CN111047970B - Display panel and display panel mother board - Google Patents
Display panel and display panel mother board Download PDFInfo
- Publication number
- CN111047970B CN111047970B CN201911151370.4A CN201911151370A CN111047970B CN 111047970 B CN111047970 B CN 111047970B CN 201911151370 A CN201911151370 A CN 201911151370A CN 111047970 B CN111047970 B CN 111047970B
- Authority
- CN
- China
- Prior art keywords
- display area
- display panel
- base plate
- substrate base
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to the technical field of display panels, in particular to a display panel and a display panel mother board, wherein the display panel comprises a substrate base plate, a cover plate, packaging glue and a heat insulation wall, wherein a display area and a non-display area arranged around the display area are arranged on the substrate base plate; the cover plate and the substrate base plate are arranged opposite to each other; the packaging adhesive is arranged around the periphery of the display area and is connected with the substrate base plate and the cover plate so as to be matched with the substrate base plate and the cover plate to provide a sealing space for the display area; and the at least one heat insulation wall is positioned in the non-display area and embedded in the packaging adhesive so as to reduce the heat transfer to the display area. The display panel and the display panel mother board can reduce the heat transferred to the display area by the heat generated by cutting the cutter, reduce the influence of the heat generated by cutting the cutter on the display area and prolong the service life of the display panel.
Description
Technical Field
The invention relates to the technical field of display panels, in particular to a display panel and a display panel mother board.
Background
At present, in the display panel industry of mobile devices (such as mobile phones, tablet computers, and the like), the design of narrow frames, which ensures that the size of the light emitting area of the display panel is unchanged, reduces the frame width, and further realizes miniaturization, is becoming the mainstream trend. The design of narrow frame can expand the ratio of the luminous region as far as possible, improve the luminance and the plumpness of the picture in the visible region, can effectively reduce the whole width of mobile device.
Disclosure of Invention
In view of the above, the present invention provides a display panel and a display panel mother board, which can reduce the influence of the cutting process on the luminescent material in the display area.
In order to solve the technical problems, the invention adopts a technical scheme that: the display panel comprises a substrate base plate, a cover plate, packaging adhesive and at least one heat insulation wall, wherein a display area and a non-display area arranged around the display area are arranged on the substrate base plate; the cover plate is arranged opposite to the substrate base plate; the packaging adhesive is arranged around the periphery of the display area and connected with the substrate base plate and the cover plate so as to be matched with the substrate base plate and the cover plate to provide a sealing space for the display area; and the at least one heat insulation wall is positioned in the non-display area and is embedded in the packaging adhesive.
The technical scheme of the invention can reduce the heat transferred to the display area by the heat generated by cutting the cutter, reduce the influence of the heat generated by cutting the cutter on the display area of the display panel and prolong the service life of the display panel.
Further, the heat insulation wall is arranged on the cover plate and/or the substrate base plate. So as to reduce the transmission of cutting energy to the display area and make the display panel easy to manufacture.
Further, the heat insulation wall is provided with a hole structure, and preferably, the hole structure is filled with heat insulation gas, so that the heat insulation effect of the heat insulation wall is better.
Further, the number of the heat insulation walls is at least two, the at least two heat insulation walls are arranged at intervals along the direction from the display area to the non-display area, and the packaging glue is filled in the interval area between the heat insulation walls. The arrangement of two or more thermal-insulated walls plays thermal-insulated effect layer upon layer for thermal-insulated effect is better.
Further, the number of the heat insulation walls is 2-3. When the number of the heat insulation walls is 2-3, the width of a frame of the display panel is not increased while the packaging effect and the packaging strength of the packaging adhesive on the substrate base plate and the cover plate are ensured, and meanwhile, the influence of heat generated by cutting of a cutter on the display area of the display panel can be reduced.
Furthermore, the material of the heat insulation wall comprises metal or inorganic material; preferably, the metal material comprises titanium and silver, and the inorganic metal comprises glass fiber, silicon oxynitride. The heat insulation wall made of the material has a better heat insulation effect, and particularly has a better heat insulation effect on laser energy.
Further, the sectional area of the heat insulation wall in the direction parallel to the display panel includes a square shape, a trapezoid shape and a triangle shape, and the specific shape of the heat insulation wall is not limited, and the heat insulation wall is easy to realize in process.
Furthermore, a first groove and a second groove are respectively arranged on the surfaces of the cover plate and the substrate base plate opposite to each other, and the packaging adhesive is embedded into the first groove and the second groove. The ability of the packaging adhesive to connect the cover plate and the substrate base plate can be improved, and the drawing force of the packaging adhesive is increased.
Further, at least one of the first groove and the second groove is a dovetail groove. The drawing force of the display panel can be remarkably increased.
Another technical solution adopted by the present invention is to provide a display panel mother board, including: the display device comprises a substrate base plate, a display area and a non-display area, wherein the display area and the non-display area are arranged around the display area; a cover plate arranged opposite to the substrate base plate; the packaging adhesive is arranged around the periphery of the display area and is connected with the substrate base plate and the cover plate so as to be matched with the substrate base plate and the cover plate to provide a sealing space for the display area; at least one heat insulation wall, which is positioned in the non-display area and is embedded in the packaging adhesive; and the cutting cushion block is embedded into the packaging adhesive to allow the display panel mother board to be cut along the cutting cushion block, wherein a hollow cavity is formed in the cutting cushion block, and heat insulation gas is filled in the hollow cavity.
The technical scheme of the display panel mother board can reduce the heat transferred to the display area by the heat generated by cutting the cutter, reduce the influence of the heat generated by cutting the cutter on the display area of the display panel mother board, and prolong the service life of the display panel.
Furthermore, the cutting cushion block is fixed on the cover plate and keeps a preset gap with the substrate base plate, and the packaging adhesive is filled in the gap between the cutting cushion block and the substrate base plate. The packaging effect can be improved, and the precision of the packaging on the process requirement can be reduced.
The invention has the beneficial effects that: different from the prior art, the cutting cushion block is arranged in the display panel mother board, so that the display panel mother board can be cut along the cutting cushion block when being cut. Meanwhile, the arrangement of the heat insulating layers in the display panel and the display panel motherboard can further reduce the influence of heat generated by cutting of the cutter on a display area and prolong the service life of the display panel. Furthermore, the transmission of energy to the display area during laser cutting is reduced, and the distance between the cutting area and the display area is shortened, so that the narrow frame design is realized.
Drawings
FIG. 1 is a schematic structural diagram of a mother board of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic sectional view taken along line A-A in example 1 of the present invention.
Wherein, 1-substrate base plate; 2-cover plate; 11-a second groove; 21-a first groove; 3-packaging glue; 4-cutting cushion block, 41-hollow cavity; 5-heat insulation wall, 51-hole structure; 6-a display area; 7-frame.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In the manufacturing process of the display panel, since oxygen and moisture are likely to react with the material of the display panel to cause the failure of the display panel, the display panel needs to be sealed to isolate oxygen and moisture. And glass cement (Frit) can keep apart oxygen and moisture better, so in display panel manufacturing process, often adopt glass cement to encapsulate and play the effect of isolated oxygen and moisture. Therefore, for the display panel, to realize the design of the narrow frame, the glass cement needs to be narrowed. The display panel of the mobile device generally needs to be cut by a cutter, and when the glass cement is narrowed, the material of a light emitting area is easily influenced in the cutting process, so that the service life of the light emitting area is shortened.
Fig. 1 is a schematic structural diagram of a display panel mother board according to an embodiment of the present invention, and fig. 2 is a schematic structural diagram of a cross-section taken along a line a-a in embodiment 1 of the present invention. FIG. 1 includes a display area 6 and a frame 7; fig. 2 includes a substrate base plate 1, a cover plate 2, a second groove 11, a first groove 21, a packaging adhesive 3, a cutting pad 4, a hollow cavity 41, a heat insulation wall 5 and a hole structure 51.
A display panel according to an embodiment of the present invention, as shown in fig. 1 and 2, (fig. 1 and 2 are drawings of an embodiment of a mother board of the display panel, which are the same as those of the mother board of the display panel except that the display panel does not include a cutting pad 4), the display panel includes a substrate base plate 1, a cover plate 2, an encapsulation adhesive 3, and at least one heat insulation wall 5, and a display area 6 and a non-display area surrounding the display area 6 are disposed on the substrate base plate 1; the cover plate 2 is arranged opposite to the substrate base plate 1; the packaging adhesive 3 is arranged around the periphery of the display area 6 and connected with the substrate base plate 1 and the cover plate 2, and further matched with the substrate base plate 1 and the cover plate 2 to provide a sealing space for the display area 6; at least one heat insulation wall 5 is located in the non-display area and embedded in the encapsulation adhesive 3.
According to the display panel provided by the embodiment of the invention, the heat transferred to the display area 6 by the heat generated by cutting with the cutting tool such as laser cutting is reduced by arranging the heat insulation wall 5, the influence of the heat generated by cutting with the cutting tool such as laser cutting on the display area is reduced, and the service life of the display panel is prolonged. Meanwhile, the transmission of energy to the display area during laser cutting is reduced, the distance between the cutting area and the display area is shortened, and the narrow frame design is realized.
Specifically, in the present embodiment, the number of the heat insulating walls 5 is three, the three heat insulating walls 5 are disposed at intervals from each other in a direction from the display area 6 to the non-display area, and the sealing adhesive 3 is further filled in the interval area between the heat insulating walls 5. In the embodiment of the invention, the three heat insulation walls 5 are arranged, so that heat transferred during laser cutting can pass through the three heat insulation barriers, and the heat insulation effect is ensured to be better; in other embodiments, one, two, or four to six thermal insulation walls 5 may be adopted, and the number of the thermal insulation walls 5 in this range may be optimized to achieve the thermal insulation effect, the bonding firmness of the encapsulation adhesive 3 with the cover plate 2 and the substrate base plate 1, and the width of the frame 7 (see fig. 1).
It should be noted that, in order to take the manufacturing process into consideration, the thickness of the heat insulation wall 5 is between 10 micrometers and 900 micrometers. It is known that the thickness of the heat insulating wall 5 is the distance of the heat insulating wall 5 in the direction from the display area 6 to the non-display area.
Specifically, the heat insulation wall 5 in the embodiment of the present invention is disposed on the cover plate 2, and may be formed by being inlaid on the cover plate 2 or being deposited on the cover plate 2. In other embodiments, the thermal insulation wall 5 may also be made by embedding or by deposition on the substrate base plate 1.
It can be known that when the heat insulating wall 5 is simultaneously provided on the cover plate 2 and the substrate base plate 1, there is a gap between the two portions of the heat insulating wall 5, and the potting adhesive 3 is filled in the gap.
The cross section of the heat insulation wall 5 of the embodiment of the present invention in the direction parallel to the display panel includes a rectangle, and in other embodiments, the shape of the cross section of the heat insulation wall 5 may also include a triangle or a trapezoid.
The material of the heat insulation wall 5 of the embodiment of the present invention may include metal or inorganic material, and preferably, the material of the heat insulation wall 5 includes metal material such as titanium metal, silver metal, etc., and may also be inorganic material such as glass fiber or silicon oxynitride. The heat insulation wall made of titanium and silver has better heat insulation effect, and particularly has better heat insulation effect on laser energy.
The heat insulation wall 5 is provided with a hole structure 51. It should be noted that the hole structure 51 is not filled with the packaging adhesive 3, and is preferably filled with a heat insulation gas, so that when the hole structure 51 is disposed in the heat insulation wall 5, heat transfer during laser cutting can be effectively reduced, and the heat insulation effect is significantly improved. For example, in the present embodiment, the heat insulating wall 5 is disposed on the cover plate 2, an empty pipe may be reserved in the process of manufacturing the heat insulating wall 5, the empty pipe may be filled with heat insulating gas, and the heat insulating wall 5 is wrapped around the empty pipe, that is, the heat insulating wall 5 having the hole structure 51 is formed.
Specifically, in the embodiment of the present invention, the length direction of the hole structure 51 is parallel to the cover plate 2, the number of the hole structures 51 of each heat insulation wall 5 is at least one, and in the embodiment of the present invention, the number of the hole structures 51 of each heat insulation wall 5 is plural, and plural holes are arranged in parallel.
In other embodiments, the heat insulation wall 5 may not be provided with holes, i.e. the heat insulation wall 5 is a unitary structure, for example, the heat insulation wall 5 is a titanium metal wall without holes.
After display panel encapsulation, cutting are accomplished, need carry out intensity test to display panel, drop test and drawing force test, to narrow frame structure, because the encapsulation is glued 3 narrowly, easily appear when drop test and drawing force test, appear encapsulating insecure phenomenon, cause the encapsulation to become invalid easily, display area 6 is easily invaded by water oxygen, show unusually, if the encapsulation is glued 3 too wide then can't realize the display effect of narrow frame. It is to be understood that the width of the encapsulating adhesive 3 is the distance of the encapsulating adhesive 3 in the direction from the display area 6 to the non-display area.
For this reason, the cover plate 2 and the substrate base plate 1 of the embodiment of the present invention are provided with a first groove 21 and a second groove 11 on the surfaces opposite to each other, respectively, that is, the cover plate 2 is provided with the first groove 21, the substrate base plate 1 is provided with the second groove 11, and the encapsulation adhesive 3 is embedded into the first groove 21 and the second groove 11. Specifically, the first groove 21 and the second groove 11 in the embodiment of the present invention may be obtained by etching on the cover plate 2 and the substrate base plate 1, when the display panel is packaged, the packaging adhesive 3 is immersed in the periphery of the display area 6 including the first groove 21 and the second groove 11, the packaging adhesive 3 is cured on the periphery of the display area 6 including the first groove 21 and the second groove 11 by heating and curing, and the packaging adhesive 3 is cured in the first groove 21 and the second groove 11, so that the packaging effect may be enhanced, the pull force may be increased, the display panel may realize the effect of a narrow bezel, and normal display may be ensured.
Specifically, in the embodiment of the present invention, the first groove 21 and the second groove 11 form a set of grooves, in the embodiment of the present invention, four sets of grooves may be disposed on one side of the display panel, the four sets of grooves are disposed at intervals, and the four sets of grooves are disposed on two sides of the heat insulation wall 5. In other embodiments, two sets of grooves may be provided, and the two sets of grooves are respectively provided on two sides of the heat insulation wall 5; a group of grooves can be arranged to play a role in increasing the drawing force; four to six groups of grooves can be arranged at intervals on two sides of the heat insulation wall 5, the number and the positions of the grooves can be arranged according to actual conditions, and no specific limitation is made here.
In a preferred embodiment of the present invention, at least one of the first groove 21 and the second groove 11 is a dovetail groove. Specifically, the dovetail groove is formed such that the longitudinal section of the first groove 21 is trapezoidal in the direction perpendicular to the cover plate 2, and the length of the side of the longitudinal section of the first groove 21 close to the substrate base plate 1 is smaller than the length of the side far from the substrate base plate 1. The cured packaging adhesive 3 is formed in the dovetail groove, so that the packaging adhesive 3 in the dovetail groove and the side edge of the dovetail groove of the cover plate 2 or the substrate base plate 1 form a blocking effect, and the drawing force of the display panel is increased more remarkably in a drawing force test.
In this embodiment, the four groups of grooves all use dovetail grooves, and it should be noted that, in other embodiments, two adjacent groups of grooves may be used, where the first groove 21 of one group is a dovetail groove, the second groove 11 of the other group is a dovetail groove, and the dovetail grooves in the two groups of grooves are symmetrically arranged at intervals, so that the package pulling resistance of the display panel package adhesive 3 reaches a better state. When it needs to be explained, in two or more groups of grooves, the arrangement of the dovetail grooves may be in other arrangement modes. In other embodiments, the grooves may have other shapes, such as rectangular grooves, saw-tooth grooves, etc.
Specifically, in the embodiment of the present invention, the substrate base plate 1 includes a base plate body (not shown) and a functional layer disposed on the base plate body, wherein the second groove 11 is at least partially disposed in the base plate body. That is, in the embodiment of the present invention, the second groove 11 may be disposed on a functional layer, such as an insulating layer, and penetrate to the substrate body. Of course, in other embodiments, the second groove 11 may be directly disposed on the substrate body, and the second groove 11 is entirely disposed in the substrate body, so as to increase the drawing force of the display panel. By the method, the depth of the groove is not limited to the thickness of the functional layer, the groove can be made deeper, and the anti-drawing effect is higher.
Another embodiment of the present invention provides a display panel mother board, as shown in fig. 1 and 2, the display panel mother board includes a substrate base plate 1, a cover plate 2, a packaging adhesive 3, a heat insulation wall 5 and a cutting pad 4, a display area 6 and a non-display area surrounding the display area 6 are disposed on the substrate base plate 1; the cover plate 2 is arranged opposite to the substrate base plate 1; the packaging adhesive 3 is arranged around the periphery of the display area 6 and connected with the substrate base plate 1 and the cover plate 2, and further matched with the substrate base plate 1 and the cover plate 2 to provide a sealing space for the display area 6; the cutting cushion block 4 is embedded in the packaging adhesive 3 to allow the display panel to be cut along the cutting cushion block 4, wherein a hollow cavity 41 is formed in the cutting cushion block 4, and heat insulation gas is filled in the hollow cavity 41; at least one heat insulation wall 5 is located in the non-display area and embedded in the encapsulation adhesive 3.
It can be known that the display panel of the embodiment of the present invention can be obtained after the cutting pad 4 of the display panel motherboard of the embodiment of the present invention is cut.
According to the display panel mother board provided by the embodiment of the invention, the cutting cushion block 4 is arranged, so that when the display panel is cut, the display panel can be cut along the cutting cushion block 4, the cutting cushion block 4 is provided with the hollow cavity 41, when the laser is cut to the hollow cavity 41 of the cutting cushion block 4, the laser cutting can be carried out without laser energy to cut the hollow cavity 41, the situation that the laser cutting in the prior art is required to cut the cover plate 2 and the substrate base plate 1 and simultaneously cut the packaging adhesive 3 between the cover plate 2 and the substrate base plate 1 is avoided, therefore, the distance of cutting the packaging adhesive 3 by a cutting tool such as the laser cutting can be reduced, and the laser energy used in the cutting process is reduced; in addition, the hollow cavity 41 is filled with heat insulation gas, so that the heat transferred to the display area 6 by the heat generated by cutting with a cutting tool such as laser cutting is reduced, the influence of the heat generated by cutting with the cutting tool such as laser cutting on the display area is reduced, and the service life of the display panel is prolonged. Meanwhile, the transmission of energy to the display area during laser cutting is reduced, the distance between the cutting area and the display area is shortened, and a narrow frame is realized.
It should be noted that, a cutting pad block 4 may be disposed on each side edge of the display panel motherboard that needs to be cut. It should be noted that, when manufacturing a display panel such as a mobile phone mobile device, a larger display panel mother board is usually manufactured and cut to form a plurality of small-sized display panels, and when a large display panel mother board is cut into two or more small display panels, a cutting pad 4 may be disposed on a common side of two adjacent display panels, and the purpose of cutting the common side of two adjacent small display panels is achieved by cutting one cutting pad 4. The common side of two adjacent display panels can also be provided with two cutting cushion blocks 4, a certain distance exists between the two cutting cushion blocks 4, and the purpose of cutting the side of two small display panels is achieved by respectively cutting the two cutting cushion blocks 4.
Specifically, as shown in fig. 2, in the present embodiment, the dicing block 4 is fixed on the cover plate 2 and maintains a predetermined gap with the substrate 1, and the package adhesive 3 is further filled in the gap between the dicing block 4 and the substrate 1. The cutting cushion block 4 is fixed on the cover plate 2, so that the manufacturing difficulty of the substrate base plate 1 can be reduced, the difficulty of the display panel mother plate in the whole manufacturing process is reduced, and the manufacturing steps of the display panel mother plate are not increased. The cutting cushion block 4 keeps a preset gap with the substrate base plate 1, so that when the cover plate 2 and the substrate base plate 1 are combined and packaged, the contact precision of the cutting cushion block 4 and the substrate base plate 1 does not need to be strictly controlled, and the operation is easy.
Specifically, in the present embodiment, the cutting mat 4 is integrally formed with the cover plate 2. The hollow cavity 41 in the cutting mat 4 is filled with an inert gas as a heat insulating gas, in this embodiment, nitrogen gas may be filled, and in other embodiments, argon gas may be filled.
As shown in fig. 2, in this embodiment, the cutting pad 4 and the hollow cavity 41 are both perpendicular to the cover plate 2, so as to facilitate cutting, and facilitate the combination of the cover plate 2 and the substrate 1, thereby reducing the acting force between the cutting pad 4 and the packaging adhesive 3. In other embodiments, the cutting block 4 and the hollow cavity 41 may not be perpendicular to the cover plate 2, but should be satisfied that there is a gap in the vertical distance from the cover plate 2 to the substrate base plate 1 in the hollow cavity 41, so that the cutting tool can cut along the vertical gap of the hollow cavity 41.
The technical features of the above embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, the combination is considered to be within the scope of the present specification, for example, in other embodiments, the heat insulation wall 5 and the first and second grooves 21 and 11 may not be provided, and only the cutting pad 4 is provided to reduce the influence of the laser cutting heat on the display area. The cutting cushion block 4 and the heat insulation wall 5 can be arranged at the same time, and the first groove 21 and the second groove 11 are not arranged, so that the influence of laser cutting heat on the display area is reduced. The cutting cushion block 4, the first groove 21 and the second groove 11 can be arranged, so that the influence of laser cutting heat on a display area is reduced, and the drawing force of the display panel is increased.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (12)
1. A display panel, comprising:
the display device comprises a substrate base plate, a display area and a non-display area, wherein the substrate base plate is provided with the display area and the non-display area arranged around the display area;
the cover plate is arranged opposite to the substrate base plate;
the packaging adhesive is arranged around the periphery of the display area and is connected with the substrate base plate and the cover plate so as to be matched with the substrate base plate and the cover plate to provide a sealing space for the display area;
and the at least one heat insulation wall is positioned in the non-display area and embedded in the packaging adhesive and is used for reducing the transmission of heat generated by cutting to the display area.
2. The display panel according to claim 1, wherein the heat insulating wall is provided on the cover plate and/or the substrate base plate.
3. The display panel according to claim 1, wherein the heat insulation wall is provided with a hole structure.
4. The display panel according to claim 3,
and the hole structure is filled with heat insulation gas.
5. The display panel according to any one of claims 1 to 4, wherein the number of the heat insulation walls is at least two, and the at least two heat insulation walls are disposed at intervals from each other in a direction from the display area to the non-display area, and the sealing adhesive is filled in an interval area between the heat insulation walls.
6. The display panel according to any one of claims 1 to 4, wherein the material of the heat insulating wall comprises a metal or an inorganic material.
7. The display panel according to claim 6,
the metal material comprises titanium and silver, and the inorganic material comprises glass fiber or silicon oxynitride.
8. The display panel according to any one of claims 1 to 4, wherein a cross-sectional area of the heat insulating wall in a direction parallel to the display panel includes a square, a trapezoid, and a triangle.
9. The display panel according to any one of claims 1 to 4, wherein a first groove and a second groove are provided on surfaces of the cover plate and the substrate base plate that face each other, respectively, and the encapsulation adhesive is embedded in the first groove and the second groove.
10. The display panel of claim 9, wherein at least one of the first and second grooves is a dovetail groove.
11. A display panel motherboard, comprising:
the display device comprises a substrate base plate, a display area and a non-display area, wherein the substrate base plate is provided with the display area and the non-display area arranged around the display area;
the cover plate is arranged opposite to the substrate base plate;
the packaging adhesive is arranged around the periphery of the display area and is connected with the substrate base plate and the cover plate so as to be matched with the substrate base plate and the cover plate to provide a sealing space for the display area;
at least one heat insulation wall, which is positioned in the non-display area and is embedded in the packaging adhesive;
and the cutting cushion block is embedded into the packaging adhesive to allow the cutting cushion block to cut the display panel motherboard, wherein a hollow cavity is formed in the cutting cushion block, and heat insulation gas is filled in the hollow cavity to cut the display panel motherboard along the hollow cavity.
12. The display panel motherboard according to claim 11, wherein the dicing block is fixed to the cover plate with a predetermined gap from the substrate base plate, and the package adhesive is filled in the gap between the dicing block and the substrate base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911151370.4A CN111047970B (en) | 2019-11-21 | 2019-11-21 | Display panel and display panel mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911151370.4A CN111047970B (en) | 2019-11-21 | 2019-11-21 | Display panel and display panel mother board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111047970A CN111047970A (en) | 2020-04-21 |
| CN111047970B true CN111047970B (en) | 2022-04-19 |
Family
ID=70233062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911151370.4A Active CN111047970B (en) | 2019-11-21 | 2019-11-21 | Display panel and display panel mother board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111047970B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN213691248U (en) * | 2020-10-22 | 2021-07-13 | 合肥维信诺科技有限公司 | Display panel and display device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730603A (en) * | 2013-12-26 | 2014-04-16 | 京东方科技集团股份有限公司 | Method for encapsulating organic light-emitting device and organic light-emitting body |
| KR20140123778A (en) * | 2013-04-15 | 2014-10-23 | 삼성디스플레이 주식회사 | Display apparatus |
| CN105719974A (en) * | 2014-12-17 | 2016-06-29 | 株式会社迪思科 | Processing method for package substrate |
| CN108232043A (en) * | 2018-01-31 | 2018-06-29 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
| CN108281570A (en) * | 2018-02-27 | 2018-07-13 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof |
| CN108598284A (en) * | 2018-05-14 | 2018-09-28 | 昆山国显光电有限公司 | Display panel, display panel preparation method and display device |
| CN110289290A (en) * | 2019-06-24 | 2019-09-27 | 京东方科技集团股份有限公司 | A kind of display master blank and preparation method thereof, electroluminescence display panel |
| CN209496874U (en) * | 2019-02-28 | 2019-10-15 | 云谷（固安）科技有限公司 | Display panel and display device |
| WO2019214284A1 (en) * | 2018-05-11 | 2019-11-14 | 云谷（固安）科技有限公司 | Display screen and preparation method for display screen |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5255894B2 (en) * | 2008-04-30 | 2013-08-07 | 株式会社ジャパンディスプレイイースト | Manufacturing method of display device |
| CN108550552B (en) * | 2018-04-24 | 2021-03-26 | 昆山国显光电有限公司 | Display panel, display device, display panel mother board and manufacturing method thereof |
| CN108598116A (en) * | 2018-04-24 | 2018-09-28 | 昆山国显光电有限公司 | Display panel, display device, display panel motherboard and preparation method thereof |
| CN108615819B (en) * | 2018-04-25 | 2020-02-14 | 云谷（固安）科技有限公司 | Display panel, display panel manufacturing method and display terminal |
| CN108417733B (en) * | 2018-05-14 | 2020-09-22 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof and display terminal |
| CN108598283B (en) * | 2018-05-11 | 2020-01-10 | 昆山国显光电有限公司 | Display panel mother board, display panel and display terminal |
| CN108922981B (en) * | 2018-07-19 | 2021-02-23 | 上海天马微电子有限公司 | Display panel and display device |
| CN109713165B (en) * | 2019-01-15 | 2021-04-27 | 合肥京东方光电科技有限公司 | Display panel and preparation method thereof |
| CN109860208B (en) * | 2019-02-28 | 2021-09-21 | 云谷（固安）科技有限公司 | Display panel mother board, display panel and manufacturing method thereof |
-
2019
- 2019-11-21 CN CN201911151370.4A patent/CN111047970B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140123778A (en) * | 2013-04-15 | 2014-10-23 | 삼성디스플레이 주식회사 | Display apparatus |
| CN103730603A (en) * | 2013-12-26 | 2014-04-16 | 京东方科技集团股份有限公司 | Method for encapsulating organic light-emitting device and organic light-emitting body |
| CN105719974A (en) * | 2014-12-17 | 2016-06-29 | 株式会社迪思科 | Processing method for package substrate |
| CN108232043A (en) * | 2018-01-31 | 2018-06-29 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
| CN108281570A (en) * | 2018-02-27 | 2018-07-13 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof |
| WO2019214284A1 (en) * | 2018-05-11 | 2019-11-14 | 云谷（固安）科技有限公司 | Display screen and preparation method for display screen |
| CN108598284A (en) * | 2018-05-14 | 2018-09-28 | 昆山国显光电有限公司 | Display panel, display panel preparation method and display device |
| CN209496874U (en) * | 2019-02-28 | 2019-10-15 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN110289290A (en) * | 2019-06-24 | 2019-09-27 | 京东方科技集团股份有限公司 | A kind of display master blank and preparation method thereof, electroluminescence display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111047970A (en) | 2020-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6724933B2 (en) | Method for manufacturing light emitting device | |
| JP4649382B2 (en) | Method for manufacturing organic electroluminescent display device | |
| CN110048014B (en) | Display panel, manufacturing method thereof and display device | |
| CN109256481B (en) | Display panel and display device | |
| CN109560112B (en) | Display panel, display device and display panel preparation method | |
| CN111047970B (en) | Display panel and display panel mother board | |
| JP2009239116A (en) | Light emitting device | |
| KR20120140454A (en) | Method for manufacturing light emitting diode array with surface type and the light emitting diode array thereby | |
| WO2024060773A1 (en) | Display panel and display device | |
| JP5370238B2 (en) | Method for manufacturing light emitting device | |
| JP5693411B2 (en) | Manufacturing method of light emitting element mounting substrate | |
| JP2011139109A (en) | Light emitting device | |
| CN112582573B (en) | Display panel, preparation method thereof and display device | |
| JP7196813B2 (en) | Light emitting device and manufacturing method thereof | |
| KR20160084382A (en) | Optoelectronic component, optoelectronic arrangement, method for producing an optical element, and method for producing an optoelectronic component | |
| JP5436353B2 (en) | Light emitting device | |
| JP7354513B2 (en) | Electronic circuit device and its manufacturing method | |
| JP7448770B2 (en) | Lead frame and light emitting device manufacturing method | |
| JP2004128084A (en) | Flake type thermistor and its manufacturing method | |
| JP2006523920A (en) | Method for forming a semiconductor device | |
| KR100554635B1 (en) | SMD type LED chip with enhanced emitting efficiency and manufacturing method thereof | |
| CN111554627B (en) | Chip packaging method | |
| CN112968136B (en) | Display panel and preparation method thereof | |
| CN217562562U (en) | Lead frame structure, packaging structure, chip assembly and terminal | |
| JP7260309B2 (en) | semiconductor light emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |