CN110515431A - A kind of 1U universal type modular high density storage JBOD equipment - Google Patents
A kind of 1U universal type modular high density storage JBOD equipment Download PDFInfo
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- CN110515431A CN110515431A CN201910760796.3A CN201910760796A CN110515431A CN 110515431 A CN110515431 A CN 110515431A CN 201910760796 A CN201910760796 A CN 201910760796A CN 110515431 A CN110515431 A CN 110515431A
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- 238000009434 installation Methods 0.000 claims abstract description 89
- 230000003993 interaction Effects 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000012546 transfer Methods 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 238000003491 array Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000013500 data storage Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
- G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of 1U universal type modular high density storage JBOD equipment, including installation shell, is slideably inserted in the installation shell side installation space and the memory gate stack of process instruction, is inserted in for storing data and slideably in the installation shell other side installation space and for making the memory gate stack and external device realize the business interface component of data interaction, being removably installed in the mounting shell body and for providing the power supply module of power supply to the memory gate stack and the business interface component.The present invention realizes the data interaction of external device and memory gate stack by the effect of business interface component, so realize data storage and read-write with can be convenient, memory gate stack, business interface component and power supply module can easily carry out disassembling operations in mounting shell body, facilitate the maintenance and replacement of component, it realizes component modularized design and cross-species transferability, improves equipment storage performance and scalability.
Description
Technical field
The present invention relates to storage equipment technical field, in particular to a kind of 1U universal type modular high density storage JBOD is set
It is standby.
Background technique
With the development of China Electronics's technology, more and more electronic equipments have been used widely.
Server is the important component in electronic equipment, is to provide the equipment of the service of calculating.Since server needs
Service request is responded, and is handled, therefore in general server should have the service of undertaking and ensure the ability of service.Root
The service type provided according to server is different, is divided into file server, database server, apps server, WEB service
Device etc..The main composition of server includes that processor, hard disk, memory, system bus etc. are similar with general computer architecture,
But due to needing to provide highly reliable service, processing capacity, stability, reliability, safety, scalability, can
It is managerial etc. more demanding.
In big data era, a large amount of information technoloy equipment can be put together at data center.These data centers include all types of
Server, storage, interchanger and a large amount of cabinet and other infrastructure.Every kind of information technoloy equipment is all to have various hardware board groups
At, such as computing module, memory module, cabinet, blower module.And with the development of information-intensive society, geometry is presented in information content
Multiple increases, and the data volume of server and storage device processes is increasing in data center, and these information datas are inevitable
It is handled and is saved by calculating and storing equipment accordingly, while plant maintenance and dimension to these calculating and storing data
It is higher and higher to protect efficiency requirements, generally realizes height using JBOD (Just a Bunch Of Disks, hard disk cluster) equipment at present
Density data storage.
Muti-piece hard disk combination is usually then mounted to clothes at a logic magnetic disc by JBOD equipment in the prior art
It is engaged on device, while the remaining part connecting with each piece of hard disk signal being respectively installed on server, realize whole with server
Close installation.However, the installation space on server is narrow, especially 1U standard type server etc., because of first device of server itself
Part is very troublesome during installation with regard to various, and repairs, replacement inconvenience.Meanwhile some parts damages in JBOD equipment it
Afterwards, it is difficult to be individually replaced and be repaired, cause device extension performance not strong, be unable to satisfy the customized demand of different performance.
Therefore, the dismounting mobility for how improving JBOD equipment facilitates the maintenance and replacement of component, realizes component modularization
Design and cross-species transferability improve equipment storage performance and scalability, are the technical issues of those skilled in the art are faced.
Summary of the invention
The object of the present invention is to provide a kind of 1U universal type modular high density storage JBOD equipment, can be improved JBOD and set
Standby dismounting mobility facilitates the maintenance and replacement of component, realizes component modularized design and cross-species transferability, improves equipment and deposits
Store up performance and scalability.
In order to solve the above technical problems, the present invention provides a kind of 1U universal type modular high density storage JBOD equipment, packet
Installation shell is included, is slideably inserted in the installation shell side installation space and for storing data and process instruction
Memory gate stack is slideably inserted in the installation space of the installation shell other side and for making the storage control group
Part and external device are realized the business interface component of data interaction, are removably installed in the mounting shell body and for institute
It states memory gate stack and the business interface component provides the power supply module of power supply.
Preferably, the installation shell includes bottom plate, the top plate being removably fastened on the backplate surface, along described
The length direction of bottom plate is distributed on its surface so that the inner space of the installation shell is divided into the first installation space and the
The demarcation plate of two installation spaces, and first installation space, for installing the memory gate stack, second installation is empty
Between for installing the business interface component and the power supply module.
Preferably, the fastener for being detachably connected with cabinet inner wall is provided on the two sides of the bottom plate；Institute
State the bunch chain belt for being additionally provided on the surface of bottom plate and preventing winding for collecting cable.
Preferably, the memory gate stack include slideably be inserted in it is described installation shell in sliding floor, can
It is releasably set to several hard disk arrays for storing data at one end position of sliding floor surface, is set to institute
State at another end position in sliding floor surface several be used for process instruction controller group, and the controller group with it is described
The connection of hard disk array signal.
Preferably, the memory gate stack further includes being set on the sliding floor surface and being located at the hard disk battle array
It connect between column and the controller group, with the power supply module and the business interface component signals, turn for realizing signal
The Signals Transfer Board connect.
Preferably, it is provided with for being connect with the business interface component signals, is used for it on the Signals Transfer Board
Output signal is sent to the first transmission connector of the controller group, and connect with the hard disk array signal, for inciting somebody to action
By the second transmission connector of the controller group treated output data the is transferred to hard disk array.
Preferably, the memory gate stack further includes being removable installed on the sliding floor surface and being located at institute
State the radiator mould group between hard disk array and the Signals Transfer Board, for carrying out cooling down to the hard disk array.
Preferably, the memory gate stack further includes being removable installed on the front end face of the sliding floor, using
In the ventilation front panel for protecting and crossing impurity in air filtering.
Preferably, the business interface component includes the slide tray being slideably inserted in the installation shell, sets
Be placed on the slide tray surface and for provides with the Service Interface Card of external device physical connection interface, be set to described in
The output end of the interface adapter board and the interface adapter board that are connect on slide tray surface and with the business interface card signal
The business interconnecting module that signal connects and is used to be sent to the data-signal of external device in the memory gate stack.
Preferably, the handrail convenient for push-and-pull operation is provided on the front end face of the slide tray, the slide tray
It is additionally provided on surface cold for radiate to the Service Interface Card, the interface adapter board and the business interconnecting module
But radiator fan.
1U universal type modular high density storage JBOD equipment provided by the present invention, main includes installation shell, storage
Control assembly, business interface component and power supply module.Wherein, installation shell is mainly used for installing and supporting remaining components.It deposits
Storage control assembly is arranged in the side installation space of installation shell, is mainly used for storing data and process instruction, and store
Control assembly can be slidably installed in mounting shell body, to carry out plugging installation from the opening of installation shell, facilitate installation
With disassembling section.Business interface component is arranged in the other side installation space of installation shell, is mainly used for making to store control group
Part and external device realize data interaction, and business interface component is as memory gate stack, can also be in mounting shell body
It is slidably installed, to carry out plugging installation from the opening of installation shell, installation and removal is facilitated to operate.Power supply module installation
In mounting shell body, it is mainly used for being powered memory gate stack and business interface component, and can be in mounting shell body
Easily carry out disassembling operations.In this way, 1U universal type modular high density storage JBOD equipment provided by the present invention, passes through industry
The data interaction of external device and memory gate stack is realized in the effect of business interface module, realizes that data are deposited with so can be convenient
Storage and read-write, meanwhile, memory gate stack, business interface component and power supply module can easily carry out in mounting shell body
Disassembling operations so as to easily carry out the independent maintenance and replacement of each module, while easily carrying out module extension；And
And the disassembling operations between each module are independent of each other, and can independently carry out, therefore can be easily implemented component modelsization design
And cross-species transferability.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of overall structure diagram of specific embodiment provided by the present invention.
Fig. 2 is the concrete structure schematic diagram of installation shell and power supply module shown in Fig. 1.
Fig. 3 is the concrete structure schematic diagram of memory gate stack shown in Fig. 1.
Fig. 4 is the decomposition texture schematic diagram of Fig. 3.
Fig. 5 is the concrete structure schematic diagram of business interface component shown in Fig. 1.
Wherein, in Fig. 1-Fig. 5:
Shell -1, memory gate stack -2, business interface component -3, power supply module -4 are installed；
First installation space -1a, the second installation space -1b；
Bottom plate -101, top plate -102, demarcation plate -103, fastener -104, bunch chain belt -105；
Sliding floor -201, hard disk array -202, controller group -203, Signals Transfer Board -204, radiator mould
Group -205, front panel -206, the first transmission connector -2041, the second transmission connector -2042 of divulging information；
Slide tray -301, Service Interface Card -302, interface adapter board -303, business interconnecting module -304 are helped
Hand -305, radiator fan -306；
Power module -401, Power conversion board -402.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to FIG. 1, Fig. 1 is a kind of overall structure diagram of specific embodiment provided by the present invention.In this hair
In a kind of specific embodiment provided by bright, 1U universal type modular high density storage JBOD equipment mainly includes installation shell
1, memory gate stack 2, business interface component 3 and power supply module 4.
Wherein, installation shell 1 is mainly used for installing and supporting remaining components.In general, the installation shell 1 can be in rectangle
Shape, simultaneously because the present embodiment is primarily adapted for use in 1U server cabinet, therefore, which specifically can be in strip rectangle shape,
And its three-dimensional dimension can be 442mmx43.2mmx800mm.
Memory gate stack 2 is arranged in the side installation space of installation shell 1, is mainly used for storing data and processing refers to
It enables, and memory gate stack 2 can be slidably installed in installation shell 1, to be plugged from the opening of installation shell 1
Installation, facilitates installation and removal to operate.
Business interface component 3 is arranged in the other side installation space of installation shell 1, is mainly used for making memory gate stack
2 realize data interaction with external device, and business interface component 3 can also install shell 1 as memory gate stack 2
It is inside slidably installed, to carry out plugging installation from the opening of installation shell 1, installation and removal is facilitated to operate.
Power supply module 4 is mounted in installation shell 1, is mainly used for carrying out memory gate stack 2 and business interface component 3
Power supply, and disassembling operations can be easily carried out in installation shell 1.Specifically, the power supply module 4 can be with business interface component
3 are mounted on the same side position of installation shell 1, and the two can be located separately the both ends position on the length direction of installation shell 1
It sets, for example, business interface component 3 may be disposed at the front position of installation shell 1, and power supply module 4 may be disposed at installation shell 1
Back-end location.
In this way, 1U universal type modular high density storage JBOD equipment provided by the present embodiment, passes through business interface group
The data interaction of external device and memory gate stack 2 is realized in the effect of part 3, is realized data storage with so can be convenient and is read
It writes, meanwhile, memory gate stack 2, business interface component 3 and power supply module 4 can easily be torn open in installation shell 1
Dress operation so as to easily carry out the independent maintenance and replacement of each module, while easily carrying out module extension；Also,
Disassembling operations between each module are independent of each other, and can independently carry out, thus can be easily implemented component modelsization design and
Cross-species transferability.
As shown in Fig. 2, Fig. 2 is the concrete structure schematic diagram of installation shell and power supply module shown in Fig. 1.
In a kind of preferred embodiment about installation shell 1, which mainly includes bottom plate 101, top plate 102
With demarcation plate 103.Wherein, top plate 102 is fastened on the surface of bottom plate 101, and the two can be detachably connected by realizations such as screws.
101 surface of bottom plate is mainly used for installing memory gate stack 2, business interface component 3 and power supply module 4, and top plate 102 mainly will
It is compressed, is covered.In a kind of preferred embodiment about top plate 102, which may include three parts, i.e., foreboard,
Middle plate and back plate, three are distributed along the length direction of bottom plate 101, are respectively used to cover the different zones of bottom plate 101.
Demarcation plate 103 erects on the surface thereof along the length direction of bottom plate 101, and top is connected to the bottom of top plate 102
Face is mainly used for for the inner space for installing shell 1 being divided into two parts along longitudinal direction, i.e. the installation of the first installation space 1a and second
Space 1b.Wherein, the first installation space 1a is mainly used for installing memory gate stack 2, and the second installation space 1b is mainly used for
Business interface component 3 and power supply module 4 are installed.Since the area of memory gate stack 2 is larger, demarcation plate 103 can be the bottom of at
It is arranged on 101 surface of plate close to wherein a side, in this way, the mounting area of the first installation space 1a and the second installation space 1b
The ratio between mounting area can be 3~1 etc..
Meanwhile the surface of bottom plate 101 is smooth, and track can be set up on its two sides, facilitate memory gate stack 2,
Being slidably installed and dismantling on it of business interface component 3 and power supply module 4.
In addition, to enable this JBOD equipment to be conveniently mounted on server cabinet, the present embodiment in bottom plate 101 two
Fastener 104, such as bolt, H-shaped nail etc. are also provided on side, can so make install shell 1 by the fastener 104 with
The inner wall formation of server cabinet is detachably connected, to easily carry out restocking installation and undercarriage disassembling section.
Meanwhile the present embodiment is provided with bunch chain belt 105, such as tank chain etc. also on the surface of bottom plate 101, it is main to use
In arranging, collect the cables such as power supply line, signal wire, while guaranteeing various cables energy when with 2 plug pull of memory gate stack
It is enough orderly mobile, it avoids winding, knotting mutually etc..
As shown in Figure 3 and Figure 4, Fig. 3 is the concrete structure schematic diagram of memory gate stack shown in Fig. 1, Fig. 4 Fig. 3
Decomposition texture schematic diagram.
In a kind of preferred embodiment about memory gate stack 2, which mainly includes sliding bottom
Plate 201101, hard disk array 202, controller group 203 and Signals Transfer Board 204.
Wherein, sliding floor 201101 is the load-bearing part of memory gate stack 2, is mainly used for installing hard disk array 202, control
Device group 203 processed and Signals Transfer Board 204, and bottom surface is smooth, can on 101 surface of bottom plate in installation shell 1 the
It is slidably installed in one installation space 1a, technical staff is facilitated to carry out push-and-pull operation.
Hard disk array 202 is mounted at an end position on 201101 surface of sliding floor, and to be detachably connected, such as
Clamping installation etc. includes mainly several hard disks, wherein can simultaneously include HDD or SSD and hard disk backboard module etc..This implementation
In example, hard disk array 202 specifically includes 2 groups of 4x2=8 block hard disks installed side by side, and 2 group hard discs are along sliding floor
Distribution before and after 201101 length direction.
Meanwhile ventilation front panel 206 is provided on the front end face of sliding floor 201101, on the one hand for rear
Hard disk array 202 forms protection, on the other hand can filter out the impurity in air, prevent dust stratification in hard disk array 202.And
And the ventilation front panel 206 is removably attachable on sliding floor 201101 simultaneously, for example can be tied by screw or clamping
Structure etc., so set, when needing that hard disk array 202 is repaired, replaces or extended, it can be first by front panel of divulging information
206 disassemble, later again by the first group hard disc from wherein extracting, finally again by the second group hard disc from wherein extracting, and Huo Zheke
With the rear panel module of vertical the second group hard disc of rotation, plug is carried out to hard disk therein from vertical direction.
Controller group 203 is specifically located at another end position of sliding floor 201101, real mainly for the treatment of instruction
The input data of external device can be passed through agreement by existing data conversion, traffic organising etc., the connection of remaining 202 signal of hard disk array
Processing is converted to meet hard disk array 202 needed for storing data, or can also be in turn by the storage in hard disk array 202
Data by protocol processes be converted to meet external device needed for output data, so realize data in hard disk array 202
Read-write operation.Specifically, the controller group 203 can be used two pieces of processors while work, control Redundancy Design is realized.
Signals Transfer Board 204 is also disposed on the surface of sliding floor 201101, and be particularly located at hard disk array 202 with
Between controller group 203, it is integrally located at the intermediate region of sliding floor 201101.The Signals Transfer Board 204 and power supply module 4 and
The connection of 3 signal of business interface component, is transmitted further to control after on the one hand being handled the electric signal that power supply module 4 transmits
Device group 203 and hard disk array 202 are transmitted further to control after on the other hand being handled the data-signal that external device inputs
Device group 203 processed and hard disk array 202.Generally speaking, the effect of Signals Transfer Board 204 is external device, power supply module 4 and hard disk
Data relay station between array 202, controller group 203.
Specifically, being provided with the first transmission connector 2041 and the second transmission connection on the surface of Signals Transfer Board 204
Device 2042.Wherein, which connect with 3 signal of business interface component, is mainly used for outputting it signal
It is sent to controller group 203, and the second transmission connector 2042 is connect with 202 signal of hard disk array, being mainly used for will be by control
Treated that output data is transferred to hard disk array 202 for device group 203 processed.
In addition, the present embodiment is provided with several radiator mould groups 205 also on the surface of sliding floor 201101, mainly
For carrying out cooling down to hard disk array 202.Specifically, the heat spreader module may include 4+1=5 fan, heat dissipation is realized
Redundancy is related to, and allows the normal operation that memory gate stack 2 is still ensured that in the case where damaging a fan.Meanwhile respectively
A radiator mould group 205 is removably disposed on sliding floor 201101, for example passes through screw or clamping structure etc..
As shown in figure 5, Fig. 5 is the concrete structure schematic diagram of business interface component shown in Fig. 1.
In a kind of preferred embodiment about business interface component 3, which mainly includes sliding support
Disk 301, Service Interface Card 302, interface adapter board 303 and business interconnecting module 304.Wherein, the bottom light of slide tray 301
It is sliding, and in the second installation space 1b being slideably plugged in installation shell 1, technical staff carries out it with can be convenient
Installation and removal operation is realized in push-and-pull operation.In general, the slide tray 301 can be in strip rectangle shape.
Service Interface Card 302 is arranged on the surface of slide tray 301, is mainly used for providing various data-interfaces, such as
USB etc., external device can realize physical connection and data with it by each data-interface opened up on the Service Interface Card 302
Interaction.
Interface adapter board 303 is also disposed on the surface of slide tray 301, and Service Interface Card 302 is installed on interface
On pinboard 303, the two can realize signal connection by connectors such as golden fingers, and such Service Interface Card 302 can set the external world
Standby input signal is transferred in interface adapter board 303.
Meanwhile also being connect by connector with 304 signal of business interconnecting module on the output end of interface adapter board 303, it should
Although business interconnecting module 304 is not set up directly on the surface of slide tray 301, but it is set up directly on installation shell 1
101 surface of bottom plate on, but still can by the connector between interface adapter board 303 realize be stably connected with, pushing and pulling
When drive it to move synchronously.Also, the effect of the business interconnecting module 304 is mainly signal transfer, on the one hand can will be by interface
The input signal for the external device that the transmitting of pinboard 303 comes is transferred in controller group 203 by bunch chain belt 105, another party
Face can also by by power supply module 4 transmit Lai electric signal interface adapter board 303 and Service Interface Card are transferred to by connector
On 302, electric energy is provided for the two.
The push-and-pull in installation shell 1 of slide tray 301 is operated in addition, being realized for convenience of technical staff, this implementation
Example is additionally arranged handrail 305 on the front end face of slide tray 301, in this way, technical staff can be grasped by the push-and-pull to handrail 305
Make the sliding of realization slide tray 301.
Moreover, the present embodiment is also additionally arranged several radiator fans 306 on the surface of slide tray 301, such as
Centrifugal fan etc., the radiator fan 306 are mainly used for Service Interface Card 302, interface adapter board 303 and business interconnecting module
304 carry out cooling, guarantee that it is chronically at normal operating condition.
In a kind of preferred embodiment about power supply module 4, which mainly includes 401 He of power module
Power conversion board 402.Wherein, power module 401 can be arranged 2 pieces simultaneously, realize common power supply.And Power conversion board 402 is defeated
Enter end to be connected with the output end of 2 pieces of power modules 401, output end can be connected to business interface by business interconnecting module 304
Card 302 provides electric energy for it, while can also be connected to Signals Transfer Board 204 by bunch chain belt 105, is 202 He of hard disk array
Controller group 203 provides electric energy.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of 1U universal type modular high density storage JBOD equipment, which is characterized in that including installation shell (1), slidably
Ground is inserted in the installation space of installation shell (1) side and for storing data and the memory gate stack of process instruction
(2), it is slideably inserted in the installation space of installation shell (1) other side and for making the memory gate stack (2)
The business interface component (3) of data interaction is realized with external device, is removably installed in the installation shell (1) and is used for
The power supply module (4) of power supply is provided to the memory gate stack (2) and the business interface component (3).
2. 1U universal type modular high density storage JBOD equipment according to claim 1, which is characterized in that the installation
Shell (1) includes bottom plate (101), the top plate (102) being removably fastened on the bottom plate (101) surface, along the bottom plate
(101) length direction is distributed on its surface so that the inner space of installation shell (1) is divided into the first installation space
The demarcation plate (103) of (1a) and the second installation space (1b), and first installation space (1a) is for installing the storage control
Component (2) processed, second installation space (1b) is for installing the business interface component (3) and the power supply module (4).
3. 1U universal type modular high density storage JBOD equipment according to claim 2, which is characterized in that the bottom plate
(101) fastener (104) for being detachably connected with cabinet inner wall is provided on two sides；The bottom plate (101)
The bunch chain belt (105) that winding is prevented for collecting cable is additionally provided on surface.
4. 1U universal type modular high density storage JBOD equipment according to claim 1, which is characterized in that the storage
Control assembly (2) includes the sliding floor (201) being slideably inserted in installation shell (1), is removable installed in
Several hard disk arrays (202) for storing data at one end position of sliding floor (201) surface, be set to it is described
Several at another end position in sliding floor (201) surface are used for the controller group (203) of process instruction, and the controller
Group (203) is connect with the hard disk array (202) signal.
5. 1U universal type modular high density storage JBOD equipment according to claim 4, which is characterized in that the storage
Control assembly (2) further includes being set on the sliding floor (201) surface and being located at the hard disk array (202) and the control
It connect between device group (203) processed, with the power supply module (4) and the business interface component (3) signal, turn for realizing signal
The Signals Transfer Board (204) connect.
6. 1U universal type modular high density storage JBOD equipment according to claim 5, which is characterized in that the signal
It is provided on pinboard (204) for being connect with business interface component (3) signal, being sent to institute for outputting it signal
The first transmission connector (2041) of controller group (203) is stated, and is connect with the hard disk array (202) signal, for inciting somebody to action
By the second transmission connector of the controller group (203) treated output data the is transferred to hard disk array (202)
(2042)。
7. 1U universal type modular high density storage JBOD equipment according to claim 6, which is characterized in that the storage
Control assembly (2) further includes being removable installed on the sliding floor (201) surface and being located at the hard disk array (202)
Radiator mould group between the Signals Transfer Board (204), for the hard disk array (202) to be carried out with cooling down
(205)。
8. 1U universal type modular high density storage JBOD equipment according to claim 7, which is characterized in that the storage
Control assembly (2) further includes being removable installed on the front end face of the sliding floor (201), for protecting and crossing air filtering
The ventilation front panel (206) of middle impurity.
9. 1U universal type modular high density storage JBOD equipment according to claim 1, which is characterized in that the business
Interface module (3) includes the slide tray (301) being slideably inserted in installation shell (1), is set to the sliding
On pallet (301) surface and for provides and the Service Interface Card of external device physical connection interface (302), be set to the cunning
Move the interface adapter board (303) connecting on pallet (301) surface and with the Service Interface Card (302) signal and the interface
The output end signal of pinboard (303) connects and is used to the data-signal of external device being sent to the memory gate stack
(2) the business interconnecting module (304) in.
10. 1U universal type modular high density storage JBOD equipment according to claim 9, which is characterized in that the cunning
It is provided on the front end face of dynamic pallet (301) and is convenient for pushing and pulling the handrail (305) operated, on the surface of the slide tray (301)
It is additionally provided with for the Service Interface Card (302), the interface adapter board (303) and the business interconnecting module (304)
Carry out the radiator fan (306) of cooling.
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Cited By (1)
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| CN111278252A (en) * | 2020-03-19 | 2020-06-12 | 英业达科技有限公司 | Server device |
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