CN110686541A - Method for manufacturing capillary structure - Google Patents
Method for manufacturing capillary structure Download PDFInfo
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- CN110686541A CN110686541A CN201810725715.1A CN201810725715A CN110686541A CN 110686541 A CN110686541 A CN 110686541A CN 201810725715 A CN201810725715 A CN 201810725715A CN 110686541 A CN110686541 A CN 110686541A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Powder Metallurgy (AREA)
Abstract
The invention provides a method for manufacturing a capillary structure. It includes: an element having a solderable surface is provided. A first solder powder having a first melting point is provided. A second powder is provided having a second melting point and a solderable surface, where the second melting point is higher than the first melting point. The first solder powder and the second powder are uniformly mixed to form a third powder. A third powder is laid on the weldable surface of the component. The element is heated to a temperature higher than or equal to the first melting point by melting the first solder powder to weld the weldable surface of the element and simultaneously forming a weld joint on the part of the surface between the second powder particles. The component is cooled so that the second powder forms a capillary structure on the solderable surface of the component. Therefore, the method for manufacturing the capillary structure has the effects of low-temperature forming, energy saving and cost reduction.
Description
Technical Field
The invention provides a method for manufacturing a capillary structure, in particular to a method for manufacturing a Micro Heat Pipe (Micro Heat Pipe) and a capillary structure (WickStructure) on the inner surface of a cavity structure of a temperature-uniforming plate (Vapor Chamber) which can reduce the temperature and save the energy.
Background
The Micro heat pipe is a Passive Component (Passive Component) with fast heat conduction and uniform temperature characteristics, is commonly used for heat dissipation of microprocessors (Micro processors) of various information and communication products, and is a very common high-efficiency heat conduction Component in the heat dissipation device of the electronic products nowadays.
The micro heat pipe is basically a closed cavity containing working fluid, and the purpose of heat transfer is achieved by means of liquid-gas two-phase change of the continuous circulation of the working fluid in the vacuum cavity. The liquid phase working fluid is evaporated into a gas phase working fluid at the Heat absorption end of the micro Heat pipe, Latent Heat (Latent Heat) is released, and the local high pressure drives the gas phase working fluid to flow to the condensation end (Condensor) at a high speed. The gas phase working fluid is condensed into a liquid phase at the condensation end, flows back to the heat absorption end by virtue of the capillary phenomenon generated by the capillary structure, and is circulated. Therefore, the capillary structure determines the heat conducting property of the micro heat pipe.
In the prior art, a Micro Heat Pipe (Micro Heat Pipe) capillary structure for sintering copper powder is manufactured by placing a center rod in the center of a copper Pipe, pouring powdered copper powder into the copper Pipe, and sintering at a high temperature. And cooling after sintering, and then pulling out the central rod from the copper pipe body to form a capillary structure on the inner pipe wall of the copper pipe body. The particle size and distribution of the copper powder affect the porosity and are the factors of the quality of the capillary structure. On the other hand, in order to sinter the copper powder in the copper tube under the condition of partial melting, and to avoid too low porosity and deformation of the copper tube, the sintering time and temperature must be accurately controlled in practice. Furthermore, the melting point of copper is 1085 ℃, and a large amount of heat energy and electric power are required to be consumed when sintering copper powder at a high temperature.
In the prior art, a capillary structure of a sintered copper powder Vapor Chamber (Vapor Chamber) is manufactured by spreading copper powder on a copper plate and sintering at high temperature, and then cooling the copper plate after sintering to form a capillary structure on the surface of the copper plate
Therefore, a method for manufacturing a micro-heating conduit and a capillary structure of a vapor chamber by powder molding with low temperature and low energy consumption is needed.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a capillary structure, in which metal powders with different melting points are laid on a weldable surface of an element, and the capillary structure required by a micro-heating conduit and a uniform-temperature plate element can be formed only by melting the metal powders with low melting points at a low temperature.
The invention provides a method for manufacturing a micro heat pipe and a capillary structure in a temperature-equalizing plate, which comprises the following steps: an element having a solderable surface is provided. A first solder powder having a first melting point is provided. Providing a second powder having a second melting point and a solderable surface, wherein the second melting point is at a higher temperature than the first melting point. The first solder powder and the second powder are uniformly mixed to form a third powder. A third powder is laid on the weldable surface of the element. The component is heated to a first melting point by melting the first solder powder to weld the weldable surface of the component and simultaneously forming a weld on the portion of the surface between the second powder particles. And cooling the element to enable the second powder to form an irregularly-shaped capillary structure on the surface of the element.
In one embodiment, the capillary structure formed by the device is a capillary structure in a cavity structure of a Micro heat pipe (Micro HeatPipe) or a Vapor Chamber (Vapor Chamber).
In one embodiment, the first solder powder particles have a smaller distribution size than the second solder powder particles.
In one aspect of the present invention, the capillary structure is formed according to a particle size distribution and a mixing ratio of the first solder powder and the second powder in the third powder.
In one embodiment, the component is copper or any material having a solderable surface plated on its surface.
In one embodiment, the first solder powder is a tin-lead alloy (Sn/Pb) powder, or a tin-silver-copper alloy (Sn/Ag/Cu) powder, or any metal alloy powder that can be used for metal soldering.
In one embodiment, the second powder is a copper powder or a powder of a material having a solderable surface.
In one embodiment, the particles of the first solder powder and the second solder powder are irregularly shaped.
In one embodiment, the first solder powder has a particle size distribution of between 1 micron and 200 microns.
In one embodiment, the particles of the second powder have a size distribution between 30 microns and 300 microns.
The capillary bonding plow has the advantages that low-melting-point soldering tin powder is used as a solder, high-melting-point and surface-weldable powder is mixed and then laid on the weldable surface of an element, and then the temperature is raised to the first melting point temperature to form welding, so that the high-melting-point powder can be welded on the surface of the element and mutually welded to form the capillary bonding plow with an irregular shape. The capillary structure manufacturing technology can save a large amount of heating energy, does not need expensive high-temperature sintering equipment, is simpler and more convenient in method, and can form the capillary structure. Therefore, the invention is a pioneering technology with low-temperature forming, cost reduction and energy saving, and is particularly suitable for the manufacturing industry of heat pipes and temperature-equalizing plates.
Drawings
FIG. 1 is a flow chart illustrating steps of a method of fabricating a capillary structure according to an embodiment of the present invention.
Fig. 2A is a schematic diagram of a device having a solderable surface in accordance with one embodiment of the invention.
Fig. 2B is a schematic diagram of the first solder powder, the second powder and the third powder according to an embodiment of the invention.
Fig. 2C shows a schematic view of laying a third powder onto the solderable surface of the component in one embodiment of the invention.
FIG. 2D is a schematic diagram illustrating the first solder powder melted to form a solder in one embodiment of the invention.
FIG. 3A is a schematic cross-sectional view of a third embodiment of the present invention showing a third powder being deposited on a tube.
FIG. 3B shows a cross-sectional view of the third powder deposited into a tube according to FIG. 3A.
FIG. 3C is a cross-sectional view of the tube of FIG. 3B after heating to the first melting point temperature.
Wherein the reference numerals are as follows:
1: first solder powder 10: solder
2: second powder 70: weldable surface
3: third powder 75: cavity structure
5: center rods S1-S7: step (ii) of
7: component
Detailed Description
In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described and discussed with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative examples of the present invention, and that no limitations are intended to the scope of the invention or its corresponding embodiments, particularly in terms of the specific methods, devices, conditions, materials, and so forth.
In the description of the present invention, it is to be understood that the terms "longitudinal, transverse, upper, lower, front, rear, left, right, top, bottom, inner, outer" and the like refer to orientations or positional relationships based on those shown in the drawings, which are merely for convenience of description and simplicity of description, and do not indicate that the described devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In addition, the indefinite articles "a", "an" and "an" preceding an apparatus or element of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the apparatus or element. Thus, "a" or "an" should be read to include one or at least one and the singular forms of a device or element also include the plural forms unless the singular forms clearly indicates otherwise.
Please refer to fig. 1. FIG. 1 is a flow chart illustrating steps of a method of fabricating a capillary structure according to an embodiment of the present invention. The invention relates to a method for manufacturing a capillary structure, which comprises the following steps: s1: an element having a solderable surface is provided. S2: a first solder powder having a first melting point is provided. S3: providing a second powder having a second melting point and a solderable surface, wherein the second melting point is at a temperature higher than the first melting point. S4: the first solder powder and the second powder are uniformly mixed to form a third powder. S5: a third powder is laid on the weldable surface of the element. S6: the component is heated to a first melting point by melting the first solder powder to weld the weldable surface of the component and simultaneously forming a weld on the portion of the surface between the second powder particles. S7: and cooling the element to enable the second powder to form a capillary structure on the surface of the element.
In step S6, the temperature reached by the heating element is the first melting point temperature, or may be between the first melting point and the second melting point. At this time, the first solder powder having a low melting point is melted into a solder so that the second powder having surface solderability is soldered to the surface of the component and forms surface mutual soldering between the particles, but the second powder having a high melting point is not melted. In step S7, when the cooling element is cooled to room temperature or below the first melting point, the solder solidifies to stabilize the second powder. In this case, the solder can solder the second powder and the surface of the component and can also solder the adjacent second powder particles. Thus, the second powder may form a multi-layered stacked and irregularly shaped capillary structure.
In this method, the irregular second powder having a particle size distribution is a main component for forming a capillary structure. The melting point of the second powder may be higher than the melting point of the first solder powder. Thus, in the prior art, high temperature sintering of high melting point copper powder onto the surface of copper components requires expensive heat generation equipment, precise temperature control and a large energy consumption.
In the method, the copper powder is not required to be sintered at high temperature to form a capillary structure on the surface of the copper material; instead, the first solder powder having a low melting point is melted at a low temperature. Typically, the solder powder is made of a solder alloy. For example, 63/37 ratio tin-lead alloy (Sn/Pb), solder melting point 183 degrees Celsius; tin-silver-copper alloy (Sn/Ag/Cu) with the ratio of 96.5/3/0.5, wherein the melting point of soldering tin is 218 ℃; 99.3/0.7 ratio of tin-copper alloy (Sn/Cu), the melting point of soldering tin is 227 ℃; 42/58 ratio of Sn-Bi alloy (Sn/Bi), the solder melting point is 138 ℃; 91/9 ratio (Sn/Bi), the solder melting point is 199 degree centigrade. According to the present invention, the second powder, the solderable surface of the component, and the second powder particles are soldered to each other by using the first solder powder as a solder, thereby forming an irregularly shaped capillary structure. Therefore, by the technology of the invention, heating equipment with lower cost can be used, the temperature control is only required to be at the first melting point or between the first melting point and the second melting point, and less energy is consumed. Therefore, the manufacturing process of the present invention consumes as little heat energy and electricity as possible.
Please refer to fig. 2A to fig. 2D. Fig. 2A shows a schematic view of a component 7 having a solderable surface 70 in one embodiment of the invention. Fig. 2B is a schematic diagram of the first solder powder 1, the second powder 2 and the third powder 3 according to an embodiment of the invention. FIG. 2C is a schematic diagram of the third powder 3 being spread on the surface of the component 7 according to one embodiment of the present invention. Fig. 2D is a schematic diagram illustrating the first solder powder 1 being melted to form a solder 10 according to an embodiment of the present invention. In one embodiment, element 7 is a thin plate or arc, and only one side of element 7 may be solderable surface 70, as shown in fig. 2A. In one embodiment, component 7 is copper or any material that is plated with a solderable material on solderable surface 70. In practice, the solderable material may be tin and component 7 may be copper or any material having a solderable surface 70 plated with tin.
The first solder powder 1 and the second powder 2 can be simply mixed to form the third powder 3, as shown in fig. 2B. The third powder 3 may follow the shape or curvature of the solderable surface 70 of the element 7 as shown in fig. 2C. In one embodiment, the first solder powder 1 is a tin-silver-copper alloy (Sn/Ag/Cu) with a ratio of 96.5/3/0.5, and the solder melting point is 218 ℃. In one embodiment, the second powder 2 is a copper powder or any metal or ceramic or glass material or polymer material powder plated with a solderable material surface. Taking copper powder as an example, the melting point of copper powder is about 1085 ℃. Therefore, when the solder powder and the copper powder are mixed to form the third powder, the heating temperature is controlled to be higher than 218 ℃ but lower than 1085 ℃. At this time, the solder powder is melted into the solder 10, and the copper powder is not melted. Solder 10 adheres to the solderable surface 70 and the copper powder particles. When the solder 10 solidifies, the copper powder is soldered to each other, while the underlying copper powder particles are soldered to the surface of the component 7, as shown in fig. 2D. It is noted that the solder 10 in fig. 2D is not merely interspersed proximate to the solderable surface 70, but may be interspersed between particles of the second powder 2.
The size distribution of the first solder powder 1 particles is smaller than the size distribution of the second powder 2 particles. Therefore, the first solder powder 1 can be more effectively adhered to the second powder 2 after being melted; meanwhile, the situation that each solder 10 is distributed unevenly or the surface of the second powder 2 is stained with excessive solder 10 is avoided. In practical applications, the first solder powder 1 has a particle size distribution of 1-200 μm. On the other hand, the particle size distribution of the particles of the second powder 2 is between 30 and 300 microns.
In one embodiment, the particles of the first solder powder 1 and the second solder powder 2 are irregular. The irregular first solder powder 1 can be randomly scattered among the irregular second powder 2 particles, which is beneficial to form a welding point between the second powder 2 and the adjacent second powder 2 when being heated, and simultaneously form welding between the bottom particles of the second powder 2 and the surface of the element 7; moreover, the capillary structure is also irregular and prominent in a microscopic view, which is beneficial to the improvement of the porosity.
Wherein, the capillary structure is formed according to the particle size distribution and the mixing ratio of the first solder powder 1 and the second solder powder 2 in the third powder 3. When the content ratio of the first solder powder 1 is high, the solder 10 formed by heating is thick, the bonding force between the second powder 2 and the element 7 is strong, and the second powder 2 is not easily detached. On the other hand, when the content ratio of the first solder powder 1 is low, the solder 10 formed by heating is less thin, and the porosity of the capillary structure formed by the second solder powder 2 is high.
Please refer to fig. 3A to fig. 3C. FIG. 3A is a schematic cross-sectional view of a third embodiment of the present invention showing a third powder 3 being laid on the tube. Fig. 3B shows a schematic cross-sectional view of laying a third powder 3 to the tube according to fig. 3A. FIG. 3C is a cross-sectional view of the tube of FIG. 3B after heating to the first melting point. In one embodiment, the capillary structure formed by the device 7 is used as a capillary structure in a cavity structure 75 of a Micro Heat Pipe (Micro Heat Pipe) or a Vapor Chamber (Vapor Chamber). At this time, a capillary structure is formed inside the element 7. The element 7 and the second powder 2 can be made of copper, which has a better thermal conductivity, as the metal material. In one embodiment, a central rod 5 may be used to extend into the cavity structure 75 in the heat pipe and then the third powder 3 may be poured in, as shown in FIG. 3A. Thereby, the third powder 3 can be applied to the solderable surface 70 as shown in fig. 3B. After heating the entire set of tubing elements 7 and central rod 5 at or above the first melting point, capillary structures are then formed on the weldable surface 70 at the edges of the cavity structures 75. Finally, the heat pipe is primarily processed and manufactured after the central rod 5 is drawn out.
Compared with the prior art which needs expensive heat energy generating equipment, high-temperature sintering copper powder and large amount of heat energy and electric energy consumption, the invention utilizes the low-melting-point soldering tin powder as the solder, mixes the high-melting-point powder, lays the mixed high-melting-point powder on the weldable surface of the element, and heats the mixed high-melting-point powder to the first melting-point temperature, thereby the high-melting-point powder can be soldered on the surface of the element to form a capillary structure. The capillary structure manufacturing technology can save a large amount of heat energy and electric power when manufacturing heat conduction and radiation elements such as a micro heat pipe, a temperature equalizing plate and the like, and does not need expensive high-temperature sintering equipment. Therefore, the invention is a pioneering technology with the advantages of reducing process temperature and saving energy, and is particularly suitable for the manufacturing industry of heat pipes and temperature-equalizing plates.
The above detailed description of the preferred embodiments is provided to more clearly describe the features and spirit of the present invention, and the scope of the present invention is not limited by the above disclosed preferred embodiments. On the contrary, the intention is to cover all equivalent variations as fall within the scope of the invention. Therefore, the scope of the invention is to be determined by the following claims.
Claims (9)
1. A method of making a capillary structure comprising the steps of:
providing a component having a solderable surface;
providing first soldering tin powder with a first melting point;
providing a second powder having a second melting point and having a solderable surface, wherein the second melting point is at a temperature higher than the first melting point;
uniformly mixing the first soldering tin powder and the second powder to form a third powder;
laying said third powder on the weldable surface of said element;
heating the component to a temperature higher than or equal to the first melting point to weld the weldable surface of the component by melting the first solder powder and to form a weld point on the part of the surface between the particles of the second powder, respectively; and
cooling the component to form a capillary structure of the second powder on the solderable surface of the component.
2. A method according to claim 1, wherein the capillary structure formed by the component is a capillary structure in a cavity structure of a micro-thermal conduit or a vapor chamber.
3. A method of fabricating a capillary structure according to claim 1 wherein said element is copper or is plated with a solderable material.
4. A method of making a capillary structure according to claim 1 wherein said second powder is a copper powder or a powder of a material having a solderable surface.
5. The method of claim 1, wherein the first solder powder particles have a smaller distribution size than the second powder particles.
6. The method according to claim 1, wherein the capillary structure is formed according to a particle distribution size and a mixing ratio of the first solder powder and the second solder powder in the third powder.
7. The method of claim 1, wherein the particles of the first solder powder and the second powder are irregularly shaped.
8. The method of claim 1, wherein the first solder powder has a particle size distribution of between 1 micron and 200 microns.
9. A method of making a capillary structure according to claim 1 wherein the particles of the second powder have a size distribution between 30 microns and 300 microns.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810725715.1A CN110686541A (en) | 2018-07-04 | 2018-07-04 | Method for manufacturing capillary structure |
| TW107136793A TW202006308A (en) | 2018-07-04 | 2018-10-18 | A method of fabricating capillary wick structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810725715.1A CN110686541A (en) | 2018-07-04 | 2018-07-04 | Method for manufacturing capillary structure |
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| CN110686541A true CN110686541A (en) | 2020-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810725715.1A Pending CN110686541A (en) | 2018-07-04 | 2018-07-04 | Method for manufacturing capillary structure |
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| CN (1) | CN110686541A (en) |
| TW (1) | TW202006308A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111486732A (en) * | 2020-03-19 | 2020-08-04 | 广州视源电子科技股份有限公司 | Capillary structure processing method for heat dissipation device |
| CN112272487A (en) * | 2020-09-09 | 2021-01-26 | 华为机器有限公司 | Vapor chamber, method for manufacturing vapor chamber, and electronic apparatus |
| CN116021016A (en) * | 2022-12-26 | 2023-04-28 | 合肥联宝信息技术有限公司 | Liquid suction core and preparation method thereof |
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| US4194559A (en) * | 1978-11-01 | 1980-03-25 | Thermacore, Inc. | Freeze accommodating heat pipe |
| JPS60251390A (en) * | 1984-05-28 | 1985-12-12 | Matsushita Refrig Co | Manufacture of heat pipe |
| CN1836145A (en) * | 2003-06-26 | 2006-09-20 | 热力公司 | Heat transfer device and method of making same |
| CN1961191A (en) * | 2004-04-21 | 2007-05-09 | 热力公司 | Heat transfer device and method of making same |
| CN106701031A (en) * | 2016-12-13 | 2017-05-24 | 中电普瑞电力工程有限公司 | Composite thermal interface material composed of metal mesh and low-melting-point alloy |
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2018
- 2018-07-04 CN CN201810725715.1A patent/CN110686541A/en active Pending
- 2018-10-18 TW TW107136793A patent/TW202006308A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4194559A (en) * | 1978-11-01 | 1980-03-25 | Thermacore, Inc. | Freeze accommodating heat pipe |
| JPS60251390A (en) * | 1984-05-28 | 1985-12-12 | Matsushita Refrig Co | Manufacture of heat pipe |
| CN1836145A (en) * | 2003-06-26 | 2006-09-20 | 热力公司 | Heat transfer device and method of making same |
| CN1961191A (en) * | 2004-04-21 | 2007-05-09 | 热力公司 | Heat transfer device and method of making same |
| CN106701031A (en) * | 2016-12-13 | 2017-05-24 | 中电普瑞电力工程有限公司 | Composite thermal interface material composed of metal mesh and low-melting-point alloy |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111486732A (en) * | 2020-03-19 | 2020-08-04 | 广州视源电子科技股份有限公司 | Capillary structure processing method for heat dissipation device |
| CN112272487A (en) * | 2020-09-09 | 2021-01-26 | 华为机器有限公司 | Vapor chamber, method for manufacturing vapor chamber, and electronic apparatus |
| CN116021016A (en) * | 2022-12-26 | 2023-04-28 | 合肥联宝信息技术有限公司 | Liquid suction core and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| TW202006308A (en) | 2020-02-01 |
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