CN110798550A

CN110798550A - Electronic device

Info

Publication number: CN110798550A
Application number: CN201910622344.9A
Authority: CN
Inventors: 龚江龙
Original assignee: Realme Chongqing Mobile Communications Co Ltd
Current assignee: Realme Chongqing Mobile Communications Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-02-14

Abstract

The embodiment of the application provides electronic equipment, which comprises a shell, a circuit board and a camera module, wherein the circuit board is arranged on the shell and is provided with a containing space which penetrates through the circuit board in the thickness direction of the circuit board, and the circuit board is provided with a mounting area; the camera module includes two at least cameras, at least one the camera setting is in the accommodation space, at least one the camera sets up on the circuit board, and be located the installing zone. The embodiment of the application can reduce the influence of the camera module on the size of the circuit board.

Description

Electronic device

Technical Field

The present application relates to the field of electronic technologies, and in particular, to an electronic device.

Background

With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. In the using process of the electronic equipment, the electronic equipment can control the camera to take a picture through the mainboard of the electronic equipment.

In the related art, a camera is installed in a housing of an electronic apparatus, and the camera is connected to a main board of the electronic apparatus so that the main board controls the camera. The larger the camera occupies the space inside the electronic device along with the increase of the size of the camera, the larger the camera affects the sizes of devices such as a main board and a battery of the electronic device.

Disclosure of Invention

The embodiment of the application provides an electronic equipment, reduces the influence of camera module to the circuit board size.

An embodiment of the present application provides an electronic device, including:

a housing;

a circuit board disposed on the housing, the circuit board having a receiving space penetrating the circuit board in a thickness direction of the circuit board, the circuit board being provided with a mounting area; and

the camera module comprises at least two cameras, at least one camera is arranged in the accommodating space, and at least one camera is arranged on the circuit board and located in the mounting area.

In the embodiment of the application, when the camera of camera module is a plurality of, can set up at least one camera in the camera module on the circuit board, the installing zone that is provided with the camera on the circuit board still can arrange the circuit. Therefore, the influence of the camera module on the size of the circuit board can be reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a first structural schematic diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a circuit board in the electronic device shown in fig. 1.

Fig. 3 is a rear view of the electronic device shown in fig. 1.

Fig. 4 is a schematic structural diagram of the camera module in the electronic device shown in fig. 3.

Fig. 5 is a schematic structural diagram of a bracket in the camera module shown in fig. 4.

Fig. 6 is a rear view of the bracket shown in fig. 5.

Fig. 7 is a perspective view of the bracket shown in fig. 5.

Fig. 8 is a schematic structural diagram of a second electronic device according to an embodiment of the present application.

Fig. 9 is a third schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

Referring to fig. 1, fig. 1 is a schematic view of a first structure of an electronic device according to an embodiment of the present disclosure. The electronic device 20 may be a computing device such as a laptop computer, a computer monitor containing an embedded computer, a tablet computer, a cellular telephone, a media player, or other handheld or portable electronic devices, smaller devices (such as a wristwatch device, a hanging device, a headset or earpiece device, a device embedded in eyeglasses, or other device worn on the head of a user, or other wearable or miniature devices), a television, a computer display not containing an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which an electronic device with a display is installed in a kiosk or automobile), a device that implements the functionality of two or more of these devices, or other electronic devices. In the exemplary configuration of fig. 1, the electronic device 20 is a portable device, such as a cellular telephone, media player, tablet, or other portable computing device. Other configurations may be used for the electronic device 20, if desired. The example of fig. 1 is merely exemplary.

As shown in fig. 1, the electronic device 20 includes a housing such as housing 200. The housing 200 may be formed from plastic, glass, ceramic, fiber composite, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials. The housing body 200 may be formed using a one-piece configuration in which some or all of the housing body 200 is machined or molded as a single structure, or may be formed using multiple structures (e.g., an inner frame structure, one or more structures that form an outer shell surface, etc.).

The housing 200 may serve as a carrier for the electronic device 20 and may carry components of the electronic device 20.

As shown in fig. 1, the electronic device 20 may also include a circuit board such as circuit board 400. The circuit board 400 may serve as a main board of the electronic device 20, and the circuit board 400 may integrate a processor, a memory, a camera, and the like. The memory of the electronic device 20 may store various computer programs and data of the electronic device 20, such as audio data, communication data, and the like. The processor of the electronic device 20 may be a control center of the electronic device 20, and various interfaces and lines may be used to connect various parts of the whole electronic device 20, and various functions of the electronic device 20 and process data may be performed by running or calling a computer program stored in the memory, and calling data stored in the memory, thereby performing overall monitoring of the electronic device. Such as a processor that may control a camera of the electronic device 20 to take pictures, etc.

As shown in fig. 2, fig. 2 is a schematic structural diagram of a circuit board in the electronic device shown in fig. 1. A plurality of functional devices of the electronic apparatus 20, such as cameras, sensors, etc., may be integrated on the circuit board 400. In some embodiments, one or more mounting areas, such as mounting area 440, may be provided on circuit board 400. The mounting area 440 may mount various functional devices of the electronic device 20, such as a camera. In some embodiments, one or more receiving spaces such as receiving space 420 may also be provided on circuit board 400. The receiving space 420 may receive a functional device of the electronic apparatus 20, or the receiving space 420 may avoid a functional device of the electronic apparatus 20, such as a camera.

The receiving space 420 may be a notch or a groove formed at an edge of the circuit board 400. The receiving space 420 may also be a through hole or a hollow hole penetrating through the circuit board 400 in the thickness direction of the circuit board 400. Wherein the mounting region 440 may route the circuit board 400.

It is understood that the mounting region 440 and the receiving space 420 on the electronic device 400 may be disposed spaced apart from each other. It should be noted that one of the mounting areas 440 and one of the receiving spaces 420 on the electronic device 400 may be disposed adjacent to each other.

Referring to fig. 3, fig. 3 is a rear view of the electronic device shown in fig. 1. The electronic device 20 may also include a camera module 40. The camera module 40 may be disposed on the housing 200 of the electronic device 20, such as the camera module 40 may be disposed at a rear cover position of the housing 200, and the camera module 40 may serve as a rear camera of the electronic device 20. The camera module 40 may also be a front camera of the electronic device 20, and the camera module 40 may be disposed at a display position of the electronic device 20.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a camera module in the electronic device shown in fig. 3. The camera module 40 may include at least two cameras. At least one camera is disposed on the circuit board 400, such as at least one camera may be disposed on the mounting region 440 of the circuit board 400. At least one camera may be disposed in the receiving space 420 opened on the circuit board 400.

It will be appreciated that, in general, the function of each of the plurality of cameras of the camera module 40 will vary, as will the size of each camera. Such as some cameras in the camera module 40 having a higher height and some cameras having a lower height. The embodiment of the application can set the camera with higher height in the accommodating space 420 opened on the circuit board 400, and can set the camera with lower height in the mounting area 440 on the circuit board 400. The thickness of the circuit board 400 and the camera module 40 stacked on each other can be reduced as compared with mounting all the cameras on the circuit board 400. And the circuit arrangement on the circuit board 400 can be increased compared with the case that all the cameras are installed in the accommodating space 420 formed in the circuit board 400.

It should be noted that, under the condition that the electronic device has more and more functions and more internal components, the space of the circuit board 400 is more and more limited. This application not only can not additionally complete machine electronic equipment 20's thickness on the whole, but also can increase the circuit board size to arrange the circuit, realize more functions and the control of circuit board 400.

Camera module 40 may include a first camera 42, a second camera 44, a third camera 46, and a fourth camera 48. Wherein at least one of the first camera 42 and the fourth camera 48 has a height greater than the height of the second camera 44 and the third camera 46. Such as: the height of the first camera 42 is greater than the height of the second camera 44 and the third camera 46, and the height of the fourth camera 48 is substantially equal to the height of the second camera 44 or the third camera 46. For another example: the heights of both first camera 42 and fourth camera 48 are greater than the heights of second camera 44 and third camera 46. Wherein the heights of both the second camera 44 and the third camera 46 are substantially equal. The first camera 42 and the fourth camera 48 may be disposed in the accommodating space 420 formed in the circuit board 400, and the second camera 44 and the third camera 46 may be disposed in the mounting area 46 of the circuit board 400. This is advantageous for the arrangement of the overall height of the camera module 40, and the thickness of the electronic device 20 can be reduced to a greater extent.

The first camera 42 can be used as a main camera of the camera module 40, and is mainly used for taking pictures, such as the first camera 42 is an RGB image capturing camera. The second camera 44 may be a blurring camera of the camera module 40, which performs blurring or blurring on the content in the image captured by the first camera 42, and the pixels of the second camera 44 may be lower than those of the first camera 42. The third camera 46 may be a close-range camera of the camera module 40 for capturing images at a close range, and the pixels of the third camera 46 may be lower than those of the first camera 42. The fourth camera 48 may be a wide-angle camera of the camera module 40, which may increase the shooting angle and content of the main camera 42. It should be noted that the functions of the first camera 42 and the fourth camera 48 may be interchanged. The functional roles of the third camera 46 and the second camera 44 may be interchanged.

It should be noted that the functional role of each camera is not limited to this, and for example, the camera located on the mounting area 440 of the circuit board 400 may be a camera with a lower pixel, such as a camera capable of realizing a low pixel depth of field, a low pixel pitch, and the like. The cameras located in the receiving area 420 of the circuit board 400 may be RGB image capturing or telephoto cameras, etc. It can be understood that the positions of the cameras can be arranged according to actual needs, and the cameras can also cover modules similar to a TOF (time of flight) camera and the like. It will be appreciated that the above description does not constitute a limitation on the type of camera.

Wherein the pixels of the camera head disposed in the receiving area 420 of the circuit board 400 may be about 200 ten thousand. Such as about 200 million pixels for the third camera 46 and about 200 million pixels for the second camera 44. Wherein the pixels of the camera head disposed on the mounting region 440 of the circuit board 400 may be between 800 and 5000. Such as about 4800 million pixels for the first camera 42 and about 800 million pixels for the fourth camera 48.

The pixel size of each camera is not limited to this, and the above pixels of each camera are merely examples, and constitute a limitation on the pixels of each camera.

In some embodiments, the size of first camera 42 may be slightly larger than the size of fourth camera 48, first camera 42 may be disposed between fourth camera 48 and second camera 44, or first camera 42 may be disposed between fourth camera 48 and third camera 46. The main camera of the camera module 40 generally has the largest size, more complicated internal structure and higher optical requirements. The first camera 42 is disposed at the middle position of the camera module 40, so that the first camera 42 can be effectively protected.

It should be noted that, when the camera module 40 includes four cameras, one of the cameras with the highest height may be disposed in the accommodating space 420 of the circuit board 400, and the other three cameras may be disposed on the mounting area 440 of the circuit board 400. It is also possible to dispose the lowest-height camera on the mounting region 440 of the circuit board 400 and the remaining three cameras within the receiving space 420 of the circuit board 400. Of course, the number of cameras of the camera module 40 is not limited to four. Such as the camera module 40, may include two cameras, wherein the higher height is disposed in the receiving space 420 of the circuit board 400, and wherein the lower height is disposed on the mounting area 440 of the circuit board 400. The camera module 40 may further include three cameras, wherein the highest height may be disposed in the receiving space 420 of the circuit board 400, and wherein two cameras having a lower height are disposed on the mounting region 440 of the circuit board 400. It should be noted that, when the number of cameras of the camera module 40 is greater than 5, one or more of the cameras with a higher height may be disposed in the accommodating space 420 of the circuit board 400, and one or more cameras with a lower height may be disposed in the mounting area 440 of the circuit board 400.

The camera module 40 may further include a bracket 600. The stand 600 may serve as a carrier for each camera.

Referring to fig. 5 to 7, fig. 5 is a schematic structural view of a bracket in the camera module shown in fig. 4, fig. 6 is a rear view of the bracket shown in fig. 5, and fig. 7 is a perspective view of the bracket shown in fig. 5. The bracket 600 may include a first bracket part 620 and a second bracket part 640, and the first bracket part 620 and the second bracket part 640 are fixedly connected to each other, and may be formed in an integral manner, such as injection molding. Other means such as welding may also be used.

Wherein the first bracket part 620 may have a height greater than that of the second bracket part 640. A step 660 may be provided between the first and

second bracket parts

620 and 640, or the first and

second bracket parts

620 and 640 may be connected to each other to form the step 660, and the step 660 may include a step surface 662 formed on the first bracket part 620 and a step surface formed on the second bracket part 640.

The first bracket part 620 may be disposed in the receiving space 420 of the circuit board 400, and the second bracket part 640 may be disposed on the mounting region 440 of the circuit board 400. The overall height of the first bracket part 620 may be equal to or slightly greater than the sum of the height of the second bracket part 640 and the thickness of the circuit board 400 at the mounting region 440. Or the height of the stepped surface 662 may be approximately the same as the height of the circuit board 400 at the location of the mounting area 440.

One or more cameras may be provided on the first frame portion 620, such as two cameras, e.g., first camera 42 and fourth camera 48, may be provided on the first frame portion 620. The first frame part 620 may be provided with a receiving groove to receive the camera. Such as the first frame portion 620, is provided with a first receiving groove 622 and a fourth receiving groove 624, the first receiving groove 622 can receive the first camera 42, and the fourth receiving groove 624 can receive the fourth camera 48. The number of the receiving grooves provided in the first frame part 620 is determined according to the number of the cameras mounted on the first frame part 620. That is, one camera provided on the first frame part 620 corresponds to one receiving groove.

One or more cameras may be disposed on second bracket portion 640, such as two cameras, e.g., second camera 44 and third camera 46, may be disposed on second bracket portion 640. The second bracket portion 640 may be provided with a receiving groove for receiving the camera. Such as the second holder portion 640, is provided with a second receiving groove 642 and a third receiving groove 644, the second receiving groove 642 can receive the second camera 44, and the third receiving groove 644 can receive the third camera 46. The number of the receiving grooves provided in the second holder portion 640 is determined by the number of the cameras mounted on the second holder portion 640. That is, one camera provided on the second bracket portion 640 corresponds to one receiving groove.

Referring to fig. 1 to fig. 3, the accommodating space 420 of the circuit board 400 may be a notch structure, and the opening direction thereof may be toward the side of the electronic device 20. When the receiving space 420 has a notch structure, the opening thereof may face in other directions.

Referring to fig. 8, fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 20 shown in fig. 8 differs from the electronic device shown in fig. 1 in that: the receiving space 420 formed in the circuit board 400 may be a notch structure, and an opening of the notch structure may face a top end of the electronic device 20. The top end may be the top end of the display of the electronic device 20.

Referring to fig. 9, fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 20 shown in fig. 9 differs from the electronic device shown in fig. 1 in that: the receiving space 420 formed in the circuit board 400 may be a through hole structure, and the periphery of the through hole structure is defined by a portion of the circuit board 400.

The electronic device provided by the embodiment of the application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An electronic device, comprising:

a housing;

2. The electronic device of claim 1, wherein the camera module comprises a first camera and a second camera, wherein a height of the first camera is greater than a height of the second camera, the first camera is disposed in the receiving space, and the second camera is disposed in the mounting area.

3. The electronic device of claim 2, wherein a sum of a height of the second camera and a thickness of the circuit board at the mounting area is approximately equal to a height of the first camera.

4. The electronic device of claim 3, wherein the camera module further comprises a third camera disposed in the mounting area, and wherein a height of the third camera is substantially equal to a height of the second camera.

5. The electronic device of claim 3, wherein the camera module further comprises a fourth camera disposed in the receiving space, and a height of the fourth camera is less than or equal to a height of the first camera.

6. The electronic device according to any one of claims 1 to 5, wherein the camera module further comprises a stand, the stand comprising a first stand portion and a second stand portion, the first stand portion being disposed in the accommodating space, the second stand portion being disposed in a mounting area, at least one camera being disposed on the first stand portion, and at least one camera being disposed on the second stand portion.

7. The electronic device of claim 6, wherein a step is disposed between the first and second stand portions, the step comprising a first step surface on the first stand portion, the step surface having a height substantially equal to a height of the circuit board at the mounting area.

8. The electronic device of claim 6, wherein the camera module comprises a main camera, a wide-angle camera, a blurring camera and a close-range camera, the first bracket portion is provided with a first mounting hole and a fourth mounting hole, the second bracket portion is provided with a second mounting hole and a third mounting hole, the first mounting hole is used for mounting the main camera, the second mounting hole is used for mounting the blurring camera, the third mounting hole is used for mounting the close-range camera, and the fourth mounting hole is used for mounting the wide-angle camera.

9. The electronic device of claim 8, wherein the first mounting hole is a rectangular hole, and the second, third, and fourth mounting holes are circular holes.

10. The electronic apparatus according to any one of claims 1 to 5, wherein pixels of the camera disposed in the housing space are larger than pixels of the camera disposed on the mounting area.

11. The electronic apparatus according to any one of claims 1 to 5, wherein the housing space includes a through hole provided on the circuit board; or

The accommodating space comprises a notch arranged on the circuit board.