CN110995197B - Acoustic wave filter device capable of adjusting inhibition - Google Patents
Acoustic wave filter device capable of adjusting inhibition Download PDFInfo
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- CN110995197B CN110995197B CN201911212787.7A CN201911212787A CN110995197B CN 110995197 B CN110995197 B CN 110995197B CN 201911212787 A CN201911212787 A CN 201911212787A CN 110995197 B CN110995197 B CN 110995197B
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- 230000005764 inhibitory process Effects 0.000 title claims abstract description 24
- 230000001629 suppression Effects 0.000 claims abstract description 59
- 230000033228 biological regulation Effects 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 15
- 238000004806 packaging method and process Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 10
- 238000004088 simulation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 4
- 238000012356 Product development Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention provides an adjustable-suppression acoustic wave filter device, which comprises a plurality of series acoustic wave resonators, wherein the end point of each series acoustic wave resonator is connected with a parallel acoustic wave resonator and then grounded, one end of the parallel acoustic wave resonator connected with the series acoustic wave resonator is arranged as the front end of the parallel acoustic wave resonator, and one end of the parallel acoustic wave resonator connected with the ground is arranged as the rear end of the parallel acoustic wave resonator; the device also comprises at least one inhibition and regulation acoustic wave resonator, wherein one end of the inhibition and regulation acoustic wave resonator is connected with any one of the series resonators, the other end of the inhibition and regulation acoustic wave resonator is connected with the rear end of any one of the parallel acoustic wave resonators, and any one of the series resonators is not connected with any one of the parallel acoustic wave resonators; the position of the suppression frequency point in the device is changed by changing the area and/or thickness of the suppression-adjustment acoustic wave resonator. According to the invention, the performance index of the filter can be improved by adding the inhibition adjusting acoustic wave resonator.
Description
Technical Field
The invention belongs to the technical field of acoustic wave filters, and particularly relates to an adjustable-suppression acoustic wave filter device.
Background
With the rapid development of wireless communication technology, handheld mobile communication products have been widely popularized and are being developed toward miniaturization, high performance, and multi-band. As a passive filter in a handheld mobile communication product, also plays an extremely important role and role therein.
The current filter devices in hand-held mobile communication products, mainly comprise SAW (Surface Acoustic Wave), BAW (Bulk Acoustic wave) and FBAR (Film Bulk Acoustic Wave), which can effectively inhibit external signals in a receiving path and a transmitting path and reduce signal interference in a radio frequency link. When the communication frequency band increases, interference between filters increases, and performance of the communication link is affected. In order to reduce interference between frequency bands, series inductance can be added in a filter connecting substrate to change the filter passband inhibition, but the design difficulty of the filter is increased, and the product development cost is also increased.
Fig. 1 is a general ladder filter structure, which includes a plurality of series acoustic wave resonators, and the rear end of each series acoustic wave resonator is respectively connected in parallel with one parallel acoustic wave resonator and then grounded. Fig. 2 is a general adjustable suppression ladder filter structure, on the basis of fig. 1, after an inductance L1 is added to the rear end of a parallel acoustic wave resonator, the rear end is grounded, and the position of a suppression frequency point can be adjusted by adjusting the inductance value of the inductance L1, as shown in fig. 9, l_500pH is a simulation curve when the inductance value of L1 is 500pH, l_750pH is a simulation curve when the inductance value of L1 is 750pH, l_1000pH is a simulation curve when the inductance value of L1 is 1000pH, and l_1250pH is a simulation curve when the inductance value of L1 is 1250 pH. In this case, the inductance value is generally large, so that the overall thickness after packaging increases, increasing the cost and size of the product.
Disclosure of Invention
The invention aims to solve the technical problems that: provided is an acoustic wave filter device capable of improving performance index of a filter.
The technical scheme adopted by the invention for solving the technical problems is as follows: an acoustic wave filter device with adjustable rejection comprising a plurality of series acoustic wave resonators, each series acoustic wave resonator having an end connected to a parallel acoustic wave resonator and then to ground, characterized in that:
The end, connected with the ground, of the parallel sound wave resonator is the rear end of the parallel sound wave resonator;
The device also comprises at least one inhibition and regulation acoustic wave resonator, wherein one end of the inhibition and regulation acoustic wave resonator is connected with any one of the series resonators, the other end of the inhibition and regulation acoustic wave resonator is connected with the rear end of any one of the parallel acoustic wave resonators, and any one of the series resonators is not connected with any one of the parallel acoustic wave resonators;
the position of the suppression frequency point in the device is changed by changing the area and/or thickness of the suppression-adjustment acoustic wave resonator.
According to the scheme, the rear end of the parallel acoustic wave resonator connected with the inhibition and regulation acoustic wave resonator is connected with the inductor and then grounded; the position of the suppression frequency point in the device is changed by at least one of changing the inductance value of the inductance, suppressing the area of the acoustic wave resonator, and suppressing the thickness of the acoustic wave resonator.
According to the scheme, more than two inhibition and adjustment acoustic wave resonators are arranged, and the other end of each inhibition and adjustment acoustic wave resonator is connected with the rear end of the same parallel acoustic wave resonator.
According to the scheme, the number of the inhibition and adjustment acoustic wave resonators is more than two, and at least one parallel acoustic wave resonator connected with the other end of the inhibition and adjustment acoustic wave resonator is different from the other parallel acoustic wave resonators connected with the other ends of the inhibition and adjustment acoustic wave resonators.
According to the scheme, the number of the inductors is less than or equal to the number of the suppression-adjustment acoustic wave resonators.
According to the scheme, the packaging structure is arranged outside the acoustic wave resonator, and the packaging structure is as follows: and carrying out planar connection on the flip chip and the substrate or adopting gold wires, and then carrying out solid sealing by using a dry film or resin.
The beneficial effects of the invention are as follows:
1. The filter performance index can be improved by adding at least one suppression-adjustment acoustic wave resonator and changing the position of the suppression frequency point in the device by changing the area and/or thickness of the suppression-adjustment acoustic wave resonator.
2. When the suppression and adjustment acoustic wave resonator and the inductance exist simultaneously, the inductance value of the inductance can be greatly reduced, so that the overall thickness of the chip is greatly reduced, and the cost and the size of the product can be reduced on the basis of improving the performance index of the filter.
Drawings
Fig. 1 is a schematic diagram of a general ladder filter.
Fig. 2 is a schematic diagram of a ladder filter structure with general tunable suppression.
Fig. 3 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a second embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a third embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a fourth embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a fifth embodiment of the present invention.
Fig. 8 is a schematic diagram of a chip package.
Fig. 9 is a graph of out-of-band rejection effects for different inductance values of a generic reject ladder filter.
Fig. 10 is a graph showing out-of-band suppression effects at different areas of a suppression-tuned acoustic wave resonator according to the third embodiment of the present invention.
Fig. 11 is a schematic structural diagram of a sixth embodiment of the present invention.
In the figure: 1. the sound wave filter comprises a sound wave filter substrate, a sound wave filter packaging protective cover, a packaging gold ball, a packaging substrate, a substrate output bonding pad, an inductor, a substrate input bonding pad and a sound wave filter output bonding pad.
Detailed Description
The invention will be further described with reference to specific examples and figures.
Embodiment one:
As shown in fig. 3, the acoustic wave filter device in this embodiment includes four series acoustic wave resonators S1 to S4, and one parallel acoustic wave resonator is connected after the first to fourth series acoustic wave resonators S1 to S4, that is, S5 to S8, and the rear ends of the parallel acoustic wave resonators S5 to S8 are grounded. Wherein one end of the sound wave suppression and regulation resonator SS is connected to the ground end of the first parallel resonator S5, and the other end of the sound wave suppression and regulation resonator SS is connected to the connection point of the third series resonator S3 and the fourth series resonator S4, the position of the suppression frequency point in the filter can be changed by changing the area of the sound wave suppression and regulation resonator SS and the thickness of the sound wave suppression and regulation resonator SS.
The acoustic wave resonator comprises a sandwich structure of a bottom electrode, a piezoelectric layer and a top electrode.
Embodiment two:
As shown in fig. 4, the acoustic wave filter device in this embodiment includes four series acoustic wave resonators S1 to S4, four parallel acoustic wave resonators S5 to S8, and a suppression-adjustment acoustic wave resonator SS.
The first to fourth series acoustic wave resonators S1 to S4 are respectively connected with one parallel acoustic wave resonator, namely S5 to S8, and the rear ends of the parallel acoustic wave resonators S5 to S7 are grounded. One end of the suppression adjusting acoustic wave resonator SS is connected to the ground terminal of the first parallel resonator S5, and the other end of the suppression adjusting acoustic wave resonator SS is connected to the connection point of the fourth series resonator S4 and the end point, and the position of the suppression frequency point in the filter can be changed by changing the area of the suppression adjusting acoustic wave resonator SS and the thickness of the suppression adjusting acoustic wave resonator SS.
Embodiment III:
as shown in fig. 5, the acoustic wave filter device in this embodiment includes four series acoustic wave resonators S1 to S4, four parallel acoustic wave resonators S5 to S8, a suppression and adjustment inductance element L, and a suppression and adjustment acoustic wave resonator SS.
The first to fourth series acoustic wave resonators S1 to S3 are respectively connected with one parallel acoustic wave resonator, namely S5 to S8, the rear end of the first parallel acoustic wave resonator S5 is connected with the suppression and regulation inductance element L and then grounded, and the rear ends of the second, third and fourth parallel acoustic wave resonators S6 to S8 are grounded. One end of the suppression adjusting acoustic wave resonator SS is connected to a connection point of the parallel resonator S5 and the suppression adjusting inductance element L, and the other end of the suppression adjusting acoustic wave resonator SS is connected to a connection point of the third series resonator S3 and the fourth series resonator S4.
In this embodiment, parameters of four series acoustic wave resonators S1 to S4 and four parallel acoustic wave resonators S5 to S8 are identical to those of the general adjustable suppression ladder filter shown in fig. 2 in the background art, but the suppression adjustment acoustic wave resonator SS is added, and the inductance value of L is 0.2nH.
The out-of-band rejection effect of the rejection-tuned acoustic wave resonator at different areas is shown in FIG. 10, wherein SS-A1500 is a simulation curve for an SS area of 1500 um 2, SS-A2500 is a simulation curve for an SS area of 2500 um 2, SS-A3500 is a simulation curve for an SS area of 3500 um 2, and SS-A4500 is a simulation curve for an SS area of 4500 um 2. As can be seen from a comparison between fig. 10 and fig. 9, the suppression area of the acoustic wave resonator SS can be adjusted to improve the position of the suppression frequency point outside the passband (i.e., in the figure), and at the same time, the value of the inductance L is greatly reduced (from hundreds to thousands of pH to 0.2 nH), so that the height of the chip package substrate can be reduced, and the product development cost can be reduced.
The sound wave resonator is provided with a packaging structure, and the packaging structure is as follows: and carrying out planar connection on the flip chip and the substrate or adopting gold wires, and then carrying out solid sealing by using a dry film or resin.
In this embodiment, a schematic diagram of a chip package structure is shown in fig. 8, in which an acoustic wave filter 1 is disposed on an acoustic wave filter substrate 2, the whole is packaged in a package substrate 5 and an acoustic wave filter package protective cover 3, the acoustic wave filter 1 is connected with a substrate input pad 8 through an acoustic wave filter output pad 9 and a package gold ball 4, the acoustic wave filter substrate 2 is provided with the inductor 7, and the end of the inductor 7 is grounded through the substrate output pad 6. Therefore, if the inductance value of the inductor 7 is small enough, the connection line of the inductor 7 is shortened, and the thickness of the package substrate 5 is greatly reduced, so that the thickness of the whole package structure is reduced, and the product development cost is reduced.
Embodiment four:
As shown in fig. 6, the acoustic wave filter device in this embodiment includes four series acoustic wave resonators S1 to S4, four parallel acoustic wave resonators S5 to S8, a suppression and adjustment inductance element L, and a suppression and adjustment acoustic wave resonator SS.
The first to third series acoustic wave resonators S1 to S3 are respectively connected with one parallel acoustic wave resonator, namely S5 to S7, the rear end of the first parallel acoustic wave resonator S5 is connected with the suppression and regulation inductance element L and then grounded, and the rear ends of the second, third and fourth parallel acoustic wave resonators S6 to S8 are grounded. One end of the suppression adjusting acoustic wave resonator SS is connected to a connection point of the parallel resonator S5 and the suppression adjusting inductance element L, and the other end of the suppression adjusting acoustic wave resonator SS is connected to a connection point of the fourth series resonator S4 and the end point, and the suppression adjusting function can be achieved by adjusting the inductance value of the suppression adjusting inductance element L, the area of the suppression adjusting acoustic wave resonator SS, and the thickness of the suppression adjusting acoustic wave resonator SS to change the position of the suppression frequency point in the filter.
Fifth embodiment:
As shown in fig. 7, the acoustic wave filter device in this embodiment includes four series acoustic wave resonators S1 to S4, four parallel acoustic wave resonators S5 to S8, a suppression and adjustment inductance element L, and two suppression and adjustment acoustic wave resonators SS1 and SS.
The first to fourth series acoustic wave resonators S1 to S4 are respectively connected with one parallel acoustic wave resonator, namely S5 to S8, the rear end of the first parallel acoustic wave resonator S5 is connected with the suppression and regulation inductance element L and then grounded, and the rear ends of the second, third and fourth parallel acoustic wave resonators S6 to S8 are grounded. One end of the first suppression-tuned acoustic wave resonator SS is connected to the connection point of the parallel resonator S5 and the suppression-tuned inductive element L, and the other end of the first suppression-tuned acoustic wave resonator SS is connected to the connection point of the fourth series resonator S4 and the terminal. One end of the second suppression-tuned acoustic wave resonator SS1 is connected to the connection point of the parallel resonator S5 and the suppression-tuned inductive element L, and the other end of the second suppression-tuned acoustic wave resonator SS1 is connected to the connection point of the third series resonator S3 and the fourth series resonator S4. The position of the suppression frequency point in the filter can be changed by adjusting the inductance value of the suppression and adjustment inductance element L, the areas of the two suppression and adjustment acoustic wave resonators SS and SS1 and the thicknesses of the two suppression and adjustment acoustic wave resonators SS and SS1, so that the suppression and adjustment effects are achieved.
Example six:
As shown in fig. 11, the acoustic wave filter device in this embodiment includes four series acoustic wave resonators S1 to S4, four parallel acoustic wave resonators S5 to S8, two suppression-adjustment inductance elements L, L1, and two suppression-adjustment acoustic wave resonators SS1 and SS.
The first to fourth series acoustic wave resonators S1 to S4 are respectively connected with one parallel acoustic wave resonator, namely S5 to S8, the rear end of the first parallel acoustic wave resonator S5 is connected with the suppression and regulation inductance element L and then grounded, the rear ends of the second and third parallel acoustic wave resonators S6 to S7 are grounded, and the rear end of the fourth parallel acoustic wave resonator S8 is connected with the suppression and regulation inductance element L1 and then grounded.
One end of the first suppression-tuned acoustic wave resonator SS is connected to the connection point of the parallel resonator S8 and the suppression-tuned inductive element L1, and the other end of the first suppression-tuned acoustic wave resonator SS is connected to the connection point of the second series resonator S2 and the third series resonator S3. One end of the second suppression-tuned acoustic wave resonator SS1 is connected to the connection point of the parallel resonator S5 and the suppression-tuned inductive element L, and the other end of the second suppression-tuned acoustic wave resonator SS1 is connected to the connection point of the third series resonator S3 and the fourth series resonator S4. The position of the suppression frequency point in the filter can be changed by adjusting the inductance value of the suppression and adjustment inductance element L, L1, the areas of the two suppression and adjustment acoustic wave resonators SS and SS1 and the thicknesses of the two suppression and adjustment acoustic wave resonators SS and SS1, so that the effect of suppression and adjustment is achieved.
It can be explained by the above embodiments that if there are at least 1 suppression-tuned acoustic wave resonator, it falls within the scope of the present invention to provide at the rear end of any one of the series resonators and the parallel acoustic wave resonator not connected thereto.
The above embodiments are merely for illustrating the design concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, the scope of the present invention is not limited to the above embodiments. Therefore, all equivalent changes or modifications according to the principles and design ideas of the present invention are within the scope of the present invention.
Claims (6)
1. An acoustic wave filter device with adjustable rejection comprising a plurality of series acoustic wave resonators, each series acoustic wave resonator having an end connected to a parallel acoustic wave resonator and then to ground, characterized in that:
The end, connected with the ground, of the parallel sound wave resonator is the rear end of the parallel sound wave resonator;
The device also comprises at least one inhibition and regulation acoustic wave resonator, wherein one end of the inhibition and regulation acoustic wave resonator is directly connected with the end point of any one of the series resonators, the other end of the inhibition and regulation acoustic wave resonator is directly connected with the rear end of any one of the parallel acoustic wave resonators, and any one of the series resonators is not connected with any one of the parallel acoustic wave resonators;
the rear end of the parallel acoustic wave resonator connected with the suppression and regulation acoustic wave resonator is connected with an inductor and then grounded; the position of the suppression frequency point in the device is changed by changing the inductance value of the inductor and suppressing and adjusting the area of the acoustic wave resonator.
2. The acoustic wave filter device according to claim 1, wherein: the position of the suppression frequency point in the device is changed by changing the thickness of the suppression adjusting acoustic wave resonator.
3. The acoustic wave filter device according to claim 1, wherein: the number of the inhibition and adjustment acoustic wave resonators is more than two, and the other end of each inhibition and adjustment acoustic wave resonator is directly connected with the rear end of the same parallel acoustic wave resonator.
4. The acoustic wave filter device according to claim 1, wherein: the number of the inhibition and adjustment acoustic wave resonators is more than two, and at least one parallel acoustic wave resonator connected with the other end of the inhibition and adjustment acoustic wave resonator is different from the parallel acoustic wave resonators connected with the other ends of the other inhibition and adjustment acoustic wave resonators.
5. The acoustic wave filter device according to claim 1, wherein: the number of inductances is less than or equal to the number of the suppression-tuned acoustic wave resonators.
6. The acoustic wave filter device according to claim 1, wherein: the sound wave resonator is provided with a packaging structure, and the packaging structure is as follows: and carrying out planar connection on the flip chip and the substrate or adopting gold wires, and then carrying out solid sealing by using a dry film or resin.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911212787.7A CN110995197B (en) | 2019-12-02 | 2019-12-02 | Acoustic wave filter device capable of adjusting inhibition |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911212787.7A CN110995197B (en) | 2019-12-02 | 2019-12-02 | Acoustic wave filter device capable of adjusting inhibition |
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| CN110995197A CN110995197A (en) | 2020-04-10 |
| CN110995197B true CN110995197B (en) | 2024-06-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112468111B (en) * | 2020-12-07 | 2022-07-12 | 诺思(天津)微系统有限责任公司 | Method for improving nonlinear performance, acoustic wave filter, multiplexer and communication equipment |
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|---|---|---|---|---|
| CN1489286A (en) * | 2002-08-06 | 2004-04-14 | 松下电器产业株式会社 | Elastic surface wave filter and electronic device using said filter |
| CN1619958A (en) * | 2003-11-20 | 2005-05-25 | 松下电器产业株式会社 | Filter using piezoelectric resonator |
| CN102017287A (en) * | 2008-04-25 | 2011-04-13 | 维斯普瑞公司 | Tunable matching network circuit topology selection |
| CN109787581A (en) * | 2018-11-28 | 2019-05-21 | 天津大学 | The filter based on bulk acoustic wave resonator with band logical and high pass dual function |
| CN109831176A (en) * | 2018-12-05 | 2019-05-31 | 天津大学 | A kind of piezoelectric acoustic-wave filter and duplexer |
-
2019
- 2019-12-02 CN CN201911212787.7A patent/CN110995197B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489286A (en) * | 2002-08-06 | 2004-04-14 | 松下电器产业株式会社 | Elastic surface wave filter and electronic device using said filter |
| CN1619958A (en) * | 2003-11-20 | 2005-05-25 | 松下电器产业株式会社 | Filter using piezoelectric resonator |
| CN102017287A (en) * | 2008-04-25 | 2011-04-13 | 维斯普瑞公司 | Tunable matching network circuit topology selection |
| CN109787581A (en) * | 2018-11-28 | 2019-05-21 | 天津大学 | The filter based on bulk acoustic wave resonator with band logical and high pass dual function |
| CN109831176A (en) * | 2018-12-05 | 2019-05-31 | 天津大学 | A kind of piezoelectric acoustic-wave filter and duplexer |
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