CN110743805A - Semiconductor production detection device - Google Patents

Abstract

The invention discloses a semiconductor production detection device, comprising a base plate, a fixed frame, a support plate, a first electric push rod, a connecting plate, a detection head, a gear rod, a transmission gear, a rack, a rotating plate, a fixed plate and a first spring , push plate, guide plate, first motor, tooth plate, slider, second motor, output gear, second electric push rod, cross bar, splint, second spring, connecting rod, limit block, blanking plate and connection axis. The invention has simple structure and convenient operation. The design of the pallet is convenient for placing the semiconductors, which is beneficial to conveying, and the continuous detection of a plurality of semiconductors is facilitated by a plurality of detection heads arranged at the bottom of the connecting plate; Afterwards, the movement of the splint driven by the slider facilitates positioning of the product, which is conducive to the removal of unqualified products; the movement and rotation of the splint facilitates taking out the tested semiconductor, and the design of the blanking plate facilitates the detection of unqualified products. Qualified products are unloaded.

Description

A semiconductor production testing device

technical field

The invention relates to a detection device, in particular to a semiconductor production detection device, and belongs to the technical field of semiconductor application.

Background technique

Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are widely used in consumer electronics, communication systems, medical instruments and other fields. For example, diodes are devices made of semiconductors, whether from the perspective of technology or economic development. From the point of view, the importance of semiconductors is very huge. Most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to the core units of semiconductors. Common semiconductor materials include silicon and germanium. , gallium arsenide, etc., and silicon is the most influential one in commercial applications among various semiconductor materials.

The current semiconductor refers to the material whose electrical conductivity is between the conductor and the insulator at room temperature. However, for the semiconductor production testing device, since the semiconductor production needs to be tested, the operation is inconvenient, and it is not conducive to many Simultaneous testing of semiconductors; and it is not conducive to the transportation of semiconductors during testing, and it is not conducive to the removal of unqualified products after testing, which is not conducive to classification; and when the products at the testing site are unqualified, it is not conducive to taking out the structure. The positioning is not conducive to the operation and affects the operation efficiency. Therefore, a semiconductor production inspection device is proposed to solve the above problems.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a semiconductor production inspection device in order to solve the above-mentioned problems.

The present invention achieves the above objects through the following technical solutions, a semiconductor production detection device, comprising a fixed frame installed on the top of the bottom plate, a detection mechanism, a moving mechanism and a blanking mechanism;

The detection mechanism includes a first electric push rod, a connecting plate, a detection head, a gear rod and a transmission gear, the bottom of the fixing frame is fixedly connected with the first electric push rod, and the bottom end of the first electric push rod is fixed with the connecting plate The bottom of the connecting plate is fixedly connected with the detection head, the bottom surface of the connecting plate is rotatably connected with the gear rod, the gear rod is meshed with the transmission gear, and the transmission gear is meshed with the rack, and the rack is meshed with the bottom of the pallet. Fixed connection, the side wall of the fixing frame is rotatably connected with the turning plate, and the top surface of the bottom plate is fixedly connected with the guide plate;

The moving mechanism includes a first motor tooth plate and a slider, the outer wall of the fixing frame is fixedly connected with the first motor, the output end of the first motor is fixedly connected with the tooth plate, and the tooth plate is connected through the inside of the slider, so the The top surface of the slider is fixedly connected with the second motor, the output end of the second motor is fixedly connected with the output gear, and the bottom surface of the slider is fixedly connected with the second electric push rod;

The feeding mechanism includes a cross bar and a splint, the bottom end of the second electric push rod is fixedly connected to the cross bar, the end of the cross bar is rotatably connected to the splint, and the splint is fixedly connected by a second spring, the The middle part of the splint is slidably connected with the connecting rod, the end of the connecting rod is fixedly connected with the limit block, and the side wall of the fixing frame is fixedly connected with the blanking plate.

Preferably, the fixing frame has a U-shaped structure, two first electric push rods are arranged inside the bottom end of the fixing frame, and a plurality of detection heads are arranged on the connecting plate at the bottom end of the first electric push rod.

Preferably, the top surface of the bottom plate is fixedly connected to the fixed plate, the side wall of the fixed plate is fixedly connected to the push plate through a first spring, the push plate is slidably connected to the top surface of the bottom plate, and the push plate contacts the bottom of the turning plate.

Preferably, the number of the guide plates is two, the inside of the two guide plates is provided with a chute with a parallel bottom surface and an arc structure on the top surface, and the inside of the chute opened by the guide plate is fixed with a connecting shaft in the middle of the gear rod. Slide to connect.

Preferably, the number of the rotating plates is two, each rotating plate is located between the push plate and the gear rod, the rotating plate is an inclined mechanism, and the rotating plate is in contact with the gear rod.

Preferably, a plurality of grooves for placing semiconductors are formed on the top surface of the support plate, two inclined structure openings are respectively formed on both sides of each groove, and each row of grooves corresponds to a detection head.

Preferably, the slider has a square hollow structure, the slider is slidably connected to the toothed plate, and the toothed plate is meshed with the output gear.

Preferably, both sides of the bottom end of the cross bar are respectively connected to two clamp plates in rotation, the bottom ends of the two clamp plates are in contact with the side walls of the openings opened by the support plates, and the two side walls of the clamp plates slide with the two limit blocks respectively. connect.

Preferably, the blanking plate has an F-shaped structure, and the bottom end of the blanking plate is in contact with both ends of the connecting rod respectively.

Preferably, the toothed plate is rotatably connected to the middle of the fixing frame, the toothed plate is slidably connected to the slider, and a through hole for the rotation of the output gear is provided on the top of the slider.

The beneficial effects of the present invention are:

1. The present invention is simple in structure and easy to operate. The design of the pallet is convenient for placing the semiconductors, which is beneficial to transportation, and the continuous detection of multiple semiconductors is facilitated by several detection heads arranged at the bottom of the connecting plate, which improves the detection efficiency. efficiency;

2. After the unqualified products are detected in the present invention, the sliding block drives the movement of the splint to facilitate the positioning of the products, which is conducive to the removal of unqualified products, facilitates effective separation, and facilitates the classification of semiconductors after detection;

3. In the present invention, the detected semiconductor is easily taken out through the movement and rotation of the splint, and the unqualified products detected are easily blanked through the design of the blanking plate, thereby improving the operation efficiency.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a schematic diagram of the overall three-dimensional structure of the present invention;

Fig. 2 is the front view structure schematic diagram of the present invention;

Fig. 3 is a side view structural schematic diagram of the present invention;

FIG. 4 is a schematic side view of the structure of the guide plate of the present invention.

In the picture: 1. Bottom plate, 2. Fixed frame, 3. Support plate, 4. The first electric push rod, 5. Connecting plate, 6. Detection head, 7. Gear rod, 8. Transmission gear, 9. Gear rack, 10. Turning plate, 11, Fixed plate, 12, First spring, 13, Push plate, 14, Guide plate, 15, First motor, 16, Gear plate, 17, Slider, 18, Second motor, 19, Output Gear, 20, second electric push rod, 21, cross bar, 22, splint, 23, second spring, 24, connecting rod, 25, limit block, 26, blanking plate, 27, connecting shaft.

Detailed ways

In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The technical solutions of the present invention are further described below with reference to the accompanying drawings and through specific embodiments.

In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on those shown in the accompanying drawings The orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

Please refer to Figures 1-4, a semiconductor production testing device, including a fixed frame 2 installed on the top of the base plate 1, a testing mechanism, a moving mechanism and a blanking mechanism;

The detection mechanism includes a first electric push rod 4, a connecting plate 5, a detection head 6, a toothed rod 7 and a transmission gear 8. The bottom of the fixing frame 2 is fixedly connected with the first electric push rod 4. The first electric push rod The bottom end of the rod 4 is fixedly connected with the connecting plate 5, which is used to drive the detection head 6 to move, and the bottom of the connecting plate 5 is fixedly connected with the detection head 6. The bottom surface of the connecting plate 5 is rotatably connected with the toothed rod 7, and the toothed rod 7 is connected with the toothed rod 7. The transmission gear 8 is meshed and connected, and the transmission gear 8 is meshed with the rack 9, the rack 9 is fixedly connected to the bottom of the support plate 3, the side wall of the fixing frame 2 is rotatably connected to the turning plate 10, and the top surface of the bottom plate 1 is The guide plate 14 is fixedly connected;

The moving mechanism includes a first motor 15, a toothed plate 16 and a slider 17, the outer wall of the fixed frame 2 is fixedly connected with the first motor 15, the output end of the first motor 15 is fixedly connected with the toothed plate 16, and the toothed plate 16 It is connected through the inside of the slider 17, the top surface of the slider 17 is fixedly connected with the second motor 18, the output end of the second motor 18 is fixedly connected with the output gear 19, and the bottom surface of the slider 17 is connected with the second electric push rod 20. Fixed connection for the movement of the splint 22;

The feeding mechanism includes a cross bar 21 and a clamp plate 22. The bottom end of the second electric push rod 20 is fixedly connected to the cross bar 21, and the end of the cross bar 21 is rotatably connected to the clamp plate 22, and the clamp plate 22 passes through the first The two springs 23 are fixedly connected, the middle of the splint 22 is slidably connected with the connecting rod 24, and the end of the connecting rod 24 is fixedly connected with the limit block 25, and the side wall of the fixing frame 2 is fixedly connected with the blanking plate 26, for not Qualified semiconductor blanking.

The fixing frame 2 has a U-shaped structure, and the bottom end of the fixing frame 2 is provided with two first electric push rods 4, and the connecting plate 5 at the bottom end of the first electric push rod 4 is provided with a number of detection heads 6, which is convenient for The movement of the connecting plate 5 facilitates the movement of the detection head 6; the top surface of the bottom plate 1 is fixedly connected to the fixing plate 11, and the side wall of the fixing plate 11 is fixedly connected to the push plate 13 through the first spring 12, and the push plate 13 It is slidingly connected with the top surface of the bottom plate 1, and the push plate 13 is in contact with the bottom of the rotating plate 10, which is convenient for the movement of the push plate 13 and the rotation of the rotating plate 10; A chute with a parallel bottom surface and an arc-shaped top surface is provided, and the inside of the chute opened by the guide plate 14 is slidably connected with the connecting shaft 27 fixed in the middle of the toothed bar 7; the number of the rotating plates 10 is two, each Each of the rotating plates 10 is located between the push plate 13 and the toothed rod 7. The rotating plate 10 is an inclined mechanism, and the rotating plate 10 is in contact with the toothed rod 7, which is convenient for pushing the toothed rod 7 to rotate, and it is convenient for the toothed rod 7 and the transmission gear 8. There are several grooves for semiconductor placement on the top surface of the support plate 3, two inclined structure openings are respectively opened on both sides of each groove, and each row of grooves corresponds to a detection head 6, which is convenient for The placement of the semiconductor is convenient for detection; the slider 17 has a square hollow structure, the slider 17 is slidably connected with the toothed plate 16, and the toothed plate 16 is meshed with the output gear 19, which is convenient for the movement of the slider 17 and the driving. The splint 22 moves; the two sides of the bottom end of the cross bar 21 are respectively connected with the two splints 22 in rotation, the bottom ends of the two splints 22 are in contact with the side walls of the openings opened by the support plate 3, and the side walls of the two splints 22 are respectively connected to the side walls of the opening. The two limit blocks 25 are slidably connected to facilitate the rotation of the splint 22 and the clamping of the semiconductor; the blanking plate 26 has an F-shaped structure, and the bottom end of the blanking plate 26 contacts the two ends of the connecting rod 24 respectively , to facilitate the movement of the connecting rod 24 and facilitate the unloading of the semiconductor; the toothed plate 16 is rotatably connected to the middle of the fixing frame 2, the toothed plate 16 is slidably connected to the slider 17, and the top of the slider 17 is provided with an output gear 19 The rotating through hole is convenient for the rotation of the toothed plate 16, and it is convenient to drive the splint 22 to rotate.

When the present invention is in use, the electrical components in the device are first connected to external power supplies and control switches, the semiconductors are placed in the grooves on the top surface of the support plate 3, and the support plate 3 is placed on the bottom plate 1, so that the bottom of the support plate 3 is After the rack 9 contacts the transmission gear 8, the first electric push rod 4 on the top of the fixing frame 2 drives the connecting plate 5 to move vertically, so that the connecting plate 5 drives the detection head 6 to move at the same time and then aligns the semiconductor placed on the pallet 3 for detection. , at the same time, the connecting plate 5 drives the toothed rod 7 to move at the same time. At this time, the first spring 12 on the fixed plate 11 pushes the push plate 13 to move, so that the push plate 13 pushes the rotating plate 10 to rotate around its top, so that the rotating plate 10 is against the The toothed bar 7 makes the toothed bar 7 located between the turning plate 10 and the guide plate 14. The toothed bar 7 is in a vertical state at this time. When moving, it drives the transmission gear 8 to rotate, and then drives the rack 9 to move at the same time, and drives the support plate 3 to move. Detect the semiconductors in the next row. When the toothed rod 7 drives the connecting shaft 27 to move to the lowest end, the connecting shaft 27 moves to the bottom of the chute opened by the guide plate 14, and the rotating plate 10 pushes the tooth through the elasticity of the first spring 12. The rod 7 rotates, so that the connecting shaft 27 on the toothed rod 7 moves to the inside of the connecting shaft 27, so that the toothed rod 7 is separated from the transmission gear 8, and when the first electric push rod 4 is shortened, the sliding of the connecting shaft 27 in the guide plate 14 is made. The groove moves vertically. When the first electric push rod 4 drives the connecting plate 5 to move to the top, the connecting shaft 27 moves to the outside of the guide plate 14, and then the back and forth of the first electric push rod 4 drives the support plate 3 to move gradually. It is convenient to test multiple semiconductors;

When there is an unqualified product at the detection place, the second motor 18 drives the output gear 19 to rotate, and the output gear 19 meshes with the toothed plate 16, thereby driving the second motor 18 and the slider 17 to move laterally on the toothed plate 16, which is convenient for alignment. The detected substandard products are positioned;

When the positioning is completed, the extension of the second electric push rod 20 at the bottom end of the slider 17 drives the cross bar 21 to move vertically, and the cross bar 21 drives the two clamping plates 22 to move to both sides of the unqualified semiconductor, so that the clamping plate 22 two The end contacts the inclined surface of the opening opened by the support plate 3, and then pushes the two clamping plates 22 to rotate with each other, so that the two clamping plates 22 in the vertical state are rotated to the inclined state, so that after the spring is compressed, the connecting rod 24 is subject to its own gravity on the clamping plate 22. Sliding between, drives the limit block 25 to move and then contacts the side wall of the clamping plate 22, and then clamps the semiconductor, and then drives the clamping plate 22 and the unqualified semiconductor clamped therebetween to move out of the bracket through the shortening of the second electric push rod 20. After the sliding block 17 is moved to the original position by the reverse rotation of the second motor 18, the toothed plate 16 is driven to rotate by the first motor 15, and then the sliding block 17, the second electric push rod 20 and the clamping plate 22 are driven to rotate. , so that when the clamping plate 22 is rotated to the horizontal position, the two connecting rods 24 of the clamping plate 22 contact the side wall of the blanking plate 26, and push the connecting rod 24 to move to the top of the clamping plate 22, so that the limit block 25 is separated from the side wall of the clamping plate 22. , so that the second spring 23 in a compressed state pushes the splint 22 to rotate to the original position, so that the splint 22 is separated from the semiconductor, and then unqualified products are taken out and then unloaded into a specially placed collection box for easy operation.

The circuits, electronic components and modules involved are all in the prior art, which can be fully realized by those skilled in the art. It is needless to mention that the content of the present invention does not involve improvements to software and methods.

It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is to be defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the claims. All changes within the meaning and scope of the same requirements are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.

As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: The technical solutions described in the embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A semiconductor production testing device, characterized in that: comprising a fixed frame (2), a detection mechanism, a moving mechanism and a blanking mechanism installed on the top of a bottom plate (1); The detection mechanism includes a first electric push rod (4), a connecting plate (5), a detection head (6), a gear rod (7) and a transmission gear (8), and the bottom of the fixing frame (2) is connected to the first electric push rod (5). The push rod (4) is fixedly connected, the bottom end of the first electric push rod (4) is fixedly connected with the connecting plate (5), and the bottom of the connecting plate (5) is fixedly connected with the detection head (6). 5) The bottom surface is rotatably connected with the gear rod (7), the gear rod (7) is meshed with the transmission gear (8), and the transmission gear (8) is meshed with the rack (9), the rack (9) It is fixedly connected with the bottom of the support plate (3), the side wall of the fixing frame (2) is rotatably connected with the turning plate (10), and the top surface of the bottom plate (1) is fixedly connected with the guide plate (14); The moving mechanism includes a first motor (15) a toothed plate (16) and a slider (17), the outer wall of the fixing frame (2) is fixedly connected with the first motor (15), and the first motor (15) outputs The end is fixedly connected with the toothed plate (16), and the toothed plate (16) is connected through the inside of the slider (17), the top surface of the slider (17) is fixedly connected with the second motor (18), the second motor (18) The output end is fixedly connected with the output gear (19), and the bottom surface of the slider (17) is fixedly connected with the second electric push rod (20); The feeding mechanism comprises a cross bar (21) and a clamp plate (22), the bottom end of the second electric push rod (20) is fixedly connected with the cross bar (21), and the end of the cross bar (21) is connected with the clamp plate (21). 22) Rotationally connected, and the splint (22) is fixedly connected by a second spring (23), the middle part of the splint (22) is slidably connected with the connecting rod (24), and the end of the connecting rod (24) is connected with the limit block (25) Fixed connection, the side wall of the fixing frame (2) is fixedly connected with the blanking plate (26). 2 . The semiconductor production testing device according to claim 1 , wherein the fixing frame ( 2 ) has a U-shaped structure, and two first electric pushers are arranged inside the bottom end of the fixing frame ( 2 ). 3 . A rod (4), and the connecting plate (5) at the bottom end of the first electric push rod (4) is provided with a plurality of detection heads (6). 3. A semiconductor production testing device according to claim 1, characterized in that: the top surface of the bottom plate (1) is fixedly connected to the fixing plate (11), and the side wall of the fixing plate (11) passes through a first spring (12) is fixedly connected with the push plate (13), the push plate (13) is slidably connected with the top surface of the bottom plate (1), and the push plate (13) contacts the bottom of the turning plate (10). 4 . The semiconductor production testing device according to claim 1 , wherein the number of the guide plates ( 14 ) is two, and the two guide plates ( 14 ) are provided with a bottom surface that is parallel and a top surface that is parallel to the top surface. 5 . A chute of arc structure is provided, and the inside of the chute opened by the guide plate (14) is slidably connected with the connecting shaft (27) fixed in the middle of the toothed rod (7). 5 . The semiconductor production testing device according to claim 1 , wherein the number of the rotating plates ( 10 ) is two, and each rotating plate ( 10 ) is located on the push plate ( 13 ) and the gear rod. 6 . Between (7), the rotating plate (10) is an inclined mechanism, and the rotating plate (10) is in contact with the toothed rod (7). 6. A semiconductor production testing device according to claim 1, characterized in that: a plurality of grooves for placing semiconductors are opened on the top surface of the support plate (3), and two grooves are respectively opened on both sides of each groove The inclined structure is open, and each row of grooves corresponds to a detection head (6). 7 . The semiconductor production testing device according to claim 1 , wherein the slider ( 17 ) has a square hollow structure, the slider ( 17 ) is slidably connected with the tooth plate ( 16 ), and the tooth The plate (16) is meshed with the output gear (19). 8 . The semiconductor production testing device according to claim 1 , wherein two sides of the bottom end of the cross bar ( 21 ) are respectively rotatably connected with two clamping plates ( 22 ), and the two clamping plates ( 22 ) The bottom end is in contact with the side wall of the opening opened by the support plate (3), and the side walls of the two clamping plates (22) are respectively slidably connected with the two limiting blocks (25). 9. A semiconductor production testing device according to claim 1, characterized in that: the blanking plate (26) has an F-shaped structure, and the bottom ends of the blanking plate (26) are respectively contacted with connecting rods ( 24) at both ends. 10 . The semiconductor production testing device according to claim 1 , wherein the tooth plate ( 16 ) is rotatably connected to the middle of the fixing frame ( 2 ), and the tooth plate ( 16 ) is connected to the slider ( 17 ). 11 . The sliding connection is provided, and the top of the slider (17) is provided with a through hole for the rotation of the output gear (19).

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