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CN110819018B - Preparation method of high-thermal-conductivity filler for thermal-conductivity polymer material - Google Patents

Preparation method of high-thermal-conductivity filler for thermal-conductivity polymer material Download PDF

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CN110819018B
CN110819018B CN201910958319.8A CN201910958319A CN110819018B CN 110819018 B CN110819018 B CN 110819018B CN 201910958319 A CN201910958319 A CN 201910958319A CN 110819018 B CN110819018 B CN 110819018B
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boron nitride
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graphene
spherical boron
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CN110819018A (en
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赵方伟
王纲
马洁
任仰省
李响
冯继凡
程路路
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Graphene Polymer Composites R&d Center Shandong Lutai Holding Group Co ltd
Shandong Lutai Holding Group Co Ltd
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Abstract

A preparation method of a high thermal conductive filler for a thermal conductive polymer material comprises the following steps: dispersing spherical boron nitride into a polar solvent, and adding a coupling agent for modification to obtain modified spherical boron nitride; dispersing and mixing the nano carbon material and a polar solvent to obtain a dispersion liquid; ultrasonically dispersing the modified boron nitride into the dispersion liquid, and ultrasonically treating; carrying out hydrothermal reduction on the prepared material, and then freeze-drying to obtain filling particles of a carbon nano material-modified spherical boron nitride core-shell structure; the prepared filled particles and the heat-conducting filler are filled into a polymer. The preparation method of the high-thermal-conductivity filler disclosed by the invention solves the problem that the graphene with high addition amount can be agglomerated during preparation of a composite material, and improves the thermal conductivity. The method solves the problems that due to the high addition amount of graphene, the material has poor fluidity when in use and is difficult to process due to agglomeration. The preparation method is simple; the types and the dosage of the adopted solvents are less, and the pollution to the matrix is less; the prepared high-heat-conductivity filler has wide application range and good effect.

Description

Preparation method of high-thermal-conductivity filler for thermal-conductivity polymer material
Technical Field
The invention relates to the field of composite polymer heat conduction materials, in particular to a high-heat-conduction filler containing high-addition-amount graphene, which is used for a heat conduction polymer material.
Background
The thermal conductivity of the polymer matrix itself is currently generally very low (about 0.2 W.m.) -1 ·K -1 ) If a higher thermal conductivity (1 to 5 W.m.) is to be achieved -1 ·K -1 ) Usually, 50-80 vol% of conventional heat conductive filler needs to be filled. The high filler addition amount can lead to the fact that the modified composite high polymer material is heavy in weight, the excellent mechanical property of the polymer is reduced, and meanwhile, the processing difficulty is increased, so that the practical application of the current heat-conducting polymer material is limited.
For the heat-conducting composite high polymer material, the formation of the heat-conducting network can greatly reduce the interface thermal resistance and improve the heat conductivity of the composite material. Graphene not only has extremely high thermal conductivity (as high as 5300 W.m) -1 ·K -1 ) In addition, compared with traditional heat conducting fillers such as metal fillers, inorganic fillers and carbon materials, other properties such as mechanical properties of graphene are also very excellent. It is therefore a promising thermally conductive filler. However, the effect of forming the thermally conductive network merely by increasing the content of the thermally conductive filler is not obvious. Although the graphene has high thermal conductivity, the graphene serving as a nano material is easy to agglomerate under the condition of high content, so that the thermal conductivity of the graphene is influenced; on the other hand, the total addition amount is small (the addition amount is generally about 1-3 vol%), an effective heat conducting network structure cannot be constructed, and the addition amount of the graphene exceeding 1vol% can cause agglomeration phenomenon, and the graphene exceeding 3vol% can cause serious agglomeration. And too much graphene can quickly increase the viscosity of the system, increase the preparation difficulty and easily generate bubbles. Thus how to prepare a high content but without the tendency to agglomerate,the graphene composite heat conduction material with good dispersion effect is a difficult point of current research.
Disclosure of Invention
The invention aims to solve the problems and provides a preparation method of a high-thermal-conductivity filler for a thermal-conductivity polymer material. The high-thermal-conductivity filler solves the problems of overhigh filler addition amount, poor overall fluidity and difficult later-stage processing in the traditional preparation method of the thermal conductive material, and also solves the problems that the graphene addition amount of the graphene thermal conductive material in the preparation process cannot be too high, and the graphene thermal conductive material can not be agglomerated and cannot give full play to the advantages of the graphene. The filler can contain high-content graphene (the maximum addition amount can reach 40 wt%), and the heat-conducting property of the matrix material can be greatly improved. In addition, micron-sized spherical boron nitride is innovatively used in the invention and is combined with graphene under pi-pi acting force, so that the prepared filler has larger specific surface area compared with a lamellar material. The utilization rate is improved, the theory of the heat conducting network is better met, and the heat conducting performance is further broken through.
The preparation method of the high-thermal-conductivity filler for the thermal-conductive polymer material comprises the following components in parts by mass:
nano-carbon material: 2.5 to 20;
spherical boron nitride: 9- -45
Polar solvent (amount of spherical boron nitride used is 1): 10-50;
coupling agent (based on the amount of spherical boron nitride used as 1): 0.05 to 0.5;
heat-conducting filler: 1 to 5;
base material: 100.
the invention relates to a preparation method of a high-thermal-conductivity filler for a thermal-conductivity polymer material, which comprises the following preparation steps:
s1, modification of spherical boron nitride: dispersing spherical boron nitride into a polar solvent, and adding a coupling agent for modification to obtain modified spherical boron nitride;
s2, dispersing and mixing the nano carbon material and a polar solvent to obtain a dispersion liquid;
s3, ultrasonically dispersing the modified boron nitride obtained after modification of the S1 into the dispersion liquid prepared in the S2, and ultrasonically treating for 5-30 minutes;
s4, carrying out hydrothermal reduction on the material prepared in the step S3, and then carrying out freeze drying for 24-48 hours to obtain filling particles of a carbon nano material-modified spherical boron nitride core-shell structure;
and S5, filling the filling particles prepared in the step S4 and the heat-conducting filler into a corresponding polymer matrix according to a certain proportion.
Further, the carbon nanomaterial is at least one selected from graphene, graphene oxide, and a graphene derivative, and is preferably graphene.
Furthermore, the particle size of the spherical boron nitride is between 1 and 20 mu m.
Further, the polar solvent is selected from at least one of ethanol, toluene, acetone and isopropanol, and preferably ethanol.
Furthermore, the ethanol concentration is between 0.5 and 5 mol/L.
Further, the coupling agent is at least one selected from a titanic acid coupling agent and a silane coupling agent.
Further, the heat conducting filler is selected from at least one of alumina, magnesia, zinc oxide, aluminum nitride and silicon carbide.
Further, the matrix material is selected from at least one of Polystyrene (PS) and polypropylene (PP).
In order to better illustrate the technical problems to be solved and the technical means adopted by the invention, the prior technical scheme and the defects thereof are provided as follows:
1. an intercalation assembly boron nitride-graphene composite material, application and a preparation method thereof are disclosed in Chinese patent (CN 201610310346.0). In the disclosure, graphene sheets and a hexagonal boron nitride film layer intercalated between the graphene layers, the hexagonal boron nitride film layer connects the graphene sheets between graphene interatomic layers to form an intercalation structure of graphene/boron nitride in a sandwich form.
However, the boron nitride used in the method is a sheet layer, namely, a 2D structure, and it is known that when graphene exists in a sheet layer structure, stacking and agglomeration are very easy to occur. Further, it is clearly proposed in a document (anfei. Construction of three-dimensional graphene thermal conductive network and study of its thermal conductive composite [ D ]. 2018) published thereafter: the graphene with lower content can not be in complete contact, and the sheets can be separated by the low-heat-conduction matrix and are diffused, so that phonon scattering and interface thermal resistance are increased. When the content is higher, the contact between the graphene sheet layers is increased to form a heat conducting network, so that heat conduction is facilitated.
In addition, the invention adopts a liquid phase stripping technology for preparing the lamellar boron nitride, uses a large amount of solvent, has complex process and has no specific parameter description on the heat-conducting property.
2. Chinese patent (CN 201410220107.7) discloses a water-based heat-dissipation coating and a preparation method thereof. According to the invention, nano carbon material coated boron nitride composite powder is added into aqueous dispersion of matrix resin as a coating filler. But the boron nitride and the nano-carbon material coated on the outer layer are dispersed in aqueous dispersion, the application field of the dispersion medium is determined, so the boron nitride and the nano-carbon material can only be used as paint, and the carbon nano-material is at most 10wt%, and the thermal conductivity is 1.54 W.m -1 ·K -1 The heat conduction effect is not significant.
The high-thermal-conductivity filler prepared by the preparation method disclosed by the invention has the following characteristics:
1. solves the problem that the graphene with high addition amount can be agglomerated during the preparation of the composite material, and further improves the thermal conductivity (5 W.m) -1 ·K -1 ). On one hand, graphene and spherical boron nitride are combined in the form of hydrogen bonds and/or pi-pi bonds, and the thin graphene is adsorbed on the outer surface of the boron nitride, so that the dispersed graphene materials are separated in the form of the spherical boron nitride, and the phenomenon of graphene agglomeration is reduced. On the other hand, the synergistic effect between the monolithic layer graphene and the boron nitride can promote the formation of a more effective interconnection structure and a heat conduction network, and the heat conduction effect is better achieved. And through the secondary matching with the heat-conducting filler, the coating can be formed again on the outer side of the graphene in a hydrogen bond mode to form the heat-conducting filler-graphene-modified spherical nitrogen from outside to insideThe three-layer coating structure of boron is adopted, so that the dispersion of graphene is more uniform, and meanwhile, the heat conduction efficiency is correspondingly improved under the action of the outer-layer heat conduction filler.
2. The method solves the problems that due to the high addition amount of graphene, the material has poor fluidity when in use and is difficult to process due to agglomeration. The prepared graphene/boron nitride filler is spherical, and the particle fluidity is good in the plasticizing stage in the matrix. The high filling and high utilization of graphene can be realized, and the problem that the graphene is agglomerated when the addition amount of the graphene is 2wt% in general research is solved.
3. The high-thermal-conductivity filler has wide application range, and can be randomly blended with high-molecular substrates such as plastics, rubber and the like on one hand because of being in solid particles; on the other hand, the modified polyvinyl alcohol can be dispersed in various polar solvents, the preparation is not limited to coating and the like solutions. The polymer heat conduction material provided by the invention can be applied to the fields of electric heating devices, aerospace, communication electronics and the like.
Detailed Description
The present invention will be further described with reference to specific embodiments. Meanwhile, it is to be understood that, in order to ensure the comparability of the embodiments and the influence of the variable factors reduced as much as possible on the experimental results in the experimental process, especially, the influence of different thermally conductive fillers and polymer matrix materials on the experimental results in the present invention is relatively large, so some limitations need to be made (it is clear that the limitations made in the following embodiments do not affect the technical content disclosed in the present invention, do not limit the technical scope of the present invention, and the highly thermally conductive fillers disclosed in the present invention also have universality in other polymer matrices based on the universality of the polymer materials). In the following examples and comparative examples, ethanol was used as the polar solvent, aluminum nitride was used as the thermally conductive filler, and polystyrene was used as the matrix material.
Example 1:
dispersing 10g of spherical boron nitride into 40g of ethanol, and adding 5g of silane coupling agent to modify the spherical boron nitride to obtain the modified spherical boron nitride. 2.5g of graphene and 60g of ethanol were dispersed and mixed to obtain a dispersion. And (3) ultrasonically dispersing the prepared modified boron nitride into the dispersion liquid in the step to obtain a mixed material, and ultrasonically treating for 30 minutes. And carrying out hydrothermal reduction on the prepared mixed material, and then carrying out freeze drying for 48 hours to obtain the filling particles with the graphene-modified spherical boron nitride core-shell structure. The above-mentioned filler particles were thoroughly mixed with 3g of aluminum nitride to obtain a filler, and then the filler was polymer-processed to be filled into 100g of Polystyrene (PS).
Example 2
Dispersing 30g of spherical boron nitride into 70g of ethanol, and adding 1.5 g of silane titanate coupling agent to modify the spherical boron nitride to obtain the modified spherical boron nitride. 2.5g of graphene and 80g of ethanol were dispersed and mixed to obtain a dispersion. And (3) ultrasonically dispersing the prepared modified boron nitride into the dispersion liquid in the step to obtain a mixed material, and ultrasonically treating for 30 minutes. And carrying out hydrothermal reduction on the prepared mixed material, and then carrying out freeze drying for 48 hours to obtain the filling particles with the graphene-modified spherical boron nitride core-shell structure. The above filler particles were thoroughly mixed with 1g of aluminum nitride to obtain a filler, and then the filler was polymer-processed to be filled into 100g of Polystyrene (PS).
Example 3
50g of spherical boron nitride is dispersed into 400g of ethanol, and 20g of silane titanate coupling agent is added to modify the spherical boron nitride to obtain the modified spherical boron nitride. 2.5g of graphene and 500g of ethanol were dispersed and mixed to obtain a dispersion. And (3) ultrasonically dispersing the prepared modified boron nitride into the dispersion liquid in the step to obtain a mixed material, and ultrasonically treating for 30 minutes. And carrying out hydrothermal reduction on the prepared mixed material, and then carrying out freeze drying for 48 hours to obtain the filling particles with the graphene-modified spherical boron nitride core-shell structure. The above-mentioned filler particles were thoroughly mixed with 3g of aluminum nitride to obtain a filler, and then the filler was polymer-processed to be filled into 100g of Polystyrene (PS).
Example 4
Dispersing 10g of spherical boron nitride into 200g of ethanol, and adding 3g of titanic acid coupling agent to modify the spherical boron nitride to obtain the modified spherical boron nitride. 10g of graphene and 300g of ethanol were dispersed and mixed to obtain a dispersion. And ultrasonically dispersing the prepared modified boron nitride into the dispersion liquid in the step to obtain a mixed material, and ultrasonically treating for 30 minutes. And carrying out hydrothermal reduction on the prepared mixed material, and then carrying out freeze drying for 48 hours to obtain the filling particles with the graphene-modified spherical boron nitride core-shell structure. The above filler particles were thoroughly mixed with 3g of aluminum nitride to obtain a filler, which was then polymer-processed to fill 100g of Polystyrene (PS).
Example 5
Dispersing 20g of spherical boron nitride into 500g of ethanol, and adding 2 g of silane titanate coupling agent to modify the spherical boron nitride to obtain the modified spherical boron nitride. 10g of graphene and 500g of ethanol were dispersed and mixed to obtain a dispersion. And (3) ultrasonically dispersing the prepared modified boron nitride into the dispersion liquid in the step to obtain a mixed material, and ultrasonically treating for 30 minutes. And carrying out hydrothermal reduction on the prepared mixed material, and then carrying out freeze drying for 48 hours to obtain the filling particles with the graphene-modified spherical boron nitride core-shell structure. The above filler particles were thoroughly mixed with 5g of aluminum nitride to obtain a filler, which was then polymer-processed to fill 100g of Polystyrene (PS).
Example 6
50g of spherical boron nitride is dispersed into 500g of ethanol, and 25 g of titanic acid coupling agent is added to modify the spherical boron nitride to obtain the modified spherical boron nitride. 10g of graphene and 500g of ethanol were dispersed and mixed to obtain a dispersion. And (3) ultrasonically dispersing the prepared modified boron nitride into the dispersion liquid in the step to obtain a mixed material, and ultrasonically treating for 30 minutes. And carrying out hydrothermal reduction on the prepared mixed material, and then carrying out freeze drying for 48 hours to obtain the filling particles with the graphene-modified spherical boron nitride core-shell structure. The above-mentioned filler particles were thoroughly mixed with 5g of aluminum nitride to obtain a filler, and then the filler was polymer-processed to be filled into 100g of Polystyrene (PS).
Comparative example 1
The same polymer processing operation as in the other examples was carried out only on 100g of Polystyrene (PS) without adding any of the other materials of the examples.
Comparative example 2
The same polymer processing operation as the other examples was adopted, and only 5g of graphene was filled into 100g of Polystyrene (PS).
Comparative example 3
The same polymer processing operation as in the other examples was carried out, and only 30g of spherical boron nitride was filled into 100g of Polystyrene (PS).
For the above examples 1 to 6 and comparative examples 1 to 3, the performance test of the materials was carried out according to the following criteria, the results of which are shown in Table 1:
(1) The tensile properties of the material perform the test criteria: GBT 1040.3-2006;
(2) Material thermal conductivity implementation test criteria: ASTM D5470.
Table form
Figure 168255DEST_PATH_IMAGE001
Figure 350975DEST_PATH_IMAGE003
As can be seen from the data in Table 1, the polystyrene has a thermal conductivity of 0.1 W.m without any addition of any thermal conductive material (as shown in comparative example 1) -1 ·K -1 The heat conduction effect is the worst in each group of data. After the heat-conducting filler prepared from graphene and spherical boron nitride is added, the heat-conducting effect is greatly improved, wherein the effect of the heat-conducting material obtained in the embodiment 6 is most obvious, and the heat conductivity of the filled polystyrene reaches 6.7 W.m -1 ·K -1 The heat conductivity is improved by fifty times. Moreover, in example 6, in which the amount added was large, the polymeric material still had good tensile properties to withstand 32 MPa. Therefore, the high-thermal-conductivity filler prepared by the preparation method of the high-thermal-conductivity filler disclosed by the invention has a good thermal conductivity effect on the base material, and simultaneously maintains good mechanical properties of the base material.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
The invention has the advantages that: the problem that the graphene is agglomerated when the composite material is prepared due to high addition amount of the graphene is solved, and the thermal conductivity is further improved. The method solves the problems that due to the high addition amount of graphene, the material has poor fluidity when in use and is difficult to process due to agglomeration. The preparation method is simple; the types and the dosage of the adopted solvents are less, and the pollution to the matrix material is less; the prepared high-heat-conductivity filler has wide application range and good effect.

Claims (7)

1. The preparation method of the high-thermal-conductivity filler for the thermal-conductive polymer material is characterized by comprising the following components in parts by mass:
nano-carbon material: 2.5 to 20;
spherical boron nitride: 9 to 45;
taking the dosage of spherical boron nitride as 1: 10-50;
taking the dosage of spherical boron nitride as 1, the coupling agent: 0.05 to 0.5;
heat conductive filler: 1 to 5;
base material: 100, respectively;
the preparation method comprises the following preparation steps:
s1, modification of spherical boron nitride: dispersing spherical boron nitride into a polar solvent, and adding a coupling agent for modification to obtain modified spherical boron nitride;
s2, dispersing and mixing the nano carbon material and a polar solvent to obtain a dispersion liquid;
s3, ultrasonically dispersing the modified boron nitride obtained after modification of the S1 into the dispersion liquid prepared in the S2, and ultrasonically treating for 5-30 minutes;
s4, carrying out hydrothermal reduction on the material prepared in the step S3, and then carrying out freeze drying for 24-48 hours to obtain filling particles of the carbon nano material-modified spherical boron nitride core-shell structure;
s5, filling the filling particles prepared in the step S4 and the heat-conducting filler into a corresponding polymer matrix according to a certain proportion;
the carbon nano material is selected from at least one of graphene and graphene oxide.
2. The method of claim 1, wherein the spherical boron nitride particles have a size of 1 μm to 20 μm.
3. The method for preparing a high thermal conductive filler for thermal conductive polymer material according to claim 1, wherein the polar solvent is at least one selected from ethanol, toluene, acetone, and isopropanol.
4. The method of claim 3, wherein the concentration of ethanol is 0.5-5 mol/L.
5. The method of claim 1, wherein the coupling agent is at least one selected from a group consisting of a titanic acid coupling agent and a silane coupling agent.
6. The method of claim 1, wherein the thermally conductive filler is at least one selected from the group consisting of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, and silicon carbide.
7. The method for preparing a high thermal conductive filler for thermal conductive polymer material according to claim 1, wherein said matrix material is at least one selected from polystyrene and polypropylene.
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