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CN110846623A - Device and method for improving uniformity of metal evaporation coating - Google Patents

Device and method for improving uniformity of metal evaporation coating Download PDF

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Publication number
CN110846623A
CN110846623A CN201911272268.XA CN201911272268A CN110846623A CN 110846623 A CN110846623 A CN 110846623A CN 201911272268 A CN201911272268 A CN 201911272268A CN 110846623 A CN110846623 A CN 110846623A
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electromagnetic stirring
inner cylinder
evaporation
metal
substrate
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宋金会
柳永博
卜镜元
孟德峰
张西京
王志立
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Dalian University of Technology
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon

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  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

本发明属于金属镀膜领域,具体来说,涉及一种用于提高金属蒸发镀膜均匀性的装置及方法。装置的组成包括电磁搅拌线圈、固定柱、内筒、基板固定架、基板、蒸发源、蒸发材料、钟罩;蒸发源和蒸发材料置于钟罩中线处,基板置于基板固定架上并在蒸发源正上方,内筒同心放置于蒸发源外侧,电磁搅拌线圈分布在内壁外侧四周。本发明通过电磁搅拌装置对金属粒子进行搅拌,从而使金属粒子在水平面内分布均匀,从而达到使金属蒸发镀膜均匀的效果。

Figure 201911272268

The invention belongs to the field of metal coating, and in particular relates to a device and method for improving the uniformity of metal evaporation coating. The composition of the device includes an electromagnetic stirring coil, a fixed column, an inner cylinder, a substrate holder, a substrate, an evaporation source, an evaporation material, and a bell jar; Just above the evaporation source, the inner cylinder is placed concentrically on the outside of the evaporation source, and the electromagnetic stirring coils are distributed around the outside of the inner wall. In the invention, the metal particles are stirred by the electromagnetic stirring device, so that the metal particles are evenly distributed in the horizontal plane, so as to achieve the effect of uniform metal evaporation coating.

Figure 201911272268

Description

一种用于提高金属蒸发镀膜均匀性的装置及方法A device and method for improving the uniformity of metal evaporation coating

技术领域technical field

本发明属于金属镀膜领域,具体来说,涉及一种用于提高金属蒸发镀膜均匀性的装置及方法。The invention belongs to the field of metal coating, and in particular relates to a device and method for improving the uniformity of metal evaporation coating.

背景技术Background technique

在现有半导体加工制造工艺中,真空镀膜技术占有非常重要的地位,特别是金属蒸发镀膜技术被广泛用于加工电极等。金属蒸发镀膜有设备操作简单、成膜纯度高、速度快等优点。影响金属蒸发镀膜质量的主要因素有蒸发源的形状、蒸发源的温度、基板的位置和形状等。In the existing semiconductor processing and manufacturing process, vacuum coating technology occupies a very important position, especially metal evaporation coating technology is widely used in processing electrodes and so on. Metal evaporation coating has the advantages of simple equipment operation, high film formation purity and fast speed. The main factors affecting the quality of metal evaporation coating are the shape of the evaporation source, the temperature of the evaporation source, the position and shape of the substrate, etc.

现有的金属蒸发镀膜多采用点蒸镀源蒸镀,由于点蒸镀源到基板各位置的距离不同,金属粒子在蒸发源与基板之间的飞行距离也不同,因此在飞行过程中金属粒子与真空腔室内残余气体分子发生撞击几率也不同,导致在大面积基板上进行蒸发镀膜时难免会造成镀膜厚度不均、成膜质量不同等问题。Existing metal evaporation coatings mostly use point evaporation sources for evaporation. Due to the different distances from the point evaporation sources to each position of the substrate, the flying distances of the metal particles between the evaporation source and the substrate are also different. The probability of collision with the residual gas molecules in the vacuum chamber is also different, resulting in problems such as uneven coating thickness and different film quality when evaporation coating is performed on a large-area substrate.

发明内容SUMMARY OF THE INVENTION

针对上述问题,本发明提出一种用于提高金属蒸发镀膜均匀性的电磁搅拌装置以及方法,以蒸发镀膜仪为基础,增加电磁搅拌装置,以解决金属蒸发镀膜均匀性问题。在蒸发镀膜仪中,蒸发源产生向上运动的金属粒子,电磁搅拌线圈产生交变磁场,使金属粒子通过交变磁场时产生感应电流,感应电流又和交变磁场产生电磁力,从而推动金属粒子运动,产生搅拌效果;通过搅拌后的金属粒子在同一水平面上分布更加均匀,从而达到提高蒸发镀膜均匀性的作用。In view of the above problems, the present invention proposes an electromagnetic stirring device and method for improving the uniformity of metal evaporation coating. Based on the evaporation coating instrument, an electromagnetic stirring device is added to solve the uniformity of metal evaporation coating. In the evaporation coating instrument, the evaporation source generates metal particles moving upward, and the electromagnetic stirring coil generates an alternating magnetic field, so that when the metal particles pass through the alternating magnetic field, an induced current is generated, and the induced current generates an electromagnetic force with the alternating magnetic field, thereby pushing the metal particles. Movement produces a stirring effect; after stirring, the metal particles are distributed more evenly on the same level, so as to improve the uniformity of the evaporation coating.

本发明的技术方案是:The technical scheme of the present invention is:

一种用于提高金属蒸发镀膜均匀性的装置,包括电磁搅拌线圈7、内筒6、基板固定架5和钟罩3;A device for improving the uniformity of metal evaporation coating, comprising an electromagnetic stirring coil 7, an inner cylinder 6, a substrate holder 5 and a bell jar 3;

所述的内筒6为上下开口的筒状结构,固定在钟罩3内,二者中线轴重合,蒸发源1置于内筒6底部的中心,金属蒸发材料2置于蒸发源1中;所述的电磁搅拌线圈7有多个,通过固定柱8固定在钟罩3内,且电磁搅拌线圈7等间隔分布在内筒6的四周,电磁搅拌线圈7位置在内筒6的上部,电磁搅拌线圈7的上表面与内筒6的上表面齐平,电磁搅拌线圈7通过外部电源施加交流电;钟罩3内的顶部设有基板固定架5,基板4水平放置在基板固定架5上,基板4位于蒸发源1正上方。The inner cylinder 6 is a tubular structure with upper and lower openings, and is fixed in the bell jar 3, and the centerlines of the two are coincident, the evaporation source 1 is placed in the center of the bottom of the inner cylinder 6, and the metal evaporation material 2 is placed in the evaporation source 1; Described electromagnetic stirring coil 7 has a plurality of, is fixed in the bell jar 3 by the fixed column 8, and the electromagnetic stirring coil 7 is distributed around the inner cylinder 6 at equal intervals, and the electromagnetic stirring coil 7 is positioned on the upper part of the inner cylinder 6, and the electromagnetic The upper surface of the stirring coil 7 is flush with the upper surface of the inner cylinder 6, and the electromagnetic stirring coil 7 applies alternating current through an external power supply; The substrate 4 is located directly above the evaporation source 1 .

所述的电磁搅拌线圈7为块状结构,内部为线圈,块状结构的内侧为弧形,贴在内筒6的外壁上,电磁搅拌线圈7的高度为内筒6高度的一半。The electromagnetic stirring coil 7 is a block structure, the inside is a coil, the inner side of the block structure is an arc, and is attached to the outer wall of the inner cylinder 6 , and the height of the electromagnetic stirring coil 7 is half of the height of the inner cylinder 6 .

该装置的原理如下:The principle of the device is as follows:

当在电磁搅拌线圈7内通入低频电流时,产生一个交变磁场,交变磁场穿过内筒6,作用于从蒸发源1中出来的、向上运动的金属粒子,在金属粒子中产生感应电势和电流,感应电流再和电磁搅拌线圈7产生的交变磁场作用产生电磁力,从而推动金属粒子定向流动,起到搅拌作用,通过搅拌后的金属粒子在同一水平面上分布更加均匀。When a low-frequency current is passed into the electromagnetic stirring coil 7, an alternating magnetic field is generated, and the alternating magnetic field passes through the inner cylinder 6 and acts on the metal particles moving upward from the evaporation source 1, and induces induction in the metal particles. The electric potential and current, the induced current and the alternating magnetic field generated by the electromagnetic stirring coil 7 generate electromagnetic force, thereby promoting the directional flow of the metal particles and playing a stirring role. The metal particles after stirring are more uniformly distributed on the same level.

一种用于提高金属蒸发镀膜均匀性的方法,采用上述装置,具体步骤如下:A method for improving the uniformity of metal evaporation coating, using the above device, the specific steps are as follows:

步骤1、将金属蒸发材料2放入蒸发源1中,基板4水平放置在基板固定架5上。Step 1. Put the metal evaporation material 2 into the evaporation source 1, and place the substrate 4 on the substrate holder 5 horizontally.

步骤2、启动蒸发镀膜仪,当金属蒸发材料2开始蒸发之后对电磁搅拌线圈7施加0.01M~1MHz的交流电,交变电压范围为50V-220V。Step 2, start the evaporation coating apparatus, and after the metal evaporation material 2 starts to evaporate, apply an alternating current of 0.01M to 1 MHz to the electromagnetic stirring coil 7, and the alternating voltage range is 50V-220V.

步骤3、蒸发源1蒸发速率稳定之后开始镀膜,在基板4上得到均匀的金属膜。Step 3: After the evaporation rate of the evaporation source 1 is stabilized, film coating is started, and a uniform metal film is obtained on the substrate 4 .

本发明的有益效果:Beneficial effects of the present invention:

1.本发明的装置中由于包含电磁搅拌线圈,可以对通过的金属粒子进行搅拌,使在同一水平面上得到更加均匀分布的金属粒子,从而在不同尺寸的基板上蒸镀金属时都可以得到均匀的金属膜。1. Since the device of the present invention includes an electromagnetic stirring coil, the passing metal particles can be stirred, so that more evenly distributed metal particles can be obtained on the same horizontal plane, so that even when metal is evaporated on substrates of different sizes, uniformity can be obtained. metal film.

2.本发明在电磁搅拌线圈内侧含有一个内筒,可以阻止金属粒子在运动时撞击到电磁线圈上从而对电磁线圈产生影响,因此有更高的稳定性。2. The present invention contains an inner cylinder inside the electromagnetic stirring coil, which can prevent the metal particles from hitting the electromagnetic coil during movement and thus have an impact on the electromagnetic coil, so it has higher stability.

附图说明Description of drawings

图1是本发明的一种用于提高金属蒸发镀膜均匀性的装置示意图。FIG. 1 is a schematic diagram of a device for improving the uniformity of metal evaporation coating according to the present invention.

图2是本发明的电磁搅拌装置示意图。Figure 2 is a schematic diagram of the electromagnetic stirring device of the present invention.

图中:1蒸发源,2蒸发材料,3钟罩,4基板,5基板固定架,6内筒,7电磁搅拌线圈,8固定柱。In the figure: 1 evaporation source, 2 evaporation material, 3 bell jar, 4 substrate, 5 substrate holder, 6 inner cylinder, 7 electromagnetic stirring coil, 8 fixed column.

具体实施方式Detailed ways

以下结合附图和技术方案,进一步说明本发明的具体实施方式。The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and technical solutions.

一种用于提高金属蒸发镀膜均匀性的装置,其组成包括电磁搅拌装置(电磁搅拌线圈7、固定柱8、内筒6)、基板固定架5、基板4、蒸发源1、蒸发材料2、钟罩3。蒸发源1和蒸发材料2置于钟罩3的底部,位于钟罩3中线处,基板4水平置于基板固定架5上并位于蒸发源1正上方,内筒6同心放置于蒸发源1外侧,电磁搅拌线圈7分布在内筒6外侧四周。A device for improving the uniformity of metal evaporation coating, its composition includes electromagnetic stirring device (electromagnetic stirring coil 7, fixing column 8, inner cylinder 6), substrate holder 5, substrate 4, evaporation source 1, evaporation material 2, Bell Jar 3. The evaporation source 1 and the evaporation material 2 are placed at the bottom of the bell jar 3, at the center line of the bell jar 3, the substrate 4 is placed horizontally on the substrate holder 5 and is directly above the evaporation source 1, and the inner cylinder 6 is placed concentrically outside the evaporation source 1 , the electromagnetic stirring coil 7 is distributed around the outer side of the inner cylinder 6 .

所述的电磁搅拌线圈7利用固定柱8固定在钟罩3上。The electromagnetic stirring coil 7 is fixed on the bell jar 3 by the fixing column 8 .

所述的电磁搅拌线圈7有多个,相等间隔分布在内筒6外侧。There are a plurality of the electromagnetic stirring coils 7 , which are distributed on the outside of the inner cylinder 6 at equal intervals.

所述的电磁搅拌线圈7内侧为圆弧形紧贴在内筒6外侧。The inner side of the electromagnetic stirring coil 7 is in an arc shape and is closely attached to the outer side of the inner cylinder 6 .

实施例1Example 1

使用本发明的装置进行蒸发镀膜,过程如下:Use the device of the present invention to carry out evaporation coating, and the process is as follows:

首先在蒸发源1中放入要镀膜的金属蒸发材料2,然后蒸发源1加热蒸发材料2。对电磁搅拌线圈7施加大小为220V,频率为0.01M赫兹的交变电流,从而产生交变磁场。当蒸发材料2产生的金属粒子向上运动时,经过交变磁场,金属粒子产生感应电流,同时此感应电流通过交变磁场时产生电磁力,进而使金属粒子在内筒6的内部开始旋转上升,从而使同一水平面上的金属粒子分布均匀。旋转上升的金属粒子接触到基板4时会固定到基板4上,因为经电磁搅拌线圈7搅拌之后金属粒子在同一水平面上分布均匀,因此在基板4上成的金属膜也是均匀的。First, the metal evaporation material 2 to be coated is put into the evaporation source 1 , and then the evaporation source 1 heats the evaporation material 2 . An alternating current with a magnitude of 220V and a frequency of 0.01M Hz is applied to the electromagnetic stirring coil 7 to generate an alternating magnetic field. When the metal particles generated by the evaporation material 2 move upward, the metal particles generate an induced current through the alternating magnetic field, and at the same time, the induced current generates an electromagnetic force when passing through the alternating magnetic field, so that the metal particles start to rotate and rise inside the inner cylinder 6, Thereby, the metal particles on the same horizontal plane are uniformly distributed. The rotating and rising metal particles will be fixed on the substrate 4 when they contact the substrate 4, because the metal particles are evenly distributed on the same horizontal plane after being stirred by the electromagnetic stirring coil 7, so the metal film formed on the substrate 4 is also uniform.

实施例2Example 2

过程同实施例1,其中,对电磁搅拌线圈7施加大小为50V,频率为1M赫兹的交变电流。可以得到均匀的金属膜。The process is the same as that of Embodiment 1, wherein an alternating current with a magnitude of 50V and a frequency of 1M Hz is applied to the electromagnetic stirring coil 7 . A uniform metal film can be obtained.

实施例3Example 3

过程同实施例1,其中,对电磁搅拌线圈7施加大小为150V,频率为0.5M赫兹的交变电流。可以得到均匀的金属膜。The process is the same as that of Embodiment 1, wherein an alternating current with a magnitude of 150V and a frequency of 0.5M Hz is applied to the electromagnetic stirring coil 7 . A uniform metal film can be obtained.

Claims (3)

1. The device for improving the uniformity of the metal evaporation coating is characterized by comprising an electromagnetic stirring coil (7), an inner cylinder (6), a substrate fixing frame (5) and a bell jar (3);
the inner cylinder (6) is a cylindrical structure with an upper opening and a lower opening and is fixed in the bell jar (3), the middle bobbins of the inner cylinder and the bell jar are overlapped, the evaporation source (1) is arranged at the center of the bottom of the inner cylinder (6), and the metal evaporation material (2) is arranged in the evaporation source (1); the electromagnetic stirring device is characterized in that a plurality of electromagnetic stirring coils (7) are fixed in the bell jar (3) through fixing columns (8), the electromagnetic stirring coils (7) are distributed around the inner cylinder (6) at equal intervals, the electromagnetic stirring coils (7) are positioned at the upper part of the inner cylinder (6), the upper surface of the electromagnetic stirring coils (7) is flush with the upper surface of the inner cylinder (6), and alternating current is applied to the electromagnetic stirring coils (7) through an external power supply; the top in the bell jar (3) is provided with a substrate fixing frame (5), the substrate (4) is horizontally placed on the substrate fixing frame (5), and the substrate (4) is positioned right above the evaporation source (1).
2. The device for improving the uniformity of metal evaporation coating according to claim 1, wherein the electromagnetic stirring coil (7) is a block structure, the inner part of the block structure is a coil, the inner side of the block structure is an arc shape and is attached to the outer wall of the inner cylinder (6), and the height of the electromagnetic stirring coil (7) is half of the height of the inner cylinder (6).
3. The device for improving the uniformity of metal evaporation coating according to claim 1 or 2 is adopted for evaporation coating, and is characterized by comprising the following specific steps:
step 1, putting a metal evaporation material (2) into an evaporation source (1), and horizontally placing a substrate (4) on a substrate fixing frame (5);
step 2, starting an evaporation coating instrument, and applying 0.01M-1 MHz alternating current to the electromagnetic stirring coil (7) after the metal evaporation material (2) starts to evaporate, wherein the alternating voltage range is 50V-220V;
and 3, starting coating after the evaporation rate of the evaporation source (1) is stable, and obtaining a uniform metal film on the substrate (4).
CN201911272268.XA 2019-12-12 2019-12-12 Device and method for improving uniformity of metal evaporation coating Pending CN110846623A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181790A (en) * 1975-01-14 1976-07-17 Yoichi Murayama
JPS58157966A (en) * 1982-03-15 1983-09-20 Hitachi Ltd Ion plating device
US6099705A (en) * 1999-09-08 2000-08-08 United Microelectronics Corp. Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer
CN101689468A (en) * 2007-04-17 2010-03-31 苏舍梅塔普拉斯有限责任公司 Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source
CN108515153A (en) * 2018-05-03 2018-09-11 燕山大学 A kind of resultant field spiral electromagnetic mixing apparatus
CN209722277U (en) * 2018-12-24 2019-12-03 北京铂阳顶荣光伏科技有限公司 A kind of film vapor deposition device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181790A (en) * 1975-01-14 1976-07-17 Yoichi Murayama
JPS58157966A (en) * 1982-03-15 1983-09-20 Hitachi Ltd Ion plating device
US6099705A (en) * 1999-09-08 2000-08-08 United Microelectronics Corp. Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer
CN101689468A (en) * 2007-04-17 2010-03-31 苏舍梅塔普拉斯有限责任公司 Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source
CN108515153A (en) * 2018-05-03 2018-09-11 燕山大学 A kind of resultant field spiral electromagnetic mixing apparatus
CN209722277U (en) * 2018-12-24 2019-12-03 北京铂阳顶荣光伏科技有限公司 A kind of film vapor deposition device

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Application publication date: 20200228