CN110839120B - Anti-shake camera module, anti-shake photosensitive assembly, manufacturing method of anti-shake photosensitive assembly and electronic equipment - Google Patents

Abstract

The invention discloses an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof and electronic equipment. The anti-shake photosensitive assembly comprises a circuit board assembly, at least one driver and at least one photosensitive element. The circuit board assembly provides at least one attaching surface. Each driver is correspondingly attached to each attaching surface of the circuit board assembly. Each photosensitive element is correspondingly arranged on each driver, and the drivers are positioned between the photosensitive elements and the attaching surface of the circuit board assembly so as to move the corresponding photosensitive elements through the drivers, thereby realizing the anti-shake function of the anti-shake photosensitive assembly.

Description

Anti-shake camera module, anti-shake photosensitive assembly, manufacturing method of anti-shake photosensitive assembly and electronic equipment

Technical Field

The present invention relates to the field of optical imaging technology, and in particular, to an anti-shake imaging module, an anti-shake photosensitive assembly, a method for manufacturing the same, and an electronic device.

Background

In recent years, electronic products, intelligent devices, and the like are increasingly being developed toward miniaturization and high performance, and such development trend of the electronic products, the intelligent devices has put more stringent demands on the size and imaging capability of an imaging module, which is one of standard configurations of the electronic products, the intelligent devices. The electronic product and intelligent equipment industries have no need to pursue the compact type and the integrated function of the camera module, and the anti-shake function is integrated into the camera module in the development surge so as to realize the anti-shake function of the camera module.

In the prior art, a conventional anti-shake motor is generally used to correct the offset of the camera module in the X and Y directions and the rotation in the XY plane, so as to implement the anti-shake function of the camera module. However, on the one hand, the conventional anti-shake motor is poor in correction effect on the offset of the image pickup module in the X and Y directions and the rotation in the XY plane; on the other hand, the traditional anti-shake motor has the advantages of complex structure, high cost, low yield, high power consumption and large volume, and can not meet the increasingly severe requirements of camera modules.

Disclosure of Invention

An objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, which can utilize a driver to realize an anti-shake function, so as to meet the requirement of the camera module on the increasingly severe anti-shake performance.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, which can provide a flat attaching surface for the driver, so as to avoid the problem of low yield caused by the substandard precision and flatness required for attaching the driver.

Another object of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, which can improve the yield, reliability and economic benefit of the anti-shake camera module.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, wherein in an embodiment of the invention, the driver is implemented as a micro-electro-mechanical system (MEMS for short) to move a photosensitive element attached to the MEMS through the MEMS, so as to implement an anti-shake function of the anti-shake camera module.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, wherein in an embodiment of the invention, an attaching substrate of the anti-shake photosensitive assembly provides the flat attaching surface, so that the MEMS is indirectly attached to a circuit board through the attaching substrate, so as to prevent the normal operation of the MEMS from being affected due to poor flatness of the circuit board.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, wherein in an embodiment of the present invention, the attaching substrate has high strength, so as to prevent the attaching substrate from deforming, thereby ensuring that the attaching surface can maintain good flatness.

Another object of the present invention is to provide an anti-shake imaging module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic apparatus, wherein in an embodiment of the present invention, the attaching substrate is implemented as a steel plate made of steel, so that the attaching substrate not only can provide a high deformation resistance to maintain the flatness of the attaching surface, but also can enhance the heat dissipation capability of the anti-shake imaging module.

Another object of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the attaching substrate is implemented as a plate material with high flatness made of a material with a certain strength, such as ceramic, alloy, metal material, polymer material, etc., so as to ensure that the attaching substrate can provide the attaching surface with high flatness.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, wherein in an embodiment of the invention, the attaching substrate is attached in an accommodating space of the circuit board, so as to reduce a distance between a photosensitive element of the anti-shake photosensitive assembly and the circuit board, so as to reduce an overall height of the anti-shake camera module.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, wherein in an embodiment of the present invention, the attaching substrate is provided with at least one vacuum groove, and vacuum is sucked through the vacuum groove when the MEMS is attached to the attaching substrate, so as to maintain the flatness of the MEMS, and prevent the MEMS from shifting or tilting before the glue is cured.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, wherein in an embodiment of the present invention, the anti-shake photosensitive assembly does not use the attaching substrate, but uses an RDL process or a grinding process to process a circuit board, so that the circuit board can provide the attaching surface with high flatness. In other words, the MEMS is directly attached to a wiring board having high flatness, preventing the normal operation of the MEMS from being affected by the unevenness of the wiring board.

To achieve at least one of the above and other objects and advantages, the present invention provides an anti-shake photosensitive assembly, comprising:

the circuit board assembly is provided with at least one attaching surface;

At least one driver, wherein each driver is correspondingly attached to each attaching surface of the circuit board assembly; and

At least one photosensitive element, wherein each photosensitive element is correspondingly arranged on each driver, and the drivers are positioned between the photosensitive elements and the attaching surface of the circuit board assembly so as to move the corresponding photosensitive element through the drivers.

In some embodiments of the present invention, the circuit board assembly includes a circuit board and an attaching substrate, wherein a lower surface of the attaching substrate is attached to the circuit board, so that an upper surface of the attaching substrate is used as the attaching surface of the circuit board assembly.

In some embodiments of the invention, the attaching substrate is a steel plate.

In some embodiments of the present invention, the attaching substrate is made of one material selected from the group consisting of ceramics, alloys, metals, and polymer materials.

In some embodiments of the invention, the attachment substrate has at least one vacuum slot, wherein each vacuum slot extends from the upper surface of the attachment substrate to the lower surface of the attachment substrate to form a through hole on the attachment substrate.

In some embodiments of the invention, the attachment substrate has a plurality of the vacuum grooves, wherein the plurality of vacuum grooves are uniformly distributed across the attachment substrate.

In some embodiments of the present invention, the circuit board has a receiving space, wherein the attaching substrate attached to the circuit board is received in the receiving space.

In some embodiments of the invention, the receiving space is a groove.

In some embodiments of the invention, the receiving space is a through hole.

In some embodiments of the present invention, the circuit board has a through hole type accommodation space, wherein the attaching substrate is attached to a bottom side of the circuit board, and the driver attached to the attaching substrate is accommodated in the accommodation space.

In some embodiments of the present invention, the circuit board assembly includes a circuit board processed through a grinding process, wherein the circuit board includes a mounting area and an edge area around the mounting area, and the mounting area of the circuit board is used as the mounting surface of the circuit board assembly.

In some embodiments of the present invention, the circuit board assembly includes a circuit board manufactured by a re-wiring layer process, wherein the circuit board includes a mounting region and an edge region located around the mounting region, and the mounting region of the circuit board is used as the mounting surface of the circuit board assembly.

In some embodiments of the invention, the circuit board assembly further comprises a reinforcing element, wherein the reinforcing element is disposed on the bottom side of the circuit board to strengthen the circuit board.

In some embodiments of the invention, the reinforcing element is a steel plate.

In some embodiments of the invention, the flatness of the attachment surface of the circuit board assembly is within 15 um.

In some embodiments of the invention, the photosensitive element is adhesively attached to the driver and the driver is adhesively attached to the attachment surface of the circuit board assembly.

In some embodiments of the invention, the attaching substrate is attached to the circuit board by means of particle glue bonding.

In some embodiments of the invention, the driver is a microelectromechanical system.

In some embodiments of the present invention, the driver includes a movable portion and an immovable portion, wherein the immovable portion of the driver is fixedly attached to the attaching surface of the circuit board assembly, and the photosensitive element is correspondingly attached to the movable portion of the driver.

In some embodiments of the invention, the driver further comprises at least one set of first connectors, at least one set of second connectors, and at least one set of elastic wires, wherein each set of first connectors is disposed on the movable portion of the driver, each set of second connectors is disposed on the immovable portion of the driver, wherein each set of first connectors and each set of second connectors are conductively connected by each set of elastic wires, wherein the wiring board is conductively connected with each set of second connectors of the driver, and the photosensitive element is conductively connected with each set of first connectors of the driver.

In some embodiments of the invention, the anti-shake photosensitive assembly further comprises at least one filter element, wherein each filter element is directly attached to a top surface of each photosensitive element.

According to another aspect of the present invention, there is also provided an anti-shake camera module, including:

At least one optical lens; and

The anti-shake photosensitive assembly is characterized in that each optical lens is correspondingly arranged on the photosensitive path of each photosensitive element of the anti-shake photosensitive assembly so as to assemble the anti-shake camera module.

According to another aspect of the present invention, there is also provided an electronic apparatus including:

an electronic device body; and

The anti-shake camera module is assembled on the electronic equipment body to form the electronic equipment.

According to another aspect of the present invention, there is provided a method for manufacturing an anti-shake photosensitive assembly, comprising the steps of:

correspondingly attaching a driver on an upper surface of an attaching substrate;

correspondingly attaching a photosensitive element to the driver;

Attaching the attaching substrate to a circuit board; and

And respectively connecting the driver and the photosensitive element with the circuit board in a conductive manner to manufacture the anti-shake photosensitive assembly.

In some embodiments of the present invention, the step of conductively connecting the driver and the photosensitive element with the circuit board to manufacture the anti-shake photosensitive assembly includes the steps of:

at least one group of first connecting pieces for conductively connecting the photosensitive element and the driver in a wire bonding manner; and

And at least one group of second connecting pieces of the driver and at least one group of circuit board connecting pieces of the circuit board are connected in a conducting manner through a wire bonding mode, wherein each group of first connecting pieces and each group of second connecting pieces are connected in a conducting manner through a group of elastic wires.

According to another aspect of the present invention, there is provided a method for manufacturing an anti-shake photosensitive assembly, comprising the steps of:

correspondingly attaching a driver to a mounting area of a circuit board, wherein the circuit board is manufactured through a rewiring layer process;

correspondingly attaching a photosensitive element to the driver; and

And respectively connecting the driver and the photosensitive element with the circuit board in a conductive manner to manufacture the anti-shake photosensitive assembly.

In some embodiments of the present invention, the method for manufacturing an anti-shake photosensitive assembly further includes the steps of:

a reinforcing element is arranged on the bottom side of the circuit board to increase the strength of the circuit board.

According to another aspect of the present invention, the present invention further provides a method for manufacturing an anti-shake camera module, including the steps of:

according to the manufacturing method of the anti-shake photosensitive assembly, an anti-shake photosensitive assembly is manufactured; and

And correspondingly arranging at least one optical lens on a photosensitive path of at least one photosensitive element of the anti-shake photosensitive assembly to manufacture an anti-shake camera module.

Further objects and advantages of the present invention will become fully apparent from the following description and the accompanying drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.

Drawings

Fig. 1 is a schematic perspective view of an anti-shake camera module according to a first preferred embodiment of the invention.

Fig. 2 is a schematic cross-sectional view of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 3 is a schematic perspective view of an anti-shake photosensitive assembly of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 4 is a schematic diagram illustrating one of the steps of manufacturing the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 5 is a schematic diagram illustrating a second step of manufacturing the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 6 is a schematic diagram illustrating a third step of manufacturing the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 7 is a schematic diagram illustrating a fourth step of manufacturing the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8A shows a first modification of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8B shows a second variant of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8C shows a third modification of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8D shows a fourth modification of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of an anti-shake camera module according to a second preferred embodiment of the invention.

Fig. 10 shows a modified embodiment of the anti-shake camera module according to the second preferred embodiment of the invention.

Fig. 11 is a schematic diagram of an electronic device with the anti-shake camera module according to the first or second preferred embodiment of the invention.

Fig. 12 is a flowchart of a method for manufacturing the anti-shake photosensitive assembly according to the first preferred embodiment of the invention.

Fig. 13 is a flowchart illustrating a method for manufacturing an anti-shake photosensitive assembly of the anti-shake camera module according to the second preferred embodiment of the invention.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

In the present invention, the terms "a" and "an" in the claims and specification should be understood as "one or more", i.e. in one embodiment the number of one element may be one, while in another embodiment the number of the element may be plural. The terms "a" and "an" are not to be construed as unique or singular, and the term "the" and "the" are not to be construed as limiting the amount of the element unless the amount of the element is specifically indicated as being only one in the disclosure of the present invention.

In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through a medium. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Along with the development of scientific technology, the miniaturization and high performance requirements of electronic equipment and intelligent terminals are also improved. The camera module is one of standard configurations of electronic products and intelligent devices, and the requirements on the size and performance of the camera module are also increasingly stringent, and particularly, the requirements on the anti-shake function of the camera module are more stringent. The traditional anti-shake motor not only can not correct the offset of the camera module in the X and Y directions and the rotation in the XY plane well, so that the anti-shake performance is poor, but also has complex structure, high cost, low yield, large power consumption and large volume, and can not meet the increasingly severe requirements of the camera module.

However, with the advent of Micro-Electro-MECHANIC SYSTEM (MEMS for short), the implementation of the anti-shake function has a new technical route, that is, after the MEMS is directly attached to the circuit board, the photosensitive chip is attached to the MEMS, so as to move the photosensitive chip through the MEMS, so as to compensate the offset of the photosensitive chip caused by shake, and further implement the anti-shake function of the camera module. However, the flatness of the circuit board is difficult to control, and the flatness and precision required by the attached MEMS are very high, so that the contradiction between the flatness and the flatness is difficult to reconcile, and therefore, the problem of lower yield is caused by the fact that the precision and the flatness required by the attached MEMS are not up to standard, and the mass production and the economic benefit of the camera module are seriously affected.

Referring to fig. 1 to 7 of the drawings, in order to solve the above-mentioned problems, a first preferred embodiment of the present invention provides an anti-shake camera module 1, wherein the anti-shake camera module 1 comprises at least one optical lens 10 and an anti-shake photosensitive assembly 20, wherein the anti-shake photosensitive assembly 20 further comprises a circuit board assembly 21, at least one driver 22 and at least one photosensitive element 23, wherein the circuit board assembly 21 provides at least one flat attaching surface 210, wherein each driver 22 is respectively attached to each attaching surface 210 of the circuit board assembly 21, wherein each photosensitive element 23 is respectively and correspondingly disposed between the driver 22, and the driver 22 is located between the photosensitive element 23 and the attaching surface 210 of the circuit board assembly 21 to move the corresponding photosensitive element 23 through each driver 22, wherein each optical lens 10 is respectively and correspondingly disposed on a photosensitive path of the photosensitive element 23 to form the anti-shake camera module 1.

Preferably, the driver 22 is implemented as a micro-electromechanical system (i.e., MEMS, also called micro-motor) to move the photosensitive element 23 by the MEMS to compensate for the offset or rotation of the photosensitive element 23 due to the shake, thereby implementing the anti-shake function of the anti-shake camera module 1. It should be appreciated that in order to ensure proper operation of the driver 22, the flatness of each of the attachment surfaces 210 of the wiring board assembly 21 is preferably controlled to be within 15 um.

It should be noted that, although the anti-shake camera module 1 in fig. 1 to 7 and the following description are taken as an example in which the anti-shake camera module 1 includes only one optical lens 10 and one driver 22, features and advantages of the anti-shake camera module 1 of the present invention are described, those skilled in the art will understand that the anti-shake camera module 1 in fig. 1 to 7 and the following description are only taken as an example, and the anti-shake camera module 1 disclosed in fig. 1 to 7 and the following description is not limited to the content and scope of the present invention, for example, in other examples of the anti-shake camera module 1, the number of optical lenses 10 may be more than one to form an array of anti-shake camera modules.

Specifically, as shown in fig. 2, the circuit board assembly 21 includes a circuit board 211 and an attaching substrate 212 disposed on the circuit board 211, wherein the attaching substrate 212 is made of a material having a certain strength and flatness, so that the attaching surface 210 having a high flatness is provided by the attaching substrate 212, so that the driver 22 is directly attached to the attaching substrate 212, so as to prevent the normal operation of the driver 22 from being affected by the uneven circuit board.

Preferably, as shown in fig. 2 and 3, the attaching substrate 212 has a flat plate structure, and the attaching substrate 212 has a flat upper surface 2121 and a lower surface 2122 parallel to the upper surface 2121, wherein the upper surface 2121 of the attaching substrate 212 serves as the attaching face 210 of the circuit board assembly 21 when the lower surface 2122 of the attaching substrate 212 is attached to the circuit board 211. It should be appreciated that in some other embodiments of the present invention, the upper surface 2121 of the attachment substrate 212 is a flat plane, and the lower surface 2122 of the attachment substrate 212 is an uneven curved surface; or the lower surface 2122 of the attaching substrate 212 may be further provided with a plurality of legs to fixedly mount the attaching substrate 212 to the wiring board 211 through the legs.

More preferably, the attaching substrate 212 is fixedly disposed on the top side of the circuit board 211 in a glue bonding manner. It will be appreciated that the glue may be implemented, but is not limited to, as a particle glue, which ensures that the thickness of the particle glue remains uniform after curing, since the particles of the largest diameter in the particle glue are evenly distributed. Of course, in some other embodiments of the present invention, the glue may be a thermosetting glue or other types of glue, or the attaching substrate 212 may be fixedly disposed on the circuit board 211 by embedding, soldering, or the like.

It should be noted that the attaching substrate 212 is made of steel material, so that the attaching substrate 212 is implemented as a steel plate 212 having high strength and flatness, wherein the upper surface 2121 of the steel plate 212 is used as the attaching surface 210 when the lower surface 2122 of the steel plate 212 and the wiring board 211 are attached together, so as to provide the attaching surface 210 of high flatness to the driver 22. In other words, after the steel plate 212 is specially processed and treated, the upper surface 2121 of the steel plate 212 may have a high flatness as the attaching surface 210 of the circuit board assembly 21, and the steel plate 212 may have a high strength and be not easily deformed, so that the steel plate 212 may stably provide the attaching surface 210 with high flatness for a long time, so as to prevent the flatness of the attaching surface 210 from being affected by external force, temperature variation, long-term use, etc. In addition, since the steel material has a large thermal conductivity, the steel plate 212 has good heat conduction and heat dissipation capability, so the steel plate 212 is also helpful to improve the heat dissipation capability of the anti-shake camera module 1.

It should be appreciated that in some other embodiments of the present invention, the attachment substrate 212 may also be made of a material having a certain strength and flatness, such as a polymer material, an alloy, a metal, a ceramic, etc., so as to provide the stable and highly-planarized attachment surface 210 through the attachment substrate 212, thereby avoiding the influence of the circuit board 211 on the driver 22.

In the first preferred embodiment of the present invention, as shown in fig. 2, the circuit board 211 includes a mounting area 2111, an edge area 2112 and at least one group of circuit board connectors 2113, wherein the mounting area 2111 and the edge area 2112 are integrally formed, and the edge area 2112 is located around the mounting area 2111, that is, the mounting area 2111 is located at the middle of the circuit board 211, and the edge area 2112 is located outside the circuit board 211. Each set of the board connectors 2113 is disposed at the edge region 2112 of the board 211, respectively.

The attaching substrate 212 is attached to the attaching region 2111 of the wiring board 211, and the attaching face 210 of the attaching substrate 212 corresponds to the attaching region 2111 of the wiring board 211, so that the driver 22 attached to the attaching face 210 corresponds to the attaching region 2111 of the wiring board 211, so that each set of the wiring board connectors 2113 is located around the driver 22, thereby facilitating conductive connection of the driver 22 and the wiring board 211.

Illustratively, as shown in fig. 2 and 3, the driver 22 generally includes a movable portion 221 and an immovable portion 222, wherein the immovable portion 222 of the driver 22 is fixedly attached to the attaching surface 210 of the attaching substrate 212, and the photosensitive element 23 is correspondingly attached to the movable portion 221 of the driver 22 to move the photosensitive element 23 by the movable portion 221 of the driver 22 to realize the anti-shake function of the anti-shake camera module 1. It should be understood that when the planar coordinate system XY is established with the attaching face 210, the movable portion 221 of the driver 22 attached to the attaching face 210 can move in the X-axis direction and the Y-axis direction and rotate in the XY plane, thereby realizing the anti-shake function of moving in the X-axis direction and the Y-axis direction and rotating in the XY plane by the driver 22.

Specifically, as shown in fig. 3, the driver 22 further includes at least one set of first connection members 223, at least one set of second connection members 224, and at least one set of elastic wires 225, wherein each set of first connection members 223 is disposed at the movable portion 221 of the driver 22, each set of second connection members 224 is disposed at the immovable portion 221 of the driver 22, and wherein each set of first connection members 223 and each set of second connection members 224 are conductively connected by each set of elastic wires 225. It should be appreciated that the elastic wire 225 of the driver 22 may be made of a conductive material having a certain elasticity, such as an aluminum wire, etc., to prevent the movement of the movable portion 221 of the driver 22 from being affected by the immovable portion 222 of the driver 22 by using the elastic deformation of the elastic wire 225.

It is noted that the first and second connection members 223, 224 of the driver 22 may be respectively connected discs, i.e. the first and second connection members 223, 224 of the driver 22 may be respectively disc-shaped for enabling both ends of the elastic wire 225 to be conductively connected to the first and second connection members 223, 224 of the driver 22, respectively. It should be appreciated that in other embodiments of the present invention, the first and second connectors 223, 224 of the driver 22 may each be spherical or otherwise shaped, as the present invention is not limited in this regard.

Further, as shown in fig. 3, each set of the second connection members 224 of the driver 22 is conductively connected to the wiring board connection members 2113 of the wiring board 211 by a set of leads in a wired manner; accordingly, each set of the first connection pieces 223 of the driver 22 can also be connected to the photosensitive element 23 in a conductive manner by another set of leads in a wire bonding manner so as to conductively connect the photosensitive element 23 to the wiring board 211 through the first connection pieces 223, the second connection pieces 224, and the elastic wires 225 of the driver 22. It should be understood that the present invention is not limited in the type of the lead wire, and for example, the lead wire may be implemented as a gold wire, a silver wire, a copper wire, or the like, as long as it is ensured that the lead wire can be conductively connected to the wiring board 211 and the driver 22, or that the driver 22 and the photosensitive element 23.

According to the first preferred embodiment of the present invention, as shown in fig. 2 and 3, the anti-shake photosensitive assembly 20 further comprises a first supporting element 24, wherein the first supporting element 24 is disposed between the upper surface 2121 of the attaching substrate 212 and the immovable portion 222 of the driver 22, so that the driver 22 is firmly attached to the upper surface 2121 of the attaching substrate 212 by the first supporting element 24. Since the first supporting element 24 has a certain thickness, the anti-shake photosensitive assembly 20 can further form a first safety gap 25 between the upper surface 2121 of the attaching substrate 212 and the movable portion 221 of the driver 22 through the first supporting element 24, so as to prevent the attaching substrate 212 from affecting the normal operation of the driver 22, thereby improving the product yield of the anti-shake camera module 1.

Preferably, the first supporting element 24 is formed by curing a first glue, so that not only the driver 22 and the attaching substrate 212 can be firmly bonded together by using the viscosity of the first glue, but also the first supporting element 24 with a certain strength can be formed by using the first glue after curing, so that the first safety gap 25 between the driver 22 and the attaching substrate 212 can be kept stable, so as to prevent the attaching substrate 212 from affecting the normal operation of the driver 22.

It is worth mentioning that the first glue used to form the first support element 24 may be a particulate glue, a heat curable glue or another type of glue.

Accordingly, in the first preferred embodiment of the present invention, as shown in fig. 2 and 3, the anti-shake photosensitive assembly 20 further comprises a second supporting member 26, wherein the second supporting member 26 is disposed between a bottom surface 232 of the photosensitive member 23 and the movable portion 221 of the driver 22, so as to firmly attach the photosensitive member 23 to the movable portion 221 of the driver 22 via the second supporting member 26. Since the second supporting element 26 has a certain thickness, the anti-shake photosensitive assembly 20 further forms a second safety gap 27 between the bottom surface 232 of the photosensitive element 23 and the movable portion 221 of the driver 22 through the second supporting element 26, so as to prevent the photosensitive element 23 from affecting the normal operation of the driver 22, thereby improving the product yield of the anti-shake imaging module 1.

It should be understood that when the bottom surface 232 of the photosensitive element 23 is attached to the movable portion 221 of the driver 22, a top surface 231 of the photosensitive element 23 faces the optical lens 10, that is, the top surface 231 of the photosensitive element 23 is implemented as a photosensitive surface of the photosensitive element 23.

Preferably, the second supporting element 26 is formed by curing a second glue, so that not only the photosensitive element 23 and the driver 22 can be firmly adhered together by using the viscosity of the second glue, but also the second supporting element 26 with a certain strength can be formed by using the second glue after curing, so that the second safety gap 27 between the driver 22 and the photosensitive element 23 can be kept stable, so as to prevent the photosensitive element 23 from affecting the normal operation of the driver 22.

It is worth mentioning that the second glue used to form the second support element 26 may be a particle glue, a heat curable glue or another type of glue.

Referring to fig. 1 and 2, the anti-shake camera module 1 further includes a base 30, wherein the base 30 is disposed at the edge region 2112 of the circuit board 211 of the circuit board assembly 21 of the anti-shake photosensitive assembly 20, and the optical lens 10 is mounted on the top surface of the base 30, so that the optical lens 10 is maintained in the photosensitive path of the photosensitive element 23 of the anti-shake photosensitive assembly 20.

In addition, in the first preferred embodiment of the present invention, as shown in fig. 2, the anti-shake photosensitive assembly 20 further comprises a light filtering element 28, wherein the light filtering element 28 is assembled to the base 30 such that the light filtering element 28 is kept in the photosensitive path of the photosensitive element 23, wherein the light filtering element 28 is located between the optical lens 10 and the photosensitive element 23, so that the light entering the anti-shake imaging module 1 from the optical lens 10 can be received and photoelectrically converted by the photosensitive surface of the photosensitive element 23 after being filtered by the light filtering element 28, thereby improving the imaging quality of the anti-shake imaging module 1, for example, the light filtering element 28 can filter the infrared portion of the light entering the anti-shake imaging module 1 from the optical lens 10. It should be understood that in different examples of the anti-shake camera module 1, the filter element 28 can be implemented as different types, for example, the filter element 28 can be implemented as an infrared cut filter, a full-spectrum filter, other filters or a combination of multiple filters, and the like, which is not limited in the present invention.

Referring to fig. 4 to 7, which are schematic views of the manufacturing process of the anti-shake photosensitive assembly 20 and the manufacturing process of the anti-shake camera module 1 according to the present invention, it should be understood by those skilled in the art that the manufacturing process of the anti-shake photosensitive assembly 20 and the manufacturing process of the anti-shake camera module 1 shown in fig. 4 to 7 are only examples to illustrate the features and advantages of the present invention, and do not limit the content and scope of the present invention.

Specifically, fig. 4 illustrates an example process of attaching the driver 22 to the attachment substrate 212, wherein a first glue is applied to the upper surface 2121 of the attachment substrate 212, and then the driver 22 is correspondingly disposed on the upper surface 2121 of the attachment substrate 212, wherein the first glue applied to the upper surface 2121 of the attachment substrate 212 corresponds to the non-movable portion 222 of the driver 22, so as to form the first supporting element 24 between the upper surface 2121 of the attachment substrate 212 and the non-movable portion 222 of the driver 22 after the first glue is cured, and the first safety gap 25 is formed between the upper surface 2121 of the attachment substrate 212 and the movable portion 221 of the driver 22, so as to prevent the attachment substrate 212 from affecting normal operation of the driver 22.

It should be noted that, in some other embodiments of the present invention, a first glue may be applied to the immovable portion 222 of the driver 22, and then the driver 22 is correspondingly disposed on the upper surface 2121 of the attaching substrate 212, so as to form the first supporting element 24 between the upper surface 2121 of the attaching substrate 212 and the immovable portion 222 of the driver 22 after the first glue is cured, and form the first safety gap 25 between the upper surface 2121 of the attaching substrate 212 and the movable portion 221 of the driver 22.

It should be noted that, because the first glue has a certain fluidity before curing, so that the driver 22 is easily shifted or inclined on the upper surface 2121 of the attaching substrate 212, and the first safety gap 25 is unstable, an external force needs to be applied to stably hold the driver 22 to the attaching substrate 212.

Therefore, in the first preferred embodiment of the present invention, as shown in fig. 4, the attaching substrate 212 is further provided with at least one vacuum groove 2123, wherein each vacuum groove 2123 extends from the upper surface 2121 of the attaching substrate 212 to the lower surface 2122 of the attaching substrate 212 to form a through hole penetrating up and down on the attaching substrate 212, so that vacuum is absorbed from the lower surface 2122 of the attaching substrate 212 through the vacuum groove 2123 during the process of attaching the driver 22 to the attaching surface 210 of the attaching substrate 212 to form a vacuum area between the attaching substrate 212 and the driver 22, thereby firmly holding the driver 22 and the attaching substrate 212 together to prevent the driver 22 from being deviated or falling off, so as to ensure the flatness of the driver 22. It should be appreciated that in the present invention, since the vacuum grooves originally opened on the circuit board are provided on the attaching substrate 212, this avoids the process of re-filling the vacuum grooves on the circuit board during the post-packaging process, and also avoids the risk of contamination of the module by the vacuum grooves of the circuit board.

Illustratively, as shown in fig. 4, the attaching substrate 212 is provided with five vacuum grooves 2123, wherein one vacuum groove 2123 is located at the center of the attaching substrate 212, and the other four vacuum grooves 2123 are uniformly distributed on the peripheral edge of the attaching substrate 212 so as to apply uniform suction force to each position of the driver 22 when vacuum is pumped through the vacuum grooves 2123, thereby ensuring high flatness of the driver 22. It should be appreciated that in some other embodiments of the present invention, the attachment substrate 212 may be further provided with other numbers of the vacuum grooves 2123, and the vacuum grooves 2123 may be arranged on the attachment substrate 212 in any arrangement such as a matrix arrangement, a ring arrangement, a random arrangement, etc., which is not limited in the present invention.

Fig. 5 shows an example process of attaching the photosensitive element 23 to the driver 22, in which a second glue is applied to a portion of the movable portion 221 of the driver 22, and then the photosensitive element 23 is correspondingly disposed to the movable portion 221 of the driver 22, so as to form the second supporting element 26 between the bottom surface 232 of the photosensitive element 23 and a portion of the movable portion 221 of the driver 22 after the second glue is cured, and form the second safety gap 27 between the bottom surface 232 of the photosensitive element 23 and another portion of the movable portion 221 of the driver 22, so as to prevent the photosensitive element 23 from affecting the normal operation of the driver 22.

Of course, in some other embodiments of the present invention, a second glue may be applied to the bottom surface 232 of the photosensitive element 23, and then the photosensitive element 23 may be correspondingly disposed on the movable portion 221 of the driver 22, so as to form the second supporting element 26 between the bottom surface 232 of the photosensitive element 23 and a portion of the movable portion 221 of the driver 22 after the second glue is cured, and form the second safety gap 27 between the bottom surface 232 of the photosensitive element 23 and another portion of the movable portion 221 of the driver 22, so as to prevent the photosensitive element 23 from affecting the normal operation of the driver 22.

In fig. 6, the attaching substrate 212 is first attached to the circuit board 211, and then the circuit board connector 2113 of the circuit board 211 and the second connector 224 of the driver 22 are connected in a conductive manner by wire bonding, and the first connector 223 of the driver 22 and the photosensitive element 23 are connected in a conductive manner by wire bonding, so that the photosensitive element 23 and the circuit board 211 are connected in a conductive manner by the elastic wire 225 of the driver 22, thereby manufacturing the anti-shake photosensitive assembly 20. In other words, after the attaching substrate 212 is attached to the wiring board 211, the driver 22 and the wiring board 211 and the driver 22 and the photosensitive element 23 are conductively connected by wire bonding, respectively.

It should be noted that, in some other embodiments of the present invention, the first connection member 223 of the driver 22 and the photosensitive element 23 may be connected in a conductive manner by wire bonding before the attaching substrate 212 is attached to the circuit board 211; next, after the attachment substrate 212 is attached to the wiring board 211, the driver 22 and the wiring board 211 are connected in a conductive manner by wire bonding. Of course, in other embodiments of the present invention, after the attaching substrate 212 is attached to the circuit board 211, the photosensitive element 23 and the circuit board 211 may be directly connected in conduction by a wire having elasticity.

It should be noted that although the steps for manufacturing the anti-shake photosensitive assembly 20 in the first preferred embodiment and the fig. 4 to 6 are as follows: the driver 22 is attached to the attaching substrate 212, the photosensitive element 23 is attached to the driver 22, and finally the attaching substrate 212 is attached to the circuit board 211, and the photosensitive element 23 and the driver 22 are connected in a conductive manner, and the driver 22 and the circuit board 211 are connected in a conductive manner. It will be appreciated by those skilled in the art that the steps of manufacturing the anti-shake photosensitive assembly 20 in fig. 4 to 6 and the first preferred embodiment are merely examples to illustrate the features and advantages of the anti-shake photosensitive assembly 20 of the present invention, and do not limit the content and scope of the present invention, for example, in other examples of manufacturing the anti-shake photosensitive assembly 20, the attaching substrate 212 may be attached to the circuit board 211, then the driver 22 may be attached to the attaching substrate 212, and finally the photosensitive element 23 may be attached to the driver 22 to manufacture the anti-shake photosensitive assembly 20; or, the photosensitive element 23 may be attached to the driver 22, then the driver 22 may be attached to the attaching substrate 212, and finally the attaching substrate 212 may be attached to the circuit board 211, so as to manufacture the anti-shake photosensitive assembly 20.

In fig. 7, the base 30 is assembled to the edge region 2112 of the circuit board 211, and the filter element 28 and the optical lens 10 are assembled to the base 30, respectively, so that the filter element 28 and the optical lens 10 are both maintained in the photosensitive path of the photosensitive element 23, thereby manufacturing the anti-shake imaging module 1. It should be appreciated that the base 30 may be formed in a manufacturing process such as, but not limited to, injection molding, die casting, molding, and the like.

Notably, in some other embodiments of the present invention, the base 30 may be formed by a molding process to form a molded base (not shown) that encapsulates the edge region 2112 of the circuit board 211 prior to attaching the attachment substrate 212 to the attachment region 2111 of the circuit board 211; next, after the attachment substrate 212 is attached to the attachment region 2111 of the wiring board 211, the filter element 28 and the optical lens 10 are assembled to the base 30, respectively. That is, the base 30 may be assembled to the circuit board 211 before attaching the attaching substrate 212, or may be assembled to the circuit board 211 after attaching the attaching substrate 212, which is not limited in the present invention.

Fig. 8A shows a first variant of the anti-shake camera module 1, in which the filter element 28 of the anti-shake photosensitive assembly 20 of the anti-shake camera module 1 is directly attached to the top surface 231 of the photosensitive element 23, so as to reduce the distance between the filter element 28 and the photosensitive element 23, and thus the height of the base 30, so as to reduce the overall height of the anti-shake camera module 1.

Fig. 8B shows a second variant of the anti-shake camera module 1, wherein the circuit board 211 of the circuit board assembly 21 of the anti-shake photosensitive assembly 20 of the anti-shake camera module 1 has at least one accommodation space 2114, wherein the mounting area 2111 of the circuit board 211 is formed in each accommodation space 2114 of the circuit board 211, wherein the attachment substrate 212 mounted in the mounting area 2111 is accommodated in the accommodation space 2114 of the circuit board 211, so as to reduce the height of the anti-shake photosensitive assembly 20, thereby avoiding the increase of the height of the anti-shake camera module 1 due to the addition of the attachment substrate 212, so as to satisfy the miniaturization requirement of electronic devices and smart products on the camera module.

Note that, in this example of the anti-shake camera module 1 shown in fig. 8B, the accommodation space 2114 may be a groove, and in the third modified embodiment of the anti-shake camera module 1 shown in fig. 8C, the accommodation space 2114 may also be a through hole, that is, the type of the accommodation space 2114 may not be limited, and it is sufficient that it is capable of accommodating the attachment substrate 212.

It should be noted that the size of the accommodating space 2114 may be greater than the size of the outer edge of the attaching substrate 212, or may be equal to the size of the outer edge of the attaching substrate 212, and the present invention is not limited in this respect.

Fig. 8D shows a fourth modification of the anti-shake camera module 1, in which the accommodation space 2114 is implemented as a through hole, the attachment substrate 212 is attached to the bottom side of the wiring board 211, and the driver 22 attached to the upper surface 2121 of the attachment substrate 212 is accommodated in the accommodation space 2114 of the wiring board 211. It should be understood that, in the example of the anti-shake camera module 1 shown in fig. 8D, the size of the accommodation space 2114 is smaller than the size of the outer edge of the attachment substrate 212, and the size of the outer edge of the driver 22 is not larger than the size of the accommodation space 2114.

Referring to fig. 9 of the drawings, an anti-shake camera module 1A according to a second preferred embodiment of the present invention is illustrated. Compared to the above-described first preferred embodiment of the present invention, the anti-shake image capturing module 1A according to the second preferred embodiment of the present invention is different in that: the circuit board assembly 21A of the anti-shake photosensitive assembly 20A of the anti-shake camera module 1A includes a circuit board 211A, but does not include the attaching substrate 212, wherein the circuit board 211A has a flat attaching area 2111A and the edge area 2112 to provide the flat attaching surface 210 through the attaching area 2111A of the circuit board 211A, that is, the driver 22 is directly attached to the attaching area 2111A of the circuit board 211A, instead of indirectly attaching the driver 22 to the circuit board 211A through the attaching substrate 212, so as to further reduce the height of the anti-shake photosensitive assembly 20A, thereby reducing the overall height of the anti-shake camera module 1A.

Preferably, the circuit board 211A is processed through a grinding process to provide the attachment 210 with high flatness. For example, the circuit board 211A is implemented as a ceramic substrate processed by a grinding process, so that the mounting area 2111A of the circuit board 211A can have a higher flatness, so as to meet the severe requirement of the driver 22 on the flatness of the attachment surface 210, and effectively avoid the influence of the circuit board 211A on the normal operation of the driver 22. It should be appreciated that the ceramic substrate 211A may be formed on the wiring board 211A by a grinding process with the mounting region 2111A having a high flatness so that the mounting region 2111A of the wiring board 211A serves as the mounting face 210 of the wiring board assembly 21A. In addition, the ceramic substrate 211A can prevent the flatness of the attaching surface 210 from being affected by the deformation of the circuit board 211A, so as to prevent the attaching surface 210 from affecting the normal operation of the driver 22.

Fig. 10 shows a modified embodiment of the anti-shake camera module 1A according to the second preferred embodiment of the invention, in which the circuit board 211A is manufactured by a re-wiring layer process to provide the attaching surface 210 with high flatness. In other words, the circuit board 211A is implemented as a redistribution layer circuit board (i.e. RDL circuit board), so that the mounting area 2111A of the circuit board 211A can have a higher flatness to meet the severe requirement of the driver 22 on the flatness of the mounting surface 210, and the circuit board 211A is effectively prevented from influencing the normal operation of the driver 22.

Further, as shown in fig. 10, the circuit board assembly 21A further includes a reinforcing element 213A, wherein the reinforcing element 213 is disposed on the bottom side of the circuit board 211A to strengthen the strength of the circuit board 211A, and prevent the circuit board 211A from being deformed, so as to prevent the circuit board 211A from damaging the flatness of the attaching surface 210 due to the deformation, so as to ensure the normal operation of the driver 22.

Preferably, the reinforcement member 213 is implemented as a steel plate attached to the bottom side of the circuit board 211A to reinforce the circuit board 211A and also to increase heat dissipation of the circuit board 211A to enhance heat dissipation performance of the anti-shake camera module 1A.

It should be noted that, in the second preferred embodiment of the present invention, except for the above-mentioned structure, other structures of the anti-shake camera module 1A are the same as those of the anti-shake camera module 1 according to the first preferred embodiment of the present invention, and the anti-shake camera module 1A also has various modification embodiments similar to or the same as those of the anti-shake camera module 1 according to the first preferred embodiment, which are not repeated herein.

Referring to fig. 11, according to another aspect of the present invention, there is further provided an electronic device, wherein the electronic device includes an electronic device body 500 and at least one anti-shake camera module 1, 1A, wherein each of the anti-shake camera modules 1, 1A is respectively disposed on the electronic device body 500 for capturing images. It should be noted that the type of the electronic device body 500 is not limited, and for example, the electronic device body 500 may be any electronic device capable of being configured with the anti-shake camera module, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, etc. It will be appreciated by those skilled in the art that although the electronic device body 500 is illustrated in fig. 11 as being implemented as a smart phone, it is not intended to limit the scope and content of the present invention.

According to another aspect of the present invention, the present invention further provides a method of manufacturing the anti-shake photosensitive assembly 20. Specifically, as shown in fig. 12, the method for manufacturing the anti-shake photosensitive assembly 20 includes the steps of:

S1: correspondingly attaching a driver 22 to an upper surface 2121 of an attaching substrate 212;

S2: correspondingly attaching a photosensitive element 23 to the driver 22;

s3: attaching the attaching substrate 212 to a circuit board 211; and

S4: the driver 22 and the photosensitive element 23 are conductively connected to the circuit board 211, respectively, to manufacture the anti-shake photosensitive assembly 20.

Specifically, the step S4 includes the steps of:

s41: at least one set of first connection members 223 conductively connecting the photosensitive element 23 and the driver 22 by wire bonding; and

S42: at least one set of second connectors 224 of the driver 22 and at least one set of circuit board connectors 2113 of the circuit board 211 are conductively connected by wire bonding, wherein each set of first connectors 223 and each set of second connectors 224 are conductively connected by a set of elastic wires 225.

It should be noted that, in the manufacturing method of the anti-shake photosensitive assembly 20, the order of the step S1, the step S2, and the step S3 is merely an example, and in some other embodiments of the present invention, the step S2, the step S1, and the step S3 may be performed sequentially; or the step S3, the step S1, and the step S2 may be sequentially performed; the order of the step S1, the step S2 and the step S3 is not further limited in the present invention.

According to another aspect of the present invention, the present invention further provides a method of manufacturing the anti-shake photosensitive assembly 20A. Specifically, as shown in fig. 13, the method for manufacturing the anti-shake photosensitive assembly 20A includes the steps of:

s1': correspondingly attaching a driver 22 to a mounting area 2111A of a circuit board 211A, wherein the circuit board 211A is manufactured by a re-wiring layer process;

S2': correspondingly attaching a photosensitive element 23 to the driver 22; and

S3': the driver 22 and the photosensitive element 23 are conductively connected to the wiring board 211A, respectively, to manufacture the anti-shake photosensitive assembly 20A.

Further, the method for manufacturing the anti-shake photosensitive assembly 20A further includes the steps of:

S4': a reinforcing element 213A is disposed on the bottom side of the circuit board 211A to increase the strength of the circuit board 211A.

It should be noted that, as shown in fig. 13, in the manufacturing method of the anti-shake photosensitive assembly 20A, the step S1 'and the step S2' are similar to the step S1 and the step S2 in the manufacturing method of the anti-shake photosensitive assembly 20, and the first glue and the second glue are used to bond to complete the corresponding attaching steps.

According to another aspect of the present invention, the present invention further provides a method for manufacturing an anti-shake camera module 1, 1A, including the steps of:

manufacturing the anti-shake photosensitive assemblies 20, 20A according to the manufacturing method of the anti-shake photosensitive assemblies 20, 20A; and

An optical lens 10 is correspondingly disposed on the photosensitive path of the photosensitive element 23 of the anti-shake photosensitive assembly 20, 20A to manufacture the anti-shake camera module 1, 1A.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims (26)

1. An anti-shake photosensitive assembly, comprising:

the circuit board assembly is provided with at least one attaching surface;

At least one driver, wherein each driver is correspondingly attached to each attaching surface of the circuit board assembly, the driver is a micro-electromechanical system, the driver comprises a movable part and an immovable part, and the immovable part of the driver is fixedly attached to the attaching surface of the circuit board assembly;

At least one photosensitive element, wherein each photosensitive element is correspondingly arranged on each driver, the drivers are positioned between the photosensitive elements and the attaching surfaces of the circuit board assembly so as to move the corresponding photosensitive elements through the drivers, and the photosensitive elements are attached to the movable parts of the drivers;

A first support element disposed between the attaching face and the immovable portion of the driver, the first support element being cured by a first glue, a first safety gap being formed between the attaching face and the movable portion by the first support element; and

The second supporting element is arranged between the photosensitive element and the movable part of the driver, is formed by solidifying second glue, and forms a second safety gap between the bottom surface of the photosensitive element and the movable part through the second supporting element.

2. The anti-shake photosensitive assembly of claim 1, wherein the circuit board assembly comprises a circuit board and an attachment substrate, wherein a lower surface of the attachment substrate is attached to the circuit board to take an upper surface of the attachment substrate as the attachment surface of the circuit board assembly.

3. The anti-shake photosensitive assembly of claim 2, wherein the attachment substrate is a steel plate.

4. The anti-shake photosensitive assembly according to claim 2, wherein the attaching substrate is made of one material selected from the group consisting of ceramics, alloys, metals, and polymer materials.

5. The anti-shake photosensitive assembly of claim 2, wherein the attachment substrate has at least one vacuum slot, wherein each vacuum slot extends from the upper surface of the attachment substrate to the lower surface of the attachment substrate to form a through hole on the attachment substrate.

6. The anti-shake photosensitive assembly of claim 5, wherein the attachment substrate has a plurality of the vacuum grooves, wherein the plurality of vacuum grooves are uniformly distributed on the attachment substrate.

7. The anti-shake photosensitive assembly according to claim 2, wherein the circuit board has an accommodation space in which the attaching substrate attached to the circuit board is accommodated.

8. The anti-shake photosensitive assembly of claim 7, wherein the receiving space is a recess.

9. The anti-shake photosensitive assembly of claim 7, wherein the receiving space is a through hole.

10. The anti-shake photosensitive assembly according to claim 2, wherein the circuit board has a through-hole type accommodation space, wherein the attaching substrate is attached to a bottom side of the circuit board, and the driver attached to the attaching substrate is accommodated in the accommodation space.

11. The anti-shake photosensitive assembly according to claim 1, wherein the wiring board assembly comprises a wiring board processed by a grinding process, wherein the wiring board comprises a mounting area and an edge area around the mounting area, and the mounting area of the wiring board is used as the mounting surface of the wiring board assembly.

12. The anti-shake photosensitive assembly according to claim 1, wherein the wiring board assembly comprises a wiring board manufactured by a re-wiring layer process, wherein the wiring board comprises a mounting area and an edge area around the mounting area, and the mounting area of the wiring board is used as the attachment surface of the wiring board assembly.

13. The anti-shake photosensitive assembly of claim 12, wherein the circuit board assembly further comprises a reinforcing element, wherein the reinforcing element is disposed on a bottom side of the circuit board to strengthen the circuit board.

14. The anti-shake photosensitive assembly of claim 13, wherein the reinforcing element is a steel plate.

15. The anti-shake photosensitive assembly according to any one of claims 1 to 14, wherein the flatness of the attaching face of the wiring board assembly is within 15 um.

16. The anti-shake photosensitive assembly according to any one of claims 1 to 14, wherein the photosensitive element is attached to the driver in a particle-glue bonding manner, and the driver is attached to the attaching face of the wiring board assembly in a particle-glue bonding manner.

17. The anti-shake photosensitive assembly according to any one of claims 2 to 10, wherein the attaching substrate is attached to the wiring board by means of particle-glue bonding.

18. The anti-shake photosensitive assembly according to any one of claims 2-14, wherein the driver further comprises at least one set of first connectors, at least one set of second connectors, and at least one set of elastic wires, wherein each set of first connectors is disposed on the movable portion of the driver, each set of second connectors is disposed on the immovable portion of the driver, wherein each set of first connectors and each set of second connectors are conductively connected by each set of elastic wires, wherein the wiring board is conductively connected with each set of second connectors of the driver, and the photosensitive element is conductively connected with each set of first connectors of the driver.

19. The anti-shake photosensitive assembly according to any one of claims 1-14, further comprising at least one filter element, wherein each filter element is directly attached to a top surface of each photosensitive element.

20. An anti-shake camera module, its characterized in that includes:

At least one optical lens; and

The anti-shake photosensitive assembly according to any one of claims 1 to 19, wherein each optical lens is correspondingly disposed on a photosensitive path of each photosensitive element of the anti-shake photosensitive assembly to assemble the anti-shake camera module.

21. An electronic device, comprising:

an electronic device body; and

The anti-shake camera module of claim 20 wherein the anti-shake camera module is assembled to the electronic device body to assemble the electronic device.

22. A method of manufacturing an anti-shake photosensitive assembly according to any one of claims 1 to 19, comprising the steps of:

Applying first glue on the attaching surface of the attaching substrate, or applying first glue on the immovable part of the driver, correspondingly attaching the driver to the upper surface of the attaching substrate, and forming a first supporting element after the first glue is solidified;

Applying second glue on the movable part of the driver, or applying second glue on the bottom surface of the photosensitive chip, correspondingly attaching the photosensitive element to the movable part of the driver, and forming a second supporting element after the second glue is solidified;

Attaching the attaching substrate to a circuit board; and

And respectively connecting the driver and the photosensitive element with the circuit board in a conductive manner to manufacture the anti-shake photosensitive assembly.

23. The method of manufacturing an anti-shake photosensitive assembly according to claim 22, wherein the step of conductively connecting the driver and the photosensitive element with the wiring board, respectively, to manufacture the anti-shake photosensitive assembly comprises the steps of:

at least one group of first connecting pieces for conductively connecting the photosensitive element and the driver in a wire bonding manner; and

And at least one group of second connecting pieces of the driver and at least one group of circuit board connecting pieces of the circuit board are connected in a conducting manner through a wire bonding mode, wherein each group of first connecting pieces and each group of second connecting pieces are connected in a conducting manner through a group of elastic wires.

24. A method of manufacturing an anti-shake photosensitive assembly according to any one of claims 1 to 19, comprising the steps of:

Applying first glue on an attaching surface of a mounting area of a circuit board, or applying first glue on an immovable part of a driver, and correspondingly attaching the driver to the attaching surface of the circuit board, wherein the circuit board is manufactured through a rewiring layer process, and a first supporting element is formed after the first glue is solidified;

Applying second glue on the movable part of the driver, or applying second glue on the bottom surface of the photosensitive chip, correspondingly attaching the photosensitive element to the movable part of the driver, and forming a second supporting element after the second glue is solidified; and

And respectively connecting the driver and the photosensitive element with the circuit board in a conductive manner to manufacture the anti-shake photosensitive assembly.

25. The method of manufacturing an anti-shake photosensitive assembly according to claim 24, further comprising the steps of:

a reinforcing element is arranged on the bottom side of the circuit board to increase the strength of the circuit board.

26. The manufacturing method of the anti-shake camera module is characterized by comprising the following steps:

The method of manufacturing an anti-shake photosensitive assembly according to any one of claims 22 to 25, wherein an anti-shake photosensitive assembly is manufactured; and

And correspondingly arranging at least one optical lens on a photosensitive path of at least one photosensitive element of the anti-shake photosensitive assembly to manufacture an anti-shake camera module.