CN110819964A

CN110819964A - Vacuum coating equipment and method and preparation method of filter cavity film layer

Info

Publication number: CN110819964A
Application number: CN201810917305.7A
Authority: CN
Inventors: 邵聪; 郑金桥; 宋忠孝
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2018-08-13
Filing date: 2018-08-13
Publication date: 2020-02-21
Also published as: DE112019004100T5; WO2020034967A1; JP7122457B2; JP2021533274A

Abstract

The invention discloses vacuum coating equipment and method and a preparation method of a filter cavity film layer. Wherein, equipment includes: an inlet differential pressure chamber, a coating chamber and an outlet differential pressure chamber; the inlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an inlet of the coating chamber; the vacuum degree of a vacuum transition chamber connected with the inlet of the coating chamber can reach the vacuum degree of the coating chamber; the coating chamber is provided with coating equipment; the outlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an outlet of the coating chamber; the vacuum degree of a vacuum transition chamber connected with an outlet of the coating chamber can reach the vacuum degree of the coating chamber; the apparatus further comprises a transport device for transporting the substrate for coating.

Description

Vacuum coating equipment and method and preparation method of filter cavity film layer

Technical Field

The present invention relates to, but is not limited to, the field of vacuum coating fabrication.

Background

The vacuum coating is to deposit a film layer with certain functions on the surface of a substrate by adopting a deposition technology in an environment with certain vacuum degree.

The film layer deposited by the Physical Vapor Deposition (PVD) technology has the advantages of high hardness, low friction coefficient, good wear resistance, good chemical stability and the like, and the film coated by the PVD technology has good environmental protection, so the film is widely applied.

Meanwhile, in order to improve the processing efficiency, continuous PVD coating equipment is produced, however, in the related art, compared with the common PVD coating equipment, the continuous PVD coating equipment is adopted for coating, so that the processing efficiency of the product can be improved, but the processing efficiency is still lower, and particularly for large-volume parts, the processing efficiency is still very low.

Disclosure of Invention

In order to solve the related technical problems, embodiments of the present invention provide a vacuum coating apparatus and method, and a method for preparing a filter cavity film layer.

The technical scheme of the embodiment of the invention is realized as follows:

a vacuum coating apparatus, the apparatus comprising: an inlet differential pressure chamber, a coating chamber and an outlet differential pressure chamber; wherein,

the inlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an inlet of the coating chamber; aiming at each vacuum line, the vacuum degree of a vacuum transition chamber connected with the inlet of the coating chamber can reach the vacuum degree of the coating chamber;

the coating chamber is provided with a coating device;

the outlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an outlet of the coating chamber; aiming at each vacuum line, the vacuum degree of a vacuum transition chamber connected with the outlet of the coating chamber can reach the vacuum degree of the coating chamber;

the apparatus further comprises a transport device for transporting the substrate for coating.

In the technical scheme, the coating chamber is provided with at least two first components for placing the target.

In the above technical solution, a first distance is provided between two adjacent first components, so that an overlapping region exists between a radiation range corresponding to a target on one of the two adjacent first components and a radiation range corresponding to a target on the other of the two adjacent first components.

In the above technical solution, each vacuum line of the inlet differential pressure chamber further comprises a cleaning vacuum chamber for performing plasma cleaning on the substrate; the vacuum degree of the cleaning vacuum chamber is smaller than that of a vacuum transition chamber connected with the inlet of the coating chamber.

In the technical scheme, a second component is arranged between the adjacent vacuum transition chambers of each vacuum line; the second component is arranged to realize vacuum isolation between the adjacent vacuum transition chambers when the substrate is transferred to the corresponding vacuum transition chamber; and when the substrate is transferred to a next adjacent vacuum transition chamber, a second member disposed between the next adjacent vacuum transition chamber is opened.

In the technical scheme, the second component is arranged between the vacuum transition chamber connected with the inlet of the coating chamber and the coating chamber; and the second component is arranged between the vacuum transition chamber connected with the outlet of the coating chamber and the coating chamber.

In the technical scheme, the conveying devices in the inlet differential pressure chamber, the coating chamber and the outlet differential pressure chamber are respectively and independently arranged.

In the technical scheme, each vacuum line of the inlet differential pressure chamber is correspondingly provided with one transmission device; and each vacuum line of the outlet differential pressure chamber is correspondingly provided with a transmission device.

In the above technical scheme, each vacuum chamber is correspondingly provided with one transmission device.

A preparation method of a filter cavity film layer adopts the filter cavity film layer prepared by any one of the vacuum coating equipment.

A vacuum coating method, the method comprising:

selecting one vacuum line from at least two vacuum lines of a differential pressure chamber at an inlet of the vacuum coating equipment; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel;

sequentially conveying the substrate to each stage of vacuum transition chamber of the selected vacuum line, and vacuumizing to enable the vacuum degree to reach the preset vacuum degree corresponding to each vacuum transition chamber;

when the substrate enters the last stage vacuum transition chamber of the selected vacuum line and the vacuum degree of the vacuum transition chamber after entering is the same as the vacuum degree of the coating chamber, the substrate is conveyed to the coating chamber of the vacuum coating equipment, and a coating layer is deposited on the substrate by the coating equipment of the coating chamber;

selecting one vacuum line from at least two vacuum lines of an outlet differential pressure chamber of the vacuum coating equipment; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel;

sequentially conveying the substrate deposited with the film layer to each stage of vacuum transition chamber of the selected vacuum line, and vacuumizing to make the vacuum degree reach the preset vacuum degree corresponding to each vacuum transition chamber so as to output the substrate deposited with the film layer;

wherein the substrate is conveyed by a conveying device of the vacuum coating equipment.

In the above technical solution, selecting one vacuum line from at least two vacuum lines of the vacuum coating equipment inlet differential pressure chamber includes:

detecting whether the corresponding vacuum line is in a vacuum buffer state or not for each vacuum line; the corresponding vacuum line in the vacuum buffer state does not meet the condition of conveying the substrate to the coating chamber;

determining at least one vacuum line that is not in a vacuum buffer state;

selecting one vacuum line from at least one vacuum line which is not in a vacuum buffer state.

In the above technical solution, sequentially transferring the substrate to each stage of vacuum transition chamber of the selected vacuum line, and vacuumizing to make the vacuum degree reach the preset vacuum degree corresponding to each vacuum transition chamber, includes:

for each vacuum transition chamber, when the substrate enters the corresponding vacuum transition chamber, opening a second part arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate is currently located, so that the substrate is conveyed to the corresponding vacuum transition chamber;

after the substrate enters the corresponding vacuum transition chamber, closing a second part arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate is located at present, and vacuumizing;

and when the vacuum degree meets the preset vacuum degree corresponding to the corresponding vacuum transition chamber, opening a second component arranged between the corresponding vacuum transition chamber and the next adjacent vacuum transition chamber, so that the substrate is conveyed to the next adjacent vacuum transition chamber.

In the above technical solution, the method further includes:

the substrate is conveyed to the last-stage vacuum transition chamber, the vacuum degree of the vacuum transition chamber is the same as that of the coating chamber, and a second component arranged between the last-stage vacuum transition chamber and the coating chamber is opened so that the substrate is conveyed to the coating chamber;

and after the substrate is conveyed to the coating chamber, closing a second component arranged between the final stage vacuum transition chamber and the coating chamber.

In the above technical solution, the selecting one vacuum line from at least two vacuum lines of the outlet differential pressure chamber of the vacuum coating apparatus includes:

detecting whether the corresponding vacuum line is in a vacuum buffer state or not for each vacuum line; the corresponding vacuum line does not meet the output condition in the vacuum buffer state;

determining at least one vacuum line that is not in a vacuum buffer state;

In the above technical solution, sequentially transferring the substrate deposited with the film layer to each stage of vacuum transition chamber of the selected vacuum line, and vacuumizing to make the vacuum degree reach the preset vacuum degree corresponding to each vacuum transition chamber, includes:

for each vacuum transition chamber, when the substrate deposited with the film layer enters the corresponding vacuum transition chamber, opening a second component arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate deposited with the film layer is currently located, so that the substrate deposited with the film layer is conveyed to the corresponding vacuum transition chamber;

after the substrate deposited with the film layer enters the corresponding vacuum transition chamber, closing a second component arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate is currently located, and vacuumizing the vacuum transition chamber where the substrate deposited with the film layer is currently located;

and opening a second part arranged between the corresponding vacuum transition chamber and the next adjacent vacuum transition chamber so that the substrate deposited with the film layer is transferred to the next adjacent vacuum transition chamber.

In the above technical solution, the method further includes:

after the film deposition of the substrate is finished, opening a second component arranged between a vacuum transition chamber connected with an outlet of the coating chamber and the coating chamber so that the substrate deposited with the film is conveyed to the vacuum transition chamber connected with the outlet of the coating chamber;

and after the substrate deposited with the film layer is conveyed to a vacuum transition chamber connected with the outlet of the coating chamber, closing a second component arranged between the vacuum transition chamber connected with the outlet of the coating chamber and the coating chamber.

In the above technical solution, the depositing a film on the substrate by using the coating apparatus of the coating chamber includes:

when the substrate is conveyed to an overlapping area of a radiation range corresponding to a first target and a radiation range corresponding to a second target arranged on a first component of the coating chamber, a transition layer is formed on the substrate under the radiation of the second target; the second target is mounted on an adjacent first part spaced a first distance from the first part on which the first target is mounted.

In the above technical solution, when the substrate is sequentially transferred to each stage of vacuum transition chamber of the selected vacuum line and vacuumized to make the vacuum degree reach the preset vacuum degree corresponding to each vacuum transition chamber, the method further includes:

and conveying the substrate to a cleaning vacuum chamber of the selected vacuum line, vacuumizing to enable the vacuum degree to reach the vacuum degree of the cleaning vacuum chamber, and carrying out plasma cleaning on the substrate.

In the above technical solution, the preparing the target material of the filter cavity film layer includes: cr target, Cu target, Ag target; and when the film layer is deposited, a Cr layer, a Cu layer and an Ag layer are sequentially deposited on the filter cavity.

In the above technical solution, the preparing the target material of the filter cavity film layer includes: cr target, Cu target, Ag-Ta target; and when the film layer is deposited, a Cr layer, a Cu layer and an Ag-Ta layer are sequentially deposited on the filter cavity.

In the above technical solution, the method further includes:

uniformly embedding a block Ta material on an Ag plate;

and preparing the Ag plate embedded with the Ta material into an Ag-Ta target material.

In the technical scheme, the surface area ratio of Ag to Ta in the Ag-Ta target material is 1: 1-10: 1.

In the technical scheme, the relative atomic ratio of Ag to Ta in the deposited Ag-Ta layer is 4: 1-50: 1.

According to the vacuum coating equipment and method and the preparation method of the filter cavity film layer, provided by the embodiment of the invention, the inlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an inlet of the coating chamber; aiming at each vacuum line, the vacuum degree of a vacuum transition chamber connected with the inlet of the coating chamber can reach the vacuum degree of the coating chamber; the outlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an outlet of the coating chamber; aiming at each vacuum line, the vacuum degree of a vacuum transition chamber connected with the outlet of the coating chamber can reach the vacuum degree of the coating chamber; because the inlet differential pressure chamber and the outlet differential pressure chamber are structural devices with a plurality of vacuum lines connected in parallel, for the inlet differential pressure chamber, when one vacuum line can not convey a sample to be deposited, the other vacuum line can be selected to convey the sample to be deposited to the film coating chamber, so that the sample to be deposited can be continuously conveyed to the film coating chamber; for the outlet differential pressure chamber, when one vacuum line can not output the sample which finishes coating, the other vacuum line can be selected to output the sample which finishes coating, thereby continuously receiving the sample which finishes coating and is output from the coating chamber, and thus, the continuous batch processing of the sample can be finished, and the processing efficiency can be greatly improved.

Drawings

FIG. 1 is a schematic structural diagram of a vacuum coating apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic flow chart of a vacuum coating method according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a vacuum coating apparatus according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples.

A continuous PVD coating equipment adopts a plurality of vacuum chambers for buffering to ensure the vacuum degree of the coating chamber, and products are in a stop state in the buffering process (vacuumizing or vacuum adjusting process), so that samples intermittently flow into the coating chamber under the condition, and the machining efficiency of the products is difficult to improve by adopting the continuous PVD coating equipment, and is very low particularly for large-size parts.

In view of this, in various embodiments of the present invention, a first portion of the vacuum coating apparatus (referred to as the inlet differential pressure chamber) is responsible for delivering product to the coating chamber (i.e., a second portion of the vacuum coating apparatus); the second part is responsible for depositing various film layers; the third part (called outlet differential pressure chamber) of the vacuum coating equipment is responsible for receiving the product which is output by the coating chamber and is coated; the first part comprises a plurality of vacuum lines which are connected in parallel so as to continuously convey samples to be deposited to the second part; the third part comprises a plurality of vacuum lines which are connected in parallel so as to continuously receive the samples which are output from the second part and are subjected to coating.

According to the scheme provided by the embodiment of the invention, the inlet differential pressure chamber and the outlet differential pressure chamber are structural devices with a plurality of vacuum lines connected in parallel, so that continuous batch processing of samples can be completed, and the processing efficiency can be greatly improved.

An embodiment of the present invention provides a vacuum coating apparatus, as shown in fig. 1, the apparatus including: an inlet differential pressure chamber 11, a coating chamber 12 and an outlet differential pressure chamber 13; wherein,

the inlet differential pressure chamber 11 is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an inlet of the coating chamber; for each vacuum line, the vacuum degree of a vacuum transition chamber connected with the inlet of the coating chamber 12 can reach the vacuum degree of the coating chamber;

the coating chamber 12 is provided with coating equipment;

the outlet differential pressure chamber 13 is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an outlet of the coating chamber; for each vacuum line, the vacuum degree of the vacuum transition chamber connected with the outlet of the coating chamber 12 can reach the vacuum degree of the coating chamber.

In addition, when in practical application, the equipment also comprises a conveying device for conveying the substrate for coating.

According to the vacuum coating equipment provided by the embodiment of the invention, after one vacuum line is selected from at least two vacuum lines of the inlet differential pressure chamber 11, the substrate is sequentially conveyed to each stage of vacuum transition chamber of the selected vacuum line, vacuum is extracted to ensure that the vacuum degree of the substrate after entering the coating chamber 12 meets the coating requirement, after the coating of the coating chamber, one vacuum line is selected from at least two vacuum lines of the outlet differential pressure chamber 13, the substrate deposited with the film layer is sequentially conveyed to each stage of vacuum transition chamber of the selected vacuum line, and finally the substrate deposited with the film layer is output.

Wherein, the at least two vacuum lines are connected in parallel, which means that: one end of each vacuum line of the inlet differential pressure chamber 11 can be communicated with the outside atmosphere (also can be understood as communication), and the other end of each vacuum line is connected with the inlet of the coating chamber 12; correspondingly, one end of each vacuum line of the outlet differential pressure chamber 13 is connected with the outlet of the coating chamber 12, and the other end of each vacuum line can be communicated with the outside atmosphere.

In the working process of the vacuum coating equipment, aiming at each vacuum line of the inlet differential pressure chamber 11, the vacuum degree of each vacuum transition chamber is different, and starting from the vacuum transition chamber which receives a substrate in the atmosphere, the vacuum degree of the vacuum transition chamber is higher and higher according to the connection sequence, and the vacuum degree of the vacuum transition chamber connected with the inlet of the coating chamber 12 is basically the same as that of the coating chamber; correspondingly, for each vacuum line of the outlet differential pressure chamber 13, the vacuum degree of each vacuum transition chamber is different, the vacuum degree of the vacuum transition chamber connected with the outlet of the coating chamber is basically the same as the vacuum degree of the coating chamber, and the vacuum degree of the vacuum transition chamber connected with the inlet of the coating chamber 12 is gradually lower and lower according to the connection sequence, so that the vacuum degree of the coating chamber 12 can meet the coating requirement, and the vacuum degree corresponding to each vacuum line can quickly reach the set vacuum degree by adopting a multistage vacuumizing mode.

The number of the inlet differential pressure chamber 11 and the outlet differential pressure chamber 13 vacuum transition chambers may be set as needed, for example, in combination with the degree of vacuum and cost in plating.

In practical application, the coating technology of the coating equipment can be a PVD technology.

Based on this, in an embodiment, the coating chamber can be provided with at least two first components for placing the target materials, and different target materials can be placed due to the arrangement of the at least two first components, so that deposition of different film layers can be realized.

When a plurality of targets are arranged, no separation measure or specific distance is arranged between each target, so that a transition layer can be deposited on the base, and the bonding force between two films can be increased.

In this regard, in an embodiment, a first distance may be provided between two adjacent first members, such that a radiation range corresponding to the target on one of the two adjacent first members overlaps with a radiation range corresponding to the target on the other of the two adjacent first members, that is, the substrate is irradiated by the target on the other of the two adjacent first members when the substrate is transferred to the end of the radiation range corresponding to the target on the one of the two adjacent first members by the transfer device.

In practice, the substrate needs to be sufficiently clean before entering the coating chamber 12 to ensure strong adhesion between the deposited film and the substrate, and therefore, it is desirable to clean the substrate before entering the coating chamber 12.

For this reason, in one embodiment, each vacuum line of the inlet differential pressure chamber 11 further comprises a cleaning vacuum chamber for plasma cleaning the substrate; the vacuum degree of the cleaning vacuum chamber is smaller than that of a vacuum transition chamber connected with the inlet of the coating chamber.

In practical application, the cleaning vacuum chamber may be set in a proper position of the vacuum line according to a vacuum degree required for plasma cleaning of the substrate.

In one embodiment, a second component is arranged between adjacent vacuum transition chambers of each vacuum line; the second component is arranged to realize vacuum isolation between the adjacent vacuum transition chambers when the substrate is transferred to the corresponding vacuum transition chamber; and when the substrate is transferred to a next adjacent vacuum transition chamber, a second member disposed between the next adjacent vacuum transition chamber is opened.

That is, before entering the coating chamber 12, for each vacuum transition chamber, when the substrate enters the corresponding vacuum transition chamber, the second component arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate is currently located is opened, so that the substrate is transferred to the corresponding vacuum transition chamber;

Wherein the substrate is transferred to the final stage vacuum transition chamber, and the vacuum degree of the vacuum transition chamber is the same as that of the coating chamber, and a second component arranged between the final stage vacuum transition chamber and the coating chamber is opened so that the substrate is transferred to the coating chamber;

Here, for the second part corresponding to the cleaning vacuum chamber, the processing mode is the same as that of the second part corresponding to the vacuum transition chamber, and the description thereof is omitted.

After the film deposition is finished, for each vacuum transition chamber, when the substrate deposited with the film enters the corresponding vacuum transition chamber, opening a second component arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate deposited with the film is currently located, so that the substrate deposited with the film is conveyed to the corresponding vacuum transition chamber;

In practice, the second member may be in the form of a flap or a door, etc., and a valve may be additionally provided to open or close the second member.

In order to adjust the conveying speed, the conveying devices in the inlet differential pressure chamber 11, the coating chamber 12 and the outlet differential pressure chamber 13 can be independently arranged.

In addition, a conveying device is correspondingly arranged for each vacuum line of the inlet differential pressure chamber 11; each vacuum line of the outlet differential pressure chamber 13 is correspondingly provided with a transmission device.

In practical application, each vacuum chamber is correspondingly provided with one transmission device, and each vacuum chamber is provided with an independent transmission device, so that the vacuum degree of each vacuum chamber can be effectively ensured.

It should be noted that: the substrate refers to a sample on which a film layer is to be deposited.

In practical application, the vacuum coating equipment can also be provided with control equipment for controlling the operation of the inlet differential pressure chamber 11, the coating chamber 12 and the outlet differential pressure chamber 13.

In addition, the control device may also control the operation of the conveyor.

According to the vacuum coating equipment provided by the embodiment of the invention, the inlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an inlet of the coating chamber; aiming at each vacuum line, the vacuum degree of a vacuum transition chamber connected with the inlet of the coating chamber can reach the vacuum degree of the coating chamber; the coating chamber is provided with a coating device; the outlet differential pressure chamber is provided with at least two vacuum lines; each vacuum line comprises at least two stages of vacuum transition chambers which are connected in sequence; the at least two vacuum lines are connected in parallel, and one end of each vacuum line is connected with an outlet of the coating chamber; aiming at each vacuum line, the vacuum degree of a vacuum transition chamber connected with the outlet of the coating chamber can reach the vacuum degree of the coating chamber; the equipment also comprises a conveying device for conveying the substrate for coating, and as the inlet differential pressure chamber and the outlet differential pressure chamber are structural devices with a plurality of vacuum lines connected in parallel, for the inlet differential pressure chamber, when one vacuum line can not convey the sample to be deposited, the other vacuum line can be selected to convey the sample to be deposited to the coating chamber, so that the sample to be deposited can be continuously conveyed to the coating chamber; for the outlet differential pressure chamber, when one vacuum line can not output the sample which finishes coating, the other vacuum line can be selected to output the sample which finishes coating, thereby continuously receiving the sample which finishes coating and is output from the coating chamber, and thus, the continuous batch processing of the sample can be finished, and the processing efficiency can be greatly improved.

Based on the above device structure, an embodiment of the present invention further provides a vacuum coating method, as shown in fig. 2, the method includes:

step 201: selecting one vacuum line from at least two vacuum lines of a differential pressure chamber at an inlet of the vacuum coating equipment;

here, each vacuum line comprises at least two stages of vacuum transition chambers connected in sequence; the at least two vacuum lines are connected in parallel.

In practical applications, the substrate needs to be pretreated before being coated, and the pretreatment is generally performed in an atmospheric environment (which can be understood as an external environment), and the pretreatment may include: fine sand blasting (similar to the action of sanding), degreasing, etc., so that the surface of the substrate is clean and flat.

In an embodiment, the specific implementation of this step may include:

determining at least one vacuum line that is not in a vacuum buffer state;

Among them, a vacuum line in a vacuum buffer state is not available for transferring a substrate, and thus, only a vacuum line not in a vacuum buffer state can be selected for transferring a substrate.

In practical application, for a vacuum line, as long as the vacuum transition chamber communicated with the atmosphere in the vacuum line is not vacant temporarily, namely, the vacuum transition chamber communicated with the atmosphere has a substrate, the vacuum line cannot be selected.

In practical applications, when there are at least two (i.e. multiple) vacuum lines that are not in the vacuum buffer state, one vacuum line may be selected according to needs, for example, one vacuum line may be randomly selected.

It should be noted that: in practical application, during the operation process of the equipment, a plurality of vacuum lines are connected in parallel, and the vacuum lines are continuously switched, so that the samples are continuously conveyed to the coating chamber.

Step 202: sequentially conveying the substrate to each stage of vacuum transition chamber of the selected vacuum line, and vacuumizing to enable the vacuum degree to reach the preset vacuum degree corresponding to each vacuum transition chamber;

specifically, for each vacuum transition chamber, when the substrate enters the corresponding vacuum transition chamber, opening a second component arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate is currently located, so that the substrate is transferred to the corresponding vacuum transition chamber;

In practical application, in the process of operating the apparatus, when the vacuum degree of the last stage vacuum transition chamber reaches the preset vacuum degree, if a condition that the substrate cannot be conveyed like a coating chamber occurs (for example, the coating chamber is receiving the substrate from another vacuum line), the last stage vacuum transition chamber continues to be in a vacuum pumping state, and at this time, the vacuum line may also be referred to as being in a vacuum buffer state.

In an embodiment, the step of sequentially transferring the substrate to each stage of vacuum transition chamber of the selected vacuum line, and when the substrate is vacuumized to reach a predetermined vacuum degree corresponding to each vacuum transition chamber, the method further includes:

Here, in actual application, the preset vacuum degree is set as required.

Step 203: when the substrate enters the last stage vacuum transition chamber of the selected vacuum line and the vacuum degree of the vacuum transition chamber after entering is the same as the vacuum degree of the coating chamber, the substrate is conveyed to the coating chamber of the vacuum coating equipment, and a coating layer is deposited on the substrate by the coating equipment of the coating chamber;

here, the depositing a film on the substrate using the coating apparatus of the coating chamber includes:

when the substrate is conveyed to the end of the radiation range corresponding to the first target arranged on the first part of the coating chamber, a transition layer is formed on the substrate by the radiation of the second target; the second target is mounted on an adjacent first part spaced a first distance from the first part on which the first target is mounted.

That is, the irradiation ranges of the first target and the second target have an overlapping region where the transition layer is formed by irradiation of both the first target and the second target.

Step 204: selecting one vacuum line from at least two vacuum lines of an outlet differential pressure chamber of the vacuum coating equipment;

In an embodiment, the specific implementation of this step may include:

determining at least one vacuum line that is not in a vacuum buffer state;

Among them, the vacuum line in the vacuum buffer state is not available for outputting the substrate on which the film layer is deposited, and therefore, only the vacuum line not in the vacuum buffer state is selected to output the substrate on which the film layer is deposited.

During the practical application, for a vacuum line, as long as the vacuum degree of the vacuum transition chamber connected with the outlet of the coating chamber in the vacuum line does not reach the preset vacuum degree temporarily (namely does not reach the vacuum degree basically same as that of the coating chamber), the vacuum line can not be selected, and at the moment, the vacuum transition chamber connected with the outlet of the coating chamber in the vacuum line can not accept the substrate with the film layer deposited and output by the coating chamber.

It should be noted that: in practical application, during the operation process of the equipment, a plurality of vacuum lines are connected in parallel, and the vacuum lines are continuously switched, so that samples are continuously output from the coating chamber.

Step 205: and sequentially conveying the substrate deposited with the film layer to each stage of vacuum transition chamber of the selected vacuum line, and vacuumizing to ensure that the vacuum degree reaches the preset vacuum degree corresponding to each vacuum transition chamber so as to output the substrate deposited with the film layer.

Specifically, for each vacuum transition chamber, when the substrate deposited with the film layer enters the corresponding vacuum transition chamber, opening a second component arranged between the corresponding vacuum transition chamber and the vacuum transition chamber where the substrate deposited with the film layer is currently located, so that the substrate deposited with the film layer is conveyed to the corresponding vacuum transition chamber;

Here, it should be noted that: and the substrate deposited with the film layer enters a vacuum transition chamber, and after a second part arranged between the substrate deposited with the film layer and the previous adjacent vacuum transition chamber is closed, the substrate deposited with the film layer can enter the next adjacent vacuum transition chamber without concerning the vacuum degree of the previous adjacent vacuum transition chamber.

The cavity filter is an important electronic device and has wide application in the fields of radar, microwave, communication and the like. At present, the cavity of the industrial cavity filter is generally a magnesium substrate or an aluminum substrate, and due to the special requirement on the electrical conductivity of the cavity, the surface treatment method mostly adopts the silver electroplating process to carry out surface treatment on the cavity, while the silver electroplating process of the filter is mostly a highly toxic cyanide electroplating process, which has great influence on the health of the human body and the environment.

Based on the above, the embodiment of the invention also provides a preparation method of the cavity film layer of the filter, and the cavity film layer of the filter is prepared by adopting the vacuum coating equipment.

Wherein, the filter cavity is a base and can also be understood as a base material.

In practical applications, the filter cavity may be a magnesium substrate or an aluminum substrate.

In an embodiment, preparing the target of the filter cavity film layer may include: cr target, Cu target, Ag target; and when the film layer is deposited, a Cr layer, a Cu layer and an Ag layer are sequentially deposited on the filter cavity.

Wherein, the Cr layer is a transition layer between the cavity and the Cu layer.

In one embodiment, the preparing the target material of the filter cavity film layer includes: cr target, Cu target, Ag-Ta target; and when the film layer is deposited, a Cr layer, a Cu layer and an Ag-Ta layer are sequentially deposited on the filter cavity.

The present invention will be described in further detail with reference to the following application examples.

In the embodiment, as shown in fig. 3, the inlet differential pressure chamber 11 includes 3 vacuum lines, each vacuum line includes a vacuum transition chamber 111, a vacuum transition chamber 112, a vacuum transition chamber 113, a cleaning vacuum chamber 114, and a vacuum transition chamber 115, the vacuum transition chamber 111, the vacuum transition chamber 112, the vacuum transition chamber 113, the cleaning vacuum chamber 114, and the vacuum transition chamber 115 are connected in sequence, and a baffle 31 (the second component mentioned above, which may be a door in practical application) is disposed between the vacuum chambers, specifically including a baffle 311, a baffle 312, a baffle 313, a baffle 314, and a baffle 315. The vacuum transition chamber 111 can be communicated with the outside atmosphere and is responsible for receiving and delivering a sample to be deposited, so that the vacuum transition chamber can be also called a sample introduction vacuum chamber; the vacuum transition chamber 111 is in communication with the outside atmosphere through a door 32.

The differential outlet chamber 13 also includes 3 vacuum lines, and each vacuum line includes a vacuum transition chamber 131, a vacuum transition chamber 132, a vacuum transition chamber 133, and a vacuum transition chamber 134. The vacuum transition chamber 131, the vacuum transition chamber 132, the vacuum transition chamber 133, and the vacuum transition chamber 134 are connected in sequence, and a baffle 33 (the second component described above) is disposed between the vacuum chambers, specifically including a baffle 331, a baffle 332, a baffle 333, and a baffle 334. The vacuum transition chamber 134 can be communicated with the outside atmosphere and is responsible for outputting a sample, so that the vacuum transition chamber can be called a sample output vacuum chamber; the vacuum transition chamber 134 is in communication with the outside atmosphere through door 34.

The functions of the respective portions are described in detail below.

For the inlet differential pressure chamber 11, a baffle 31 arranged between the vacuum chambers can be opened or closed, so that communication or vacuum isolation between the vacuum chambers is realized; during the operation of the equipment, the baffles at two ends of each vacuum chamber only allow one end to be opened, namely when the baffle at one end of each vacuum chamber is about to be opened or is opened, the baffle or the door at the other end is required to be in a closed state.

With reference to fig. 3, when the apparatus is in operation, each vacuum line operates as follows:

step A: opening the door 32, placing a certain amount of products on the carrying device on the conveying device 35, closing the door 32, and vacuumizing the vacuum transition chamber 111 after sample introduction to a set vacuum degree;

and B: the shutter 311 is released (which can also be understood as opening) and the sample enters the transitional vacuum chamber 112, the shutter 311 is closed, and the transitional vacuum chamber 112 is evacuated to a specified vacuum level. Simultaneously, the vacuum transition chamber 111 is deflated to normal atmospheric pressure, and the door 32 is opened, so as to start to load the sample from the outside again;

and C: loosening the baffle 312, enabling the sample to enter the vacuum transition chamber 113, closing the baffle 312, and vacuumizing the vacuum transition chamber 113 to a set vacuum degree;

step D: loosening the baffle 313, enabling the product to enter the equal-cleaning vacuum chamber 114, closing the baffle 313, adjusting the vacuum degree of the equal-cleaning vacuum chamber 114 to a set vacuum degree, and then carrying out plasma cleaning on the sample;

step E: loosening the baffle 314, enabling the product to enter the vacuum transition chamber 115, closing the baffle 314, and vacuumizing the vacuum transition chamber 115 to the same vacuum degree as that of the coating chamber 12;

step F: the baffle 315 is released, the sample to be coated is transferred to the coating chamber 12, and the baffle 315 is closed, thereby completing the transfer process of the product to be coated.

Wherein, for the inlet differential pressure chamber 11, when a certain vacuum line is in a vacuum buffer state, the vacuum line stops conveying products to the coating chamber; meanwhile, other vacuum lines connected in parallel are responsible for conveying products to the coating chamber 12 in the period (the period when the vacuum lines are in a vacuum buffer state), and the coating chamber 12 can continuously receive the products to be coated from the inlet differential pressure chamber 11 through the cross conveying of a plurality of vacuum lines connected in parallel.

When one vacuum line has the condition of conveying the product to the coating chamber 12 (that is, the vacuum transition chamber 115 in the vacuum line is loaded with the product and the vacuum degree has reached the set vacuum degree requirement), and the coating chamber 12 is receiving the product from the other vacuum line, the product in the vacuum line is kept in a static state, and after the conveying of the product on the other vacuum line is finished, the baffle 315 of the vacuum line is released to start conveying the product to the coating chamber 12. The control equipment is used for controlling the process, and in this way, the conveying conflict can be avoided while the plurality of conveying vacuum lines work closely.

In addition, the number of vacuum chambers can be increased according to actual needs, the time of vacuum buffering can be shortened, and the processing efficiency can be improved, for example, one or more vacuum transition chambers can be added before the vacuum chamber 114 is cleaned on the basis of the number of vacuum transitions shown in fig. 3, or the number of vacuum chamber 114 can be increased, and the plasma cleaning efficiency can be improved.

For the coating chamber 12, a certain number of target positions 36 (the first component) are arranged in parallel on the upper part of the coating chamber 12, so that different target materials can be conveniently installed, and different coatings can be obtained. A product conveying device 37 is arranged right below the target, and the conveying speed is adjustable, such as the conveying speed can be adjusted according to the thickness of the deposited coating.

As shown in fig. 3, the front end of the coating chamber 12 is provided with a plurality of parallel conveying devices, one by one corresponding to a plurality of vacuum lines of the inlet differential pressure chamber 11, and the products conveyed from the inlet differential pressure chamber 11 are conveyed to the conveying device 37 in sequence; the rear end of the coating chamber 12 is provided with a plurality of parallel conveying devices, one corresponds to a plurality of vacuum lines of the outlet differential pressure chamber 13, and the products which are coated are sequentially conveyed to the corresponding vacuum lines of the outlet differential pressure chamber 13 from the product conveying device 37.

In practical application, on the premise of capacity support of the inlet differential pressure chamber 11 and the outlet differential pressure chamber 13, the length of the channel of the coating chamber 12 can be prolonged, the number of upper targets can be increased, the running speed of the chain of the conveying device 37 can be increased, and the processing efficiency can be greatly improved.

In practical application, various targets of the coating can be flexibly configured according to requirements to realize film formation of different coatings and film formation of different alloy coatings.

For the outlet differential pressure chamber 13, a baffle 33, similar to the baffle 31 in the inlet differential pressure chamber 11, disposed between the vacuum chambers can be opened or closed to achieve communication or vacuum isolation between the vacuum chambers; during the operation of the equipment, the baffles at two ends of each vacuum chamber only allow one end to be opened, namely when the baffle at one end of each vacuum chamber is about to be opened or is opened, the baffle at the other end must be in a closed state.

Referring to fig. 3, when the apparatus is in a continuous coating operation, the operation steps of each vacuum line are as follows:

step A: opening the baffle 331, allowing the product subjected to film coating to enter the vacuum transition chamber 131 from the film coating chamber 12, placing the product on the conveying device 38 to enter the vacuum transition chamber 131, and closing the baffle 331;

and B: the flap 332 is opened and product enters the vacuum transition chamber 132 and the flap 332 is closed. Meanwhile, the vacuum transition chamber 131 is vacuumized, and when the vacuum degree reaches the same vacuum degree as the coating chamber 12, the product is prepared to be received from the coating chamber 12 again;

and C: the flap 333 is opened and product enters the vacuum transition chamber 133 and the flap 333 is closed. Meanwhile, the vacuum transition chamber 132 is vacuumized, and when the specified vacuum degree is reached, the product is ready to be received from the vacuum transition chamber 131 again;

step D: the flap 334 is opened and product enters the vacuum transition chamber 134, closing the flap 334. Meanwhile, the vacuum transition chamber 133 is vacuumized, and when a specified vacuum degree is reached, the product is ready to be received from the vacuum transition chamber 132 again;

step E: after the vacuum transition chamber 134 is deflated to normal atmospheric pressure, the door 34 is opened, the coated product is taken out, the door 34 is closed, the vacuum transition chamber 134 is vacuumized to a specified vacuum degree, and the product is ready to be received from the vacuum transition chamber 133 again. At this point, the output of the product is completed.

Thus, the whole film coating process is completed.

When a certain vacuum line is in a vacuum buffer state (within vacuumizing time), the vacuum line suspends conveying products; meanwhile, other vacuum lines connected in parallel with the vacuum lines are responsible for receiving the products conveyed by the coating chamber 12 in the period (the period when the vacuum lines are in a vacuum buffer state) (when the control equipment detects that the vacuum degree of the vacuum lines is not satisfactory, other vacuum lines are selected to be responsible for receiving the products conveyed by the coating chamber 12), and the products which are coated in the coating chamber 12 can be continuously and continuously conveyed out through the cross operation of a plurality of vacuum lines connected in parallel.

In addition, when one vacuum line has the product condition conveyed by the coating receiving chamber 12 (namely, the vacuum transition chamber 131 in the vacuum line has no product and the vacuum degree reaches the specified requirement), and the coating chamber 12 conveys the product to the other vacuum line, the vacuum line product keeps a static state, and after the product conveying to the other vacuum line is finished, the vacuum line baffle 331 is loosened to start receiving the product conveyed by the coating chamber 12. In this way, each vacuum line can work closely and simultaneously, transmission conflict does not occur.

In addition, according to actual needs, the number of the vacuum transition chambers can be increased, the vacuum buffering time can be shortened, and the processing efficiency can be improved, for example, one or more vacuum transition chambers can be added before the vacuum transition chamber 134.

In this application embodiment, the film layer is deposited in the filter cavity using the process described above.

Specifically, first, the filter product is transferred to the coating chamber 12 by entering the differential pressure chamber 11;

here, the specific process of the transfer can be understood with reference to the operation process of the inlet differential pressure chamber 11 described above.

Then, depositing a film layer in the cavity of the filter in the film coating chamber 12;

herein, for the filter cavity, the target material installed on the upper part of the coating chamber 12 is Cr target, Cu target, Ag (or Ag-Ta assembled target, which can be selected according to the requirement), the filter product is driven by the chain of the conveyer 37 to deposit three layers of Cr, Cu, Ag (or Ag-Ta alloy, depending on the target material) in turn, wherein the Cr coating is thinnest and plays a transition role between the substrate and the coating, the Cu layer is thicker and is the most main conductive layer on the surface of the filter, the outermost layer of the filter product deposits a thinner Ag (or Ag-Ta alloy) layer, and the main purpose is to conduct electricity and protect the copper layer from oxidation.

The Ag-Ta assembled target is used for obtaining an Ag-Ta alloy coating with low Ta content, so that good conductivity is guaranteed, and the oxidation resistance of the outermost coating of the filter is improved;

in practical application, the manufacturing method of the Ag-Ta assembled target comprises the following steps: the method comprises the following steps of uniformly embedding small block-shaped Ta materials with different numbers on an Ag plate, processing the Ag plate embedded with the Ta materials into a target material, such as machining, arranging a back plate and the like, and finally obtaining an Ag-Ta assembled target, wherein in order to ensure good conductivity and certain oxidation resistance, the surface area ratio range of the Ag-Ta assembled target Ag to Ta required by a filter product can be as follows: 1: 1-10: 1, wherein the relative atomic ratio range of Ag and Ta in the obtained Ag-Ta alloy film layer can be as follows: 4: 1-50: 1.

In practical application, bulk Ta materials with uniform specifications can be used to make the material distribution in the deposited thin film uniform.

The size of the bulk Ta can be set as desired.

The uniform inlaying means that: a bulk Ta material is embedded in the unit area of the Ag plate. More specifically, an Ag plate is divided into N pieces uniformly on its surface (the side facing the filter product during deposition after being made into a target material), each piece being embedded with a Ta material.

Here, in practical application, the value of N is set on the principle that the material distribution in the deposited thin film can be uniform. N is an integer greater than or equal to 2.

The surface area is understood to be the effective working area and, in general, the exposed area of the target surface. Here, the area of the target surface exposed is: the area of the side of the target facing the filter product during deposition.

In addition, the upper portion of the coating chamber 12 is sequentially installed with three targets, namely, Cr target, Cu target and Ag target (or Ag-Ta assembled target), which are different in number, and each target is not provided with a separation measure or a specific distance, so that when the filter product is conveyed to the end of the radiation range of one target, the filter product is radiated by the adjacent second target, and thus a thinner alloy layer is formed.

In practical application, different alloys and alloy proportions thereof can be adjusted for the assembled target.

On the premise of the above steps, by adjusting the sputtering power of various targets and the running speed of the chain of the conveying device 37, composite conductive film layers with different thicknesses are obtained on the surface of the cavity of the filter, the area ratio of sputtering of Ag and Ta in the Ag-Ta assembly target is adjusted, and Ag-Ta alloy coating layers with different atomic ratios of Ag and Ta are obtained on the outermost layer of the composite conductive film layers on the surface of the filter, which is specifically as follows:

detailed description of the preferred embodiment 1

Operating according to the filter product pretreatment scheme and PVD continuous coating steps described above, a certain number of Cr targets, Cu targets, and Ag targets are sequentially installed in the coating chamber 12, and various parameters of the coating chamber are adjusted according to the radiation ranges of various targets and the running speed of the chain of the conveyor 37, as shown in table 1:

TABLE 1

According to the parameters shown in table 1, a composite conductive film layer with a Cu layer thickness of 8 μm and an Ag layer thickness of 1 μm was obtained on the surface of the filter cavity (the Cr layer belongs to the transition layer between the substrate and the plating layer, and no thickness requirement was made).

Specific example 2

The operation is carried out according to the filter product pretreatment scheme and the PVD continuous coating steps, a certain amount of Cr targets, Cu targets and Ag-Ta assembled targets are sequentially arranged in the coating chamber 12, wherein the area ratio of the Ag-Ta assembled targets to the Ta sputtering is 8:1, and various parameters of the coating chamber are adjusted according to the radiation range of various targets and the running speed of a chain of a conveying device 37, and the like, as shown in Table 2:

TABLE 2

According to the parameters shown in Table 2, a composite conductive film layer with a Cu layer thickness of 8 μm and an Ag-Ta alloy coating thickness of 0.9 μm is obtained on the surface of the filter cavity, wherein the atomic percentage of Ag and Ta in the Ag-Ta alloy coating is 40:1 (the Cr layer belongs to a transition layer of the substrate and the coating, and the thickness requirement is not made).

Specific example 3

The operation is performed according to the filter product pretreatment scheme and the PVD continuous coating step described above, a certain number of Cr targets, Cu targets, and Ag-Ta assembled targets are sequentially installed in the coating chamber 12, wherein the area ratio of the Ag-Ta assembled targets to the sputtering target Ag is 4:1, and various parameters of the coating chamber are adjusted according to the radiation range of various targets and the running speed of the chain of the conveyor 37, as shown in table 3:

TABLE 3

According to the parameters shown in table 3, a composite conductive film layer with a Cu layer thickness of 7 μm and an Ag-Ta alloy coating thickness of 1.1 μm was obtained on the surface of the filter cavity, wherein the atomic percentages of Ag and Ta in the Ag-Ta alloy coating are 20: 1 (the Cr layer belongs to the transition layer of the substrate and the plating layer, and the thickness requirement is not made).

Specific example 4

The operation is carried out according to the filter product pretreatment scheme and the PVD continuous coating steps, a certain amount of Cr targets, Cu targets and Ag-Ta assembled targets are sequentially arranged in the coating chamber 8, wherein the area ratio of the Ag-Ta assembled targets to the Ta sputtering is 2:1, and various parameters of the coating chamber are adjusted according to the radiation range of various targets and the running speed of a chain of a conveying device 37, and the like, as shown in Table 4:

TABLE 4

According to the parameters shown in table 4, a composite conductive film layer with a Cu layer thickness of 9 μm and an Ag-Ta alloy coating thickness of 1.2 μm was obtained on the surface of the filter cavity, wherein the atomic percentages of Ag and Ta in the Ag-Ta alloy coating are 10:1 (the Cr layer belongs to the transition layer of the substrate and the plating layer, and the thickness requirement is not made).

From the above description, it can be seen that the inlet differential pressure chamber and the outlet differential pressure chamber of the vacuum coating apparatus according to the embodiments of the present invention continuously deliver the product to be deposited to the coating chamber and continuously receive the filtered product after coating from the coating chamber through the parallel connection of the plurality of vacuum lines, so that the vacuum buffer is no longer a bottleneck in the improvement of the processing efficiency of continuous vacuum coating, and therefore, the efficiency of the deposition process is greatly improved.

In addition, aiming at a filter cavity product, an Ag-Ta assembled target is adopted above a coating chamber to deposit an Ag-Ta alloy coating, and the Ag-Ta assembled target material adopts a simple preparation method of mutual embedded combination of metals, so that the preparation difficulty of the target material is reduced and the flexibility of element component adjustment is improved compared with the traditional alloy target material (the alloy is obtained by adopting a metallurgy mode and is made into the target material, such as smelting or powder metallurgy and the like, the preparation difficulty is high, the period is long).

In addition, aiming at the cavity product of the filter, the Ag-Ta assembling target is adopted to deposit the Ag-Ta alloy film layer with high silver content and low tantalum content to serve as the outermost coating of the filter, and because Ta has excellent oxidation resistance, the oxidation resistance of the Ag-Ta alloy coating obtained on the surface of the filter is improved compared with the oxidation resistance of the traditional outermost Ag layer.

In the coating chamber, each target is not provided with a separation measure or a specific distance, when the filter product is conveyed to the tail end of the radiation range of one target, the filter product is radiated by the adjacent second target, so that a thinner alloy layer is formed and used as a transition layer between two different coating layers, and the bonding force between the two coating layers is better than that of the traditional bonding mode without the transition layer.

It should be noted that: fig. 3 shows an example in which the inlet differential pressure chamber is provided with five vacuum chambers and the outlet differential pressure chamber is provided with four vacuum chambers. However, in practical applications, the embodiment is not limited thereto, for example, in an embodiment, the inlet differential pressure chamber is provided with four or six vacuum chambers or the like, and the outlet differential pressure chamber is provided with five or six vacuum chambers or the like.

It will be apparent to one of ordinary skill in the art that all or some of the steps of the methods, systems, program modules or units in the apparatus disclosed above may be implemented as software, firmware, hardware, or suitable combinations thereof. In a hardware implementation, the division between functional modules or units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation. Some or all of the components may be implemented as software executed by a processor, such as a digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.

In addition, the technical solutions described in the embodiments of the present invention may be arbitrarily combined without conflict.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.

Claims

1. A vacuum coating apparatus, characterized in that the apparatus comprises: an inlet differential pressure chamber, a coating chamber and an outlet differential pressure chamber; wherein,

the coating chamber is provided with a coating device;

2. The apparatus of claim 1, wherein the coating chamber is provided with at least two first members for receiving a target.

3. The apparatus of claim 2, wherein a first distance is provided between two adjacent first members such that a radiation range corresponding to the target on one of the two adjacent first members overlaps with a radiation range corresponding to the target on the other of the two adjacent first members.

4. The apparatus of claim 1, wherein each vacuum line of the inlet differential pressure chamber further comprises a cleaning vacuum chamber for plasma cleaning the substrate; the vacuum degree of the cleaning vacuum chamber is smaller than that of a vacuum transition chamber connected with the inlet of the coating chamber.

5. The apparatus of claim 1, wherein a second member is disposed between adjacent vacuum transition chambers of each vacuum line; the second component is arranged to realize vacuum isolation between the adjacent vacuum transition chambers when the substrate is transferred to the corresponding vacuum transition chamber; and when the substrate is transferred to a next adjacent vacuum transition chamber, a second member disposed between the next adjacent vacuum transition chamber is opened.

6. The apparatus of claim 5, wherein the second component is disposed between a vacuum transition chamber connected to the inlet of the coating chamber and the coating chamber; and the second component is arranged between the vacuum transition chamber connected with the outlet of the coating chamber and the coating chamber.

7. The apparatus of claim 1 wherein the transfer means in the differential inlet chamber, the coating chamber and the differential outlet chamber are independently provided.

8. The apparatus of claim 7, wherein one transfer device is provided for each vacuum line of the inlet differential pressure chamber; and each vacuum line of the outlet differential pressure chamber is correspondingly provided with a transmission device.

9. The apparatus of claim 7, wherein one transport device is provided for each vacuum chamber.

10. A vacuum coating method, characterized in that the method comprises:

11. The method of claim 10, wherein selecting one of the at least two vacuum lines of the differential pressure chamber at the inlet of the vacuum coating apparatus comprises:

determining at least one vacuum line that is not in a vacuum buffer state;

12. The method of claim 10, wherein sequentially transferring the substrate to each stage of vacuum transition chamber of the selected vacuum line, and evacuating to reach a predetermined vacuum level corresponding to each vacuum transition chamber comprises:

13. The method of claim 12, further comprising:

14. The method of claim 10, wherein selecting one of the at least two vacuum lines of the differential outlet pressure chamber of the vacuum coating apparatus comprises:

determining at least one vacuum line that is not in a vacuum buffer state;

15. The method of claim 10, wherein sequentially transferring the substrate deposited with the film layer to each stage of vacuum transition chamber of a selected vacuum line, and vacuumizing to reach a predetermined vacuum degree corresponding to each vacuum transition chamber, comprises:

16. The method of claim 15, further comprising:

17. The method of claim 10, wherein depositing a film on the substrate using the coating apparatus of the coating chamber comprises:

18. The method of claim 10, wherein the substrates are sequentially transferred to the vacuum transition chambers of the selected vacuum line, and when the vacuum is pumped to reach the predetermined vacuum degree corresponding to each vacuum transition chamber, the method further comprises:

19. A method for preparing a filter cavity film layer, which is characterized in that the filter cavity film layer prepared by the vacuum coating equipment of any one of claims 1 to 8 is adopted.

20. The method of claim 19, wherein preparing the target material for the filter cavity film layer comprises: cr target, Cu target, Ag target; and when the film layer is deposited, a Cr layer, a Cu layer and an Ag layer are sequentially deposited on the filter cavity.

21. The method of claim 19, wherein preparing the target material for the filter cavity film layer comprises: cr target, Cu target, Ag-Ta target; and when the film layer is deposited, a Cr layer, a Cu layer and an Ag-Ta layer are sequentially deposited on the filter cavity.

22. The method of claim 21, further comprising:

uniformly embedding a block Ta material on an Ag plate;

23. The method of claim 22, wherein the surface area ratio of Ag to Ta in the Ag-Ta target is 1:1 to 10: 1.

24. The method of claim 21, wherein the Ag-Ta layer is deposited with a relative atomic ratio of Ag to Ta of 4:1 to 50: 1.