufacturing process of the upper substrate and the lower substrate of the COA, where the repair method of the upper substrate includes:
After a process of manufacturing a BM (Black Matrix) on a substrate, identifying a defect of the substrate in the BM process by using AOI, and comparing the generated information with preset standard parameter information, wherein the generated defect file is named as BM, the BM defect file includes an information field of the process and corresponding parameter information, in this embodiment, the content of the information field of the process is denoted by BM, and the parameter information corresponding to the BM process includes: point location, morphology, defect determination, and pre-process determination module. If the defect is judged to be positive, a corresponding BM repairing instruction is sent to substrate repairing equipment, so that the substrate repairing equipment repairs the defect existing in a BM process in the substrate according to the BM defect file;
specifically, the dots are represented by X-axis and Y-axis, and the forms include RB (reflective black), RW (reflective white), TW (transmissive white), and the corresponding gray scale values.
The gray scale value refers to the depth of the color at the midpoint of the black-and-white image, and ranges from 0 to 255, wherein black is 0, white is 255, and the darker the color, the smaller the gray scale value.
Specifically, in the steps of the above embodiments, the generated information is compared with the preset standard parameter information, and the comparison content is the form information of the pixel point location and the corresponding gray scale value.
Specifically, the pre-process determination information module is configured to determine whether a process belongs to a current process or a history process, and in this embodiment, BM is the current process.
After an ITO (Indium Tin Oxide) layer process is manufactured on a substrate, defects of the substrate in the ITO process are identified by utilizing an AOI, generated information is compared with preset standard parameter information, a defect file generated on the basis of a BM defect file is named as ITO, the ITO defect file comprises an information field of the ITO process and corresponding parameter information, and specifically, the content of the information field of the process is represented by BM and ITO. If the defect judgment information is yes, a corresponding repair instruction is sent to substrate repair equipment, so that the substrate repair equipment repairs the defects of BM or ITO in the ITO working procedure in the substrate according to the ITO defect file;
after a PS (Post Spacer) process is performed on a substrate, defects of the substrate in the PS process are identified by utilizing an AOI, generated information is compared with preset standard parameter information, a defect file generated on the basis of the PS defect file is named as PS, the PS defect file comprises an information field of the PS process and corresponding parameter information, and specifically, the content of the information field of the process is represented by BM, ITO and PS. And if the defect judgment information corresponding to the content of the information field of the procedure is yes, sending a corresponding repair instruction to the substrate repair equipment so that the substrate repair equipment repairs the defects of BM, ITO or PS in the PS procedure in the substrate according to the PS defect file.
The detection method of the lower substrate of the COA substrate comprises the following steps:
after the substrate is manufactured into an Array and R, G, B (red, green and blue) layers, defects of the substrate in the R, G, B process are identified by utilizing AOI, the generated information is compared with preset standard parameter information, a defect file generated on the basis of the defect file is named R, G, B, a defect file R, G, B comprises information fields of the R, G, B process and corresponding parameter information, and the content of the information fields of the process is specifically denoted by Array, R, G, B. If the defect determination information corresponding to the content of the information field of the procedure is yes, a corresponding repair instruction is sent to the substrate repair equipment, so that the substrate repair equipment repairs the defect of Array, R, G, B in the R, G, B procedure in the substrate according to the R, G, B defect file.
It should be noted that, the above method for detecting a substrate defect only describes repairing a COA substrate, and it is understood that in addition to the COA substrate, other substrates, such as POA (PS on Array) or HVA (High Vertical Alignment ) substrates, may be repaired, and the manufacturing process of the upper substrate and the lower substrate of the POA shown in fig. 3 and fig. 3 is not limited herein.
The substrate detection method provided by the embodiment of the invention has multiple purposes, can be used for a multi-working-procedure quality monitoring and repairing system, has repaired defects in the pre-filtering working procedure, or can be used for any defect monitoring and repairing procedure in the liquid crystal panel quality monitoring industry.
The embodiment of the invention also provides a substrate defect detection device, which is positioned in the AOI, and comprises:
a first identifying unit, configured to identify a defect of a substrate in a first substrate process after the first substrate process, and generate a first process defect file, where the first process defect file includes an information field of the first substrate process and first parameter information of the first substrate process;
a first obtaining unit, configured to obtain first standard parameter information of the preset first substrate process;
the first comparison unit is used for comparing the first parameter information with the first standard parameter information and determining whether the substrate subjected to the first substrate procedure needs to be repaired or not;
and the first sending unit is used for sending a first repairing instruction to the substrate repairing equipment if the substrate subjected to the first substrate working procedure needs to be repaired, so that the substrate repairing equipment repairs the defects of the first substrate working procedure in the substrate according to the first working procedure defect file.
On the basis of the above embodiment, in another specific embodiment of the present application, the apparatus further includes:
a second identifying unit, configured to identify a defect of the substrate in the second substrate process after the second substrate process, and generate a second process defect file based on the first process record file, where the second process defect file includes an information field of the second substrate process and parameter information of the second substrate process;
a second obtaining unit, configured to obtain second standard parameter information of the second substrate process;
the second comparison unit is used for comparing the second parameter information with the second standard parameter information and determining whether the substrate subjected to the second substrate procedure needs to be repaired or not;
and the second sending unit is used for sending a second repairing instruction to the substrate repairing equipment if the substrate subjected to the second substrate working procedure needs to be repaired, so that the substrate repairing equipment can repair the defects of the second substrate working procedure in the substrate according to the second working procedure defect file.
In another specific embodiment of the present application, the first parameter information includes first dot position information of each pixel of the substrate, the first standard parameter information includes first standard dot position information of each pixel of the substrate, and the first comparing unit is specifically configured to:
Respectively comparing the first point position information of each pixel with the first standard point position information to respectively determine whether the first standard point position information corresponding to the first point position information of each pixel is matched or not;
if the number of pixels, in which the first point position information and the corresponding first standard point position information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
On the basis of the above embodiment, in another specific embodiment of the present application, the first point location information of each pixel includes a first pixel coordinate of each pixel, and the first standard point location information of each pixel includes a first standard pixel coordinate of each pixel;
the first point position information of each pixel further comprises first form information corresponding to the first pixel coordinates of each pixel, and the first standard point position information of each pixel further comprises first standard form information corresponding to the first standard pixel coordinates of each pixel;
the first comparison unit is specifically configured to:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
In another specific embodiment of the present application, when the first morphological information of the target pixel in each pixel matches with the corresponding first standard morphological information, it is determined that the first dot location information of the target pixel matches with the first standard dot location information.
The apparatus further comprises:
a third acquisition unit: after determining that the substrate after the first substrate process does not need to be repaired, if a third repairing instruction for repairing the substrate after the first substrate process is acquired by a user;
a third transmitting unit: and sending a third repair instruction to the substrate repair equipment so that the substrate repair equipment repairs the defects existing in the first substrate process in the substrate according to the first process defect file.
It should be noted that, in the above embodiment of the substrate defect detecting device, only the above structure is described, and it should be understood that, in addition to the above structure, the substrate defect detecting device according to the embodiment of the present invention may include any other necessary structure as needed, and is not limited herein.
The embodiment of the invention provides a substrate defect detection device, which comprises a first identification unit, a first acquisition unit, a first comparison unit and a first sending unit, wherein a first procedure defect file in the first identification unit comprises an information field of a first substrate procedure and first parameter information of the first substrate procedure, the first parameter information of the first substrate procedure is used for comparing with first standard parameter information to judge whether a substrate after the first substrate procedure needs to be repaired, and the information field of the first substrate procedure is used for distinguishing the substrate procedures, so that the substrate defect detection device provided by the embodiment can identify and distinguish each procedure and help repair equipment to self-define any procedure or multiple procedures. Unnecessary repeated repair of the working procedures meeting the conditions is avoided, so that the repair productivity is saved.
The embodiment of the invention also provides an automatic optical detection device, which integrates any one of the substrate defect detection devices provided by the embodiment of the invention, and the automatic optical detection device comprises:
one or more processors;
a memory; and
one or more applications, wherein the one or more applications are stored in the memory and configured to be executed by the processor in the substrate defect detection method described in any of the embodiments above.
Those of ordinary skill in the art will appreciate that all or a portion of the steps of the various methods of the above embodiments may be performed by instructions, or by instructions controlling associated hardware, which may be stored in a computer-readable storage medium and loaded and executed by a processor.
To this end, an embodiment of the present invention provides a computer-readable storage medium, which may include: read Only Memory (ROM), random access Memory (RAM, random Access Memory), magnetic or optical disk, and the like. On which a computer program is stored, which is loaded by a processor to perform the steps of any of the substrate defect detection methods provided by the embodiments of the present invention.
In the foregoing embodiments, the descriptions of the embodiments are focused on, and the portions of one embodiment that are not described in detail in the foregoing embodiments may be referred to in the foregoing detailed description of other embodiments, which are not described herein again.
In the implementation, each unit or structure may be implemented as an independent entity, or may be implemented as the same entity or several entities in any combination, and the implementation of each unit or structure may be referred to the foregoing method embodiments and will not be repeated herein.
The specific implementation of each operation above may be referred to the previous embodiments, and will not be described herein.
The foregoing describes in detail a method and apparatus for detecting defects in a substrate according to embodiments of the present invention, and specific examples are applied to illustrate principles and embodiments of the present invention, where the foregoing examples are only for helping to understand the method and core ideas of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present invention, the present description should not be construed as limiting the present invention.
Claims (10)
1. A method for detecting a substrate defect, the method comprising:
After a first substrate process, identifying defects of a substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process, the information field of the process is used for distinguishing the defect file in each substrate process, and identifying and distinguishing each substrate process so as to repair or not repair any one or more processes in a repair process in a self-defined mode based on the information field;
acquiring first standard parameter information of a preset first substrate process;
comparing the first parameter information with the first standard parameter information to determine whether the substrate subjected to the first substrate working procedure needs to be repaired or not;
if yes, a first repair instruction is sent to the substrate repair equipment, so that the substrate repair equipment repairs defects existing in a first substrate process in the substrate according to the first process defect file.
2. The method for detecting a substrate defect according to claim 1, further comprising:
after the second substrate process, identifying a defect of the substrate in the second substrate process, and generating a second process defect file on the basis of the first process defect file, wherein the second process defect file comprises an information field of the second substrate process and second parameter information of the second substrate process;
Acquiring second standard parameter information of the preset second substrate process;
comparing the second parameter information with the second standard parameter information to determine whether the substrate subjected to the second substrate working procedure needs to be repaired or not;
if yes, a second repair instruction is sent to the substrate repair equipment, so that the substrate repair equipment repairs defects existing in a second substrate process in the substrate according to the second process defect file.
3. The method according to claim 1, wherein the first parameter information includes first dot information of each pixel of the substrate, the first standard parameter information includes first standard dot information of each pixel of the substrate, and the comparing the first parameter information with the first standard parameter information determines whether the substrate after the first substrate process needs to be repaired, and the method comprises:
respectively comparing the first point position information of each pixel with the first standard point position information to respectively determine whether the first standard point position information corresponding to the first point position information of each pixel is matched or not;
if the number of pixels, in which the first point position information and the corresponding first standard point position information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
4. The method according to claim 3, wherein the first dot position information of each pixel includes a first pixel coordinate of each pixel, and the first standard dot position information of each pixel includes a first standard pixel coordinate of each pixel;
the first point position information of each pixel further comprises first form information corresponding to the first pixel coordinates of each pixel, and the first standard point position information of each pixel further comprises first standard form information corresponding to the first standard pixel coordinates of each pixel;
the comparing the first point position information of each pixel with the first standard point position information to determine whether the first standard point position information corresponding to the first point position information of each pixel is matched, includes:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point position information of the target pixel is matched with the first standard point position information.
5. The method for detecting a substrate defect according to claim 1, further comprising:
after the fact that the substrate after the first substrate process does not need to be repaired is determined, if a third repairing instruction for repairing the substrate after the first substrate process is obtained;
and sending a third repair instruction to the substrate repair equipment so that the substrate repair equipment repairs the defects existing in the first substrate process in the substrate according to the first process defect file.
6. A device for detecting defects in a substrate, the device comprising:
the first identifying unit is used for identifying defects of the substrate in the first substrate process after the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process, the information field is used for distinguishing the defect file in each step of process, and identifying and distinguishing each step of process so as to repair or not repair any one or more steps in the repairing process in a self-defined mode based on the information field;
a first obtaining unit, configured to obtain first standard parameter information of the preset first substrate process;
The first comparison unit is used for comparing the first parameter information with the first standard parameter information and determining whether the substrate subjected to the first substrate procedure needs to be repaired or not;
and the first sending unit is used for sending a first repairing instruction to the substrate repairing equipment if the substrate subjected to the first substrate working procedure needs to be repaired, so that the substrate repairing equipment repairs the defects of the first substrate working procedure in the substrate according to the first working procedure defect file.
7. The apparatus for detecting a substrate defect according to claim 6, further comprising:
a second identifying unit, configured to identify a defect of the substrate in the second substrate process after the second substrate process, and generate a second process defect file based on the first process defect file, where the second process defect file includes an information field of the second substrate process and second parameter information of the second substrate process;
a second obtaining unit, configured to obtain second standard parameter information of the second substrate process;
the second comparison unit is used for comparing the second parameter information with the second standard parameter information and determining whether the substrate subjected to the second substrate procedure needs to be repaired or not;
And the second sending unit is used for sending a second repairing instruction to the substrate repairing equipment if the substrate subjected to the second substrate working procedure needs to be repaired, so that the substrate repairing equipment can repair the defects of the second substrate working procedure in the substrate according to the second working procedure defect file.
8. The apparatus for detecting a substrate defect according to claim 6, wherein the first parameter information includes first dot position information of each pixel of the substrate, the first standard parameter information includes first standard dot position information of each pixel of the substrate, and the first comparing unit is specifically configured to:
respectively comparing the first point position information of each pixel with the first standard point position information to respectively determine whether the first standard point position information corresponding to the first point position information of each pixel is matched or not;
if the number of pixels, in which the first point position information and the corresponding first standard point position information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
9. The apparatus according to claim 8, wherein the first dot position information of each pixel includes a first pixel coordinate of each pixel, and the first standard dot position information of each pixel includes a first standard pixel coordinate of each pixel;
The first point position information of each pixel further comprises first form information corresponding to the first pixel coordinates of each pixel, and the first standard point position information of each pixel further comprises first standard form information corresponding to the first standard pixel coordinates of each pixel;
the first comparison unit is specifically configured to:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point position information of the target pixel is matched with the first standard point position information.
10. The apparatus for detecting a substrate defect according to claim 6, further comprising:
a third obtaining unit, configured to obtain a third repair instruction for repairing the substrate after the first substrate process if the user performs repair after determining that the substrate after the first substrate process does not need repair;
and the third sending unit is used for sending a third repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair defects existing in the first substrate process in the substrate according to the first process defect file.
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