CN111477559A - Silicon wafer damage detection device and detection method - Google Patents
Silicon wafer damage detection device and detection method Download PDFInfo
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- CN111477559A CN111477559A CN202010385489.4A CN202010385489A CN111477559A CN 111477559 A CN111477559 A CN 111477559A CN 202010385489 A CN202010385489 A CN 202010385489A CN 111477559 A CN111477559 A CN 111477559A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 160
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 156
- 239000010703 silicon Substances 0.000 title claims abstract description 156
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- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000006872 improvement Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 4
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- 230000004048 modification Effects 0.000 description 2
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- 238000006467 substitution reaction Methods 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
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- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
The invention relates to a silicon wafer damage detection device and a detection method in the field of silicon wafer manufacturing.A detection platform outlet is arranged corresponding to an output system; the detection platform is provided with a detection flow mechanism from an inlet position to an outlet position, the detection flow mechanism sequentially comprises a tray placing table, a grabbing component for grabbing a tray on the tray placing table, a transportation component for transporting the tray, a detection mechanism matched with the transportation component, a damaged part pushing-out component arranged at the rear stage of the detection mechanism, and a linking component arranged at the tail end of the transportation component and used for being connected with an output system; the transportation assembly is driven by the driving assembly; the invention provides a silicon wafer damage detection device, which can realize the rapid streamlined detection of a silicon wafer, improve the detection efficiency and remove unqualified silicon wafers; meanwhile, the silicon wafer can be rapidly detected by the method, the transportation of the silicon wafer can be realized in the detected gap, and the working efficiency is improved.
Description
Technical Field
The invention relates to a silicon wafer damage detection device and a detection method in the field of silicon wafer manufacturing.
Background
The photovoltaic energy is a new energy project for the key development and popularization of human beings in the 21 st century; at present, an important goal in the industry is to reduce the production cost to realize the flat-price surfing of photovoltaic electric energy, wherein, improving the efficiency of photovoltaic products is an important way to reduce the production cost; the existing crystalline silicon cell is restricted by technology, and the structure of the light receiving surface does not achieve ideal effect, so that the light utilization rate is still low. The photovoltaic energy can be required to use crystal silicon wafers, the crystal silicon wafers are subjected to a series of physical and chemical processes such as ingot casting (or crystal pulling), square splitting, wire cutting and the like from raw material silicon to crystal regular finished product silicon wafers, the quality of the finished product silicon wafers inevitably has differences or small damages, and the differences and the damages cannot be distinguished by naked eyes but have great influence on the subsequent process; the line mark defect caused by silicon wafer cutting affects the fragments and electrical property of the subsequent battery piece, and needs to be detected and selected before the battery process. At present, the main reason for causing the line mark defect is wire jumping and wire breakage of a steel wire in the cutting process, the direction of the wire jumping and the wire breakage is any direction, and no fixed rule exists. Most of conventional silicon wafer line mark detection methods are laser detection, the distance is calculated through a triangle formed by a laser emission line and a reflection line (laser triangle principle), and then the depth of a line mark is calculated, but when the direction of the line mark is vertical to the detection direction or an included angle exists, the line mark can be detected; however, when the direction of the line mark is the same as the direction of the detection path, the line mark cannot be detected, so that the conventional detection method is easy to cause missing judgment, and normal silicon wafers are mixed and flow into a battery process, thereby reducing the yield.
In the prior art, application No. 201610993435. X, filing date 2016.11.11, entitled "method of making an article of manufacture
The silicon wafer line mark detection device comprises a transmission platform for transmitting a silicon wafer to a detection station, wherein a rotary platform is arranged below the detection station, a jacking assembly for jacking the silicon wafer to be detected positioned on the detection station is arranged above the rotary platform, and a group of line mark detection assemblies for detecting the line marks of the silicon wafer are arranged above and below the detection station. The silicon wafer line mark detection device has the advantages of being accurate, comprehensive and reliable in detection and the like. The invention also correspondingly discloses a detection method, which comprises the following steps: s01, starting, the transmission platform transmits the silicon wafer to be detected to the detection station; s02, the jacking assembly jacks the silicon wafer to be detected to be separated from the transmission platform, and then the rotating platform rotates to drive the silicon wafer to be detected on the jacking assembly to rotate; meanwhile, the line mark detection assembly detects line marks on the silicon wafer to be detected; the invention can not form batch detection, has low detection efficiency, is not beneficial to popularization, and has large error and poor effect in detection.
Disclosure of Invention
The invention aims to provide a silicon wafer damage detection device, which can realize the rapid streamlined detection of a silicon wafer, improve the detection efficiency and remove unqualified silicon wafers.
The purpose of the invention is realized as follows: a silicon wafer breakage detection device comprises an input system and an output system, wherein a detection device is arranged between the input system and the output system in a matching mode, the detection device comprises a detection platform, the input system is arranged in a matching mode with an inlet of the detection platform, and an outlet of the detection platform corresponds to the output system; the detection platform is provided with a detection flow mechanism from an inlet position to an outlet position, and the detection flow mechanism sequentially comprises a tray placing table, a grabbing component for grabbing a tray on the tray placing table, a transportation component for transporting the tray, a detection mechanism matched with the transportation component, a damaged part pushing-out component arranged at the rear stage of the detection mechanism, and a linking component arranged at the tail end of the transportation component and used for being connected with an output system; the transport assembly is driven by a drive assembly.
When the silicon wafer detection device works, a tray fully loaded with a plurality of groups of silicon wafers to be detected is transported to a tray placing table through an input system and is ready for detection, and a front-section transportation mechanism and a rear-section transportation mechanism are respectively started; the sliding platform for fixing the sucker component slides to the position right above the tray placing table, and the telescopic cylinder extends out and drives the sucker to move downwards; the sucking discs sequentially adsorb the silicon wafers to be detected from the uppermost side, and then sequentially place the adsorbed silicon wafers to be detected on a conveying belt of the front-section conveying mechanism; when the silicon wafer to be detected is placed, the distances from the outer edges of the two conveyor belts to the two sides of the silicon wafer to be detected are equal, so that the silicon wafer to be detected can be ensured to be positioned between the two conveyor belts and prevented from falling off in the transportation process; the front-section conveying mechanism is driven by an independent driving assembly and conveys the silicon wafer to be detected into the intermediate transition mechanism, the silicon wafer enters the shell when entering the intermediate transition mechanism, and then the silicon wafer is detected by the X-ray detector; after the detection is finished, the particles are conveyed to a rear-section conveying mechanism through an intermediate transition mechanism and then collected; when the system detects unqualified silicon wafers, the pushing sucker of the damaged piece pushing assembly starts to work, the pushing sucker pushes the unqualified silicon wafers into the collection table to be collected, and then the unqualified silicon wafers are processed in a centralized manner; when the detected silicon wafer is proper, the damaged part pushing assembly does not work, and then the damaged part pushing assembly is directly conveyed to the rear section conveying mechanism through the conveying belt and collected; wait to detect the silicon chip and be adsorbed one after another in proper order and place and transport in the anterior segment conveying mechanism, then detect, rethread back end conveying mechanism transports, in case there is the silicon chip when carrying out the X-ray detection, anterior segment conveying mechanism continues to transport next and waits to detect the silicon chip and stop until being close to middle transition mechanism this moment, and back end conveying mechanism also moves and transports off finished product silicon chip simultaneously.
The invention has the advantages that the invention can realize the rapid streamlined detection of the silicon chip, improve the detection efficiency and can remove unqualified silicon chips.
As a further improvement of the invention, the silicon chip detection device can realize batch transportation and high-efficiency detection; the tray is placed the bench and is provided with the tray, the tray is including being the frame of quadrangle setting, sets up the buffering cushion below the frame, sets up the baffle at frame dog subassembly and frame center all around, dog subassembly perpendicular to frame sets up, the dog subassembly is provided with a plurality of groups side by side and the interval, it has a plurality of silicon chips that wait to detect to pile up in proper order on the baffle.
As a further improvement of the invention, the grabbing mechanism can stably grab the workpiece with high grabbing efficiency and can work stably; the grabbing component comprises a sliding portal frame, a sliding component arranged in cooperation with the sliding portal frame, a sliding platform arranged in cooperation with the sliding component, and a sucker component arranged on the sliding platform, and the sliding platform moves back and forth on the sliding component through a sliding driving component; the sliding portal frame is arranged by crossing the transportation assembly, the sliding platform comprises guide rails arranged on two sides, a driving shaft arranged between the guide rails, sliding chutes arranged below the sliding platform and matched with the guide rails on the two sides, and a driving part used for connecting the driving shaft, and the sliding driving assembly drives the driving shaft and the driving part to move relatively and drives the sliding chutes to move back and forth on the guide rails.
As a further improvement of the invention, the sucker component is ensured to work stably and reliably; the sucker assembly comprises a telescopic cylinder fixed on the sliding platform, a connecting plate arranged at the bottom of the telescopic cylinder in a matching manner, and suckers fixedly arranged on the connecting plate, wherein the suckers are provided with a plurality of groups and are arranged side by side; the telescopic cylinder performs telescopic action and drives the sucker to move up and down.
As a further improvement of the invention, in order to ensure that the transportation assembly can carry out segmented transportation, and simultaneously can improve the working efficiency, trivial time can be utilized; the transportation assembly comprises a front-section transportation mechanism, a middle transition mechanism and a rear-section transportation mechanism; the front-section conveying mechanism and the rear-section conveying mechanism are respectively driven by independent driving components; the front-section conveying mechanism and the rear-section conveying mechanism respectively comprise a front pulley, a rear pulley and two conveying belts arranged between the front pulley and the rear pulley, the two conveying belts are arranged side by side, and the silicon wafers to be detected are placed on the conveying belts; the conveying belt is made of wear-resistant and anti-skid materials.
As a further improvement of the invention, the invention ensures that the detection mechanism can carry out high-efficiency detection and ensures high detection efficiency and stable work; the detection mechanism is arranged at the position of the middle transition mechanism of the conveying assembly, covers the middle transition mechanism and comprises a detection shell and an X-ray detector matched with the detection shell; and conveying the silicon wafer to be detected to the intermediate transition mechanism and detecting the silicon wafer in the shell by an X-ray detector.
As a further improvement of the invention, in order to ensure that the broken piece pushing-out assembly can quickly remove the broken pieces, the working efficiency of the whole process is improved; the damaged part pushing assembly comprises a pushing sucker and a collecting table matched with the pushing sucker, and the pushing sucker pushes damaged silicon wafers to the collecting table and collects the silicon wafers.
As a further improvement of the invention, in order to ensure that the connecting assembly can assist the finished silicon wafer to carry out stable transportation, the working efficiency of detection is improved; the linking assembly is arranged between the output system and the tail end of the transportation assembly and comprises an upper side bracket, a lower side bracket and a roller between the upper side bracket and the lower side bracket; and the detected silicon wafer is transported to the roller through the transport assembly, enters the output system and is transported out.
Another object of the invention is: the silicon wafer detection method can be used for rapidly detecting the silicon wafer, facilitates the transportation of the silicon wafer in the detected gap, and improves the working efficiency.
Another object of the invention is achieved by: comprises that
The method comprises the following steps: the method comprises the following steps that a tray which is fully loaded with a plurality of groups of silicon wafers to be detected and stacked is transported to a tray placing table through an input system and is ready for detection, and a front-section transportation mechanism and a rear-section transportation mechanism are respectively started;
step two: the sliding platform for fixing the sucker component slides to the position right above the tray placing table, and the telescopic cylinder extends out and drives the sucker to move downwards;
step three: the sucking discs sequentially adsorb the silicon wafers to be detected from the uppermost side, and then sequentially place the adsorbed silicon wafers to be detected on a conveying belt of the front-section conveying mechanism;
step four: when the silicon wafer to be detected is placed, the distances from the outer edges of the two conveyor belts to the two sides of the silicon wafer to be detected are equal, so that the silicon wafer to be detected can be ensured to be positioned between the two conveyor belts and prevented from falling off in the transportation process;
step five: the front-section conveying mechanism is driven by an independent driving assembly and conveys the silicon wafer to be detected into the intermediate transition mechanism, the silicon wafer enters the shell when entering the intermediate transition mechanism, and then the silicon wafer is detected by the X-ray detector;
step six: after the detection is finished, the particles are conveyed to a rear-section conveying mechanism through an intermediate transition mechanism and then collected;
step seven: when the system detects unqualified silicon wafers, the pushing sucker of the damaged piece pushing assembly starts to work, the pushing sucker pushes the unqualified silicon wafers into the collection table to be collected, and then the unqualified silicon wafers are processed in a centralized manner;
step eight: when the detected silicon wafer is proper, the damaged part pushing assembly does not work, and then the damaged part pushing assembly is directly conveyed to the rear section conveying mechanism through the conveying belt and collected;
step nine: wait to detect the silicon chip and be adsorbed one after another in proper order and place and transport in the anterior segment conveying mechanism, then detect, rethread back end conveying mechanism transports, in case there is the silicon chip when carrying out the X-ray detection, anterior segment conveying mechanism continues to transport next and waits to detect the silicon chip and stop until being close to middle transition mechanism this moment, and back end conveying mechanism also moves and transports off finished product silicon chip simultaneously.
The invention also has the beneficial effects that: the silicon wafer detection method can be used for rapidly detecting the silicon wafer, facilitates the transportation of the silicon wafer in the detected gap, and improves the working efficiency.
Drawings
FIG. 1 is a top view of the present invention without the detection mechanism housing removed.
FIG. 2 is a top view of the present invention with the detection mechanism housing removed.
Fig. 3 is a block diagram of the present invention.
Fig. 4 is an enlarged view of a portion a in fig. 3.
The device comprises an input system 1, a detection device 2, an output system 3, a tray placing table 4, a grabbing assembly 5, a transportation assembly 6, a detection mechanism 7, a damaged part pushing assembly 8, a connection assembly 9, a tray 10, a buffer rubber mat 11, a frame 12, a baffle 13, a baffle 14, a baffle assembly 15, a silicon wafer to be detected 15, a sliding platform 16, a guide rail 17, a driving shaft 18, a telescopic cylinder 19, a connecting plate 20, a suction cup 21, a front section transportation mechanism 22, a middle transition mechanism 23, a rear section transportation mechanism 24, a front pulley 25, a rear pulley 26, a conveyor belt 27, a pushing suction cup 28 and a 29 pushing suction cup 30, a collection table 31, an upper side support 31, a lower side support 32, a roller 33, a sliding driving assembly 34, a sliding chute 35, a driving part 36.
Detailed Description
Example one
As shown in fig. 1-4, the object of the present invention is achieved by: a silicon wafer breakage detection device comprises an input system 1 and an output system 3, wherein a detection device 2 is arranged between the input system 1 and the output system 3 in a matching mode, the detection device 2 comprises a detection platform 37, the input system 1 is arranged in a matching mode with an inlet of the detection platform 37, and an outlet of the detection platform 37 is arranged corresponding to the output system 3; the detection platform 37 is provided with a detection flow mechanism from an inlet position to an outlet position, and the detection flow mechanism sequentially comprises a tray placing table 4, a grabbing component 5 for grabbing a tray 10 on the tray placing table 4, a transporting component 6 for transporting the tray 10, a detection mechanism 7 arranged in cooperation with the transporting component 6, a damaged part pushing component 8 arranged in a rear process of the detection mechanism 7, and a connecting component 9 arranged at the tail end of the transporting component 6 and used for being connected with the output system 3; the transport assembly 6 is driven by a drive assembly.
The tray is provided with tray 10 on placing the platform 4, tray 10 is including being the frame 12 of quadrangle setting, sets up buffering cushion 11 below frame 12, sets up the baffle 13 at frame 12 dog subassembly 14 all around and frame 12 center rather than, dog subassembly 14 perpendicular to frame 12 sets up, dog subassembly 14 is provided with a plurality of groups side by side and the interval, it has a plurality of silicon chips 15 that wait to detect to stack gradually on the baffle 13.
The grabbing component 5 comprises a sliding portal frame 28, a sliding component arranged in cooperation with the sliding portal frame 28, a sliding platform 16 arranged in cooperation with the sliding component, and a sucker component arranged on the sliding platform 16, wherein the sliding platform 16 moves back and forth on the sliding component through a sliding driving component 34; the sliding portal frame 28 is arranged across the transportation assembly 6, the sliding platform 16 comprises guide rails 17 arranged on two sides, a driving shaft 18 arranged between the guide rails 17, sliding chutes 35 arranged below the sliding platform 16 and matched with the guide rails 17 on the two sides, and a driving part 36 used for connecting the driving shaft 18, and the sliding driving assembly 34 drives the driving shaft 18 and the driving part 36 to move relatively and drives the sliding chutes 35 to move back and forth on the guide rails 17.
The sucker assembly comprises a telescopic cylinder 19 fixed on the sliding platform 16, a connecting plate 20 arranged at the bottom of the telescopic cylinder 19 in a matching manner, and suckers 21 fixedly arranged on the connecting plate 20, wherein the suckers 21 are provided with a plurality of groups and are arranged side by side; the telescopic cylinder 19 performs telescopic action and drives the suction cup 21 to move up and down.
The transportation assembly 6 comprises a front-section transportation mechanism 22, a middle transition mechanism 23 and a rear-section transportation mechanism 24; the front-section conveying mechanism 22 and the rear-section conveying mechanism 24 are respectively driven by independent driving components; the front-section conveying mechanism 22 and the rear-section conveying mechanism 24 respectively comprise a front pulley 25, a rear pulley 26 and two conveying belts 27 arranged between the front pulley 25 and the rear pulley 26, the two conveying belts 27 are arranged side by side, and the silicon wafers 15 to be detected are placed on the conveying belts 27; the conveyor belt 27 is made of wear-resistant and anti-slip materials.
The detection mechanism 7 is arranged at the position of the middle transition mechanism 23 of the conveying assembly, the detection mechanism 7 covers the middle transition mechanism 23, and the detection mechanism 7 comprises a detection shell and an X-ray detector matched with the detection shell; the silicon chip 15 to be detected is transported to the intermediate transition mechanism 23 and positioned in the shell to be detected by an X-ray detector.
The damaged part pushing assembly 8 comprises a pushing sucker 29 and a collecting platform 30 arranged in cooperation with the pushing sucker 29, and the damaged silicon wafer is pushed onto the collecting platform 30 and is collected by the pushing sucker 29.
The engaging assembly 9 is arranged between the output system 3 and the tail end of the transportation assembly 6, and the engaging assembly 9 comprises an upper bracket 31, a lower bracket 32 and a roller 33 between the upper bracket 31 and the lower bracket 32; the detected silicon wafer is transported to the roller 33 through the transport assembly 6 and enters the output system 3 to be transported out.
When the silicon wafer detection device works, a tray 10 which is fully loaded with a plurality of groups of silicon wafers 15 to be detected and stacked is transported to a tray placing table 4 through an input system 1 and is ready for detection, and a front-section transportation mechanism 22 and a rear-section transportation mechanism 24 are respectively started; the sliding platform 16 for fixing the sucker component slides right above the tray placing table 4, and the telescopic cylinder 19 extends out and drives the sucker 21 to move downwards; the suction cups 21 sequentially suck the silicon wafers 15 to be detected from the uppermost side, and then sequentially place the sucked silicon wafers 15 to be detected on the conveyor belt 27 of the front-section conveying mechanism 22; when the silicon wafer 15 to be detected is placed, the distances from the outer edges of the two conveyor belts 27 to the two edges of the silicon wafer 15 to be detected are equal, so that the silicon wafer 15 to be detected is positioned in the middle of the two conveyor belts 27 and is prevented from falling off in the transportation process; the front-section conveying mechanism 22 is driven by an independent driving component and conveys the silicon wafer 15 to be detected into the intermediate transition mechanism 23, the silicon wafer enters the intermediate transition mechanism 23 and then enters the shell, and then the silicon wafer is detected by an X-ray detector; after the detection is finished, the particles are conveyed to a rear-section conveying mechanism 24 through an intermediate transition mechanism 23 and then collected; when the system detects unqualified silicon wafers, the pushing-out sucker 29 of the damaged piece pushing-out assembly 8 starts to work, the pushing-out sucker 29 pushes the unqualified silicon wafers into the collection table 30 for collection, and then the unqualified silicon wafers are processed in a centralized manner; when the detected silicon wafer is proper, the damaged part pushing-out assembly 8 does not work, and then the damaged part pushing-out assembly is directly conveyed to the rear section conveying mechanism 24 through the conveying belt 27 and collected; wait to detect silicon chip 15 and be adsorbed one by one in proper order and place and transport in anterior segment transport mechanism 22, then detect, the transport is carried out to rethread back end transport mechanism 24, in case there is the silicon chip when carrying out the X-ray detection, anterior segment transport mechanism 22 continues to transport next and waits to detect silicon chip 15 and stop when being close to middle transition mechanism 23 this moment, and rear end transport mechanism 24 also moves and transports finished product silicon chip simultaneously.
Example two
Another object of the invention is achieved by: comprises that
The method comprises the following steps: the tray 10 fully loaded with a plurality of groups of silicon wafers 15 to be detected is transported to the tray placing table 4 through the input system 1 and is ready for detection, and the front-section transporting mechanism 22 and the rear-section transporting mechanism 24 are respectively started;
step two: the sliding platform 16 for fixing the sucker component slides right above the tray placing table 4, and the telescopic cylinder 19 extends out and drives the sucker 21 to move downwards;
step three: the suction cups 21 sequentially suck the silicon wafers 15 to be detected from the uppermost side, and then sequentially place the sucked silicon wafers 15 to be detected on the conveyor belt 27 of the front-section conveying mechanism 22;
step four: when the silicon wafer 15 to be detected is placed, the distances from the outer edges of the two conveyor belts 27 to the two edges of the silicon wafer 15 to be detected are equal, so that the silicon wafer 15 to be detected is positioned in the middle of the two conveyor belts 27 and is prevented from falling off in the transportation process;
step five: the front-section conveying mechanism 22 is driven by an independent driving component and conveys the silicon wafer 15 to be detected into the intermediate transition mechanism 23, the silicon wafer enters the intermediate transition mechanism 23 and then enters the shell, and then the silicon wafer is detected by an X-ray detector;
step six: after the detection is finished, the particles are conveyed to a rear-section conveying mechanism 24 through an intermediate transition mechanism 23 and then collected;
step seven: when the system detects unqualified silicon wafers, the pushing-out sucker 29 of the damaged piece pushing-out assembly 8 starts to work, the pushing-out sucker 29 pushes the unqualified silicon wafers into the collection table 30 for collection, and then the unqualified silicon wafers are processed in a centralized manner;
step eight: when the detected silicon wafer is proper, the damaged part pushing-out assembly 8 does not work, and then the damaged part pushing-out assembly is directly conveyed to the rear section conveying mechanism 24 through the conveying belt 27 and collected;
step nine: the silicon wafers 15 to be detected are sequentially adsorbed one by one and then placed in the front-section transportation mechanism 22 for transportation, then detection is carried out, then the silicon wafers are transported out through the rear-section transportation mechanism 24, once the silicon wafers are subjected to X-ray detection, the front-section transportation mechanism 22 continues to transport the next silicon wafer 15 to be detected until the silicon wafers are close to the middle transition mechanism 23, and then the transportation is stopped; and meanwhile, the rear-end conveying mechanism 24 also acts to convey the finished silicon wafers out.
The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (9)
1. A silicon wafer breakage detection device comprises an input system and an output system, and is characterized in that a detection device is arranged between the input system and the output system in a matching mode, the detection device comprises a detection platform, the input system is arranged in a matching mode with an inlet of the detection platform, and an outlet of the detection platform is arranged corresponding to the output system; the detection platform is provided with a detection flow mechanism from an inlet position to an outlet position, and the detection flow mechanism sequentially comprises a tray placing table, a grabbing component for grabbing a tray on the tray placing table, a transportation component for transporting the tray, a detection mechanism matched with the transportation component, a damaged part pushing-out component arranged at the rear stage of the detection mechanism, and a linking component arranged at the tail end of the transportation component and used for being connected with an output system; the transport assembly is driven by a drive assembly.
2. The silicon wafer breakage detecting apparatus according to claim 1, characterized in that: the tray is placed the bench and is provided with the tray, the tray is including being the frame of quadrangle setting, sets up the buffering cushion below the frame, sets up the baffle at frame dog subassembly and frame center all around, dog subassembly perpendicular to frame sets up, the dog subassembly is provided with a plurality of groups side by side and the interval, it has a plurality of silicon chips that wait to detect to pile up in proper order on the baffle.
3. The silicon wafer breakage detecting apparatus according to claim 1, characterized in that: the grabbing component comprises a sliding portal frame, a sliding component arranged in cooperation with the sliding portal frame, a sliding platform arranged in cooperation with the sliding component, and a sucker component arranged on the sliding platform, and the sliding platform moves back and forth on the sliding component through a sliding driving component; the sliding portal frame is arranged by crossing the transportation assembly, the sliding platform comprises guide rails arranged on two sides, a driving shaft arranged between the guide rails, sliding chutes arranged below the sliding platform and matched with the guide rails on the two sides, and a driving part used for connecting the driving shaft, and the sliding driving assembly drives the driving shaft and the driving part to move relatively and drives the sliding chutes to move back and forth on the guide rails.
4. The silicon wafer breakage detecting apparatus according to claim 3, wherein: the sucker assembly comprises a telescopic cylinder fixed on the sliding platform, a connecting plate arranged at the bottom of the telescopic cylinder in a matching manner, and suckers fixedly arranged on the connecting plate, wherein the suckers are provided with a plurality of groups and are arranged side by side; the telescopic cylinder performs telescopic action and drives the sucker to move up and down.
5. The silicon wafer breakage detecting apparatus according to claim 1, characterized in that: the transportation assembly comprises a front-section transportation mechanism, a middle transition mechanism and a rear-section transportation mechanism; the front-section conveying mechanism and the rear-section conveying mechanism are respectively driven by independent driving components; the front-section conveying mechanism and the rear-section conveying mechanism respectively comprise a front pulley, a rear pulley and two conveying belts arranged between the front pulley and the rear pulley, the two conveying belts are arranged side by side, and the silicon wafers to be detected are placed on the conveying belts; the conveying belt is made of wear-resistant and anti-skid materials.
6. The silicon wafer breakage detecting apparatus according to claim 1, characterized in that: the detection mechanism is arranged at the position of the middle transition mechanism of the conveying assembly, covers the middle transition mechanism and comprises a detection shell and an X-ray detector matched with the detection shell; and conveying the silicon wafer to be detected to the intermediate transition mechanism and detecting the silicon wafer in the shell by an X-ray detector.
7. The silicon wafer breakage detecting apparatus according to claim 1, characterized in that: the damaged part pushing assembly comprises a pushing sucker and a collecting table matched with the pushing sucker, and the pushing sucker pushes damaged silicon wafers to the collecting table and collects the silicon wafers.
8. The silicon wafer breakage detecting apparatus according to claim 1, characterized in that: the linking assembly is arranged between the output system and the tail end of the transportation assembly and comprises an upper side bracket, a lower side bracket and a roller between the upper side bracket and the lower side bracket; and the detected silicon wafer is transported to the roller through the transport assembly, enters the output system and is transported out.
9. The method of claim 1, wherein the method comprises: comprises that
The method comprises the following steps: the method comprises the following steps that a tray which is fully loaded with a plurality of groups of silicon wafers to be detected and stacked is transported to a tray placing table through an input system and is ready for detection, and a front-section transportation mechanism and a rear-section transportation mechanism are respectively started;
step two: the sliding platform for fixing the sucker component slides to the position right above the tray placing table, and the telescopic cylinder extends out and drives the sucker to move downwards;
step three: the sucking discs sequentially adsorb the silicon wafers to be detected from the uppermost side, and then sequentially place the adsorbed silicon wafers to be detected on a conveying belt of the front-section conveying mechanism;
step four: when the silicon wafer to be detected is placed, the distances from the outer edges of the two conveyor belts to the two sides of the silicon wafer to be detected are equal, so that the silicon wafer to be detected can be ensured to be positioned between the two conveyor belts and prevented from falling off in the transportation process;
step five: the front-section conveying mechanism is driven by an independent driving assembly and conveys the silicon wafer to be detected into the intermediate transition mechanism, the silicon wafer enters the shell when entering the intermediate transition mechanism, and then the silicon wafer is detected by the X-ray detector;
step six: after the detection is finished, the particles are conveyed to a rear-section conveying mechanism through an intermediate transition mechanism and then collected;
step seven: when the system detects unqualified silicon wafers, the pushing sucker of the damaged piece pushing assembly starts to work, the pushing sucker pushes the unqualified silicon wafers into the collection table to be collected, and then the unqualified silicon wafers are processed in a centralized manner;
step eight: when the detected silicon wafer is proper, the damaged part pushing assembly does not work, and then the damaged part pushing assembly is directly conveyed to the rear section conveying mechanism through the conveying belt and collected;
step nine: wait to detect the silicon chip and be adsorbed one after another in proper order and place and transport in the anterior segment conveying mechanism, then detect, rethread back end conveying mechanism transports, in case there is the silicon chip when carrying out the X-ray detection, anterior segment conveying mechanism continues to transport next and waits to detect the silicon chip and stop until being close to middle transition mechanism this moment, and back end conveying mechanism also moves and transports off finished product silicon chip simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010385489.4A CN111477559A (en) | 2020-05-09 | 2020-05-09 | Silicon wafer damage detection device and detection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010385489.4A CN111477559A (en) | 2020-05-09 | 2020-05-09 | Silicon wafer damage detection device and detection method |
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| CN111477559A true CN111477559A (en) | 2020-07-31 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880737A (en) * | 2021-01-14 | 2021-06-01 | 四川雅吉芯电子科技有限公司 | Integrated system for detecting monocrystalline silicon epitaxial wafer |
| CN117637880A (en) * | 2023-12-07 | 2024-03-01 | 扬州方通电子材料科技有限公司 | Texturing process and equipment for silicon wafer |
-
2020
- 2020-05-09 CN CN202010385489.4A patent/CN111477559A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880737A (en) * | 2021-01-14 | 2021-06-01 | 四川雅吉芯电子科技有限公司 | Integrated system for detecting monocrystalline silicon epitaxial wafer |
| CN117637880A (en) * | 2023-12-07 | 2024-03-01 | 扬州方通电子材料科技有限公司 | Texturing process and equipment for silicon wafer |
| CN117637880B (en) * | 2023-12-07 | 2024-06-07 | 扬州方通电子材料科技有限公司 | Texturing equipment for silicon wafer |
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