CN110792931A

CN110792931A - Structure of LED filament bulb

Info

Publication number: CN110792931A
Application number: CN201910187065.4A
Authority: CN
Inventors: 张国兴; 赖中平
Original assignee: BGT Materials Ltd
Current assignee: BGT Materials Ltd
Priority date: 2018-08-03
Filing date: 2019-03-13
Publication date: 2020-02-14
Also published as: JP2020021724A; CN210035123U; TWM585874U; TW202014641A; JP3222266U; CN110792933A

Abstract

The invention provides a structure of a light-emitting diode filament bulb, which comprises: the lamp holder can be connected with an external power supply to provide driving power for driving the LED filament, the lamp filament support is electrically connected with the lamp holder, the LED filament comprises two metal supports, two electrode pins of the LED filament are respectively electrically connected with the two metal supports to form a driving loop, the surfaces of the two metal supports are coated with a coating containing graphene or boron nitride to form a heat dissipation and black body radiation layer, and the back of a substrate of the LED filament is provided with a heat radiation heat dissipation film; the metal support, the heat dissipation and black body radiation layer and the heat radiation heat dissipation film are penetrated, so that the heat conductivity and the heat radiation area of the lamp filament support and the light-emitting diode lamp filament can be increased, the heat convection of gas in the transparent lamp shell is promoted, the heat radiation capacity is improved, and the heat dissipation and heat radiation effects of the light-emitting diode lamp filament bulb are improved.

Description

Structure of LED filament bulb

Technical Field

The invention relates to a structure of a bulb, in particular to a structure of a light-emitting diode filament bulb, which can improve the heat radiation effect of the light-emitting diode filament bulb.

Background

In recent years, due to the great progress of LED manufacturing technology, especially the successful development of high-power and high-brightness white LEDs, many LED bulbs (LED bulbs) using LEDs as light emitting components have been on the market due to the ideal green energy and environmental protection, for example, LED bulbs used for illumination or small night lights using LEDs.

Because of the excellent characteristics of LEDs, manufacturers have made LED filaments from LED chips (LED chips) and encapsulated them into transparent bulbs to replace traditional incandescent bulbs; the LED filament used in the LED filament bulb generally uses a transparent substrate, such as a glass substrate or a sapphire substrate, a plurality of LED chips are bonded on one side surface of the transparent substrate, and then the LED filament is formed by wire bonding and fluorescent glue coating processes.

The lamp bulb with the LED filament in the prior art mainly generates heat from the LED, the lamp bulb with the LED filament in the prior art mainly dissipates heat in a heat conduction mode, a heat convection mode and a heat radiation mode, wherein a lamp wick support used for supporting the LED filament in the lamp bulb with the LED filament is made of glass, the heat conduction capability is poor, most of the heat generated by the LED needs to be transferred to a transparent lamp shell through the heat radiation mode and filling gas in the transparent lamp shell, and then the heat generated by the contact of external air and the transparent lamp shell dissipates heat through the heat convection mode. Therefore, although led filament bulbs have better light emitting performance than conventional incandescent bulbs, the problem of poor heat dissipation and radiation effect of led filament bulbs still needs to be further improved.

Disclosure of Invention

The main objective of the present invention is to provide a structure of led filament bulb for improving the heat dissipation and radiation effects of the led filament bulb.

To achieve the above object, an embodiment of the present invention provides a structure of a filament bulb of a light emitting diode, including: the lamp comprises a lamp holder, a transparent lamp shell, at least one filament support and at least one light-emitting diode filament, wherein the transparent lamp shell is a hollow shell which is provided with an opening and is transparent, the lamp holder is provided with an anode power supply terminal and a cathode power supply terminal which can be electrically connected with an external power supply to provide driving power for driving the light-emitting diode filament, and the filament support comprises two metal supports which are respectively and electrically connected with the anode power supply terminal and the cathode power supply terminal to transmit the driving power; wherein the light emitting diode filament includes: the LED lamp comprises a substrate, a first electrode pin and a second electrode pin which are arranged at two ends of the substrate, a thermal radiation heat dissipation film formed on the back surface of the substrate, at least one LED chip (hereinafter referred to as an LED chip) fixed on the front side of the substrate, a conducting wire and a phosphor, wherein the conducting wire is connected with the LED chip in series and is electrically connected with the first electrode pin and the second electrode pin to form a serial circuit, the first electrode pin and the second electrode pin are respectively and electrically connected with two metal supports to form a driving loop, wherein the surfaces of the two metal supports are coated with a coating containing graphene (graphene) or boron nitride to form a heat dissipation and black body radiation layer, an LED filament and a filament support are arranged in a transparent lamp shell, and the LED filament and the filament support are arranged in an opening of the transparent lamp cap and seal the opening to enable the transparent lamp.

In an embodiment of the present invention, the metal support of the filament support may be any one of a straight bar shape and an arc shape.

In an embodiment of the invention, the lamp includes more than one filament support, and the two metal supports of any one of the filament supports are electrically connected to the positive power terminal and the negative power terminal of the lamp holder respectively.

In one embodiment of the invention, a plurality of parallel led filaments are included.

In an embodiment of the present invention, the led lamp includes a plurality of led filaments, and the led filaments are electrically connected to the two metal supports of the filament support in a parallel-multi-string relationship.

In an embodiment of the invention, the first electrode lead and the second electrode lead are fixed on the front side of the substrate by a die bond containing graphene or hexagonal boron nitride.

In an embodiment of the present invention, the substrate of the led filament includes: any one of a metal substrate, a ceramic substrate, a glass substrate, and a plastic substrate.

In an embodiment of the invention, the substrate of the led filament includes: any one of a metal substrate, a flexible ceramic substrate, a flexible glass substrate, and a plastic substrate.

In an embodiment of the present invention, the led filament includes any one of a straight led filament and a bent led filament and a combination thereof.

In an embodiment of the invention, a power controller is disposed in the lamp cap, and the power controller is electrically connected to the lamp cap and is configured to convert electric energy provided by an external power source into driving power for driving the light emitting diode filament.

In an embodiment of the present invention, the radiation heat dissipation film is formed by applying a radiation heat dissipation ink to the back surface of the substrate by using any one of spraying, brushing, screen printing and nozzle printing, the radiation heat dissipation ink includes: heat dissipation filler, dispersant and adhesive.

In an embodiment of the present invention, the heat dissipation filler is at least any one of carbon material, metal particles, ceramic material and far infrared radiation powder, or a mixture of the above heat dissipation fillers.

In one embodiment of the present invention, the carbon material at least comprises: any one of graphene, carbon black, graphite, carbon nanotubes and activated carbon, or a mixture of the above carbon materials.

In one embodiment of the present invention, the metal particles at least comprise: any one of copper (Cu), nickel (Ni), zinc (Zn), iron (Fe), cobalt (Co), silver (Ag), gold (Au), platinum (Pt) and alloys thereof, or a mixture of the above-mentioned plurality of metal particles.

In one embodiment of the present invention, the far infrared radiation powder at least comprises: any one of silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium dioxide (TiO2), zirconium oxide (ZrO2), zirconium carbide (ZrC), silicon carbide (SiC), tantalum carbide (TaC), titanium diboride (TiB2), zirconium diboride (ZrB2), titanium disilicide (TiSi2), silicon nitride (Si3N4), titanium nitride (TiN) and Boron Nitride (BN), or a mixture of the above-mentioned plural kinds of far infrared ray radiating powders.

Therefore, it can be understood from the above technical contents that the structure of the led filament bulb provided by the present invention can increase the thermal conductivity and the thermal radiation area of the filament support and the led filament through the metal support, the heat dissipation and black body radiation layer and the thermal radiation heat dissipation film, and has the effects of promoting the thermal convection of the gas inside the transparent lamp housing and improving the thermal radiation, thereby improving the heat dissipation and thermal radiation effects of the led filament bulb.

Other features and embodiments of the present invention will be described in detail below with reference to the drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a structural view of an embodiment of the construction of the LED filament bulb of the present invention;

FIG. 2 is a partial structural view of another embodiment of the LED filament bulb of the present invention, showing another arrangement of the LED filament on the filament support;

FIG. 3 is a partial structural view of another embodiment of the LED filament bulb of the present invention, showing another arrangement of the LED filament on the filament support;

FIG. 4 is a partial structural view of another embodiment of the LED filament bulb of the present invention, showing another arrangement of the LED filament on the filament support;

FIG. 5 is a partial structural view of another embodiment of the LED filament bulb of the present invention, showing one arrangement of the LED filament on the filament support;

FIG. 6 is a cross-sectional structural view of the LED filament shown in FIG. 5;

FIG. 7 is a cross-sectional structural view of the electrical connection between the LED filament and the metal support shown in FIG. 5;

FIG. 8 is a partial configuration view of another embodiment of the construction of the LED filament bulb of the present invention, showing the construction of the LED filament and the arc-shaped metal support;

fig. 9 is a partial configuration view of another embodiment of the configuration of the led filament bulb of the present invention, showing the configuration of the led filament and the arc-shaped metal support.

Description of the symbols

10 lamp holder 11 lamp core holder

20 transparent lamp shell 21 opening

30 first electrode pin of LED filament 31

32 second electrode pin 40, 40a filament support

41. 42 metal support 43 heat dissipation and blackbody radiation layer

50 positive power supply terminal of power controller 51

52 negative power supply terminal 60 substrate

61 LED chip 62 heat radiation heat dissipation film

63 solid crystal glue 64 conducting wire

65 fluorophor 70 insulating solid crystal glue S filament group

Detailed Description

The positional relationship described in the following embodiments includes: the top, bottom, left and right, unless otherwise indicated, are based on the orientation of the elements in the drawings.

Referring first to fig. 1, a structural diagram of an embodiment of the led filament bulb of the present invention is shown; the construction of the led filament bulb disclosed therein comprises: a lamp cap 10, a transparent lamp housing 20, at least one filament support 40 and at least one led filament 30.

Wherein the lamp cap 10 can be electrically connected to an external power source for providing driving power for driving the led filament 30, and the type of the lamp cap 10 includes, but is not limited to, any one of a screw type lamp cap, a plug-in type lamp cap and a connector type lamp cap; wherein the screw type lamp holder (such as the lamp holder 10 shown in FIG. 1) is the one whose current model starts with the English letter E (e.g. E22, E26 and E27); plug-in burners, i.e. those whose current model starts with the english letter G (for example GU10), and pin-head burners, i.e. those whose current model starts with the english letter B. In general, the led filament 30 is driven by a dc driving power to be lit, wherein in one embodiment, the dc driving power may be directly provided by an external power source, for example, the lamp cap 10 is mounted on a lamp holder connected to the dc power source; in another embodiment, an external power source (e.g., an ac power source) is converted into dc driving power by the lamp head 10, in the embodiment shown in fig. 1, a power controller 50 is disposed in the lamp head 10, the power controller 50 is electrically connected to the lamp head 10, the power controller 50 is basically a driving circuit of a light emitting diode, the input side of the driving circuit is electrically connected to an AC power source through the lamp cap 10, the output side of the driving circuit includes two power terminals with different polarities, a positive power terminal 51 and a negative power terminal 52 for outputting DC driving power, the power controller 50 can thus convert the power supplied from an external power source into driving power for driving the led filament 30, for example by mounting the burner 10 in a lamp socket connected to an ac power source, the power supplied by the ac power source is converted into dc driving power for driving the led filament 30 by the power controller 50.

Wherein the transparent lamp envelope 20 is a hollow envelope having an opening 21 and being light-transmissive, generally, the transparent lamp envelope 20 is made of glass, the light-emitting diode filament 30 and the filament support 40 can be inserted into the transparent lamp envelope 20 from the opening 21 of the transparent lamp envelope 20, and after filling gas (usually nitrogen or other inert gas mixture) is injected into the transparent lamp envelope 20, the opening 21 is sealed by the burner 10 so that the transparent lamp envelope 20 is in a sealed state.

The filament support 40 includes two metal supports 41 and 42, the two metal supports 41 and 42 are respectively electrically connected to the positive power terminal 51 and the negative power terminal 52 of the lamp cap 10 for transmitting driving power; in one embodiment, as shown in fig. 1, the lamp cap 10 has a lamp core holder 11 made of glass, bottom ends of two

metal brackets

41 and 42 are fixed to the lamp core holder 11, and the bottom ends of the two

metal brackets

41 and 42 are electrically connected to a positive power terminal 51 and a negative power terminal 52 of a dc power controller 50 respectively after passing through the lamp core holder 11.

The led filament 30 is constructed as shown in fig. 6, and includes: a substrate 60, at least one LED chip 61 (preferably a plurality of LED chips 61), a first electrode pin 31 and a second electrode pin 32 fixed at two ends of the substrate 60 are fixed at the front side of the substrate 60; the first electrode leads 31 and the second electrode leads 32 are electrically connected with the two

metal frames

41 and 42 respectively to form a driving circuit, in a preferred embodiment, the LED chips 61, the first electrode leads 31 and the second electrode leads 32 are fixed on the front side of the substrate 60 by a die attach adhesive 63 containing graphene or boron nitride, wherein the LED chips 61 are electrically connected with the first electrode leads 31 and the second electrode leads 32 in series by a wire 64, wherein the wire 64 can be completed by a conventional wire bonding process, a phosphor 65 encapsulates all the LED chips 61 therein, only the first electrode leads 31 and the second electrode leads 32 are exposed, and a thermal radiation heat dissipation film 62 is formed on the back side of the substrate 60. In a preferred embodiment shown in fig. 7, the substrate 60 is fixed on one side surface of the two

metal frames

41 and 42 by an electrically insulating die bond adhesive 70, so as to prevent the substrate 60 from forming a short circuit between the two

metal frames

41 and 42.

In an embodiment of the present invention, the first electrode lead 31 and the second electrode lead 32 of the led filament 30 can be directly soldered to one side surface of the metal supports 41 and 42 by solder to form an electrical connection, and the led filament 30 can be driven to light by the dc driving power transmitted through the two metal supports 41 and 42; referring to fig. 7, in an embodiment of the invention, a coating containing graphene (graphene) or Boron Nitride (BN) or other heat conductive ceramic powder is coated on the surfaces of two metal supports 41 and 42 to form a heat dissipation and black body radiation layer 43, preferably, the heat dissipation and black body radiation layer 43 is coated on the opposite side surfaces of the two metal supports 41 and 42 welded with the first electrode pin 31 and the second electrode pin 32, respectively, when a portion of heat generated by the led filament 30 is transferred to the two metal supports 41 and 42 through the first electrode pin 31 and the second electrode pin 32, the heat conductivity, heat dissipation and heat radiation area of the two metal supports 41 and 42 can be increased by the sheet structure of graphene or Boron Nitride (BN) or other heat conductive ceramic powder contained in the heat dissipation and black body radiation layer 43; on the other hand, due to the excellent heat radiation capability of the graphene, boron nitride or other heat conductive ceramic powder, the heat exchange and heat convection effects between the two metal supports 41 and 42 and the filling gas inside the transparent lamp housing 20 can be improved, and further the heat dissipation and heat radiation effects of the led filament bulb can be improved.

The material of the substrate 60 of the led filament 30 includes: any one of a metal substrate, a ceramic substrate, a glass substrate, a sapphire substrate, and a plastic substrate. As another preferred embodiment of the present invention, in which the led filament 30 is bendable, the substrate 60 of the bendable led filament 30 includes: any one of a metal substrate, a flexible ceramic substrate, a flexible glass substrate, and a plastic substrate.

In a preferred embodiment of the present invention, the radiation-dissipating film 62 is formed by applying a radiation-dissipating ink to the back surface of the substrate 60 by any one of spraying (spraying), brushing (brushing), screen printing (screen printing) and nozzle printing (nozzle printing), wherein the radiation-dissipating ink comprises: heat-dissipating fillers (disparation fillers), dispersants (dispersants) and binders (binders).

Wherein the heat dissipation filler is at least one of carbon material, metal particles (metal particles), ceramic material and far-infrared radiation powder (infrared-radiation powder), or mixture of the above heat dissipation fillers.

Wherein the carbon material comprises at least: any one of graphene (graphene), carbon black (carbon black), graphite (graphite), carbon nanotubes (carbon nanotubes), and activated carbon (activated carbon), or a mixture of the above carbon materials.

Wherein the metal particles comprise at least: any one of copper (Cu), nickel (Ni), zinc (Zn), iron (Fe), cobalt (Co), silver (Ag), gold (Au), platinum (Pt) and alloys thereof, or a mixture of the above-mentioned plurality of metal particles.

Wherein the far infrared radiation powder at least comprises: any one of silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium dioxide (TiO2), zirconium oxide (ZrO2), zirconium carbide (ZrC), silicon carbide (SiC), tantalum carbide (TaC), titanium diboride (TiB2), zirconium diboride (ZrB2), titanium disilicide (TiSi2), silicon nitride (Si3N4), titanium nitride (TiN) and Boron Nitride (BN), or a mixture of the above-mentioned plural kinds of far infrared ray radiating powders.

In the preferred embodiment of the present invention, the led filament 30 includes any one or a combination of a bendable and an inflexible led filament, and fig. 5 shows an led filament 30 that can be bent into an arc shape. Fig. 9 shows an embodiment in which the led filament 30 comprises an inflexible led filament and a flexible led filament 30.

In the embodiment of the present invention, the arrangement of the led filament 30 and the filament support 40 includes several embodiments, which will be described below with reference to the drawings.

Referring to fig. 1, in an embodiment of the present invention, a plurality of led filaments 30 are disposed in parallel, and the led filaments 30 are electrically connected to two

metal frames

41 and 42 of the same filament frame 40 in parallel.

Fig. 2 is a partial structural view of another embodiment of the present invention, showing another arrangement of the led filament 30 on the filament support 40; the lamp comprises a plurality of LED filaments 30, the LED filaments 30 are respectively arranged on two opposite sides of a plane formed by two

metal brackets

41 and 42, the LED filaments 30 on the same side are electrically connected with the two

metal brackets

41 and 42 of the same filament bracket 40 in a parallel connection manner, and the LED filaments 30 on the two opposite sides of the plane formed by the two

metal brackets

41 and 42 are mutually crossed and arranged, so that the number of the LED filaments 30 in a single transparent lamp shell 20 can be increased to improve the lumen count (lux) of the LED filament bulb. In another embodiment shown in fig. 3, the led filament bulb of the present invention includes more than one filament support 40, which includes two filament supports 40 and 40a, and the two metal supports 41 and 42 of either filament support 40 or 40a are electrically connected to the positive power terminal 51 and the negative power terminal 52 of the lamp cap 10, respectively.

Referring to fig. 4, a multiple-parallel-multiple-string configuration is shown, wherein a plurality of filament sets S electrically connected to two metal supports 41 and 42 of the same filament support 40 in parallel are included, and each filament set S includes two led filaments 30 connected in series.

In an embodiment of the present invention, the two

metal brackets

41 and 42 of the filament bracket 40 may be any one of a straight bar shape (see fig. 1 to 5) and an arc shape, wherein an embodiment of the two

metal brackets

41 and 42 of the arc shape is shown in fig. 8 and 9.

The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art may make modifications or changes to other equivalent embodiments without departing from the scope of the technical means disclosed in the present disclosure, but should be construed as the technology or implementations substantially the same as the present technology.

Claims

1. A construction for a light emitting diode filament bulb, comprising: the lamp comprises a lamp holder, a transparent lamp shell, at least one filament support and at least one light-emitting diode filament;

the transparent lamp shell is a hollow shell which is provided with an opening and is transparent, the lamp holder is provided with an anode power supply terminal and a cathode power supply terminal which can be electrically connected with an external power supply for providing driving power for driving the LED filament, wherein the filament support comprises two metal supports which are respectively and electrically connected with the anode power supply terminal and the cathode power supply terminal for transmitting the driving power;

this emitting diode filament includes: the LED lamp comprises a substrate, a first electrode pin and a second electrode pin which are arranged at two ends of the substrate, a thermal radiation heat dissipation film formed on the back surface of the substrate, at least one LED chip fixed on the front side of the substrate, a lead and a phosphor, wherein the lead is connected with the LED chip in series and is electrically connected with the first electrode pin and the second electrode pin to form a serial circuit, the first electrode pin and the second electrode pin are respectively and electrically connected with two metal supports to form a driving loop, the LED filament and the filament support are arranged in the transparent lamp shell, and the lamp cap is arranged in the opening of the transparent lamp shell and seals the opening to enable the transparent lamp shell to form a sealed state.

2. The structure of the led filament bulb as claimed in claim 1, wherein the surface of the two metal supports is coated with a heat sink and blackbody radiation layer.

3. The structure of claim 1, comprising more than one of the filament supports, wherein each of the two metal supports of any one of the filament supports is electrically connected to the positive power terminal and the negative power terminal of the lamp holder.

4. The structure of the led filament bulb as claimed in claim 1, comprising a plurality of the led filaments electrically connected in parallel to the two metal supports of the filament support.

5. The structure of the led filament bulb as claimed in claim 1, comprising a plurality of the led filaments electrically connected to the two metal supports of the filament support in a plurality of parallel strings.

6. The structure of the LED filament bulb as claimed in claim 1, wherein the first electrode lead and the second electrode lead are fixed to the front side of the substrate by a die attach adhesive containing graphene or hexagonal boron nitride, the LED chips are electrically connected to the first electrode lead and the second electrode lead in series by the wires, and the phosphor encapsulates the LED chips therein and exposes the first electrode lead and the second electrode lead.

7. The structure of the led filament bulb as claimed in claim 6, wherein the substrate of the led filament comprises: any one of a metal substrate, a ceramic substrate, a glass substrate, and a plastic substrate.

8. The structure of the led filament bulb as claimed in claim 6, wherein the substrate of the led filament comprises: any one of a metal substrate, a bendable ceramic substrate, a bendable glass substrate, and a plastic substrate.

9. The led filament bulb construction of claim 1, wherein the led filament comprises any one of a straight led filament and a bent led filament and combinations thereof.

10. The structure of the led filament bulb as claimed in claim 1, wherein a power controller is disposed in the lamp holder, the power controller being electrically connected to the lamp holder for converting the electrical energy provided by an external power source into driving power for driving the led filament.

11. The led filament bulb construction of claim 1, wherein the radiant heat film is formed by applying a radiant heat-dissipating ink to the back side of the substrate using any one of spraying, brushing, screen printing, and nozzle printing, the radiant heat-dissipating ink comprising: heat dissipation filler, dispersant and adhesive.

12. The structure of the filament bulb of the light emitting diode of claim 11, wherein the heat-dissipating filler is at least one of carbon material, metal particles, ceramic material and far infrared radiation powder, or a mixture of the heat-dissipating fillers.

13. The led filament bulb construction of claim 11, wherein the carbon material comprises at least: any one of graphene, carbon black, graphite, carbon nanotubes and activated carbon, or a mixture of the above carbon materials.

14. The led filament bulb construction of claim 11 wherein the metal particles comprise at least: any one of copper, nickel, zinc, iron, cobalt, silver, gold, platinum and their alloys, or a mixture of the above-mentioned metal particles.

15. The structure of the led filament bulb as set forth in claim 11, wherein the far infrared radiation powder includes at least: any one of silicon dioxide, aluminum oxide, titanium dioxide, zirconium oxide, zirconium carbide, silicon carbide, tantalum carbide, titanium diboride, zirconium diboride, titanium disilicide, silicon nitride, titanium nitride and boron nitride, or a mixture of the above-mentioned various far infrared radiation powders.