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CN110846623A - Device and method for improving uniformity of metal evaporation coating - Google Patents

Device and method for improving uniformity of metal evaporation coating Download PDF

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Publication number
CN110846623A
CN110846623A CN201911272268.XA CN201911272268A CN110846623A CN 110846623 A CN110846623 A CN 110846623A CN 201911272268 A CN201911272268 A CN 201911272268A CN 110846623 A CN110846623 A CN 110846623A
Authority
CN
China
Prior art keywords
electromagnetic stirring
evaporation
inner cylinder
substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911272268.XA
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Chinese (zh)
Inventor
宋金会
柳永博
卜镜元
孟德峰
张西京
王志立
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Dalian University of Technology
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Dalian University of Technology
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Publication date
Application filed by Dalian University of Technology filed Critical Dalian University of Technology
Priority to CN201911272268.XA priority Critical patent/CN110846623A/en
Publication of CN110846623A publication Critical patent/CN110846623A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention belongs to the field of metal coating, and particularly relates to a device and a method for improving the uniformity of metal evaporation coating. The device comprises an electromagnetic stirring coil, a fixed column, an inner cylinder, a substrate fixed mount, a substrate, an evaporation source, an evaporation material and a bell jar; the evaporation source and the evaporation material are arranged at the center line of the bell jar, the substrate is arranged on the substrate fixing frame and right above the evaporation source, the inner cylinder is concentrically arranged at the outer side of the evaporation source, and the electromagnetic stirring coils are distributed on the periphery of the outer side of the inner wall. The invention stirs the metal particles by the electromagnetic stirring device, thereby enabling the metal particles to be uniformly distributed in a horizontal plane and achieving the effect of enabling the metal evaporation coating film to be uniform.

Description

Device and method for improving uniformity of metal evaporation coating
Technical Field
The invention belongs to the field of metal coating, and particularly relates to a device and a method for improving the uniformity of metal evaporation coating.
Background
In the existing semiconductor processing and manufacturing process, the vacuum coating technology plays a very important role, and particularly, the metal evaporation coating technology is widely used for processing electrodes and the like. The metal evaporation coating has the advantages of simple equipment operation, high film forming purity, high speed and the like. The main factors affecting the quality of the metal evaporation coating are the shape of the evaporation source, the temperature of the evaporation source, the position and shape of the substrate, and the like.
The existing metal evaporation coating mostly adopts point evaporation source evaporation, because the distance from the point evaporation source to each position of the substrate is different, the flying distance of the metal particles between the evaporation source and the substrate is also different, so the collision probability of the metal particles and residual gas molecules in the vacuum chamber is also different in the flying process, and the problems of uneven coating thickness, different film forming quality and the like are caused when evaporation coating is carried out on a large-area substrate inevitably.
Disclosure of Invention
Aiming at the problems, the invention provides an electromagnetic stirring device and a method for improving the uniformity of metal evaporation coating, which are based on an evaporation coating instrument and are additionally provided with the electromagnetic stirring device so as to solve the problem of uniformity of metal evaporation coating. In an evaporation coating instrument, an evaporation source generates metal particles moving upwards, an electromagnetic stirring coil generates an alternating magnetic field, so that the metal particles generate induced current when passing through the alternating magnetic field, and the induced current and the alternating magnetic field generate electromagnetic force, so that the metal particles are pushed to move, and a stirring effect is generated; the metal particles after being stirred are more uniformly distributed on the same horizontal plane, thereby achieving the effect of improving the uniformity of the evaporation coating.
The technical scheme of the invention is as follows:
a device for improving the uniformity of metal evaporation coating comprises an electromagnetic stirring coil 7, an inner cylinder 6, a substrate fixing frame 5 and a bell jar 3;
the inner cylinder 6 is a cylindrical structure with an upper opening and a lower opening and is fixed in the bell jar 3, the middle bobbins of the inner cylinder and the bell jar are overlapped, the evaporation source 1 is arranged at the center of the bottom of the inner cylinder 6, and the metal evaporation material 2 is arranged in the evaporation source 1; a plurality of electromagnetic stirring coils 7 are fixed in the bell jar 3 through fixing columns 8, the electromagnetic stirring coils 7 are distributed around the inner cylinder 6 at equal intervals, the electromagnetic stirring coils 7 are positioned at the upper part of the inner cylinder 6, the upper surface of the electromagnetic stirring coils 7 is flush with the upper surface of the inner cylinder 6, and the electromagnetic stirring coils 7 apply alternating current through an external power supply; a substrate fixing frame 5 is arranged at the top in the bell jar 3, a substrate 4 is horizontally placed on the substrate fixing frame 5, and the substrate 4 is positioned right above the evaporation source 1.
The electromagnetic stirring coil 7 is of a block structure, the coil is arranged inside the electromagnetic stirring coil, the inner side of the block structure is arc-shaped and is attached to the outer wall of the inner cylinder 6, and the height of the electromagnetic stirring coil 7 is half of that of the inner cylinder 6.
The principle of the device is as follows:
when low-frequency current is introduced into the electromagnetic stirring coil 7, an alternating magnetic field is generated, the alternating magnetic field penetrates through the inner cylinder 6 and acts on the metal particles which come out of the evaporation source 1 and move upwards, induced potential and current are generated in the metal particles, the induced current acts with the alternating magnetic field generated by the electromagnetic stirring coil 7 to generate electromagnetic force, so that the metal particles are pushed to flow directionally, the stirring effect is achieved, and the metal particles after stirring are distributed more uniformly on the same horizontal plane.
A method for improving the uniformity of metal evaporation coating adopts the device, and comprises the following specific steps:
step 1, putting a metal evaporation material 2 into an evaporation source 1, and horizontally placing a substrate 4 on a substrate fixing frame 5.
And 2, starting the evaporation coating instrument, and applying 0.01M-1 MHz alternating current to the electromagnetic stirring coil 7 after the metal evaporation material 2 starts to evaporate, wherein the alternating voltage range is 50V-220V.
And 3, starting coating after the evaporation rate of the evaporation source 1 is stable, and obtaining a uniform metal film on the substrate 4.
The invention has the beneficial effects that:
1. the device of the invention can stir the passing metal particles due to the electromagnetic stirring coil, so that the metal particles are more uniformly distributed on the same horizontal plane, and uniform metal films can be obtained when metal is evaporated on substrates with different sizes.
2. The inner side of the electromagnetic stirring coil is provided with the inner cylinder, so that metal particles can be prevented from impacting the electromagnetic coil when moving, and the electromagnetic coil is prevented from being influenced, and the electromagnetic stirring coil has higher stability.
Drawings
FIG. 1 is a schematic view of an apparatus for improving the uniformity of a metal evaporation coating according to the present invention.
FIG. 2 is a schematic view of an electromagnetic stirring apparatus of the present invention.
In the figure: the device comprises an evaporation source 1, an evaporation material 2, a bell jar 3, a substrate 4, a substrate fixing frame 5, an inner cylinder 6, an electromagnetic stirring coil 7 and a fixing column 8.
Detailed Description
The following further describes a specific embodiment of the present invention with reference to the drawings and technical solutions.
A device for improving the uniformity of metal evaporation coating comprises an electromagnetic stirring device (an electromagnetic stirring coil 7, a fixing column 8 and an inner cylinder 6), a substrate fixing frame 5, a substrate 4, an evaporation source 1, an evaporation material 2 and a bell jar 3. The evaporation source 1 and the evaporation material 2 are arranged at the bottom of the bell jar 3 and are positioned at the central line of the bell jar 3, the substrate 4 is horizontally arranged on the substrate fixing frame 5 and is positioned right above the evaporation source 1, the inner cylinder 6 is concentrically arranged at the outer side of the evaporation source 1, and the electromagnetic stirring coil 7 is distributed around the outer side of the inner cylinder 6.
The electromagnetic stirring coil 7 is fixed on the bell jar 3 by a fixing column 8.
The electromagnetic stirring coils 7 are distributed on the outer side of the inner barrel 6 at equal intervals.
The inner side of the electromagnetic stirring coil 7 is arc-shaped and clings to the outer side of the inner cylinder 6.
Example 1
The device of the invention is used for evaporation coating, and the process is as follows:
first, a metal evaporation material 2 to be coated is put into an evaporation source 1, and then the evaporation source 1 heats the evaporation material 2. An alternating current of 220V and a frequency of 0.01 mhz was applied to the electromagnetic stirring coil 7, thereby generating an alternating magnetic field. When the metal particles generated from the evaporation material 2 move upward, the metal particles generate an induced current through the alternating magnetic field, and the induced current generates an electromagnetic force when passing through the alternating magnetic field, so that the metal particles start to rotate and rise in the inner cylinder 6, thereby uniformly distributing the metal particles on the same horizontal plane. The metal particles which have risen by rotation are fixed to the substrate 4 when they come into contact with the substrate 4, and since the metal particles are uniformly distributed on the same horizontal plane after being stirred by the electromagnetic stirring coil 7, the metal film formed on the substrate 4 is also uniform.
Example 2
The procedure is as in example 1, wherein an alternating current of 50V and a frequency of 1MHz is applied to the electromagnetic stirring coil 7. A uniform metal film can be obtained.
Example 3
The procedure is as in example 1, wherein an alternating current of 150V and a frequency of 0.5 MHz is applied to the electromagnetic stirring coil 7. A uniform metal film can be obtained.

Claims (3)

1. The device for improving the uniformity of the metal evaporation coating is characterized by comprising an electromagnetic stirring coil (7), an inner cylinder (6), a substrate fixing frame (5) and a bell jar (3);
the inner cylinder (6) is a cylindrical structure with an upper opening and a lower opening and is fixed in the bell jar (3), the middle bobbins of the inner cylinder and the bell jar are overlapped, the evaporation source (1) is arranged at the center of the bottom of the inner cylinder (6), and the metal evaporation material (2) is arranged in the evaporation source (1); the electromagnetic stirring device is characterized in that a plurality of electromagnetic stirring coils (7) are fixed in the bell jar (3) through fixing columns (8), the electromagnetic stirring coils (7) are distributed around the inner cylinder (6) at equal intervals, the electromagnetic stirring coils (7) are positioned at the upper part of the inner cylinder (6), the upper surface of the electromagnetic stirring coils (7) is flush with the upper surface of the inner cylinder (6), and alternating current is applied to the electromagnetic stirring coils (7) through an external power supply; the top in the bell jar (3) is provided with a substrate fixing frame (5), the substrate (4) is horizontally placed on the substrate fixing frame (5), and the substrate (4) is positioned right above the evaporation source (1).
2. The device for improving the uniformity of metal evaporation coating according to claim 1, wherein the electromagnetic stirring coil (7) is a block structure, the inner part of the block structure is a coil, the inner side of the block structure is an arc shape and is attached to the outer wall of the inner cylinder (6), and the height of the electromagnetic stirring coil (7) is half of the height of the inner cylinder (6).
3. The device for improving the uniformity of metal evaporation coating according to claim 1 or 2 is adopted for evaporation coating, and is characterized by comprising the following specific steps:
step 1, putting a metal evaporation material (2) into an evaporation source (1), and horizontally placing a substrate (4) on a substrate fixing frame (5);
step 2, starting an evaporation coating instrument, and applying 0.01M-1 MHz alternating current to the electromagnetic stirring coil (7) after the metal evaporation material (2) starts to evaporate, wherein the alternating voltage range is 50V-220V;
and 3, starting coating after the evaporation rate of the evaporation source (1) is stable, and obtaining a uniform metal film on the substrate (4).
CN201911272268.XA 2019-12-12 2019-12-12 Device and method for improving uniformity of metal evaporation coating Pending CN110846623A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911272268.XA CN110846623A (en) 2019-12-12 2019-12-12 Device and method for improving uniformity of metal evaporation coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911272268.XA CN110846623A (en) 2019-12-12 2019-12-12 Device and method for improving uniformity of metal evaporation coating

Publications (1)

Publication Number Publication Date
CN110846623A true CN110846623A (en) 2020-02-28

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Application Number Title Priority Date Filing Date
CN201911272268.XA Pending CN110846623A (en) 2019-12-12 2019-12-12 Device and method for improving uniformity of metal evaporation coating

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181790A (en) * 1975-01-14 1976-07-17 Yoichi Murayama
JPS58157966A (en) * 1982-03-15 1983-09-20 Hitachi Ltd Ion plating device
US6099705A (en) * 1999-09-08 2000-08-08 United Microelectronics Corp. Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer
CN101689468A (en) * 2007-04-17 2010-03-31 苏舍梅塔普拉斯有限责任公司 Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source
CN108515153A (en) * 2018-05-03 2018-09-11 燕山大学 A kind of resultant field spiral electromagnetic mixing apparatus
CN209722277U (en) * 2018-12-24 2019-12-03 北京铂阳顶荣光伏科技有限公司 A kind of film vapor deposition device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181790A (en) * 1975-01-14 1976-07-17 Yoichi Murayama
JPS58157966A (en) * 1982-03-15 1983-09-20 Hitachi Ltd Ion plating device
US6099705A (en) * 1999-09-08 2000-08-08 United Microelectronics Corp. Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer
CN101689468A (en) * 2007-04-17 2010-03-31 苏舍梅塔普拉斯有限责任公司 Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source
CN108515153A (en) * 2018-05-03 2018-09-11 燕山大学 A kind of resultant field spiral electromagnetic mixing apparatus
CN209722277U (en) * 2018-12-24 2019-12-03 北京铂阳顶荣光伏科技有限公司 A kind of film vapor deposition device

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Application publication date: 20200228

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