CN110562585B

CN110562585B - Semiconductor card packaging container and optical disk packaging container

Info

Publication number: CN110562585B
Application number: CN201910876982.3A
Authority: CN
Inventors: 留国典; 留君铭
Original assignee: Finest Products Ltd
Current assignee: Finest Products Ltd
Priority date: 2019-09-17
Filing date: 2019-09-17
Publication date: 2021-10-22
Anticipated expiration: 2039-09-17
Also published as: CN110562585A

Abstract

The invention discloses a semiconductor card packaging container, which comprises a box body capable of being closed and opened, wherein a card containing part is arranged on the box body, and a card containing groove with the outline matched with the appearance of a semiconductor card is arranged on the card containing part; the clamping part is provided with an elastic buckle component and a pressing buckle component on two opposite sides of the clamping groove respectively, the elastic buckle component and the pressing buckle component are used for limiting the semiconductor card in the clamping groove, and when the pressing buckle component is stressed, the elastic buckle component ejects the semiconductor card out of the clamping groove. The semiconductor card packaging container provided by the invention has the advantages that the semiconductor card can be smoothly and conveniently stored and taken, the problem of scratching a user can not exist in the storage and taking of the semiconductor card, the semiconductor card can be repeatedly utilized, and the problems of losing and damaging the semiconductor card are not easy to occur when the semiconductor card is stored by utilizing the packaging container.

Description

Semiconductor card packaging container and optical disk packaging container

Technical Field

The invention relates to the technical field of packaging, in particular to a semiconductor card packaging container.

Background

The SD memory card is a new-generation memory device based on a semiconductor flash memory, and is widely used in portable devices such as digital cameras, personal digital assistants (PDA for short of foreign language), and multimedia players due to its excellent characteristics of small size, high data transfer speed, hot-swappability, and the like.

For semiconductor cards such as SD cards and micro SD cards, corresponding packaging containers do not exist at present, most manufacturers only package the semiconductor cards in a blister shell mode when selling the semiconductor cards, but the blister shell packaging is disposable and cannot be reused, so that not only is a great deal of waste caused, but also the environment is polluted, the problem that the blister shell packaging is difficult to open exists, the semiconductor cards in the blister shell can be taken out only by scratching the blister shell through scissors or a blade, and in the process, the danger of scratching a user exists.

In addition, as the blister pack cannot be reused, no special packaging equipment is available in the market, no available packaging container is available after consumers buy the semiconductor cards, the semiconductor cards are very inconvenient to store, particularly for photography enthusiasts and the like needing a large number of storage cards, a plurality of semiconductor cards are required to be carried when the semiconductor cards are out for work, and the loss and the damage of the semiconductor cards are easy to occur due to the absence of the special packaging container, so that the loss of the value of the cards per se can be caused to users, the loss and the leakage of data can also be caused to the users, and the degree of the loss can not be estimated.

Disclosure of Invention

The invention aims to provide a packaging container specially designed for a semiconductor card, and solves the problems that in the prior art, a user is inconvenient to carry the semiconductor card, a blister shell cannot be recycled, and the hand is easily scratched when the blister shell is opened.

In view of the above, the present invention provides a semiconductor card packaging container, which includes a box body capable of being closed and opened, wherein the box body is provided with a card loading portion, and the card loading portion is provided with a card placing groove with a contour matched with the contour of a semiconductor card;

the clamping part is provided with an elastic buckle component and a pressing buckle component on two opposite sides of the clamping groove respectively, the elastic buckle component and the pressing buckle component are used for limiting the semiconductor card in the clamping groove, and when the pressing buckle component is stressed, the elastic buckle component ejects the semiconductor card out of the clamping groove.

Preferably, a panel part is arranged in the card placing groove, the panel part extends downwards from a first side of the card placing groove to a second side of the card placing groove in the opposite direction of the first side, and the pressing and buckling component is arranged at one end of the panel part connected with the first side of the card placing groove.

Preferably, the panel part is provided with a pressing and buckling groove below the pressing and buckling component, so that the pressing and buckling component is suspended downwards.

Preferably, the pressing and buckling assembly comprises a pressing piece and a limiting piece, one end of the pressing piece is connected with the panel portion, the other end of the pressing piece is connected with the limiting piece, and the limiting piece is abutted to the semiconductor card when in use.

Preferably, spacing piece is for being L shape, is equipped with roof and lateral wall, the roof with the pressing sheet is connected, the roof is the inclined plane structure when the pressing sheet is the lax state, the roof is higher than panel portion plane when the pressing sheet is the stress state, the roof with panel portion plane parallel and level, the roof is when getting, putting the semiconductor card with semiconductor card bottom surface butt, the lateral wall when depositing the semiconductor card with the side butt of semiconductor card.

Preferably, the card loading part is close to a second side of the card placing groove and is provided with a spring fastening groove, the spring fastening groove is communicated with the card placing groove, and the spring fastening component is arranged in the spring fastening groove and is suspended in the direction of the spring fastening groove.

Preferably, the elastic buckle assembly comprises an elastic sheet which is of a V-shaped structure, the bottom of the elastic sheet is arc-shaped, one side of the elastic sheet is connected with the clamping part, and the elastic sheet is abutted to the semiconductor card when in use.

Preferably, the elastic sheet is of an arc structure with a notch in the middle, and two sides of the elastic sheet are respectively connected with the elastic buckle groove.

Preferably, the elastic buckle assembly further comprises a connecting sheet, one end of the connecting sheet is connected with the clamping portion, the other end of the connecting sheet is connected with the elastic sheet, and the connecting sheet is of an S-shaped arc structure.

Preferably, the clamping portion is provided with a blocking piece, the blocking piece is arranged on two sides of the clamping groove perpendicular to the direction from the first side to the second side, so that the projection of the blocking piece in the vertical direction can partially cover the panel portion, and a gap is directly formed between the blocking piece and the panel portion.

The invention also provides an optical disk packaging container, which comprises the card loading part in any one of the semiconductor card packaging containers.

Compared with the prior art, the embodiment of the invention has the advantages that:

the invention provides a semiconductor card packaging container, a consumer can slide a semiconductor card into a card placing groove from one side of a press buckle when using the semiconductor card packaging container, when the end part of the card placing groove is propped against an elastic sheet, the semiconductor card can be fixed in the card placing groove by pushing the semiconductor card forwards, and the press buckle component, the elastic buckle component and a baffle plate can stably limit the semiconductor card in the card placing groove; when the semiconductor card needs to be taken out, the pressing and buckling assembly is pressed down, so that the top wall and the panel part of the limiting piece of the pressing and buckling assembly are positioned on the same plane, and the top wall and the panel part of the limiting piece are obliquely arranged, so that the semiconductor card can slide out of the card placing groove under the action of the elastic buckling assembly.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic structural view of example 1 of the present invention;

FIG. 2 is a schematic structural view of a card loading portion in embodiment 1 of the present invention;

FIG. 3 is a cross-sectional view of a card-storing state of the card-loading portion in accordance with embodiment 1 of the present invention;

FIG. 4 is a schematic cross-sectional view illustrating a card-removing state of the card-loading portion in accordance with embodiment 1 of the present invention;

FIG. 5 is an enlarged cross-sectional view of the card-loading portion in the card-loading state in example 1 of the present invention;

FIG. 6 is a schematic structural view of a card loading portion in embodiment 2 of the present invention;

FIG. 7 is a cross-sectional view of a card-storing state of the card-loading portion in embodiment 2 of the present invention;

FIG. 8 is a schematic cross-sectional view illustrating a card-removing state of the card-loading portion in accordance with embodiment 2 of the present invention;

FIG. 9 is a schematic structural view of a card loading portion in embodiment 3 of the present invention;

FIG. 10 is a cross-sectional view of a card-storing state of the card-loading portion in accordance with embodiment 3 of the present invention;

FIG. 11 is a schematic cross-sectional view illustrating a card-removing state of the card-loading portion in accordance with embodiment 3 of the present invention;

FIG. 12 is an enlarged view of the latch assembly in the latch loading position according to embodiment 3 of the present invention;

FIG. 13 is an enlarged view of the pressing and fastening assembly in the fastening state in embodiment 3 of the present invention;

FIG. 14 is a schematic structural view of a card loading portion in accordance with embodiment 4 of the present invention;

FIG. 15 is a cross-sectional view of a card-storing state of the card-loading portion in accordance with embodiment 4 of the present invention;

FIG. 16 is a schematic cross-sectional view illustrating a card-removing state of the card-loading portion in accordance with embodiment 4 of the present invention;

FIG. 17 is an enlarged view of the latch assembly in the latch loading position according to embodiment 4 of the present invention;

FIG. 18 is an enlarged view of the pressing and fastening assembly in the fastening state in embodiment 4 of the present invention;

in the figure: 1-bottom; 2-a cover part; 3-a ridge; 4-a card installing part; 5-SD card area; 6-micro SD card area; 7-placing a clamping groove; 8-panel part; 9-a press-fastening component; 10-pressing sheet; 11-a limiting sheet; 12-pressing a buckling groove; 13-a snap-on assembly; 14-a spring plate; 15-connecting sheets; 16-a snap groove; 17-a baffle plate; 20-SD card; 30-micro SD card; 40-magnetic card.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

Referring to fig. 1, the present embodiment provides a semiconductor card packaging container for storing semiconductor cards such as SD cards and micro SD cards, which includes a box body having a bottom portion 1, a cover 2 and a spine portion 3, wherein the bottom portion 1 and the cover portion 2 are respectively hinged to two sides of the spine portion 3, and the cover portion 2 and the bottom portion 1 can rotate around the spine portion 3, so that the box body has two states of opening and closing.

Be equipped with dress card portion 4 on the bottom of the case portion 1, be equipped with SD card district 5 and micro SD card district 6 on dress card portion 4, SD card district 5 and micro SD card district 6 all are equipped with puts draw-in groove 7, SD card district 5 is the same with micro SD card district 6's structure, the difference only lies in SD card district 5 and micro SD card district 6 put the shape of draw-in groove 7 different, according to actual needs, can set up one or more SD card district, one or more micro SD card district, the combination of a plurality of SD cards and micro SD card on dress card portion 4, use SD card district 5 to exemplify the structure of dress card portion 4 below.

The card slot 7 of the SD card area 4 is used for storing an SD card, and has a contour matching the external shape of the SD card, and when the SD card 20 is placed in the card slot 7, the inner wall of the card slot 7 can completely fit with the SD card 20, and for convenience of description, two directions in which the card slot 7 is perpendicular to each other are respectively referred to as a longitudinal direction and a transverse direction.

The inside of the card placing groove 7 is provided with a panel part 8, the panel part 8 is connected with the inner wall of the card placing groove 7 in a matching manner, namely, when the SD card 20 is placed in the card placing groove 7, the bottom surface of the SD card 20 is attached to the area, the projection of the SD card 20 in the vertical direction is overlapped with the panel part 8, the panel part 8 extends downwards from one side of the card placing groove 7 along the longitudinal direction of the card placing groove 7 to the other side of the card placing groove 7 in a slant manner, namely, the panel part 8 has a certain gradient in the longitudinal direction of the card placing groove 7, for convenience of description, the two longitudinal sides of the card placing groove 7 are respectively called as a first side and a second side, the first side is the higher side of the panel part 8, and the second side is the lower side of the panel part 8.

A pressing and buckling component 9 is arranged on the higher side of the panel part 8, a pressing and buckling groove 12 is arranged below the pressing and buckling component 9, so that the pressing and buckling component 9 is suspended downwards, the pressing and buckling component 9 comprises a pressing sheet 10 and a limiting sheet 11, the pressing sheet 10 is used as a force application part pressed by a user, the limiting sheet 11 is of an L-shaped structure and is provided with a top wall and a side wall, one end of the pressing sheet 10 is connected with the panel part 8, the other end of the pressing sheet is connected with the top wall of the limiting sheet 11, the top wall of the limiting sheet 11 is of an inclined plane structure, the inclination of the top wall is the same as that of the panel part 8, when the pressing sheet 10 is in a loose state, the top wall of the limiting sheet 11 is higher than the plane of the panel part 8, when the pressing sheet 10 is in a stress state, the top wall of the limiting sheet 11 is flush with the plane of the panel part 8, namely, the top wall of the limiting sheet 11 is in the same plane with the plane, when the user deposits or takes out the SD card 20, the bottom surface of the SD card can abut against the top wall of the limiting sheet 11, that is, the SD card 20 slides on the top wall of the stopper piece 11, and the side wall of the stopper piece 11 abuts against the side surface of the SD card 20 in a state where the SD card 20 is stored, to restrict the movement of the SD card 20 in the horizontal direction.

The SD card district 5 is equipped with bullet catching groove 16 near the second side department of putting draw-in groove 7, bullet catching groove 16 with put draw-in groove 7 intercommunication, be equipped with bullet knot subassembly 13 in the bullet catching groove 16, bullet knot subassembly 13 is unsettled state to the direction in the bullet catching groove 16, bullet knot subassembly 13 includes shell fragment 14, shell fragment 14 is the V font structure, its bottom is the arc transition, one side wherein of shell fragment 14 is connected with bullet catching groove 16, the opposite side when using with the side butt of SD card 20.

Put draw-in groove 7 and be equipped with separation blade 17 respectively along being equipped with on its horizontal two lateral walls, separation blade 17 does not contact with panel portion 8, is equipped with the clearance with panel portion 8, and separation blade 17 projection in vertical direction can partially cover on panel portion 8, when depositing SD card 20 in putting draw-in groove 7 promptly, and separation blade 17 can cover the edge of SD card 20 for restriction SD card 20 is at the ascending removal in vertical direction.

The use of this embodiment is as follows:

when the SD card 20 needs to be stored, the SD card 20 slides into the card slot 7 from one side of the pressing and buckling assembly 9, when the front end of the SD card 20 abuts against the elastic piece 14, the SD card 20 is pushed to press the elastic piece 14, the elastic piece 14 moves towards the elastic buckling groove 16, the rear end of the SD card 20 slides into the card slot 7 along the top wall of the limiting piece 11, the inner wall of the card slot 7 is matched with the shape of the SD card 20, the side wall of the limiting piece 11 and the elastic piece 14 are both connected with the side face of the SD card 20 to limit the movement of the SD card 20 in the horizontal direction, and the blocking piece 17 is arranged on the inner wall of the card slot 7 along the inner wall to limit the movement of the SD card 20 in the vertical direction, so that the SD card 20 is firmly fixed in the card slot 7, and then the box body is closed, and the storage action of the SD card 20 is completed; when the SD card 20 needs to be taken out, the case body is opened, the force is applied to the pressing sheet 10, the upper wall of the limiting sheet 11 is flush with the plane of the panel part 8, the side wall of the limiting sheet 11 does not limit the SD card 20, the elastic sheet 14 ejects the SD card 20, the SD card 20 is separated from the card placing groove 7, and the user slides out the SD card 20 along the panel part 8.

The semiconductor card packaging container that this embodiment provided, the access semiconductor card is all very smooth and easy convenient, can not have fish tail user's problem, and the shape of box body can freely design, generally all is the cuboid, and the user carries and comes very convenient, is difficult for causing the loss or the damage of SD card, if the merchant uses this embodiment packing SD card to sell, the consumer still repeatedly usable this embodiment packaging container after buying back, and reuse has reduced the waste.

Example 2

The present embodiment is different from embodiment 1 in that:

the shell fragment 14 of the snapping component 13 of this embodiment is an arc-shaped structure, the two ends of the shell fragment 14 are respectively connected with the two sides of the opening of the snapping slot 16, and the middle of the shell fragment 14 is provided with a notch, so that the shell fragment 14 is connected together as two half-arc pieces, and the two half-arc pieces can move smoothly towards the inside of the snapping slot 16 or the outside of the snapping slot 16.

Example 3

The present embodiment is different from embodiment 1 in that:

the present embodiment can be used for storing a magnetic card or an IC card such as a debit card, a credit card, a bus card, etc., the card installing portion 4 of the present embodiment is provided with only one card placing slot 7, and the card placing slot 7 has a contour matched with the shape of the magnetic card 40, that is, when the magnetic card 40 is located in the card placing slot 7 of the present embodiment, the magnetic card 40 is attached to the inner wall of the card placing slot 7.

The snap-fastener assembly 13 of this embodiment still includes the connection piece 15, and the connection piece 15 is the arc structure of S-shaped, and its one end is connected with snap-fastener groove 16, and the other end is connected with shell fragment 14, through setting up connection piece 15, makes snap-fastener assembly 13 have bigger elasticity and bigger resilience displacement space, and then can restrict the bigger magnetic card 40 of size in putting card groove 7.

Example 4

The present embodiment is different from embodiment 2 in that:

Example 5

This embodiment provides an optical disc packaging container, which is a box capable of being opened and closed, wherein the bottom of the box is provided with a card loading portion of the semiconductor card packaging box of any one of embodiments 1-2, and the card loading portion of the semiconductor card packaging box has a smaller volume, so that the card loading portion and the storage area of the optical disc can be used in combination, and the optical disc packaging container can store not only optical discs but also SD cards and other semiconductor cards.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor card packaging container is characterized by comprising a box body capable of being closed and opened, wherein a card containing part is arranged on the box body, and a card containing groove with the outline matched with the appearance of a semiconductor card is arranged on the card containing part;

the card loading part is respectively provided with an elastic buckle component and a pressing buckle component at two opposite sides of the card placing groove, the elastic buckle component and the pressing buckle component are used for limiting the semiconductor card in the card placing groove, and when the pressing buckle component is stressed, the elastic buckle component ejects the semiconductor card out of the card placing groove;

a panel part is arranged in the clamping groove, and a pressing and buckling groove is arranged below the pressing and buckling component by the panel part, so that the pressing and buckling component is suspended downwards; the pressing and buckling assembly comprises a pressing sheet and a limiting sheet, one end of the pressing sheet is connected with the panel part, the other end of the pressing sheet is connected with the limiting sheet, and the limiting sheet is abutted to the semiconductor card when in use;

spacing piece is for being L shape, is equipped with roof and lateral wall, the roof with the pressing plate is connected, the roof is the inclined plane structure when the pressing plate is lax state, the roof is higher than panel portion plane when the pressing plate is the stress state, the roof with panel portion plane parallel and level, the roof when getting, putting the semiconductor card with semiconductor card bottom surface butt, the lateral wall when depositing the semiconductor card with the side butt of semiconductor card.

2. The semiconductor card packaging container according to claim 1, wherein said panel portion extends obliquely downward from a first side of said card-receiving slot to a second side of said card-receiving slot in a direction opposite to said first side of said card-receiving slot, said press-fit assembly being provided at an end of said panel portion connected to said first side of said card-receiving slot;

the clamping part is close to a second side of the clamping groove, an elastic buckling groove is formed in the position, communicated with the clamping groove, of the clamping part, and the elastic buckling component is arranged in the elastic buckling groove and is made to be in a suspended state in the direction of the inner side of the elastic buckling groove.

3. The semiconductor card packaging container of claim 2, wherein the snap assembly comprises a spring, the spring is of a V-shaped structure, the bottom of the spring is arc-shaped, one side of the spring is connected with the card loading portion, and the spring abuts against the semiconductor card when in use.

4. The semiconductor card packaging container according to claim 3, wherein the snap assembly further comprises a connecting piece, one end of which is connected to the card loading portion and the other end of which is connected to the resilient piece.

5. The semiconductor card packaging container according to claim 4, wherein the connecting piece has an S-shaped arc structure.

6. The semiconductor card packaging container of claim 2, wherein the snap assembly comprises a spring plate, the spring plate is an arc-shaped structure with a notch in the middle, and two sides of the spring plate are respectively connected with the snap groove.

7. The semiconductor card packaging container according to claim 2, wherein the card loading portion is provided with a blocking piece, the blocking piece is provided on both sides of the card loading slot in a direction perpendicular to the first side to the second side, so that a projection of the blocking piece in a vertical direction can partially cover the panel portion, and the blocking piece is directly provided with a gap from the panel portion.

8. An optical disk packaging container, comprising the card holding portion in the semiconductor card packaging container according to any one of claims 1 to 7.