CN110776819A - Graphene heat dissipation coating for electronic and electric appliances - Google Patents
Graphene heat dissipation coating for electronic and electric appliances Download PDFInfo
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- CN110776819A CN110776819A CN201911175695.6A CN201911175695A CN110776819A CN 110776819 A CN110776819 A CN 110776819A CN 201911175695 A CN201911175695 A CN 201911175695A CN 110776819 A CN110776819 A CN 110776819A
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- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
- C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
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- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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Abstract
The invention discloses a graphene heat-dissipation coating for electronic and electric appliances, which comprises the following raw material components in percentage by mass: 35-55% of water-soluble resin, 5-15% of graphene oxide, 2-4% of nano boron nitride, 1-3% of carbon nano tube, 3-7% of filler, 0.6-2.2% of graphene dispersant, 0.5-1.5% of water-based flatting agent, 0.6-1.2% of water-based defoaming agent and the balance of water, wherein the sum of the contents of the raw materials is 100%. The invention has the beneficial effects that: the graphene with high thermal conductivity is used as a heat conduction and dissipation medium, so that a good heat conduction and dissipation effect is achieved; the water-based emulsion is used as a film forming material of the coating, and has the advantages of good weather resistance, good adhesion, high strength, high temperature resistance, high electrical insulation performance and the like; the water is used as the solvent, so that the method has the characteristics of low price and environmental friendliness, and the water is used as the solvent, does not need to be added with a curing agent, can be quickly dried at normal temperature, and has the characteristic of low energy consumption.
Description
Technical Field
The invention belongs to the technical field of heat dissipation coatings, and particularly relates to a graphene heat dissipation coating for electronic and electric appliances.
Background
It is known that electronic and electrical components generate much heat during operation, and the accumulation of heat in the interior of the equipment greatly reduces the performance and the service life of the electronic components. According to relevant statistics, the following steps are shown: the reliability of the electronic components is reduced by 10 percent when the temperature of the electronic components is increased by 2 ℃. In the prior art, a layer of heat dissipation coating is usually coated on the surface of a heat source to improve the heat dissipation performance of an object, and the heat dissipation coating is low in cost, convenient to operate and widely applied.
The traditional heat dissipation coating comprises organic silicon resin, epoxy resin, phenolic resin, acrylic acid, polyurethane and the like, has a good heat conduction effect, but has a series of environmental pollution problems, along with increasingly strict national environmental protection requirements, more environment-friendly and efficient water-based heat dissipation coatings appear in the market, but how to ensure the environment protection and improve the heat conduction and heat dissipation effects and simultaneously improve the basic performances of the coating such as adhesive force, hardness and impact resistance is a hotspot of research in the field of water-based coatings.
Graphene is a single-layer sheet structure composed of carbon atoms, has the characteristics of high strength, large specific surface area and high infrared emissivity, has a thermal conductivity as high as 5300W/m.K, and is considered as the best heat transfer material so far, about 5 times that of diamond and 10 times that of copper in terms of thermal performance. However, due to the characteristics of easy agglomeration and high conductivity of graphene caused by the high specific surface area of graphene, the graphene is easy to precipitate in the heat dissipation coating, and the heat dissipation effect of the product is influenced.
Disclosure of Invention
The invention aims to provide a graphene heat dissipation coating for electronic and electric appliances, and solves the problem that the graphene heat dissipation coating in the prior art is poor in heat dissipation.
The invention adopts the technical scheme that the graphene heat dissipation coating for the electronic and electric appliances is composed of the following raw material components in percentage by mass: 35-55% of water-soluble resin, 5-15% of graphene oxide, 2-4% of nano boron nitride, 1-3% of carbon nano tube, 3-7% of filler, 0.6-2.2% of graphene dispersant, 0.5-1.5% of water-based flatting agent, 0.6-1.2% of water-based defoaming agent and the balance of water, wherein the sum of the contents of the raw materials is 100%.
The invention is also characterized in that:
40-48% of water-soluble resin, 6-9% of graphene oxide, 3-3.5% of nano boron nitride, 1-2% of carbon nano tube, 5-6% of filler, 1-1.5% of graphene dispersant, 0.5-1.0% of water-based flatting agent, 0.8-1.2% of water-based defoaming agent and the balance of water, wherein the sum of the contents of the raw materials is 100%.
The oxygen content of oxygen-containing groups on the surface of the graphene oxide is 40-50%, the content of a single layer after dissolution is more than 99%, the size of a microchip is 0.5-2 mu m, and the thickness is 0.35-1.20 nm.
The graphene dispersing agent is a mixture of melamine and concentrated hydrochloric acid, wherein the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.2-0.4: 1.
The water-soluble resin is at least one of water-based polyurethane emulsion, water-based epoxy emulsion, water-based acrylic resin, water-based amino resin and water-based organic silicon resin.
The filler is one or more of silicon carbide, barium sulfate and zinc oxide.
The water-based defoaming agent is any one of emulsified silicone oil, organic siloxane and polyoxypropylene glycerol ether.
The invention has the beneficial effects that: the graphene with high thermal conductivity is used as a heat conduction and dissipation medium, so that a good heat conduction and dissipation effect is achieved; the water-based emulsion is used as a film forming material of the coating, and has the advantages of good weather resistance, good adhesion, high strength, high temperature resistance, high electrical insulation performance and the like; the water is used as the solvent, so that the method has the characteristics of low price and environmental friendliness, and the water is used as the solvent, does not need to be added with a curing agent, can be quickly dried at normal temperature, and has the characteristic of low energy consumption.
Detailed Description
The present invention will be described in detail with reference to the following embodiments.
The invention relates to a graphene heat dissipation coating for electronic and electric appliances, which comprises the following raw material components in percentage by mass: 35-55% of water-soluble resin, 5-15% of graphene oxide, 2-4% of nano boron nitride, 1-3% of carbon nano tube, 3-7% of filler, 0.6-2.2% of graphene dispersant, 0.5-1.5% of water-based flatting agent, 0.6-1.2% of water-based defoaming agent and the balance of water, wherein the sum of the contents of the raw materials is 100%.
Preferably, 40-48% of water-soluble resin, 6-9% of graphene oxide, 3-3.5% of nano boron nitride, 1-2% of carbon nano tube, 5-6% of filler, 1-1.5% of graphene dispersing agent, 0.5-1.0% of water-based leveling agent, 0.8-1.2% of water-based defoaming agent and the balance of water, wherein the sum of the contents of the raw materials is 100%.
Preferably, the oxygen content of oxygen-containing groups on the surface of the graphene oxide is 40-50%, the content of a single layer after dissolution is more than 99%, the size of a microchip is 0.5-2 μm, and the thickness is 0.35-1.20 nm.
Preferably, the graphene dispersing agent is a mixture of melamine and concentrated hydrochloric acid, wherein the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.2-0.4: 1.
Preferably, the water-soluble resin is at least one of an aqueous polyurethane emulsion, an aqueous epoxy emulsion, an aqueous acrylic resin, an aqueous amino resin and an aqueous silicone resin.
Preferably, the filler is a combination of one or more of silicon carbide, barium sulfate and zinc oxide.
Preferably, the aqueous defoaming agent is any one of silicone emulsion, organosiloxane and polyoxypropylene glycerol ether.
Example 1
The graphene heat-dissipation coating for the electronic and electric devices comprises the following raw material components in percentage by mass: 35% of water-soluble resin, 10% of graphene oxide, 4% of nano boron nitride, 3% of carbon nano tube, 7% of filler, 1.8% of graphene dispersant, 1.0% of aqueous leveling agent, 0.8% of aqueous defoaming agent and 36.4% of water.
Wherein, the oxygen content of the oxygen-containing group on the surface of the graphene oxide is 40%, the content of a single layer after dissolution is more than 99%, the size of a microchip is 0.5 μm, and the thickness is 0.35 nm; the graphene dispersing agent is a mixture of melamine and concentrated hydrochloric acid, wherein the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.2: 1; the water-soluble resin is a mixture of aqueous polyurethane emulsion and aqueous epoxy emulsion; the filler is barium sulfate; the water-based defoaming agent is emulsified silicone oil.
Example 2
The graphene heat-dissipation coating for the electronic and electric devices comprises the following raw material components in percentage by mass: 40% of water-soluble resin, 15% of graphene oxide, 3% of nano boron nitride, 2% of carbon nano tube, 6% of filler, 2.2% of graphene dispersant, 1.5% of aqueous leveling agent, 0.6% of aqueous defoaming agent and 29.7% of water.
Wherein, the oxygen content of the oxygen-containing group on the surface of the graphene oxide is 43%, the content of a single layer after dissolution is more than 99%, the size of a microchip is 1.0 μm, and the thickness is 1.20 nm; the graphene dispersing agent is a mixture of melamine and concentrated hydrochloric acid, wherein the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.3: 1; the water-soluble resin is water-based acrylic resin; the filler is a composition of barium sulfate and zinc oxide; the water-based defoaming agent is polyoxypropylene glycerol ether.
Example 3
The graphene heat-dissipation coating for the electronic and electric devices comprises the following raw material components in percentage by mass: 45% of water-soluble resin, 7% of graphene oxide, 2% of nano boron nitride, 1% of carbon nano tube, 5% of filler, 0.6% of graphene dispersant, 0.5% of water-based leveling agent, 1.0% of water-based defoaming agent and 37.9% of water.
Wherein, the oxygen content of the oxygen-containing group on the surface of the graphene oxide is 46%, the content of a single layer after dissolution is more than 99%, the size of a microchip is 1.5 μm, and the thickness is 0.70 nm; the graphene dispersing agent is a mixture of melamine and concentrated hydrochloric acid, wherein the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.4: 1; the water-soluble resin is a mixture of water-based amino resin and water-based organic silicon resin; the filler is barium sulfate; an aqueous defoamer organosiloxane.
Example 4
The graphene heat-dissipation coating for the electronic and electric devices comprises the following raw material components in percentage by mass: 50% of water-soluble resin, 12% of graphene oxide, 3% of nano boron nitride, 3% of carbon nano tube, 4% of filler, 1.0% of graphene dispersant, 0.8% of water-based leveling agent, 1.2% of water-based defoaming agent and 25% of water.
Wherein, the oxygen content of the oxygen-containing group on the surface of the graphene oxide is 48%, the content of a single layer after dissolution is more than 99%, the size of a microchip is 2 μm, and the thickness is 1.0 nm; the graphene dispersing agent is a mixture of melamine and concentrated hydrochloric acid, wherein the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.25: 1; the water-soluble resin is a composition of aqueous polyurethane emulsion and aqueous organic silicon resin; the filler is zinc oxide; the water-based defoaming agent is emulsified silicone oil.
Example 5
The graphene heat-dissipation coating for the electronic and electric devices comprises the following raw material components in percentage by mass: 55% of water-soluble resin, 5% of graphene oxide, 2% of nano boron nitride, 2% of carbon nano tube, 3% of filler, 1.5% of graphene dispersant, 1.2% of water-based leveling agent, 0.6% of water-based defoaming agent and 29.7% of water.
Wherein, the oxygen content of the oxygen-containing group on the surface of the graphene oxide is 50%, the content of a single layer after dissolution is more than 99%, the size of a microchip is 0.5 μm, and the thickness is 0.6 nm; the graphene dispersing agent is a mixture of melamine and concentrated hydrochloric acid, wherein the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.35: 1; the water-soluble resin is a composition of aqueous polyurethane emulsion, aqueous epoxy emulsion and aqueous acrylic resin; the filler is a composition of silicon carbide and barium sulfate; the water-based defoaming agent is emulsified silicone oil.
Claims (7)
1. The graphene heat-dissipation coating for the electronic and electric devices is characterized by comprising the following raw material components in percentage by mass: 35-55% of water-soluble resin, 5-15% of graphene oxide, 2-4% of nano boron nitride, 1-3% of carbon nano tube, 3-7% of filler, 0.6-2.2% of graphene dispersant, 0.5-1.5% of water-based flatting agent, 0.6-1.2% of water-based defoaming agent and the balance of water, wherein the sum of the contents of the raw materials is 100%.
2. The graphene heat dissipation coating for electronic and electric appliances as claimed in claim 1, wherein the water-soluble resin comprises 40% to 48%, graphene oxide comprises 6% to 9%, nano boron nitride comprises 3% to 3.5%, carbon nanotubes comprise 1% to 2%, a filler comprises 5% to 6%, a graphene dispersant comprises 1% to 1.5%, a water-based leveling agent comprises 0.5% to 1.0%, a water-based defoaming agent comprises 0.8% to 1.2%, and the balance is water, and the sum of the raw materials is 100%.
3. The graphene heat dissipation coating as claimed in claim 1, wherein the oxygen content of oxygen-containing groups on the surface of the graphene oxide is 40-50%, the content of a single layer after dissolution is more than 99%, the size of the micro-sheet is 0.5-2 μm, and the thickness is 0.35-1.20 nm.
4. The graphene heat dissipation coating for the electronic and electric devices as claimed in claim 1, wherein the graphene dispersant is a mixture of melamine and concentrated hydrochloric acid, and the dosage ratio of the melamine to the concentrated hydrochloric acid is 0.2-0.4: 1.
5. The graphene heat-dissipation coating for electronic and electrical appliances according to claim 1, wherein the water-soluble resin is at least one of an aqueous polyurethane emulsion, an aqueous epoxy emulsion, an aqueous acrylic resin, an aqueous amino resin and an aqueous silicone resin. .
6. The graphene heat dissipation coating for electronic and electrical appliances according to claim 1, wherein the filler is a composition of one or more of silicon carbide, barium sulfate and zinc oxide.
7. The graphene heat-dissipating coating for electronic and electrical appliances according to claim 1, wherein the aqueous defoaming agent is any one of silicone emulsion, organosiloxane, and polyoxypropylene glycerol ether.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911175695.6A CN110776819A (en) | 2019-11-26 | 2019-11-26 | Graphene heat dissipation coating for electronic and electric appliances |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416452A (en) * | 2021-06-22 | 2021-09-21 | 广东鑫皇冠新材料有限公司 | Heat-conducting and heat-dissipating water-soluble fluoride coating and preparation method thereof |
| CN113817395A (en) * | 2021-09-29 | 2021-12-21 | 江阴市新万沅机件有限公司 | Antirust high-surface-quality refrigerator quick-cooling disc stamping part and machining process thereof |
| CN116376417A (en) * | 2023-04-06 | 2023-07-04 | 金华市美林涂料有限公司 | Water-based paint and preparation method thereof |
| CN117229703A (en) * | 2023-09-27 | 2023-12-15 | 国网浙江省电力有限公司电力科学研究院 | Conductive coating and preparation method and application thereof |
| WO2024041389A1 (en) * | 2022-08-24 | 2024-02-29 | 中国电力科学研究院有限公司 | Aqueous high-thermal-conductivity anticorrosive paint and production method therefor |
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| CN107384148A (en) * | 2017-07-24 | 2017-11-24 | 宁波墨西科技有限公司 | Graphene-based heat radiation coating and preparation method thereof |
| CN110256894A (en) * | 2019-06-18 | 2019-09-20 | 安徽工大化工科技有限公司 | A kind of modified graphene and preparation method thereof, a kind of watersoluble plumbago alkene heat radiation coating and preparation method thereof |
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| CN104804618A (en) * | 2014-01-24 | 2015-07-29 | 江苏联科纳米科技有限公司 | Aqueous heat dissipation coating and preparation method thereof |
| CN107384148A (en) * | 2017-07-24 | 2017-11-24 | 宁波墨西科技有限公司 | Graphene-based heat radiation coating and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416452A (en) * | 2021-06-22 | 2021-09-21 | 广东鑫皇冠新材料有限公司 | Heat-conducting and heat-dissipating water-soluble fluoride coating and preparation method thereof |
| CN113817395A (en) * | 2021-09-29 | 2021-12-21 | 江阴市新万沅机件有限公司 | Antirust high-surface-quality refrigerator quick-cooling disc stamping part and machining process thereof |
| WO2024041389A1 (en) * | 2022-08-24 | 2024-02-29 | 中国电力科学研究院有限公司 | Aqueous high-thermal-conductivity anticorrosive paint and production method therefor |
| CN116376417A (en) * | 2023-04-06 | 2023-07-04 | 金华市美林涂料有限公司 | Water-based paint and preparation method thereof |
| CN116376417B (en) * | 2023-04-06 | 2024-07-16 | 金华市美林涂料有限公司 | Water-based paint and preparation method thereof |
| CN117229703A (en) * | 2023-09-27 | 2023-12-15 | 国网浙江省电力有限公司电力科学研究院 | Conductive coating and preparation method and application thereof |
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Application publication date: 20200211 |