CN110776706A - Method for manufacturing CPU heat dissipation material by heat absorption, heat transfer and radiation combined mechanism - Google Patents
Method for manufacturing CPU heat dissipation material by heat absorption, heat transfer and radiation combined mechanism Download PDFInfo
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Abstract
The invention discloses a heat absorption and heat transfer radiation composite mechanism CPU heat dissipation material and a manufacturing method thereof, wherein the heat dissipation material consists of three parts: the matrix part is 55 to 80 parts by weight of P (VDF-TrFE) copolymer with honeycomb multi-channel through holes inside, and the filler part is a blend which is solidified inside the matrix part and comprises 15 to 20 parts by weight of polymethyl methacrylate, 25 to 35 parts by weight of ethylene-vinyl acetate and 15 to 25 parts by weight of graphite powder; the graphene film layer is also attached to the outer surface, and the water contact angle of the film layer is 118-123 degrees, and the thermal conductivity is 4800W/m.K-5300W/m.K. The invention has hydrophobic surface, large specific surface area, quick heat dissipation, coexistence of multiple heat dissipation modes and double radiation of the whole heat dissipation efficiency.
Description
Technical Field
The invention relates to the technical field of heat dissipation materials for electric devices, in particular to a manufacturing method of a CPU heat dissipation material of a heat absorption and heat transfer radiation compound mechanism.
Background
At present, any radiator in the market only utilizes one or two heat transfer modes, namely two mechanisms of contact heat transfer and heat convection, and simultaneously has a more complex structure and higher material cost, so that the use and popularization of a high-performance CPU are restricted. The problem of limit of heat dissipation efficiency exists, no matter how exquisite the heat dissipation structure is designed, the CPU radiator is limited by the materials, and the limit of heat dissipation efficiency exists, so that for the CPU with top performance and higher power consumption, the CPU radiator is replaced by a complex radiator with higher price, poorer reliability and more difficult maintenance, or replaced by a high-cost heat conduction material with higher heat transfer efficiency; finally, the heat dissipation efficiency is seriously affected by the excessive thickness of the accumulated dust, which is easily absorbed and accumulated by the water and oil substances in the air as the service life is prolonged due to the complexity of the conventional heat dissipation structure.
Therefore, a manufacturing method of a heat absorption and transfer radiation composite mechanism CPU heat dissipation material with hydrophobic surface, large specific surface area, quick heat dissipation, coexistence of multiple heat dissipation modes and double radiation enhancement of the whole heat dissipation efficiency is urgently needed in the market.
Disclosure of Invention
The invention aims to provide a method for manufacturing a CPU heat dissipation material of a heat absorption and heat transfer radiation compound mechanism, which has hydrophobic surface, large specific surface area, quick heat dissipation, coexistence of multiple heat dissipation modes and double radiation enhancement of the whole heat dissipation efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme: a method for manufacturing a CPU heat dissipation material by a heat absorption and heat transfer radiation compound mechanism comprises the following steps:
1) raw material preparation
① raw material preparation, which comprises preparing 135-140 parts of concentrated sulfuric acid, 6-8 parts of activated carbon powder, 16-17 parts of potassium permanganate, 40-50 parts of vinylidene fluoride, 30-40 parts of trifluoroethylene, 25-30 parts of methyl methacrylate, 15-18 parts of vinyl acetate, 25-30 parts of ethylene, 0.15-0.25 part of azodiisobutyronitrile initiator, 20-25 parts of graphite powder and 0.1-0.2 part of Guel gum by weight;
② preparing tool, preparing cylindrical glass heating container with vent holes with aperture of 0.3-0.5 mm, ejection angle of 60 ° to the bottom and clockwise distribution of ejection angle along the tangential direction of the circumference of the vent hole, wherein the vent holes are uniformly arranged at the bottom of the container according to 1-1.5 mm grid gaps;
2) liquid bulk polymerization
① mixing 0.05-0.07 part of azodiisobutyronitrile initiator prepared in step ① of stage 1) with all methyl methacrylate, vinyl acetate and graphite powder and stirring uniformly to obtain a mixture A;
② putting the mixture A obtained in step ① into a stainless steel high-pressure reaction kettle, vacuumizing, filling nitrogen, boosting the pressure to 3.5-3.8 MPa, heating to 55-60 ℃, and continuously stirring at a stirring speed of 120-150 rpm/min to obtain a to-be-reacted pool;
③, continuously and slowly introducing the ethylene prepared in the step ① in the stage 1) into the reaction tank to be reacted obtained in the step ②, continuously preserving heat and pressure for 5-8 min after all the ethylene is introduced, then releasing the pressure to 2.4-2.5 MPa, completely releasing the pressure after the furnace is cooled to the room temperature, and discharging to obtain a component A;
3) gas suspension polymerization
①, preparing enough deionized water, and uniformly stirring the guar gum prepared in the step ① in the stage 1) and the rest of azobisisobutyronitrile initiator with the deionized water to obtain a reaction medium;
② putting the reaction medium obtained in step ① into a stainless steel high-pressure reaction kettle, vacuumizing, filling nitrogen, increasing the pressure to 3.5-3.8 MPa, heating to 55-60 ℃, and continuously stirring at a stirring speed of 120-150 rpm/min to obtain a solution for later use;
③ continuously, slowly and uniformly introducing the vinylidene fluoride and the trifluoroethylene prepared in the step ① of the stage 1) into the solution to be used, continuously preserving heat and maintaining pressure for 5min to 8min after introduction is finished, then releasing pressure to 2.4MPa to 2.5MPa, completely releasing pressure after the furnace is cooled to room temperature, discharging, and evaporating to remove water to obtain a component B;
4) forming heat-dissipating materials
① mechanically cutting the component A obtained in stage 2) step ③ into granules with the grain diameter of 1mm-2mm to obtain granules A;
② placing the component B obtained in step ③ in step 3) of stage 1) of the cylindrical glass heating vessel prepared in step ②, heating until the component B is completely melted to obtain a molten pool B;
③, putting the particles A obtained in the step ① into the molten pool B of the step ②, fully stirring uniformly, stopping heating, opening gas injection holes at the bottom of a cylindrical glass heating container, and continuously injecting nitrogen at the pressure of 3-4 MPa until the molten pool is completely cooled to obtain a crude heat dissipation material block;
④, machining the crude radiating material block obtained in step ③ into a shape with the bottom corresponding to the upper surface of the CPU and the top corresponding to the radiating fan to obtain a prefabricated composite radiating material;
⑤, heating the prefabricated composite heat dissipation material obtained in the step ④ to 120-130 ℃, then rinsing the surface of the heated heat dissipation material by using sufficient ethanol, and evaporating the attached ethanol to obtain the composite heat dissipation material to be treated;
5) preparation of surface-modified Dispersion
① an ice bath pool composed of ice-water mixture;
② uniformly mixing concentrated sulfuric acid, activated carbon powder and deionized water 800-900 parts prepared in the step ① in the step 1), then putting the mixture into a glass container, then immersing the container into an ice bath prepared in the step ①, keeping the solution inside and outside the container isolated, mechanically stirring for 2.5-3 h at the stirring speed of 30-35 rpm/min, then slowly and uniformly putting the potassium permanganate prepared in the step ① in the step 1) into the container at the adding speed of 5% of the total weight per minute, and continuously stirring for 90-100 min at the stirring speed of 15-20 rpm/min to obtain a low-temperature reaction solution;
③ immersing a glass container containing low-temperature reaction solution in a warm water bath with constant water temperature of 36-38 deg.C, keeping the solution inside and outside the container isolated, stirring at a stirring speed of 120-150 rpm/min for 80-90 min to obtain medium-temperature reaction solution;
④ immersing a glass container containing the medium temperature reaction solution in a high temperature bath with the constant water temperature of 95-97 ℃, keeping the solution inside and outside the container isolated, slowly and uniformly injecting 250-300 parts by weight of deionized water into the container at the addition rate of 5%/min of the total weight of the container, and then standing for 45-50 min to obtain the high temperature reaction solution;
⑤ injecting 450-500 parts by weight of deionized water into the glass container containing the high temperature reaction solution again, centrifuging and washing until the pH value of the reaction product C is 6.5-7.5 to obtain a product dispersion liquid;
6) radiator preparation
① putting the product dispersion liquid obtained in the step ⑤ of the stage 5) into a spraying container with a nozzle diameter of 0.2mm-0.5mm to obtain a dispersion liquid sprayer;
②, uniformly and completely spraying the dispersion liquid by a sprayer on the outer surface of the composite heat dissipation material to be processed obtained in the step ⑤ in the stage 4), naturally drying, and processing the dried dispersion liquid by adopting flash with the irradiation intensity of GN/M being 30-35 and the irradiation time of 1ms, thus obtaining the heat dissipation material of the CPU of the required heat absorption and heat transfer radiation composite mechanism.
A heat absorption and heat transfer radiation composite mechanism CPU heat dissipation material is composed of three parts: the matrix part is 55 to 80 parts by weight of P (VDF-TrFE) copolymer with honeycomb multi-channel through holes inside, and the filler part is a blend which is solidified inside the matrix part and comprises 15 to 20 parts by weight of polymethyl methacrylate, 25 to 35 parts by weight of ethylene-vinyl acetate and 15 to 25 parts by weight of graphite powder; the graphene film layer is also attached to the outer surface, and the water contact angle of the film layer is 118-123 degrees, and the thermal conductivity is 4800W/m.K-5300W/m.K.
Compared with the prior art, the invention has the following advantages: (1) as the graphene on the surface layer of the invention has high self-heat-conducting efficiency, the invention can additionally improve the overall heat-radiating efficiency of 120W/mK-150W/mK (the heat-radiating structure cured with the film layer of the invention is calculated integrally) on the basis of the heat-radiating efficiency of the original matrix heat-radiating material only by the film layer. (2) After the film layer is subjected to flash treatment, an irregular undulating structure can be formed on the surface of the film layer, the specific surface area of the film layer in contact with air is obviously increased, and the heat dissipation efficiency is further improved. (3) After the film layer is cured and flash-treated, the water contact angle is 118-123 degrees, the film layer has good hydrophobic property, the surface of the heat dissipation structure can be kept clean to a certain degree, and the service life and the stability of the film layer are improved. (4) The invention adopts a material framework completely different from the prior art, takes the high-temperature resistant polymer P (VDF-TrFE) copolymer with certain piezoelectric property as a matrix, part of graphite powder for improving the whole heat transfer performance, part of polymethyl methacrylate with the softening point of about 80 ℃ and a large amount of ethylene-vinyl acetate (EVA) with the melting point of about 60 ℃ are filled in the heat transfer material, therefore, it is obvious that the invention not only utilizes the conventional contact heat transfer and heat convection, but also absorbs heat during solid liquefaction, transfers heat after solid liquefaction, and partial heat-to-electricity conversion function brought by piezoelectric material [ P (VDF-TrFE) has better piezoelectric performance ] (therefore, the invention can also add wires on both sides of the heat dissipation block, and is combined with the case design for supplying power to the decorative light emitting diode). (5) The invention has transparent organic polymer except small amount of graphite powder, so that the invention is transparent and can disperse partial heat by heat radiation. (6) According to the invention, through the final heat treatment at 120-130 ℃, the internal stress obtained during the rapid cooling of the invention is eliminated, so that the structure of the invention is more stable, on the other hand, the low-melting-point substances (polymethyl methacrylate and EVA) and the easily-shedding substance graphite powder with the opening outside the matrix P (VDF-TrFE) are removed through liquefying part of the filler, and finally, the rough structure of the surface of the complex air channel is obtained through the way, so that the specific surface area of the invention is greatly increased. (7) According to the invention, because the gas sprayed out along the 60-degree oblique angle naturally escapes upwards in the viscous liquid to form the complex convoluted passage, most of all sparse holes are through holes and are densely distributed in the integral radiating block, and great convenience is brought to the air cooling efficiency. (8) The invention can obtain nonflammable liquefied P (VDF-TrFE) fluid with extremely high viscosity (obtained by only slightly heating) by melting the bottom by open fire, and then the fluid can be adhered to the surface of a CPU (Central processing Unit) by self without arranging additional adhesive in the middle, so that the heat transfer efficiency is higher, the service life is longer, and the reliability is better. Therefore, the invention has the characteristics of hydrophobic surface, large specific surface area, quick heat dissipation, coexistence of multiple heat dissipation modes and double radiation increase of the whole heat dissipation efficiency.
Detailed Description
Example 1:
① preparing, namely preparing 1350g of concentrated sulfuric acid, 80g of activated carbon powder, 170g of potassium permanganate, 480g of vinylidene fluoride, 320g of trifluoroethylene, 270g of methyl methacrylate, 160g of vinyl acetate, 280g of ethylene, 2g of azodiisobutyronitrile initiator, 220g of graphite powder and 1.4g of Guel adhesive, and preparing a cylindrical glass heating container with vent holes with the hole diameter of 0.3-0.5 mm, the ejection angle of 60 degrees with the bottom surface and the ejection angle of clockwise distribution along the tangential direction of the circumference where the vent holes are located, wherein the vent holes are uniformly and densely arranged at the bottom of the cylindrical glass heating container according to 1-1.5 mm grid gaps;
② mixing and uniformly stirring 0.6g of azodiisobutyronitrile initiator with all methyl methacrylate, vinyl acetate and graphite powder to obtain a mixture A, putting the mixture A into a stainless steel high-pressure reaction kettle, vacuumizing, filling nitrogen, boosting the pressure to 3.6MPa, heating to 55-60 ℃, and continuously stirring at the stirring speed of 130rpm/min to obtain a to-be-reacted pool;
③ introducing ethylene into the reaction tank, keeping temperature and pressure for 5-8 min, releasing pressure to 2.4-2.5 MPa, cooling to room temperature, releasing pressure, and discharging to obtain component A;
④, preparing enough deionized water, uniformly stirring the Guerlan prepared in the step ① in the stage 1), the rest of azodiisobutyronitrile initiator and the deionized water, putting the mixture into a stainless steel high-pressure reaction kettle, vacuumizing the reaction kettle, filling nitrogen into the reaction kettle, boosting the pressure to 3.5-3.8 MPa, heating the reaction kettle to 55-60 ℃, and continuously stirring the mixture at a stirring speed of 120-150 rpm/min to obtain a solution for later use;
⑤ continuously and uniformly introducing vinylidene fluoride and trifluoroethylene into the solution to be used, keeping the temperature and pressure for 5min-8min after the introduction is finished, then releasing the pressure to 2.4MPa-2.5MPa, completely releasing the pressure after the furnace is cooled to room temperature, discharging the material out of the furnace, and evaporating to remove water to obtain a component B;
⑥ cutting the component A into particles with a diameter of 1mm-2mm, getting the particles A, putting the component B into a cylindrical glass heating container, heating to melt completely, getting the melting pool B, putting the particles A into the melting pool B, stirring thoroughly, stopping heating, opening the gas jet hole at the bottom of the cylindrical glass heating container, and continuously jetting nitrogen gas with a pressure of 3MPa-4MPa until the melting pool is completely cooled, getting the rough heat dissipation material block;
⑦ machining the rough block into a shape with the bottom corresponding to the upper surface of the CPU and the top corresponding to the heat dissipation fan, heating the processed block to 120-130 deg.C, rinsing the heated surface with sufficient ethanol, and evaporating off the ethanol to obtain the composite heat dissipation material;
⑧ mixing concentrated sulfuric acid, activated carbon powder, multi-walled carbon nanotubes and 8-9 kg of deionized water uniformly, then loading the mixture into a glass container, immersing the outer surface of the container into an ice-water mixture pool, mechanically stirring the mixture for 3 hours at a stirring speed of 30-35 rpm/min, slowly and uniformly adding potassium permanganate into the low-temperature pre-reaction pool obtained in the step ② at an addition rate of 8.5g/min in total weight, and continuously stirring the mixture for 90-100 minutes at a stirring speed of 15-20 rpm/min after the adding is finished to obtain a low-temperature reaction solution;
⑨ immersing the glass container containing low-temperature reaction solution in a warm water bath with constant water temperature of 36-38 deg.C, stirring at 120-150 rpm/min for 80-90 min to obtain intermediate-temperature reaction solution, immersing the glass container containing intermediate-temperature reaction solution in a high-temperature bath with constant water temperature of 95-97 deg.C, slowly and uniformly injecting 2.8kg deionized water into the intermediate-temperature reaction solution at 140g/min per se, standing for 45-50 min to obtain high-temperature reaction solution
⑩ injecting 4.8kg deionized water into the high temperature reaction solution again, centrifugally washing until the pH value is 6.5-7.5 to obtain product dispersion liquid, loading the product dispersion liquid into a spray container with a nozzle diameter of 0.2-0.5 mm to obtain a dispersion liquid sprayer, uniformly and completely spraying the dispersion liquid sprayer on the outer surface of a CPU heat dissipation structure sold in the market when in use, and treating the dried dispersion liquid by adopting a flash with the irradiation intensity GN/M of 30-35 and the irradiation time of 1ms after natural drying to obtain the CPU heat dissipation structure with the heat dissipation efficiency improved by the required stereo structure carbon nano tube and graphene composite CPU heat dissipation material.
The embodiment has multiple heat dissipation mechanisms, large specific surface area, low noise, two solid-liquid conversion temperature control defense lines at 50-60 ℃ and 80-90 ℃, integral thermal conductivity of 320W/mK-450W/mK, surface water contact angle of 118-123 degrees, good reliability and the following characteristics.
Example 2:
the whole is in accordance with example 1, with the difference that:
① preparing, namely preparing 1400g of concentrated sulfuric acid, 60g of activated carbon powder, 160g of potassium permanganate, 500g of vinylidene fluoride, 300g of trifluoroethylene, 250g of methyl methacrylate, 150g of vinyl acetate, 250g of ethylene, 1.5g of azodiisobutyronitrile initiator, 200g of graphite powder and 1g of Guel gum, and preparing a cylindrical glass heating container with vent holes with the hole diameter of 0.3-0.5 mm, the ejection angle of 60 degrees with the bottom surface and the ejection angle of clockwise distribution along the tangential direction of the circumference where the vent holes are located, wherein the vent holes are uniformly and densely arranged at the bottom of the cylindrical glass heating container according to 1-1.5 mm grid gaps;
② mixing and uniformly stirring 0.5g of azodiisobutyronitrile initiator with all methyl methacrylate, vinyl acetate and graphite powder to obtain a mixture A, putting the mixture A into a stainless steel high-pressure reaction kettle, vacuumizing, filling nitrogen, boosting the pressure to 3.5MPa, heating to 55-60 ℃, and continuously stirring at a stirring speed of 120rpm/min to obtain a reaction tank;
example 3:
the whole is in accordance with example 1, with the difference that:
① preparing, namely preparing 1400g of concentrated sulfuric acid, 60g of activated carbon powder, 160g of potassium permanganate, 400g of vinylidene fluoride, 400g of trifluoroethylene, 300g of methyl methacrylate, 180g of vinyl acetate, 300g of ethylene, 2.5g of azodiisobutyronitrile initiator, 250g of graphite powder and 2g of Guel gum, and preparing a cylindrical glass heating container with vent holes with the hole diameter of 0.3-0.5 mm, the ejection angle of 60 degrees with the bottom surface and the ejection angle of clockwise distribution along the tangential direction of the circumference where the vent holes are located, wherein the vent holes are uniformly and densely arranged at the bottom of the cylindrical glass heating container according to 1-1.5 mm grid gaps;
② mixing and uniformly stirring 0.7g of azodiisobutyronitrile initiator with all methyl methacrylate, vinyl acetate and graphite powder to obtain a mixture A, putting the mixture A into a stainless steel high-pressure reaction kettle, vacuumizing, filling nitrogen, boosting the pressure to 3.8MPa, heating to 55-60 ℃, and continuously stirring at the stirring speed of 150rpm/min to obtain a to-be-reacted pool;
the previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (2)
1. A method for manufacturing a CPU heat dissipation material by a heat absorption and heat transfer radiation compound mechanism is characterized by comprising the following steps:
1) raw material preparation
① raw material preparation, which comprises preparing 135-140 parts of concentrated sulfuric acid, 6-8 parts of activated carbon powder, 16-17 parts of potassium permanganate, 40-50 parts of vinylidene fluoride, 30-40 parts of trifluoroethylene, 25-30 parts of methyl methacrylate, 15-18 parts of vinyl acetate, 25-30 parts of ethylene, 0.15-0.25 part of azodiisobutyronitrile initiator, 20-25 parts of graphite powder and 0.1-0.2 part of Guel gum by weight;
② preparing tool, preparing cylindrical glass heating container with vent holes with aperture of 0.3-0.5 mm, ejection angle of 60 ° to the bottom and clockwise distribution of ejection angle along the tangential direction of the circumference of the vent hole, wherein the vent holes are uniformly arranged at the bottom of the container according to 1-1.5 mm grid gaps;
2) liquid bulk polymerization
① mixing 0.05-0.07 part of azodiisobutyronitrile initiator prepared in step ① of stage 1) with all methyl methacrylate, vinyl acetate and graphite powder and stirring uniformly to obtain a mixture A;
② putting the mixture A obtained in step ① into a stainless steel high-pressure reaction kettle, vacuumizing, filling nitrogen, boosting the pressure to 3.5-3.8 MPa, heating to 55-60 ℃, and continuously stirring at a stirring speed of 120-150 rpm/min to obtain a to-be-reacted pool;
③, continuously and slowly introducing the ethylene prepared in the step ① in the stage 1) into the reaction tank to be reacted obtained in the step ②, continuously preserving heat and pressure for 5-8 min after all the ethylene is introduced, then releasing the pressure to 2.4-2.5 MPa, completely releasing the pressure after the furnace is cooled to the room temperature, and discharging to obtain a component A;
3) gas suspension polymerization
①, preparing enough deionized water, and uniformly stirring the guar gum prepared in the step ① in the stage 1) and the rest of azobisisobutyronitrile initiator with the deionized water to obtain a reaction medium;
② putting the reaction medium obtained in step ① into a stainless steel high-pressure reaction kettle, vacuumizing, filling nitrogen, increasing the pressure to 3.5-3.8 MPa, heating to 55-60 ℃, and continuously stirring at a stirring speed of 120-150 rpm/min to obtain a solution for later use;
③ continuously, slowly and uniformly introducing the vinylidene fluoride and the trifluoroethylene prepared in the step ① of the stage 1) into the solution to be used, continuously preserving heat and maintaining pressure for 5min to 8min after introduction is finished, then releasing pressure to 2.4MPa to 2.5MPa, completely releasing pressure after the furnace is cooled to room temperature, discharging, and evaporating to remove water to obtain a component B;
4) forming heat-dissipating materials
① mechanically cutting the component A obtained in stage 2) step ③ into granules with the grain diameter of 1mm-2mm to obtain granules A;
② placing the component B obtained in step ③ in step 3) of stage 1) of the cylindrical glass heating vessel prepared in step ②, heating until the component B is completely melted to obtain a molten pool B;
③, putting the particles A obtained in the step ① into the molten pool B of the step ②, fully stirring uniformly, stopping heating, opening gas injection holes at the bottom of a cylindrical glass heating container, and continuously injecting nitrogen at the pressure of 3-4 MPa until the molten pool is completely cooled to obtain a crude heat dissipation material block;
④, machining the crude radiating material block obtained in step ③ into a shape with the bottom corresponding to the upper surface of the CPU and the top corresponding to the radiating fan to obtain a prefabricated composite radiating material;
⑤, heating the prefabricated composite heat dissipation material obtained in the step ④ to 120-130 ℃, then rinsing the surface of the heated heat dissipation material by using sufficient ethanol, and evaporating the attached ethanol to obtain the composite heat dissipation material to be treated;
5) preparation of surface-modified Dispersion
① an ice bath pool composed of ice-water mixture;
② uniformly mixing concentrated sulfuric acid, activated carbon powder and deionized water 800-900 parts prepared in the step ① in the step 1), then putting the mixture into a glass container, then immersing the container into an ice bath prepared in the step ①, keeping the solution inside and outside the container isolated, mechanically stirring for 2.5-3 h at the stirring speed of 30-35 rpm/min, then slowly and uniformly putting the potassium permanganate prepared in the step ① in the step 1) into the container at the adding speed of 5% of the total weight per minute, and continuously stirring for 90-100 min at the stirring speed of 15-20 rpm/min to obtain a low-temperature reaction solution;
③ immersing a glass container containing low-temperature reaction solution in a warm water bath with constant water temperature of 36-38 deg.C, keeping the solution inside and outside the container isolated, stirring at a stirring speed of 120-150 rpm/min for 80-90 min to obtain medium-temperature reaction solution;
④ immersing a glass container containing the medium temperature reaction solution in a high temperature bath with the constant water temperature of 95-97 ℃, keeping the solution inside and outside the container isolated, slowly and uniformly injecting 250-300 parts by weight of deionized water into the container at the addition rate of 5%/min of the total weight of the container, and then standing for 45-50 min to obtain the high temperature reaction solution;
⑤ injecting 450-500 parts by weight of deionized water into the glass container containing the high temperature reaction solution again, centrifuging and washing until the pH value of the reaction product C is 6.5-7.5 to obtain a product dispersion liquid;
6) radiator preparation
① putting the product dispersion liquid obtained in the step ⑤ of the stage 5) into a spraying container with a nozzle diameter of 0.2mm-0.5mm to obtain a dispersion liquid sprayer;
②, uniformly and completely spraying the dispersion liquid by a sprayer on the outer surface of the composite heat dissipation material to be processed obtained in the step ⑤ in the stage 4), naturally drying, and processing the dried dispersion liquid by adopting flash with the irradiation intensity of GN/M being 30-35 and the irradiation time of 1ms, thus obtaining the heat dissipation material of the CPU of the required heat absorption and heat transfer radiation composite mechanism.
2. A CPU heat dissipation material of a heat absorption and heat transfer radiation compound mechanism is characterized in that: the heat dissipation material is composed of three parts: the matrix part is 55 to 80 parts by weight of P (VDF-TrFE) copolymer with honeycomb multi-channel through holes inside, and the filler part is a blend which is solidified inside the matrix part and comprises 15 to 20 parts by weight of polymethyl methacrylate, 25 to 35 parts by weight of ethylene-vinyl acetate and 15 to 25 parts by weight of graphite powder; the graphene film layer is also attached to the outer surface, and the water contact angle of the film layer is 118-123 degrees, and the thermal conductivity is 4800W/m.K-5300W/m.K.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911039829.1A CN110776706A (en) | 2019-10-29 | 2019-10-29 | Method for manufacturing CPU heat dissipation material by heat absorption, heat transfer and radiation combined mechanism |
| PCT/CN2019/114404 WO2021081820A1 (en) | 2019-10-29 | 2019-10-30 | Manufacturing method for cpu heat dissipation material having heat-absorbing, heat-transferring and radiative complex mechanism |
| ZA2021/06092A ZA202106092B (en) | 2019-10-29 | 2021-08-24 | Manufacturing method of heat dissipation material for heat absorption and heat transfer radiative recombination mechanism cpu |
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| CN201911039829.1A CN110776706A (en) | 2019-10-29 | 2019-10-29 | Method for manufacturing CPU heat dissipation material by heat absorption, heat transfer and radiation combined mechanism |
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| CN1961012A (en) * | 2004-06-01 | 2007-05-09 | 瓦克聚合系统两合公司 | Non-blocking solid resins of vinyl ester polymers |
| CN101735374A (en) * | 2009-12-15 | 2010-06-16 | 上海三爱富新材料股份有限公司 | Preparation method of vinylidene fluoride copolymer resin |
| CN108251072A (en) * | 2018-03-05 | 2018-07-06 | 北京科技大学 | A kind of preparation method of liquid metal composite phase-change material |
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| US5908499A (en) * | 1996-10-08 | 1999-06-01 | Tourangeau; Paulette | Colored powders prepared by a combination of two thermal, chemical or irradiation processes |
| CN101316499B (en) * | 2007-06-01 | 2013-02-27 | 聚鼎科技股份有限公司 | Cooling substrates and cooling material |
| CN102651961B (en) * | 2012-05-29 | 2016-02-03 | 安顿雷纳(上海)纤维材料科技有限公司 | A kind of Heat-conduction heat-dissipation interface material and manufacture method thereof |
| CN105385013A (en) * | 2015-12-04 | 2016-03-09 | 太仓陶氏电气有限公司 | Nonmetal radiator |
| CN107644856A (en) * | 2017-09-13 | 2018-01-30 | 比赫电气（太仓）有限公司 | A kind of assembly type fin |
| CN108640109B (en) * | 2018-06-19 | 2021-10-01 | 杭州格蓝丰纳米科技有限公司 | Preparation method of graphene heat dissipation film with fractal structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1961012A (en) * | 2004-06-01 | 2007-05-09 | 瓦克聚合系统两合公司 | Non-blocking solid resins of vinyl ester polymers |
| CN101735374A (en) * | 2009-12-15 | 2010-06-16 | 上海三爱富新材料股份有限公司 | Preparation method of vinylidene fluoride copolymer resin |
| CN108251072A (en) * | 2018-03-05 | 2018-07-06 | 北京科技大学 | A kind of preparation method of liquid metal composite phase-change material |
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