CN110846623A - Device and method for improving uniformity of metal evaporation coating - Google Patents
Device and method for improving uniformity of metal evaporation coating Download PDFInfo
- Publication number
- CN110846623A CN110846623A CN201911272268.XA CN201911272268A CN110846623A CN 110846623 A CN110846623 A CN 110846623A CN 201911272268 A CN201911272268 A CN 201911272268A CN 110846623 A CN110846623 A CN 110846623A
- Authority
- CN
- China
- Prior art keywords
- electromagnetic stirring
- inner cylinder
- evaporation
- metal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 29
- 239000011248 coating agent Substances 0.000 title claims abstract description 28
- 238000001883 metal evaporation Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title abstract description 9
- 238000003756 stirring Methods 0.000 claims abstract description 45
- 230000008020 evaporation Effects 0.000 claims abstract description 44
- 238000001704 evaporation Methods 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000002923 metal particle Substances 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明属于金属镀膜领域,具体来说,涉及一种用于提高金属蒸发镀膜均匀性的装置及方法。装置的组成包括电磁搅拌线圈、固定柱、内筒、基板固定架、基板、蒸发源、蒸发材料、钟罩;蒸发源和蒸发材料置于钟罩中线处,基板置于基板固定架上并在蒸发源正上方,内筒同心放置于蒸发源外侧,电磁搅拌线圈分布在内壁外侧四周。本发明通过电磁搅拌装置对金属粒子进行搅拌,从而使金属粒子在水平面内分布均匀,从而达到使金属蒸发镀膜均匀的效果。
The invention belongs to the field of metal coating, and in particular relates to a device and method for improving the uniformity of metal evaporation coating. The composition of the device includes an electromagnetic stirring coil, a fixed column, an inner cylinder, a substrate holder, a substrate, an evaporation source, an evaporation material, and a bell jar; Just above the evaporation source, the inner cylinder is placed concentrically on the outside of the evaporation source, and the electromagnetic stirring coils are distributed around the outside of the inner wall. In the invention, the metal particles are stirred by the electromagnetic stirring device, so that the metal particles are evenly distributed in the horizontal plane, so as to achieve the effect of uniform metal evaporation coating.
Description
技术领域technical field
本发明属于金属镀膜领域,具体来说,涉及一种用于提高金属蒸发镀膜均匀性的装置及方法。The invention belongs to the field of metal coating, and in particular relates to a device and method for improving the uniformity of metal evaporation coating.
背景技术Background technique
在现有半导体加工制造工艺中,真空镀膜技术占有非常重要的地位,特别是金属蒸发镀膜技术被广泛用于加工电极等。金属蒸发镀膜有设备操作简单、成膜纯度高、速度快等优点。影响金属蒸发镀膜质量的主要因素有蒸发源的形状、蒸发源的温度、基板的位置和形状等。In the existing semiconductor processing and manufacturing process, vacuum coating technology occupies a very important position, especially metal evaporation coating technology is widely used in processing electrodes and so on. Metal evaporation coating has the advantages of simple equipment operation, high film formation purity and fast speed. The main factors affecting the quality of metal evaporation coating are the shape of the evaporation source, the temperature of the evaporation source, the position and shape of the substrate, etc.
现有的金属蒸发镀膜多采用点蒸镀源蒸镀,由于点蒸镀源到基板各位置的距离不同,金属粒子在蒸发源与基板之间的飞行距离也不同,因此在飞行过程中金属粒子与真空腔室内残余气体分子发生撞击几率也不同,导致在大面积基板上进行蒸发镀膜时难免会造成镀膜厚度不均、成膜质量不同等问题。Existing metal evaporation coatings mostly use point evaporation sources for evaporation. Due to the different distances from the point evaporation sources to each position of the substrate, the flying distances of the metal particles between the evaporation source and the substrate are also different. The probability of collision with the residual gas molecules in the vacuum chamber is also different, resulting in problems such as uneven coating thickness and different film quality when evaporation coating is performed on a large-area substrate.
发明内容SUMMARY OF THE INVENTION
针对上述问题,本发明提出一种用于提高金属蒸发镀膜均匀性的电磁搅拌装置以及方法,以蒸发镀膜仪为基础,增加电磁搅拌装置,以解决金属蒸发镀膜均匀性问题。在蒸发镀膜仪中,蒸发源产生向上运动的金属粒子,电磁搅拌线圈产生交变磁场,使金属粒子通过交变磁场时产生感应电流,感应电流又和交变磁场产生电磁力,从而推动金属粒子运动,产生搅拌效果;通过搅拌后的金属粒子在同一水平面上分布更加均匀,从而达到提高蒸发镀膜均匀性的作用。In view of the above problems, the present invention proposes an electromagnetic stirring device and method for improving the uniformity of metal evaporation coating. Based on the evaporation coating instrument, an electromagnetic stirring device is added to solve the uniformity of metal evaporation coating. In the evaporation coating instrument, the evaporation source generates metal particles moving upward, and the electromagnetic stirring coil generates an alternating magnetic field, so that when the metal particles pass through the alternating magnetic field, an induced current is generated, and the induced current generates an electromagnetic force with the alternating magnetic field, thereby pushing the metal particles. Movement produces a stirring effect; after stirring, the metal particles are distributed more evenly on the same level, so as to improve the uniformity of the evaporation coating.
本发明的技术方案是:The technical scheme of the present invention is:
一种用于提高金属蒸发镀膜均匀性的装置,包括电磁搅拌线圈7、内筒6、基板固定架5和钟罩3;A device for improving the uniformity of metal evaporation coating, comprising an
所述的内筒6为上下开口的筒状结构,固定在钟罩3内,二者中线轴重合,蒸发源1置于内筒6底部的中心,金属蒸发材料2置于蒸发源1中;所述的电磁搅拌线圈7有多个,通过固定柱8固定在钟罩3内,且电磁搅拌线圈7等间隔分布在内筒6的四周,电磁搅拌线圈7位置在内筒6的上部,电磁搅拌线圈7的上表面与内筒6的上表面齐平,电磁搅拌线圈7通过外部电源施加交流电;钟罩3内的顶部设有基板固定架5,基板4水平放置在基板固定架5上,基板4位于蒸发源1正上方。The
所述的电磁搅拌线圈7为块状结构,内部为线圈,块状结构的内侧为弧形,贴在内筒6的外壁上,电磁搅拌线圈7的高度为内筒6高度的一半。The
该装置的原理如下:The principle of the device is as follows:
当在电磁搅拌线圈7内通入低频电流时,产生一个交变磁场,交变磁场穿过内筒6,作用于从蒸发源1中出来的、向上运动的金属粒子,在金属粒子中产生感应电势和电流,感应电流再和电磁搅拌线圈7产生的交变磁场作用产生电磁力,从而推动金属粒子定向流动,起到搅拌作用,通过搅拌后的金属粒子在同一水平面上分布更加均匀。When a low-frequency current is passed into the
一种用于提高金属蒸发镀膜均匀性的方法,采用上述装置,具体步骤如下:A method for improving the uniformity of metal evaporation coating, using the above device, the specific steps are as follows:
步骤1、将金属蒸发材料2放入蒸发源1中,基板4水平放置在基板固定架5上。
步骤2、启动蒸发镀膜仪,当金属蒸发材料2开始蒸发之后对电磁搅拌线圈7施加0.01M~1MHz的交流电,交变电压范围为50V-220V。
步骤3、蒸发源1蒸发速率稳定之后开始镀膜,在基板4上得到均匀的金属膜。Step 3: After the evaporation rate of the
本发明的有益效果:Beneficial effects of the present invention:
1.本发明的装置中由于包含电磁搅拌线圈,可以对通过的金属粒子进行搅拌,使在同一水平面上得到更加均匀分布的金属粒子,从而在不同尺寸的基板上蒸镀金属时都可以得到均匀的金属膜。1. Since the device of the present invention includes an electromagnetic stirring coil, the passing metal particles can be stirred, so that more evenly distributed metal particles can be obtained on the same horizontal plane, so that even when metal is evaporated on substrates of different sizes, uniformity can be obtained. metal film.
2.本发明在电磁搅拌线圈内侧含有一个内筒,可以阻止金属粒子在运动时撞击到电磁线圈上从而对电磁线圈产生影响,因此有更高的稳定性。2. The present invention contains an inner cylinder inside the electromagnetic stirring coil, which can prevent the metal particles from hitting the electromagnetic coil during movement and thus have an impact on the electromagnetic coil, so it has higher stability.
附图说明Description of drawings
图1是本发明的一种用于提高金属蒸发镀膜均匀性的装置示意图。FIG. 1 is a schematic diagram of a device for improving the uniformity of metal evaporation coating according to the present invention.
图2是本发明的电磁搅拌装置示意图。Figure 2 is a schematic diagram of the electromagnetic stirring device of the present invention.
图中:1蒸发源,2蒸发材料,3钟罩,4基板,5基板固定架,6内筒,7电磁搅拌线圈,8固定柱。In the figure: 1 evaporation source, 2 evaporation material, 3 bell jar, 4 substrate, 5 substrate holder, 6 inner cylinder, 7 electromagnetic stirring coil, 8 fixed column.
具体实施方式Detailed ways
以下结合附图和技术方案,进一步说明本发明的具体实施方式。The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and technical solutions.
一种用于提高金属蒸发镀膜均匀性的装置,其组成包括电磁搅拌装置(电磁搅拌线圈7、固定柱8、内筒6)、基板固定架5、基板4、蒸发源1、蒸发材料2、钟罩3。蒸发源1和蒸发材料2置于钟罩3的底部,位于钟罩3中线处,基板4水平置于基板固定架5上并位于蒸发源1正上方,内筒6同心放置于蒸发源1外侧,电磁搅拌线圈7分布在内筒6外侧四周。A device for improving the uniformity of metal evaporation coating, its composition includes electromagnetic stirring device (
所述的电磁搅拌线圈7利用固定柱8固定在钟罩3上。The
所述的电磁搅拌线圈7有多个,相等间隔分布在内筒6外侧。There are a plurality of the
所述的电磁搅拌线圈7内侧为圆弧形紧贴在内筒6外侧。The inner side of the
实施例1Example 1
使用本发明的装置进行蒸发镀膜,过程如下:Use the device of the present invention to carry out evaporation coating, and the process is as follows:
首先在蒸发源1中放入要镀膜的金属蒸发材料2,然后蒸发源1加热蒸发材料2。对电磁搅拌线圈7施加大小为220V,频率为0.01M赫兹的交变电流,从而产生交变磁场。当蒸发材料2产生的金属粒子向上运动时,经过交变磁场,金属粒子产生感应电流,同时此感应电流通过交变磁场时产生电磁力,进而使金属粒子在内筒6的内部开始旋转上升,从而使同一水平面上的金属粒子分布均匀。旋转上升的金属粒子接触到基板4时会固定到基板4上,因为经电磁搅拌线圈7搅拌之后金属粒子在同一水平面上分布均匀,因此在基板4上成的金属膜也是均匀的。First, the
实施例2Example 2
过程同实施例1,其中,对电磁搅拌线圈7施加大小为50V,频率为1M赫兹的交变电流。可以得到均匀的金属膜。The process is the same as that of
实施例3Example 3
过程同实施例1,其中,对电磁搅拌线圈7施加大小为150V,频率为0.5M赫兹的交变电流。可以得到均匀的金属膜。The process is the same as that of
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911272268.XA CN110846623A (en) | 2019-12-12 | 2019-12-12 | Device and method for improving uniformity of metal evaporation coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911272268.XA CN110846623A (en) | 2019-12-12 | 2019-12-12 | Device and method for improving uniformity of metal evaporation coating |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110846623A true CN110846623A (en) | 2020-02-28 |
Family
ID=69608911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911272268.XA Pending CN110846623A (en) | 2019-12-12 | 2019-12-12 | Device and method for improving uniformity of metal evaporation coating |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110846623A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5181790A (en) * | 1975-01-14 | 1976-07-17 | Yoichi Murayama | |
JPS58157966A (en) * | 1982-03-15 | 1983-09-20 | Hitachi Ltd | Ion plating device |
US6099705A (en) * | 1999-09-08 | 2000-08-08 | United Microelectronics Corp. | Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer |
CN101689468A (en) * | 2007-04-17 | 2010-03-31 | 苏舍梅塔普拉斯有限责任公司 | Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source |
CN108515153A (en) * | 2018-05-03 | 2018-09-11 | 燕山大学 | A kind of resultant field spiral electromagnetic mixing apparatus |
CN209722277U (en) * | 2018-12-24 | 2019-12-03 | 北京铂阳顶荣光伏科技有限公司 | A kind of film vapor deposition device |
-
2019
- 2019-12-12 CN CN201911272268.XA patent/CN110846623A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5181790A (en) * | 1975-01-14 | 1976-07-17 | Yoichi Murayama | |
JPS58157966A (en) * | 1982-03-15 | 1983-09-20 | Hitachi Ltd | Ion plating device |
US6099705A (en) * | 1999-09-08 | 2000-08-08 | United Microelectronics Corp. | Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer |
CN101689468A (en) * | 2007-04-17 | 2010-03-31 | 苏舍梅塔普拉斯有限责任公司 | Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source |
CN108515153A (en) * | 2018-05-03 | 2018-09-11 | 燕山大学 | A kind of resultant field spiral electromagnetic mixing apparatus |
CN209722277U (en) * | 2018-12-24 | 2019-12-03 | 北京铂阳顶荣光伏科技有限公司 | A kind of film vapor deposition device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105789010B (en) | Plasma processing apparatus and the adjusting method of plasma distribution | |
CN104217914B (en) | Plasma processing apparatus | |
CN104996000B (en) | Plasma source | |
TW200913056A (en) | Plasma processing apparatus, plasma processing method and storage medium | |
JP2003086580A (en) | Magnetic generator for semiconductor manufacturing apparatus, the apparatus and method for controlling magnetic field strength | |
TWI842768B (en) | Magnetic housing systems | |
TW201812987A (en) | Electrostatic chuck and manufacturing method for the same | |
JP2007227562A (en) | Apparatus and method for plasma treatment | |
TWI521559B (en) | Magnetic field distribution adjusting device for plasma processor and its adjusting method | |
CN105239057B (en) | Microwave plasma CVD device | |
US6524431B1 (en) | Apparatus for automatically cleaning mask | |
JP2010123810A (en) | Substrate supporting device and substrate temperature control method | |
CN110846623A (en) | Device and method for improving uniformity of metal evaporation coating | |
JP2009256711A (en) | Plasma-generating device, film-forming apparatus, and film-forming method | |
JPH0314907B2 (en) | ||
TWI714254B (en) | Plasma film forming device and plasma film forming method | |
JPS58206125A (en) | Treating device for plasma | |
KR20110016485A (en) | Plasma treatment apparatus and plasma treatment method | |
KR101184859B1 (en) | Hybrid plasma source and plasma generating apparatus using the same | |
CN205710902U (en) | Enhancement mode magnetron sputtering coil film coating equipment | |
JP2000328269A (en) | Dry etching device | |
JP3686563B2 (en) | Semiconductor device manufacturing method and plasma processing apparatus | |
CN102899632A (en) | Coating method and coating device thereof | |
JP2006299362A (en) | Sputter film deposition apparatus | |
JP2006083458A (en) | Sputtering system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200228 |