CN110646975B - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN110646975B CN110646975B CN201910884526.3A CN201910884526A CN110646975B CN 110646975 B CN110646975 B CN 110646975B CN 201910884526 A CN201910884526 A CN 201910884526A CN 110646975 B CN110646975 B CN 110646975B
- Authority
- CN
- China
- Prior art keywords
- led chip
- guide plate
- light guide
- led
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000012788 optical film Substances 0.000 claims abstract description 13
- 238000009792 diffusion process Methods 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims abstract description 8
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 11
- 239000003292 glue Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a backlight module and a liquid crystal display device, which comprise an LED light source; the light guide plate is arranged at one side of the LED light source; an optical film set. The optical film group comprises a diffusion film arranged above the light guide plate, a prism sheet arranged above the diffusion film, and a reflecting sheet arranged below the light guide plate. The LED light source comprises an LED chip main body and at least one retaining wall. The LED chip and the at least one retaining wall are integrally connected to form an accommodating space with an opening, the light guide plate is clamped in the accommodating space, and light emitted by the LED chip body is transmitted to the light guide plate through the opening. The invention realizes stable connection of the LED light source and the light guide plate, enhances the connection strength of the LED light source and a Flexible Printed Circuit (FPC), greatly reduces light leakage, and realizes ultrathin backlight module.
Description
Technical Field
The present invention relates to the field of liquid crystal displays, and more particularly, to a backlight module and a liquid crystal display device.
Background
In a liquid crystal display device (Liquid CrystalDisplay), a backlight (BackLightModule) is generally used to provide a uniform, high-brightness light source for a liquid crystal panel (Cell). The backlight module can be divided into a side-in type backlight module and a direct type backlight module according to different light source distribution positions in the backlight module, wherein a light source in the side-in type backlight module is positioned on the side surface of the display panel, and a light source in the direct type backlight module is positioned at the bottom of the display panel. The existing side-entry backlight module is more suitable for light and thin electronic products.
The market demand for thinning electronic products and technological progress provide technical support for the thinning development of the products, and particularly the thinning development of the light guide plate is rapid. At this time, after the backlight module adopting the ultra-thin LED chip and the ultra-thin light guide plate is assembled, the contact area of the ultra-thin LED chip and the ultra-thin light guide plate is reduced, and the ultra-thin LED chip and the ultra-thin light guide plate are easy to fall off or shift, so that light leakage, light spots and lamp eyes are generated; on the other hand, the welding area of the ultrathin LED chip and a Flexible Printed Circuit (FPC) is reduced, so that the ultrathin LED chip is unstable in connection and easy to drop and shift, and the explosion fault is generated.
Disclosure of Invention
The invention mainly solves the technical problem of providing a backlight module and a liquid crystal display device, which can solve the problem encountered in the process of ultrathin backlight module, ensure that an LED light source and a light guide plate are firmly connected, simultaneously enhance the connection strength of the LED light source and a Flexible Printed Circuit (FPC), greatly reduce light leakage and realize ultrathin backlight module.
In order to solve the technical problems, the invention adopts a technical scheme that the backlight module comprises an LED light source, a light guide plate and an optical film group. The light guide plate is arranged on one side of the LED light source. The optical film group comprises a diffusion film arranged above the light guide plate, a prism sheet arranged above the diffusion film and a reflecting sheet arranged below the light guide plate. The LED light source comprises an LED chip main body and at least one retaining wall, the retaining wall extends to the other end of the opening, the LED chip and the at least one retaining wall are integrally connected and form an accommodating space with the opening, the light guide plate is clamped in the accommodating space, and light emitted by the LED chip main body is transmitted to the light guide plate through the opening.
The backlight module of the invention utilizes the arrangement of the retaining wall and the accommodating space on the LED light source to ensure that the LED chip is firmly connected with the light guide plate, can reduce the light emitting angle of the LED chip, and ensures that the light emitted from the light emitting port of the LED chip is totally emitted into the light guide plate, thereby solving the problem of light leakage caused by height difference between the light emitting port of the LED chip and the light incident surface of the ultrathin light guide plate, and further improving the light emitting utilization rate and light emitting uniformity of the backlight module. The LED chip and the at least one retaining wall can be assembled into an integral connection structure when the backlight module is integrated, and can also be assembled into an integral connection structure before the backlight module is integrated, so that the whole backlight module is simpler in production, assembly process and structure and high in structural stability.
In a preferred embodiment, the LED chip and the at least one retaining wall are an injection molded integral structure.
Further, the LED chip, the at least one retaining wall and the light guide plate are integrally formed into an integral structure through injection molding. Further, LED chips are arranged on the retaining wall.
In a preferred embodiment, the backlight module further comprises a flexible printed circuit board, and the retaining wall is connected with the flexible printed circuit board.
In a preferred embodiment, the LED light source comprises a continuous or discontinuous LED chip.
In a preferred embodiment, the backlight module further includes a glue frame, where the glue frame is used to fixedly connect the LED light source, the optical film set and the light guide plate; the backlight module further comprises shading glue, wherein the shading glue is used for bonding the LED light source, the optical film set and the light guide plate, and reducing light leakage of the backlight module.
According to the embodiment of the invention, the backlight module, the LCD panel and the glass cover plate are integrated into a liquid crystal display device, and the liquid crystal display device can be applied to the liquid crystal display device. The backlight module is applied to the fingerprint identification liquid crystal display device, can greatly reduce light leakage and realize ultrathin backlight module.
Drawings
The present invention and its advantages will be better understood by studying the detailed description of the specific embodiments illustrated in the appended drawings, given by way of non-limiting example, wherein:
Fig. 1 is a schematic structural diagram of a backlight module according to embodiment 1 of the present invention.
Fig. 2 is a schematic structural view of an LED light source according to embodiment 1 of the present invention.
Fig. 3 is a schematic structural diagram of a backlight module according to embodiment 2 of the present invention.
Fig. 4 is a schematic structural view of an LED light source according to embodiment 2 of the present invention.
Detailed Description
Referring to the drawings wherein like reference numbers represent like elements throughout, the principles of the present invention are illustrated in the accompanying drawings as implemented in a suitable environment. The following description is based on illustrated embodiments of the invention and should not be taken as limiting other embodiments of the invention not described in detail herein.
The word "embodiment" is used in this specification to mean serving as an example, instance, or illustration. Furthermore, the articles "a" and "an" as used in this specification and the appended claims may generally be construed to mean "one or more" unless specified otherwise or clear from context to be directed to a singular form.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both first and second features being in direct contact, and may also include both first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Also, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or meaning that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or meaning that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Example 1
First, a backlight module according to embodiment 1 of the present invention will be described with reference to fig. 1 to 2. The backlight module according to embodiment 1 of the present invention includes an LED light source 103, a light guide plate 102 and an optical film set 101. The light guide plate 102 is disposed on the LED light source 103 side. The optical film set 101 includes a diffusion film 220 disposed above the light guide plate 102, a prism sheet 210 disposed above the diffusion film 220, and a reflection sheet 230 disposed below the light guide plate 102. The LED light source 103 includes an LED chip 1031 and two retaining walls 1032, the two retaining walls 1032 are respectively located above and below the LED chip 1031, the LED chip 1031 and the two retaining walls 1032 are integrally connected and form an accommodating space with an opening, the light guide plate 102 is clamped in the accommodating space, and light emitted by the LED chip 1031 propagates to the light guide plate 102 through the opening. The upper surface of the retaining wall 1032 above the LED chip 1031 is flush with the upper surface of the optical film set 101, and at the same time, the lower surface of the retaining wall 1032 below the LED chip 1031 is flush with the lower surface of the optical film set 101, so that the backlight module is conveniently installed as a liquid crystal display and light leakage is reduced. The LED chip can be a mini-LED chip or a micro-LED chip.
The backlight module of the embodiment utilizes the arrangement of the two retaining walls 1032 and the accommodating space 1033 on the LED light source 103 to ensure that the LED chip 1031 is firmly connected with the light guide plate 102, so that the light emitting angle of the LED chip 1031 can be reduced, and the light emitted from the light emitting opening of the LED chip 1031 is totally emitted into the light guide plate 102, thereby solving the problem of light leakage caused by height difference between the light emitting opening of the LED chip 1031 and the light incident surface of the ultrathin light guide plate 102, and further improving the light emitting utilization rate and light emitting uniformity of the backlight module. The LED chip 1031 and the two retaining walls 1032 are integrally formed with a connection structure before the backlight module is integrated, so that the entire backlight module has simpler production, assembly process and structure and high structural stability.
The retaining wall 1032 extends toward the other end of the opening. The LED chip 1031 and the two retaining walls 1032 are an integrally injection molded structure.
The dam 1032 is connected to the flexible printed circuit board 104, which enhances the connection strength of the LED light source 103 and the flexible printed circuit board 104.
The backlight module further comprises a glue frame, wherein the glue frame is used for fixedly connecting the LED light source 103, the optical film group 101 and the light guide plate 102; the backlight module further comprises a shading adhesive, wherein the shading adhesive is used for bonding the LED light source 103, the optical film set 101 and the light guide plate 102, and reducing light leakage of the backlight module.
The problem that meets in the ultra-thin process of backlight unit can be solved to this embodiment, and LED light source 103 and light guide plate 102 connect firmly, strengthen the joint strength of LED light source 103 and flexible printed circuit board 104 simultaneously to reduce the light leak by a wide margin, realize the ultra-thin of backlight unit.
Example 2
Fig. 3-4 are schematic structural diagrams of a backlight module according to embodiment 2 of the present invention. Only the differences between embodiment 2 and embodiment 1 will be described below, and the description of the similarities will not be repeated here.
The LED light source 103 includes an LED chip 1031 and two retaining walls 1032, the two retaining walls 1032 are respectively located above and below the LED chip 1031, the LED chip 1031 and the retaining walls 1032 are integrally connected and form an accommodating space with an opening, the light guide plate 102 is clamped in the accommodating space, and light emitted by the LED chip 1031 propagates to the light guide plate 102 through the opening. The upper retaining wall 1032 of the LED chip 1031 is disposed flush with the LED chip 1031, and the extension length of the upper retaining wall 1032 is shorter than the extension length of the lower retaining wall 1032.
Although the invention has been described above with reference to some embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the features of the various embodiments disclosed herein may be combined with each other in any manner so long as there is no structural conflict, and the combination is not described in the present specification in an exhaustive manner for the sake of brevity and resource saving. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (1)
1. A backlight module, comprising:
an LED light source;
the light guide plate is arranged at one side of the LED light source; and
An optical film group including a diffusion film disposed above the light guide plate, a prism sheet disposed above the diffusion film, and a reflection sheet disposed below the light guide plate;
The LED light source comprises an LED chip and two retaining walls, wherein the two retaining walls are respectively positioned above and below the LED chip, the LED chip and the two retaining walls are connected and form an accommodating space with an opening, the light guide plate is clamped in the accommodating space, and the LED chip and the two retaining walls are of an integrally formed connecting structure;
The retaining wall above the LED chip is arranged in a flush manner with the LED chip, and the extension length of the retaining wall above the LED chip is shorter than that of the retaining wall below the LED chip;
The backlight module further comprises a flexible printed circuit board, and the retaining wall below the LED chip is connected with the flexible printed circuit board;
The LED chip is a mini-LED chip or a micro-LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910884526.3A CN110646975B (en) | 2019-09-19 | 2019-09-19 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910884526.3A CN110646975B (en) | 2019-09-19 | 2019-09-19 | Backlight module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110646975A CN110646975A (en) | 2020-01-03 |
| CN110646975B true CN110646975B (en) | 2024-09-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910884526.3A Active CN110646975B (en) | 2019-09-19 | 2019-09-19 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110646975B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546063A (en) * | 2008-03-27 | 2009-09-30 | 深圳帝光电子有限公司 | Ultra thin type LCD use backlight module taking LED as light source |
| CN208888540U (en) * | 2018-10-25 | 2019-05-21 | 深圳市隆利科技股份有限公司 | A kind of side entrance back module reducing reflection light loss |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070044991A (en) * | 2005-10-26 | 2007-05-02 | 웬-쿵 숭 | Backlight module of omnidirectional led |
| KR20090045977A (en) * | 2007-11-05 | 2009-05-11 | 주식회사 엘에스텍 | A back light unit having color correction material |
| CN201204211Y (en) * | 2008-04-18 | 2009-03-04 | 群康科技(深圳)有限公司 | Light emitting diode, backlight module unit and liquid crystal display apparatus |
| TWI439768B (en) * | 2011-06-27 | 2014-06-01 | Au Optronics Corp | Backlight module and method for manufacturing the same |
| CN202419335U (en) * | 2011-10-28 | 2012-09-05 | Tcl光电科技(惠州)有限公司 | Liquid crystal display and direct light-emitting diode (LED) backlight module |
| CN102767759B (en) * | 2012-07-04 | 2015-07-15 | 深圳市华星光电技术有限公司 | Liquid crystal display device and backlight module thereof |
| CN105895787B (en) * | 2016-06-06 | 2019-02-19 | 青岛海信电器股份有限公司 | LED, LED encapsulation method, down straight aphototropism mode set and LCD TV |
| CN108180444A (en) * | 2017-12-28 | 2018-06-19 | 惠州市华星光电技术有限公司 | LED light source and side entrance back module, liquid crystal display device |
| CN109811976B (en) * | 2019-03-21 | 2024-02-13 | 福建省泉州博友石材有限公司 | Composite stone with background light source |
-
2019
- 2019-09-19 CN CN201910884526.3A patent/CN110646975B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546063A (en) * | 2008-03-27 | 2009-09-30 | 深圳帝光电子有限公司 | Ultra thin type LCD use backlight module taking LED as light source |
| CN208888540U (en) * | 2018-10-25 | 2019-05-21 | 深圳市隆利科技股份有限公司 | A kind of side entrance back module reducing reflection light loss |
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| Publication number | Publication date |
|---|---|
| CN110646975A (en) | 2020-01-03 |
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