CN110744731B - Wafer slicing equipment based on photoelectric control - Google Patents
Wafer slicing equipment based on photoelectric control Download PDFInfo
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- CN110744731B CN110744731B CN201911051070.9A CN201911051070A CN110744731B CN 110744731 B CN110744731 B CN 110744731B CN 201911051070 A CN201911051070 A CN 201911051070A CN 110744731 B CN110744731 B CN 110744731B
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- 238000001514 detection method Methods 0.000 claims abstract description 24
- 238000003698 laser cutting Methods 0.000 claims abstract description 22
- 238000009966 trimming Methods 0.000 claims abstract description 17
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 101100008048 Caenorhabditis elegans cut-4 gene Proteins 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/027—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade arranged underneath a stationary work table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention relates to the technical field of wafer processing equipment, in particular to wafer slicing equipment based on photoelectric control, wherein during slicing operation, a high-speed saw blade cutting mechanism is positioned in front of a laser cutting mechanism for a certain distance, a cut is formed at a cutting surface of a slice first and then the laser cutting mechanism is used for cutting the slice into a through groove within a certain time interval, one side of the high-speed saw blade cutting mechanism is also provided with a trimming mechanism for trimming a saw cutting edge of a high-speed saw blade, so that the precision and the stability of the saw cutting edge can be effectively improved, the precision of the cutting edge is improved, the generation of burrs is reduced, the diameter change of the saw cutting edge of the high-speed saw blade is detected by a photoelectric detection mechanism, the position of the high-speed saw blade cutting mechanism is adjusted and compensated by the compensation mechanism according to the value detected by the photoelectric detection mechanism, the depth of the cut is kept within a set threshold value, and the combination with the laser cutting machine is convenient, effectively ensuring the stability and uniformity of the cutting of each wafer.
Description
Technical Field
The invention relates to the technical field of wafer processing equipment, in particular to wafer slicing equipment based on photoelectric control.
Background
The existing wafer slicing equipment generally adopts a cutter or a laser mode for cutting, burrs are easily generated at the edge of a sliced wafer by the cutting mode of the cutter, when the contact surface of the cutter and the wafer is large, the contact part of the cutter and the wafer generates a large amount of heat, so that the surface of a cut of the wafer is easily damaged by heat, while the cutting speed of the laser cutting mode is high, but the temperature of the edge cutting part of the wafer is high, the damage to the edge is large, particularly the upper part of the wafer, so that the difficulty is increased when the edge of the wafer is ground subsequently, and the wafer slicing efficiency is influenced. In addition, after the cutter is used for a long time, if the cutter is not trimmed, after the cutter is deformed, a large error is generated at the edge of the wafer cutting position, and burrs are greatly increased, so that the precision of the wafer is lowered.
Accordingly, the present invention is directed to a wafer slicing apparatus based on photoelectric control to solve the above-mentioned problems in the background art.
Disclosure of Invention
The present invention is directed to a wafer slicing apparatus based on photoelectric control, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a wafer slicing device based on photoelectric control comprises a high-speed saw blade cutting mechanism and a laser cutting mechanism, wherein the high-speed saw blade cutting mechanism is arranged on the back surface of a wafer to be cut so as to be used for cutting a cut from the back surface of the wafer, and the laser cutting mechanism is arranged on the front surface of the wafer to be cut so as to thoroughly cut a part with the cut into a through groove and cut into a single wafer; it is characterized in that the preparation method is characterized in that,
during slicing operation, the high-speed saw blade cutting mechanism is positioned in front of the laser cutting mechanism for a certain distance, so that a cut is formed at the cutting surface of the slice at first and then the laser cutting mechanism is used for cutting the slice into a through groove within a certain time interval;
a trimming mechanism for trimming the saw cutting edge of the high-speed saw blade is also arranged on one side of the high-speed saw blade cutting mechanism; and is
A photoelectric detection mechanism and a compensation mechanism are further arranged on one side of the high-speed saw blade cutting mechanism, and the photoelectric detection mechanism can detect the diameter change of the saw cutting edge of the high-speed saw blade;
the compensation mechanism is configured to adjust and compensate the position of the high speed saw blade cutting mechanism according to the value detected by the photoelectric detection mechanism so as to keep the depth of the cut within a set threshold value.
Further, as preferred, still include to the wafer adsorb fixed section workstation and set up and be in section workstation lower extreme face and downwardly extending's positioning seat, high-speed saw bit cutting mechanism, photoelectric detection mechanism and compensation mechanism all set up on the positioning seat.
Further, as preferred, high-speed saw bit cutting mechanism is including saw cutting bearing frame, driving motor and saw cutting blade, wherein, saw cutting bearing frame adopts compensation mechanism sets up on the positioning seat, driving motor's output with saw cutting blade's rotation main shaft drive is connected.
Further, as preferred, the positioning seat is relative interval and parallel arrangement two, both ends saw cut the bearing frame and set up respectively in the vertical compensation spout of positioning seat, compensation mechanism is accurate linear actuator, accurate linear actuator's output is connected to through the spliced pole saw cut the bearing frame, so that by accurate linear actuator adjusts and compensates saw cut the position of bearing frame.
Further, as preferred, saw cut the tip of bearing frame with still be provided with hydraulic locking piece between the inner wall of spout, so that it is right saw cut the bearing frame adjust after the compensation right saw cut the bearing frame and carry out hydraulic locking.
Preferably, the photoelectric detection mechanism comprises a laser emitter and a photoelectric receiving sensor, wherein the laser emitter is fixed on the bottom side of the positioning seat, the photoelectric receiving sensor is fixed on the bottom side of the positioning seat, the laser emitter and the photoelectric receiving sensor are arranged just opposite to each other, and the diameter of the end cutting edge of the sawing blade is detected through the shielding part of the lower end part of the sawing blade on the laser emitted by the laser emitter.
Preferably, the laser emitter is provided with a plurality of laser emitting heads in an array manner, the photoelectric receiving sensor is provided with a plurality of photoelectric receiving probes in an array manner, each laser emitting head is opposite to the photoelectric receiving probe in position, and the coordinate position of each photoelectric receiving probe is known and fixed.
Further, as a preferred mode, the dressing mechanism comprises a dressing grinding wheel, a dressing driving disk and a dressing motor, wherein the dressing grinding wheel is coaxially and fixedly connected with the dressing driving disk, and the dressing driving disk is in transmission driving connection with the dressing motor.
Preferably, the sawing bearing seat on which the sawing blade is mounted is further fixedly provided with an underframe, the underframe is hinged with a conversion driving piece, a driving end of the conversion driving piece is hinged with a dressing grinding wheel of the dressing mechanism, and a lower end of the dressing mechanism is hinged on the underframe, so that the position of the dressing grinding wheel is adjusted by the conversion driving piece, and the state conversion of whether the sawing blade is dressed or not is realized.
Further, as preferred, the bottom of chassis still fixed be provided with the stable balancing weight.
Compared with the prior art, the invention has the beneficial effects that:
1. when the high-speed saw blade cutting mechanism is used for slicing, the high-speed saw blade cutting mechanism is positioned in front of the laser cutting mechanism for a certain distance, so that a cut is formed at a cutting surface of the slice firstly and then the laser cutting mechanism is used for cutting the cut slice into the through grooves within a certain time interval, the cut part of the slice can be effectively cooled, the cutting is carried out before the cooling is finished, the problem that the deformation is overlarge due to overlarge temperature difference before and after the cutting of the wafer is prevented, and the cutting precision and the stability of the wafer are effectively improved;
2. one side of the high-speed saw blade cutting mechanism is also provided with a trimming mechanism for trimming the saw cutting edge of the high-speed saw blade, so that the precision and the stability of the saw cutting edge can be effectively improved, the precision of the cutting edge is improved, the generation of burrs is reduced, the consistency of the cutting surface of each slice is ensured, and the subsequent grinding large-scale processing and treatment are facilitated;
3. the photoelectric detection mechanism and the compensation mechanism are further arranged on one side of the high-speed saw blade cutting mechanism, the photoelectric detection mechanism detects the diameter change of the saw cutting edge of the high-speed saw blade, and the compensation mechanism adjusts and compensates the position of the high-speed saw blade cutting mechanism according to the value detected by the photoelectric detection mechanism, so that the depth of a cut is kept within a set threshold value, the high-speed saw blade cutting mechanism is convenient to combine with a laser cutting machine, and the cutting stability and uniformity of each wafer are effectively guaranteed.
Drawings
FIG. 1 is a front view structural diagram of a wafer slicing device based on photoelectric control when a wafer is sliced;
FIG. 2 is a schematic view of a detecting and compensating structure of a high-speed sawing mechanism in a wafer slicing apparatus based on photoelectric control;
FIG. 3 is a schematic diagram of a hydraulic lock and a slide groove position relationship of a wafer slicing apparatus based on photoelectric control;
FIG. 4 is a schematic diagram of a dressing wheel structure of a wafer slicing apparatus based on electro-optical control;
fig. 5 is a structural diagram illustrating a positional relationship between a trimming mechanism and a high-speed saw blade cutting mechanism in a wafer slicing apparatus based on photoelectric control.
Detailed Description
Referring to fig. 1 to 5, in an embodiment of the present invention, a wafer slicing apparatus based on photoelectric control includes a high-speed saw blade cutting mechanism 2 and a laser cutting mechanism 1, wherein the high-speed saw blade cutting mechanism 2 is disposed on a back surface of a wafer 3 to be cut so as to cut a notch 4 from the back surface of the wafer, and the laser cutting mechanism 1 is disposed on a front surface of the wafer 3 to be cut so as to completely cut a portion having the notch 4 to form a through slot 5 and cut a single wafer; the high-speed saw blade cutting mechanism 2 is positioned in front of the laser cutting mechanism 1 for a certain distance during slicing operation, so that a cut 4 is formed on a cutting surface of a slice and then the laser cutting mechanism 1 is used for cutting the slice into a through groove 5 within a certain time interval; a trimming mechanism for trimming the saw cutting edge of the high-speed saw blade is also arranged on one side of the high-speed saw blade cutting mechanism 2; a photoelectric detection mechanism and a compensation mechanism are further arranged on one side of the high-speed saw blade cutting mechanism 2, and the photoelectric detection mechanism can detect the diameter change of the saw cutting edge of the high-speed saw blade;
the compensation mechanism is configured to adjust and compensate the position of the high speed blade cutting mechanism 2 based on the value detected by the photoelectric detection mechanism so as to keep the depth of the cut 4 within a set threshold.
In this embodiment, the present invention further includes a slicing table 6 for adsorbing and fixing the wafer, and a positioning seat 15 disposed on a lower end surface of the slicing table and extending downward, wherein the high-speed saw blade cutting mechanism 2, the photoelectric detection mechanism, and the compensation mechanism are all disposed on the positioning seat 15.
Wherein, high-speed saw bit cutting mechanism 2 is including saw cutting bearing frame 8, driving motor 7 and saw cutting blade 13, wherein, saw cutting bearing frame 8 adopts compensation mechanism sets up on the positioning seat, driving motor 7's output with saw cutting blade 13's rotation main shaft drive is connected.
As a preferred embodiment, the two positioning seats 15 are arranged in parallel at an interval, the sawing bearing blocks 8 at two ends are respectively arranged in the vertical compensation sliding grooves 9 of the positioning seats, the compensation mechanism is a precision linear driver, and an output end of the precision linear driver is connected to the sawing bearing blocks 8 through a connecting column 11, so that the precision linear driver can adjust and compensate the position of the sawing bearing blocks 8.
In the invention, a hydraulic locking piece 17 is arranged between the end part of the sawing bearing seat 8 and the inner wall of the sliding chute, so that the sawing bearing seat is hydraulically locked after the sawing bearing seat is adjusted and compensated.
The photoelectric detection mechanism comprises a laser emitter 14 and a photoelectric receiving sensor 12, wherein the laser emitter 14 is fixed on the bottom side of the positioning seat, the photoelectric receiving sensor 12 is fixed on the bottom side of the positioning seat, the laser emitter 14 and the photoelectric receiving sensor 12 are arranged just opposite to each other, and the diameter of the end cutting edge of the sawing blade is detected through the shielding part of the lower end part of the sawing blade 13 on the laser emitted by the laser emitter 14.
The laser transmitter 14 is provided with a plurality of laser emitting heads in an array, the photoelectric receiving sensor 12 is provided with a plurality of photoelectric receiving probes in an array, each laser emitting head is opposite to the photoelectric receiving probe in position, and the coordinate position of each photoelectric receiving probe is known and fixed. The dressing mechanism comprises a dressing grinding wheel 16, a dressing driving disk 23 and a dressing motor 22, wherein the dressing grinding wheel is coaxially and fixedly connected with the dressing driving disk 23, and the dressing driving disk is in transmission driving connection with the dressing motor 22. The sawing bearing seat 8 for mounting the sawing blade 13 is further fixedly provided with an underframe 19, the underframe 19 is hinged with a conversion driving piece 20, the driving end of the conversion driving piece is hinged with the dressing grinding wheel of the dressing mechanism, and the lower end of the dressing mechanism is hinged on the underframe 19, so that the position of the dressing grinding wheel is adjusted by the conversion driving piece 20, and the state conversion of whether the sawing blade is dressed or not is realized.
In addition, in order to ensure the stable working state of the high-speed sawing mechanism, a stable balancing weight 18 is fixedly arranged at the bottom of the underframe.
When the high-speed saw blade cutting mechanism is used for slicing, the high-speed saw blade cutting mechanism is positioned in front of the laser cutting mechanism for a certain distance, so that a cut is formed at a cutting surface of the slice firstly and then the laser cutting mechanism is used for cutting the cut slice into the through grooves within a certain time interval, the cut part of the slice can be effectively cooled, the cutting is carried out before the cooling is finished, the problem that the deformation is overlarge due to overlarge temperature difference before and after the cutting of the wafer is prevented, and the cutting precision and the stability of the wafer are effectively improved; one side of the high-speed saw blade cutting mechanism is also provided with a trimming mechanism for trimming the saw cutting edge of the high-speed saw blade, so that the precision and the stability of the saw cutting edge can be effectively improved, the precision of the cutting edge is improved, the generation of burrs is reduced, the consistency of the cutting surface of each slice is ensured, and the subsequent grinding large-scale processing and treatment are facilitated; the photoelectric detection mechanism and the compensation mechanism are further arranged on one side of the high-speed saw blade cutting mechanism, the photoelectric detection mechanism detects the diameter change of the saw cutting edge of the high-speed saw blade, and the compensation mechanism adjusts and compensates the position of the high-speed saw blade cutting mechanism according to the value detected by the photoelectric detection mechanism, so that the depth of a cut is kept within a set threshold value, the high-speed saw blade cutting mechanism is convenient to combine with a laser cutting machine, and the cutting stability and uniformity of each wafer are effectively guaranteed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.
Claims (4)
1. A wafer slicing device based on photoelectric control comprises a high-speed saw blade cutting mechanism (2) and a laser cutting mechanism (1), wherein the high-speed saw blade cutting mechanism (2) is arranged on the back surface of a wafer (3) to be cut so as to be used for cutting a cut (4) from the back surface of the wafer, and the laser cutting mechanism (1) is arranged on the front surface of the wafer (3) to be cut so as to completely cut a part which is provided with the cut (4) to form a through groove (5) and cut a single wafer; the high-speed saw blade cutting mechanism is characterized in that during slicing operation, the high-speed saw blade cutting mechanism (2) is positioned in front of the laser cutting mechanism (1) for a certain distance, so that a cut (4) is formed on a cutting surface of a slice at first and then the laser cutting mechanism (1) is used for cutting the slice into a through groove (5) within a certain time interval; a trimming mechanism for trimming the saw cutting edge of the high-speed saw blade is also arranged on one side of the high-speed saw blade cutting mechanism (2); a photoelectric detection mechanism and a compensation mechanism are further arranged on one side of the high-speed saw blade cutting mechanism (2), and the photoelectric detection mechanism can detect the diameter change of the saw cutting edge of the high-speed saw blade; the compensation mechanism is set to adjust and compensate the position of the high-speed saw blade cutting mechanism (2) according to the value detected by the photoelectric detection mechanism so as to keep the depth of the notch (4) within a set threshold value;
the high-speed saw blade cutting mechanism comprises a high-speed saw blade cutting mechanism (2), a photoelectric detection mechanism and a compensation mechanism, and is characterized by further comprising a slicing worktable (6) for adsorbing and fixing a wafer and a positioning seat (15) which is arranged on the lower end face of the slicing worktable and extends downwards, wherein the high-speed saw blade cutting mechanism, the photoelectric detection mechanism and the compensation mechanism are all arranged on the positioning seat (15);
the high-speed saw blade cutting mechanism (2) comprises a sawing bearing seat (8), a driving motor (7) and a sawing blade (13), wherein the sawing bearing seat (8) is arranged on the positioning seat through the compensation mechanism, and the output end of the driving motor (7) is in driving connection with a rotating main shaft of the sawing blade (13);
the two positioning seats (15) are oppositely spaced and arranged in parallel, the sawing bearing blocks (8) at two ends are respectively arranged in a vertical compensation chute (9) of the positioning seat, the compensation mechanism is a precise linear driver, and the output end of the precise linear driver is connected to the sawing bearing blocks (8) through a connecting column (11), so that the precise linear driver can adjust and compensate the positions of the sawing bearing blocks (8);
the photoelectric detection mechanism comprises a laser emitter (14) and a photoelectric receiving sensor (12), wherein the laser emitter (14) is fixed on the bottom side of the positioning seat, the photoelectric receiving sensor (12) is fixed on the bottom side of the positioning seat, the laser emitter (14) and the photoelectric receiving sensor (12) are arranged just opposite to each other, and the diameter of the end cutting edge part of the sawing blade is detected through the shielding part of the lower end part of the sawing blade (13) on the laser emitted by the laser emitter (14);
the dressing mechanism comprises a dressing grinding wheel (16), a dressing driving disk (23) and a dressing motor (22), wherein the dressing grinding wheel is coaxially and fixedly connected with the dressing driving disk (23), and the dressing driving disk is in transmission driving connection with the dressing motor (22); the sawing bearing seat (8) for mounting the sawing blade (13) is also fixedly provided with an underframe (19), the underframe (19) is hinged with a conversion driving piece (20), the driving end of the conversion driving piece is hinged with a trimming grinding wheel of the trimming mechanism, and the lower end of the trimming mechanism is hinged on the underframe (19), so that the position of the trimming grinding wheel is adjusted by the conversion driving piece (20), and the state conversion of whether the sawing blade is trimmed or not is realized.
2. Wafer slicing device based on photoelectric control as claimed in claim 1, characterized in that a hydraulic locking member (17) is further provided between the end of the sawing bearing block (8) and the inner wall of the chute, so as to hydraulically lock the sawing bearing block after adjusting and compensating the sawing bearing block.
3. The wafer slicing device based on photoelectric control as claimed in claim 1, wherein a plurality of laser emitting heads are arranged on the laser emitter (14) in an array manner, a plurality of photoelectric receiving probes are arranged on the photoelectric receiving sensor (12) in an array manner, each laser emitting head is opposite to the photoelectric receiving probe in position, and the coordinate position of each photoelectric receiving probe is known and fixed.
4. The wafer slicing device based on the photoelectric control as claimed in claim 1, wherein the bottom of the bottom frame is further fixedly provided with a stable balancing weight (18).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911051070.9A CN110744731B (en) | 2019-10-30 | 2019-10-30 | Wafer slicing equipment based on photoelectric control |
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| CN201911051070.9A CN110744731B (en) | 2019-10-30 | 2019-10-30 | Wafer slicing equipment based on photoelectric control |
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| CN110744731A CN110744731A (en) | 2020-02-04 |
| CN110744731B true CN110744731B (en) | 2021-07-27 |
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| CN112363458A (en) * | 2020-11-04 | 2021-02-12 | 厦门至慧机器人有限公司 | Method for online measuring and compensating diameter of saw blade of sawing machine by using correlation type photoelectric switch or mechanical micro-motion switch |
| CN113053770B (en) * | 2021-03-15 | 2024-03-08 | 上海华力微电子有限公司 | Wafer cutting method |
| CN115366184B (en) * | 2022-10-27 | 2023-03-17 | 济南鼎点数控设备有限公司 | Numerical control carbon fiber pipeline cutting machine and circular cutting compensation method thereof |
| CN115446904B (en) * | 2022-10-27 | 2024-09-06 | 济南鼎点数控设备有限公司 | Numerical control carbon fiber pipeline cutting machine and circular cutting method thereof |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06151581A (en) * | 1992-11-16 | 1994-05-31 | Hitachi Ltd | Method and device for dicing |
| JPH06163687A (en) * | 1992-11-18 | 1994-06-10 | Mitsubishi Electric Corp | Method and device for dicing semiconductor device |
| JP2002370140A (en) * | 2001-06-12 | 2002-12-24 | Disco Abrasive Syst Ltd | Blade monitoring device |
| JP3746422B2 (en) * | 2000-12-05 | 2006-02-15 | シャープ株式会社 | Dicing apparatus and dicing method |
| JP2006116690A (en) * | 2004-09-22 | 2006-05-11 | Disco Abrasive Syst Ltd | Cutting device |
| JP2006310396A (en) * | 2005-04-26 | 2006-11-09 | Tokyo Seimitsu Co Ltd | Blade breakage detector |
| CN101165877A (en) * | 2006-10-17 | 2008-04-23 | 株式会社迪思科 | Laser processing method for gallium arsenide wafer |
| CN101927402A (en) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | Method for cutting off brittle material substrate |
| JP2011110669A (en) * | 2009-11-27 | 2011-06-09 | Disco Abrasive Syst Ltd | Cutting device |
| CN102343629A (en) * | 2010-07-26 | 2012-02-08 | 澁谷工业株式会社 | Device and method for cutting fragile material |
| JP2012080029A (en) * | 2010-10-06 | 2012-04-19 | Disco Abrasive Syst Ltd | Cutting device |
| JP2013146800A (en) * | 2012-01-17 | 2013-08-01 | Toyota Motor Corp | Device for adjusting reference position of cutting tool |
| CN104096908A (en) * | 2013-04-03 | 2014-10-15 | 苏州宝时得电动工具有限公司 | Miter saw and cutting depth adjusting method for same |
| CN105312775A (en) * | 2014-06-10 | 2016-02-10 | 三星钻石工业股份有限公司 | Processing method for brittle material substrate |
| JP2016068400A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | Division method of ceramic substrate |
| CN105810633A (en) * | 2015-01-16 | 2016-07-27 | 株式会社迪思科 | Method for processing wafer |
| CN106295140A (en) * | 2016-07-29 | 2017-01-04 | 南京海威机械有限公司 | Error compensating method when a kind of numerical control sizing saw machine workpiece is cut sth. askew |
| CN106903810A (en) * | 2015-10-21 | 2017-06-30 | 株式会社迪思科 | Topping machanism |
| CN108015650A (en) * | 2016-11-02 | 2018-05-11 | 株式会社迪思科 | The processing method of chip |
| CN108943444A (en) * | 2017-05-24 | 2018-12-07 | 株式会社迪思科 | Cutting apparatus |
| CN109311177A (en) * | 2016-04-27 | 2019-02-05 | 法比奥·泼尼股份公司 | There are the roundwood saw and grinding method of abrasive wheel |
| CN109473351A (en) * | 2017-09-08 | 2019-03-15 | 株式会社迪思科 | The processing method of chip |
| CN110000940A (en) * | 2018-01-05 | 2019-07-12 | 株式会社迪思科 | Cutting apparatus |
| CN110039674A (en) * | 2018-01-16 | 2019-07-23 | 株式会社迪思科 | The management method and cutting apparatus of cutting tool |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231760A (en) * | 2008-03-25 | 2009-10-08 | Tokyo Seimitsu Co Ltd | Device for detecting breakage/abrasion of blade |
-
2019
- 2019-10-30 CN CN201911051070.9A patent/CN110744731B/en active Active
Patent Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06151581A (en) * | 1992-11-16 | 1994-05-31 | Hitachi Ltd | Method and device for dicing |
| JPH06163687A (en) * | 1992-11-18 | 1994-06-10 | Mitsubishi Electric Corp | Method and device for dicing semiconductor device |
| JP3746422B2 (en) * | 2000-12-05 | 2006-02-15 | シャープ株式会社 | Dicing apparatus and dicing method |
| JP2002370140A (en) * | 2001-06-12 | 2002-12-24 | Disco Abrasive Syst Ltd | Blade monitoring device |
| JP2006116690A (en) * | 2004-09-22 | 2006-05-11 | Disco Abrasive Syst Ltd | Cutting device |
| JP2006310396A (en) * | 2005-04-26 | 2006-11-09 | Tokyo Seimitsu Co Ltd | Blade breakage detector |
| CN101165877A (en) * | 2006-10-17 | 2008-04-23 | 株式会社迪思科 | Laser processing method for gallium arsenide wafer |
| CN101927402A (en) * | 2009-06-17 | 2010-12-29 | 三星钻石工业股份有限公司 | Method for cutting off brittle material substrate |
| JP2011110669A (en) * | 2009-11-27 | 2011-06-09 | Disco Abrasive Syst Ltd | Cutting device |
| CN102343629A (en) * | 2010-07-26 | 2012-02-08 | 澁谷工业株式会社 | Device and method for cutting fragile material |
| JP2012080029A (en) * | 2010-10-06 | 2012-04-19 | Disco Abrasive Syst Ltd | Cutting device |
| JP2013146800A (en) * | 2012-01-17 | 2013-08-01 | Toyota Motor Corp | Device for adjusting reference position of cutting tool |
| CN104096908A (en) * | 2013-04-03 | 2014-10-15 | 苏州宝时得电动工具有限公司 | Miter saw and cutting depth adjusting method for same |
| CN105312775A (en) * | 2014-06-10 | 2016-02-10 | 三星钻石工业股份有限公司 | Processing method for brittle material substrate |
| JP2016068400A (en) * | 2014-09-30 | 2016-05-09 | 株式会社ディスコ | Division method of ceramic substrate |
| CN105810633A (en) * | 2015-01-16 | 2016-07-27 | 株式会社迪思科 | Method for processing wafer |
| CN106903810A (en) * | 2015-10-21 | 2017-06-30 | 株式会社迪思科 | Topping machanism |
| CN109311177A (en) * | 2016-04-27 | 2019-02-05 | 法比奥·泼尼股份公司 | There are the roundwood saw and grinding method of abrasive wheel |
| CN106295140A (en) * | 2016-07-29 | 2017-01-04 | 南京海威机械有限公司 | Error compensating method when a kind of numerical control sizing saw machine workpiece is cut sth. askew |
| CN108015650A (en) * | 2016-11-02 | 2018-05-11 | 株式会社迪思科 | The processing method of chip |
| CN108943444A (en) * | 2017-05-24 | 2018-12-07 | 株式会社迪思科 | Cutting apparatus |
| CN109473351A (en) * | 2017-09-08 | 2019-03-15 | 株式会社迪思科 | The processing method of chip |
| CN110000940A (en) * | 2018-01-05 | 2019-07-12 | 株式会社迪思科 | Cutting apparatus |
| CN110039674A (en) * | 2018-01-16 | 2019-07-23 | 株式会社迪思科 | The management method and cutting apparatus of cutting tool |
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