CN111230249A

CN111230249A - Laser tin ball welding machine

Info

Publication number: CN111230249A
Application number: CN202010241426.1A
Authority: CN
Inventors: 陈灿华; 卢国洪; 任向阳; 姚国华; 金旺雄; 孙金锁; 邓春华
Original assignee: World Precision Manufacturing Dongguan Co Ltd
Current assignee: World Precision Manufacturing Dongguan Co Ltd
Priority date: 2020-03-30
Filing date: 2020-03-30
Publication date: 2020-06-05

Abstract

The invention provides a laser tin ball welding machine, which comprises a supporting platform, a moving mechanism, a laser welding mechanism, a first vision system and a product placing table, wherein the laser welding mechanism comprises a shell, a welding disc assembly, a welding nozzle, a first sliding mechanism, a first PZT driving mechanism and a laser emitter, the shell is connected with the moving mechanism, the welding disc assembly is arranged in the shell, the welding disc assembly is provided with a laser channel, the welding nozzle is arranged at the bottom of the welding disc assembly and protrudes out of the shell, the first sliding mechanism is arranged at the upper part of the welding disc assembly in a sliding and adjusting manner, the first PZT driving mechanism comprises a first power supply assembly and first piezoelectric ceramics, the first power supply assembly is connected with the first piezoelectric ceramics, the first piezoelectric ceramics is connected with the first sliding mechanism, the laser emitter is arranged on the first sliding mechanism and positioned above the laser channel, the first piezoelectric ceramics are electrified by the first power supply assembly, so that the first piezoelectric ceramic drives the first sliding mechanism to slide together with the laser emitter.

Description

Laser tin ball welding machine

Technical Field

The invention relates to the field of solder ball welding, in particular to a laser solder ball welding machine.

Background

At present, soldering is very popular in industrial production, and with the development of technology and the rapid rise of labor cost, the soldering mode that automatic soldering equipment for solder balls replaces the traditional manual operation electric soldering iron becomes the main direction of the development of the soldering technology. The laser tin ball welding is to irradiate the tin ball in the welding nozzle in the tin plate by using a laser beam with high energy density as a heat source so as to rapidly melt the tin ball, and then remove the laser irradiation so as to solidify the melted tin ball and further complete the welding. If the laser beam deviates from the solder ball and is not irradiated onto the solder ball, the solder ball cannot be melted, and the solder ball cannot be welded. In the existing laser solder ball welding equipment, the position of a laser emitter is generally adjusted by manually adjusting a fine adjustment screw of an XY sliding platform, so that a laser beam emitted by the laser emitter is aligned with the solder ball, and the solder ball is melted. However, this method has the following problems: firstly, the centering adjustment precision of manual fine adjustment is low, the operation is troublesome, and the labor cost is high; secondly, the solder balls are not effectively dropped into the welding channel and are taken away by the disc, the balls remain in the ball dividing holes of the disc, so that the solder balls rub against the substrate and the bottom plate, the friction increases torque, and even the disc is clamped, so that the disc cannot continue to rotate, the worn-out solder balls cause tin slag to cause pollution, and even the worn-out solder balls are sent into the working ball position again for welding, so that the welding of a bad product is caused, and the production efficiency is influenced.

Therefore, a laser solder ball welding machine which can automatically adjust laser alignment and automatically weld is urgently needed.

Disclosure of Invention

The invention aims to provide a laser solder ball welding machine which can automatically adjust laser centering and automatically weld.

In order to achieve the purpose, the invention provides a laser solder ball welding machine which comprises a supporting platform, a moving mechanism, a laser welding mechanism, a first vision system and a product placing table, wherein the moving mechanism is arranged on the supporting platform; the laser welding mechanism comprises a shell, a welding disc assembly, a welding nozzle, a first sliding mechanism, a first PZT driving mechanism and a laser emitter, wherein the shell is connected with the moving mechanism, the moving mechanism can drive the shell to move, the welding disc assembly is arranged in the shell, the welding disc assembly is provided with a laser channel, the welding nozzle is arranged at the bottom of the welding disc assembly and protrudes out of the shell, the welding nozzle is provided with a welding channel, the welding channel is communicated with the laser channel, the first sliding mechanism is arranged at the upper part of the welding disc assembly in a sliding and adjusting manner, the first PZT driving mechanism comprises a first power supply assembly and a first piezoceramic, the first power supply assembly is connected with the first piezoceramic, the first piezoceramic is connected with the first sliding mechanism, and the laser emitter is arranged on the first sliding mechanism and is positioned above the laser channel, electrifying the first piezoelectric ceramic by the first power supply assembly so that the first piezoelectric ceramic drives the first sliding mechanism to slide together with the laser emitter; the first vision system is arranged on the supporting platform and is used for observing the light spot of the laser emitted by the laser emitter and the central position of the welding tip; the product placing table is arranged on the supporting platform and used for placing products to be welded.

Preferably, the moving mechanism includes an X-axis moving assembly, a Y-axis moving assembly and a Z-axis moving assembly, the X-axis moving assembly is disposed on the supporting platform, the Y-axis moving assembly is vertically disposed on the X-axis moving assembly, the Z-axis moving assembly is vertically disposed on the Y-axis moving assembly, and the housing is disposed on the Z-axis moving assembly.

Preferably, the first sliding mechanism includes a first seat and a first sliding member, the first seat is disposed on the welding disc assembly, the first sliding member is slidably disposed on the first seat, the first piezoelectric ceramic is disposed on the first seat and is in abutting connection with the first sliding member, and the laser emitter is connected with the first sliding member.

Preferably, the first PZT driving mechanism further includes a first amplifier, the middle portion of the first amplifier is pivotally connected to the first base, the first amplifier is located between the first piezoelectric ceramic and the first sliding member, the first piezoelectric ceramic is in abutting connection with one end of the first amplifier, the other end of the first amplifier is in abutting connection with the first sliding member, and a force arm of the first piezoelectric ceramic acting on the first amplifier is shorter than a force arm of the first sliding member acting on the first amplifier.

Preferably, the laser welding mechanism further includes a second sliding mechanism and a second PZT driving mechanism, the second sliding mechanism is slidably and adjustably disposed on the upper portion of the welded disc assembly, the first sliding mechanism is disposed on the second sliding mechanism, the second PZT driving mechanism includes a second power supply assembly and a second piezoelectric ceramic, the second power supply assembly is connected to the second piezoelectric ceramic, the second piezoelectric ceramic is connected to the second sliding mechanism, and the second piezoelectric ceramic is powered on by the second power supply assembly, so that the second piezoelectric ceramic drives the second sliding mechanism to slide.

Preferably, the second sliding mechanism includes a second seat and a second sliding member, the second seat is disposed on the welded disc assembly, the second sliding member is slidably disposed on the second seat, the second piezoelectric ceramic is disposed on the second seat and is in abutting connection with the second sliding member, and the first sliding mechanism is disposed on the second sliding member.

Preferably, the second PZT driving mechanism further includes a second amplifier, the middle of the second amplifier is pivotally connected to the second base, the second amplifier is located between the second piezoelectric ceramic and the second sliding member, the second piezoelectric ceramic is connected to one end of the second amplifier in an abutting manner, the other end of the second amplifier is connected to the second sliding member in an abutting manner, and a force arm of the second piezoelectric ceramic acting on the second amplifier is shorter than a force arm of the second sliding member and the second amplifier.

Preferably, the welding disc assembly comprises a lower substrate, a ball dividing disc, an upper substrate and a rotation driving mechanism, the lower substrate, the ball dividing disc and the upper substrate are sequentially stacked from bottom to top, the laser channel penetrates through the lower substrate and the upper substrate, the welding nozzle is installed at the bottom of the lower substrate, the lower substrate is provided with a blanking channel and a slag discharging groove opening, one end of the blanking channel forms a blanking opening on the upper surface of the lower substrate, the other end of the blanking channel is communicated with the laser channel, the slag discharging groove opening is located on the upper surface of the lower substrate, the ball dividing disc is provided with a plurality of ball dividing holes along the circumferential direction, the upper substrate is provided with a feeding channel, the feeding channel forms a feeding outlet on the lower surface of the upper substrate, and the blanking opening, the slag discharging groove opening and the feeding outlet are respectively opposite to the circumferential line where the ball dividing holes are located, the output end of the rotation driving mechanism penetrates through the upper substrate and is connected with the ball distributing disc, and the rotation driving mechanism drives the ball distributing disc to rotate so that the solder balls in the ball distributing holes, which do not fall into the blanking port, fall into the deslagging notch.

Preferably, the mobile phone further comprises a second vision system, the second vision system is connected with the shell, and the second vision system is used for photographing and positioning the product on the product placing table.

Preferably, the solder ball collection box is arranged on the support platform and used for collecting solder balls.

Compared with the prior art, the laser welding mechanism of the laser solder ball welding machine is provided with the first vision system, the first sliding mechanism and the first PZT driving mechanism, the first vision system is used for observing and analyzing the light spot of laser emitted by the laser emitter and the central position of the welding nozzle, and the first power supply assembly is used for electrifying the first piezoelectric ceramic according to the analysis result, so that the first piezoelectric ceramic converts an electric signal into mechanical displacement and drives the first sliding mechanism to slide, the first sliding mechanism drives the laser emitter to slide together, the position of a laser beam emitted by the laser emitter is finely adjusted, the laser beam and the welding nozzle are accurately aligned, automatic adjustment of laser alignment is realized, and the laser beam can be emitted onto the solder ball and can melt the solder ball; the laser tin ball welding machine can drive the laser welding mechanism to move through the moving mechanism, so that the welding nozzle of the laser welding mechanism moves to the position corresponding to the welded product, the automatic welding of the product is realized, and the welding quality is high.

Drawings

FIG. 1 is a schematic perspective view of a laser solder ball bonding machine according to the present invention.

FIG. 2 is a schematic view of the laser solder ball bonding machine of the present invention with the frame removed.

FIG. 3 is a schematic structural diagram of a laser welding mechanism of the laser solder ball welding machine of the present invention.

Fig. 4 is a schematic view of the construction of the weld disc assembly of the laser welding mechanism of the present invention.

Fig. 5 is an exploded view of a weld disc assembly of the laser welding mechanism of the present invention.

Fig. 6 is a cross-sectional view of a weld disc assembly of the laser welding mechanism of the present invention.

Fig. 7 is an enlarged view at a in fig. 6.

Fig. 8 is a schematic structural view of a ball-separating disk of the laser welding mechanism of the present invention.

Fig. 9 is another cross-sectional view of a weld disc assembly of the laser welding mechanism of the present invention.

Fig. 10 is an enlarged view at B in fig. 9.

Fig. 11 is a schematic view of the laser welding mechanism of the present invention with the housing removed.

Fig. 12 is a functional block diagram of the first PZT driving mechanism of the present invention.

Figure 13 is a functional block diagram of the second PZT driving mechanism of the present invention.

FIG. 14 is a schematic view of the first vision system, the product placement platform and the solder ball collection box according to the present invention.

Detailed Description

In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.

Referring to fig. 1 to 3 and fig. 11 to 12, a laser solder ball welding machine 100 of the present invention includes a frame 101, a supporting platform 1, a moving mechanism 2, a laser welding mechanism 3, a first vision system 4 and a product placing table 5. The supporting platform 1 is arranged in the frame 101; the moving mechanism 2 is arranged on the supporting platform 1; the laser welding mechanism 3 comprises a shell 31, a welding disc assembly 32, a welding nozzle 33, a first sliding mechanism 34, a first PZT driving mechanism 35 (PZT), and a laser emitter 36, wherein the shell 31 is connected with the moving mechanism 2, the moving mechanism 2 can drive the shell 31 to move, the welding disc assembly 32 is arranged in the shell 31, the welding disc assembly 32 is provided with a laser channel 321, the welding nozzle 33 is arranged at the bottom of the welding disc assembly 32 and protrudes out of the shell 31, the welding nozzle 33 is provided with a welding channel 331, the upper end of the welding channel 331 is communicated with the laser channel 321, the lower end of the welding channel 331 forms a solder ball welding outlet, the first sliding mechanism 34 is arranged at the upper part of the welding disc assembly 32 in a sliding and adjusting manner, the first PZT driving mechanism 35 comprises a first power assembly 351 and a first piezoceramic 352, the first power assembly 351 is connected with the first piezoceramic 352, the first piezoceramic 352 is connected with the first sliding mechanism 34, the laser emitter 36 is disposed on the first sliding mechanism 34 and above the laser channel 321, and the first piezoelectric ceramic 352 is powered by the first power module 351, so that the first piezoelectric ceramic 352 drives the first sliding mechanism 34 to slide together with the laser emitter 36; the first vision system 4 is arranged on the supporting platform 1, and the first vision system 4 is used for observing the light spot of the laser and the central position of the welding tip 33; the product placing table 5 is arranged on the supporting platform 1 and is used for placing products to be welded. The first vision system 4 may be an existing CCD vision system or the like.

Referring to fig. 1 and 3, the first vision system 4 observes and analyzes the light spot of the laser and the center position of the welding tip 33, and according to the analysis result, the first power module 351 is used to energize the first piezoelectric ceramic 352, so that the first piezoelectric ceramic 352 converts the electrical signal into a mechanical displacement and drives the first sliding mechanism 34 to slide, so that the first sliding mechanism 34 drives the laser emitter 36 to slide together, and further, the position of the laser beam emitted by the laser emitter 36 is finely adjusted, so that the laser beam is accurately aligned with the welding tip 33, the automatic adjustment of laser alignment is realized, the laser beam can be ensured to be emitted onto the solder ball and melt the solder ball, the moving mechanism 2 can drive the laser welding mechanism 3 to move, so that the welding tip 33 of the laser welding mechanism 3 moves to a position corresponding to the welded product, and the automatic welding of the product is realized. Specifically, the rack 101 is provided with a display operation mechanism 8, a controller, and the like.

Referring to fig. 2, in the embodiment, the moving mechanism 2 includes an X-axis moving assembly 21, a Y-axis moving assembly 22 and a Z-axis moving assembly 23, the X-axis moving assembly 21 is disposed on the supporting platform 1, the Y-axis moving assembly 22 is vertically disposed on the X-axis moving assembly 21, the Z-axis moving assembly 23 is vertically disposed on the Y-axis moving assembly 22, and the housing 31 is disposed on the Z-axis moving assembly 23. The laser welding mechanism 3 is driven to move in a three-dimensional space by the X-axis moving unit 21, the Y-axis moving unit 22, and the Z-axis moving unit 23 so as to weld the products of the product placing table 5. The X-axis moving assembly 21, the Y-axis moving assembly 22, and the Z-axis moving assembly 23 form an existing three-axis manipulator mechanism, but the structure of the moving mechanism 2 is not limited thereto, and the moving mechanism 2 may also adopt an existing four-axis manipulator, a six-axis manipulator, and the like.

Referring to fig. 11 and 12, the first sliding mechanism 34 includes a first seat 341 and a first sliding member 342, the first seat 341 is disposed on the soldering tray assembly 32, the first sliding member 342 is slidably disposed on the first seat 341, the first piezoelectric ceramic 352 is disposed on the first seat 341 and is connected to the first sliding member 342 in an abutting manner, and the laser emitter 36 is connected to the first sliding member 342. The first power module 351 may be disposed in the first base 341, but not limited thereto, and the first power module 351 may also be disposed externally. Preferably, the first PZT driving mechanism 35 further includes a first amplifier 353, the middle portion of the first amplifier 353 is pivotally connected to the first base 341, the first amplifier 353 is located between the first piezoelectric ceramic 352 and the first sliding member 342, the first piezoelectric ceramic 352 is connected to one end of the first amplifier 353 in an abutting manner, the other end of the first amplifier 353 is connected to the first sliding member 342 in an abutting manner, and a force arm of the first piezoelectric ceramic 352 acting on the first amplifier 353 is shorter than a force arm of the first sliding member 342 acting on the first amplifier 353. In this embodiment, the first sliding member 342 has a resetting force that is reset to the initial position by sliding, the first amplifier 353 and the first piezoelectric ceramic 352 block the resetting of the first sliding member 342 to the initial position, the first piezoelectric ceramic 352 is energized through the first power module 351, so that the first piezoelectric ceramic 352 pushes the first amplifier 353 to rotate, the first amplifier 353 releases the first sliding member 342, the first sliding member 342 slides along the first seat 341 under the action of the resetting force, and drives the laser emitter 36 to slide together, thereby finely adjusting the position of the laser emitter 36. The first sliding member 342 can be a conventional extension spring, which is disposed between the first seat 341 and the first sliding member 342 and is in an extension state, so as to apply a restoring force to the first sliding member 342, but not limited thereto. It should be noted that in other embodiments, the first power module 351 may be used to energize the first piezo 352, such that the first piezo 352 pushes the first amplifier 353 to rotate, and the first amplifier 353 directly pushes the first sliding member 342 to slide, such that the first sliding member 342 drives the laser emitter 36 to slide together. Wherein first amplifier 353 may protect first piezoceramic 352 from off-axis forces (lateral forces and torques) while increasing the stroke.

Referring to fig. 11 to 13, the laser welding mechanism 3 further includes a second sliding mechanism 37 and a second PZT driving mechanism 38, the second sliding mechanism 37 is slidably and adjustably disposed on the upper portion of the soldering tray assembly 32, the first sliding mechanism 34 is disposed on the second sliding mechanism 37, the second PZT driving mechanism 38 includes a second power module 381 and a second piezoelectric ceramic 382, the second power module 381 is connected to the second piezoelectric ceramic 382, and the second piezoelectric ceramic 382 is connected to the second sliding mechanism 37, so that the second piezoelectric ceramic 382 is powered by the second power module 381 to drive the second sliding mechanism 37 to slide. Specifically, the second sliding mechanism 37 includes a second seat 371 and a second sliding member 372, the second seat 371 is disposed on the welded disk assembly 32, the second sliding member 372 is slidably disposed on the second seat 371, the second piezoelectric ceramic 382 is disposed on the second seat 371 and is connected to the second sliding member 372 in an abutting manner, and the first sliding mechanism 34 is disposed on the second sliding member 372. The second power module 381 may be disposed in the second seat 371, but not limited thereto, and the second power module 381 may also be external. Preferably, the second PZT driving mechanism 38 further includes a second amplifier 383, the middle portion of the second amplifier 383 is pivotally connected to the second base 371, the second amplifier 383 is located between the second piezoelectric ceramic 382 and the second slider 372, the second piezoelectric ceramic 382 is connected to one end of the second amplifier 383 in an abutting manner, the other end of the second amplifier 383 is connected to the second slider 372 in an abutting manner, and the arm of force of the second piezoelectric ceramic 382 acting on the second amplifier 383 is shorter than the arm of force of the second amplifier 383 about the second slider 372. In this embodiment, the second sliding member 372 constantly has a resetting force for resetting to the initial position by sliding, the second amplifier 383 and the second piezoelectric ceramic 382 block the resetting of the second sliding member 372 to the initial position, the second piezoelectric ceramic 382 is energized through the second power supply unit 381, so that the second piezoelectric ceramic 382 pushes the second amplifier 383, the second amplifier 383 rotates to release the second sliding member 372, and the second sliding member 372 slides along the second seat 371 under the action of the resetting force and drives the first sliding mechanism 34 to slide. More specifically, the sliding direction of the first slider 342 is perpendicular to the sliding direction of the second slider 372. The first sliding mechanism 34 and the second sliding mechanism 37 may be implemented by using an existing XY sliding platform, but not limited thereto. The second amplifier 383 can protect the second piezoceramic 382 from off-axis forces (lateral forces and torques) while increasing the stroke.

Referring to fig. 4 to 8, the soldering pan assembly 32 includes a lower substrate 322, a ball separating disc 323, an upper substrate 324 and a rotation driving mechanism 325, the lower substrate 322, the ball separating disc 323 and the upper substrate 324 are stacked in sequence from bottom to top, specifically, a gasket 327 and a sealing ring 329 are disposed between the lower substrate 322 and the upper substrate 324, the gasket 327 is disposed around the ball separating disc 323, and the sealing ring 329 is disposed around the gasket 327, but not limited thereto; the laser channel 321 penetrates through the lower substrate 322 and the upper substrate 324, and the welding tip 33 is installed at the bottom of the lower substrate 322; the lower substrate 322 is provided with a blanking channel 322a and a slag discharge notch 322b, one end of the blanking channel 322a forms a blanking port 322a1 on the upper surface of the lower substrate 322, the other end of the blanking channel 322a is communicated with the laser channel 321, and the slag discharge notch 322b is positioned on the upper surface of the lower substrate 322; the ball distributing disk 323 is provided with a plurality of ball distributing holes 323a along the circumferential direction; the upper substrate 324 is provided with a feeding channel 324a, the feeding channel 324a forms a feeding outlet 324a1 on the lower surface of the upper substrate 324, the blanking port 322a1, the slag notch 322b and the feeding outlet 324a1 respectively face the circumference where the ball separating hole 323a is located, the feeding channel 324a forms a feeding outlet 324a1 on the lower surface of the upper substrate 324, the feeding channel 324a forms a feeding inlet on the upper surface of the upper substrate 324, solder balls can enter the feeding channel 324a from the feeding inlet and fall out from the feeding outlet 324a1, but not limited thereto, the feeding inlet can also be formed on the side wall of the upper substrate 324; the output end of the rotation driving mechanism 325 passes through the upper base plate 324 and is connected with the ball distributing disc 323, the rotation driving mechanism 325 can drive the ball distributing disc 323 to rotate, so that the solder balls dropped from the feeding outlet 324a1 fall into the material dropping opening 322a1 through the ball distributing hole 323a of the ball distributing disc 323, the solder balls enter the laser channel 321 through the material dropping channel 322a and fall into the welding channel 331 of the welding nozzle, when the solder balls do not effectively fall into the material dropping opening 322a1 and are taken away by the ball distributing disc 323, the rotation driving mechanism 325 is used for continuously driving the ball distributing disc 323 to rotate, so that the solder balls not falling into the material dropping opening 322a1 in the ball distributing hole 323a fall into the slag discharging notch 322b, and the residual solder balls are automatically cleaned. The rotation driving mechanism 325 may be an existing rotating electric machine, but is not limited thereto.

Referring to fig. 9 to 10, in the present embodiment, the lower substrate 322 is provided with a slag discharging channel 322c, and one end of the slag discharging channel 322c is communicated with the slag discharging notch 322b, so that the slag falling into the slag discharging notch 322b can fall into the slag discharging channel 322 c. Specifically, the other end of the deslagging channel 322c forms a deslagging opening on the sidewall of the lower substrate 322, so that the solder balls located in the deslagging channel 322c can be discharged from the deslagging opening. More specifically, the slag discharge notch 322b is an arc-shaped groove which also faces the circumferential line where the ball distributing hole 323a is located, and it is sufficiently ensured that the solder balls in the ball distributing hole 323a which do not fall into the discharge port 322a1 can fall into the slag discharge notch 322b and from the slag discharge notch 322b into the slag discharge passage 322 c. For example, the lower substrate 322 may be provided with only the deslagging slot 322b, the depth of the deslagging slot 322b is greater than the diameter of the solder ball, so as to ensure that the solder ball does not rub against the upper substrate 324 and the lower substrate 322, the residual solder ball is stored through the deslagging slot 322b, and the shape of the deslagging slot 322b may be a long groove shape, so as to store more solder balls.

Referring to fig. 3-5, the bond pad assembly 32 further includes a feed tube 326 and a pressurized gas supply 328, the feed tube 326 being mounted on the upper substrate 324 and communicating with the feed inlet. The feeding pipe 326 is used for storing and feeding solder balls to the feeding inlet, the solder balls in the feeding pipe 326 can enter the feeding channel 324a through the feeding inlet, and then fall into the ball dividing hole 323a of the ball dividing disk 323 through the feeding outlet 324a1 from the feeding channel 324a, so that ball feeding is realized; the pressurized gas supply mechanism 328 is connected with the lower substrate 322 and used for supplying pressurized gas to the laser channel 321 and the welding channel 331, the solder ball has a certain sealing effect on the outlet of the welding channel 331, so that the air pressure in the laser channel 321 and the welding channel 331 continuously introduced with the pressurized gas is increased, the air pressure detection mechanism detecting the increase of the air pressure triggers the laser emitter 36, the laser emitter 36 emits laser, the solder ball is hit by the laser and is rapidly liquefied, and the molten tin liquid is separated from the outlet of the welding channel 331 and directly comes to the part to be welded of a product abutted against the molten tin liquid, so that the welding is realized. In the present embodiment, the pressurized gas is nitrogen, but not limited thereto.

Referring to fig. 2 and 3, the laser solder ball welding machine 100 of the present invention further includes a second vision system 6, the second vision system 6 is connected to the housing 31, and the second vision system 6 is used for photographing and positioning the product on the product placing table 5. Order to order about second vision system 6 through moving mechanism 2 and remove to the position department that places platform 5 and correspond with the product earlier for second vision system 6 places the product on the platform 5 and takes a picture the location to the product, in order to obtain the positional information of the welding position of product, moving mechanism 2 orders about laser welding mechanism 3 according to this positional information again and removes, makes welding nozzle 33 remove to corresponding position department and welds the product. The second vision system 6 may be an existing CCD vision system or the like.

Referring to fig. 2 and 14, the laser solder ball bonding machine 100 of the present invention further includes a solder ball collection box 7, and the solder ball collection box 7 is disposed on the support platform 1 and used for collecting solder balls. The solder balls discharged from the tip 33 can fall into the solder ball collection box 7 by cleaning the laser passage 321 and the solder passage 331 with nitrogen gas, and thus collected.

Referring to fig. 1 to 14, the laser solder ball bonding machine 100 of the present invention has the following operation principle:

carrying out alignment verification by using a second vision system 6; the laser emitter 36 is started, so that the laser emitter 36 emits laser guide light, the camera of the first vision system 4 captures a picture, the industrial personal computer analyzes the concentricity of the optical fiber emitting head of the laser emitter 36 and the welding tip 33, the second piezoelectric ceramic 382 is electrified through the second power supply module 381 according to the calculation result of the industrial personal computer, so that the second piezoelectric ceramic 382 pushes the second amplifier 383, the second amplifier 383 rotates to release the second sliding piece 372, and the second sliding piece 372 slides along the second seat body 371 under the action of the reset force and drives the first sliding mechanism 34 to slide; the first power supply component 351 is used for electrifying the first piezoelectric ceramic 352, so that the first piezoelectric ceramic 352 pushes the first amplifier 353 to rotate, the first amplifier 353 releases the first sliding part 342, the first sliding part 342 slides along the first seat 341 under the action of the reset force and drives the laser emitter 36 to slide together, the position of the laser emitter 36 is finely adjusted, and automatic centering adjustment is completed; the solder ball discharging debugging is carried out on the welding disc assembly 32 and the welding nozzle 33 of the laser welding mechanism 3, the laser channel 321 and the welding channel 331 are cleaned through nitrogen, and the solder balls discharged from the welding nozzle 33 can fall into the solder ball collecting box 7; to inlet pipe 326 material loading tin ball, and will treat that the welded product is placed in the product and place platform 5, order about second vision system 6 through moving mechanism 2 and remove to the position department that places platform 5 and correspond with the product earlier, make second vision system 6 place the product on the platform 5 and shoot the location to the product, in order to obtain the positional information of the welding position of product, shoot welding tip 33 through first vision system 4, in order to obtain the positional information of welding tip 33, moving mechanism 2 orders about laser welding mechanism 3 according to the positional information of welding position and the positional information of welding tip 33 again and removes, make welding tip 33 remove to the position department that corresponds and weld the product.

In summary, the laser welding mechanism 3 of the laser solder ball welding machine 100 of the present invention is provided with the first vision system 4, the first sliding mechanism 34 and the first PZT driving mechanism 35, the first vision system 4 observes and analyzes the central position of the laser spot emitted by the laser emitter 36 and the solder tip 33, and according to the analysis result, the first power module 351 is used to energize the first piezoelectric ceramic 352, so that the first piezoelectric ceramic 352 converts the electrical signal into a mechanical displacement and drives the first sliding mechanism 34 to slide, so that the first sliding mechanism 34 drives the laser emitter 36 to slide together, and further, the position of the laser beam emitted by the laser emitter 36 is finely adjusted, so that the laser beam and the solder tip 33 are precisely aligned, thereby achieving automatic adjustment of laser alignment, and ensuring that the laser beam can be irradiated onto the solder ball and melt the solder ball; the laser solder ball welding machine 100 of the invention can drive the laser welding mechanism 3 to move through the moving mechanism 2, so that the welding tip 33 of the laser welding mechanism 3 moves to the position corresponding to the welded product, the automatic welding of the product is realized, and the welding quality is high.

The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.

Claims

1. A laser solder ball welding machine is characterized by comprising a supporting platform, a moving mechanism, a laser welding mechanism, a first vision system and a product placing table, wherein the moving mechanism is arranged on the supporting platform; the laser welding mechanism comprises a shell, a welding disc assembly, a welding nozzle, a first sliding mechanism, a first PZT driving mechanism and a laser emitter, wherein the shell is connected with the moving mechanism, the moving mechanism can drive the shell to move, the welding disc assembly is arranged in the shell, the welding disc assembly is provided with a laser channel, the welding nozzle is arranged at the bottom of the welding disc assembly and protrudes out of the shell, the welding nozzle is provided with a welding channel, the welding channel is communicated with the laser channel, the first sliding mechanism is arranged at the upper part of the welding disc assembly in a sliding and adjusting manner, the first PZT driving mechanism comprises a first power supply assembly and a first piezoceramic, the first power supply assembly is connected with the first piezoceramic, the first piezoceramic is connected with the first sliding mechanism, and the laser emitter is arranged on the first sliding mechanism and is positioned above the laser channel, electrifying the first piezoelectric ceramic by the first power supply assembly so that the first piezoelectric ceramic drives the first sliding mechanism to slide together with the laser emitter; the first vision system is arranged on the supporting platform and is used for observing the light spot of the laser emitted by the laser emitter and the central position of the welding tip; the product placing table is arranged on the supporting platform and used for placing products to be welded.

2. The laser solder ball welding machine of claim 1, wherein the moving mechanism comprises an X-axis moving assembly, a Y-axis moving assembly and a Z-axis moving assembly, the X-axis moving assembly is disposed on the supporting platform, the Y-axis moving assembly is vertically disposed on the X-axis moving assembly, the Z-axis moving assembly is vertically disposed on the Y-axis moving assembly, and the housing is disposed on the Z-axis moving assembly.

3. The laser solder ball welding machine of claim 1, wherein the first sliding mechanism comprises a first seat and a first slider, the first seat is disposed on the solder disc assembly, the first slider is slidably disposed on the first seat, the first piezoelectric ceramic is disposed on the first seat and is in interference connection with the first slider, and the laser emitter is connected with the first slider.

4. The laser solder ball welding machine of claim 3, wherein the first PZT driving mechanism further comprises a first amplifier, a middle portion of the first amplifier is pivotally connected to the first base, the first amplifier is located between the first piezoceramic and the first sliding member, the first piezoceramic is in interference connection with one end of the first amplifier, the other end of the first amplifier is in interference connection with the first sliding member, and a force arm of the first piezoceramic acting on the first amplifier is shorter than a force arm of the first sliding member acting on the first amplifier.

5. The laser solder ball bonding machine of claim 1, wherein the laser welding mechanism further comprises a second sliding mechanism and a second PZT actuator, the second sliding mechanism is slidably and adjustably disposed on the upper portion of the bonding pad assembly, the first sliding mechanism is disposed on the second sliding mechanism, the second PZT actuator comprises a second power supply assembly and a second piezoelectric ceramic, the second power supply assembly is connected to the second piezoelectric ceramic, the second piezoelectric ceramic is connected to the second sliding mechanism, and the second piezoelectric ceramic is energized by the second power supply assembly to cause the second piezoelectric ceramic to drive the second sliding mechanism to slide.

6. The laser solder ball welding machine of claim 5, wherein the second sliding mechanism comprises a second seat and a second slider, the second seat is disposed on the solder disc assembly, the second slider is slidably disposed on the second seat, the second piezoelectric ceramic is disposed on the second seat and is in interference connection with the second slider, and the first sliding mechanism is disposed on the second slider.

7. The laser solder ball welding machine of claim 6, wherein the second PZT driving mechanism further comprises a second amplifier, the middle of the second amplifier is pivotally connected to the second base, the second amplifier is located between the second piezoceramic and the second slider, the second piezoceramic is connected with one end of the second amplifier in an abutting manner, the other end of the second amplifier is connected with the second slider in an abutting manner, and the arm of force of the second piezoceramic acting on the second amplifier is shorter than the arm of force of the second amplifier acting on the left and right sides of the second slider.

8. The laser solder ball welding machine of claim 1, wherein the welding disc assembly comprises a lower substrate, a ball separating disc, an upper substrate and a rotation driving mechanism, the lower substrate, the ball separating disc and the upper substrate are stacked in sequence from bottom to top, the laser channel penetrates through the lower substrate and the upper substrate, the welding nozzle is mounted at the bottom of the lower substrate, the lower substrate is provided with a blanking channel and a slag discharging notch, one end of the blanking channel forms a blanking opening at the upper surface of the lower substrate, the other end of the blanking channel is communicated with the laser channel, the slag discharging notch is located at the upper surface of the lower substrate, the ball separating disc is provided with a plurality of ball separating holes along the circumferential direction, the upper substrate is provided with a feeding channel, the feeding channel forms a feeding outlet at the lower surface of the upper substrate, and the blanking opening, the slag discharging opening, the rotating driving mechanism, The slag discharging notch and the feeding outlet are respectively opposite to a circumferential line where the ball distributing hole is located, the output end of the rotary driving mechanism penetrates through the upper substrate and is connected with the ball distributing disc, and the rotary driving mechanism drives the ball distributing disc to rotate so that the solder balls which do not fall into the blanking port in the ball distributing hole fall into the slag discharging notch.

9. The laser solder ball bonding machine of claim 1, further comprising a second vision system connected to the housing, the second vision system being configured to take a picture of the product on the product placement stage for positioning.

10. The laser solder ball bonding machine of claim 1, further comprising a solder ball collection box disposed on the support platform for collecting solder balls.