CN110646915A

CN110646915A - Periscopic lens driving device

Info

Publication number: CN110646915A
Application number: CN201911079888.1A
Authority: CN
Inventors: 彭坤; 林聪�; 刘富泉; 其他发明人请求不公开姓名
Original assignee: Henan Hozel Electronics Co Ltd
Current assignee: Henan Haoze Electronics Co ltd Kunshan Branch
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2020-01-03

Abstract

The invention discloses a periscopic lens driving device which comprises a base, a carrier, a bottom circuit board, an OIS assembly and an AF assembly. The OIS component comprises an OIS magnet and an OIS coil group, the AF component comprises an AF magnet and an AF coil group, the carrier is provided with a lens mounting hole used for mounting a lens, the OIS magnet is mounted on two sides of the lens mounting hole of the carrier, the AF magnet is mounted at the bottom of the carrier, and the AF coil group is mounted on the bottom circuit board and matched with the AF magnet. The both ends of base are equipped with the integrative protruding piece that upwards stretches out, and OIS coil assembly installs on the protruding piece and with OIS magnetite cooperation. Still be provided with embedded sheetmetal in the base, OIS coil pack and embedded sheetmetal electricity intercommunication and drive the carrier motion when the circular telegram in order to realize optics anti-shake function. The invention cancels the suspension wire to participate in the whole circuit and only participates in physical movements such as homing and the like, thereby ensuring the stability of the circuit.

Description

Periscopic lens driving device

Technical Field

The invention relates to the technical field of optical imaging equipment, in particular to a periscopic lens driving device.

Background

With the development of technology, many electronic devices (such as smart phones or digital cameras) have a function of taking pictures or recording videos. The use of these electronic devices is becoming more common and the design direction of these electronic devices is being developed to be more convenient and thinner to provide more choices for users.

Some electronic devices with a camera or video recording function are provided with a lens driving module to drive an Optical component such as a lens to move, so as to achieve the functions of auto focus (auto focus) and Optical Image Stabilization (OIS). The light can pass through the optical component to form an image on a photosensitive component.

However, these lens driving modules generally have a suspension structure, and the suspension participates in a circuit portion. Because the suspension wires are used as the unremoved parts of the carrier, the problems of deformation and the like generated when the suspension wires are impacted can influence the circuit transmission and even lead to the integral failure. In addition, the suspension wire participates in circuit transmission, and the assembly of parts is relatively difficult when the parts such as the upper spring plate and the like are installed and combined.

Disclosure of Invention

The present invention is directed to a periscopic lens driving apparatus to solve the above-mentioned problems of the prior art.

In order to solve the above-mentioned problems, according to an aspect of the present invention, there is provided a periscopic lens driving apparatus including a base, a carrier, a bottom circuit board, an OIS component including an OIS magnet and an OIS coil set, and an AF component including an AF magnet and an AF coil set,

the carrier is provided with a lens mounting hole for mounting a lens, the OIS magnets are mounted on two sides of the lens mounting hole of the carrier, the AF magnets are mounted at the bottom of the carrier,

the AF coil set is mounted on the bottom circuit board and matched with the AF magnet,

two ends of the base are provided with a protruding block which integrally extends upwards, the OIS coil group is arranged on the protruding block and is matched with the OIS magnet,

still be provided with embedded sheetmetal in the base, OIS coil pack with embedded sheetmetal electricity intercommunication and drive when the circular telegram the carrier motion is in order to realize optics anti-shake function.

In one embodiment, the lens driving apparatus further comprises a flexible suspension suspending the carrier from the chassis;

in one embodiment, the suspension element is a suspension wire and no current flow is provided in the suspension wire.

In one embodiment, the OIS assembly further comprises an OIS patch mounted between the carrier and the OIS magneto.

In one embodiment, the AF component comprises an AF patch that is mounted between the AF magnet and the carrier.

In one embodiment, the periscopic lens driving apparatus further comprises an upper spring disposed at an upper portion of the carrier and connected to an upper end of the suspension.

In one embodiment, the AF module further comprises an AF sensor and an AF sensor magnet, the AF sensor magnet is arranged between two AF magnets, and the AF sensor is arranged on the bottom circuit board and is correspondingly matched with the AF magnets.

In one embodiment, the OIS assembly further includes an OIS sensor mounted on the base circuit board and in corresponding engagement with the OIS magnet.

In one embodiment, a coil is installed inside the OIS coil assembly, and a conductive portion connected to the embedded metal sheet is formed in the middle of the OIS coil assembly and is in electrical communication with the coil.

In one embodiment, the periscopic lens driving device further comprises a shell, and the shell is matched with the base to suspend the carrier in a space defined by the base and the shell.

In one embodiment, the base comprises a bottom plate, a rectangular groove is formed in the middle of the bottom plate, and the protruding blocks are located on two sides of the groove.

In one embodiment, shoulders are formed on two sides of the protruding block, a protruding part is integrally formed on the inner surface of each shoulder in an inward protruding mode, and the OIS coil group is installed on the protruding part.

In one embodiment, the four corners of the bottom plate are formed with supporting portions, and the upper surfaces of the supporting portions are provided with buffer glue grooves which are matched with the supporting columns of the carrier to protect and support the carrier.

In one embodiment, an extension part integrally extends out of the outer side of one of the protruding blocks, the edge of the extension part is provided with a plurality of clamping grooves, and after the metal sheet group is embedded into the base, the end part of the horizontal protruding sheet of the metal sheet group is accommodated in the clamping groove and led out from the clamping groove.

In one embodiment, the main body portion of the bottom plate is further provided with a plurality of pouring holes and positioning posts that engage and position the bottom circuit board.

In one embodiment, the metal sheet group has a main body portion, two ends of the main body portion integrally extend upwards to form two vertical protruding sheets, and when the metal sheet group and the OIS coil are mounted on a base, tops of the vertical protruding sheets are in contact with and electrically communicated with a conductive portion of the OIS coil.

In one embodiment, the adjacent sides of two vertical protruding sheets at the same end integrally extend out of the hook piece to increase the bonding strength of the metal sheet group and the base.

In one embodiment, four corners of the main body part of the metal sheet group integrally extend out of the first horizontal protruding pieces towards two ends along the plane where the main body part is located, a second horizontal protruding piece is formed between the two first horizontal protruding pieces at the same end, and the end parts of the first horizontal protruding pieces and the second horizontal protruding end parts are matched with the clamping grooves in the base to lead out current from the clamping grooves.

In one embodiment, notches are formed at four corners of the bottom circuit board, and bottom circuit board suspension holes are formed in the notches.

In one embodiment, the bottom circuit board includes a first body portion in which the OIS sensor is disposed, a second body portion in which the AF sensor is disposed, and a gap between the first and second body portions.

In one embodiment, the upper end of the OIS patch is provided with an ear part extending towards two sides, two sides below the ear part are provided with clamping blocks extending towards the OIS magnet, the clamping blocks form OIS magnet mounting grooves, and the OIS magnet is fixedly mounted in the OIS magnet mounting grooves.

In one embodiment, the OIS patch and the AF patch are made using iron sheets.

In one embodiment, the carrier has a lens mount portion having a lens mount hole extending in an optical axis direction, the OIS component mount portion being formed on both sides of the lens mount hole.

In one embodiment, suspension wire mounting portions are formed on both sides of the OIS component mounting portion, the suspension wire mounting portions are integrally formed to protrude in the optical axis direction from both sides of the OIS component mounting portion, and the height of the suspension wire mounting portions is lower than that of the lens mounting portion.

In one embodiment, a supporting column is arranged at the bottom of the suspension wire mounting part, and the supporting column is matched with a buffer rubber groove of the supporting part on the base and is mounted in the buffer rubber groove during assembly.

In one embodiment, the top of the suspension wire mounting part forms an upper spring mounting part, and the upper spring is mounted on the upper spring mounting part.

In one embodiment, the OIS assembly mounting portion is formed with an OIS assembly mounting groove, the OIS assembly mounting groove includes an OIS patch mounting groove formed at an inner side and an OIS magnet mounting groove located at an outer side, the shape of the OIS patch mounting groove matches the shape of the OIS patch and is formed at an upper end with an ear groove matched with an ear of the OIS patch, and when the OIS patch is mounted in the OIS patch mounting groove, the ear is embedded in the ear groove and clamped.

In one embodiment, the shape of the OIS magnet mounting groove is matched with the shape of the OIS magnet so that the OIS magnet can be embedded and clamped in the OIS magnet mounting groove.

In one embodiment, the upper spring plate includes a first plate-shaped body and a second plate-shaped body integrally formed with a gap formed therebetween, the first plate-shaped body and the second plate-shaped body are further connected by a bending bar including a plurality of bends, the bending bar being provided with a suspension wire fixing portion through which an upper end of the suspension wire passes and is fixed when the upper spring plate is mounted above the carrier.

The suspension wire is not involved in the whole circuit, and only participates in physical motions such as homing and the like, so that the stability of the circuit is ensured, meanwhile, as the suspension wire does not participate in circuit transmission, other alternative flexible material OIS parts can be adopted to adopt a three-dimensional circuit, and a metal sheet group is arranged in the base, so that the assembly difficulty of the circuit, a bottom circuit board sensor and other parts is simplified.

Drawings

Fig. 1 is a schematic structural diagram of a periscopic lens driving structure.

Fig. 2 is an exploded perspective view of the lens driving apparatus of the present invention.

Fig. 3 is a perspective view of a base of the lens driving apparatus of the present invention.

Fig. 4 is a perspective view of a metal sheet group of the lens driving device of the present invention.

Fig. 5 is a perspective view of a bottom circuit board of the lens driving apparatus of the present invention.

Fig. 6 is an exploded perspective view of an OIS assembly of the lens driving apparatus of the present invention.

Fig. 7 is a perspective view of a carrier of the lens driving apparatus of the present invention.

Fig. 8 is a perspective view of an AF module of the lens driving apparatus of the present invention.

Fig. 9 is a perspective view of an upper spring plate of the lens driving device of the present invention.

Fig. 10 is an exploded perspective view of the base, sheet metal pack and OIS coil pack of the present invention.

Fig. 11 is a perspective view of the components of fig. 10 assembled together.

Fig. 12 is a perspective view of the base, the metal sheet set, the OIS coil set and the bottom circuit board of the present invention assembled together.

Fig. 13 is a perspective view of a lens driving device of the present invention.

Fig. 14 is an exploded perspective view of the lens driving device of the present invention.

Fig. 15 is a sectional view of a lens driving device of the present invention.

Fig. 16 to 17 are plan views of the lens driving apparatus of the present invention, in which fig. 16 is not mounted with a spring plate.

Fig. 18 is another sectional view of the lens driving device of the present invention.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the invention can be more clearly understood. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are merely intended to illustrate the spirit of the technical solution of the present invention.

In the following description, for the purposes of illustrating various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details. In other instances, well-known devices, structures and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the following description, for the purposes of clearly illustrating the structure and operation of the present invention, directional terms will be used, but terms such as "front", "rear", "left", "right", "outer", "inner", "outer", "inward", "upper", "lower", etc. should be construed as words of convenience and should not be construed as limiting terms.

Fig. 1 is a schematic structural diagram of a periscopic lens driving structure. As shown in fig. 1, the periscopic lens structure generally includes two parts, i.e., a periscopic part 100 and a prism part 200. In which a prism section 200 is provided at the front end of the periscopic section 100 and an imaging chip 300 is provided at the rear end of the periscopic section 100. The light is reflected into the periscopic portion 100 through the prism portion 200, and the periscopic portion 100 includes an AF portion responsible for performing an optical zoom function and an OIS portion responsible for an anti-shake function, but the OIS portion of the periscopic portion is responsible for an anti-shake function only along one axis X perpendicular to the optical axis Z direction, and the OIS portion of the prism portion is responsible for an anti-shake function on the X axis perpendicular to both the Z axis and the Y axis.

The embodiments referred to below are described primarily with respect to periscope portion 100. The periscopic portion 100 is also referred to as a lens driving apparatus in the present invention. Fig. 2 is an exploded perspective view of the lens driving device 100 of the present invention. As shown in fig. 2, the lens driving apparatus 100 of the present invention integrally includes a metal plate group 10, a base 20, a bottom circuit board 30, an AF assembly 40, a suspension wire 50, an OIS assembly 60, a carrier 70, a spring 80, a supporting block 90, and a housing 91. The metal sheet assembly 10 and the bottom circuit board 30 are mounted on the base 20 and form a receiving space together with the housing 91, so as to enclose the suspension wires 50, the AF assembly 40, the OIS assembly 60, the carrier 70, the spring 80 and the supporting block 90 in the space formed by the housing 91 and the base 10. The carrier 70 is used for mounting a lens (not shown) and can move in a space formed by the housing 91 and the base 10 under the driving of the AF assembly and the OIS assembly, so as to achieve the functions of optical anti-shake and auto-focusing, which will be described in detail below.

The respective components in one embodiment of the lens driving device 100 of the invention are described in detail below.

Fig. 3 is a perspective view of the base 10. As shown in fig. 3, the base 10 includes a bottom plate 11, a rectangular groove 14 is formed in the middle of the bottom plate 11, the rectangular groove 14 extends from one side edge of the bottom plate 11 to the opposite side edge of the bottom plate 11 to a distance of about one-half to about two-thirds of the width of the bottom plate, and the width of the groove 14 is about one-third of the distance of the bottom plate 11. The opposite sides of the groove 14 are formed with projecting pieces 17 projecting upward integrally along the opposite side edges of the bottom plate 11, and both ends of the projecting pieces 17 are respectively adjacent to the supporting portions 13 on the corners of the side of the bottom plate 11.

The two ends of the bottom plate 11 are provided with protruding blocks 12 integrally extending upwards, the protruding blocks 12 are positioned at two sides of the groove 14, shoulders 121 are formed at two sides of the protruding blocks 12, a notch 123 is formed on the upper surface of the middle part of the protruding block 12, protruding parts 124 are integrally and inwards extended from the inner surfaces of the two shoulders 121, and the height of the protruding parts 124 is lower than that of the shoulders 121. The projecting block 12 is formed in a shape of which height is increased from both sides toward the middle as a whole. The OIS coil assembly 63 of the OIS assembly 60 is mounted on this boss 124.

The bottom plate 11 is formed at four corners thereof with support portions 13, and the support portions 13 are preferably rectangular in shape and have a height higher than that of the main body portion of the bottom plate 11. The upper surface of the supporting portion 13 is provided with a buffer rubber groove 131. The buffer rubber bath 131 is engaged with the support columns 731 of the carrier 70 so that the carrier 70 can be protected and supported.

An extension part 18 integrally extends out of the outer side of one of the protruding blocks 12, rectangular blocks 14 are arranged at two ends of the extension part 18, a plurality of clamping grooves 15 are arranged on the edge of the extension part 18, and the clamping grooves 15 are located between the rectangular blocks 14 at two ends. When the metal sheet set 20 is inserted into the base 10, the end 241 and the end 231 of the horizontal protruding piece of the metal sheet set 20 are received in the slot 15 and led out from the slot 15. A plurality of pouring holes 191 and positioning posts 16 are also provided in the main body portion (excluding the recess 14) of the base plate 11, and the positioning posts 16 are engaged with and position the bottom circuit board 30.

Fig. 4 is a perspective view of the metal sheet group 20. As shown in fig. 4, the metal sheet set 20 is embedded inside the base 10, and structurally reinforces and electrically connects the base 10. Specifically, the metal plate group 20 has a main body portion 21, and both ends of the main body portion 21 integrally extend upward by two vertical protruding pieces 22, respectively. The vertical protrusion piece 22 is provided with a plurality of through holes 221, in this embodiment, specifically three through holes 221, and the protrusion piece 22 is reduced in width at the upper portion to form a reduced top 222, and the reduced top 222 may be disposed to slightly protrude toward the protrusion piece 22 at the opposite side, so that the raised top 222 is in contact with and electrically communicates with the conductive portion 633 of the OIS coil 63 when the metal sheet set 20 is mounted in the chassis 10 and the OIS coil 63 of the OIS module 60 is also mounted on the chassis 10. Therefore, the top portion 222 also serves as a conductive portion. Hook members 223 integrally extend from adjacent sides of two protruding pieces 22 at the same end, and the hook members 223 are used for cooperating with corresponding portions on the base 10, thereby increasing the bonding strength of the metal sheet group 20 and the base 10.

Four corners of the main body 21 of the metal sheet set 20 integrally extend out of the first horizontal protruding pieces 23 to two ends along the plane of the main body 21, the width of the end of each first horizontal protruding piece 23 is smaller than that of the main body of each first horizontal protruding piece 23, so as to form a reduced end 231, a second horizontal protruding piece 24 is formed between two first horizontal protruding pieces 23 at the same end, each second horizontal protruding piece 24 forms an end 241, and the end 231 and the end 241 are matched with the clamping groove 15 on the base 10, accommodated in the clamping groove 15 and led out current from the clamping groove 15.

One side of the main body 21 forms a middle matching part 25, a special-shaped gap 253 is formed between the middle matching part 25 and the horizontal protruding pieces 23 at the two ends of the same side, two ends of the middle matching part 25 form protruding parts 251, and the protruding parts 251 are matched with a groove (not shown) formed inside the base so as to increase the bonding strength of the metal sheet group 20 and the base 10. A third horizontal projection piece 26, a fourth horizontal projection piece 27, and a fifth horizontal projection piece 28 are formed on opposite sides of the intermediate fitting portion 25 of the main body portion 21. The fourth horizontal projection piece 27 and the fifth horizontal projection piece 28 are located on both sides of the third horizontal projection piece 26.

Fig. 5 is a perspective view of the bottom circuit board 30. As shown in fig. 5, the bottom circuit board 30 is integrally formed in a "concave" shape structure including a first body portion 32 and a second body portion 34 at both sides and a gap 31 between the first body portion 32 and the second body portion 34. Four corners of the bottom circuit board 30 are formed with notches 33, and bottom circuit board suspension holes 331 are formed on the notches 33, wherein two suspension holes 331 are located on two outer corners of the first body portion 32, and the other two suspension holes 331 are located on two outer corners of the second body portion 34.

An OIS sensor (not shown) is provided in the first body 32 and an AF sensor 36 is provided in the middle of the second body portion 34. The OIS sensor is configured to cooperate with the OIS magnet to detect the displacement of the OIS magnet and to detect the displacement of the carrier 70 when the OIS magnet is mounted on the carrier 70, and to communicate the displacement to the control system to implement the optical anti-shake function. The AF sensor 36 is configured to cooperate with the sensor magnet 42 of the AF module 40 to detect the position of the AF sensor magnet 42 and thus the offset position of the carrier 70, and to communicate the offset to the control system to implement the autofocus function, as will be described in further detail below.

Fig. 6 is an exploded perspective view of the OIS assembly 60. As shown in fig. 6, the OIS assembly 60 includes an OIS patch 61, an OIS magnet 62, and an OIS coil set 63. The OIS patch 61 has an ear portion 611 extending to both sides at the upper end thereof, a clamp block 612 extending to the OIS magnet 62 is provided at both sides below the ear portion 611, the clamp blocks 612 at both sides form a surrounding force to the OIS magnet 62 from both sides to form an OIS magnet mounting groove 613, and the OIS magnet 612 is fixedly mounted in the OIS magnet mounting groove 613. The OIS patch can be made of iron sheets or other materials with magnetic conduction functions, the magnetic field of the magnet can be enlarged, and the magnetic field direction of the OIS magnet can be effectively regulated.

The OIS magnet 62 is formed in a rectangular shape as a whole, and a magnet default portion 621 is formed at one corner portion of the upper end. The OIS coil group 63 has a coil cutout 631 formed at an upper portion thereof, and when both the OIS magnet 62 and the OIS coil group 63 are mounted, the OIS magnet cutout 621 and the OIS coil cutout 631 are located at different sides. Two corners of the lower end of the OIS coil assembly 63 define notches 632, and the notches 632 engage with inwardly extending projections 124 integrally formed on the inner surface of the shoulder 121 of the base 10. The middle portion of the OIS coil assembly 63 further has a conductive portion 633, where the left conductive portion 633 is connected to the positive current electrode, the right conductive portion 633 is connected to the negative current electrode, or the left conductive portion 633 is connected to the negative current electrode, and the right conductive portion 633 is connected to the positive current electrode.

The OIS coil assembly 63 is actually a rigid bottom circuit board like component with a coil (not shown) mounted therein and a conductive portion 633 in electrical communication with the internal coil, and thus in electrical communication with the vertically projecting tabs 22 on the blade assembly 20 via the conductive portion 633 to direct current through the blade assembly 20 into the internal coil. In one embodiment, the conductive portion 633 may be configured as a conductive metal part, and a slightly protruding conductive end 222 is disposed at a position of the metal sheet set 20 corresponding to the conductive portion 633, so that the conductive end 222 is connected with the OIS coil set 63 to form a circuit conduction.

The OIS coil assembly 63 also includes an OIS sensor (not shown) mounted on the base circuit board 30 for monitoring the position of the OIS magnet 621. In the embodiment shown in fig. 5, the OIS sensor is located at the bottom of the OIS magnet 621 on either side and is located at the same center line as the OIS magnet 621, and the AF sensor 36 of the AF module 40 is located on the side where the OIS sensor is not located, and the AF sensor 36 is located on the second body portion 34 and the OIS sensor is located on the first body portion 32.

However, it will be understood by those skilled in the art that the arrangement of the AF sensor 36 and the OIS sensor may be reversed, for example, in the bottom circuit board 30 shown in fig. 5, the AF sensor 36 is arranged in the middle of the second body portion 34 on the right side, and the OIS sensor (not shown) is arranged in the first body portion 32 on the left side. When the carrier moves, the OIS sensor detects the deviated position of the OIS magnet and transmits a signal to the control system, and the control system further adjusts the magnetic field force between the OIS coil and the OIS magnet by controlling the on-off and the size of the current in the OIS coil, so that the deviated OIS carrier is pulled back to the upper side of the OIS sensor, and the function of optical focusing is realized.

Fig. 7 is a perspective view of the carrier 70. As shown in fig. 7, the carrier 70 has a lens mount portion 71, the lens mount portion 71 having a lens mount hole 711 extending in the optical axis direction, and OIS component mount portions 72 formed on both sides of the lens mount hole 711. The OIS assembly mount 72 has suspension mounts 73 formed on both sides thereof. The suspension mounting portion 73 is integrally formed to protrude in the optical axis direction from both sides of the OIS assembly mounting portion 72, and the height of the suspension mounting portion 73 is lower than that of the lens mounting portion 71. A supporting column 731 is arranged at the bottom of the suspension wire mounting part 73, and the supporting column 731 is matched with the buffer rubber slot 131 of the supporting part 13 on the base 10 and is mounted in the buffer rubber slot 131 during assembly. At the top of the suspension wire mounting portion 72 is an upper spring mounting portion 74, and an upper spring 80 is mounted to the upper spring mounting portion 74.

Specifically, the suspension mounting portion 73 integrally extends in a direction toward the lens mounting hole 711 with the outer projecting portion 732 and the inner projecting portion 733, and a suspension mounting groove 734 is formed between the outer projecting portion 732 and the inner projecting portion 733, and the suspension is suspended in the suspension mounting groove 734. The inner protrusion 734 is adjacent to the lens mounting hole 711 and forms an arc surface at a side close to the lens mounting hole 711 to be fitted with the lens. The middle portion of the upper reed mounting portion 74 is provided with a groove 743 depressed downward, and the groove 743 is fitted with the elastically deforming portion 80B of the upper reed 80, thereby reducing a frictional force when the upper reed 80 is elastically deformed, so that the elastically deforming portion 80B can be freely deformed. A through hole 744 extending from the upper surface to the lower surface of the suspension wire mounting portion 73 is provided in the recess 743.

The upper surface of the suspension wire mounting portion 73 is provided with a first link 741 and a second link 742, and the first link 741 and the second link 742 are respectively disposed at two adjacent sides of the groove 743, so that the operation can be facilitated after the upper spring 80 is mounted.

The OIS assembly mounting portion 72 is formed with an OIS assembly mounting slot 721, the OIS assembly mounting slot 721 includes an OIS patch mounting slot 722 formed on the inner side and an OIS magnet mounting slot 723 located on the outer side, the shape of the OIS patch mounting slot 722 matches the shape of the OIS patch 61 and an ear slot 724 formed on the upper end thereof matches the ear 611 of the OIS patch 61, and when the OIS patch 61 is mounted in the OIS patch mounting slot 722, the ear 611 is inserted into the ear slot 724 and clamped. The shape of the OIS magnet mounting groove 723 is matched with the shape of the OIS magnet 62, and the OIS magnet 62 can be inserted into and clamped in the OIS magnet mounting groove 723. And the OIS coil assembly 63 is mounted on the boss 124 of the base 10. Specifically, the OIS coil assembly 63 is mounted on the base 10 by snapping the notch 632 at the lower end of the OIS coil assembly 63 over the protrusion 124 of the base 10. When the carrier 70 is mounted on the base 10, the OIS patch 61, OIS magnet 62 and OIS coil assembly 63 are sequentially aligned so that the carrier 70 is driven in motion under magnetic force when the coils are energized, as will be described further below.

Fig. 8 is a perspective view of the AF module 40. As shown in fig. 8, the AF assembly 40 includes an AF magnet 41, a sensor magnet 42, an AF patch 43, and an AF coil 44. The AF magnet 41, the sensor magnet 42, and the AF patch 43 are fixedly mounted on the bottom of the carrier 70, and the AF coil 44 is mounted on the bottom circuit board 30. In the present embodiment, a total of two AF patches 43 on the left and right are included, wherein one AF patch 43 corresponding to the sensor magnet 42 includes an AF magnet patch 432 and a sensor magnet patch 431 that are integrally formed, the sensor magnet patch 431 is located in the middle, and the AF magnet patches 432 are located on both sides of the sensor magnet patch 431. And the other AF patch 43 includes only the AF lodestone patch 431.

In the present embodiment, a total of four AF magnets 41 are included, however, it will be understood by those skilled in the art that the AF magnets 41 may be in other numbers. The sensor magnet 42 is disposed between the two AF magnets 41, and is aligned with the sensor 36 on the bottom circuit board 30. An AF patch mounting portion (not shown) and an AF magnet mounting portion (not shown) are provided at the bottom of the carrier 70, the AF patch 43 is mounted in the patch mounting portion at the bottom of the carrier 70, the AF magnet 42 is mounted in the AF magnet mounting portion at the bottom of the carrier 70, and the sensor magnet 42 is located between the two AF magnets 41 and mounted in the sensor magnet mounting portion. The AF coil 44 is mounted on the bottom circuit board 30 and aligned with the AF magnet, so that when the AF coil is powered on, the AF magnet is forced to move under the action of electromagnetic induction to drive the carrier 70 to move, thereby realizing the function of automatic focusing.

An AF coil (not shown) of the AF module 40 is also mounted on the bottom circuit board 30 in correspondence with the position of the AF magnet 41. When the AF sensor 36 detects the position of the AF sensor magnet 42 and then the position of the carrier 70 during operation, when the carrier 70 is detected to deviate, the AF sensor 42 transmits the information to the control system, and the control system forces the AF magnet to move under the action of electromagnetic induction by controlling the on-off or the size of current in an AF coil (not shown) so as to drive the carrier 70 to move, so that the automatic focusing function is realized. The AF coil and the AF sensor in the invention are both mounted on the bottom circuit board 30, the AF magnet 41 is mounted on the bottom of the carrier 70, and the AF patch 43 is mounted between the AF magnet 41 and the carrier 70, and the AF patch 43 can strengthen the action of the magnetic field. The AF sensor 36 is aligned with the center of the AF sensing magnet 42, and the AF sensing magnet 42 is also provided with an AF patch 43, so that a regular magnetic field is achieved, and the operation of the AF sensor 36 is more stable.

Fig. 9 is a perspective view of the upper spring 80. As shown in fig. 9, the upper spring 80 includes a fixing portion 80A and an elastic deformation portion 80B, the fixing portion 80A is fixed on the carrier 70, and the elastic deformation portion 80B is fixedly connected to the suspension wire 50 and can be elastically deformed along with the movement of the carrier 70, so that the carrier 70 is movably suspended on the base 10 by the suspension wire 50.

The fixing portion 80A includes a first plate-like body 81 and a second plate-like body 82. The first plate-like body 81 and the second plate-like body 82 are integrally formed. A notch 84 is formed between the first plate-like body 81 and the second plate-like body 82, the notch 84 cooperating with a corresponding corner on the carrier 70 to mount the upper spring 80 on the carrier 70. First coupling holes (not shown) are provided in the first plate-like body 81 to be fitted with first coupling pieces 741 of the reed mounts 74 on the carrier 70, second coupling holes (not shown) are provided in the second plate-like body 82 to be fitted with second coupling pieces 742 of the reed mounts 74 on the carrier 70, the first coupling pieces 741 are fixed through the first coupling holes, and the second coupling pieces 742 are fixed through the second coupling holes, thereby fixing the upper reeds 80 to the carrier 70.

As is apparent from fig. 13, the first connection hole and the second connection hole are spaced apart by a certain distance (i.e., the distance between the first link 741 and the second link 742), so that the operation is convenient and the force points of the entire upper spring are dispersed, the upper spring 80 is firmly fixed to the carrier 70, and is not easily damaged during the movement of the carrier.

The elastic deformation portion 80B includes a first elastic portion 85 and a second elastic portion 86, the first elastic portion 85 is composed of a bent strip including a plurality of bends, one end of the first elastic portion 85 is connected to the edge of the first plate-like body 81, and the other end of the first elastic portion 85 is connected to the suspension wire fixing portion 83. The second elastic portion 86 is also composed of a bent strip including a plurality of bends, and one end of the second elastic portion 85 is connected to the second plate-like body 82, and the other end of the second elastic portion 85 is connected to the suspension wire fixing portion 83.

In the present embodiment, the suspension wire fixing portion 83 is integrally formed with the first elastic portion 85 and the second elastic portion 86, in other words, the first elastic portion 85, the second elastic portion 86 and the suspension wire fixing portion 83 are integrally formed by bending one elastic strip, wherein the first elastic portion 85 integrally forms an "S" shaped body, one end of the "S" shaped body is connected to the edge of the first plate-shaped body 81, and the other end of the "S" shaped body is bent to form the suspension wire fixing portion 83. Similarly, the second elastic portion 86 is also integrally formed as an "S" -shaped body, one end of which is connected to the edge of the second plate-like body 82, and the other end of which is connected to the suspension wire fixing portion 83. When the upper spring 80 is mounted above the carrier 70, the upper end of the suspension wire 50 passes through the suspension wire fixing portion 83 and is suspended on the suspension wire fixing portion 83.

Referring to fig. 9 in conjunction with fig. 13, when the suspension wire 50 is fixed at the lower end to the base 10, at the upper end to the suspension wire fixing portion 83 of the upper spring 80, and at the upper end of the upper spring 80, the upper spring 80 is fixedly connected to the upper portion of the carrier 70 by the first fixing member 87 and the second fixing member 88, the carrier 70 can be suspended above the base 10 for movement in the X-axis and Y-axis directions. Preferably, the first elastic portion 85 forms an S-shaped bend along the Y-axis direction, and the second elastic portion 86 forms an S-shaped bend along the X-axis direction, so that the carrier 70 can return to its original position under the elastic force of the first elastic portion 85 after moving along the Y-axis direction, and can return to its original position under the elastic force of the second elastic portion 86 after moving along the X-axis direction. That is, the optical anti-shake and auto-focus functions can be realized by the actions of the OIS assembly 60, the AF assembly 40, the suspension wire 50, and the upper reed 80, while the carrier can be restored to the original position by the action of the upper reed 80.

Fig. 10 is an exploded perspective view of base 10, sheet metal set 20, and OIS coil set 63 of the present invention, and fig. 11 is a perspective view of the components of fig. 10 assembled together. As shown in fig. 10 to 11, when the base 10, the metal sheet set 20 and the OIS coil set 63 are assembled together, the metal sheet set 20 is mounted inside the base 10, the top 222 of the protruding piece 22 of the metal sheet set 20 is located at the front side of the shoulder 121, and the end 231 of the first horizontal protruding piece 23 and the end 241 of the second horizontal protruding piece 24 are received in the slots 15 of the base 10 and led out from the slots 15, wherein the end 231 of the first horizontal protruding piece 23 is located in the slots 15 at both sides, and the end 241 of the second horizontal protruding piece 24 is located in the slot 15 at the middle. The OIS coil assembly 63 is mounted on the inner side of the vertical protrusion piece 12 of the base 10, and the gap 632 of the OIS coil assembly is caught on the protrusion 124 integrally formed to protrude inward of the inner surface of the shoulder 121 of the base 10, so that the OIS coil assembly 632 is fixedly mounted on the base 10.

Fig. 12 is a perspective view of the base 10, the metal sheet group 20, the OIS coil group 63, and the bottom circuit board 30 of the present invention assembled together. As shown in fig. 12, the bottom circuit board 30 is continuously mounted on the base 10 on the basis of the assembly shown in fig. 11, wherein the middle notch 31 of the bottom circuit board 30 matches the shape and size of the rectangular groove 14 of the base 10, so that when the bottom circuit board 30 is mounted on the base 10, the notch 31 of the bottom circuit board 30 is aligned with the rectangular groove 14 of the base 10, the notches 33 of the corners of the bottom circuit board 30 are clamped and fixed with the supporting portions 13 on the base 10, the bottom circuit board suspension hole 331 on the bottom circuit board 30 is aligned with the base suspension hole 19 on the base 10, and the suspension wire is suspended in the bottom circuit board suspension hole 331 and the base suspension hole 19 after the carrier is mounted.

Fig. 13 is a perspective view of the lens driving device 100 of the present invention. Fig. 14 is a perspective view of the lens driving device 100, fig. 15 is a sectional view of the lens driving device 100, fig. 16 to 17 are plan views of the lens driving device 100, in which fig. 16 is not mounted with a spring plate, and fig. 18 is another sectional view of the lens driving device 100. As shown in fig. 13, after the AF component 40 and the OIS component 60 are mounted on the carrier 70, the mounting of the carrier 70 on the base 10 is continued on the basis of fig. 12. As shown in fig. 13 to 18 in combination with fig. 6 to 9, both the OIS patch 61 and the OIS magnet 62 of the OIS module 60 are mounted on the carrier 70, wherein the OIS patch 61 is first mounted in the OIS patch mounting slot 722 inside the OIS module mounting slot 721 of the carrier 70, then the OIS magnet 62 is mounted in the OIS magnet mounting slot 723 outside, the ear 611 of the OIS patch 61 is fittingly mounted in the ear slot 724 and is clamped, and the OIS magnet 62 is embedded in and clamped to the OIS magnet mounting slot 723.

The AF module 40 is mounted on the lower surface of the carrier 70, wherein the AF patch 43 is mounted on the AF patch mounting portion of the carrier 70, the AF magnets 41 are mounted on the AF patch 43, and the sensor magnet 42 is located between the two AF magnets 41 and mounted in the middle of one AF patch 43. After the AF module 40 and the OIS module 60 are mounted on the carrier 70, the entire assembly formed by the carrier 70, the OIS module 60 and the AF module 40 is mounted on the base 10. The supporting column 731 at the bottom of the suspension wire mounting portion 73 is mounted in the buffer rubber groove 131 of the supporting portion 13 on the base 10, so that the supporting portion 13 on the base 10 mainly bears the weight of the carrier 70. The OIS magnet 62 of the OIS assembly 60 mounted on the carrier 70 faces the OIS coil assembly 63 mounted on the base 10. When the OIS coil 63 is powered on, the OIS magnet 62 can be driven to move so as to drive the carrier 70 to move, so that the optical anti-shake function is realized. The AF magnet 42 of the AF module 40 faces an AF coil (not shown) mounted in the bottom circuit board 30, so that when the AF coil is powered on, the AF magnet 42 is driven to move to drive the carrier 70 to move, thereby implementing an auto-focusing function.

With continued reference to fig. 13, after the carrier 70 having the AF module 40 and the OIS module 60 mounted thereon is mounted on the chassis 10, the upper reed 80 is mounted on and fixed to the upper reed mounting portion 74 of the carrier 70. The suspension wire mounting portion 83 of the upper spring 80 is aligned with the bottom circuit board suspension wire hole 331 and the base suspension wire hole 19 on the bottom circuit board 30. The suspension wire is inserted into the base suspension wire hole 19, the bottom circuit board suspension wire hole 331 and fixed to the suspension wire mounting portion 83 of the upper spring 80, and the carrier is allowed to move on the base 10 under the suspension of the suspension wire suspension 50. In the application, the suspension wires 50 only play a role of a suspension carrier, no current is arranged to pass through the suspension wires, and the scheme cancels the participation of the suspension wires in the whole circuit and only participates in physical motions such as homing and the like, thereby ensuring the stability of the circuit. In addition, as will be appreciated by those skilled in the art, since the suspension wires do not participate in the circuit transmission, the suspension wires may be replaced with other flexible materials as long as the suspension wires can move to suspend the carrier on the base.

Referring back to fig. 1, the driving mechanism of the present invention further includes a housing 90, and the housing 90 cooperates with the base 10 to enclose the bottom circuit board 30, the AF module 40, the OIS module 60, the carrier 70, and the upper spring 80 in a space defined by the housing 90 and the base 10.

The invention only enables the suspension wires to participate in physical movements such as homing and the like by canceling the suspension wires to participate in the whole circuit, thereby ensuring the circuit stability of the whole lens driving device. In addition, the OIS component part adopts a three-dimensional circuit, and the metal sheet group is arranged in the base, so that the assembly difficulty of the circuit, the bottom circuit board sensor and other components is simplified.

While the preferred embodiments of the present invention have been illustrated and described in detail, it should be understood that various changes and modifications of the invention can be effected therein by those skilled in the art after reading the above teachings of the invention. Such equivalents are intended to fall within the scope of the claims appended hereto.

Claims

1. A periscopic lens driving device is characterized by comprising a base, a carrier, a bottom circuit board, an OIS component and an AF component, wherein the OIS component comprises an OIS magnet and an OIS coil set, the AF component comprises an AF magnet and an AF coil set,

the both ends of base are equipped with integrative protrusion piece that upwards stretches out, OIS coil pack install in on the protrusion piece and with the cooperation of OIS magnetite, and

2. A periscopic lens driving apparatus according to claim 1, further comprising a flexible suspension that suspends the carrier from the chassis;

3. The periscopic lens driving apparatus according to claim 1, wherein the OIS assembly further comprises an OIS patch mounted between the carrier and the OIS magnet.

4. A periscopic lens driving apparatus according to claim 1, wherein the AF module comprises an AF patch mounted between the AF magnet and the carrier.

5. A periscopic lens driving apparatus according to claim 2, further comprising an upper spring provided at an upper portion of the carrier and connected to an upper end of the suspension.

6. A periscopic lens driving apparatus according to claim 1, wherein said AF assembly further comprises an AF sensor and an AF sensor magnet, said AF sensor magnet being disposed between two said AF magnets, said AF sensor being mounted on said bottom circuit board and being in corresponding engagement with said AF magnets.

7. The periscopic lens driving apparatus according to claim 1, wherein the OIS assembly further comprises an OIS sensor mounted on the base circuit board and correspondingly engaged with the OIS magnet.

8. A periscopic lens driving apparatus according to claim 1, further comprising a housing, wherein the housing cooperates with the chassis to suspend the carrier within a space defined by the chassis and the housing.

9. A periscopic lens driving apparatus according to claim 1, wherein the base includes a bottom plate, a central portion of the bottom plate forms a rectangular groove, and the protruding blocks are located on both sides of the groove.

10. A periscopic lens driving apparatus according to claim 9, wherein shoulders are formed on both sides of the projection block, and a projection is integrally formed on an inner surface of the shoulder so as to protrude inward, the OIS coil assembly being mounted on the projection.

In one embodiment, the OIS patch and the AF patch are made using iron sheets.