CN110802892A - Method for laminating multilayer aluminum/copper composite plate with copper atoms deposited on surface - Google Patents
Method for laminating multilayer aluminum/copper composite plate with copper atoms deposited on surface Download PDFInfo
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/016—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
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- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
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- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B47/00—Auxiliary arrangements, devices or methods in connection with rolling of multi-layer sheets of metal
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- B32—LAYERED PRODUCTS
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- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C25D5/44—Aluminium
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- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B2311/24—Aluminium
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Abstract
The invention discloses a method for laminating a multilayer aluminum/copper composite plate with copper atoms deposited on the surface, which comprises the steps of electroplating copper on the surface of an original aluminum plate to obtain a copper-plated aluminum plate; after the copper-plated aluminum plates and the aluminum plates are subjected to surface treatment, the copper-plated aluminum plates and the aluminum plates are alternately stacked at intervals, the first layer is the aluminum plate to form a laminated plate, and the laminated plate is bundled, fixed and uniformly preheated; hot rolling to obtain a primary rolling aluminum plate-copper-plated aluminum plate composite plate; rolling the aluminum plate-copper-plated aluminum plate composite plate for the first time in a heat preservation way to obtain a heat-diffused composite plate; cutting into plates, superposing the two plates after decontamination, bundling, and repeating the cutting, superposing and rolling processes for a plurality of times to obtain the multilayer aluminum/copper composite plate with copper atoms deposited on the surface. According to the stacking method, copper is uniformly distributed in an aluminum matrix through a method of stacking for multiple times and rolling for multiple times, the interface bonding is good, and the bonding strength of the aluminum-copper interface is improved, so that the mechanical property of the material is enhanced.
Description
Technical Field
The invention belongs to the technical field of metal composite material preparation, and relates to a method for laminating a multilayer aluminum/copper composite plate with copper atoms deposited on the surface.
Background
As a common material for industry and aerospace, aluminum has many outstanding characteristics, such as small metal density, light weight, good ductility, strong plasticity and small elastic coefficient; copper has excellent ductility, thermal conductivity and electrical conductivity, so that it is the most commonly used material for cables, electric and electronic components; in addition copper is often used for electroplating.
The surface of the aluminum plate is electroplated with copper to obtain a copper layer which is bonded in an atomic mode and has strong adhesive force and good uniformity; the uniformity of the copper layer obtained by the method is beyond the uniformity of other methods, and the improvement of the uniformity further optimizes the mechanical property of the material. By regulating and controlling the number of combined layers and the thickness of the copper plating layer, the aluminum-copper composite plate suitable for various special application fields can be prepared. However, the thickness of the copper layer can affect the bonding of the aluminum-copper interface and the mechanical properties of the composite board, so the thickness of the plating layer needs to be further studied.
Patent number ZL201810938113.4 discloses a multilayer copper/copper-aluminum intermetallic compound/aluminum composite foil prepared by a rolling process. However, in the method, copper is inevitably distributed unevenly in an aluminum matrix, and the bonding strength of an aluminum-copper interface is only about 40-45 MPa, so that the mechanical property of the material is influenced.
Disclosure of Invention
The invention aims to provide a method for laminating a multilayer aluminum/copper composite plate with copper atoms deposited on the surface, which solves the problems of uneven distribution of the interface of the composite plate, low interface bonding strength and non-ideal mechanical property in the existing preparation method.
In order to achieve the purpose, the invention adopts the technical scheme that: a method for stacking a multi-layer aluminum/copper composite plate with copper atoms deposited on the surface, the flow chart of which is shown in fig. 1, the stacking method specifically comprises the following steps:
1) uniformly depositing copper atoms on the surface of the original aluminum plate with the thickness of 1-2 mm through an electroplating process to obtain a copper-plated aluminum plate;
treatment of the original aluminum plate: the method comprises the steps of cleaning an original aluminum plate by acetone, removing an oxide film on the surface of the original aluminum plate by a stainless steel brush with the diameter of a steel wire being 0.1-0.2 mm, sequentially polishing the surface of the original aluminum plate by 800# abrasive paper, 1000# abrasive paper and 2000# abrasive paper, cleaning the surface of the original aluminum plate by ethanol water solution in an ultrasonic cleaner, and drying the aluminum plate.
The electroplating process comprises the following steps: placing the surface-treated original aluminum plate in an electroplating solution at room temperature under a current of 2A/dm2Electroplating for 5-60 min under the condition of voltage of 1-5V; 20mL of H per liter of plating bath2SO4And 240g of CuSO4·5H2O。
2) Carrying out surface treatment on a copper-plated aluminum plate and an aluminum plate with the thickness of 1-2 mm, then alternately stacking the aluminum plate and the copper-plated aluminum plate at intervals, wherein the stacking sequence is aluminum plate-copper-plated aluminum plate-aluminum plate, 5-9 layers are stacked to form a laminated plate, drilling a hole with the diameter of 1-3 mm on the laminated plate, penetrating a thin steel wire with the diameter of 1mm into the hole, bundling and fixing the laminated plate, and uniformly preheating the laminated plate in a resistance furnace at the temperature of 300-400 ℃ for 10-15 min;
surface treatment of the aluminum plate: and (3) polishing the aluminum plate along the direction to be rolled by a stainless steel brush with the diameter of the steel wire being 0.1-0.2 mm to remove a surface oxide film, scrubbing by ethanol water solution, and drying.
Surface treatment of a copper-plated aluminum plate: scrubbing residual plating solution stains on the surface by using ethanol water solution, and drying.
3) Carrying out hot rolling on the preheated laminated plate, wherein the hot rolling process conditions are as follows: the reduction rate is 58-60%, and the rolling speed is 10r/min, so that a primarily rolled aluminum plate-copper-plated aluminum plate composite plate is obtained;
4) placing the primarily rolled aluminum plate-copper plated aluminum plate composite plate in a resistance furnace, preserving heat for 5-20 hours at the temperature of 250-300 ℃, and performing thermal diffusion treatment to obtain a thermally diffused composite plate;
the thermal diffusion treatment is carried out to promote the interface of the aluminum plate and the copper-plated aluminum plate to fully react so as to obtain good interface bonding strength, thereby improving the comprehensive performance of the material.
5) Cutting the composite plate after heat diffusion into two plates along a center line in the vertical rolling direction to form plates, respectively performing surface decontamination treatment on the two plates, then overlapping the two plates after decontamination treatment, bundling and fixing the plates, and then rolling the plates under the conditions that the reduction rate is 58-60% and the rolling speed is 10r/min to obtain a secondary rolling aluminum plate-copper-plated aluminum plate composite plate;
6) repeating the step 5) on the secondarily rolled aluminum plate-copper-plated aluminum plate composite plate to obtain a thirdly rolled aluminum plate-copper-plated aluminum plate composite plate; repeating the step 5) on the three-time rolled aluminum plate-copper-plated aluminum plate composite plate to obtain a four-time rolled aluminum plate-copper-plated aluminum plate composite plate; repeating the step 5) on the aluminum plate-copper-plated aluminum plate composite plate rolled for four times to obtain an aluminum plate-copper-plated aluminum plate composite plate rolled for five times; repeating the step 5) on the five-time rolled aluminum plate-copper-plated aluminum plate composite plate to obtain a six-time rolled aluminum plate-copper-plated aluminum plate composite plate; and (5) repeating the step 5) on the six-time rolled aluminum plate-copper-plated aluminum plate composite plate to obtain the multilayer aluminum/copper composite plate with the surface deposited with copper atoms.
Copper atoms are uniformly deposited on the surface of the aluminum plate through electroplating, and the copper atoms are well combined with the surface of the aluminum plate. Stacking the aluminum plate subjected to surface decontamination treatment and the copper-plated aluminum plate, rolling at a certain temperature, and repeatedly stacking and rolling by the same process; the structure of the material subjected to large plastic deformation is refined, and the distribution of copper atoms is finer and more uniform, so that the material performance is greatly improved.
According to the stacking method, copper is uniformly distributed in an aluminum matrix through a method of stacking for multiple times and rolling for multiple times, the interface bonding is good, the bonding strength is 50-60 MPa, and the bonding strength of the aluminum-copper interface is obviously improved, so that the mechanical property of the material is enhanced. The stacking method has the advantages of low cost, high efficiency, and simple preparation process requirement and operation flow.
Drawings
FIG. 1 is a schematic process flow diagram of a stacking method of the present invention.
FIG. 2 is a schematic view showing a process for producing a copper-plated aluminum sheet in the stacking method of the present invention.
FIG. 3 is a schematic diagram of copper plating on an aluminum plate during the manufacturing process shown in FIG. 2.
FIG. 4 is a graph of engineering stress strain curves for a primary rolled aluminum sheet-copper plated aluminum sheet composite sheet, a secondary rolled aluminum sheet-copper plated aluminum sheet composite sheet, and a quartic rolled aluminum sheet-copper plated aluminum sheet composite sheet.
FIG. 5 is a structure distribution diagram of a multi-layer aluminum/copper composite plate with copper atoms deposited on the surface thereof according to the stacking method of the present invention.
Detailed Description
The invention is further described with reference to the following figures and detailed description.
Example 1
Cleaning an original aluminum plate with the thickness of 1mm by using acetone, removing an oxide film on the surface of the original aluminum plate by using a stainless steel brush with the diameter of 0.2mm, sequentially polishing the surface of the original aluminum plate by using 800# abrasive paper, 1000# abrasive paper and 2000# abrasive paper, cleaning the surface of the original aluminum plate by using an ethanol aqueous solution in an ultrasonic cleaning machine, blow-drying, putting the original aluminum plate with the surface treated into an electroplating solution, and performing current 2A/dm at room temperature2Electroplating for 1h under the condition of 1V voltage, as shown in figure 2; 20mL of H per liter of plating bath2SO4And 240g of CuSO4·5H2O; uniformly depositing copper atoms on the surface of the treated original aluminum plate by electroplating, and obtaining a copper-plated aluminum plate as shown in figure 3; polishing the aluminum plate with the thickness of 2mm along the direction of the aluminum plate to be rolled by a stainless steel brush with the steel wire diameter of 0.2mm to remove an oxide film on the surface of the aluminum plate, scrubbing by using ethanol water solution, and drying. Scrubbing residual plating solution stains on the surface of the copper-plated aluminum plate by using an ethanol water solution, and drying. Then, after surface treatmentThe aluminum plate and the copper-plated aluminum plate are alternately stacked at intervals, the stacking sequence is aluminum plate-copper-plated aluminum plate-aluminum plate, 5 layers are stacked together to form a laminated plate, a hole with the diameter of 3mm is drilled in the laminated plate, a thin steel wire with the diameter of 1mm penetrates into the hole, the laminated plate is bundled and fixed, the laminated plate is placed in a resistance furnace and is uniformly preheated for 10min at the temperature of 400 ℃, hot rolling is carried out, and the hot rolling process conditions are as follows: the reduction rate is 58 percent, and the rolling speed is 10r/min, so that the primarily rolled aluminum plate-copper-plated aluminum plate composite plate is obtained; placing the primarily rolled aluminum plate-copper-plated aluminum plate composite plate in a resistance furnace, preserving heat for 20 hours at the temperature of 300 ℃, and performing thermal diffusion treatment to obtain a thermally diffused composite plate; cutting the composite plate after heat diffusion into two plates along a center line in the vertical rolling direction to form plates, respectively carrying out surface decontamination treatment on the two plates, then superposing the two plates after decontamination treatment, bundling and fixing the plates, and then rolling the plates under the conditions that the reduction rate is 58% and the rolling speed is 10r/min to obtain a secondary rolling aluminum plate-copper-plated aluminum plate composite plate; rolling the secondary rolled aluminum plate-copper-plated aluminum plate composite plate under the conditions that the reduction rate is 58% and the rolling speed is 10r/min to obtain a tertiary rolled aluminum plate-copper-plated aluminum plate composite plate; rolling the aluminum plate-copper-plated aluminum plate composite plate for three times under the conditions that the reduction rate is 58% and the rolling speed is 10r/min to obtain a rolled aluminum plate-copper-plated aluminum plate composite plate for four times; rolling the aluminum plate-copper-plated aluminum plate for four times under the conditions that the reduction rate is 58% and the rolling speed is 10r/min to obtain a five-time rolled aluminum plate-copper-plated aluminum plate composite plate; rolling the aluminum plate-copper-plated aluminum plate composite plate for five times under the conditions that the reduction rate is 58% and the rolling speed is 10r/min to obtain a six-time rolled aluminum plate-copper-plated aluminum plate composite plate; and rolling the aluminum plate-copper-plated aluminum plate composite plate for six times under the conditions that the reduction rate is 58% and the rolling speed is 10r/min to obtain the multilayer aluminum/copper composite plate with the surface deposited with copper atoms.
The engineering stress-strain curves of the primary rolled aluminum plate-copper plated aluminum plate composite plate, the secondary rolled aluminum plate-copper plated aluminum plate composite plate, and the fourth rolled aluminum plate-copper plated aluminum plate composite plate manufactured in example 1 are shown in fig. 4. As can be seen from fig. 4, the tensile strength of the primary rolled aluminum plate-copper plated aluminum plate composite plate is 121.13Mpa, the tensile strength of the secondary rolled aluminum plate-copper plated aluminum plate composite plate is 137.15Mpa, and the tensile strength of the fourth rolled aluminum plate-copper plated aluminum plate composite plate is 177.42 Mpa; from this, it is understood that the tensile strength of the composite plate increases as the number of stacking times increases.
The texture distribution of the multi-layer aluminum/copper clad plate with copper atoms deposited on the surface prepared in example 1 is shown in fig. 5, and as can be seen from the graph, in the primary rolled aluminum plate-copper plated aluminum plate clad plate (fig. 5 a), copper is larger in most of the matrix; in the secondary rolled aluminum plate-copper plated aluminum plate composite plate (fig. 5 b), copper is reduced in size in the matrix; the copper in the four-time rolled composite plate is in the matrix (fig. 5 c), and the size of the copper is reduced into particles and the distribution of the copper is more uniform. The size of the copper decreases and the distribution becomes more uniform as the number of times of the stack rolling increases.
Example 2
Cleaning an original aluminum plate with the thickness of 2mm by using acetone, removing an oxide film on the surface of the original aluminum plate by using a stainless steel brush with the diameter of 0.1mm, sequentially polishing the surface of the original aluminum plate by using 800# abrasive paper, 1000# abrasive paper and 2000# abrasive paper, cleaning the surface of the original aluminum plate by using an ethanol aqueous solution in an ultrasonic cleaning machine, blow-drying, putting the original aluminum plate with the surface treated into an electroplating solution, and performing current 2A/dm at room temperature2Electroplating for 8min under the condition of 5V voltage; 20mL of H per liter of plating bath2SO4And 240g of CuSO4·5H2O; uniformly depositing copper atoms on the surface of the treated original aluminum plate by electroplating to obtain a copper-plated aluminum plate; polishing the aluminum plate with the thickness of 1.5mm along the direction to be rolled of the aluminum plate by using a stainless steel brush with the steel wire diameter of 0.1mm to remove an oxide film on the surface of the aluminum plate, scrubbing by using ethanol water solution, and drying. Scrubbing residual plating solution stains on the surface of the copper-plated aluminum plate by using an ethanol water solution, and drying. Then, the aluminum plates and the copper-plated aluminum plates after surface treatment are alternately stacked at intervals, 9 layers of aluminum plates, copper-plated aluminum plates, copper-plated aluminum plates and aluminum plates are stacked in sequence, a hole with the diameter of 1mm is drilled in the stacked plates, thin steel wires with the diameter of 1mm penetrate into the hole, the stacked plates are bundled and fixed, and after being uniformly preheated in a resistance furnace at the temperature of 300 ℃ for 15min, hot rolling is carried out, and the process conditions of the hot rolling are as follows: the reduction rate is 60 percent, and the rolling speed is 10r/min to obtainRolling the aluminum plate-copper-plated aluminum plate composite plate for the first time; placing the primarily rolled aluminum plate-copper-plated aluminum plate composite plate in a resistance furnace, preserving heat for 10 hours at the temperature of 250 ℃, and performing thermal diffusion treatment to obtain a thermally diffused composite plate; cutting the composite plate after heat diffusion into two plates along a center line in the vertical rolling direction to form plates, respectively carrying out surface decontamination treatment on the two plates, then superposing the two plates after decontamination treatment, bundling and fixing the plates, and then rolling the plates under the conditions that the reduction rate is 60% and the rolling speed is 10r/min to obtain a secondary rolled aluminum plate-copper-plated aluminum plate composite plate; rolling the secondary rolled aluminum plate-copper-plated aluminum plate composite plate under the conditions that the reduction rate is 60% and the rolling speed is 10r/min to obtain a tertiary rolled aluminum plate-copper-plated aluminum plate composite plate; rolling the aluminum plate-copper-plated aluminum plate composite plate for three times under the conditions that the reduction rate is 60% and the rolling speed is 10r/min to obtain a rolled aluminum plate-copper-plated aluminum plate composite plate for four times; rolling the aluminum plate-copper-plated aluminum plate for four times under the conditions that the reduction rate is 60% and the rolling speed is 10r/min to obtain a five-time rolled aluminum plate-copper-plated aluminum plate composite plate; rolling the aluminum plate-copper-plated aluminum plate composite plate for five times under the conditions that the reduction rate is 60% and the rolling speed is 10r/min to obtain a six-time rolled aluminum plate-copper-plated aluminum plate composite plate; and rolling the aluminum plate-copper-plated aluminum plate composite plate for six times under the conditions that the reduction rate is 60% and the rolling speed is 10r/min to obtain the multilayer aluminum/copper composite plate with the surface deposited with copper atoms.
Example 3
Cleaning an original aluminum plate with the thickness of 1.5mm by using acetone, removing an oxide film on the surface of the original aluminum plate by using a stainless steel brush with the diameter of 0.15mm, sequentially polishing the surface of the original aluminum plate by using 800# abrasive paper, 1000# abrasive paper and 2000# abrasive paper, cleaning the surface of the original aluminum plate by using an ethanol water solution in an ultrasonic cleaning machine, blow-drying, putting the original aluminum plate with the surface treated in electroplating solution, and carrying out current 2A/dm at room temperature2Electroplating for 30min under the voltage of 3V; 20mL of H per liter of plating bath2SO4And 240g of CuSO4·5H2O; uniformly depositing copper atoms on the surface of the treated original aluminum plate by electroplating to obtain a copper-plated aluminum plate; polishing with stainless steel brush with wire diameter of 0.15mm along the direction of 1mm aluminum plate to be rolled to remove oxide film on the surface of the aluminum plate, and adding ethanol water solutionScrubbing and drying. Scrubbing residual plating solution stains on the surface of the copper-plated aluminum plate by using an ethanol water solution, and drying. Then, the aluminum plates and the copper-plated aluminum plates after surface treatment are alternately stacked at intervals, the stacking sequence is 8 layers of aluminum plates, copper-plated aluminum plates, aluminum plates and copper-plated aluminum plates, a hole with the diameter of 2mm is drilled in the stacked plates, a thin steel wire with the diameter of 1mm penetrates into the hole, the stacked plates are bundled and fixed, and after being uniformly preheated in a resistance furnace at the temperature of 350 ℃ for 12min, hot rolling is carried out, and the process conditions of the hot rolling are as follows: the reduction rate is 59 percent, and the rolling speed is 10r/min, so that the primarily rolled aluminum plate-copper-plated aluminum plate composite plate is obtained; placing the primarily rolled aluminum plate-copper-plated aluminum plate composite plate in a resistance furnace, preserving heat for 15 hours at the temperature of 280 ℃, and performing thermal diffusion treatment to obtain a thermally diffused composite plate; cutting the composite plate after heat diffusion into two plates along a center line in the vertical rolling direction to form plates, respectively performing surface decontamination treatment on the two plates, then overlapping the two plates after decontamination treatment, bundling and fixing the plates, and then rolling the plates under the conditions of a rolling reduction of 59% and a rolling speed of 10r/min to obtain a secondary rolling aluminum plate-copper-plated aluminum plate composite plate; rolling the secondary rolled aluminum plate-copper-plated aluminum plate composite plate under the conditions that the reduction rate is 59% and the rolling speed is 10r/min to obtain a tertiary rolled aluminum plate-copper-plated aluminum plate composite plate; rolling the aluminum plate-copper-plated aluminum plate composite plate for three times under the conditions that the reduction rate is 59% and the rolling speed is 10r/min to obtain a rolled aluminum plate-copper-plated aluminum plate composite plate for four times; rolling the aluminum plate-copper-plated aluminum plate for four times under the conditions that the reduction rate is 59% and the rolling speed is 10r/min to obtain a five-time rolled aluminum plate-copper-plated aluminum plate composite plate; rolling the aluminum plate-copper-plated aluminum plate composite plate for five times under the conditions that the reduction rate is 59% and the rolling speed is 10r/min to obtain a six-time rolled aluminum plate-copper-plated aluminum plate composite plate; and rolling the aluminum plate-copper-plated aluminum plate composite plate for six times under the conditions that the reduction rate is 59% and the rolling speed is 10r/min to obtain the multilayer aluminum/copper composite plate with the surface deposited with copper atoms.
Claims (4)
1. A method for laminating a multi-layer aluminum/copper composite plate with copper atoms deposited on the surface is characterized by comprising the following steps:
1) electroplating copper on the surface of the original aluminum plate to obtain a copper-plated aluminum plate;
2) carrying out surface treatment on a copper-plated aluminum plate and an aluminum plate, then alternately stacking the surface-treated aluminum plate and the copper-plated aluminum plate at intervals, wherein the first layer is an aluminum plate, 5-9 layers are stacked to form a laminated plate, bundling and fixing the laminated plate, and uniformly preheating for 10-15 min in an environment at the temperature of 300-400 ℃;
3) hot rolling the preheated laminated plate under the process conditions of the reduction rate of 58-60% and the rolling speed of 10r/min to obtain a primary rolled aluminum plate-copper-plated aluminum plate composite plate;
4) placing the primarily rolled aluminum plate-copper plated aluminum plate composite plate in an environment with the temperature of 250-300 ℃ for heat preservation for 5-20 hours to obtain a heat-diffused composite plate;
5) cutting the composite plate after heat diffusion into two plates along a center line in the vertical rolling direction to form plates, respectively performing surface decontamination treatment on the two plates, then overlapping the two plates after decontamination treatment, bundling and fixing the plates, and rolling the plates at the conditions that the reduction rate is 58-60% and the rolling speed is 10r/min to obtain a secondary rolled aluminum plate-copper plated aluminum plate composite plate;
6) repeating the step 5) on the secondarily rolled aluminum plate-copper-plated aluminum plate composite plate to obtain a thirdly rolled aluminum plate-copper-plated aluminum plate composite plate; repeating the step 5) on the three-time rolled aluminum plate-copper-plated aluminum plate composite plate to obtain a four-time rolled aluminum plate-copper-plated aluminum plate composite plate; repeating the step 5) on the four-time rolled aluminum plate-copper-plated aluminum plate composite plate to obtain a five-time rolled aluminum plate-copper-plated aluminum plate composite plate; repeating the step 5) on the five-time rolled aluminum plate-copper-plated aluminum plate composite plate to obtain a six-time rolled aluminum plate-copper-plated aluminum plate composite plate; and (5) repeating the step 5) on the six-time rolled aluminum plate-copper-plated aluminum plate composite plate to obtain the multilayer aluminum/copper composite plate with the surface deposited with copper atoms.
2. The method for stacking a multi-layered aluminum/copper composite plate with copper atoms deposited on the surface according to claim 1, wherein in the step 1), the surface of an original aluminum plate is electroplated with copper: placing the surface-treated original aluminum plate in an electroplating solution at room temperature under a current of 2A/dm2Electroplating for 5-60 min under the condition of voltage of 1-5V; 20mL of H per liter of plating bath2SO4And 240g of CuSO4·5H2O。
3. The method for stacking the multi-layer aluminum/copper composite plate with the surface deposited with copper atoms according to claim 1 or 2, wherein the thickness of the original aluminum plate is 1-2 mm.
4. The method for stacking a multi-layer aluminum/copper composite plate with copper atoms deposited on the surface according to claim 1 or 2, wherein in the step 2), the thickness of the aluminum plate is 1-2 mm.
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| CN111299320A (en) * | 2020-03-16 | 2020-06-19 | 吉林大学 | Preparation method of multilayer ceramic particle tough composite-configuration aluminum alloy plate |
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| JPS6046801A (en) * | 1983-08-23 | 1985-03-13 | Toyo Alum Kk | Manufacture of aluminum foil having metallic layer on its surface |
| EP1543899A2 (en) * | 2003-12-17 | 2005-06-22 | Fuji Photo Film B.V. | Aluminium alloy substrate for digitally imageable lithographic printing plate and process for producing the same |
| CN106670235A (en) * | 2016-12-30 | 2017-05-17 | 洛阳铜鑫复合材料科技有限公司 | Production method for copper-aluminum composite board strip and copper-aluminum composite board strip |
| CN109772885A (en) * | 2019-01-28 | 2019-05-21 | 兰州理工大学 | The composite board and its preparation process of aluminium sheet and 45 ° of copper mesh accumulation pack rolling |
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| JPS6046801A (en) * | 1983-08-23 | 1985-03-13 | Toyo Alum Kk | Manufacture of aluminum foil having metallic layer on its surface |
| EP1543899A2 (en) * | 2003-12-17 | 2005-06-22 | Fuji Photo Film B.V. | Aluminium alloy substrate for digitally imageable lithographic printing plate and process for producing the same |
| CN106670235A (en) * | 2016-12-30 | 2017-05-17 | 洛阳铜鑫复合材料科技有限公司 | Production method for copper-aluminum composite board strip and copper-aluminum composite board strip |
| CN109772885A (en) * | 2019-01-28 | 2019-05-21 | 兰州理工大学 | The composite board and its preparation process of aluminium sheet and 45 ° of copper mesh accumulation pack rolling |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111299320A (en) * | 2020-03-16 | 2020-06-19 | 吉林大学 | Preparation method of multilayer ceramic particle tough composite-configuration aluminum alloy plate |
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| CN110802892B (en) | 2021-12-24 |
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