CN111261566A - Wafer tray positioning mechanism and wet method fence lifting and fixing device - Google Patents
Wafer tray positioning mechanism and wet method fence lifting and fixing device Download PDFInfo
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- CN111261566A CN111261566A CN201811458751.2A CN201811458751A CN111261566A CN 111261566 A CN111261566 A CN 111261566A CN 201811458751 A CN201811458751 A CN 201811458751A CN 111261566 A CN111261566 A CN 111261566A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title description 11
- 238000003825 pressing Methods 0.000 claims abstract description 72
- 230000009471 action Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 103
- 230000000712 assembly Effects 0.000 description 8
- 238000000429 assembly Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000003014 reinforcing effect Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer tray positioning mechanism and a wet fence lifting and fixing device, wherein the wafer tray positioning mechanism comprises a fixed seat, a mounting seat, a first driving part, a supporting assembly and a pressing assembly; the first driving part is arranged on the fixed seat and connected with the mounting seat, and the first driving part is used for driving the mounting seat to move along a first direction; the pressing component and the supporting component are respectively arranged on the mounting seat; the supporting component comprises a supporting part, the supporting part is used for supporting a wafer tray which is taken out of a finished wafer, the pressing component comprises a pressing part, the pressing part is used for pressing the wafer tray which is taken out of the finished wafer, the distance between the supporting part and the pressing part can be adjusted along a second direction, and the first direction is perpendicular to the second direction. The technical scheme of the invention effectively solves the problem that the wet fence in the prior art has the defect that the deformation of a wafer tray in a lifting and fixing device affects the production efficiency.
Description
Technical Field
The invention relates to the technical field of wet fence tools, in particular to a wafer tray positioning mechanism and a wet fence tool lifting and fixing device.
Background
In the solar cell manufacturing industry, the lifting and fixing device of the fence in the wet equipment can also be applied to the field of semiconductors.
The wet column is a special carrier for loading the wafer with the film. In the manufacturing process of the thin film battery, the wafer needs to be placed in the wet process fence, and after the wet process treatment, the wafer needs to be taken out of the wet process fence. The wet column is formed by stacking wafer trays layer by layer, and each wafer tray can be used for holding a wafer. When the wafer is put in and taken out, the wafer tray on the upper layer needs to be lifted up, and the corresponding action can be finished.
In the wet process, the wafer tray is soaked in high-temperature chemical liquid, and the wafer tray is deformed after long-term accumulation in a process from normal temperature to high temperature and then to normal temperature.
In the prior art, the robot arm only loads or unloads one wafer at a time. 2 or more wafers are loaded or unloaded simultaneously for efficiency. However, the wafer trays of the same layer cannot be guaranteed to be in one plane due to the deformation of the wafer trays. Due to the deformation of the wafer tray, when wafers are loaded or unloaded, the robot arm collides with the wafer tray, thereby reducing the production efficiency. Wafer tray deformation may also cause the wafer tray to jam on the guides of the wet fence. In the prior art, if this happens, the robot cannot continue to load or unload wafers, and must be shut down and manual processing resumed.
Disclosure of Invention
The invention mainly aims to provide a wafer tray positioning mechanism and a wet fence lifting and fixing device, so as to solve the problem that the production efficiency is influenced by the deformation of a wafer tray in the wet fence lifting and fixing device in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided a wafer tray positioning mechanism including a fixing base, a mounting base, a first driving portion, a lifting assembly, and a pressing assembly; the first driving part is arranged on the fixed seat and connected with the mounting seat, and the first driving part is used for driving the mounting seat to move along a first direction; the pressing component and the supporting component are respectively arranged on the mounting seat; the supporting component comprises a supporting part, the supporting part is used for supporting a wafer tray which is taken out of a finished wafer, the pressing component comprises a pressing part, the pressing part is used for pressing the wafer tray which is taken out of the finished wafer, the distance between the supporting part and the pressing part can be adjusted along a second direction, and the first direction is perpendicular to the second direction.
Further, the pushing assembly further comprises a second driving portion, the second driving portion is fixed on the mounting seat, the pushing portion is mounted on the second driving portion, and the second driving portion drives the pushing portion to move along the second direction.
Further, the second driving part comprises an air cylinder and a piston rod, the pressing part comprises a pressing plate, and the pressing plate is arranged at the free end of the piston rod.
Furthermore, the pressing plate comprises a first plane and a second plane which are parallel to each other, the first plane is connected with the free end of the piston rod, a third plane is arranged between the first plane and the second plane and in transitional connection with the second plane, and the third plane is pressed against the wafer tray under the action of the second driving part.
Furthermore, the pressing assemblies and the supporting assemblies are respectively multiple, the pressing assemblies respectively comprise a second driving part, and each pressing plate in the pressing assemblies corresponds to each row of wafer trays.
Further, a sliding rail assembly is arranged between the fixed seat and the mounting seat, and the mounting seat moves along the first direction through the sliding rail assembly.
According to another aspect of the present invention, there is provided a wet fence lifting and fixing device, comprising a wet fence mechanism and a wafer tray positioning mechanism fixed on the wet fence mechanism, wherein the wafer tray positioning mechanism is the above wafer tray positioning mechanism.
Furthermore, the wet fence mechanism comprises a third driving part and a fence tray driven by the third driving part, the fence tray is used for bearing the fence, the third driving part is fixedly arranged on the frame, the movable end of the third driving part is connected with the fence tray, and the third driving part drives the fence tray to move along the second direction.
Furthermore, the fence tray also comprises a fixing device, and the fixing device is used for fixing the wet fence. Furthermore, the wet fence lifting and fixing device comprises a first wafer tray positioning mechanism and a second wafer tray positioning mechanism, wherein the first wafer tray positioning mechanism and the second wafer tray positioning mechanism are symmetrically arranged relative to the wet fence.
When the technical scheme of the invention is applied, the first driving part drives the mounting seat, the mounting seat drives the supporting component and the pressing component to enter the space between the wafer trays, then the distance between the supporting component and the pressing component is increased, the pressing component presses the lower wafer tray, and the supporting component supports the wafer tray. When the wafer tray is deformed, the interference between the manipulator and the wafer tray when the manipulator loads the wafer into the column tool and the interference between the manipulator and the wafer or the wafer tray when the manipulator unloads the wafer from the column tool are avoided, and therefore the production efficiency is improved. The technical scheme of the invention effectively solves the problem that the wet fence in the prior art has the defect that the deformation of a wafer tray in a lifting and fixing device affects the production efficiency.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 illustrates a perspective view of an embodiment of a wet fence lifting fixture according to the present invention;
FIG. 2 shows a partial schematic view of another angle of the wet fence lifting fixture of FIG. 1;
FIG. 3 shows a schematic top view of the fence tray of the wet fence lifting fixture of FIG. 1;
FIG. 4 shows a schematic cross-sectional C-C view of the fence tray of FIG. 3;
FIG. 5 is a schematic perspective view of the wafer tray positioning mechanism of the wet fence of FIG. 1;
FIG. 6 is a schematic perspective view of the wet fence lifting fixture of FIG. 1; and
fig. 7 shows a perspective view of a wafer tray.
Wherein the figures include the following reference numerals:
10. a fixed seat; 20. a mounting seat; 30. a first driving section; 40. supporting the assembly; 50. pressing the assembly; 60. a second driving section; 70. a frame; 80. a wet fence tool; 90. a lifting assembly; 91. a fence tray; 92. a third driving section; 100. and a wafer tray.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 to 7, the wafer tray positioning mechanism of the present embodiment includes: the fixing seat 10, the mounting seat 20, the first driving part 30, the lifting assembly 40 and the pressing assembly 50. The first driving part 30 is installed on the fixing base 10 and connected to the mounting base 20, and the first driving part 30 is used for driving the mounting base 20 to move along a first direction. The hold-down assembly 50 and the hold-up assembly are respectively disposed on the mount 20. The supporting component 40 comprises a supporting part, the supporting part is used for supporting the wafer tray 100 which is taken out of the wafer, the pressing component 50 comprises a pressing part, the pressing part is used for pressing the wafer tray 100 which is to be taken out of the wafer, the distance between the supporting part and the pressing part can be adjusted along the second direction, and the first direction is perpendicular to the second direction.
When the technical scheme of the embodiment is applied, the first driving part 30 drives the mounting seat 20, the mounting seat 20 drives the supporting component 40 and the pressing component 50 to enter between the wafer trays 100, then the distance between the supporting component 40 and the pressing component 50 is increased, the pressing component 50 presses the wafer tray 100 at the lower part, and the supporting component 40 supports the wafer tray 100. When the wafer tray 100 is deformed, the robot arm may interfere with the wafer tray when loading the wafer into the column, and may interfere with the wafer or the wafer tray when unloading the wafer from the column.
It should be noted that the first direction is a horizontal direction, and the second direction is a vertical direction.
As shown in fig. 1, 2 and 5, in the solution of the present embodiment, the pressing assembly 50 includes a second driving portion 60, and the second driving portion 60 is fixed on the mounting base 20. The pressing part is mounted on the second driving part 60, and the second driving part 60 drives the pressing part to move in the second direction. The increase in the distance between the lifting portion and the pressing portion is caused by the second driving portion 60 driving the pressing portion such that the pressing portion presses against the wafer tray 100, so that the wafer tray 100 is not easily deformed. The wafer tray 100 is placed on the bottom fence tray 91 by gravity, and the pressing portion applies downward force, so that the wafer tray 100 is not easily deformed.
As shown in fig. 5, in the solution of the present embodiment, the second driving portion 60 includes a cylinder and a piston rod, and the pressing assembly 50 includes a pressing plate disposed at a free end of the piston rod.
As shown in fig. 5, in the technical solution of this embodiment, the lower surface of the pressure plate has a step structure, the pressure plate includes a first plane and a second plane parallel to each other, the first plane is connected to the free end of the piston rod, a third plane is further included between the first plane and the second plane, the third plane is in transition connection with the second plane, and the third plane is pressed against the wafer tray 100 under the action of the second driving portion 60. Specifically, the pressing plates press the corners of the wafer trays 100, a plurality of rows of vertically placed wafer trays 100 are arranged in the same wet fence, the pressing plate in the middle is wider, two rows of wafer trays 100 can be pressed simultaneously, and the pressing plates at the two ends only press one row of wafer trays 100.
As shown in fig. 5, in the solution of the present embodiment, the pressing assemblies 50 and the lifting assemblies 40 are respectively provided in plurality, the pressing assemblies 50 respectively include one second driving portion 60, and each pressing plate of the pressing assemblies 50 corresponds to each column of the wafer tray 100. The present embodiment further includes a control system, which controls the lifting assembly 40 and the pressing assembly 50, so that the control of the lifting assembly and the pressing assembly is more precise.
As shown in fig. 5, in the solution of the present embodiment, the lifting assembly 40 includes a supporting plate, and the supporting plate is fixed on the mounting base 20. The structure has the advantages of low processing cost, convenient arrangement and easy operation.
As shown in fig. 5, in the technical solution of this embodiment, the upper surface of the pallet has a step structure, and the thickness of the front end of the pallet is smaller than the thickness of the rear end of the pallet. The supporting plate comprises a fourth plane and a fifth plane which are parallel to each other, the fourth plane is connected with the mounting seat 20 through a connecting part, a sixth plane is further arranged between the fourth plane and the fifth plane, the sixth plane is in transition connection with the fifth plane, and the sixth plane supports the wafer tray 100 on the upper portion.
As shown in fig. 5, in the solution of the present embodiment, a sliding rail assembly is disposed between the fixed seat 10 and the mounting seat 20, and the mounting seat 20 moves along a first direction through the sliding rail assembly. A sliding rail assembly is arranged between the fixed seat 10 and the mounting seat 20, so that the mounting seat 20 can move according to a preset track on one hand, and the friction force between the fixed seat 10 and the mounting seat 20 is reduced on the other hand. Specifically, the fixing base 10 and the mounting base 20 are both plate-shaped structures.
As shown in fig. 5, in the technical solution of this embodiment, the slide rail assembly includes a slide rail and a slide groove, the slide rail is disposed on the fixing base 10, and the slide groove is disposed on the mounting base 20. The structure has low processing cost, and particularly, the sliding groove can be a dovetail groove, so that the relative movement of the fixed seat 10 and the mounting seat 20 is more accurate.
As shown in fig. 1, the present application further provides a wet fence lifting and fixing device, which includes a wet fence mechanism and a wafer tray positioning mechanism fixed on the wet fence mechanism. The wafer tray positioning mechanism is the wafer tray positioning mechanism. The wafer tray with the wet fence lifting and fixing device is not easy to deform and high in use efficiency.
This application wet process fence utensil mechanism includes third drive division and the fence utensil tray 91 by the drive of third drive division, and fence utensil tray 91 is used for bearing the fence utensil, and the fixed setting of third drive division is on frame 70, and the expansion end of third drive division links to each other with fence utensil tray 91, and third drive division drive fence utensil tray 91 moves along the second direction.
The fence tray 91 of the present application further comprises a fixing device for fixing the wet fence.
The wet fence mechanism of the present application further comprises a lifting assembly 90 and a fixing device on the lifting assembly for fixing the wet fence. The structure is stable and occupies small space.
The lifting assembly 90 of the present application includes a third driving portion and a fence tray 91 driven by the third driving portion, the third driving portion is disposed on the frame 70, and the fence tray 91 is connected to the third driving portion, so that the third driving portion drives the fence tray 91 to move along the second direction. The structure has lower processing cost and convenient operation. Specifically, lifting unit 90 still includes the lead screw, and the drive lead screw of third drive division, lead screw and fence utensil tray 91 link to each other, and the lead screw drives fence utensil tray 91 and reciprocates. The fence tray 91 includes a tray bottom plate, two tray side plates, four tray reinforcing plates, and two tray bottom reinforcing plates. The fixing device comprises two plane rotary clamping cylinders. Two tray curb plates, four tray reinforcing plates, two tray bottom reinforcing plates are all fixed mounting on the tray bottom plate. Two plane gyration die clamping cylinders install on the tray bottom plate, and when wet process fence utensil was placed on the tray bottom plate of fence utensil tray, two plane gyration die clamping cylinders can press from both sides the clamp tightly fixedly to the bottom plate of wet process fence utensil.
The wafer tray positioning mechanism of the application is a plurality of. This makes the stress on the wafer tray 100 more uniform, and specifically, the wafer tray positioning mechanism is two: the first wafer tray positioning mechanism and the second wafer tray positioning mechanism are symmetrically arranged on two sides of the wet fence.
The wet fence has an initial state of a lifting and fixing device: the piston rods of the first and second drive portions 30, 60 are both in an unextended state; the tray bottom plate is at the lowest position; the plane rotary clamping cylinder is positioned at an avoidance position;
step 1, a carrying mechanism of the wet fence 80 places the wet fence 80 on a tray bottom plate of a fence tray;
step 2, moving and clamping a bottom plate of the fixed wet fence 80 by a plane rotary clamping cylinder;
step 3, the carrying mechanism of the wet-method fence 80 is separated;
step 4, the fence tray moves upwards, and the wet fence 80 is brought to the fixing position of the first layer of wafer tray 100;
step 5, the piston rod of the first driving part 30 extends out, and the supporting plate and the pressing plate enter the gap between the first layer wafer tray and the second layer wafer tray;
step 6, the lifting assembly 90 descends for a certain distance, and the first layer of wafer tray falls onto the supporting plate and is fixedly dragged;
step 7, extending the piston rod of the second driving part 60 to make the pressing plate press the second layer wafer tray;
step 8, the wafer is loaded to or unloaded from the second layer wafer tray by the mechanical arm and then leaves;
step 9, retracting the piston rod of the second driving part 60 to separate the pressing plate from the second layer of wafer tray;
step 11, retracting a piston rod of the first driving part, wherein the supporting plate and the pressing plate are both far away from the wafer tray 100;
step 12, the lifting assembly 90 moves upwards, and the wet fence 80 moves to the fixing position of the second layer wafer tray;
at this time, the wafers of the second layer wafer tray are loaded or unloaded and are ready for the third time wafer tray loading or unloading. And repeating the actions of the steps 5-12, and sequentially completing the loading or unloading of the wafer trays from the third layer to the last layer.
When the loading or unloading of the last layer of wafer tray is completed and the piston rod of the first driving part 30 is already in the retracted state, the lifting assembly 90 moves downward to place the pallet at the lowermost position.
The plane rotary clamping cylinder moves away from the bottom plate of the wet fence 80 and is in a dodging position.
The wet fence 80 is removed by the wet fence 80 handling mechanism.
At this point, the loading or unloading of a wafer from a wet column 80 is complete.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A wafer tray positioning mechanism is characterized by comprising a fixed seat (10), a mounting seat (20), a first driving part (30), a supporting assembly (40) and a pressing assembly (50); the first driving part (30) is installed on the fixed seat (10) and connected with the installation seat (20), and the first driving part (30) is used for driving the installation seat (20) to move along a first direction; the pressing component (50) and the supporting component (40) are respectively arranged on the mounting seat (20); the supporting component (40) comprises a supporting part, the supporting part is used for supporting a wafer tray (100) which is taken out of the wafer, the pressing component (50) comprises a pressing part, the pressing part is used for pressing the wafer tray (100) which is taken out of the wafer to be taken out, the distance between the supporting part and the pressing part can be adjusted along a second direction, and the first direction is perpendicular to the second direction.
2. The wafer tray positioning mechanism according to claim 1, wherein the pressing assembly (50) further comprises a second driving part (60), the second driving part (60) being fixed to the mounting base (20), the pressing part being mounted on the second driving part (60), the second driving part (60) driving the pressing part to move in the second direction.
3. The wafer tray positioning mechanism of claim 2, wherein the second drive section (60) comprises a cylinder and a piston rod, and the hold-down section comprises a pressure plate disposed at a free end of the piston rod.
4. The wafer tray positioning mechanism according to claim 3, wherein the pressing plate comprises a first plane and a second plane parallel to each other, the first plane is connected to the free end of the piston rod, a third plane is further included between the first plane and the second plane, the third plane is in transition connection with the second plane, and the third plane is pressed against the wafer tray (100) under the action of the second driving part (60).
5. The wafer tray positioning mechanism according to claim 3, wherein the pressing units (50) and the lifting units (40) are plural, the plural pressing units (50) include one second driving portion (60), and the pressing plates of the plural pressing units (50) correspond to the respective columns of wafer trays (100).
6. A wafer tray positioning mechanism according to claim 1, characterized in that a slide assembly is provided between the holder (10) and the mounting seat (20), by which slide assembly the mounting seat (20) is moved in the first direction.
7. A wet fence lifting and fixing device, which comprises a wet fence mechanism and a wafer tray positioning mechanism fixed on the wet fence mechanism, wherein the wafer tray positioning mechanism is the wafer tray positioning mechanism in any one of claims 1 to 6.
8. The wet fence lifting fixing device of claim 7, wherein the wet fence mechanism comprises a third driving part and a fence tray (91) driven by the third driving part, the fence tray (91) is used for carrying fences, the third driving part is fixedly arranged on a frame (70), a movable end of the third driving part is connected with the fence tray (91), and the third driving part drives the fence tray (91) to move along the second direction.
9. The wet fence lifting fixture as claimed in claim 8, wherein said fence tray (91) further comprises a fixture for holding the wet fence.
10. The wet fence lifting fixture of claim 9 wherein said wet fence lifting fixture comprises a first wafer tray positioning mechanism and a second wafer tray positioning mechanism, said first wafer tray positioning mechanism and said second wafer tray positioning mechanism being symmetrically disposed with respect to said wet fence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458751.2A CN111261566A (en) | 2018-11-30 | 2018-11-30 | Wafer tray positioning mechanism and wet method fence lifting and fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458751.2A CN111261566A (en) | 2018-11-30 | 2018-11-30 | Wafer tray positioning mechanism and wet method fence lifting and fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111261566A true CN111261566A (en) | 2020-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811458751.2A Pending CN111261566A (en) | 2018-11-30 | 2018-11-30 | Wafer tray positioning mechanism and wet method fence lifting and fixing device |
Country Status (1)
| Country | Link |
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| CN (1) | CN111261566A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100244877A1 (en) * | 2007-11-22 | 2010-09-30 | Semics Inc. | Method and apparatus for controlling position of z-axis for wafer prober |
| CN103187348A (en) * | 2011-12-31 | 2013-07-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer fixed device, semiconductor device and wafer fixed method |
| CN103594406A (en) * | 2013-11-05 | 2014-02-19 | 中国电子科技集团公司第四十五研究所 | Self-centering positioning chuck and centering positioning method of semiconductor wafer |
| CN209150071U (en) * | 2018-11-30 | 2019-07-23 | 东泰高科装备科技有限公司 | Chip tray positioning mechanism and wet process column tool promote fixed device |
-
2018
- 2018-11-30 CN CN201811458751.2A patent/CN111261566A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100244877A1 (en) * | 2007-11-22 | 2010-09-30 | Semics Inc. | Method and apparatus for controlling position of z-axis for wafer prober |
| CN103187348A (en) * | 2011-12-31 | 2013-07-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer fixed device, semiconductor device and wafer fixed method |
| CN103594406A (en) * | 2013-11-05 | 2014-02-19 | 中国电子科技集团公司第四十五研究所 | Self-centering positioning chuck and centering positioning method of semiconductor wafer |
| CN209150071U (en) * | 2018-11-30 | 2019-07-23 | 东泰高科装备科技有限公司 | Chip tray positioning mechanism and wet process column tool promote fixed device |
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Effective date of registration: 20210115 Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208 Applicant after: Zishi Energy Co.,Ltd. Address before: Room a129-1, No. 10, Zhongxing Road, science and Technology Park, Changping District, Beijing Applicant before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd. |
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