CN110814222A

CN110814222A - High-speed pin cutting die for LED lead frame

Info

Publication number: CN110814222A
Application number: CN201911139882.9A
Authority: CN
Inventors: 林木荣; 陈方; 郑子钦; 熊林权; 罗广鸿; 石红丽
Original assignee: Zhongshan Mls Electronics Co Ltd
Current assignee: Ji'an MuLinSen Precision Technology Co.,Ltd.
Priority date: 2019-11-20
Filing date: 2019-11-20
Publication date: 2020-02-21
Anticipated expiration: 2039-11-20
Also published as: CN110814222B

Abstract

The application discloses a high-speed pin cutting die for an LED lead frame, which comprises an upper die set and a lower die set, wherein the upper die set is provided with a first punch group and a second punch group, the first punch group comprises at least one first punch group, the second punch group comprises at least one second punch group, the first punch group and the second punch group are arranged in a staggered mode along the longitudinal direction of the upper die set, and punching ends of the first punch group and the second punch group extend out of the lower side face of the upper die set; the lower die set is provided with a first blanking groove set which can be matched with the first punch set and a second blanking groove set which can be matched with the second punch set. The aluminum wire frame can effectively solve a series of quality problems of aluminum powder, aluminum scraps, flying flocs, adhesive edges, burrs and the like which are easy to generate when the LED aluminum wire frame is used for pin cutting production, so that the LED aluminum wire frame has the same quality guarantee of the copper wire frame, the innovation and the development of an LED technology are further improved, and the use requirement with higher requirements is met.

Description

High-speed pin cutting die for LED lead frame

[ technical field ] A method for producing a semiconductor device

The application relates to the technical field of LEDs, in particular to a high-speed pin cutting die for an LED lead frame.

[ background of the invention ]

Throughout the development process of LED lighting technology, from the first discovery of electroluminescence of semiconductor material silicon carbide by human beings in 1907, the LED has been developed for hundreds of years to date, and compared with the traditional incandescent lamp and fluorescent lamp lighting device, the LED has been paid attention to its superiority such as energy saving, environmental protection, and long life (the energy saving of LED is up to 90% compared with that of incandescent lamp, and 50% compared with that of fluorescent lamp), all countries in the world strive to develop a development plan of LED suitable for its own development status, and china starts relatively late but comes later, and the current production and technical innovation capability of LED in the world has mainly focused on mainland and taiwan, japan, korea, and the like.

Attracted by the high-speed development trend of the industries in the previous years, a large number of manufacturers are added into the industries to carry out marketing competition for market shares, in recent years, the whole scale of the industries enters the universal release period after continuous high-level development of annual growth rate of more than 30%, the industries start shuffling, the competition is intensified day by day, the enterprises start to accelerate the excellence and decline, and a large number of small enterprises lacking technical advantages and accumulated experiences are gradually eliminated.

The LED hardware lead frame is used as a core carrier and a conductive heat radiating part of the LED lamp bead, is an LED main part, has larger cost, and is a main direction for research, development and breakthrough. In recent years, the technical development of the lead frame is rapidly advanced, the specification development of the lead frame is smaller and smaller, the arrangement is more and more compact, the sheet width is larger and larger, the material thickness is thinner and thinner, various manufacturers compete for simulation, the price of the lamp bead is continuously detected, and the material selection aspect is basically not broken through; the LED hardware lead frame technology is developed to the present, the materials of the LED hardware lead frame are red copper, brass and iron, the market metal strip is researched once, and a fourth material with higher cost performance is difficult to find.

Research shows that the copper-aluminum lead frame has the same copper-aluminum lead frame in two kinds of materials, and the copper-aluminum lead frame has the same copper-aluminum lead frame in the same copper material and the same copper material; this means that the aluminum lead frame has better performance than a copper lead frame, and lower cost than an iron lead frame (although the aluminum material has higher unit price than the iron material, but has a lot of lighter specific gravity, and the number of the produced lead frames is several times greater than that of the iron material for the aluminum material with the same weight), so the LED aluminum lead frame has great significance to the industry, but the development difficulty is also very high, but the stamping production quality is very unstable, and due to the material particularity of the aluminum material, the problems of crumbs, flying flocs, sticky edges, burrs and the like are particularly easily generated during the pin cutting stamping production, and the quality requirement of the LED lead frame is very high, and the oil can not be supplied during the pin cutting and punching process, which establishes a barrier for the pin cutting mold design and production of the LED aluminum lead frame, and therefore, the technical personnel in the field need to develop a high-speed pin cutting mold for the LED lead frame to meet the.

[ summary of the invention ]

The above-mentioned prior art problem that this application will be solved and be directed against provides a high-speed pin mould of cutting of LED lead frame.

In order to solve the technical problem, the method is realized by the following technical scheme:

the LED lead frame high-speed pin cutting die comprises an upper die set and a lower die set matched with the upper die set, wherein the upper die set is provided with a first punch group and a second punch group positioned on one side of the first punch group, the first punch group comprises at least one group of first punch group, the second punch group comprises at least one group of second punch group, the first punch group and the second punch group are arranged in a staggered mode along the longitudinal direction of the upper die set, and punching ends of the first punch group and the second punch group extend out of the lower side surface of the upper die set;

the lower module is provided with a first blanking groove group which can be matched with the first punch group and is used for punching pins of the LED lead frame for the first time, and a second blanking groove group which can be matched with the second punch group and is used for punching the pins of the LED lead frame for the second time.

According to the high-speed pin cutting die for the LED lead frame, the first punch set and the second punch set are the same in shape.

According to the high-speed pin cutting die for the LED lead frame, the first punch group comprises a first left punch, a first right punch arranged on the right side of the first left punch, and a first middle punch arranged between the first left punch and the first right punch;

the first blanking groove group comprises a first left side blanking groove matched with the first left side punch, a first right side blanking groove arranged on the right side of the first left side blanking groove and matched with the first right side punch, and a first middle blanking groove arranged between the first left side blanking groove and the first right side blanking groove and matched with the first middle punch.

According to the high-speed pin cutting die for the LED lead frame, the first left side punch and the first right side punch are arranged in a bilateral symmetry mode.

According to the high-speed pin cutting die for the LED lead frame, the inner side wall of the first left-side blanking groove is provided with the blanking groove abdicating concave position used for abdicating the first left-side punch so as to reduce friction.

The high-speed pin cutting die for the LED lead frame comprises an upper discharging plate, a notch is penetrated through the first left side, the first right side and the first right side are penetrated through the first right side and the first left side is penetrated through the notch right side, the notch is penetrated through the first left side, the first left side is penetrated through the notch, the first right side is penetrated through the notch, the first middle part is penetrated through the notch, the inner side wall of the notch is penetrated through the first left side, the notch is arranged in a yielding mode, and the first left side is penetrated through the notch yielding concave position of the first left side punch for reducing friction.

The high-speed pin cutting die for the LED lead frame is characterized in that the upper die set further comprises a cleaning and cooling air path system which is arranged on the upper stripper plate, can be externally connected with a compressed air source and can respectively diffuse towards the first left through notch, the first middle through notch and the first right through notch to be used for respectively cleaning and cooling the first left punch, the first right punch and the first right punch.

The high-speed pin cutting die for the LED lead frame is characterized in that the upper die set further comprises a material belt misdelivery detection device which is arranged on the upper stripper plate and used for detecting whether the material belt of the LED lead frame is misdelivered or not.

As above high-speed pin mould of cutting of LED lead frame, the die-cut end of first punching sub-group stretches out go up the distance of module downside with the die-cut end of second punching sub-group stretches out the distance of last module downside is 0.15 ~ 0.5 mm.

According to the high-speed pin cutting die for the LED lead frame, the number of the first punching groups is 1 group, or 2 groups, or 3 groups.

Compared with the prior art, the application has the following advantages:

the high-speed pin cutting die for the LED lead frame is characterized in that the punched LED lead frame is the LED aluminum lead frame, then the first punch group and the first blanking groove group are matched to firstly punch the LED aluminum lead frame for the first time, then the second punch group and the second blanking groove group are matched to punch the LED aluminum lead frame for the second time, and the first punch group and the second punch group are staggered along the longitudinal direction of the upper die set, so that the first punch pin work and the second punch pin work are staggered and complemented to complete the pin punching work of the whole LED aluminum lead frame, thereby effectively reducing the single punching strength of the high-speed pin cutting die for the LED aluminum lead frame, avoiding the aluminum powder and the aluminum scraps from being piled and being incapable of being completely removed in a short time, and in addition, designing the purpose that the punching ends of the first punch group and the second punch group all stretch out the upper side face module is to realize the material stripping effect, the probability that the punch completely submerges and carries aluminum powder and aluminum scraps can be reduced, and then a series of quality problems such as aluminum powder, aluminum scraps, flying wadding, adhesive edges, burrs and the like which are easy to generate when the LED aluminum lead frame is used for pin cutting production can be effectively solved through the method, so that the LED aluminum lead frame has the same quality guarantee of the copper lead frame, the innovation and the development of an LED technology can be further improved, and the use requirement with higher requirements can be met.

[ description of the drawings ]

Fig. 1 is a schematic cross-sectional view of a high-speed lead cutting die for an LED leadframe according to the present application.

Fig. 2 is a schematic view illustrating the first punch set disposed on the upper die set in the high-speed lead cutting die for an LED leadframe according to the present application.

Fig. 3 is a partial enlarged view i of fig. 2.

Fig. 4 is a schematic diagram of the high-speed pin cutting die for the LED lead frame, in which the upper die set hides the upper spreader plate, the clean cooling air path system and the material belt misfeed detection device.

Fig. 5 is a partial enlarged view ii of fig. 4.

Fig. 6 is a partially enlarged view iii of fig. 4.

Fig. 7 is a schematic diagram of the upper material-releasing plate, the clean cooling air path system and the material belt misfeed detection device in the high-speed pin cutting die for the LED lead frame according to the present application.

Fig. 8 is a partial enlarged view iv of fig. 7.

Fig. 9 is a schematic view of the first left-side through notch of the high-speed lead cutting mold for an LED leadframe according to the present application.

Fig. 10 is a schematic view of the LED leadframe high speed lead cutting mold according to the present invention after a portion of the lower mold is hidden.

Fig. 11 is a partial enlarged view v of fig. 10.

Fig. 12 is a schematic view of the first left-side material receiving groove in the high-speed lead cutting mold for an LED leadframe according to the present application.

Fig. 13 is a schematic view of a LED leadframe strip diagram a-1 processed by the high speed lead cutting die of the LED leadframe of the present application.

Fig. 14 is a schematic view of an LED leadframe strip diagram a-2 processed by the high speed lead cutting die of the LED leadframe of the present application, immediately following the LED leadframe strip diagram a-1.

Fig. 15 is a schematic view of an LED leadframe strip diagram a-3 processed by the high speed lead cutting die of the LED leadframe of the present application, immediately following the LED leadframe strip diagram a-2.

[ detailed description ] embodiments

The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.

As shown in fig. 1 to 15, the high-speed pin cutting mold for an LED leadframe includes an upper mold 1 and a lower mold 2 adapted to the upper mold 1.

Specifically, the upper die set 1 is provided with a first punch group 11 and a second punch group 12 located on one side of the first punch group 11, the first punch group 11 includes at least one first punch group 111, the second punch group 12 includes at least one second punch group 121, the first punch group 111 and the second punch group 121 are arranged in a staggered manner along the longitudinal direction of the upper die set 1, and the punching ends of the first punch group 111 and the second punch group 121 extend out of the lower side surface of the upper die set 1;

the lower module 2 is provided with a first blanking slot group 21 adapted to the first punch group 111 for punching LED leadframe pins for the first time, and a second blanking slot group 22 adapted to the second punch group 121 for punching LED leadframe pins for the second time.

This application LED lead frame die-cut LED lead frame of high-speed pin mould of LED lead frame is LED aluminum product lead frame, then works as through first punching group 111 with first blanking groove group 21 cooperation is in order to carry out the work of punching pin for the first time to LED aluminum product lead frame, then by second punching group 121 with the cooperation of second blanking groove group 22 is in order to carry out the work of punching pin for the second time to LED aluminum product lead frame, and because first punching group 111 with second punching group 121 is followed go up the setting of staggering of 1 vertical direction of module for the first punching pin work and the work of punching pin of second time stagger complemental in order to accomplish the punching work of the pin of whole LED aluminum product lead frame, thereby can effectively reduce the single punching strength of this application, also can avoid aluminite powder, aluminium bits to prick to appear and can't clear away totally in the short time, in addition, design first punching group 111 with the punching end of second punching group 121 all stretches out go up the purpose of 1 downside of module lies in realizing going up The aluminum lead frame has the advantages that the stripping effect can be achieved, the probability that the punch completely submerges and carries aluminum powder and aluminum scraps can be reduced, a series of quality problems of aluminum powder, aluminum scraps, flying flocs, adhesive edges, burrs and the like which are easy to generate in pin cutting production of the LED aluminum lead frame can be effectively solved through the aluminum lead frame, the LED aluminum lead frame has the same quality guarantee of a copper lead frame, innovation and development of an LED technology can be further improved, and the use requirement with higher requirements can be met.

Furthermore, the number of the first punch group 11 and the second punch group 12 is 1 group, 2 groups, or 3 groups, which has the advantages that the number of the punch groups can be arranged according to the actual production requirement, so as to achieve the purpose of flexible arrangement, and certainly, when the supply of the punches is in short supply, the number of the punch groups can be adjusted at any time, so as to meet the production requirement to the maximum extent.

Furthermore, the distance that the punching end of the first punching group 111 extends out of the lower side surface of the upper module 1 and the distance that the punching end of the second punching group 121 extends out of the lower side surface of the upper module 1 are both 0.15-0.5 mm, preferably 0.2 mm. The advantages that the material removing effect can be achieved, and the probability that the punch is completely submerged and carries in the powder can be reduced; of course, the design needs to strictly control the up-and-down moving range of the punch hanging table within 0.05mm, and the total length of the punch needs to be strictly kept unchanged during the die maintenance and padding, so that the use requirement of not bringing aluminum powder and aluminum scraps can be ensured to the maximum extent.

Further, the first punch set 111 and the second punch set 121 have the same shape.

Further, the first punch set 111 includes a first left punch 1111 and a first right punch 1113 disposed at the right side of the first left punch 1111, and a first middle punch 1112 disposed between the first left punch 1111 and the first right punch 1113;

the first blanking groove group 21 comprises a first left blanking groove 211 matched with the first left punch 1111, a first right blanking groove 213 arranged at the right side of the first left blanking groove 211 and matched with the first right punch 1113, and a first middle blanking groove 212 arranged between the first left blanking groove 211 and the first right blanking groove 213 and matched with the first middle punch 1112. Its advantage lies in satisfying die-cut blanking demand.

Further, the first left punch 1111 and the first right punch 1113 are symmetrically disposed.

Further, the inner side wall of the first left-side chute 211 is provided with a chute relief notch 2111 for relieving the first left-side punch 1111 to reduce friction. The advantage is reduced friction.

Further, the upper die set 1 includes the material releasing plate 101, set up on the material releasing plate 101 by the first left side that first left side punching sub 1111 runs through notch 1011, set up in first left side runs through the notch 1011 right side and by the first right side punching sub 1113 runs through notch 1013, and set up in first left side runs through notch 1011 with first right side runs through between notch 1013 and by notch 1012 is run through in the first middle that first middle punching sub 1112 runs through, the inside lateral wall of first left side run through notch 1011 is equipped with and is used for stepping down the notch that runs through that first left side punching sub 1111 in order to reduce friction steps down 10111. The material has the advantages that the friction between the impact and the upper material releasing plate 101 is reduced as much as possible, the smooth sliding between the impact and the upper material releasing plate 101 is ensured, the purposes of reducing the abrasion and the breaking frequency of the impact are achieved, and the problem of failure of the guiding function of the impact is certainly solved.

Further, the upper diffuser plate 101 is also provided with a second through slot (not labeled) adapted to the second punch set 121, and the second through slot includes the same slots as the first left through slot 1011, the first middle through slot 1012 and the first right through slot 1013, and thus the description thereof is not repeated.

Furthermore, the upper die set 1 further includes a clean cooling gas path system 102 disposed on the upper stripper plate 101 and capable of being externally connected to a compressed gas source and respectively diffusing to the first left through slot 1011, the first middle through slot 1012 and the first right through slot 1013 for respectively cleaning and cooling the first left punch 1111, the first right punch 1112 and the first right punch 1113, and the clean cooling gas path system 102 is adopted to clean and cool the first left punch 1111, the first right punch 1112 and the first right punch 1113 so as to prevent aluminum powder and aluminum chips from adhering to the punching ends of the first left punch 1111, the first right punch 1112 and the first right punch 1113 and reduce the temperature of the punching ends, thereby preventing the punching ends from being overheated and affecting the punching effect.

Furthermore, the upper module 1 further includes a material belt misdelivery detection device 103 disposed on the upper stripper plate 101 and used for detecting whether the material belt of the LED lead frame is misdelivered, and the material belt misdelivery detection device 103 is preferably a misdelivery detection probe, which is a misdelivery detection probe.

Further, the high-speed pin cutting die for the LED lead frame is further provided with a blowing cleaning system 3 which is arranged on the lower die set 2, can be externally connected with a compressed air source and can blow outwards to clean aluminum scraps and other foreign matters on the surface of the die plate, and then when the foreign matters such as aluminum powder and aluminum scraps appear on the surface of the die plate, the compressed air can blow away the foreign matters in time, so that the surface of the die plate is kept clean, and further the stability of the punching quality is facilitated.

Furthermore, the high-speed pin cutting die for the LED lead frame further comprises a positive arch correction mechanism 4 and a negative arch correction mechanism 5 which are arranged between the upper die set 1 and the lower die set 2 and sequentially positioned on the right side of the second punch sub-group 12, wherein the positive arch correction mechanism 4 and the negative arch correction mechanism 5 are matched with each other to solve the problem of stress deformation of the LED lead frame generated in the injection molding and glue filling process, so that the product quality can be further improved, and the actual production requirement can be further met.

Furthermore, the high-speed pin cutting die for the LED lead frame further comprises a cutting mechanism 6 which is arranged between the upper die set 1 and the lower die set 2, is positioned on the right side of the inverted arch correction mechanism 5 and is used for cutting off the LED lead frame material belt, and the cutting mechanism 6 is arranged to achieve the purpose of unifying the length of the LED lead frame, so that the follow-up packaging operation can be facilitated.

As described above, the embodiments of the present application have been described in detail, but the present application is not limited to the above embodiments. Even if various changes are made in the present application, the protection scope of the present application is still included.

Claims

The high-speed pin mould of cutting of LED lead frame, including go up module (1) and with go up module (1) looks adaptation's lower module (2), its characterized in that: the upper die set (1) is provided with a first punching group (11) and a second punching group (12) located on one side of the first punching group (11), the first punching group (11) comprises at least one group of first punching group (111), the second punching group (12) comprises at least one group of second punching group (121), the first punching group (111) and the second punching group (121) are arranged in a staggered mode along the longitudinal direction of the upper die set (1), and punching ends of the first punching group (111) and the second punching group (121) extend out of the lower side face of the upper die set (1);

the lower die set (2) is provided with a first blanking groove set (21) which can be matched with the first punch set (111) and used for punching pins of the LED lead frame for the first time, and a second blanking groove set (22) which can be matched with the second punch set (121) and used for punching the pins of the LED lead frame for the second time.
2. The high-speed pin cutting die for the LED lead frame according to claim 1, wherein: the first punch set (111) and the second punch set (121) are identical in shape.
3. The high-speed pin cutting die for the LED lead frame according to claim 2, wherein: the first punch group (111) comprises a first left punch (1111) and a first right punch (1113) arranged on the right side of the first left punch (1111), and a first middle punch (1112) arranged between the first left punch (1111) and the first right punch (1113);

first blanking groove group (21) include with first left side charging conduit (211) of first left side punching pin (1111) looks adaptation, locate first left side charging conduit (211) right side and with first right side punching pin (1113) looks adaptation first right side charging conduit (213), and locate first left side charging conduit (211) with between first right side charging conduit (213) and with first middle charging conduit (212) of first middle punching pin (1112) looks adaptation.
4. The high-speed pin cutting die for the LED lead frame according to claim 3, wherein: the first left punch (1111) and the first right punch (1113) are arranged in a bilateral symmetry manner.
5. The high-speed pin cutting die for the LED lead frame according to claim 4, wherein: the inside lateral wall of first left side charging conduit (211) is equipped with and is used for abdicating first left side punching pin (1111) is with the charging conduit abdicating notch (2111) of reducing friction.
6. The high-speed pin cutting die for the LED lead frame according to claim 4, wherein: go up module (1) and include the material releasing plate (101), go up material releasing plate (101) on seted up by first left side that first left side punching pin (1111) run through notch (1011), set up in first left side runs through notch (1011) right side and quilt first right side that first right side punching pin (1113) run through notch (1013), and set up in first left side run through notch (1011) with first right side runs through between notch (1013) and quilt notch (1012) are run through to first middle that punching pin (1112) run through, first left side runs through inside lateral wall of notch (1011) and is equipped with and is used for stepping down notch (10111) is stepped down in order to reduce the running through of friction to first left side punching pin (1111).
7. The high-speed pin cutting die for an LED lead frame according to claim 6, wherein: go up module (1) still including locate go up take off flitch (101) on and can external compressed air source and can be respectively to first left side run through notch (1011) and first middle run through notch (1012) and first right side run through notch (1013) diffusion with being used for the clean cooling respectively first left side punching pin (1111) with first right side punching pin (1112) and clean cooling gas circuit system (102) of first right side punching pin (1113).
8. The high-speed pin cutting die for an LED lead frame according to claim 6, wherein: the upper module (1) further comprises a material belt misdelivery detection device (103) which is arranged on the upper stripper plate (101) and used for detecting whether the LED lead frame material belt is misdelivered or not.
9. The high-speed pin cutting die for the LED lead frame according to claim 1, wherein: the die-cut end of first punching group (111) stretches out go up the distance of module (1) downside with the die-cut end of second punching group (121) stretches out the distance of going up module (1) downside is 0.15 ~ 0.5 mm.
10. The high-speed pin cutting die for the LED lead frame according to claim 1, wherein: the number of the first punching groups (11) and the number of the second punching groups (12) are both 1 group, or both 2 groups, or both 3 groups.