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CN110702695B - Multi-view visual inspection jig for surface flaws of semiconductor silicon wafer - Google Patents

Multi-view visual inspection jig for surface flaws of semiconductor silicon wafer Download PDF

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Publication number
CN110702695B
CN110702695B CN201910925628.5A CN201910925628A CN110702695B CN 110702695 B CN110702695 B CN 110702695B CN 201910925628 A CN201910925628 A CN 201910925628A CN 110702695 B CN110702695 B CN 110702695B
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China
Prior art keywords
frame
shaft
transverse
longitudinal
swing
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Active
Application number
CN201910925628.5A
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Chinese (zh)
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CN110702695A (en
Inventor
林火旺
刘立清
廖文民
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Dongguan Huashengxin Precision Manufacturing Co ltd
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Dongguan Huashengxin Precision Manufacturing Co ltd
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Priority to CN201910925628.5A priority Critical patent/CN110702695B/en
Publication of CN110702695A publication Critical patent/CN110702695A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106General arrangement of respective parts
    • G01N2021/0112Apparatus in one mechanical, optical or electronic block

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses a multi-view visual inspection jig for surface flaws of a semiconductor silicon wafer, which comprises a rack, a movable rack, a swinging rack, a supporting device, a first driving mechanism and a second driving mechanism, wherein the rack is arranged on the rack; the bearing device comprises a ball shaft and a tray; the lower end of the swing frame is hinged with the upper end of the movable frame, and the movable frame is driven to horizontally and longitudinally move by being matched with the first driving mechanism, so that the swing frame is controlled to universally swing through the horizontal or longitudinal movement of the movable frame, the ball shaft is universally and swingably arranged on the frame through the ball head, and the lower end of the ball shaft is rotatably arranged on the swing frame, so that the ball shaft can correspondingly swing along with the swing of the swing frame; and a second driving mechanism is arranged on the swinging frame, so that the ball shaft is driven to rotate by the second driving mechanism; the silicon wafer is swung in different directions by the first driving mechanism and the second driving mechanism, so that the silicon wafer can be comprehensively inspected from a plurality of angles.

Description

Multi-view visual inspection jig for surface flaws of semiconductor silicon wafer
Technical Field
The invention relates to the technology of the field of silicon wafer inspection, in particular to a multi-view visual inspection jig for surface flaws of a semiconductor silicon wafer.
Background
In semiconductor processing and manufacturing, inspection of the surface of silicon wafers is important, which affects the processing efficiency of silicon wafers. In practice, an operator needs to hold a silicon wafer by hand when inspecting the silicon wafer, and in order to perform a full inspection of the silicon wafer to ensure the accuracy of the inspection, the operator needs to constantly swing the silicon wafer out of various angles to inspect the silicon wafer from a plurality of angles. However, this inspection method of holding the silicon wafer by hand is inconvenient for the operator and is prone to errors. Therefore, a new solution to the above-mentioned problems needs to be studied.
Disclosure of Invention
In view of the above, the present invention aims at overcoming the drawbacks of the prior art, and its primary object is to provide a multi-view visual inspection jig for surface defects of semiconductor silicon wafers, which can solve the problems of inconvenience and easy error when an operator inspects the silicon wafers.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
A multi-view visual inspection jig for surface flaws of a semiconductor silicon wafer comprises a rack, a movable rack, a swinging rack, a bearing device, a first driving mechanism and a second driving mechanism; the movable frame can be horizontally and longitudinally arranged back and forth movably; the lower end of the swing frame is hinged with the upper end of the movable frame; the bearing device comprises a ball shaft and a tray for bearing the semiconductor silicon wafer, wherein the ball shaft is provided with a ball head, the ball shaft is arranged on the rack in a universal swinging way through the ball head, the tray is fixed at the top end of the ball shaft, and the lower end of the ball shaft is rotatably arranged on the swinging rack; the first driving mechanism is arranged on the frame and drives the movable frame to horizontally and longitudinally move back and forth; the second driving mechanism is arranged on the swing frame and drives the ball shaft to rotate.
As a preferable scheme, the movable frame comprises a movable seat and a connecting rod, wherein the connecting rod is rotatably and vertically arranged on the movable seat, and the upper end of the connecting rod is hinged with the lower end of the swinging frame.
As a preferable scheme, the first driving mechanism comprises a transverse driving shaft, a transverse driven shaft, a longitudinal driving shaft, a longitudinal driven shaft, a transverse sliding rod, a longitudinal sliding rod, a transverse motor, a longitudinal motor, two transverse belts and two longitudinal belts; the transverse driving shaft, the transverse driven shaft, the longitudinal driving shaft and the longitudinal driven shaft are rotatably arranged on the frame, the transverse driving shaft and the transverse driven shaft extend longitudinally and are arranged in parallel at a transverse interval, and the longitudinal driving shaft and the longitudinal driven shaft extend transversely and are arranged in parallel at a longitudinal interval; the transverse sliding rod extends longitudinally, and two ends of the transverse sliding rod are respectively sleeved on the longitudinal driving shaft and the longitudinal driven shaft in a sliding manner; the longitudinal sliding rod transversely extends, and two ends of the longitudinal sliding rod are respectively sleeved on the transverse driving shaft and the transverse driven shaft in a sliding manner; the transverse motor is fixed on the frame and drives the transverse driving shaft to rotate; the longitudinal motor is fixed on the frame and drives the longitudinal driving shaft to rotate; the two transverse belts extend transversely and are longitudinally arranged at intervals in parallel, the two transverse belts are connected between a transverse driving shaft and a transverse driven shaft, two ends of the transverse sliding rod are fixedly connected with the two transverse belts respectively, and the movable seat is sleeved on the transverse sliding rod in a sliding manner; the two longitudinal belts extend longitudinally and are arranged in parallel at a transverse interval, the two longitudinal belts are connected between a longitudinal driving shaft and a longitudinal driven shaft, two ends of the longitudinal sliding rod are fixedly connected with the two longitudinal belts respectively, and the movable seat is sleeved on the longitudinal sliding rod in a sliding manner.
As a preferable scheme, the second driving mechanism comprises a motor, a driving belt pulley and a driven belt pulley; the motor is fixed on the swing frame, the driving belt wheel is arranged on an output shaft of the motor, the driven belt wheel is fixed at the lower end of the ball shaft, and a transmission belt is connected between the driven belt wheel and the driving belt wheel.
As a preferable scheme, an air cavity is formed in the tray, the tray is provided with a concave position matched with the semiconductor silicon wafer, a plurality of air holes are formed in the bottom surface of the concave position, the air holes are distributed at intervals and are communicated with the air cavity, the upper end face and the lower end face of the ball shaft penetrate through an air channel, and the upper end of the air channel is communicated with the air cavity.
As a preferable scheme, the side of frame encapsulates there is the curb plate, and the top surface encapsulation of this frame has the roof, and this movable frame, swing frame, first actuating mechanism and second actuating mechanism all are located the frame, and this bulb exposes in the surface of roof, and this tray is located the top of roof.
As a preferable scheme, the upper end of the ball shaft is sleeved with a dustproof soft cover, and the dustproof soft cover is propped against the surface of the top plate and covers the ball head.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and in particular, the technical scheme can be as follows:
The lower end of the swing frame is hinged with the upper end of the movable frame, and the movable frame is driven to horizontally and longitudinally move back and forth by being matched with the first driving mechanism, so that the swing frame is controlled to swing in a universal mode through the horizontal or longitudinal movement of the movable frame, furthermore, the ball shaft is arranged on the frame in a universal mode through the ball head in a swinging mode, the lower end of the ball shaft is arranged on the swing frame in a rotatable mode, and accordingly the ball shaft can swing correspondingly along with the swing of the swing frame, and therefore the function that the first driving mechanism controls the ball shaft to swing in a universal mode is achieved; and a second driving mechanism is arranged on the swinging frame, so that the ball shaft is driven to rotate by the second driving mechanism; therefore, the product can control the universal swing of the ball shaft, and can control the rotation of the ball shaft, so that the tray arranged at the top end of the ball shaft moves correspondingly along with the movement of the ball shaft, when the product is in practical application, an operator can swing the silicon wafer towards different directions through the first driving mechanism after placing the silicon wafer on the tray, and the corresponding position on the silicon wafer can be automatically rotated into the inspection range through the second driving mechanism, so that the silicon wafer can be comprehensively inspected from a plurality of angles.
In order to more clearly illustrate the structural features and efficacy of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is an assembled perspective view of a preferred embodiment of the present invention;
FIG. 2 is an internal block diagram of the preferred embodiment of the present invention;
FIG. 3 is a diagram showing the internal connection relation structure of the preferred embodiment of the present invention;
FIG. 4 is a partial block diagram of a preferred embodiment of the present invention;
FIG. 5 is another partial block diagram of the preferred embodiment of the present invention;
FIG. 6 is a further partial block diagram of the preferred embodiment of the present invention;
FIG. 7 is a view of a support device according to a preferred embodiment of the present invention;
FIG. 8 is a cross-sectional view of a preferred embodiment of the present invention.
The attached drawings are used for identifying and describing:
10. Frame 20, movable frame
21. Movable seat 22, connecting rod
30. Swing frame 40 and bearing device
41. Ball axle 411, ball head
412. Airway 42, tray
421. Air cavity 422, recess
423. Air hole 50, first driving mechanism
51. A transverse driving shaft 52 and a transverse driven shaft
53. Longitudinal driving shaft 54 and longitudinal driven shaft
55. Transverse slide bar 56 and longitudinal slide bar
57. Transverse motor 58, longitudinal motor
59. Transverse belt 501 and longitudinal belt
60. Second driving mechanism 61 and motor
62. Driving pulley 63 and driven pulley
71. Side plate 72 and top plate
80. Silicon wafer 90, dust-proof soft cover.
Detailed Description
Referring to fig. 1 to 8, a specific structure of a preferred embodiment of the present invention is shown, which includes a frame 10, a movable frame 20, a swinging frame 30, a supporting device 40, a first driving mechanism 50 and a second driving mechanism 60.
In this embodiment, the frame 10 is a square frame, the side of the frame 10 is encapsulated with a side plate 71, the top surface of the frame 10 is encapsulated with a top plate 72, and the movable frame 20, the swinging frame 30, the first driving mechanism 50 and the second driving mechanism 60 are all positioned in the frame 10, so that the frame 10 and the internal structure thereof can be isolated from the outside through the side plate 71 and the top plate 72, and the danger caused by the operator touching the internal structure during the use is prevented.
The movable frame 20 can be horizontally and longitudinally movably arranged back and forth; in this embodiment, the movable frame 20 includes a movable base 21 and a connecting rod 22, and the connecting rod 22 is vertically rotatably mounted on the movable base 21.
The lower end of the swing frame 30 is hinged with the upper end of the movable frame 20, and the swing frame 30 is controlled to swing in a universal way through the horizontal transverse or longitudinal movement of the movable frame 20; in this embodiment, the upper end of the connecting rod 22 is hinged to the lower end of the swing frame 30.
The supporting device 40 comprises a ball shaft 41 and a tray 42 for supporting the semiconductor silicon wafer 80, wherein the ball shaft 41 is provided with a ball head 411, the ball shaft 41 is arranged on the frame 10 in a universal swinging way through the ball head 411, the tray 42 is fixed at the top end of the ball shaft 41, and the lower end of the ball shaft 41 is rotatably arranged on the swinging frame 30, so that the ball shaft 41 can correspondingly swing in different directions along with the swinging of the swinging frame 30; in this embodiment, an air cavity 421 is provided in the tray 42, the tray 42 has a recess 422 adapted to the semiconductor silicon wafer 80, a plurality of air holes 423 are provided on the bottom surface of the recess 422, the plurality of air holes 423 are arranged at intervals and are all communicated with the air cavity 421, and the upper and lower end surfaces of the ball shaft 41 are penetrated with an air channel 412, the upper end of the air channel 412 is communicated with the air cavity 421, thus, before use, the air pipe of the external device is communicated with the lower end of the air channel 412, and then, after the operator places the silicon wafer 80 in the recess 422, the external device is started to suck air, and suction is formed at the air holes 423 to firmly fix the silicon wafer 80 on the recess 422; and the ball head 411 is exposed on the surface of the top plate 72, the tray 42 is located above the top plate 72, and the upper end of the ball shaft 41 is sleeved with a dust-proof soft cover 90, and the dust-proof soft cover 90 abuts against the surface of the top plate 72 and covers the ball head 411.
The first driving mechanism 50 is disposed on the frame 10 and drives the movable frame 20 to move horizontally and longitudinally.
Specifically, the first driving mechanism 50 includes a transverse driving shaft 51, a transverse driven shaft 52, a longitudinal driving shaft 53, a longitudinal driven shaft 54, a transverse slide bar 55, a longitudinal slide bar 56, a transverse motor 57, a longitudinal motor 58, two transverse belts 59, and two longitudinal belts 501; the transverse driving shaft 51, the transverse driven shaft 52, the longitudinal driving shaft 53 and the longitudinal driven shaft 54 are rotatably mounted on the frame 10, the transverse driving shaft 51 and the transverse driven shaft 52 extend longitudinally and are arranged in parallel at a transverse interval, and the longitudinal driving shaft 53 and the longitudinal driven shaft 54 extend transversely and are arranged in parallel at a longitudinal interval; the transverse slide bar 55 extends longitudinally, and two ends of the transverse slide bar 55 are respectively sleeved on the longitudinal driving shaft 53 and the longitudinal driven shaft 54 in a sliding manner; the longitudinal slide bar 56 extends transversely, and two ends of the longitudinal slide bar 56 are respectively sleeved on the transverse driving shaft 51 and the transverse driven shaft 52 in a sliding manner; the transverse motor 57 is fixed on the frame 10 and drives the transverse driving shaft 51 to rotate; the longitudinal motor 58 is fixed on the frame 10 and drives the longitudinal driving shaft 53 to rotate; the two transverse belts 59 extend transversely and are arranged in parallel at a longitudinal interval, the two transverse belts 59 are connected between the transverse driving shaft 51 and the transverse driven shaft 52, two ends of the transverse sliding rod 55 are fixedly connected with the two transverse belts 59 respectively, the movable seat 21 is slidably sleeved on the transverse sliding rod 55, so that when the transverse motor 57 is started, the transverse motor 57 drives the transverse driving shaft 51 to rotate, the transverse belts 59 transversely drive, and the transverse sliding rod 55 transversely moves and pushes the movable seat 21 to transversely move under the drive of the transverse belts 59; the two longitudinal belts 501 extend longitudinally and are arranged in parallel at a transverse interval, the two longitudinal belts 501 are connected between the longitudinal driving shaft 53 and the longitudinal driven shaft 54, two ends of the longitudinal slide bar 56 are fixedly connected with the two longitudinal belts 501 respectively, the movable seat 21 is slidably sleeved on the longitudinal slide bar 56, so that when the longitudinal motor 58 is started, the longitudinal motor 58 drives the longitudinal driving shaft 53 to rotate, the longitudinal belts 501 are longitudinally driven, and the longitudinal slide bar 56 is driven by the longitudinal belts 501 to longitudinally move and push the movable seat 21 to longitudinally move.
The second driving mechanism 60 is disposed on the swing frame 30 and drives the ball shaft 41 to rotate; in the present embodiment, the second driving mechanism 60 includes a motor 61, a driving pulley 62, and a driven pulley 63; the motor 61 is fixed to the swing frame 30, the driving pulley 62 is mounted on an output shaft of the motor 61, the driven pulley 63 is fixed to a lower end of the ball shaft 41, and a driving belt (not shown) is connected between the driven pulley 63 and the driving pulley 62, so that the motor 61 can drive the ball shaft 41 to rotate.
The method of use of this embodiment is described in detail as follows:
The air tube of the external device is first connected to the lower end of the air passage 412. Then, after the silicon wafer 80 to be inspected is placed in the recess 422, the external device is activated to suck air, and at this time, the tray 42 firmly sucks the silicon wafer 80 on the recess 422. Then, according to the actual inspection requirement, the first driving mechanism 50 drives the movable frame 20 to move transversely or longitudinally for a certain distance, so as to drive the swinging frame 30 to swing to a certain angle, at this time, the ball shaft 41 swings along with the swinging frame 30 to form a corresponding angle, the silicon wafer 80 on the tray 42 also swings to a corresponding angle, furthermore, the second driving mechanism 60 can control the ball shaft 41 to rotate correspondingly, the silicon wafer 80 on the tray 42 also rotates, and after the silicon wafer 80 is adjusted to a proper inspection position, an operator can conveniently perform visual inspection or photographing inspection on the silicon wafer 80 by adopting a camera. When the inspection is finished, the external equipment is stopped to remove the suction force, so that the operator can remove the inspected silicon wafer 80.
The design focus of the invention is that:
The lower end of the swing frame is hinged with the upper end of the movable frame, and the movable frame is driven to horizontally and longitudinally move back and forth by being matched with the first driving mechanism, so that the swing frame is controlled to swing in a universal mode through the horizontal or longitudinal movement of the movable frame, furthermore, the ball shaft is arranged on the frame in a universal mode through the ball head in a swinging mode, the lower end of the ball shaft is arranged on the swing frame in a rotatable mode, and accordingly the ball shaft can swing correspondingly along with the swing of the swing frame, and therefore the function that the first driving mechanism controls the ball shaft to swing in a universal mode is achieved; and a second driving mechanism is arranged on the swinging frame, so that the ball shaft is driven to rotate by the second driving mechanism; therefore, the product can control the universal swing of the ball shaft, and can control the rotation of the ball shaft, so that the tray arranged at the top end of the ball shaft moves correspondingly along with the movement of the ball shaft, when the product is in practical application, an operator can swing the silicon wafer towards different directions through the first driving mechanism after placing the silicon wafer on the tray, and the corresponding position on the silicon wafer can be automatically rotated into the inspection range through the second driving mechanism, so that the silicon wafer can be comprehensively inspected from a plurality of angles.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention are still within the scope of the technical solutions of the present invention.

Claims (3)

1. A multi-view visual inspection jig for surface flaws of a semiconductor silicon wafer is characterized in that: comprises a frame, a movable frame, a swinging frame, a bearing device, a first driving mechanism and a second driving mechanism; the movable frame can be horizontally and longitudinally arranged back and forth movably; the lower end of the swing frame is hinged with the upper end of the movable frame; the bearing device comprises a ball shaft and a tray for bearing the semiconductor silicon wafer, wherein the ball shaft is provided with a ball head, the ball shaft is arranged on the rack through the ball head in a universal swinging way, the tray is fixed at the top end of the ball shaft, and the lower end of the ball shaft is rotatably arranged on the swinging frame, so that the ball shaft swings correspondingly towards different directions along with the swinging of the swinging frame; the first driving mechanism is arranged on the frame and drives the movable frame to horizontally and longitudinally move back and forth; the second driving mechanism is arranged on the swing frame and drives the ball shaft to rotate;
The movable frame comprises a movable seat and a connecting rod, the connecting rod is rotatably and vertically arranged on the movable seat, and the upper end of the connecting rod is hinged with the lower end of the swinging frame; the lower end of the swing frame is hinged with the upper end of the movable frame, and the movable frame is driven to horizontally and longitudinally move back and forth by being matched with the first driving mechanism, so that the swing frame is controlled to swing in a universal way through the horizontal or longitudinal movement of the movable frame, the ball shaft is arranged on the frame in a universal way through the ball head, and the lower end of the ball shaft is rotatably arranged on the swing frame, so that the ball shaft can correspondingly swing along with the swing of the swing frame, and the function of controlling the universal swing of the ball shaft through the first driving mechanism is realized;
The second driving mechanism comprises a motor, a driving belt pulley and a driven belt pulley; the motor is fixed on the swing frame, the driving belt pulley is arranged on an output shaft of the motor, the driven belt pulley is fixed at the lower end of the ball shaft, and a transmission belt is connected between the driven belt pulley and the driving belt pulley;
the tray is internally provided with an air cavity, the tray is provided with a concave position matched with the semiconductor silicon wafer, the bottom surface of the concave position is provided with a plurality of air holes which are distributed at intervals and are communicated with the air cavity, the upper end surface and the lower end surface of the ball shaft penetrate through an air passage, and the upper end of the air passage is communicated with the air cavity;
the side of frame encapsulates there is the curb plate, and the top surface encapsulation of this frame has the roof, and this movable frame, swing frame, first actuating mechanism and second actuating mechanism all are located the frame, and this bulb exposes in the surface of roof, and this tray is located the top of roof.
2. The multi-view visual inspection jig for surface defects of a semiconductor silicon wafer according to claim 1, wherein: the first driving mechanism comprises a transverse driving shaft, a transverse driven shaft, a longitudinal driving shaft, a longitudinal driven shaft, a transverse sliding rod, a longitudinal sliding rod, a transverse motor, a longitudinal motor, two transverse belts and two longitudinal belts; the transverse driving shaft, the transverse driven shaft, the longitudinal driving shaft and the longitudinal driven shaft are rotatably arranged on the frame, the transverse driving shaft and the transverse driven shaft extend longitudinally and are arranged in parallel at a transverse interval, and the longitudinal driving shaft and the longitudinal driven shaft extend transversely and are arranged in parallel at a longitudinal interval; the transverse sliding rod extends longitudinally, and two ends of the transverse sliding rod are respectively sleeved on the longitudinal driving shaft and the longitudinal driven shaft in a sliding manner; the longitudinal sliding rod transversely extends, and two ends of the longitudinal sliding rod are respectively sleeved on the transverse driving shaft and the transverse driven shaft in a sliding manner; the transverse motor is fixed on the frame and drives the transverse driving shaft to rotate; the longitudinal motor is fixed on the frame and drives the longitudinal driving shaft to rotate; the two transverse belts extend transversely and are longitudinally arranged at intervals in parallel, the two transverse belts are connected between a transverse driving shaft and a transverse driven shaft, two ends of the transverse sliding rod are fixedly connected with the two transverse belts respectively, and the movable seat is sleeved on the transverse sliding rod in a sliding manner; the two longitudinal belts extend longitudinally and are arranged in parallel at a transverse interval, the two longitudinal belts are connected between a longitudinal driving shaft and a longitudinal driven shaft, two ends of the longitudinal sliding rod are fixedly connected with the two longitudinal belts respectively, and the movable seat is sleeved on the longitudinal sliding rod in a sliding manner.
3. The multi-view visual inspection jig for surface defects of a semiconductor silicon wafer according to claim 1, wherein: the upper end of the ball shaft is sleeved with a dustproof soft cover, and the dustproof soft cover is propped against the surface of the top plate and covers the ball head.
CN201910925628.5A 2019-09-27 2019-09-27 Multi-view visual inspection jig for surface flaws of semiconductor silicon wafer Active CN110702695B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910925628.5A CN110702695B (en) 2019-09-27 2019-09-27 Multi-view visual inspection jig for surface flaws of semiconductor silicon wafer

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Application Number Priority Date Filing Date Title
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CN110702695B true CN110702695B (en) 2024-07-23

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117074303A (en) * 2023-06-13 2023-11-17 浙江精瓷半导体有限责任公司 Multi-view visual inspection jig for surface flaws of semiconductor silicon wafer

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CN106680296A (en) * 2017-02-27 2017-05-17 苏州杰锐思自动化设备有限公司 Multi-station backlight module AOI (automatic optical inspector) testing device and method
CN208588683U (en) * 2018-07-24 2019-03-08 深圳东瑞兴联智能科技有限公司 A kind of multi-angle movable equipment for the detection of chemical fiber wire ingot

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JP2002323452A (en) * 2001-04-27 2002-11-08 Mitsuboshi Belting Ltd Apparatus for inspecting external appearance of automobile upholstery
CN101767096B (en) * 2010-01-20 2013-05-29 湖南大学 Bottle reject mechanism of online visual inspection robot for visible foreign matters in bottled liquid
CN208383743U (en) * 2018-07-04 2019-01-15 浙江省产品质量安全检测研究院 A kind of surface defect automatic detection device that steel ball surface is unfolded entirely
CN210982257U (en) * 2019-09-27 2020-07-10 东莞市庆颖智能自动化科技有限公司 Multi-view visual inspection jig for surface defects of semiconductor silicon wafer

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106680296A (en) * 2017-02-27 2017-05-17 苏州杰锐思自动化设备有限公司 Multi-station backlight module AOI (automatic optical inspector) testing device and method
CN208588683U (en) * 2018-07-24 2019-03-08 深圳东瑞兴联智能科技有限公司 A kind of multi-angle movable equipment for the detection of chemical fiber wire ingot

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