CN111309195A - Touch module, manufacturing method thereof and touch display device - Google Patents
Touch module, manufacturing method thereof and touch display device Download PDFInfo
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- CN111309195A CN111309195A CN202010106833.1A CN202010106833A CN111309195A CN 111309195 A CN111309195 A CN 111309195A CN 202010106833 A CN202010106833 A CN 202010106833A CN 111309195 A CN111309195 A CN 111309195A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
A touch module, a manufacturing method thereof and a touch display device are provided, wherein the touch module comprises: first insulating layer, second insulating layer, electrically conductive net layer and bridging layer, electrically conductive net layer includes: the touch control device comprises a plurality of first touch control electrodes and a plurality of second touch control electrodes which are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the adjacent sub-electrodes included in the same second touch electrode are connected through a bridging layer; the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side, close to the bridge layer, of the first insulating layer, a second groove is formed in the second insulating layer, and the conductive grid layer is located in the second groove. The technical scheme that this application provided sets up bridging layer and electrically conductive net layer in the recess of insulating layer for electrically conductive net layer can not break off when the touch-control module is buckled, has improved the bending performance of touch-control screen.
Description
Technical Field
The present disclosure relates to the field of touch technologies, and in particular, to a touch module, a manufacturing method thereof, and a touch display device.
Background
With the rapid development of display technologies, touch screens are more and more widely used, and according to the difference of sensing modes, touch screens can be roughly classified into resistive, capacitive, infrared and acoustic wave types. The capacitive touch screen has the largest market usage, and other technologies are difficult to catch up in a short period, so that the capacitive touch screen becomes the mainstream and future development trend in the touch screen market. The touch screen is provided with touch electrodes.
The inventor finds that the touch electrode in the touch screen in the related art is broken in the bending process, so that the bending performance of the touch screen is poor.
Disclosure of Invention
The application provides a touch module, a manufacturing method thereof and a touch display device, which can improve the bending performance of a touch screen.
In a first aspect, the present application provides a touch module, including: first insulating layer, second insulating layer, electrically conductive net layer and bridging layer, electrically conductive net layer includes: the touch control device comprises a plurality of first touch control electrodes and a plurality of second touch control electrodes which are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the adjacent sub-electrodes included in the same second touch electrode are connected through a bridging layer;
the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side, close to the bridging layer, of the first insulating layer, a second groove is formed in the second insulating layer, and the conductive grid layer is located in the second groove.
In one possible implementation, the second groove includes: the touch panel comprises a plurality of first sub-grooves and a plurality of second sub-grooves, wherein the first sub-grooves correspond to first touch electrodes one to one, the first touch electrodes are positioned in the corresponding first sub-grooves, the second sub-grooves correspond to second touch electrodes one to one, and the second touch electrodes are positioned in the corresponding second sub-grooves;
the second insulating layer is further provided with a through hole, and the sub-electrodes in the second touch electrode are connected with the bridging layer through the through hole.
In a possible implementation manner, the thickness of the first sub-groove is smaller than or equal to the thickness of the second insulating layer, and the thickness of the second sub-groove is smaller than the thickness of the second insulating layer.
In a possible implementation manner, an orthogonal projection of the first sub-groove on the first insulating layer partially overlaps with an orthogonal projection of the first groove on the first insulating layer, and an orthogonal projection of the second sub-groove on the first insulating layer partially overlaps with an orthogonal projection of the first groove on the first insulating layer.
In one possible implementation, the first insulating layer and the second insulating layer are organic layers.
In a possible implementation manner, the first touch electrode and the second touch electrode are metal electrodes, and the bridging layer is made of metal.
In a possible implementation manner, the touch module further includes: a protective layer;
the protective layer is located on one side, far away from the second insulating layer, of the conductive grid layer and used for protecting the conductive grid layer.
In a second aspect, the present application further provides a method for manufacturing a touch module, for manufacturing the touch module, the method includes:
forming a first insulating layer provided with a first groove;
forming a bridging layer in the first groove of the first insulating layer;
forming a second insulating layer provided with a second groove on one side of the first insulating layer close to the bridging layer;
and forming a conductive grid layer connected with the bridging layer in the second groove of the second insulating layer.
In a possible implementation manner, the forming of the first insulating layer with the first groove includes:
forming a first organic thin film;
processing the first organic film through a photoetching process to form a first insulating layer provided with a first groove;
the second insulating layer that forms and set up the second recess on one side that first insulating layer is close to the bridging layer includes:
forming a second organic film on one side of the first insulating layer close to the bridging layer;
and processing the second organic film through a photoetching process to form a second insulating layer provided with a second groove.
In one possible implementation manner, the forming of the bridging layer in the first groove of the first insulating layer includes:
forming a first metal film on the first insulating layer;
processing the first metal film through a composition process to form a bridging layer;
the forming of the conductive mesh layer in the second groove of the second insulating layer includes:
forming a second metal film on the second insulating layer;
and processing the second metal film through a composition process to form the conductive grid layer.
In a possible implementation manner, the processing the second organic thin film through the photolithography process to form the second insulating layer provided with the second groove includes:
processing the second organic film by adopting a first mask through a photoetching process to form a second groove on the second organic film;
and processing the second organic film with the second groove by adopting a second mask through a photoetching process to form a via hole.
In one possible implementation, after the forming the conductive mesh layer in the second groove of the second insulating layer, the method further includes:
forming a protective film on the conductive mesh layer;
processing the protective film through a photoetching process to form an original protective layer;
and baking the original protective layer to form the protective layer.
In a third aspect, the present application further provides a touch display device, including: the touch module is provided.
The application provides a touch module, a manufacturing method thereof and a touch display device, wherein the touch module comprises: first insulating layer, second insulating layer, electrically conductive net layer and bridging layer, electrically conductive net layer includes: the touch control device comprises a plurality of first touch control electrodes and a plurality of second touch control electrodes which are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the adjacent sub-electrodes included in the same second touch electrode are connected through a bridging layer; the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side, close to the bridge layer, of the first insulating layer, a second groove is formed in the second insulating layer, and the conductive grid layer is located in the second groove. The technical scheme that this application provided will be bridged the layer and the electrically conductive net layer sets up in the recess of insulating layer, can release the stress in the layer and between the layer for electrically conductive net layer can not break off when the touch-control module is buckling, has improved the bending performance of touch-control screen.
Drawings
The accompanying drawings are included to provide an understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the examples serve to explain the principles of the disclosure and not to limit the disclosure.
Fig. 1 is a top view of a touch module according to an embodiment of the present disclosure;
FIG. 2A is a cross-sectional view taken along A-A of FIG. 1;
FIG. 2B is a cross-sectional view taken along line B-B of FIG. 1;
FIG. 2C is a cross-sectional view taken along line C-C of FIG. 1;
FIG. 2D is a cross-sectional view taken along D-D of FIG. 1;
FIG. 3 is a top view of a second insulating layer provided in an exemplary embodiment;
fig. 4A is a first cross-sectional view of a touch module according to an exemplary embodiment;
fig. 4B is a second cross-sectional view of a touch module according to an exemplary embodiment;
fig. 4C is a third cross-sectional view of a touch module according to an exemplary embodiment;
fig. 4D is a fourth cross-sectional view of a touch module according to an exemplary embodiment;
fig. 5 is a flowchart of a method for manufacturing a touch module according to an embodiment of the present disclosure;
fig. 6A is a schematic view illustrating a method for manufacturing a touch module according to an exemplary embodiment;
fig. 6B is another schematic view of a method for manufacturing a touch module according to an exemplary embodiment;
fig. 6C is another schematic view of a method for manufacturing a touch module according to an exemplary embodiment.
Detailed Description
The present application describes embodiments, but the description is illustrative rather than limiting and it will be apparent to those of ordinary skill in the art that many more embodiments and implementations are possible within the scope of the embodiments described herein. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Any feature or element of any embodiment may be used in combination with or instead of any other feature or element in any other embodiment, unless expressly limited otherwise.
The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed in the present application may also be combined with any conventional features or elements to form a unique application as defined in the claims. Any feature or element of any embodiment may be combined with features or elements from other applications to form yet another unique application defined by the claims. Thus, it should be understood that any of the features shown and/or discussed in this application may be implemented alone or in any suitable combination. Accordingly, the embodiments are not limited except as by the appended claims and their equivalents. Furthermore, various modifications and changes may be made within the scope of the appended claims.
Further, in describing representative embodiments, the specification may have presented the method and/or process as a particular sequence of steps. However, to the extent that the method or process does not rely on the particular order of steps herein, the method or process should not be limited to the particular sequence of steps. Other orders of steps are possible as will be understood by those of ordinary skill in the art. Therefore, the particular order of the steps set forth in the specification should not be construed as limitations on the claims. Further, the claims directed to the method and/or process should not be limited to the performance of their steps in the order written, and one skilled in the art can readily appreciate that the sequences may be varied and still remain within the spirit and scope of the embodiments of the present application.
Unless otherwise defined, technical or scientific terms used throughout the disclosure of the embodiments of the present application shall have the ordinary meaning as understood by those having ordinary skill in the art to which the present application belongs. The use of "first," "second," and similar terms in the embodiments of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Fig. 1 is a top view of a touch module according to an embodiment of the disclosure, fig. 2A is a cross-sectional view taken along a direction a-a in fig. 1, fig. 2B is a cross-sectional view taken along a direction B-B in fig. 1, fig. 2C is a cross-sectional view taken along a direction C-C in fig. 1, and fig. 2D is a cross-sectional view taken along a direction D-D in fig. 1. As shown in fig. 1 and 2, a touch module provided in an embodiment of the present application includes: a first insulating layer 10, a second insulating layer 20, a bridging layer 30 and a conductive mesh layer 40.
The first insulating layer 10 is provided with a first groove V1, and the bridging layer 30 is located in the first groove V1; the second insulating layer 10 is disposed on one side of the first insulating layer 10 close to the bridging layer 30, and is formed with a second groove V2, and the conductive mesh layer 40 is located in the second groove V2 for connection.
As shown in fig. 1, in one exemplary embodiment, the conductive mesh layer 40 includes: the touch panel includes a plurality of first touch electrodes 41 and a plurality of second touch electrodes 42 arranged in a cross-isolation manner.
Each of the first touch electrodes 41 is a stripe electrode, and each of the second touch electrodes 42 includes: a plurality of independent sub-electrodes 420, and adjacent sub-electrodes included in the same second touch electrode are connected by the bridging layer 30.
In an exemplary embodiment, the first touch electrode may be a driving electrode and the second touch electrode may be a sensing electrode, or the first touch electrode may be a sensing electrode and the second touch electrode is a driving electrode.
The touch module that this application embodiment provided includes: first insulating layer, second insulating layer, electrically conductive net layer and bridging layer, electrically conductive net layer includes: the touch control device comprises a plurality of first touch control electrodes and a plurality of second touch control electrodes which are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the adjacent sub-electrodes included in the same second touch electrode are connected through a bridging layer; the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side, close to the bridge layer, of the first insulating layer, a second groove is formed in the second insulating layer, and the conductive grid layer is located in the second groove. The technical scheme that this application provided will be bridged the layer and the electrically conductive net layer sets up in the recess of insulating layer, can release the stress in the layer and between the layer for electrically conductive net layer can not break off when the touch-control module is buckling, has improved the bending performance of touch-control screen.
Fig. 3 is a top view of the second insulating layer provided in an exemplary embodiment, and as shown in fig. 2A, 2B and 3, the second groove V2 in the second insulating layer 20 includes: the touch panel comprises a plurality of first sub-grooves V21 and a plurality of second sub-grooves V22, wherein the first sub-grooves V21 correspond to the first touch electrodes one by one, the first touch electrodes are located in the corresponding first sub-grooves, the second sub-grooves V22 correspond to the second touch electrodes one by one, and the second touch electrodes are located in the corresponding second sub-grooves.
As shown in fig. 2A, the second insulating layer 20 is further provided with via holes, and the sub-electrodes in the second touch electrode 42 are connected to the bridging layer 30 through the via holes.
In an exemplary embodiment, the depth D1 of the first sub-groove V21 is less than or equal to the thickness H of the second insulating layer 20, and fig. 2B illustrates that the depth of the first sub-groove V21 is equal to the thickness of the second insulating layer.
In one exemplary embodiment, the depth D2 of the second sub-groove V22 is less than the thickness H of the second insulating layer 20.
In an exemplary embodiment, an orthographic projection of the first sub-groove on the first insulating layer partially overlaps with an orthographic projection of the first groove on the first insulating layer, and an orthographic projection of the second sub-groove on the first insulating layer partially overlaps with an orthographic projection of the first groove on the first insulating layer.
In one exemplary embodiment, the first insulating layer and the second insulating layer are organic layers, and the organic layers are made of materials including: a negative photoresist.
The first insulating layer and the second insulating layer adopt organic layers, so that the adhesive force between the first insulating layer and the second insulating layer is enhanced, the processes of deposition, etching, stripping and the like can be reduced, the manufacturing process of the touch module is simplified, and the technical problems of difficulty in slope angle adjustment, poor etching uniformity and easiness in film breakage can be solved.
In a possible implementation manner, the first touch electrode and the second touch electrode are metal electrodes, and the bridging layer is made of metal, where the first touch electrode, the second touch electrode, and the bridging layer may be a single-layer metal structure or a multi-layer metal structure. When the metal structure is a single layer metal structure, the metal may be aluminum, silver, or the like. When the metal structure is a multilayer metal structure, the first touch electrode, the second touch electrode and the bridging layer respectively comprise: the metal layer structure comprises a first metal layer, a second metal layer and a third metal layer which are stacked, wherein the first metal layer and the third metal layer can be made of titanium, and the second metal layer can be made of aluminum.
Because metal material has better ductility, difficult fracture, therefore this application adopts metal material preparation electrically conductive net layer and bridging layer, can improve touch module's the performance of can buckling for touch module is more fit for flexible display device.
Fig. 4A is a first cross-sectional view of a touch module according to an exemplary embodiment, fig. 4B is a second cross-sectional view of a touch module according to an exemplary embodiment, fig. 4C is a third cross-sectional view of a touch module according to an exemplary embodiment, and fig. 4D is a fourth cross-sectional view of a touch module according to an exemplary embodiment, as shown in fig. 4, a touch module according to an exemplary embodiment further includes: and a protective layer 50.
In an exemplary embodiment, the material of the protection layer is an organic material, and the organic material may be a negative photoresist to isolate water and oxygen.
Fig. 5 is a flowchart of a method for manufacturing a touch module according to an embodiment of the present disclosure. As shown in fig. 5, the method for manufacturing a touch module according to the embodiment of the present application is used for manufacturing a touch module, and specifically includes the following steps:
step S1, forming a first insulating layer with a first trench.
Step S2, forming a bridging layer in the first recess of the first insulating layer.
Step S3, forming a second insulating layer with a second groove on a side of the first insulating layer close to the bridge layer.
And step S4, forming a conductive grid layer connected with the bridging layer in the second groove of the second insulating layer.
The manufacturing method of the touch module provided by the embodiment of the application is used for manufacturing the touch module provided by the embodiment, and the implementation principle and the implementation effect are similar and are not repeated herein.
For convenience of explanation, the photolithography process in the embodiment of the present application includes: an exposure and development process, the patterning process comprising: photoresist coating, exposing, developing, etching and stripping processes.
In an exemplary embodiment, step S1 includes: forming a first organic thin film; and processing the first organic film through a photoetching process to form a first insulating layer provided with a first groove.
Forming the first organic thin film includes: a first organic film is coated.
In an exemplary embodiment, step S2 includes: forming a first metal film on the first insulating layer; and processing the first metal film through a composition process to form a bridging layer.
Forming a first metal film on the first insulating layer includes: a first metal film is deposited on the first insulating layer.
In an exemplary embodiment, step S3 includes: forming a second organic film on one side of the first insulating layer close to the bridging layer; and processing the second organic film through a photoetching process to form a second insulating layer provided with a second groove.
Forming a second organic film on a side of the first insulating layer adjacent to the bridge layer includes: and coating a second organic film on one side of the first insulating layer close to the bridging layer.
Processing the second organic film through a photolithography process to form a second insulating layer provided with a second groove, comprising: processing the second organic film by adopting a first mask through a photoetching process to form a second groove on the second organic film; and processing the second organic film with the second groove by adopting a second mask through a photoetching process to form a via hole.
In an exemplary embodiment, step S4 includes: forming a second metal film on the second insulating layer; and processing the second metal film through a composition process to form the conductive grid layer.
After step S4, the method for manufacturing a touch module according to an exemplary embodiment further includes: forming a protective film on the conductive mesh layer; processing the protective film through a photoetching process to form an original protective layer; and baking the original protective layer to form the protective layer.
The following further describes a method for manufacturing the touch module with reference to fig. 6A to 6C.
Step 100, coating a first organic film, and processing the first organic film through a photolithography process to form the first insulating layer 10 with the first groove V1, as shown in fig. 6A.
Step 200, depositing a first metal film on the first insulating layer 10, and processing the first metal film through a patterning process to form a bridging layer 30, as shown in fig. 6B.
Step 300, coating a second organic film on the side of the first insulating layer 10 close to the bridging layer 30, and processing the second organic film through a photolithography process to form the second insulating layer 20 with the second groove V2 and the via hole, as shown in fig. 6C.
Step 400, depositing a second metal film on the second insulating layer 20, and processing the second metal film through a patterning process to form the conductive mesh layer 40, as shown in fig. 2A.
Step 500, forming a protective film on the conductive mesh layer 40; processing the protective film through a photoetching process to form an original protective layer; the original protective layer is baked to form a protective layer 50, as shown in fig. 4A.
An embodiment of the present application further provides a touch display device, including: a touch module.
The touch display device further includes: the touch module is positioned on one side of the display panel.
The touch module is the touch module provided in the foregoing embodiments, and the implementation principle and the implementation effect are similar, and are not described herein again.
In an exemplary embodiment, the touch module may be located at a light emitting side of the display panel, or may be located at a light incident side of the display panel.
In an exemplary embodiment, the display panel may be a display panel applied to a liquid crystal display device, may also be a display panel applied to an organic light emitting diode display device, or may be a display panel applied to other types of display devices.
The drawings of the embodiments of the present application relate only to the structures related to the embodiments of the present application, and other structures may refer to general designs.
In the drawings used to describe embodiments of the present application, the thickness and dimensions of layers or microstructures are exaggerated for clarity. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
Although the embodiments disclosed in the present application are described above, the descriptions are only for the convenience of understanding the present application, and are not intended to limit the present application. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.
Claims (13)
1. A touch module, comprising: first insulating layer, second insulating layer, electrically conductive net layer and bridging layer, electrically conductive net layer includes: the touch control device comprises a plurality of first touch control electrodes and a plurality of second touch control electrodes which are arranged in a crossed and insulated mode; each first touch electrode is a strip electrode, and each second touch electrode comprises: the adjacent sub-electrodes included in the same second touch electrode are connected through a bridging layer;
the first insulating layer is provided with a first groove, and the bridging layer is positioned in the first groove; the second insulating layer is arranged on one side, close to the bridging layer, of the first insulating layer, a second groove is formed in the second insulating layer, and the conductive grid layer is located in the second groove.
2. The touch module of claim 1, wherein the second groove comprises: the touch panel comprises a plurality of first sub-grooves and a plurality of second sub-grooves, wherein the first sub-grooves correspond to first touch electrodes one to one, the first touch electrodes are positioned in the corresponding first sub-grooves, the second sub-grooves correspond to second touch electrodes one to one, and the second touch electrodes are positioned in the corresponding second sub-grooves;
the second insulating layer is further provided with a through hole, and the sub-electrodes in the second touch electrode are connected with the bridging layer through the through hole.
3. The touch module of claim 2, wherein the thickness of the first sub-groove is less than or equal to the thickness of the second insulating layer, and the thickness of the second sub-groove is less than the thickness of the second insulating layer.
4. The touch module of claim 2, wherein an orthogonal projection of the first sub-groove on the first insulating layer partially overlaps an orthogonal projection of the first groove on the first insulating layer, and an orthogonal projection of the second sub-groove on the first insulating layer partially overlaps an orthogonal projection of the first groove on the first insulating layer.
5. The touch module of claim 1, wherein the first insulating layer and the second insulating layer are organic layers.
6. The touch module of claim 1, wherein the first touch electrode and the second touch electrode are metal electrodes, and the bridging layer is made of metal.
7. The touch module of claim 1, further comprising: a protective layer;
the protective layer is located on one side, far away from the second insulating layer, of the conductive grid layer and used for protecting the conductive grid layer.
8. A method for manufacturing a touch module according to any one of claims 1 to 7, the method comprising:
forming a first insulating layer provided with a first groove;
forming a bridging layer in the first groove of the first insulating layer;
forming a second insulating layer provided with a second groove on one side of the first insulating layer close to the bridging layer;
and forming a conductive grid layer connected with the bridging layer in the second groove of the second insulating layer.
9. The method of claim 8, wherein the forming the first insulating layer with the first recess comprises:
forming a first organic thin film;
processing the first organic film through a photoetching process to form a first insulating layer provided with a first groove;
the second insulating layer that forms and set up the second recess on one side that first insulating layer is close to the bridging layer includes:
forming a second organic film on one side of the first insulating layer close to the bridging layer;
and processing the second organic film through a photoetching process to form a second insulating layer provided with a second groove.
10. The method of claim 8, wherein forming a bridging layer within the first recess of the first insulating layer comprises:
forming a first metal film on the first insulating layer;
processing the first metal film through a composition process to form a bridging layer;
the forming of the conductive mesh layer in the second groove of the second insulating layer includes:
forming a second metal film on the second insulating layer;
and processing the second metal film through a composition process to form the conductive grid layer.
11. The method of claim 9, wherein the processing the second organic film by the photolithography process to form the second insulating layer having the second recess comprises:
processing the second organic film by adopting a first mask through a photoetching process to form a second groove on the second organic film;
and processing the second organic film with the second groove by adopting a second mask through a photoetching process to form a via hole.
12. The method of claim 8, wherein after forming the conductive mesh layer within the second recess of the second insulating layer, the method further comprises:
forming a protective film on the conductive mesh layer;
processing the protective film through a photoetching process to form an original protective layer;
and baking the original protective layer to form the protective layer.
13. A touch display device, comprising: the touch module according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010106833.1A CN111309195B (en) | 2020-02-20 | 2020-02-20 | Touch module, manufacturing method thereof and touch display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010106833.1A CN111309195B (en) | 2020-02-20 | 2020-02-20 | Touch module, manufacturing method thereof and touch display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111309195A true CN111309195A (en) | 2020-06-19 |
| CN111309195B CN111309195B (en) | 2023-07-25 |
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| CN112433632A (en) * | 2020-11-19 | 2021-03-02 | 湖北长江新型显示产业创新中心有限公司 | Display panel, preparation method thereof and display device |
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| CN111309195B (en) | 2023-07-25 |
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