CN110636689A - Protection plate suitable for pasting and mounting over-current protection device PTC - Google Patents
Protection plate suitable for pasting and mounting over-current protection device PTC Download PDFInfo
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- CN110636689A CN110636689A CN201910917519.9A CN201910917519A CN110636689A CN 110636689 A CN110636689 A CN 110636689A CN 201910917519 A CN201910917519 A CN 201910917519A CN 110636689 A CN110636689 A CN 110636689A
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- ptc
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- protection device
- welding
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- 238000003466 welding Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 74
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 3
- 230000001960 triggered effect Effects 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 41
- 230000020169 heat generation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000009388 chemical precipitation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013524 data verification Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Emergency Protection Circuit Devices (AREA)
Abstract
The invention relates to a protection board suitable for mounting an overcurrent protection device PTC, which is a hard board, a soft board and a soft and hard combined board and comprises a substrate layer and a line layer, wherein the line layer covers the surface of the substrate layer, and comprises bonding pads for welding pins of electronic components, conducting wires for forming a line and a protection layer for covering the conducting wires, wherein at least 1 group of bonding pads for welding the PTC are included, and at least 1 conducting wire is locally wired from the middle of the bonding pads for welding the pins at two ends of the PTC or penetrates through the bonding pads for welding the pins at two ends when in wiring, namely at least 1 conducting wire passes through the bottom of the PTC. According to the invention, through the design that the conductive wire passes through the bottom of the PTC when the wire is wired, when the current is small, the conductive wire generates less heat, the PTC is hardly influenced by the heat of the conductive wire, when the current is large, the conductive wire generates heat sharply, the PTC is greatly influenced by the heat of the conductive wire, and the action protection of the PTC is more easily triggered.
Description
Technical Field
The invention relates to a protection plate which can ensure long-term use of PTC under the condition of common low current application and can meet the requirement that the protection action time of a Limited Power Supply (LPS for short) 8A is within 60s, wherein a wire is designed to pass through a bonding pad for welding pins at two ends of the PTC, namely to pass through the bottom of the PTC, and when low current is passed, the conductive wire generates little heat and hardly affects the PTC; when a large current is conducted, the conductive wire section generates heat greatly, so that the heat generation of the PTC is accelerated, and the PTC is easier to act and protect.
Background
Along with the increasingly strict requirements of users on products such as smart phones, the capacity of a battery core of the smart phone is increased, the charging current of the smart phone is increased, the popularity of quick charging has higher and higher requirements on a PTC (positive temperature coefficient) of an overcurrent protection device, and the quick charging is expected to reduce the initial resistance, improve the sustainable current and prolong the service life of the PTC; however, the reduction of resistance inevitably causes a delay in the PTC operation time, and the protection operation time required by LPS for PTC is 8A to less than 60s in the case of using a PTC overcurrent protection device according to the standard specification for LPS in lithium battery safety standard UL 2054. Therefore, it is likely that PTC alone cannot satisfy both the low resistance and LPS.
Disclosure of Invention
The invention aims to: the protection plate is suitable for mounting the PTC of the over-current protection device, so that the PTC can simultaneously meet the LPS standard specified by the battery safety standard UL2054 while meeting low resistance and long service life.
The purpose of the invention is realized by the following technical scheme: the invention provides a protection board suitable for mounting a PTC (positive temperature coefficient) of an overcurrent protection device, which can be a hard board, a soft board and a rigid-flexible board and comprises a substrate layer and a line layer, wherein the line layer covers the surface of the substrate layer, and comprises bonding pads for welding pins of electronic components, conducting wires forming a line and a protection layer for covering the conducting wires, wherein at least 1 group of bonding pads for welding the PTC are included, and at least 1 conducting wire is locally wired from the middle of the bonding pads for welding the pins at two ends of the PTC or is penetrated between the bonding pads for welding the pins at two ends when in wiring, namely at least 1 conducting wire passes through the bottom of the PTC.
The conductive wires of the circuit layer of the invention have 1 or more than 2 conductive wires which are locally wired from the middle of the welding pads of the welding PTC or pass through the welding pads of the welding PTC, namely, part or all of the conductive wires pass through the bottom of the PTC. The principle is as follows: when the power is switched on in the circuit, the heat generated by the section from the bottom of the PTC through the conductive wire can help to accelerate the heat generation of the PTC according to the heat generation power Q = I2And R, when the current is small, the conductive wire generates less heat, the PTC is hardly influenced by the heat of the conductive wire, when the current is large, the conductive wire generates heat and increases sharply, and the PTC is greatly influenced by the heat of the conductive wire, so that the action protection of the PTC is triggered more easily.
The type of the conductive wire passing through the bottom of the PTC element can be a single-side all-through type, a double-side all-through type, a single-side local wiring type, a double-side local wiring type, or a local wiring type and a full-through type.
The conductive wires passing through the bottom of the PTC may be single, double or more, or all.
The conducting wire routing is a straight line, a curve or a combination of the straight line and the curve.
The circuit layer also comprises a bonding pad for welding NTC, IC, MOS, precision resistor and capacitor electronic components and a conducting wire for forming an electronic circuit.
The shape of the bonding pad can be round, rectangular, polygonal and irregular, and the surface treatment mode of the bonding pad can be one or more than two of chemical precipitation nickel gold, electroplating nickel gold, chemical precipitation silver, OSP and hot air leveling.
The circuit layer can be a single layer, a double layer or a multilayer, and when the circuit layer is a double layer or a multilayer, the circuit layer is connected with a circuit through a conductive hole between the circuit layers.
And one or the combination of more than two of the conductive hole through hole, the blind hole and the buried hole.
The substrate layer is a phenolic resin, an epoxy resin, a polyester resin, a BT resin, a PI resin, a PPO resin, an MS resin, a ceramic, a metal or a metal alloy layer.
On the basis of the scheme, the number of the substrate layers can be single layer, double layers or multiple layers.
The surface of the circuit layer needs to be printed with a protective layer, so that the circuit layer is protected, the short circuit of the solder in dip-dyeing of the non-pad part is prevented, and meanwhile, the pad for welding the pins of the electronic components needs to be windowed and exposed.
The protective layer is solder resist ink covering the surface of the circuit layer and silk-screen characters printed on the solder resist ink.
The invention has the advantages that: the protection shield changes the ambient temperature around the PTC through the design of walking the line and influences the heating of PTC, passes between the pad of welding PTC both ends pin when walking the line, namely passes through from the bottom of PTC. When the access circuit is electrified, the heat of the conductive wire can help to accelerate the heat generation of the PTC, and the Q = I heat generation power2And R, when the current is small, the conductive wire generates less heat, the PTC is hardly influenced by the heat of the conductive wire, when the current is large, the conductive wire generates heat and increases sharply, and the PTC is greatly influenced by the heat of the conductive wire, so that the action protection of the PTC is triggered more easily. The PTC can realize low resistance and long service life and can meet the standard of LPS.
Drawings
FIG. 1 is a cross-sectional view of a test plate according to example 1 of the present invention;
FIG. 2 is a schematic structural diagram of a test board according to embodiment 1 of the present invention;
FIG. 3 is a schematic structural diagram of a test board according to example 2 of the present invention;
FIG. 4 is a schematic structural diagram of a test board according to example 3 of the present invention;
FIG. 5 is a schematic view of a test board according to example 4 of the present invention;
FIG. 6 is a schematic structural view of a conventional test board not incorporating the present invention;
FIG. 7 shows an action time of 8A, wherein from left to right, the conventional testboard, the single-sided all-pass type, the double-sided all-pass type, the single-sided local layout, and the double-sided local layout are shown;
fig. 8 is a curve showing the change in charge/discharge resistance of 3A, in which the right side is a full-double-side-penetration type, a partial-double-side-wiring type, a full-single-side-penetration type, a partial-single-side-wiring type, or a conventional test board, respectively, from top to bottom;
the reference numbers in the figures illustrate:
1-protective layer;
2-line layer;
3-the substrate layer;
4-a nickel-gold layer;
5——PTC；
21a — a first test pad; 21 b-second test pad;
22 a-first PTC pad; 22 b-second PTC pad;
23a — first electrically conductive line of example 1; 23b — second conductive line of example 1;
23c — first electrically conductive line of example 2; 23d — second conductive line of example 2;
23e — first electrically conductive line of example 3; 23f — second conductive line of example 3;
23g — first electrically conductive line of example 4; 23h — example 4 second conductive line;
23i — conventional test board first conductive line; 23j — conventional test board second conductive line.
Detailed Description
Example 1
A protection board suitable for mounting an overcurrent protection device PTC, which only contains a PTC 5 electronic element and a conductive wire passing through the bottom of the PTC is a single-side all-through type test board, as shown in figures 1 and 2, comprises a substrate layer 3 and a line layer 2, wherein the line layer 2 covers the surface of the substrate layer 3, the line layer 2 comprises a bonding pad for welding pins of each electronic element, a conductive wire forming a line and a protection layer 1 covering the conductive wire, wherein,
comprises 1 group of pads for welding PTC 5, a first PTC pad 22a and a second PTC pad 22 b;
in the embodiment 1, the first conductive wire 23a is locally wired between the first PTC pad 22a and the second PTC pad 22b for soldering the two terminal pins of the PTC 5, i.e. it passes through the bottom of the PTC 5.
As shown in FIG. 2, FR-4 epoxy resin with a thickness of 0.80mm is used as a substrate 3, a copper layer with a thickness of 1OZ is plated on the surface, and a circuit layer 2 is formed by a circuit image transfer technology.
The wiring layer 2 includes first and second test pads 21a and 21b, first and second pads 22a and 22b to which the PTC 5 is soldered, and first and second conductive lines 23a and 23 b. Wherein the first conductive line 23a is led out from the end of the first pad 22a to which the PTC 5 is bonded, and then, passes entirely between the first pad 22a and the second pad 22b, and is connected to the first test pad 21 a; the second conductive line 23b is directly connected to the second test pad 21 b.
Printing a layer of green solder resist ink with the thickness of about 23um on the surface of the circuit layer 2 to serve as a protective layer 1, windowing and exposing the first test pad 21a and the second test pad 21b and the first PTC pad 22a and the second PTC pad 22b for welding the PTC 5, and processing the surfaces of the first test pad 21a and the second test pad 21b and the first PTC pad 22a and the second PTC pad 22b for welding the PTC 5 by adopting a chemical nickel-gold precipitation mode to form a nickel layer 4 with the thickness of 2.6 um.
The action time of 8A and the charge-discharge resistance change curve of 3A of this example are shown in fig. 7 and 8. The PTC not only realizes low resistance and long service life, but also can meet the standard of LPS.
Example 2
A protection plate suitable for mounting a PTC (positive temperature coefficient) of an overcurrent protection device comprises a substrate layer 3 and a line layer 2, wherein the line layer 2 covers the surface of the substrate layer 3, the line layer 2 comprises a bonding pad for welding pins of an electronic device, a conductive line forming a line and a protection layer 1 covering the conductive line, at least 1 group of first and second PTC bonding pads 22a and 22b for welding a PTC 5 are included, and the first and second conductive lines 23c and 23d of the embodiment completely penetrate through the bonding pads for welding pins at two ends of the PTC during wiring.
The difference between this embodiment and embodiment 1 is only in the routing manner of the conductive wires, as shown in fig. 3, wherein the first conductive wire 23c is led out from the end of the first pad 22a for soldering the PTC, and then passes through the space between the first and second pads 22a and 22b of the PTC, and is connected to the first testing pad 21 a; the second conductive wire 23d is led out from the end of the second pad 22b to which the PTC is bonded, and then passes entirely between the first and second pads 22a, 22b of the PTC to be connected to the second test pad 21 b.
The action time of 8A and the charge-discharge resistance change curve of 3A of this example are shown in fig. 7 and 8. The PTC not only realizes low resistance and long service life, but also can meet the standard of LPS.
Example 3
A protection board suitable for mounting PTC of over-current protection device, as shown in figure 4, the conductive wire passing through the bottom of PTC is a single-side local wiring type test board, which comprises a substrate layer 3 and a line layer 2, the line layer 2 covers the surface of the substrate layer 3, the line layer 2 comprises 1 group of pads for welding PTC, conductive wires forming the line and a protection layer 1 covering the conductive wires,
the difference between this embodiment and embodiment 1 is only the wiring manner of the conductive wire, as shown in fig. 4, wherein the first conductive wire 23e is routed out from the side of the first pad 22a for soldering PTC, and then routed out from between the first and second PTC pads 22a, 22b, and then connected to the first test pad 21 a; the second conductive line 23f is directly connected to the second test pad 21 b.
The action time of 8A and the charge-discharge resistance change curve of 3A of this example are shown in fig. 7 and 8. The PTC not only realizes low resistance and long service life, but also can meet the standard of LPS.
Example 4
A suitable for pasting and installing the protective plate of the over-current protection device PTC, as shown in fig. 5, the conducting wire passing through PTC 5 bottom is the local wiring type test board of bilateral, including base plate layer 3 and line layer 2, the line layer 2 covers the surface of base plate layer 3, the said line layer 2 includes 1 group of pad used for welding PTC, conducting wire forming circuit and protective layer 1 covering the conducting wire, this embodiment is different from 1 embodiment only in the way of routing of the conducting wire, the first conducting wire 23g is wired and walked out from the side of the first pad 22a of welding PTC, then pass through between first, second PTC pad 22a, 22b, and couple to first test pad 21 a; the second conductive wire 23h is routed from the side of the second PTC pad 22b to which the PTC 5 is bonded, then passes between the first and second PTC pads 22a, 22b, and is connected to the second test pad 21 b.
The action time of 8A and the charge-discharge resistance change curve of 3A of this example are shown in fig. 7 and 8. The PTC not only realizes low resistance and long service life, but also can meet the standard of LPS.
Comparative example
In addition, a conventional test board not having the special design of the present invention is manufactured as a comparison, as shown in fig. 6, the only difference from the present invention is that the first conductive line 23i does not pass through the bottom of the PTC 5 but is directly connected to the first test pad 21 a; the second conductive line 23j also does not pass through the bottom of the PTC 5, but is directly connected to the second test pad 21 b.
Data verification:
after mounting with the same type of PTC using a conventional test board (test board shown in fig. 6) and test boards according to examples 1 to 4 of the present invention (test boards shown in fig. 2 to 5), respectively, a wire comparison test was performed by soldering wires from test pads at both ends:
first, 8A action time, as shown in FIG. 7; second, the resistance of the charge-discharge cycle of 3A was changed as shown in fig. 8. From the above two sets of tests, it can be seen that the PTC devices of the same type are attached to the conventional test board and the test boards according to the embodiments of the present invention, and the lift-drag levels of the low-current charge and discharge are equivalent; however, the standard of LPS (8A action time less than 60 s) cannot be met on the conventional test board, but the LPS standard can be met on the test boards of several embodiments of the present invention, and the sequence of action time is: the double-side all-through type < the double-side local wiring type < the single-side all-through type < the single-side local wiring type. It should be noted that, when designing the protection board, the protection board manufacturer may select an optimal routing manner according to the heat dissipation capability of the protection board itself, which may not only ensure long-term use of PTC under the normal low-current application condition, but also meet the requirement of LPS (protection action time of 8A is within 60 s).
Claims (13)
1. The protection board comprises a substrate layer and a line layer, wherein the line layer covers the surface of the substrate layer, and the protection board is characterized in that the line layer comprises bonding pads for welding pins of all electronic components, conductive wires forming a line and a protection layer for covering the conductive wires, wherein at least 1 group of bonding pads for welding the PTC are included, and at least 1 conductive wire is locally wired in the middle of the bonding pads for welding the pins at two ends of the PTC or penetrates through the bonding pads for welding the pins at two ends when in wiring, namely at least 1 conductive wire passes through the bottom of the PTC.
2. The protection plate for attaching an overcurrent protection device PTC according to claim 1, wherein the conductive wire passes through the bottom of the PTC and can be a single-side all-through type, a double-side all-through type, a single-side partial wiring type, a double-side partial wiring type, or a single-side partial wiring type and a full-through type.
3. A protection plate suitable for being mounted with a PTC of an overcurrent protection device according to claim 1 or 2, wherein the conducting wires passing through the bottom of the PTC can be single, double or more or all.
4. A protection plate suitable for being mounted with an overcurrent protection device PTC according to claim 3, wherein the conductive wire trace is a straight line, a curved line, or a combination of a straight line and a curved line.
5. A protective plate suitable for mounting an overcurrent protection device PTC according to claim 1 or 2, wherein the circuit layer further comprises bonding pads for soldering NTC, IC, MOS, precision resistor, capacitor type electronic components and conductive wires for forming electronic circuits.
6. The protection plate suitable for being mounted with an overcurrent protection device PTC according to claim 5, wherein the shape of the bonding pad can be round, rectangular, polygonal or irregular, and the surface treatment mode of the bonding pad can be one or more than two of electroless nickel gold, electroplating nickel gold, electroless silver, OSP and hot air leveling.
7. A protection plate suitable for mounting an over-current protection device PTC according to claim 5, wherein said wiring layer is single layer, double layer or multi-layer, and when the wiring layer is double layer or multi-layer, the circuit is connected through the conductive hole between the wiring layers.
8. The protection plate suitable for being mounted with an over-current protection device PTC according to claim 7, wherein the conductive hole is one or a combination of more than two of a through hole, a blind hole and a buried hole.
9. The protection plate suitable for being mounted with a PTC of an overcurrent protection device according to claim 1, wherein the substrate layer is a layer of phenolic resin, epoxy resin, polyester resin, BT resin, PI resin, PPO resin, MS resin, ceramic, metal or metal alloy.
10. The protection plate for mounting a PTC of an overcurrent protection device according to claim 1 or 6, wherein the number of the substrate layers can be a single layer, a double layer or a multi-layer.
11. The protective plate for attaching an overcurrent protection device PTC according to claim 1, wherein the protective layer exposes the bonding pad window.
12. A protection plate suitable for being mounted with an overcurrent protection device PTC according to claim 1 or 11, wherein a nickel layer is formed on the surface of the bonding pad by chemical nickel-gold deposition.
13. The protection plate suitable for being attached with the over-current protection device PTC according to claim 1 or 11, wherein the protection layer is solder resist ink covering the surface of the circuit layer and silk-screen characters printed on the solder resist ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910917519.9A CN110636689A (en) | 2019-09-26 | 2019-09-26 | Protection plate suitable for pasting and mounting over-current protection device PTC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910917519.9A CN110636689A (en) | 2019-09-26 | 2019-09-26 | Protection plate suitable for pasting and mounting over-current protection device PTC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110636689A true CN110636689A (en) | 2019-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910917519.9A Pending CN110636689A (en) | 2019-09-26 | 2019-09-26 | Protection plate suitable for pasting and mounting over-current protection device PTC |
Country Status (1)
| Country | Link |
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| CN (1) | CN110636689A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097985A (en) * | 2021-04-01 | 2021-07-09 | 上海维安电子有限公司 | Protection module with overcurrent quick response |
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| US6445277B1 (en) * | 1999-06-22 | 2002-09-03 | Yazaki Corporation | Safety device of electric circuit and process for producing the same |
| CN101595615A (en) * | 2007-01-25 | 2009-12-02 | 万国半导体股份有限公司 | Structures and methods for self-protection in power devices |
| CN202697037U (en) * | 2012-04-13 | 2013-01-23 | 瑞侃电子(上海)有限公司 | Circuit protection module |
| CN205040096U (en) * | 2015-10-23 | 2016-02-17 | 苏州科利科技发展有限公司 | Circuit board with hot protection circuit of PTC |
| CN107580422A (en) * | 2017-08-25 | 2018-01-12 | 维沃移动通信有限公司 | A kind of circuit board and its manufacturing method |
| CN107995775A (en) * | 2017-12-07 | 2018-05-04 | 东莞市奕东电子有限公司 | Carry overcurrent protection flexible circuit and manufacturing process |
-
2019
- 2019-09-26 CN CN201910917519.9A patent/CN110636689A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6445277B1 (en) * | 1999-06-22 | 2002-09-03 | Yazaki Corporation | Safety device of electric circuit and process for producing the same |
| CN101595615A (en) * | 2007-01-25 | 2009-12-02 | 万国半导体股份有限公司 | Structures and methods for self-protection in power devices |
| CN202697037U (en) * | 2012-04-13 | 2013-01-23 | 瑞侃电子(上海)有限公司 | Circuit protection module |
| CN205040096U (en) * | 2015-10-23 | 2016-02-17 | 苏州科利科技发展有限公司 | Circuit board with hot protection circuit of PTC |
| CN107580422A (en) * | 2017-08-25 | 2018-01-12 | 维沃移动通信有限公司 | A kind of circuit board and its manufacturing method |
| CN107995775A (en) * | 2017-12-07 | 2018-05-04 | 东莞市奕东电子有限公司 | Carry overcurrent protection flexible circuit and manufacturing process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097985A (en) * | 2021-04-01 | 2021-07-09 | 上海维安电子有限公司 | Protection module with overcurrent quick response |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 806, 8th floor, No. 125, Liuying Road, Hongkou District, Shanghai 200083 Applicant after: Shanghai Wei'an Electronic Co.,Ltd. Address before: 715-z, 710 Siping Road, Yangpu District, Shanghai 200092 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant before: Shanghai Wei'an Electronic Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191231 |
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| WD01 | Invention patent application deemed withdrawn after publication |