CN110828695A - Mirror array substrate, preparation method thereof, mirror display panel and display device - Google Patents
Mirror array substrate, preparation method thereof, mirror display panel and display device Download PDFInfo
- Publication number
- CN110828695A CN110828695A CN201911132432.7A CN201911132432A CN110828695A CN 110828695 A CN110828695 A CN 110828695A CN 201911132432 A CN201911132432 A CN 201911132432A CN 110828695 A CN110828695 A CN 110828695A
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- display
- light
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 233
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 332
- 239000000463 material Substances 0.000 claims description 39
- 239000011241 protective layer Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 238000001312 dry etching Methods 0.000 claims description 5
- 238000001039 wet etching Methods 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 14
- 239000010408 film Substances 0.000 description 36
- 239000004642 Polyimide Substances 0.000 description 15
- 229920001721 polyimide Polymers 0.000 description 15
- 238000005538 encapsulation Methods 0.000 description 14
- 239000010409 thin film Substances 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The disclosure provides a mirror array substrate, a preparation method thereof, a mirror display panel and a mirror display device, and belongs to the technical field of display. The mirror array substrate includes a substrate, a display layer, and a reflective layer. The display layer is arranged on one side of the substrate base plate and is provided with a plurality of display units distributed in an array manner; the reflecting layer is arranged on one side, away from the substrate, of the display layer, and is provided with a plurality of light holes in one-to-one correspondence with the display units; the orthographic projection of the light emitting region of any one display unit on the substrate base plate is at least partially overlapped with the orthographic projection of the corresponding light-transmitting hole on the substrate base plate. The mirror array substrate can improve the display effect.
Description
Technical Field
The disclosure relates to the technical field of display, and in particular relates to a mirror array substrate, a preparation method thereof, a mirror display panel and a mirror display device.
Background
The mirror surface display screen comprises a display screen and a semi-transparent semi-reflecting film covering the light emergent side of the display screen, and the mirror surface display screen can realize the functions of a conventional mirror and an image display function, so that the mirror surface display screen is widely applied to the fields of vehicle-mounted rearview mirrors, cosmetic mirrors and the like.
However, the contrast ratio of the display screen of the mirror display screen is relatively low due to the influence of the external reflected light, and the display effect is reduced.
The above information disclosed in the background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute prior art that is known to a person of ordinary skill in the art.
Disclosure of Invention
The present disclosure is directed to a mirror array substrate, a method for manufacturing the same, a mirror display panel, and a mirror display device, which improve the display effect of the mirror array substrate.
In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:
according to a first aspect of the present disclosure, there is provided a mirror array substrate comprising:
a substrate base plate;
the display layer is arranged on one side of the substrate base plate; the display layer is provided with a plurality of display units distributed in an array;
the reflecting layer is arranged on one side, away from the substrate, of the display layer, and is provided with a plurality of light holes which correspond to the display units one to one; the orthographic projection of the light emitting region of any one display unit on the substrate base plate is at least partially overlapped with the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
In an exemplary embodiment of the present disclosure, the mirror array substrate further includes:
and the inorganic protective layer is arranged between the display layer and the reflecting layer, and the reflecting layer is arranged on the surface of the inorganic protective layer far away from the substrate base plate.
In an exemplary embodiment of the present disclosure, a material of the inorganic protective layer is silicon nitride.
In an exemplary embodiment of the present disclosure, the mirror array substrate further includes:
and the organic protective layer is arranged between the display layer and the reflecting layer, and the reflecting layer is arranged on the surface of the organic protective layer far away from the substrate.
In an exemplary embodiment of the present disclosure, an area of an orthogonal projection of any one of the light-transmitting holes on the substrate base plate is 50% to 100% of an area of an orthogonal projection of a light-emitting area of the corresponding display unit on the substrate base plate; and the orthographic projection of any light-transmitting hole on the substrate base plate is positioned in the orthographic projection of the light-emitting area of the corresponding display unit on the substrate base plate.
In an exemplary embodiment of the present disclosure, an area of an orthogonal projection of any one of the light-transmitting holes on the substrate base plate is 100% to 150% of an area of an orthogonal projection of a light-emitting area of the corresponding display unit on the substrate base plate; the orthographic projection of the light emitting area of any one display unit on the substrate base plate is positioned in the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
In an exemplary embodiment of the present disclosure, the display unit is an organic light emitting diode.
According to a second aspect of the present disclosure, a mirror display panel is provided, which includes the mirror array substrate.
According to a third aspect of the present disclosure, a mirror display device is provided, which includes the above mirror display panel.
According to a fourth aspect of the present disclosure, there is provided a method of manufacturing a mirror array substrate, comprising:
providing a substrate base plate;
forming a display layer on one side of the substrate, wherein the display layer is provided with a plurality of display units distributed in an array manner;
forming a reflecting layer on one side of the display layer far away from the substrate base plate; the reflecting layer is provided with a plurality of light holes which are in one-to-one correspondence with the display units; the orthographic projection of the light emitting region of any one display unit on the substrate base plate is at least partially overlapped with the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
In an exemplary embodiment of the present disclosure, the method of manufacturing a mirror array substrate further includes:
before the reflecting layer is formed, forming an inorganic protective layer on one side of the display layer far away from the substrate;
forming a reflective layer on a side of the display layer away from the substrate includes:
forming a reflecting material layer on the surface of the inorganic protective layer far away from the substrate base plate;
and patterning the reflecting material layer through dry etching to form the reflecting layer.
In an exemplary embodiment of the present disclosure, the method of manufacturing a mirror array substrate further includes:
before the reflecting layer is formed, forming an organic protective layer on one side of the display layer, which is far away from the substrate;
forming a reflective layer on a side of the display layer away from the substrate includes:
forming a reflecting material layer on the surface of the organic protective layer far away from the substrate base plate;
and patterning the reflecting material layer through wet etching to form the reflecting layer.
In one exemplary embodiment of the present disclosure, forming a reflective layer on a side of the display layer away from the substrate base plate includes:
forming a reflecting material layer on one side of the display layer far away from the substrate base plate;
forming a plurality of light holes on the reflecting material layer by etching, so that the orthographic projection area of any one light hole on the substrate is 50% -100% of the orthographic projection area of the light emitting area of the corresponding display unit on the substrate; and the orthographic projection of any light-transmitting hole on the substrate base plate is positioned in the orthographic projection of the light-emitting area of the corresponding display unit on the substrate base plate.
In one exemplary embodiment of the present disclosure, forming a reflective layer on a side of the display layer away from the substrate base plate includes:
forming a reflecting material layer on one side of the display layer far away from the substrate base plate;
forming a plurality of light holes on the reflecting material layer by etching, so that the orthographic projection area of any one light hole on the substrate is 100% -150% of the orthographic projection area of the light emitting area of the corresponding display unit on the substrate; the orthographic projection of the light emitting area of any one display unit on the substrate base plate is positioned in the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
In the mirror array substrate, the preparation method thereof, the mirror display panel and the mirror display device, the reflecting layer is provided with the light holes, light emitted by the display unit can be emitted through the light holes, and the phenomenon that the intensity of the light is reduced due to the fact that the light penetrates through the reflecting layer is avoided or weakened. Therefore, the display brightness of the mirror array substrate is increased, the influence of external reflection light is weakened, the contrast of a display picture can be improved, and the display effect is improved.
Drawings
The above and other features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
Fig. 1 is a schematic structural diagram of a mirror array substrate according to an embodiment of the present disclosure.
Fig. 2 is a schematic top view of a mirror array substrate according to an embodiment of the present disclosure.
Fig. 3 is a schematic structural diagram of a mirror array substrate according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of a mirror array substrate according to an embodiment of the present disclosure.
Fig. 5 is a schematic flow chart illustrating the preparation of a mirror array substrate according to an embodiment of the present disclosure.
The reference numerals of the main elements in the figures are explained as follows:
100. a substrate base plate; 101. a base film layer; 102. a pressure sensitive adhesive layer; 103. a first polyimide layer; 104. a second polyimide layer; 200. a display layer; 201. a buffer layer; 202. an active layer; 203. a first gate insulating layer; 204. a first gate layer; 205. a second gate insulating layer; 206. a second gate layer; 207. an interlayer dielectric layer; 208. a source drain metal layer; 209. a planarization layer; 210. a pixel electrode layer; 211. a pixel defining layer; 212. an organic light emitting layer; 213. a common electrode layer; 220. a display unit; 300. a reflective layer; 301. a light-transmitting hole; 400. a packaging layer; 401. a silicon oxynitride layer; 402. an organic protective layer; 403. an inorganic protective layer; 501. a first optical adhesive layer; 502. a touch layer; 503. a second optical adhesive layer; 504. covering the film; 600. a flexible circuit board; A. a display area; B. a peripheral region.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure.
In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals denote the same or similar structures in the drawings, and thus detailed descriptions thereof will be omitted.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the disclosure can be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the primary technical ideas of the disclosure.
When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure. The terms "a," "an," "the," and the like are used to denote the presence of one or more elements/components/parts; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc. The terms "first" and "second", etc. are used merely as labels, and are not limiting on the number of their objects.
In an embodiment of the present disclosure, there is provided a mirror array substrate, as shown in fig. 1, including: a substrate base plate 100, a display layer 200, and a reflective layer 300, wherein,
the display layer 200 is disposed on one side of the substrate 100; the display layer 200 is provided with a plurality of display units 220 distributed in an array; the reflective layer 300 is disposed on a side of the display layer 200 away from the substrate 100, and the reflective layer 300 is provided with a plurality of light holes 301 corresponding to the display units 220; the orthographic projection of the light emitting region of any display unit 220 on the substrate base plate 100 at least partially coincides with the orthographic projection of the corresponding light-transmitting hole 301 on the substrate base plate 100.
In fig. 1, solid arrows indicate light emitted from the display unit 220, and the light emitted from the display unit 220 can exit through the light-transmitting hole 301 to realize image display; the dotted arrows indicate ambient light, which is irradiated onto the reflective layer and reflected, so that the mirror array substrate realizes a mirror function. In the mirror array substrate provided by the present disclosure, the reflective layer 300 is provided with the light hole 301, and the light emitted by the display unit 220 can exit through the light hole 301, thereby avoiding or weakening the intensity reduction of the light passing through the reflective layer 300. Therefore, the display brightness of the mirror array substrate is increased, the influence of external reflection light is weakened, the contrast of a display picture can be improved, and the display effect is improved.
Each component of the array substrate provided by the embodiments of the present disclosure is described in detail below with reference to the accompanying drawings:
the base substrate 100 may be an inorganic base substrate 100 or an organic base substrate 100. For example, in one embodiment of the present disclosure, the material of the substrate 100 may be a glass material such as soda-lime glass (soda-lime glass), quartz glass, or sapphire glass, or may be a metal material such as stainless steel, aluminum, or nickel. In another embodiment of the present disclosure, the material of the substrate 100 may be polymethyl methacrylate (PMMA), Polyvinyl alcohol (PVA), Polyvinyl phenol (PVP), Polyether sulfone (PES), polyimide, polyamide, polyacetal, Polycarbonate (PC), Polyethylene terephthalate (PET), Polyethylene naphthalate (PEN), or a combination thereof. In another embodiment of the present disclosure, the substrate 100 may also be a flexible substrate 100, for example, the material of the substrate 100 may be Polyimide (PI). The substrate 100 may also be a composite of multiple layers of materials, for example, in an embodiment of the present disclosure, as shown in fig. 3, the substrate 100 may include an underlayer 101(Bottom Film), a pressure sensitive adhesive layer 102, a first polyimide layer 103, and a second polyimide layer 104, which are sequentially stacked.
The display layer 200 is used to implement pattern display. As shown in fig. 1, in the present disclosure, a side of the display layer 200 away from the substrate 100 is a display side of the mirror array substrate, and light emitted by the light emitting unit is emitted to the side away from the substrate 100, so as to implement image display.
In the display layer 200, the display unit 220 may be an Organic Light Emitting Diode (OLED), a liquid crystal display unit, a Light Emitting Diode (LED), or other feasible display units 220. It is understood that the display unit 220 may implement autonomous light emission, such as an organic light emitting diode or a light emitting diode, and may also implement light emission control by means of a backlight, for example, the liquid crystal display unit 220 may control whether light of the backlight passes through a light emitting region to implement display.
In one embodiment of the present disclosure, the display unit 220 is an organic light emitting diode. Compared with a liquid crystal display unit, the organic light emitting diode has a better black level, so that light rays in the display layer 200 can be reduced or eliminated when a picture is not displayed, a better background is provided for mirror surface display, the influence of the background light rays in the display layer 200 on the mirror surface effect is avoided, and the mirror surface effect of the mirror surface display substrate is improved. Moreover, the organic light emitting diode has better black level, so that the contrast of a display picture of the mirror array substrate can be improved; the organic light emitting diode can also improve the color gamut and the visual angle of the mirror surface array substrate, and further improve the display effect.
Optionally, the display layer 200 may further include a driving circuit layer for driving each display unit 220 to emit light or display. The driver circuit layer may include a thin film transistor and a capacitor, wherein the thin film transistor may be an LTPS-TFT (low temperature polysilicon-thin film transistor) or an oxide-TFT (oxide-thin film transistor), for example, an IGZO-TFT, which is not limited in this disclosure. The thin film transistor may be a top gate type or a bottom gate type, and the disclosure is not limited thereto.
As shown in fig. 1, the reflective layer 300 is disposed on a side of the display layer 200 away from the substrate base plate 100, that is, on a light-emitting side of the display layer 200, and is used for reflecting ambient light, so that the mirror array base plate has a mirror function. The reflective layer 300 may be a reflective film layer or a semi-transmissive and semi-reflective film layer, so as to achieve the function of reflecting light.
In one embodiment of the present disclosure, the reflective layer 300 may be one or more layers of a metallic material. For example, in one embodiment of the present disclosure, the reflective layer 300 may be a molybdenum layer, an aluminum layer, or a titanium layer. In another embodiment of the present disclosure, the reflective layer 300 may be a titanium layer, an aluminum layer, and a titanium layer sequentially stacked, i.e., in a sandwich structure.
In an embodiment of the present disclosure, the reflective layer 300 may be a semi-transparent and semi-reflective film layer, so that the light emitted by the display unit 220 can partially pass through the reflective layer 300 to be emitted, and the emission rate of the light emitted by the display unit 220 is improved, that is, the display brightness of the mirror array substrate can be further improved, the visual angle of the display image of the mirror array substrate can be further improved, and the display effect of the mirror array substrate can be improved.
In another embodiment of the present disclosure, the reflective layer 300 is a total reflection layer. And the mirror surface array substrate realizes total reflection at the position covering the reflecting layer so as to improve the mirror surface effect of the mirror surface array substrate.
As shown in fig. 1, the light-transmitting hole 301 of the reflective layer 300 is used for emitting light of the display unit 220. Because the material of the reflective layer 300 is not disposed in the light hole 301, the transmitted light is not lost, and thus the brightness of the emergent light of the display unit 220 can be improved, the brightness of the mirror array substrate can be improved, the influence of the ambient light reflected by the reflective layer 300 can be reduced, and the contrast of the display image of the mirror array substrate can be improved.
The light holes 301 are disposed in one-to-one correspondence with the display units 220, i.e., one light hole 301 is aligned with a light emitting region of one display unit 220. In other words, the orthographic projection of the light emitting region of any one display unit 220 on the substrate 100 at least partially coincides with the orthographic projection of the corresponding light-transmitting hole 301 on the substrate 100.
It is to be understood that when the display unit 220 is a device capable of autonomously emitting light, for example, an organic light emitting diode, the light emitting region of the display unit 220 generally refers to a region capable of emitting light in the display unit 220. For example, for the organic light emitting diode, the light emitting region of the display unit 220 may be a region where the pixel electrode of the organic light emitting diode is actually in contact with the organic light emitting layer 212, which is generally defined by the pixel defining layer 211 disposed on the pixel electrode.
The area of the light-transmitting hole 301 can be determined according to the specific requirements of the mirror array substrate. When the demand of the mirror array substrate for the mirror function is higher than the demand of the mirror array substrate for the display function, the area of the light transmissive hole 301 may be made smaller, so that the area of the reflective layer 300 is made larger. On the contrary, when the requirement of the mirror array substrate for the display function is higher than the requirement for the mirror function, the area of the light hole 301 can be made larger, so that the display brightness of the mirror array substrate is higher, and the contrast of the display image is better.
To enable optimal utilization of the light-transmissive holes 301, the light-emitting regions of the display unit 220 may be aligned with the corresponding light-transmissive holes 301. In other words, one of the orthographic projection of the light emitting region of the display unit 220 on the substrate base plate 100 and the orthographic projection of the light transmitting hole 301 on the substrate base plate 100 is completely located within the range of the other.
In one embodiment of the present disclosure, an area of an orthogonal projection of any light-transmitting hole 301 on the substrate 100 is 50% to 100% of an area of an orthogonal projection of a light-emitting region of the corresponding display unit 220 on the substrate 100; wherein, the orthographic projection of any light-transmitting hole 301 on the substrate 100 is located in the orthographic projection of the light-emitting region of the corresponding display unit 220 on the substrate 100
In another embodiment of the present disclosure, an area of an orthogonal projection of any light-transmitting hole 301 on the substrate base plate 100 is 100% to 150% of an area of an orthogonal projection of a light-emitting region of the corresponding display unit 220 on the substrate base plate 100; the orthographic projection of the light emitting region of any display unit 220 on the substrate 100 is located in the orthographic projection of the corresponding light-transmitting hole 301 on the substrate 100.
Optionally, as shown in fig. 3, in order to protect the display layer 200, an encapsulation layer 400 may be further disposed between the display layer 200 and the reflective layer 300, and the reflective layer 300 is disposed on a surface of the encapsulation layer 400 away from the substrate 100.
The encapsulation layer 400 may be a single layer structure or a multi-layer structure, and the material thereof may be inorganic material, organic material, or a combination of inorganic material and organic material. Optionally, the encapsulation layer 400 includes at least one layer of organic material and at least one layer of inorganic material.
In one embodiment of the present disclosure, as shown in fig. 3, the encapsulation layer 400 includes an inorganic protection layer 403, the inorganic protection layer 403 is disposed between the display layer 200 and the reflective layer 300, and the reflective layer 300 is disposed on a surface of the inorganic protection layer 403 away from the substrate 100. In this way, a reflective material layer may be formed on the surface of the inorganic protective layer 403 away from the substrate 100, and then the reflective material layer may be patterned by dry etching to form the desired reflective layer 300. The inorganic protective layer 403 can block etching gas, and thus, the influence of a dry etching process on the encapsulation layer 400 and the display layer 200 is avoided, so that an etching blocking layer does not need to be arranged between the encapsulation layer 400 and the reflective layer 300, the preparation process of the mirror array substrate is simplified, and the preparation cost is reduced. Alternatively, the material of the inorganic protective layer 403 may be silicon nitride.
In another embodiment of the present disclosure, as shown in fig. 4, the encapsulation layer 400 includes an organic protection layer 402, the organic protection layer 402 is disposed between the display layer 200 and the reflective layer 300, and the reflective layer 300 is disposed on a surface of the organic protection layer 402 away from the substrate 100.
In this way, a reflective material layer may be formed on the surface of the organic protection layer 402 away from the substrate 100, and then the reflective material layer may be patterned by wet etching to form the desired reflective layer 300. The organic protective layer 402 can block etching liquid, and influence of a wet etching process on the encapsulation layer 400 and the display layer 200 is avoided, so that an etching blocking layer does not need to be arranged between the encapsulation layer 400 and the reflection layer 300, the preparation process of the mirror array substrate is simplified, and the preparation cost is reduced. Alternatively, the organic protective layer 402 may be an inkjet printed (IJP) organic layer.
Optionally, the mirror array substrate may further have a touch function, for example, a touch layer 502 may be disposed on a side of the reflective layer 300 away from the substrate 100. For example, in an embodiment of the present disclosure, the mirror array substrate may further include a first optical adhesive layer 501, a touch layer 502, a second optical adhesive layer 503, and a cover film 504 sequentially stacked on the side of the reflective layer 300 away from the substrate 100.
Optionally, the mirror array substrate is a flexible array substrate.
Hereinafter, an implementation of a mirror array substrate is exemplarily illustrated in order to further explain and explain the structure, principle and effect of the mirror array substrate of the present disclosure.
As shown in fig. 3, the exemplary mirror array substrate may include:
a base Film layer 101(Bottom Film);
a pressure-sensitive adhesive layer 102 provided on one side of the base Film layer 101(Bottom Film);
the first polyimide layer 103 is arranged on one side of the pressure-sensitive adhesive layer 102 far away from the bottom film layer 101;
and a second polyimide layer 104 disposed on a side of the first polyimide layer 103 away from the bottom film layer 101.
A Buffer layer 201(Buffer) disposed on a side of the second polyimide layer 104 away from the bottom film layer 101;
the active layer 202 is arranged on one side of the buffer layer 201 away from the bottom film layer 101, and an active region of the thin film transistor can be formed;
a first gate insulating layer 203 disposed on a side of the active layer 202 away from the bottom film layer 101 and covering at least a portion of the active layer 202, especially covering an active region of the thin film transistor;
a first gate layer 204 disposed on a side of the first gate insulating layer 203 away from the bottom film layer 101, and may be formed with a gate of a thin film transistor;
a second gate insulating layer 205 disposed on a side of the first gate layer 204 away from the bottom film layer 101, covering the first gate layer 204;
a second gate electrode layer 206 disposed on a side of the second gate insulating layer 205 away from the bottom film layer 101;
an interlayer dielectric layer 207(ILD) disposed on a side of the second gate layer 206 away from the bottom film layer 101, covering the second gate layer 206;
the source-drain metal layer 208 is arranged on one side, far away from the bottom film layer 101, of the interlayer dielectric layer 207, and is provided with a source electrode and a drain electrode of the thin film transistor; the source electrode and the drain electrode are electrically connected with the active region of the thin film transistor through the metalized through hole respectively;
the planarization layer 209 is arranged on one side of the source-drain metal layer 208 away from the bottom film layer 101 and used for providing a planarization surface for the pixel electrode;
the pixel electrode layer 210 is arranged on one side, away from the bottom film layer 101, of the planarization layer 209, and the pixel electrode layer 210 is provided with a plurality of pixel electrodes distributed in an array manner, wherein any one of the pixel electrodes is electrically connected with the source-drain metal layer 208 through a metalized through hole, and particularly is electrically connected with a drain electrode of a corresponding thin film transistor; any one of the pixel electrodes is provided with a light-emitting region;
the pixel defining layer 211 is arranged on one side of the pixel electrode layer 210 far away from the bottom film layer 101; the pixel defining layer 211 exposes a light emitting region of the pixel electrode and covers other regions;
a support column layer (not shown in fig. 3) disposed on a side of the pixel defining layer 211 away from the underlayer 101 for supporting a precision metal mask (FFM) for preparing the organic light emitting layer 212;
an organic light emitting layer 212 disposed on a side of the support column layer away from the bottom film layer 101 and covering the light emitting region of each pixel electrode; wherein, the portion of the organic light emitting layer 212 contacting with the pixel electrode can realize electroluminescence under the control of the pixel electrode;
a common electrode layer 213 disposed on a side of the organic light emitting layer 212 away from the underlayer 101;
the silicon oxynitride layer 401 is arranged on one side of the common electrode layer 213, which is far away from the bottom film layer 101, and is used for blocking water and oxygen;
the organic protective layer 402 is arranged on one side of the silicon oxynitride layer 401, which is far away from the bottom film layer 101, and is used for balancing the stress of the mirror array substrate and providing a flattened surface;
an inorganic protective layer 403 disposed on a side of the organic protective layer 402 away from the underlayer 101; the material of the inorganic protective layer 403 is silicon nitride;
the reflecting layer 300 is arranged on one side of the inorganic protective layer 403, which is far away from the bottom film layer 101, and is provided with a plurality of light-transmitting holes 301 which are in one-to-one correspondence with the light-emitting regions of the pixel electrodes, and the orthographic projection of the light-emitting region of any pixel electrode on the bottom film layer 101 at least partially coincides with the orthographic projection of the corresponding light-transmitting hole 301 on the bottom film layer 101;
the first optical adhesive layer 501 is arranged on one side of the reflecting layer 300 away from the bottom film layer 101;
the touch layer 502 is arranged on one side of the first optical adhesive layer 501, which is far away from the bottom film layer 101, and is used for realizing a touch function;
the second optical adhesive layer 503 is arranged on one side of the touch layer 502 away from the bottom film layer 101;
the cover film 504 is disposed on a side of the second optical adhesive layer 503 away from the bottom film layer 101.
Among them, as shown in fig. 3, in the exemplary mirror array substrate, an undercoat layer 101, a pressure sensitive adhesive layer 102, a first polyimide layer 103, and a second polyimide layer 104 may form a substrate 100 of the mirror array substrate. The substrate base plate 100 adopts a double-layer polyimide layer structure, so that the performance index of the substrate base plate 100 can be further improved, and the problem that a single-layer polyimide layer is difficult to meet the performance requirement is solved.
As shown in fig. 3, in the exemplary mirror array substrate, the buffer layer 201, the active layer 202, the first gate insulating layer 203, the first gate layer 204, the second gate insulating layer 205, the second gate layer 206, the interlayer dielectric layer 207, the source-drain metal layer 208, the planarization layer 209, the pixel electrode layer 210, the pixel definition layer 211, the organic light emitting layer 212, and the common electrode layer 213, which are sequentially stacked, form a display layer 200 of the mirror array substrate. The display layer 200 includes a plurality of display units 220 arranged in an array, and each display unit 220 includes a pixel electrode, an organic light emitting layer 212 portion arranged on a side of the pixel electrode away from the substrate 100, and a common electrode layer 213 portion arranged on a side of the organic light emitting layer 212; the light-emitting region of the display unit 220 overlaps with the light-emitting region of the pixel electrode.
Among them, as shown in fig. 3, in the exemplary mirror array substrate, a silicon oxynitride layer 401, and an inorganic protective layer 403, which are sequentially stacked, may form an encapsulation layer 400 of the mirror array substrate for realizing protection of the display layer 200, particularly, the pixel electrode layer 210, the organic light emitting layer 212, and the common electrode layer 213.
It is to be understood that the exemplary mirror array substrate may include a display area a and a peripheral area B surrounding the display area a, the peripheral area B being used to dispose pads and the like so as to be electrically connected to the driving chip, as shown in fig. 2. The encapsulation layer 400, the reflection layer 300, the first optical adhesive layer 501, the touch layer 502, the second optical adhesive layer 503 and the cover film 504 are not disposed in the peripheral region B.
As shown in fig. 5, an embodiment of the present disclosure further provides a method for manufacturing a mirror array substrate, including:
step S110, providing a substrate 100;
step S120, forming a display layer 200 on one side of the substrate 100, where the display layer 200 is provided with a plurality of display units 220 distributed in an array;
step S130, forming a reflective layer 300 on a side of the display layer 200 away from the substrate 100; the reflective layer 300 is provided with a plurality of light-transmitting holes 301 corresponding to the respective display units 220 one to one; the orthographic projection of the light emitting region of any display unit 220 on the substrate base plate 100 at least partially coincides with the orthographic projection of the corresponding light-transmitting hole 301 on the substrate base plate 100.
According to the preparation method of the mirror array substrate, any one of the mirror array substrates described in the above embodiments of the mirror array substrate can be prepared, so that the brightness and contrast of a display picture of the mirror array substrate are improved, and the display effect of the mirror array substrate is improved.
In one embodiment of the present disclosure, the method for manufacturing a mirror array substrate further includes:
step S141, forming an inorganic protective layer 403 on the side of the display layer 200 away from the base substrate 100 between step S120 and step S130, i.e. before forming the reflective layer 300;
step S130 may be implemented by the following procedure:
step S1301, forming a reflective material layer on the surface of the inorganic protective layer 403 away from the substrate 100;
in step S1303, the reflective material layer is patterned by dry etching to form the reflective layer 300.
Optionally, the material of the inorganic protective layer 403 is silicon nitride.
Alternatively, the inorganic protective layer 403 does not cover the peripheral region B of the mirror array substrate. For example, an Open Mask (Open Mask) may be used to deposit a layer of silicon nitride in the display area a of the mirror array substrate, while no silicon nitride is deposited in the peripheral area B of the mirror array substrate. In this manner, the silicon nitride layer may achieve protection of the display layer 200 and other film layers of the encapsulation layer 400.
In another embodiment of the present disclosure, the method of manufacturing a mirror array substrate further includes:
step S143, forming an organic protection layer 402 on the side of the display layer 200 away from the base substrate 100 between step S120 and step S130, i.e. before forming the reflective layer 300;
step S130 may be implemented by the following procedure:
step S1305, forming a reflective material layer on the surface of the organic protection layer 402 away from the substrate 100;
in step S1307, the reflective material layer is patterned by wet etching to form the reflective layer 300.
Alternatively, the organic protective layer 402 may be an inkjet printed organic layer.
Alternatively, the organic protective layer 402 does not cover the peripheral region B of the mirror array substrate. For example, an organic layer may be inkjet printed in the display area a of the mirror array substrate, while no organic layer is printed in the peripheral area B of the mirror array substrate. As such, the organic protective layer 402 may achieve protection of the display layer 200 and other film layers of the encapsulation layer 400.
In one embodiment of the present disclosure, in step S130, a plurality of light-transmitting holes 301 may be formed on the reflective material layer by etching, such that an area of an orthogonal projection of any one of the light-transmitting holes 301 on the substrate base plate 100 is 50% to 100% of an area of an orthogonal projection of a light-emitting region of the corresponding display unit 220 on the substrate base plate 100; the orthographic projection of any light-transmitting hole 301 on the substrate 100 is located in the orthographic projection of the light-emitting region of the corresponding display unit 220 on the substrate 100.
In another embodiment of the present disclosure, in step S130, a plurality of light-transmitting holes 301 may be formed on the reflective material layer by etching, such that an area of an orthogonal projection of any one of the light-transmitting holes 301 on the substrate base plate 100 is 100% to 150% of an area of an orthogonal projection of a light-emitting region of a corresponding display unit 220 on the substrate base plate 100; the orthographic projection of the light emitting region of any display unit 220 on the substrate 100 is located in the orthographic projection of the corresponding light-transmitting hole 301 on the substrate 100.
Other details, principles and effects related to the method for manufacturing a mirror array substrate of the present disclosure have been described in detail in the above embodiments of the mirror array substrate, and are not repeated herein.
The embodiments of the present disclosure also provide a mirror display panel including any one of the mirror array substrates described in the above embodiments of the mirror array substrate. The mirror display panel may be a mirror OLED display panel, a mirror LCD display panel, or other types of mirror display panels. Since the mirror display panel has any one of the mirror array substrates described in the above embodiments of the mirror array substrate, the same advantageous effects are obtained, and details are not repeated in this disclosure.
Optionally, the mirror display panel further includes a flexible circuit board 600, and a driving chip is disposed on the flexible circuit board 600. The flexible circuit board 600 may be electrically connected to a pad of the peripheral region B of the mirror array substrate, for driving the mirror array substrate to display a picture.
Embodiments of the present disclosure also provide a mirror display device including any one of the mirror display panels described in the above mirror display panel embodiments. The mirror display may be a cycling rearview mirror, a vanity mirror, or other type of mirror display. Since the mirror display device has any one of the mirror display panels described in the above embodiments of the mirror display panel, the same advantages are obtained, and details are not repeated in this disclosure.
It should be noted that although the various steps of the methods of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that these steps must be performed in this particular order, or that all of the depicted steps must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc., are all considered part of this disclosure.
It is to be understood that the disclosure is not limited in its application to the details of construction and the arrangements of the components set forth in the specification. The present disclosure is capable of other embodiments and of being practiced and carried out in various ways. The foregoing variations and modifications are within the scope of the present disclosure. It should be understood that the disclosure disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for carrying out the disclosure and will enable those skilled in the art to utilize the disclosure.
Claims (14)
1. A mirror array substrate, comprising:
a substrate base plate;
the display layer is arranged on one side of the substrate base plate; the display layer is provided with a plurality of display units distributed in an array;
the reflecting layer is arranged on one side, away from the substrate, of the display layer, and is provided with a plurality of light holes which correspond to the display units one to one; the orthographic projection of the light emitting region of any one display unit on the substrate base plate is at least partially overlapped with the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
2. The mirror array substrate according to claim 1, further comprising:
and the inorganic protective layer is arranged between the display layer and the reflecting layer, and the reflecting layer is arranged on the surface of the inorganic protective layer far away from the substrate base plate.
3. The mirror array substrate according to claim 2, wherein the inorganic protective layer is made of silicon nitride.
4. The mirror array substrate according to claim 1, further comprising:
and the organic protective layer is arranged between the display layer and the reflecting layer, and the reflecting layer is arranged on the surface of the organic protective layer far away from the substrate.
5. The mirror array substrate according to claim 1, wherein an area of an orthogonal projection of any one of the light-transmitting holes on the substrate is 50% to 100% of an area of an orthogonal projection of a light-emitting region of the corresponding display unit on the substrate; and the orthographic projection of any light-transmitting hole on the substrate base plate is positioned in the orthographic projection of the light-emitting area of the corresponding display unit on the substrate base plate.
6. The mirror array substrate according to claim 1, wherein an area of an orthogonal projection of any one of the light-transmitting holes on the substrate is 100% to 150% of an area of an orthogonal projection of a light-emitting region of the corresponding display unit on the substrate; the orthographic projection of the light emitting area of any one display unit on the substrate base plate is positioned in the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
7. The mirror array substrate of claim 1, wherein the display unit is an organic light emitting diode.
8. A mirror display panel comprising the mirror array substrate according to any one of claims 1 to 7.
9. A mirror display device comprising the mirror display panel according to claim 8.
10. A preparation method of a mirror array substrate is characterized by comprising the following steps:
providing a substrate base plate;
forming a display layer on one side of the substrate, wherein the display layer is provided with a plurality of display units distributed in an array manner;
forming a reflecting layer on one side of the display layer far away from the substrate base plate; the reflecting layer is provided with a plurality of light holes which are in one-to-one correspondence with the display units; the orthographic projection of the light emitting region of any one display unit on the substrate base plate is at least partially overlapped with the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
11. The method of manufacturing a mirror array substrate according to claim 10, further comprising:
before the reflecting layer is formed, forming an inorganic protective layer on one side of the display layer far away from the substrate;
forming a reflective layer on a side of the display layer away from the substrate includes:
forming a reflecting material layer on the surface of the inorganic protective layer far away from the substrate base plate;
and patterning the reflecting material layer through dry etching to form the reflecting layer.
12. The method of manufacturing a mirror array substrate according to claim 10, further comprising:
before the reflecting layer is formed, forming an organic protective layer on one side of the display layer, which is far away from the substrate;
forming a reflective layer on a side of the display layer away from the substrate includes:
forming a reflecting material layer on the surface of the organic protective layer far away from the substrate base plate;
and patterning the reflecting material layer through wet etching to form the reflecting layer.
13. The method of claim 10, wherein forming a reflective layer on a side of the display layer away from the substrate comprises:
forming a reflecting material layer on one side of the display layer far away from the substrate base plate;
forming a plurality of light holes on the reflecting material layer by etching, so that the orthographic projection area of any one light hole on the substrate is 50% -100% of the orthographic projection area of the light emitting area of the corresponding display unit on the substrate; and the orthographic projection of any light-transmitting hole on the substrate base plate is positioned in the orthographic projection of the light-emitting area of the corresponding display unit on the substrate base plate.
14. The method of claim 10, wherein forming a reflective layer on a side of the display layer away from the substrate comprises:
forming a reflecting material layer on one side of the display layer far away from the substrate base plate;
forming a plurality of light holes on the reflecting material layer by etching, so that the orthographic projection area of any one light hole on the substrate is 100% -150% of the orthographic projection area of the light emitting area of the corresponding display unit on the substrate; the orthographic projection of the light emitting area of any one display unit on the substrate base plate is positioned in the orthographic projection of the corresponding light-transmitting hole on the substrate base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911132432.7A CN110828695A (en) | 2019-11-19 | 2019-11-19 | Mirror array substrate, preparation method thereof, mirror display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911132432.7A CN110828695A (en) | 2019-11-19 | 2019-11-19 | Mirror array substrate, preparation method thereof, mirror display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110828695A true CN110828695A (en) | 2020-02-21 |
Family
ID=69556630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911132432.7A Pending CN110828695A (en) | 2019-11-19 | 2019-11-19 | Mirror array substrate, preparation method thereof, mirror display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110828695A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111308772A (en) * | 2020-02-28 | 2020-06-19 | 合肥鑫晟光电科技有限公司 | Array substrate and preparation method thereof, display panel and driving method thereof |
| CN111416064A (en) * | 2020-04-30 | 2020-07-14 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN111584602A (en) * | 2020-05-28 | 2020-08-25 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN111785769A (en) * | 2020-08-26 | 2020-10-16 | 京东方科技集团股份有限公司 | Mirror display panel and display device |
| CN111785767A (en) * | 2020-08-25 | 2020-10-16 | 京东方科技集团股份有限公司 | Mirror display device and manufacturing method thereof |
| CN111900190A (en) * | 2020-08-07 | 2020-11-06 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN111900189A (en) * | 2020-08-07 | 2020-11-06 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN112310326A (en) * | 2020-10-30 | 2021-02-02 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN113380962A (en) * | 2021-06-07 | 2021-09-10 | 京东方科技集团股份有限公司 | Mirror display panel, display device, preparation method and display method |
| CN113451527A (en) * | 2021-06-28 | 2021-09-28 | 京东方科技集团股份有限公司 | Display panel and display device |
| WO2022193094A1 (en) * | 2021-03-15 | 2022-09-22 | 京东方科技集团股份有限公司 | Manufacturing method for light-mixing plate, light-mixing plate and backlight module |
| CN116027587A (en) * | 2022-12-30 | 2023-04-28 | 维沃移动通信有限公司 | Display module and electronic equipment |
| EP4131407A4 (en) * | 2020-05-28 | 2023-09-27 | BOE Technology Group Co., Ltd. | Display panel and display device |
| WO2023231678A1 (en) * | 2022-05-31 | 2023-12-07 | 京东方科技集团股份有限公司 | Display device |
| CN117495664A (en) * | 2023-12-25 | 2024-02-02 | 成都白泽智汇科技有限公司 | Intelligent auxiliary cosmetic system |
| WO2024088430A1 (en) * | 2022-10-25 | 2024-05-02 | 京东方科技集团股份有限公司 | Display panel and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104103661A (en) * | 2013-04-09 | 2014-10-15 | 三星显示有限公司 | Organic light-emitting display apparatus providing mirror function |
| CN105575998A (en) * | 2014-10-31 | 2016-05-11 | 乐金显示有限公司 | Organic light emitting display device and method for manufacturing the same |
| CN107026245A (en) * | 2016-02-02 | 2017-08-08 | 三星显示有限公司 | Organic light-emitting display device |
| CN107104126A (en) * | 2016-02-23 | 2017-08-29 | 三星显示有限公司 | Organic light-emitting display device and its manufacture method with improved reflectivity properties |
-
2019
- 2019-11-19 CN CN201911132432.7A patent/CN110828695A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104103661A (en) * | 2013-04-09 | 2014-10-15 | 三星显示有限公司 | Organic light-emitting display apparatus providing mirror function |
| CN105575998A (en) * | 2014-10-31 | 2016-05-11 | 乐金显示有限公司 | Organic light emitting display device and method for manufacturing the same |
| CN107026245A (en) * | 2016-02-02 | 2017-08-08 | 三星显示有限公司 | Organic light-emitting display device |
| CN107104126A (en) * | 2016-02-23 | 2017-08-29 | 三星显示有限公司 | Organic light-emitting display device and its manufacture method with improved reflectivity properties |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11614669B2 (en) | 2020-02-28 | 2023-03-28 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Array substrate and preparation method thereof, display panel and driving method thereof |
| CN111308772A (en) * | 2020-02-28 | 2020-06-19 | 合肥鑫晟光电科技有限公司 | Array substrate and preparation method thereof, display panel and driving method thereof |
| CN111308772B (en) * | 2020-02-28 | 2022-10-11 | 合肥鑫晟光电科技有限公司 | Array substrate and preparation method thereof, display panel and driving method thereof |
| CN111416064A (en) * | 2020-04-30 | 2020-07-14 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN111416064B (en) * | 2020-04-30 | 2022-12-06 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| WO2021238465A1 (en) * | 2020-05-28 | 2021-12-02 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display device |
| CN111584602A (en) * | 2020-05-28 | 2020-08-25 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| EP4131407A4 (en) * | 2020-05-28 | 2023-09-27 | BOE Technology Group Co., Ltd. | Display panel and display device |
| CN111584602B (en) * | 2020-05-28 | 2023-04-07 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN111900189A (en) * | 2020-08-07 | 2020-11-06 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN111900190A (en) * | 2020-08-07 | 2020-11-06 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| WO2022028190A1 (en) * | 2020-08-07 | 2022-02-10 | 京东方科技集团股份有限公司 | Display substrate and preparation method therefor, and display apparatus |
| CN111785767A (en) * | 2020-08-25 | 2020-10-16 | 京东方科技集团股份有限公司 | Mirror display device and manufacturing method thereof |
| CN111785767B (en) * | 2020-08-25 | 2023-04-07 | 京东方科技集团股份有限公司 | Mirror display device and manufacturing method thereof |
| CN111785769A (en) * | 2020-08-26 | 2020-10-16 | 京东方科技集团股份有限公司 | Mirror display panel and display device |
| CN112310326A (en) * | 2020-10-30 | 2021-02-02 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN112310326B (en) * | 2020-10-30 | 2024-09-10 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN115605806A (en) * | 2021-03-15 | 2023-01-13 | 京东方科技集团股份有限公司（Cn） | Manufacturing method of light mixing plate, light mixing plate and backlight module |
| WO2022193094A1 (en) * | 2021-03-15 | 2022-09-22 | 京东方科技集团股份有限公司 | Manufacturing method for light-mixing plate, light-mixing plate and backlight module |
| CN113380962A (en) * | 2021-06-07 | 2021-09-10 | 京东方科技集团股份有限公司 | Mirror display panel, display device, preparation method and display method |
| CN113451527A (en) * | 2021-06-28 | 2021-09-28 | 京东方科技集团股份有限公司 | Display panel and display device |
| WO2023231678A1 (en) * | 2022-05-31 | 2023-12-07 | 京东方科技集团股份有限公司 | Display device |
| WO2024088430A1 (en) * | 2022-10-25 | 2024-05-02 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN116027587A (en) * | 2022-12-30 | 2023-04-28 | 维沃移动通信有限公司 | Display module and electronic equipment |
| CN117495664A (en) * | 2023-12-25 | 2024-02-02 | 成都白泽智汇科技有限公司 | Intelligent auxiliary cosmetic system |
| CN117495664B (en) * | 2023-12-25 | 2024-04-09 | 成都白泽智汇科技有限公司 | Intelligent auxiliary cosmetic system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110828695A (en) | Mirror array substrate, preparation method thereof, mirror display panel and display device | |
| US11832494B2 (en) | Display panel and display device for thinning a thickness of a display | |
| GB2566789A (en) | Touch screen panel and display apparatus with integrated touch screen | |
| KR20190128101A (en) | Display device | |
| CN110838509A (en) | Array substrate, manufacturing method thereof and display device | |
| US20160178812A1 (en) | Optical film and display assembly applying the same | |
| KR102440471B1 (en) | Display apparatus and manufacturimg method thereof | |
| CN110767841A (en) | Display substrate, preparation method thereof and display device | |
| WO2018223988A1 (en) | Optical module and reflective display device having same | |
| US20140192416A1 (en) | Window member, method of manufacturing the same, and display device having the same | |
| US20210036263A1 (en) | Display device and method of manufacturing the display device | |
| KR102245505B1 (en) | Dual display device and method for fabricating the same | |
| US20070091232A1 (en) | Flexible liquid crystal display and manufacturing method thereof | |
| CN114830019A (en) | Display with passive display area | |
| US12078888B2 (en) | Backlight unit and display device including the same | |
| TWI823910B (en) | Display apparatus and manufacturing method thereof | |
| WO2020178922A1 (en) | Display device | |
| CN113130613B (en) | Display substrate, device and preparation method thereof | |
| TWI556425B (en) | Pixel structure and display panel using the same | |
| TWI552044B (en) | Optical film and touch controlled display apparatus using the same | |
| CN116437767A (en) | Display panel and display device | |
| TWM606233U (en) | Electronic device | |
| CN112542496A (en) | Display panel | |
| KR20200059551A (en) | Organic light emitting display device and manufacturing method for cover window of the same | |
| CN114545677B (en) | Reflective display module and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200221 |