CN110566917A - Porous heat dissipation structure, radiator for LED lamp and processing method of porous heat dissipation structure - Google Patents

Abstract

The invention provides a porous heat dissipation structure, a radiator for an LED lamp and a processing method of the porous heat dissipation structure, and relates to the technical field of LED module heat dissipation. The porous heat dissipation structure is plate-shaped, the plate surface of the porous heat dissipation structure is provided with a connecting end used for being connected with heat dissipation equipment and a heat dissipation end opposite to the connecting end, the heat dissipation end of the plate surface is in a curve shape with high middle and low two sides, the cross section of the porous heat dissipation structure parallel to the connecting end is provided with a first heat dissipation area and a second heat dissipation area surrounding the first heat dissipation area, a plurality of first heat dissipation holes are distributed on the first heat dissipation area, a plurality of second heat dissipation holes are distributed on the second heat dissipation area, and the aperture of the first heat dissipation holes is smaller than that of the second heat dissipation holes. The radiator comprises the porous radiating structure, the characteristic of heat concentration of the LED lamp is met through the change of the overall height and the change of the size of the radiating holes, and the heat is radiated quickly and efficiently. The processing method of the porous heat dissipation structure is used for processing the porous heat dissipation structure.

Description

Porous heat dissipation structure, heat sink for LED lamps and processing of porous heat dissipation structure method

technical field

The invention relates to the technical field of heat dissipation of LED modules, in particular to a porous heat dissipation structure, a heat sink for LED lamps and a processing method for the porous heat dissipation structure.

Background technique

LED is a new type of semiconductor fixed light source, which has the advantages of strong safety and reliability, low power consumption, and high luminous efficiency. However, because LED is a point-shaped light source, the heat generated is concentrated in a very small area. If the heat cannot be dissipated in time, the It will cause the temperature of the PN junction to rise, accelerate the aging of the chip and packaging resin, and directly affect the service life and luminous efficiency of the LED. Therefore, how to well solve the problem of LED heat dissipation has always been an important problem to be solved urgently.

In order to solve the LED heat dissipation problem, although there are many technical solutions, their effects are not very obvious. In view of this, propose this application.

Contents of the invention

The purpose of the present invention is to provide a porous heat dissipation structure, which aims to enable the structure of the heat sink to dissipate heat more quickly and efficiently, thereby improving the service life of the electrical appliance.

Another object of the present invention is to provide a heat sink for LED lamps, which can dissipate heat more quickly and efficiently.

The third object of the present invention is to provide a method for processing a porous heat dissipation structure, the heat dissipation fins prepared by the method can meet the heat distribution characteristics, and improve the heat dissipation effect of the heat dissipation fins.

The present invention is achieved like this:

The invention provides a porous heat dissipation structure. The porous heat dissipation structure is plate-shaped. The plate surface of the porous heat dissipation structure has a connection end for connecting with heat dissipation equipment and a heat dissipation end opposite to the connection end. The heat dissipation end of the plate surface is high in the middle and low on both sides. Curved, the porous heat dissipation structure is parallel to the cross section of the connecting end. A first heat dissipation area and a second heat dissipation area surrounding the first heat dissipation area are provided. A plurality of first heat dissipation holes are distributed on the first heat dissipation area, and a plurality of first heat dissipation holes are distributed on the second heat dissipation area. A plurality of second heat dissipation holes are distributed on the top, the first heat dissipation holes and the second heat dissipation holes are through holes that penetrate from the heat dissipation end of the porous heat dissipation structure to the connection end of the porous heat dissipation structure, and the diameter of the first heat dissipation hole is smaller than that of the second heat dissipation hole. The aperture of the hole.

Further, in a preferred embodiment of the present invention, the maximum distance from the heat dissipation end to the connection end is 30-60mm, and the minimum distance from the heat dissipation end to the connection end is 5-10mm.

Further, in a preferred embodiment of the present invention, the shape of the heat dissipation end of the board surface is a Gaussian distribution curve.

Further, in a preferred embodiment of the present invention, a plurality of bump arrays arranged at intervals are distributed on the side wall of the porous heat dissipation structure, and each bump array includes a plurality of bump arrays arranged at intervals from top to bottom. starting portion, and each bump group extends from the middle of the porous heat dissipation structure to the connecting end.

Further, in a preferred embodiment of the present invention, the shape of the heat dissipation end in the thickness direction of the porous heat dissipation structure is also a Gaussian distribution curve, and the porous heat dissipation structure includes a first side and a second side opposite to each other and a third side and a third side opposite to each other. the fourth side;

On the first side, the second side, the third side and the fourth side, the bump arrays all extend from the heat dissipation end to the connection end.

Further, in a preferred embodiment of the present invention, the area of the first heat dissipation area is 1-2 times the area of the second heat dissipation area, the diameter of the first heat dissipation hole is 2-5 mm, and the diameter of the second heat dissipation hole is 5 mm. -10mm.

The present invention also provides a heat sink for an LED lamp, comprising the above-mentioned porous heat dissipation structure.

Further, in a preferred embodiment of the present invention, it also includes a mounting plate for installing the LED lamp and a heat dissipation plate for installing the porous heat dissipation structure, the heat dissipation plate is detachably connected to the installation plate, and each porous heat dissipation structure Corresponding to an LED lamp, thermal conductive silicon ester is coated between the mounting plate and the cooling plate.

Further, in a preferred embodiment of the present invention, the connection end of the porous heat dissipation structure is provided with at least two positioning pin holes, and the taper of each positioning pin hole is 1:40-60, the depth is 0.1-10mm, and the heat dissipation Mounting holes matched with the positioning pin holes are arranged on the board.

The present invention also provides a processing method for a porous heat dissipation structure, comprising the following steps:

Modeling is carried out according to the structure of the porous heat dissipation structure, and processed into shapes.

The beneficial effects of the present invention are: the present invention obtains the porous heat dissipation structure through the above-mentioned design, by setting the heat dissipation fins in a shape with a high middle and low sides, and setting the first heat dissipation holes on the first heat dissipation area in the middle as small In the form of holes, the second heat dissipation holes located on the peripheral second heat dissipation area are set in the form of large holes. Through the change of the overall height and the size of the cooling hole, it is more in line with the characteristics of heat concentration of electrical appliances such as LED lights, and can dissipate heat more quickly and efficiently.

The present invention also provides a heat sink for LED lamps, which includes the above-mentioned porous heat dissipation structure, which can better meet the heat distribution characteristics of LED lamps, can dissipate heat more quickly and efficiently, and improve the service life of LED lamps.

The invention also provides a processing method of the porous heat dissipation structure, which is simple and easy to implement, and the prepared porous heat dissipation structure has better heat dissipation effect, and is suitable for popularization and application.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

Fig. 1 is a front view of a porous heat dissipation structure provided by an embodiment of the present invention;

Fig. 2 is a left view of the porous heat dissipation structure provided by the embodiment of the present invention;

Fig. 3 is a bottom view of the porous heat dissipation structure provided by the embodiment of the present invention;

Fig. 4 is a top view of the porous heat dissipation structure provided by the embodiment of the present invention;

Fig. 5 is a front view of the radiator provided by the embodiment of the present invention;

Fig. 6 is a bottom view of the radiator provided by the embodiment of the present invention;

Fig. 7 is a top view of the heat sink provided by the embodiment of the present invention.

Icons: 10-radiator; 100-porous heat dissipation structure; 101-connection end; 102-radiation end; 111-first side; 112-second side; 113-third side; 114-fourth side; 120-th 1 heat dissipation area; 121-the first heat dissipation hole; 130-the second heat dissipation area; 131-the second heat dissipation hole; 140-bump arrangement; 141-protruding part; - Cooling plate; 400-LED lights.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

In describing the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

Please refer to FIGS. 1-4 , the embodiment of the present invention provides a porous heat dissipation structure 100, the porous heat dissipation structure 100 is plate-shaped, and the plate surface of the porous heat dissipation structure 100 has a connection end 101 for connecting with a heat dissipation device and a connection end 101 The opposite heat dissipation end 102, the heat dissipation end 102 of the board surface is in the shape of a curve with a high middle and low sides, and the porous heat dissipation structure 100 is provided with a first heat dissipation area 120 and a second heat dissipation area around the first heat dissipation area 120 in the section parallel to the connection end 101. In the region 130, a plurality of first heat dissipation holes 121 are distributed on the first heat dissipation region 120, and a plurality of second heat dissipation holes 131 are distributed on the second heat dissipation region 130, and the first heat dissipation holes 121 and the second heat dissipation holes 131 are both The through hole from the heat dissipation end 102 of the porous heat dissipation structure 100 to the connection end 101 of the porous heat dissipation structure 100 has a through hole, and the diameter of the first heat dissipation hole 121 is smaller than that of the second heat dissipation hole 131 .

It should be noted that the porous heat dissipation structure 100 is set in the shape of high middle and low sides, and the first heat dissipation holes 121 on the first heat dissipation area 120 in the middle are set in the form of small holes, and the second heat dissipation area located in the periphery The second cooling hole 131 on 130 is set in the form of a large hole. Through the change of the overall height and the size of the cooling hole, it is more in line with the characteristics of heat concentration of electrical appliances such as LED lights, and can dissipate heat more quickly and efficiently.

Specifically, "high in the middle and low on both sides" means that the distance between the heat dissipation end 102 and the connection end 101 of the porous heat dissipation structure 100 is in a state where the middle distance is large and the distance between two sides is small.

Further, the maximum distance from the heat dissipation end 102 to the connection end 101 is 30-60 mm, and the minimum distance from the heat dissipation end 102 to the connection end 101 is 5-10 mm. The maximum distance is the height in the middle, and the minimum distance is the height of the two sides. The inventor found that the height change control within this range can better meet the heat distribution characteristics of LED lights. Small holes are used to dissipate heat, and places with low heat flux use large holes with a lower height to dissipate heat.

In a preferred embodiment of the present invention, the shape of the heat dissipation end 102 of the board is a Gaussian distribution curve. LED is a point-shaped light source, and the heat generated is concentrated in a very small area. The heat generated by LED is concentrated in a small area and has the characteristics of Gaussian distribution. The inventors creatively set the shape of the porous heat dissipation structure 100 to satisfy a Gaussian distribution curve, and each side view can satisfy a rough Gaussian distribution curve, and the heat dissipation effect of this structure can be further improved.

Furthermore, the area of the first heat dissipation area 120 is 1-2 times the area of the second heat dissipation area 130 , the diameter of the first heat dissipation hole 121 is 2-5 mm, and the diameter of the second heat dissipation hole 131 is 5-10 mm. The size of the porous heat dissipation structure 100 is defined by taking the center of the board surface (corresponding to the center of the LED lamp) as the dot, the total area is the area occupied by the view in Figure 4, and the area of the first heat dissipation region 120 is the center of the board surface. The area of the circle. Generally speaking, the first heat dissipation area 120 occupies 1/2-2/3 of the total area, and the second heat dissipation area 130 occupies 1/3-1/2 of the total area. The thickness of the board surface (that is, the thickness of the porous structure) is 0.5-2mm, and the maximum diameter of the board surface is 50-100mm.

Specifically, the porous heat dissipation structure 100 may be made of copper alloy, aluminum alloy or iron-based alloy, and the use of the above materials is conducive to rapid heat dissipation.

In a preferred embodiment of the present invention, a plurality of bump rows 140 arranged at intervals are distributed on the side wall of the porous heat dissipation structure 100, and each bump row 140 includes a plurality of bumps arranged at intervals from top to bottom. The rising portion 141 , and each bump row group 140 extends from the middle of the porous heat dissipation structure 100 to the connecting end 101 . The disposition of the bump array 140 can increase the heat dissipation surface, and since the bump array 140 extends from the middle to the bottom, the exposed through hole will be formed on the top, which is beneficial to further enhance the heat dissipation.

Specifically, the size of the protruding portion 141 is not limited, and may be set in a block shape with a length of about 1 mm, a width of about 0.5 mm, and a protrusion of about 0.5 mm.

In a preferred embodiment of the present invention, the shape of the heat dissipation end 102 in the thickness direction of the porous heat dissipation structure 100 is also a Gaussian distribution curve. Three sides 113 and a fourth side 114 ; in the first side 111 , the second side 112 , the third side 113 and the fourth side 114 , the bump array 140 extends from the heat dissipation end 102 to the connection end 101 .

It should be noted that, in order to further increase the heat dissipation effect, the shape in the thickness direction of the porous heat dissipation structure 100 is also made to exhibit a Gaussian distribution curve, and the entire heat dissipation end 102 presents an exposed through-hole structure.

Specifically, as shown in FIG. 3 and FIG. 4 , the top view of the porous heat dissipation structure 100 is a hexagonal structure, and this structure can make the side view of the porous heat dissipation structure 100 satisfy the shape of the Gaussian distribution curve.

Please refer to Figures 5-7, the embodiment of the present invention also provides a heat sink 10 for LED lamps, including the above-mentioned porous heat dissipation structure 100, the installation position of each porous heat dissipation structure 100 corresponds to one LED lamp 400, the specific installation relationship and The working principle is the same as that of the existing LED lamp heat sink, and will not be described in detail.

Further, the radiator 10 also includes a mounting plate 200 for mounting the LED lamp 400 and a heat dissipation plate 300 for mounting the porous heat dissipation structure 100. The heat dissipation plate 300 is detachably connected to the mounting plate 200, and each porous heat dissipation structure 100 is Corresponding to one LED lamp 400 , thermal conductive silicon ester is coated between the mounting plate 200 and the heat dissipation plate 300 to further enhance the heat dissipation effect.

Further, please refer to FIG. 3 , the connecting end 101 of the porous heat dissipation structure 100 is provided with at least two positioning pin holes 150 , and each positioning pin hole 150 has a taper of 1:40-60 and a depth of 0.1-10mm. The porous heat dissipation structure 100 is installed on the heat dissipation plate 300 through the positioning pin holes 150 , and the heat dissipation plate 300 is provided with mounting holes (not shown) matching with the positioning pin holes 150 .

Specifically, the material of the heat dissipation plate 300 is not limited, and in some embodiments it can be made of oxygen-free copper material to further enhance the heat dissipation effect.

The present invention also provides a processing method for a porous heat dissipation structure, comprising the following steps:

Modeling is carried out according to the structure of the porous heat dissipation structure, and processed into shapes. Preferably, the process of processing and forming adopts 3D printing technology, which saves complex processes such as casting, stamping and overmolding. The procedure is simple, the forming speed is fast, and the purpose of saving materials is achieved at the same time.

Preferably, the 3D printing technology includes at least one of direct metal deposition, direct metal laser sintering, laser near net shaping, laser metal shaping, selective laser melting, selective laser sintering, and electron beam melting. All of the above are existing 3D printing processes, and you can choose a suitable process for molding according to your needs. Specifically, the process of 3D printing is to import the designed 3D model into mechanical manufacturing software such as Magics or Robot Studio that contains 3D printing modules, perform hierarchical processing on the imported 3D model, program and output the final program code, Manufactured using professional 3D printing equipment.

Preferably, the process of modeling according to the structure of the porous heat dissipation structure includes: using mechanical modeling software to carry out three-dimensional design and modeling of the heat sink entity; importing the built three-dimensional solid model into the simulation software for heat dissipation and heat flux distribution and adjust the 3D model according to the simulation situation. Specifically, mechanical modeling software such as CATIA, UG, Pro/e or Solidworks, and simulation software such as ANSYS, ABAQUS or COMSOL.

It should be pointed out that before modeling, the specific structure type, size of each part and the proportion of each part of the heat sink are counted and calculated according to the actual heat dissipation of the workpiece and the size of the parts.

To sum up, the embodiment of the present invention provides a porous heat dissipation structure, which sets the porous heat dissipation structure of the heat sink into a shape with a high middle and low sides, and sets the first heat dissipation hole on the first heat dissipation area in the middle. The second heat dissipation hole is arranged in the form of a small hole, and the second heat dissipation hole located on the peripheral second heat dissipation area is arranged in the form of a large hole. Through the change of the overall height and the size of the cooling hole, it is more in line with the characteristics of heat concentration of electrical appliances such as LED lights, and can dissipate heat more quickly and efficiently.

The embodiment of the present invention provides a heat sink for LED lamps, which includes the above-mentioned porous heat dissipation structure, which can better meet the heat distribution characteristics of LED lamps, can dissipate heat more quickly and efficiently, and improve the service life of LED lamps.

The embodiment of the present invention provides a processing method of a porous heat dissipation structure, which is simple and easy to implement, and the prepared porous heat dissipation structure has a better heat dissipation effect, and is suitable for popularization and application.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A porous heat dissipation structure, characterized in that, the porous heat dissipation structure is plate-shaped, and the plate surface of the porous heat dissipation structure has a connection end for connecting with a heat dissipation device and a heat dissipation end opposite to the connection end, so The heat dissipation end of the board surface is in the shape of a curve with a high middle and low sides, and the cross section of the porous heat dissipation structure parallel to the connection end is provided with a first heat dissipation area and a second heat dissipation area surrounding the first heat dissipation area. A plurality of first heat dissipation holes are distributed on the first heat dissipation area, and a plurality of second heat dissipation holes are distributed on the second heat dissipation area, and both the first heat dissipation holes and the second heat dissipation holes are formed from the porous The heat dissipation end of the heat dissipation structure passes through the through hole of the connection end of the porous heat dissipation structure, and the diameter of the first heat dissipation hole is smaller than the diameter of the second heat dissipation hole. 2 . The porous heat dissipation structure according to claim 1 , wherein the maximum distance from the heat dissipation end to the connection end is 30-60 mm, and the minimum distance from the heat dissipation end to the connection end is 5-10 mm. 3. The porous heat dissipation structure according to claim 2, wherein the shape of the heat dissipation end of the plate surface is a Gaussian distribution curve. 4. The porous heat dissipation structure according to claim 1 or 3, wherein a plurality of bump arrays arranged at intervals are distributed on the sidewall of the porous heat dissipation structure, and each of the bump arrays includes A plurality of protrusions are arranged at intervals from top to bottom, and each of the bump arrays extends from the middle of the porous heat dissipation structure to the connection end. 5. The porous heat dissipation structure according to claim 4, wherein the shape of the heat dissipation end in the thickness direction of the porous heat dissipation structure is also a Gaussian distribution curve, and the porous heat dissipation structure includes a first side and a second side oppositely arranged and a third side and a fourth side oppositely disposed; On the first side, the second side, the third side and the fourth side, the bump arrays all extend from the heat dissipation end to the connection end. 6. The porous heat dissipation structure according to claim 1 or 3, wherein the area of the first heat dissipation region is 1-2 times the area of the second heat dissipation region, and the diameter of the first heat dissipation hole is 2-5mm, the diameter of the second cooling hole is 5-10mm. 7. A heat sink for an LED lamp, characterized in that it comprises the porous heat dissipation structure according to any one of claims 1-6. 8. The radiator for LED lamps according to claim 7, further comprising a mounting plate for mounting the LED lamp and a heat dissipation plate for mounting the porous heat dissipation structure, the heat dissipation plate is detachable Connected to the mounting plate, each of the porous heat dissipation structures corresponds to an LED lamp, and thermal conductive silicon ester is coated between the mounting plate and the heat dissipation plate. 9. The heat sink for LED lamps according to claim 8, wherein at least two positioning pin holes are provided at the connecting end of the porous heat dissipation structure, and the taper of each positioning pin hole is 1 : 40-60, the depth is 0.1-10mm, and the heat dissipation plate is provided with a mounting hole matched with the positioning pin hole. 10. The processing method of the porous heat dissipation structure according to any one of claims 1-6, characterized in that, comprising the steps of: Modeling is carried out according to the structure of the porous heat dissipation structure, and processed into shape; Preferably, the process of processing and shaping adopts 3D printing technology; Preferably, the 3D printing technology includes at least one of direct metal deposition, direct metal laser sintering, laser near-net shaping, laser metal forming, selective laser melting, selective laser sintering, and electron beam melting; Preferably, the process of modeling according to the structure of the porous heat dissipation structure includes: using mechanical modeling software to carry out three-dimensional design and modeling of the heat sink entity; importing the built three-dimensional solid model into the simulation software for heat dissipation and heat flow Simulation of density distribution, and adjust the 3D model according to the simulation situation.