CN110690179B - Laminated low-loss chip integrated waveguide packaging structure - Google Patents
Laminated low-loss chip integrated waveguide packaging structure Download PDFInfo
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- CN110690179B CN110690179B CN201910930517.3A CN201910930517A CN110690179B CN 110690179 B CN110690179 B CN 110690179B CN 201910930517 A CN201910930517 A CN 201910930517A CN 110690179 B CN110690179 B CN 110690179B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6683—High-frequency adaptations for monolithic microwave integrated circuit [MMIC]
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Power Engineering (AREA)
- Electromagnetism (AREA)
- Waveguides (AREA)
Abstract
The invention discloses a laminated low-loss chip integrated waveguide packaging structure, which comprises: the antenna comprises a chip carrier plate, a cavity shell arranged on the chip carrier plate, a chip embedded in the cavity shell and antennas connected below two sides of the chip; the chip carrier plate and the cavity shell are provided with waveguide cavities with downward openings at positions corresponding to the antennas on two sides of the chip, and the waveguide cavities are of cavity structures with gradually changed sizes from bottom to top; the cavity housing is a laminated plurality of metal sheets, and each metal sheet has an electromagnetic band gap structure. The antenna and the chip are integrally packaged together, so that the packaging size is reduced, meanwhile, the cavity shell is formed by laminating a plurality of layers of metal sheets, and the waveguide cavity is formed by the laminated metal sheets, thereby being beneficial to preventing electromagnetic wave leakage, further reducing the volume of the chip integrated waveguide, and being beneficial to the development of miniaturization, light weight and large-scale integrated products.
Description
Technical Field
The invention relates to the technical field of microwave circuit packaging, in particular to a laminated low-loss chip integrated waveguide packaging structure.
Background
The development of monolithic integrated circuits (MMICs) has remained highly consistent with the growth of society in many respects. In the development process, cost and performance play a leading role in promoting, so that a smaller monolithic circuit with higher integration degree gradually replaces a traveling wave tube and an electron tube. With the rapid development of microelectronic and microwave vacuum electronic devices, the performance requirements for various microwave components and devices are higher and higher, especially in aerospace and military electronic technologies, the use environment of electronic equipment is very harsh, and the performance of various components, especially microwave devices, must meet very harsh requirements, such as: vacuum tightness, excellent heat dissipation performance, high mechanical strength, high thermal shock resistance, high temperature cycling resistance and the like.
The traditional waveguide is mostly of an integral structure, is not beneficial to processing and manufacturing the waveguide with complex requirements, has high manufacturing cost and is not beneficial to adhering the MMIC chip and the integrated antenna into a cavity. Therefore, the reasonable waveguide manufacturing method and the cavity structure are effective ways for reducing the processing difficulty and reducing the electromagnetic wave signal loss, and the assembly process can be simplified through the structural design of metal sheet lamination, so that the high-efficiency transmission of microwave signals is realized, and the signal loss is reduced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the existing problems, the laminated low-loss chip integrated waveguide packaging structure is provided, and the cavity shell is designed into the laminated metal sheet, so that the packaging size is reduced when the chip integrated waveguide is realized, and the development of miniaturization, light weight and large-scale integration products is facilitated.
The technical scheme adopted by the invention is as follows:
a stacked, low-loss chip-integrated waveguide package structure, comprising: the antenna comprises a chip carrier plate, a cavity shell arranged on the chip carrier plate, a chip embedded in the cavity shell and antennas connected below two sides of the chip; the chip carrier plate and the cavity shell are provided with waveguide cavities with downward openings at positions corresponding to the antennas on two sides of the chip, and the waveguide cavities are of cavity structures with gradually changed sizes from bottom to top; the cavity housing is a laminated plurality of metal sheets, and each metal sheet has an electromagnetic band gap structure.
In one embodiment, the waveguide cavities disposed on both sides of the chip are symmetrical.
In one embodiment, the chip carrier is a PCB board etched with circuitry.
In one embodiment, the PCB board is FR4 material.
In one embodiment, the antenna is a unitary or multi-element antenna.
In one embodiment, the radiating patches of the antenna are rectangular, circular or sector-shaped.
In one embodiment, the antenna is arranged below two sides of the chip by means of bonding.
In one embodiment, the die is attached to the underlying metal sheet by soldering.
In one embodiment, the chip carrier and each metal thin plate have flange holes corresponding to the positions of the chip carrier and each metal thin plate for fixing the relative positions of the chip carrier and each metal thin plate.
In one embodiment, when the stacked low-loss chip integrated waveguide package structure is used, signals are transmitted from the antenna and the corresponding waveguide cavity on one side of the chip and are transmitted from the antenna and the corresponding waveguide cavity on the other side of the chip.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
the invention integrally encapsulates the antenna and the chip together, reduces the encapsulation size, simultaneously, the cavity shell is formed by laminating a plurality of metal sheets, and the waveguide cavity is formed by the laminated metal sheets, thereby being beneficial to preventing electromagnetic wave leakage, further reducing the volume of the chip integrated waveguide, and being beneficial to the development of miniaturization, light weight and large-scale integrated products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a front view of a package structure of a stacked low-loss chip integrated waveguide according to the present invention.
Fig. 2a-2b are perspective views of the stacked low-loss chip integrated waveguide package structure according to the present invention.
Reference numeral, 10-chip carrier plate, 20-cavity shell, 30-chip, 40-antenna, 50-electromagnetic band gap structure, 60-flange hole.
Detailed Description
The invention relates to a laminated low-loss chip integrated waveguide packaging structure, which comprises: the antenna comprises a chip carrier plate, a cavity shell arranged on the chip carrier plate, a chip embedded in the cavity shell and antennas connected below two sides of the chip; the chip carrier plate and the cavity shell are provided with waveguide cavities with downward openings at positions corresponding to the antennas on two sides of the chip, and the waveguide cavities are of cavity structures with gradually changed sizes from bottom to top; the cavity housing is a laminated plurality of metal sheets, and each metal sheet has an electromagnetic band gap structure.
The invention integrally encapsulates the antenna and the chip together, reduces the encapsulation size, simultaneously, the cavity shell is formed by laminating a plurality of metal sheets, and the waveguide cavity is formed by the laminated metal sheets, thereby being beneficial to preventing electromagnetic wave leakage, further reducing the volume of the chip integrated waveguide, and being beneficial to the development of miniaturization, light weight and large-scale integrated products.
The features and properties of the present invention are described in further detail below with reference to examples.
A stacked low-loss chip 30 integrated waveguide package structure of the present embodiment, as shown in fig. 1, 2a and 2b, includes: the antenna comprises a chip carrier plate 10, a cavity shell 20 arranged on the chip carrier plate 10, a chip 30 embedded in the cavity shell 20, and antennas 40 connected below two sides of the chip 30; the chip carrier plate 10 and the cavity housing 20 are provided with waveguide cavities with downward openings at positions corresponding to the antenna 40 on two sides of the chip 30, and the waveguide cavities have a cavity structure gradually changing in size from bottom to top; the cavity housing 20 is a stack of 5 metal sheets, i.e. metal sheets 1, 2, 3, 4, 5 as shown in fig. 1, and each metal sheet has an electromagnetic bandgap structure 50(EBG structure).
In the present embodiment, the waveguide cavities disposed on both sides of the chip 30 are symmetrical.
In this embodiment, the chip carrier 10 is a PCB board etched with a circuit.
In this embodiment, the PCB is made of FR4 material.
In the present embodiment, the antenna 40 is a single element or multi-element array antenna 40.
In the present embodiment, the radiating patch of the antenna 40 is rectangular, circular or fan-shaped.
In the present embodiment, the antenna 40 is disposed below two sides of the chip 30 by means of adhesion.
In the present embodiment, the chip 30 is disposed on the metal sheet (i.e., the metal sheet 1) therebelow by means of soldering.
In the present embodiment, the chip carrier 10 and each metal thin plate have corresponding flange holes 60 for fixing the relative positions of the chip carrier 10 and each metal thin plate.
The packaging process comprises the following steps:
(1) determining the structure of the waveguide cavity and the electromagnetic band gap structure 50 through simulation according to the frequency band of the waveguide;
(2) and according to the simulation result, digging holes corresponding to the metal sheets of each layer on the PCB and the 5 layers of metal sheets. The waveguide cavity is of a cavity structure with gradually changed size from bottom to top, so that holes corresponding to the waveguide cavity on the PCB and the 5 layers of metal sheets are different in size; in addition, the electromagnetic bandgap structure 50 is an EBG structure, and in this embodiment, a hollow structure obtained by digging a hole in each layer of metal thin plate is the electromagnetic bandgap structure 50.
(3) And manufacturing flange holes 60 corresponding to the positions of the PCB and each layer of metal thin plate. The flange holes 60 may be two corners, or all four corners, on a diagonal of the PCB board and each sheet metal.
Step 2, integrating the chip 30 with the antenna 40;
the antenna 40 is arranged below two sides of the chip 30 by means of bonding, and can be integrated by adopting an integrated circuit packaging process, and the antenna 40 array is integrated in the package, so that sufficient signal gain is provided, and size minimization is realized.
Step 3, packaging;
(1) welding a chip 30 of the integrated antenna 40 in the step 2 on the metal sheet 1 manufactured in the step 1;
(2) laminating the metal sheets 2, 3, 4 and 5 on the metal sheet 1 from bottom to top;
(3) and is fixed with screws through the flange holes 60.
When the laminated low-loss chip 30 integrated waveguide packaging structure obtained through the packaging process is used, due to the symmetrical structure, signals are transmitted from the waveguide cavity a and transmitted from the waveguide cavity b; or the signal is transmitted from the waveguide cavity b and transmitted from the waveguide cavity a.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A stacked, low-loss chip-integrated waveguide package, comprising: the antenna comprises a chip carrier plate, a cavity shell arranged on the chip carrier plate, a chip embedded in the cavity shell and antennas connected below two sides of the chip; the chip carrier plate and the cavity shell are provided with waveguide cavities with downward openings at positions corresponding to the antennas on two sides of the chip, and the waveguide cavities are of cavity structures with gradually changed sizes from bottom to top; the cavity housing is a laminated plurality of metal sheets, and each metal sheet has an electromagnetic band gap structure.
2. The stacked low-loss chip-integrated waveguide package structure according to claim 1, wherein the waveguide cavities disposed on both sides of the chip are symmetrical.
3. The stacked low-loss chip-integrated waveguide package structure according to claim 1, wherein the chip carrier is a PCB board etched with a circuit.
4. The stacked low-loss chip-integrated waveguide package according to claim 3, wherein the PCB is FR4 material.
5. The stacked low-loss chip-integrated waveguide package structure according to claim 1, wherein the antenna is a single-element or multi-element array antenna.
6. The stacked low-loss chip-integrated waveguide package structure according to claim 1, wherein the radiating patch of the antenna is rectangular, circular or fan-shaped.
7. The stacked low-loss chip-integrated waveguide package structure according to claim 1, 5 or 6, wherein the antenna is disposed under two sides of the chip by means of bonding.
8. The stacked low-loss chip-integrated waveguide package structure according to claim 1, wherein the chip is disposed on the metal sheet thereunder by soldering.
9. The stacked low-loss chip-integrated waveguide package structure according to claim 1, wherein the chip carrier and each metal sheet have corresponding flange holes for fixing the relative positions of the chip carrier and each metal sheet.
10. The stacked low-loss chip-integrated waveguide package structure according to claim 1, wherein, in use, signals are transmitted from the antenna and the corresponding waveguide cavity on one side of the chip and transmitted from the antenna and the corresponding waveguide cavity on the other side of the chip.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910930517.3A CN110690179B (en) | 2019-09-29 | 2019-09-29 | Laminated low-loss chip integrated waveguide packaging structure |
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| CN201910930517.3A CN110690179B (en) | 2019-09-29 | 2019-09-29 | Laminated low-loss chip integrated waveguide packaging structure |
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| CN110690179A CN110690179A (en) | 2020-01-14 |
| CN110690179B true CN110690179B (en) | 2020-11-24 |
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| CN109669248A (en) * | 2017-10-13 | 2019-04-23 | 苏州旭创科技有限公司 | Optical waveguide coupled encapsulating structure, installation method and optical module |
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| KR100998720B1 (en) * | 2007-12-07 | 2010-12-07 | 삼성전기주식회사 | Electromagnetic bandgap structure and printed circuit board |
| US8093700B2 (en) * | 2008-12-16 | 2012-01-10 | Freescale Semiconductor, Inc. | Packaging millimeter wave modules |
| US8536954B2 (en) * | 2010-06-02 | 2013-09-17 | Siklu Communication ltd. | Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein |
| CN201682693U (en) * | 2010-05-31 | 2010-12-22 | 苏州博海创业微系统有限公司 | Electromagnetic band gap structure |
| CN102074772B (en) * | 2011-01-07 | 2014-01-29 | 中国电子科技集团公司第十研究所 | Strip line waveguide switch |
| CN105940553A (en) * | 2014-02-14 | 2016-09-14 | Hrl实验室有限责任公司 | A reconfigurable electromagnetic surface of pixelated metal patches |
| CN104051434B (en) * | 2014-05-28 | 2017-05-24 | 西安电子科技大学 | Packaging structure for integrating VCO and waveguide antenna |
| JP2019054315A (en) * | 2016-04-28 | 2019-04-04 | 日本電産エレシス株式会社 | Mounting board, waveguide module, integrated circuit mounting board, microwave module, radar device and radar system |
| US10325850B1 (en) * | 2016-10-20 | 2019-06-18 | Macom Technology Solutions Holdings, Inc. | Ground pattern for solderability and radio-frequency properties in millimeter-wave packages |
| US10297927B2 (en) * | 2017-05-01 | 2019-05-21 | Intel Corporation | Antenna package for large-scale millimeter wave phased arrays |
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| CN109669248A (en) * | 2017-10-13 | 2019-04-23 | 苏州旭创科技有限公司 | Optical waveguide coupled encapsulating structure, installation method and optical module |
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