CN111500214A - Pressure-sensitive adhesive, preparation method of pressure-sensitive adhesive and high-temperature-resistant protective film - Google Patents
Pressure-sensitive adhesive, preparation method of pressure-sensitive adhesive and high-temperature-resistant protective film Download PDFInfo
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- CN111500214A CN111500214A CN202010442603.2A CN202010442603A CN111500214A CN 111500214 A CN111500214 A CN 111500214A CN 202010442603 A CN202010442603 A CN 202010442603A CN 111500214 A CN111500214 A CN 111500214A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J113/00—Adhesives based on rubbers containing carboxyl groups
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
- C09J123/32—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with compounds containing phosphorus or sulfur
- C09J123/34—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with compounds containing phosphorus or sulfur by chlorosulfonation
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/383—Natural or synthetic rubber
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/22—Expandable microspheres, e.g. Expancel®
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2413/00—Presence of rubbers containing carboxyl groups
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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Abstract
The invention relates to the technical field of adhesives and application thereof, in particular to a pressure-sensitive adhesive, a preparation method of the pressure-sensitive adhesive and a high-temperature-resistant protective film, wherein the pressure-sensitive adhesive comprises a glue main agent, a curing agent, a solvent and thermal expansion microspheres, and the glue main agent, the curing agent, the solvent and the thermal expansion microspheres have the following mass ratio: (40-60): (0.01-0.1): (30-45): (3-10). The heat expandable microsphere is a product which contains heat expandable microspheres and heat expandable microcapsules with low-boiling-point liquid hydrocarbon, the retention of expansion performance of the heat expandable microsphere is obviously improved when the heat expandable microsphere is soaked in a solvent, when the heat expandable microsphere is heated to a proper temperature, the shell of the heat expandable microsphere begins to expand, the expansion rate of the shell of the heat expandable microsphere is gradually increased along with the increase of the temperature, the expansion of the shell destroys the glue surface, the automatic viscosity reduction effect is achieved, the heat expandable microsphere can be applied to a high-temperature-resistant protective film, the CPI film is highly adhered when in use, meanwhile, the heat expandable microsphere can be debonded when in need of stripping without influencing the whole CPI film surface, and the use flexibility is.
Description
Technical Field
The invention relates to the technical field of adhesives and application thereof, in particular to a pressure-sensitive adhesive, a preparation method of the pressure-sensitive adhesive and a high-temperature-resistant protective film.
Background
With the progress of science and technology, foldable flexible screen mobile phones come into operation, the key material of the flexible screen is transparent polyimide (CPI), and the foldable flexible screen mobile phones also need to be protected by a high-temperature-resistant protective film. The traditional high-temperature-resistant protective film is mostly used for the bonding protection of glass and metal surfaces, but because the viscosity is low, and the peeling force is increased to a certain extent along with the extension of the bonding time, the deformation or adhesive residue on the surface of the CPI film can be caused during peeling, and the high-temperature-resistant protective film is not suitable for the surface protection of the film material.
Disclosure of Invention
Therefore, the pressure-sensitive adhesive is needed to solve the problems of the conventional technology at present, and can automatically reduce the viscosity in a specified high-temperature range, so that the CPI film is highly adhered in use, and meanwhile, the CPI film can be debonded without affecting the whole surface of the CPI film when the CPI film needs to be peeled.
The invention also provides a preparation method of the pressure-sensitive adhesive, which is simple to operate and easy to realize.
The invention also provides a high-temperature resistant protective film with the pressure-sensitive adhesive, which can be applied to the surface bonding protection of hard materials and the bonding protection of flexible films.
A pressure-sensitive adhesive comprises a glue main agent, a curing agent, a solvent and thermal expansion microspheres, wherein the glue main agent, the curing agent, the solvent and the thermal expansion microspheres are in the following mass ratio: (40-60): (0.01-0.1): (30-45): (3-10).
The invention has the beneficial effects that: the pressure-sensitive adhesive contains thermal expansion microspheres which are provided with thermal expansion microcapsules of low-boiling-point liquid hydrocarbon, and the retention of expansion performance of the thermal expansion microspheres in the soaking process of a solvent is obviously improved; generally, the reaction temperature range of the thermal expansion microspheres is 120-150 ℃, when the temperature is higher than 120 ℃, the adhesive layer begins to foam and expand, the viscosity of the pressure-sensitive adhesive is reduced, when the temperature reaches 150 ℃, the adhesive surface is completely visbroken and whitened, the viscosity of the adhesive surface is reduced to the minimum, a user has time to perform corresponding operations such as peeling and the like, the thermal expansion microsphere can be applied to a high-temperature-resistant protective film, the CPI film is highly adhered when in use, the CPI film can be debonded when needing to be peeled without affecting the whole CPI film surface, and the use flexibility is improved.
The further improvement of the scheme is that the mass ratio of the glue main agent to the curing agent to the solvent to the thermal expansion microspheres is as follows: (52-60): (0.01-0.05): (30-41.5): (3-8).
The further improvement of the scheme is that the main agent of the glue is acrylate resin or modified rubber resin.
The further improvement of the scheme is that the curing agent is an isocyanate curing agent or a peroxide curing agent.
The scheme is further improved in that the solvent is one or more of ethyl acetate, butanone and isopropanol.
The scheme is further improved in that the particle size of the thermal expansion microspheres is 10-30 microns.
The preparation method of the pressure-sensitive adhesive comprises the following steps:
and uniformly mixing the main agent of the glue, the curing agent and the solvent in proportion, slowly adding the thermal expansion microspheres, and uniformly stirring to obtain the pressure-sensitive adhesive.
The high-temperature-resistant protective film with the pressure-sensitive adhesive comprises a substrate and a release film, wherein the pressure-sensitive adhesive is attached to one side of the substrate to form an adhesive layer, and the release film is attached to one side, away from the substrate, of the adhesive layer.
The scheme is further improved in that the substrate is a PET (Polyethylene terephthalate) film or a PI (Polyimide) film; the release film is a PET release film.
The further improvement of the scheme is that the thickness of the substrate is 20-50 microns, the thickness of the adhesive layer is 30-50 microns, and the thickness of the release film is 40-50 microns.
Drawings
Fig. 1 is a schematic structural view of a high temperature resistant protective film according to embodiment 1 of the present invention.
Description of reference numerals:
the adhesive comprises a substrate 20, an adhesive layer 30, a release film 40 and a high-temperature-resistant protective film 100.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following description. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The invention provides a pressure-sensitive adhesive, which comprises a glue main agent, a curing agent, a solvent and thermal expansion microspheres, wherein the glue main agent, the curing agent, the solvent and the thermal expansion microspheres are in the following mass ratio: (40-60): (0.01-0.1): (30-45): (3-10).
In one embodiment, the mass ratio of the glue main agent, the curing agent, the solvent and the thermal expansion microspheres is as follows: (52-60): (0.01-0.05): (30-41.5): (3-8).
The main agent of the glue is acrylate resin or modified rubber resin. The acrylate resin may be, for example, one or more of methacrylic acid, methyl methacrylate, ethyl methacrylate, butyl methacrylate, and isooctyl methacrylate. The modified rubber resin may be, for example, one or more of chloroprene rubber, nitrile rubber, polysulfide rubber, carboxyl rubber, chlorosulfonated polyethylene rubber, and polyisobutylene rubber.
The curing agent is an isocyanate curing agent or a peroxide curing agent. The peroxide curing agent can be one or more of benzoyl peroxide, cyclohexanone peroxide, tert-butyl benzoyl peroxide and di-tert-butyl peroxide.
The solvent is one or more of ethyl acetate, butanone and isopropanol.
The particle size of the thermal expansion microspheres is 10-30 microns.
In a preferred embodiment, the main glue agent of the pressure-sensitive adhesive is acrylate resin, the curing agent is isocyanate curing agent, and the solvent is ethyl acetate.
In one embodiment, the main glue agent of the pressure-sensitive adhesive is modified rubber resin, the curing agent is a peroxide curing agent, and the solvent is butanone.
The pressure-sensitive adhesive contains thermal expansion microspheres which are provided with thermal expansion microcapsules of low-boiling-point liquid hydrocarbon, and the retention of expansion performance of the product is obviously improved when the thermal expansion microspheres are soaked in a solvent. Generally, the reaction temperature range of the thermal expansion microspheres is 120-150 ℃, when the temperature is higher than 120 ℃, the adhesive layer begins to foam and expand, the viscosity of the pressure-sensitive adhesive is reduced, when the temperature reaches 150 ℃, the adhesive surface is completely visbroken and whitened, the viscosity of the adhesive surface is reduced to the minimum, a user has time to perform corresponding operations such as peeling and the like, the thermal expansion microsphere can be applied to a high-temperature-resistant protective film, the CPI film is highly adhered when in use, the CPI film can be debonded when needing to be peeled without affecting the whole CPI film surface, and the use flexibility is improved.
The preparation method of the pressure-sensitive adhesive is simple to operate and easy to realize, and comprises the following steps:
and uniformly mixing the main agent of the glue, the curing agent and the solvent in proportion, slowly adding the thermal expansion microspheres, and uniformly stirring to obtain the pressure-sensitive adhesive.
The high-temperature-resistant protective film with the pressure-sensitive adhesive comprises a substrate and a release film, wherein the pressure-sensitive adhesive is attached to one side of the substrate to form an adhesive layer, and the release film is attached to one side, away from the substrate, of the adhesive layer.
The substrate may be a PET film or a PI film. The release film may be a PET release film.
Preferably, the thickness of the substrate is 20-50 microns, the thickness of the adhesive layer is 30-50 microns, and the thickness of the release film is 40-50 microns.
The preparation method of the high-temperature resistant protective film comprises the following steps: coating a pressure-sensitive adhesive on one side of a substrate, baking for 2-5 minutes to form an adhesive layer, cooling to room temperature, attaching a release film to one side, far away from the substrate, of the adhesive layer, and obtaining the high-temperature-resistant protective film.
The high-temperature-resistant protective film can be applied to the surface bonding protection of hard materials and the bonding protection of flexible films.
The following are specific examples.
Example 1
The high temperature resistant protective film 100 of the present embodiment includes a substrate 20, an adhesive layer 30 attached to the substrate 20, and a release film 40 attached to the adhesive layer 30. The PET film with the thickness of 50 microns is used as the base material 20, the PET film with the thickness of 50 microns is used as the release film 50, and the thickness of the adhesive layer 30 is 50 microns.
The adhesive layer 30 is formed by drying a pressure-sensitive adhesive, which comprises the following components in percentage by weight:
example 2
The high-temperature-resistant protective film of the embodiment comprises a base material, an adhesive layer attached to the base material and a release film attached to the adhesive layer. A PI film with the thickness of 50 micrometers is used as a base material, a PET film with the thickness of 50 micrometers is used as a release film, and the thickness of an adhesive layer is 50 micrometers.
The adhesive layer is formed by drying a pressure-sensitive adhesive, and the pressure-sensitive adhesive comprises the following components in percentage by weight:
example 3
The high-temperature-resistant protective film of the embodiment comprises a base material, an adhesive layer attached to the base material and a release film attached to the adhesive layer. A PI film with the thickness of 50 micrometers is used as a base material, a PET film with the thickness of 50 micrometers is used as a release film, and the thickness of an adhesive layer is 50 micrometers.
The adhesive layer is formed by drying a pressure-sensitive adhesive, and the pressure-sensitive adhesive comprises the following components in percentage by weight:
the modified rubber resin is chlorosulfonated polyethylene rubber, and the peroxide curing agent is benzoyl peroxide.
Example 4
The high-temperature-resistant protective film of the embodiment comprises a base material, an adhesive layer attached to the base material and a release film attached to the adhesive layer. A PI film with the thickness of 30 micrometers is used as a base material, a PET film with the thickness of 45 micrometers is used as a release film, and the thickness of an adhesive layer is 42 micrometers.
The adhesive layer is formed by drying a pressure-sensitive adhesive, and the pressure-sensitive adhesive comprises the following components in percentage by weight:
the modified rubber resin is carboxyl rubber, and the peroxide curing agent is tert-butyl benzoyl peroxide.
Example 5
The high-temperature-resistant protective film of the embodiment comprises a base material, an adhesive layer attached to the base material and a release film attached to the adhesive layer. The PET film with the thickness of 40 micrometers is used as a base material, the PET film with the thickness of 30 micrometers is used as a release film, and the thickness of the adhesive layer is 35 micrometers.
The adhesive layer is formed by drying a pressure-sensitive adhesive, and the pressure-sensitive adhesive comprises the following components in percentage by weight:
the modified rubber resin is chlorosulfonated polyethylene rubber, the peroxide curing agent is tert-butyl benzoyl peroxide, and the volume ratio of the solvent is 1: 1 butanone and isopropanol.
The high temperature resistant protective films of examples 1 to 5 were subjected to various performance tests, and the test results are shown in table 1.
The test method comprises the following steps: before the high-temperature resistant protective film of each example was detackified, the high-temperature resistant protective film was attached to an SUS304 steel plate: 180 DEG peel force 1200gf/25mm, test the peel force;
after the de-sticking, the high temperature resistant protective films of the previous examples were peeled off, respectively attached to the CPI film, and the peel force was tested: 180 ℃ peel force 0.5gf/25 mm.
The viscosity reduction scheme comprises the steps of baking at 130 ℃ for 3-5min at 120-.
TABLE 1
According to experimental results, the high-temperature-resistant protective film has good adhesive force when being applied to the CPI film, the CPI film is torn after viscosity reduction, and the adhered surface of the CPI film is not damaged, so that the high-temperature-resistant protective film can be applied to adhesion protection of flexible thin film materials such as the CPI film.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The pressure-sensitive adhesive is characterized by comprising a glue main agent, a curing agent, a solvent and thermal expansion microspheres, wherein the glue main agent, the curing agent, the solvent and the thermal expansion microspheres are in a mass ratio of: (40-60): (0.01-0.1): (30-45): (3-10).
2. The pressure-sensitive adhesive of claim 1, wherein the glue main agent, the curing agent, the solvent and the thermal expansion microspheres are in a mass ratio of: (52-60): (0.01-0.05): (30-41.5): (3-8).
3. The pressure-sensitive adhesive of claim 1, wherein the main glue agent is acrylate resin or modified rubber resin.
4. The pressure sensitive adhesive of claim 1 wherein the curative is an isocyanate curative or a peroxide curative.
5. The pressure sensitive adhesive of claim 1 wherein the solvent is one or more of ethyl acetate, methyl ethyl ketone and isopropyl alcohol.
6. The pressure-sensitive adhesive of claim 1, wherein the thermally expandable microspheres have a particle size of 10-30 μm.
7. The process for preparing a pressure sensitive adhesive according to any of claims 1 to 6, comprising the steps of:
and uniformly mixing the main agent of the glue, the curing agent and the solvent in proportion, slowly adding the thermal expansion microspheres, and uniformly stirring to obtain the pressure-sensitive adhesive.
8. The high-temperature-resistant protective film with the pressure-sensitive adhesive as claimed in any one of claims 1 to 6, comprising a substrate and a release film, wherein the pressure-sensitive adhesive is attached to one side of the substrate to form an adhesive layer, and the release film is attached to one side of the adhesive layer away from the substrate.
9. The high temperature resistant protective film according to claim 8, wherein the substrate is a PET film or a PI film; the release film is a PET release film.
10. The high-temperature-resistant protective film according to claim 8 or 9, wherein the substrate has a thickness of 20 to 50 micrometers, the adhesive layer has a thickness of 30 to 50 micrometers, and the release film has a thickness of 40 to 50 micrometers.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112126382A (en) * | 2020-09-01 | 2020-12-25 | 邓雁 | High-temperature-resistant magnetic-conductive acrylic pressure-sensitive adhesive and preparation method thereof |
| CN112143418A (en) * | 2020-09-01 | 2020-12-29 | 邓雁 | High-temperature-resistant magnetic-conductive acrylic pressure-sensitive adhesive and preparation method thereof |
| CN112280497A (en) * | 2020-10-20 | 2021-01-29 | 苏州环明电子科技有限公司 | Reworkable laser phase change adhesive and preparation method thereof |
| CN112708360A (en) * | 2020-12-23 | 2021-04-27 | 宁波长阳科技股份有限公司 | High-temperature-resistant back protection film for CPI touch conductive film manufacturing process and preparation method and application thereof |
| WO2022194241A1 (en) * | 2021-03-19 | 2022-09-22 | 立铠精密科技(盐城)有限公司 | Protective colloid and use method therefor |
| WO2022206876A1 (en) * | 2021-04-02 | 2022-10-06 | 烟台正海磁性材料股份有限公司 | Composition of heat-expandable microspheres and application thereof |
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| CN105131869A (en) * | 2015-09-10 | 2015-12-09 | 深圳市美信电子有限公司 | Thermal viscosity loss pressure-sensitive adhesive, thermally peelable adhesive tape and preparation methods of thermal viscosity loss pressure-sensitive adhesive and thermally peelable adhesive tape |
| CN106433506A (en) * | 2016-11-07 | 2017-02-22 | 苏州旭泽新材料科技有限公司 | Protective film with heating-reducible adhesion and preparation method thereof |
| CN110437757A (en) * | 2019-07-11 | 2019-11-12 | 昆山博益鑫成高分子材料有限公司 | A kind of preparation of novel hot visbreaking adhesive and hot visbreaking protective film |
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| CN105131869A (en) * | 2015-09-10 | 2015-12-09 | 深圳市美信电子有限公司 | Thermal viscosity loss pressure-sensitive adhesive, thermally peelable adhesive tape and preparation methods of thermal viscosity loss pressure-sensitive adhesive and thermally peelable adhesive tape |
| CN106433506A (en) * | 2016-11-07 | 2017-02-22 | 苏州旭泽新材料科技有限公司 | Protective film with heating-reducible adhesion and preparation method thereof |
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