CN110539208A - Ceramic cover plate processing method and ceramic cover plate - Google Patents
Ceramic cover plate processing method and ceramic cover plate Download PDFInfo
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- CN110539208A CN110539208A CN201810768962.XA CN201810768962A CN110539208A CN 110539208 A CN110539208 A CN 110539208A CN 201810768962 A CN201810768962 A CN 201810768962A CN 110539208 A CN110539208 A CN 110539208A
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- cover plate
- ceramic cover
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a ceramic cover plate processing method and a ceramic cover plate obtained by the method. The method comprises the following steps: preparing a fired blank with a preset external dimension as a product to be processed; processing the front side of the product to be processed to finish thinning and flattening; processing the back surface of the product to be processed to form an inner concave surface; roughly polishing the front surface of the product to be processed; grinding the concave surface; processing the front surface of the product to be processed to form an outer arc surface; roughly polishing the front surface of the product to be processed; grinding the concave surface; and performing back polishing on the front surface of the product to be processed. Because the front surface and the back surface of the ceramic cover plate are alternately and alternately processed, especially the front surface rough polishing and the inner concave surface grinding are respectively decomposed into twice and alternately processed, the positive and negative reaction forces in the processing process can be mutually offset, the ceramic cover plate is prevented from deforming in the processing process, and the effects of high flatness and high brightness of the ceramic cover plate are realized.
Description
Technical Field
The invention relates to the technical field of machining, in particular to a ceramic cover plate machining method and a ceramic cover plate obtained by the machining method.
Background
because the ceramic has good physical properties such as high hardness, scratch resistance, difficult breakage, good texture after polishing and the like, the ceramic is widely applied to manufacturing of mobile phone cover plates.
in the manufacturing process of the ceramic cover plate of the mobile phone, in order to obtain a high-brightness and high-brightness surface, the ceramic cover plate needs to be subjected to chemical mechanical polishing so as to reduce or eliminate scratches of the ceramic cover plate during the processes of cutting, grinding and the like.
In the prior art, the ceramic cover plate can deform after being ground and polished, so that warping (namely unevenness) occurs, and adverse effects are brought to the complete machine assembly of the mobile phone.
In order to correct the deformation, the traditional method adopts medium and high temperature annealing for smoothing, the medium and high temperature annealing has higher requirements on the cleanliness of the surrounding environment, if impurities or dust points exist in the surrounding environment, the surface of the ceramic cover plate has defects such as white spots, pinholes and the like, and the defect ratio is up to more than 30%.
Therefore, how to avoid the deformation of the ceramic cover plate during the processing is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a method for processing a ceramic cover plate and a ceramic cover plate obtained by the method, and the method can avoid deformation of the ceramic cover plate during processing, so as to achieve high flatness and high brightness of the ceramic cover plate.
In order to achieve the purpose, the invention provides the following technical scheme:
A processing method of a ceramic cover plate comprises the following steps:
Step 1: preparing a fired blank with a preset external dimension as a product to be processed for manufacturing the ceramic cover plate;
Step 2: processing the front side of the product to be processed to finish thinning and flattening;
and step 3: processing the back surface of the product to be processed to form an inner concave surface;
And 4, step 4: roughly polishing the front surface;
And 5: grinding the concave surface;
Step 6: processing the front surface and forming an outer arc surface;
And 7: roughly polishing the front surface;
And 8: grinding the concave surface;
and step 9: and performing back polishing on the front surface.
Preferably, in step 1 of the above ceramic cover plate processing method: and processing the sintered blank by a grinding machine, and finishing regular shaping to obtain the sintered blank with a preset external dimension.
preferably, in step 2 of the above ceramic cover plate processing method, the front surface is processed by a grinding machine.
Preferably, in step 3 of the ceramic cover plate processing method, the concave surface is formed on the reverse surface by CNC processing;
and/or, in the step 6 of the ceramic cover plate processing method, the outer arc surface is formed on the front surface in a CNC (computer numerical control) processing mode.
Preferably, in step 4 of the above ceramic cover plate processing method, when the front surface is roughly polished, the front surface is in contact with a copper disc, pressure is applied at four ends, the pressure is 15kg to 55kg, the rotating speed of a four-end rotating disc is 10r/min to 55r/min, the rotating speed of a lower disc is 20r/min to 55r/min, the processing time is 30min to 55min, and diamond micropowder liquid is sprayed at the same time to finish the rough polishing.
Preferably, in step 5 and step 8 of the above ceramic cover plate processing method, the concave surface is ground by a grinder, a grinding head of the grinder rotates by 360 degrees, the main shaft rotates at a speed of 40r/min to 180r/min, the processing time is 5min to 20min, the workbench moves with the product to be processed, and simultaneously, diamond micropowder liquid is injected to finish the grinding.
Preferably, in step 7 of the above ceramic cover plate processing method, the front surface is roughly polished by a mill, and a disk brush on the mill rotates forwards or backwards for 360 degrees to complete the rough polishing;
in the step 9 of the ceramic cover plate processing method, the front surface is reversely polished by the grinding machine, the disk brush on the grinding machine rotates forwards or backwards at 360 degrees, the rotating speed is 40r/min to 180r/min, the pressure is 0.1MPa to 0.4MPa, and the processing time is 20min to 60 min.
Preferably, in the above method for processing a ceramic cover plate, the ceramic cover plate is a rear cover of a mobile phone;
the back surface is a side surface positioned in the mobile phone rear cover, and when the mobile phone is used, internal parts of the mobile phone are arranged in the concave surface;
the front surface is the side surface of the mobile phone rear cover which is positioned outside the mobile phone.
Preferably, in the above method for processing a ceramic cover plate, after step 8 and before step 9, the method further includes: and punching holes on the product to be processed.
a ceramic cover plate is obtained by the ceramic cover plate processing method.
According to the technical scheme, when the ceramic cover plate is processed, the front side and the back side of the ceramic cover plate are alternately and alternately carried out, and particularly, the front side rough polishing and the inner concave surface grinding are respectively divided into two times and alternately carried out, so that the positive and negative reaction forces of the ceramic cover plate in the processing process can be mutually offset. Therefore, the ceramic cover plate obtained by the processing method can not deform, does not need to smooth deformation by medium and high temperature after-fire, and can not cause poor product surface due to substandard peripheral environment during medium and high temperature after-fire, thereby achieving the effects of high flatness and high brightness of the ceramic cover plate.
in addition, the invention also provides a ceramic cover plate, which is manufactured by the ceramic cover plate processing method, so that the effects of high flatness and high brightness can be achieved.
Drawings
in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a method for processing a ceramic cover plate according to an embodiment of the present invention;
FIG. 2 is a front view of a ceramic cover plate provided in accordance with an embodiment of the present invention;
FIG. 3 is a side view of a ceramic cover plate provided by an embodiment of the present invention;
Fig. 4 is a top view of a ceramic cover plate according to an embodiment of the present invention.
Detailed Description
the invention discloses a processing method of a ceramic cover plate and the ceramic cover plate obtained by the processing method.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, fig. 1 is a flowchart illustrating a method for processing a ceramic cover plate according to an embodiment of the present invention, fig. 2 is a front view of the ceramic cover plate according to the embodiment of the present invention, fig. 3 is a side view of the ceramic cover plate according to the embodiment of the present invention, and fig. 4 is a top view of the ceramic cover plate according to the embodiment of the present invention.
the ceramic cover plate processing method provided by the embodiment of the invention comprises the following steps:
Step 1: preparing a fired blank with a preset external dimension as a product to be processed for manufacturing the ceramic cover plate;
Step 2: processing the front surface 2 of the product to be processed to finish thinning and flattening;
And step 3: processing the back surface 1 of the product to be processed to form an inner concave surface;
And 4, step 4: roughly polishing the front surface 2 of the product to be processed;
And 5: grinding the concave surface;
Step 6: processing the front surface 2 of the product to be processed to form an outer arc surface;
And 7: roughly polishing the front surface 2 of the product to be processed;
and 8: grinding the concave surface;
and step 9: the front side 2 of the product to be processed is re-polished.
Specifically, the method for processing the ceramic cover plate provided by the embodiment of the invention can be used for processing and manufacturing the mobile phone rear cover made of the ceramic material (namely, the ceramic cover plate is the mobile phone rear cover). The reverse side 1 of the ceramic cover plate is the side surface of the rear cover of the mobile phone inside the mobile phone, and when the mobile phone is used, the internal parts of the mobile phone are arranged in the concave surface of the reverse side 1; the "front surface 2 of the ceramic cover plate" is the side surface of the mobile phone rear cover which is located outside the mobile phone.
However, the method for processing the ceramic cover plate provided by the embodiment of the present invention is not limited to this, and the method can be applied to the processing and manufacturing of the mobile phone rear cover, and can also be applied to the processing and manufacturing of other products in the shape of ceramic materials and cover plates.
further, the ceramic cover plate processing method also comprises a punching processing step of punching holes on the product to be processed. This punching process step is performed after step 8 and before step 9. In a specific embodiment, the step 1 specifically includes: the method comprises the steps of stacking and pressing sintered blanks with proper sizes, fixing the blanks on a support on a double-end-face grinding machine, respectively and rapidly grinding long and short edges of the blanks through grinding wheels on two sides to the required external dimension, straightness and verticality, and finishing square shaping on four sides to obtain a product to be processed with a preset external dimension (namely, the external dimension and the dimension which are designed in advance).
In a specific embodiment, the step 2 specifically includes: and (3) putting a product to be processed into a grinding machine jig, enabling the front side 2 to face upwards, sucking air and limiting and fixing, grinding by using a grinding machine 400# grinding wheel, wherein the processing removal amount is 0.05-0.15 mm, and processing to the required thickness size and surface roughness to finish the grinding machine thinning and flattening front side 2.
In a specific embodiment, the step 3 specifically includes: putting a product to be processed into a jig of a CNC (computer numerical control machine) workbench, enabling a front surface 2 to face downwards, sucking air for fixing, grinding a back surface 1 of the product to be processed by adopting 180#, 300#, 400# grinding wheel rods through a programmed program, processing to a required size and surface roughness, and finishing the forming processing of an inner concave surface, wherein the processing removal amount is 0.15-0.50 mm.
in a specific embodiment, the step 4 specifically includes: and placing the product to be processed into a jig for limiting and fixing, enabling the front face 2 of the product to be processed to be in contact with a copper disc, applying pressure at four ends, wherein the pressure is 15-55 kg, the rotating speed of a four-end rotating disc is 10-55 r/min, the rotating speed of a lower disc is 20-55 r/min, the processing time is 30-55 min, and simultaneously spraying diamond micropowder liquid to finish rough polishing on the front face 2 of the product to be processed.
in a specific embodiment, the step 5 specifically includes: the product to be processed is placed in the forming base to be limited and fixed, the grinding head of the grinding machine rotates by 360 degrees, the rotating speed of the main shaft is 40-180 r/min, the processing time is 5-20 min, the workbench drives the product to move, and meanwhile, diamond micropowder liquid is injected, so that the inner concave surface of the product to be processed is ground. (step 8 same as step 5)
In a specific embodiment, the step 6 specifically includes: and (3) putting the product to be processed into a jig of a CNC workbench, enabling the front surface 2 to face upwards, sucking air and fixing, grinding the front surface 2 of the product to be processed by adopting a grinding wheel rod through a programmed program, and finishing the forming processing of the outer arc surface, wherein the processing removal amount is 0.15-0.50 mm.
In a specific embodiment, the step 7 specifically includes: and putting the product to be processed into the jig, rotating the disc brush on the mill forwards or backwards by 360 degrees, and roughly polishing the front surface 2 of the product to be processed.
In a specific embodiment, the punching process specifically includes: putting the product to be processed into a jig of a CNC workbench, enabling the front surface 2 to face upwards, sucking air and fixing, adopting 180#, 300#, 400# grinding wheel rods through a programmed program, machining the grinding wheel rods to remove 0.15-0.50 mm, and completing punching through CNC.
In a specific embodiment, the step 9 specifically includes: and putting the product to be processed into a jig, rotating the disc brush on the mill forwards or backwards at 360 degrees at a rotating speed of 40-180 r/min, under a pressure of 0.1-0.4 MPa for 20-60 min, and finishing back polishing on the front surface 2 of the product to be processed.
further, in the method for processing a ceramic cover plate according to the embodiment of the present invention, after step 9, step 10 is further included: and carrying out ultrasonic cleaning on a product to be processed.
in summary, as shown in fig. 1, the method for processing a ceramic cover plate according to an embodiment of the present invention mainly includes: burn back embryo material rule side plastic, openly 2 attenuate, the interior concave surface of CNC processing, copper plate are thrown openly 2, are ground interior concave surface for the first time, the outer cambered surface of CNC processing, mill are thrown openly 2, are ground interior concave surface for the second time, CNC processing hole site, return and throw openly 2, and it is openly 2, the reverse side 1 (interior concave surface place side) sequence of processing to ceramic cover plate basically does:
positive-negative-positive-negative-positive.
according to the technical scheme, when the ceramic cover plate is processed, the front surface 2 and the back surface 1 of the ceramic cover plate are alternately and alternately processed, and particularly, the front surface rough polishing and the inner concave surface grinding are respectively divided into twice and alternately performed, so that the positive and negative reaction forces of the ceramic cover plate in the processing process can be mutually offset. Therefore, the ceramic cover plate obtained by the processing method can not deform, does not need to smooth deformation by medium and high temperature after-fire, and can not cause poor product surface due to substandard peripheral environment during medium and high temperature after-fire, thereby achieving the effects of high flatness and high brightness of the ceramic cover plate.
in addition, the embodiment of the invention also provides a ceramic cover plate, which is obtained by the ceramic cover plate processing method. It will thus be appreciated that the scope of the present invention includes not only the ceramic cover plate processing method described above, but also the ceramic cover plate obtained by this processing method.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. the processing method of the ceramic cover plate is characterized by comprising the following steps:
Step 1: preparing a fired blank with a preset external dimension as a product to be processed for manufacturing the ceramic cover plate;
Step 2: processing the front surface (2) of the product to be processed to finish thinning and flattening;
and step 3: processing the back surface (1) of the product to be processed to form an inner concave surface;
and 4, step 4: the front surface (2) is roughly polished;
And 5: grinding the concave surface;
Step 6: machining the front surface (2) and forming an outer arc surface;
and 7: the front surface (2) is roughly polished;
and 8: grinding the concave surface;
And step 9: and performing back polishing on the front surface (2).
2. The method for processing a ceramic cover plate according to claim 1, wherein in step 1: and processing the sintered blank by a grinding machine, and finishing regular shaping to obtain the sintered blank with a preset external dimension.
3. Method for machining a ceramic cover plate according to claim 1, characterized in that in step 2, the front face (2) is machined by means of a grinding machine.
4. the ceramic cover plate processing method according to claim 1, wherein in step 3, the concave surface is formed on the reverse surface (1) by CNC processing;
and/or in step 6, forming the outer arc surface on the front surface (2) in a CNC machining mode.
5. The method for processing the ceramic cover plate according to the claim 1, wherein in the step 4, when the front surface (2) is roughly polished, the front surface (2) is contacted with a copper disc, four heads are applied with pressure, the pressure is 15kg to 55kg, the four-head rotating disc rotates at a speed of 10r/min to 55r/min, the lower disc rotates at a speed of 20r/min to 55r/min, the processing time is 30min to 55min, and diamond micropowder liquid is sprayed at the same time to finish the rough polishing.
6. The method for processing the ceramic cover plate according to claim 1, wherein in the step 5 and the step 8, the concave surface is ground by a grinding machine, a grinding head of the grinding machine rotates by 360 degrees, the main shaft rotates by 40r/min to 180r/min, the processing time is 5min to 20min, the workbench moves with the product to be processed, and simultaneously, diamond micropowder liquid is injected to finish the grinding.
7. The ceramic cover plate processing method according to claim 1, characterized in that in step 7, the front surface (2) is roughly polished by a grinding machine, and a disc brush on the grinding machine rotates forwards or backwards for 360 degrees to finish the rough polishing;
and 9, performing back polishing on the front surface (2) by the grinding machine, wherein the disc brush on the grinding machine rotates forwards or backwards at 360 degrees at a rotating speed of 40-180 r/min and a pressure of 0.1-0.4 MPa, and the processing time is 20-60 min.
8. the method for processing the ceramic cover plate according to any one of claims 1 to 7, wherein the ceramic cover plate is a mobile phone rear cover;
the back surface (1) is a side surface positioned in the mobile phone rear cover, and when the mobile phone rear cover is used, internal parts of the mobile phone are arranged in the concave surface;
the front surface (2) is the side surface of the mobile phone rear cover which is positioned outside the mobile phone.
9. the method for processing a ceramic cover plate according to claim 8, wherein after step 8 and before step 9, the method further comprises: and punching holes on the product to be processed.
10. A ceramic cover plate obtained by the ceramic cover plate processing method according to any one of claims 1 to 9.
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Cited By (1)
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CN114211316A (en) * | 2021-12-23 | 2022-03-22 | 宁波江丰复合材料科技有限公司 | Ceramic and machining method and application thereof |
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