CN111117476A - Light heat-dissipation coating and preparation method thereof - Google Patents
Light heat-dissipation coating and preparation method thereof Download PDFInfo
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- CN111117476A CN111117476A CN202010005024.1A CN202010005024A CN111117476A CN 111117476 A CN111117476 A CN 111117476A CN 202010005024 A CN202010005024 A CN 202010005024A CN 111117476 A CN111117476 A CN 111117476A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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Abstract
The invention relates to a light heat dissipation coating and a preparation method thereof. The prepared light heat-dissipation coating has the characteristics of high heat conductivity, high emissivity, low density, easiness in construction and the like, can be applied to electronic products such as mobile phones, tablet computers and notebook computers, greatly improves the heat-dissipation effect, and has high economic value and wide prospect.
Description
Technical Field
The invention belongs to the field of functional materials, and particularly relates to a light heat dissipation coating and a preparation method thereof.
Background
Electronic products such as mobile phones, tablet computers, notebook computers and the like can generate a large amount of heat at local parts such as a CPU (central processing unit), a GPU (graphics processing unit) and the like in the using process, so that local temperature is too high, if the heat cannot be quickly dissipated, the using performance of the products is seriously reduced, the service life of the products is greatly shortened, and even a user is scalded. In order to improve the product performance, heat dissipation is mainly performed by means of pasting heat-conducting glue and installing metal heat-dissipating fins, but the methods have the defects of poor heat dissipation effect, heavy weight and the like due to high price and easy deformation. In recent years, people develop interface-contact heat-dissipation coatings, which can be conveniently coated on the surfaces of planes and curved surfaces of electronic products and play a role in heat conduction and heat dissipation. Patent application No. 201810426423.8 discloses a high heat dissipation coating for electronic device housings, which contains silver-plated glass beads, graphite powder, carbon nanotubes and epoxy resin as main components, but the patent does not give performance data of the heat dissipation coating, and silver is easily oxidized at a higher temperature by using the silver-plated glass beads, so that heat dissipation performance is rapidly attenuated. The patent with application number 201610599486.4 discloses a heat dissipation coating, which mainly comprises asphalt-based carbon fiber powder, nano silicon nitride, aluminum nitride, epoxy resin, acrylic resin and the like, and is mainly used for heat dissipation of lamps, but specific heat dissipation data are not given in the patent. Generally, metal powder, carbon nanotubes, carbon fiber powder, silicon nitride, boron nitride, aluminum nitride and other heat dissipation fillers are added into a common heat dissipation coating, so that the heat conductivity is in a range of 1-5W/(m.k), and the heat dissipation effect is poor.
Disclosure of Invention
The invention aims to provide a light heat dissipation coating and a preparation method thereof, the light heat dissipation coating is prepared by adding high-thermal-conductivity graphite fibers and graphene into a resin system, and has excellent heat dissipation performance so as to meet the requirement that rapid heat dissipation is needed when the local temperature is overhigh in the using process of electronic products.
In order to achieve the purpose, the invention adopts the technical scheme that: the light heat dissipation coating comprises a filler and a resin system, wherein the filler mainly comprises high-thermal-conductivity graphite fibers and graphene; the length of the high-thermal-conductivity graphite fiber is 100 nm-50 mu m, the diameter of the fiber is 1 nm-10 mu m, and the addition amount of the high-thermal-conductivity graphite fiber is 1% -40% of the total mass of the coating; the number of the graphene layers is 1-5, the graphene is added in a graphene slurry form, the content of the graphene in the graphene slurry is 1% -10%, and the addition amount of the graphene is 0.1% -5.0% of the total mass of the coating; the resin system comprises epoxy resin, polyurethane, acrylic acid, siloxane, alkyd, amino, polyester, organic silicon and fluorocarbon, and the addition amount of the resin system is 5.0-85.0% of the total mass of the coating; the heat conductivity of the light heat dissipation coating is more than 50W/(m.k).
The filler also comprises other filling materials, the other filling materials are one or more of titanium dioxide, kaolin and precipitated barium sulfate, and the addition amount of the other filling materials is 10.0-75.0% of the total mass of the coating.
The preparation method of the light heat dissipation coating comprises the following steps:
firstly, placing the required high-thermal-conductivity graphite fibers in an oven at 110 +/-5 ℃ for drying for 2-12 h, naturally cooling, bagging and sealing the high-thermal-conductivity graphite fibers for later use, and identifying;
step two, weighing the resin system and the dispersing agent according to the weight percentage of 5.0-85.0% and 0.2-2.0% of the total weight of the coating respectively, then adding the resin system and the dispersing agent into a charging basket, adding a solvent, stirring at a low speed for 5-45 min, uniformly dispersing, then adding high-thermal-conductivity graphite fibers and graphene according to the addition amount, stirring at a high speed for 15-60 min, uniformly dispersing, then grinding for 0.5-4 h until the fineness of the coating reaches below 60 mu m, and filtering, discharging and packaging after the viscosity is detected to be qualified to obtain a finished product of the light heat-dissipation coating.
The dispersant is BYK110, BYK130 or EFKA 4010.
The solvent is xylene, n-butanol or acetone.
The total adding amount of the solvent is 5-20% of the total mass of the coating, the solvent is added step by step, 70% of the adding amount of the solvent is added for the first time, after uniform mixing, low-speed stirring and subsequent processes are carried out, after grinding to the required fineness, the rest solvent is added again, and the coating is uniformly mixed and checked for viscosity.
The high-speed stirring speed is 1200-1500 r/min.
In the second step, after the high-thermal-conductivity graphite fiber and the graphene are added, other physical fillers are added according to the requirement, the other physical fillers are one or more of titanium dioxide, kaolin and precipitated barium sulfate, and the addition amount of the other physical fillers is 10.0-75.0% of the total mass of the coating.
The principle of the invention is as follows: (1) selecting high heat-conducting graphite fiber as heat-radiating filler
The graphite fiber has a molecular structure which is graphitized, has a layered hexagonal lattice graphite structure with carbon content higher than 99 percent, and has the characteristics of high strength and high modulus, good thermal shock resistance, small thermal expansion coefficient, high temperature resistance, flame resistance, excellent conductivity, corrosion resistance and the like. The thermal conductivity of the graphite fiber reaches over 1200W/(m.k), which is far higher than the thermal conductivity 394W/(m.k) of copper. The invention selects high-performance asphalt-based graphite fiber as the heat dissipation filler, mainly plays the linear and efficient heat transfer effect of the fiber, and can greatly improve the heat conductivity and the heat dissipation effect of the coating.
(2) Selecting single-layer or few-layer graphene as heat dissipation filler
Graphene is a two-dimensional sheet material, and the theoretical thermal conductivity of the graphene can reach 5300W/(m.k). The number of layers of graphene has a remarkable influence on the performance of the graphene, single-layer or few-layer graphene (less than 5 layers) is selected as a filler of the heat dissipation coating, and the layered graphene plays the advantages of lamellar heat conduction, high strength and radiation heat dissipation in the coating, so that the heat dissipation coating has high heat conductivity, emissivity and mechanical strength.
According to the invention, the linear graphite fiber and the layered graphene are selected as the heat dissipation filler combination and are matched together, so that the heat conductivity and the heat dissipation effect of the heat dissipation coating are improved.
The invention has the following advantages: the light heat-dissipation coating provided by the invention has the characteristics of high heat conductivity, high emissivity, low density, easiness in construction and the like, can be applied to electronic products such as mobile phones, tablet computers and notebook computers, greatly improves the heat-dissipation effect, and has higher economic value and wide prospect.
Detailed Description
The present invention is further illustrated by the following examples, which are not to be construed as limiting the invention in any way.
The light heat dissipation coating comprises a filler and a resin system, wherein the filler mainly comprises high-thermal-conductivity graphite fibers and graphene; the length of the high-thermal-conductivity graphite fiber is 100 nm-50 mu m, the diameter of the fiber is 1 nm-10 mu m, and the addition amount of the high-thermal-conductivity graphite fiber is 1% -40% of the total mass of the coating; the number of the graphene layers is 1-5, the graphene is added in a graphene slurry form, the content of the graphene in the graphene slurry is 1% -10%, and the addition amount of the graphene is 0.1% -5.0% of the total mass of the coating; the resin system comprises epoxy resin, polyurethane, acrylic acid, siloxane, alkyd, amino, polyester, organic silicon and fluorocarbon, and the addition amount of the resin system is 5.0-85.0% of the total mass of the coating; the heat conductivity of the light heat dissipation coating is more than 50W/(m.k).
The filler also comprises other filling materials, the other filling materials are one or more of titanium dioxide, kaolin and precipitated barium sulfate, and the addition amount of the other filling materials is 10.0-75.0% of the total mass of the coating.
The high-heat-conductivity graphite fiber is high-performance asphalt-based graphite fiber.
The method for preparing the light heat dissipation coating comprises the following steps:
(1) placing the required high-thermal-conductivity graphite fibers in an oven at 110 +/-5 ℃ for drying for 2-12 h, naturally cooling, bagging and sealing the high-thermal-conductivity graphite fibers for later use, and identifying;
(2) adding a resin system, a dispersing agent, a defoaming agent and a leveling agent into a charging basket, adding a solvent, stirring at a low speed for 5-45 min, uniformly dispersing, adding high-thermal-conductivity graphite fibers and graphene according to the addition amount, stirring at a high speed of 1200-1500 r/min for 15-60 min, uniformly dispersing, grinding for 0.5-4 h until the fineness of the coating reaches below 60 mu m, detecting that the viscosity is qualified, and filtering, discharging and packaging to obtain a finished product of the light heat-dissipation coating.
Wherein the addition amount of the resin system is 5.0-85.0% of the total mass of the prepared coating, and the addition amount of the dispersant is 0.2-2.0% of the total mass of the prepared coating.
The dispersant is BYK110, BYK130 or EFKA 4010.
The solvent is dimethylbenzene, n-butyl alcohol or acetone, the total addition amount of the solvent is 5% -20% of the total mass of the coating, the solvent is added step by step, 70% of the addition amount of the solvent is added for the first time, after uniform mixing, low-speed stirring and subsequent processes are carried out, after grinding to the required fineness, the residual solvent is added again while ultrasonic stirring, uniform mixing is carried out, and the viscosity of the coating is checked.
In the step (2), after the high-thermal-conductivity graphite fibers and the graphene are added, other physical fillers are added according to needs, the other physical fillers are one or more of titanium dioxide, kaolin and precipitated barium sulfate, and the addition amount of the other physical fillers is 10.0-75.0% of the total mass of the coating.
The graphene slurry and the resin system used in the invention are all commercially available products.
The main technical indexes of the light heat-dissipation coating provided by the invention are shown in table 1.
The heat dissipation characteristics of the light heat dissipation coating provided by the present invention will be further described below by taking a single-component coating as an example.
The formulation of the light weight heat dissipating coating in the examples is shown in table 2.
In the above table, the content of graphene in the graphene paste is 5%, and the three examples correspond to the mass fraction of the graphene paste in the coating.
According to the preparation method of the invention, the light heat dissipation coating is prepared by using the formulas of the three embodiments, and the correlation performance of the obtained coating is detected, and the detection result is shown in table 3.
From the detection results, the light heat-dissipation coating provided by the invention has higher heat conductivity and hemispherical emissivity, can greatly improve the heat-dissipation effect after being used for electronic products such as mobile phones, tablet computers, notebook computers and the like, can be popularized and applied to devices and products needing heat dissipation such as LED lamps and the like, greatly improves the heat-dissipation effect, has higher economic value and has wide prospect.
The above embodiments are only intended to illustrate the technical solution of the present invention and not to limit the same, and it should be understood by those of ordinary skill in the art that the specific embodiments of the present invention can be modified or substituted with equivalents with reference to the above embodiments, and any modifications or equivalents without departing from the spirit and scope of the present invention are within the scope of the claims to be appended.
Claims (8)
1. A light heat dissipation coating comprises the following components of a filler and a resin system, and is characterized in that: the filler mainly comprises high-thermal-conductivity graphite fibers and graphene; the length of the high-thermal-conductivity graphite fiber is 100 nm-50 mu m, the diameter of the fiber is 1 nm-10 mu m, and the addition amount of the high-thermal-conductivity graphite fiber is 1% -40% of the total mass of the coating; the number of the graphene layers is 1-5, the graphene is added in a graphene slurry form, the content of the graphene in the graphene slurry is 1% -10%, and the addition amount of the graphene is 0.1% -5.0% of the total mass of the coating; the resin system comprises epoxy resin, polyurethane, acrylic acid, siloxane, alkyd, amino, polyester, organic silicon and fluorocarbon, and the addition amount of the resin system is 5.0-85.0% of the total mass of the coating; the heat conductivity of the light heat dissipation coating is more than 50W/(m.k).
2. The light heat-dissipating coating material according to claim 1, wherein: the filler also comprises other filling materials, the other filling materials are one or more of titanium dioxide, kaolin and precipitated barium sulfate, and the addition amount of the other filling materials is 10.0-75.0% of the total mass of the coating.
3. A method of preparing the lightweight heat-dissipating coating of claim 1, comprising the steps of:
firstly, placing the required high-thermal-conductivity graphite fibers in an oven at 110 +/-5 ℃ for drying for 2-12 h, naturally cooling, bagging and sealing the high-thermal-conductivity graphite fibers for later use, and identifying;
step two, weighing the resin system and the dispersing agent according to the weight percentage of 5.0-85.0% and 0.2-2.0% of the total weight of the coating respectively, then adding the resin system and the dispersing agent into a charging basket, adding a solvent, stirring at a low speed for 5-45 min, uniformly dispersing, then adding high-thermal-conductivity graphite fibers and graphene according to the addition amount, stirring at a high speed for 15-60 min, uniformly dispersing, then grinding for 0.5-4 h until the fineness of the coating reaches below 60 mu m, and filtering, discharging and packaging after the viscosity is detected to be qualified to obtain a finished product of the light heat-dissipation coating.
4. The method for preparing the light heat-dissipation coating as claimed in claim 3, wherein the dispersant is BYK110, BYK130 or EFKA 4010.
5. The method for preparing a light heat-dissipating paint as claimed in claim 3, wherein the solvent is xylene, n-butanol or acetone.
6. The preparation method of the light heat dissipation coating as claimed in claim 3 or 5, wherein the total addition amount of the solvent is 5% -20% of the total mass of the coating, the solvent is added step by step, 70% of the addition amount of the solvent is added for the first time, after uniform mixing, low-speed stirring and subsequent processes are performed, after grinding to a required fineness, the remaining solvent is added again while ultrasonic stirring, and the uniform mixing and coating viscosity inspection are performed.
7. The preparation method of the light heat dissipation coating as claimed in claim 3, wherein the high-speed stirring speed is 1200-1500 r/min.
8. The preparation method of the light heat dissipation coating according to claim 3, wherein in the second step, after the high thermal conductivity graphite fiber and the graphene are added, other physical fillers are optionally added according to needs, the other physical fillers are one or more of titanium dioxide, kaolin and precipitated barium sulfate, and the addition amount of the other physical fillers is 10.0-75.0% of the total mass of the coating.
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Cited By (1)
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CN115651446A (en) * | 2022-06-29 | 2023-01-31 | 福州集宝金属科技有限公司 | Preparation method of heat dissipation coating |
Citations (1)
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CN102649896A (en) * | 2012-05-29 | 2012-08-29 | 邱璟 | Novel high heat conduction and heat dissipation coating and manufacturing method thereof |
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Patent Citations (1)
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CN102649896A (en) * | 2012-05-29 | 2012-08-29 | 邱璟 | Novel high heat conduction and heat dissipation coating and manufacturing method thereof |
Non-Patent Citations (3)
Title |
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张长瑞等: "《陶瓷基复合材料—原理、工艺、性能与设计》", 31 January 2001, 国防科技大学出版社 * |
徐蔓等: "《中国化学产品大全 第三版 上卷》", 31 January 2005, 化学工业出版社 * |
陈照峰: "《无机非金属材料学》", 28 February 2016, 西北工业大学出版社 * |
Cited By (1)
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CN115651446A (en) * | 2022-06-29 | 2023-01-31 | 福州集宝金属科技有限公司 | Preparation method of heat dissipation coating |
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Application publication date: 20200508 |