CN110504517B - Dielectric waveguide resonator, port coupling quantity adjusting method thereof and filter - Google Patents
Dielectric waveguide resonator, port coupling quantity adjusting method thereof and filter Download PDFInfo
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- CN110504517B CN110504517B CN201910764835.7A CN201910764835A CN110504517B CN 110504517 B CN110504517 B CN 110504517B CN 201910764835 A CN201910764835 A CN 201910764835A CN 110504517 B CN110504517 B CN 110504517B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/008—Manufacturing resonators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
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Abstract
The invention relates to a dielectric waveguide resonator, a port coupling quantity adjusting method thereof and a filter. A hollow area exposing the dielectric block is arranged between the first metal layer and the second metal layer. The hollow-out region is arranged around the periphery of the first metal layer in the circumferential direction. The first metal layer comprises a first covering layer, a second covering layer and a connecting layer. The first covering layer covers the bottom surface of the dielectric block, and the second covering layer covers the side surface of the dielectric block. According to the dielectric waveguide resonator, the first covering layer covers the bottom surface of the dielectric block, so that strong port coupling can be realized, conditions are provided for widening the bandwidth of the dielectric waveguide resonator, and the dielectric waveguide resonator can be widely applied to dielectric waveguide resonators with wider bandwidths; in addition, the second covering layer is positioned on the side face of the medium block and is used for connecting the coaxial connector or the signal connector of the PCB, and the design mode is less limited by the external dimension during design and can facilitate mass production.
Description
Technical Field
The invention relates to the technical field of filters, in particular to a dielectric waveguide resonator, a port coupling quantity adjusting method thereof and a filter.
Background
When the dielectric waveguide filter is designed, port design is needed, the size of port coupling of the dielectric waveguide filter is related to bandwidth, and the port coupling requirement is higher as the bandwidth is wider. The traditional dielectric waveguide filter is composed of more than two dielectric waveguide resonators, the top surfaces of the dielectric waveguide resonators are provided with resonant holes, and the side surfaces or the bottom surfaces of the dielectric waveguide resonators are provided with ports. If the port is positioned on the bottom surface of the dielectric waveguide resonator, stronger coupling can be realized, but the design of the dielectric waveguide filter is limited by the external dimension, so that the design limitation is large; if the port is located on the side face of the dielectric waveguide resonator, the conventional method needs to arrange a deep blind hole on the side face to realize strong coupling, and the processing molding and metallization are difficult in practical application, so that the method is not suitable for batch production.
Disclosure of Invention
Therefore, it is necessary to overcome the defects of the prior art and provide a dielectric waveguide resonator, a port coupling amount adjusting method thereof and a filter, which can realize a stronger port coupling amount, facilitate mass production and reduce design limitations.
The technical scheme is as follows: a dielectric waveguide resonator comprising: the dielectric block is characterized in that a first metal layer and a second metal layer surrounding the periphery of the first metal layer are laid on the outer surface of the dielectric block, a hollow area exposing the dielectric block is arranged between the first metal layer and the second metal layer and circumferentially arranged around the periphery of the first metal layer, the first metal layer comprises a first covering layer, a second covering layer and a connecting layer connecting the first covering layer and the second covering layer, the first covering layer covers the bottom surface of the dielectric block, and the second covering layer covers the side surface of the dielectric block; one part of the connecting layer is positioned on the bottom surface of the dielectric block, and the other part of the connecting layer is positioned on the side surface of the dielectric block; the second cover layer is used for connecting an external port.
In the dielectric waveguide resonator, the first metal layer is equivalent to a port, and the first covering layer covers the bottom surface of the dielectric block, so that strong coupling of the port can be realized, conditions are provided for widening the bandwidth of the dielectric waveguide resonator, and the dielectric waveguide resonator can be widely applied to dielectric waveguide resonators with wider bandwidths; in addition, because the second covering layer is positioned on the side surface of the dielectric block and is used for connecting an external port, such as a coaxial connector or a signal connector of a PCB (printed circuit board), the design mode is less limited by the external dimension, and more better design schemes are selected when the dielectric waveguide resonator is designed; in addition, the machining, forming and metallization of the product are simpler, and the working hours can be saved; after the coaxial cable or the signal connector of the PCB is assembled together, the coupling amount of the port can be adjusted by removing the first metal layer or the second metal layer, so that the product debugging efficiency is higher, and the debugging cost is saved; and secondly, the dielectric waveguide resonator has good consistency, the change of the coupling amount caused by processing errors is small, and the dielectric waveguide resonator is suitable for mass production.
In one embodiment, the top surface of the dielectric block is provided with a resonant hole, and the part of the second metal layer completely covers the inner wall of the resonant hole.
In one embodiment, a first coupling hole is formed in the bottom surface of the dielectric block, the first coupling hole is a blind hole or a through hole communicated with the resonance hole, and the first covering layer covers the inner wall of the first coupling hole.
In one embodiment, a groove communicated with the first coupling hole is formed in the bottom surface of the dielectric block, and the connecting layer covers the inner wall of the groove.
In one embodiment, a second coupling hole is formed in the side face of the dielectric block, the second coupling hole is a blind hole, and the second covering layer covers the inner wall of the second coupling hole.
In one embodiment, the bottom surface of the dielectric block is a plane; and/or the side surface of the dielectric block paved with the second covering layer is a plane.
A port coupling amount adjusting method of a dielectric waveguide resonator comprises the following steps: the bottom surface of the dielectric block is provided with a first coupling hole, and the first covering layer covers the inner wall of the first coupling hole; the coupling quantity of the port is adjusted by adjusting the size of the diameter D1 of the first coupling hole; and/or the strength of the coupling amount of the port is adjusted by adjusting the depth H1 of the first coupling hole; and/or adjusting the coupling strength of the port by controlling the amount of the metal layer removed from the first metal layer.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
A port coupling amount adjusting method of a dielectric waveguide resonator comprises the following steps: the bottom surface of the dielectric block is provided with a first coupling hole, and the first covering layer covers the inner wall of the first coupling hole; the bottom surface of the medium block is provided with a groove communicated with the first coupling hole, the connecting layer covers the inner wall of the groove, and the coupling amount of the port is adjusted by adjusting the depth of the groove.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
A port coupling amount adjusting method of a dielectric waveguide resonator comprises the following steps: a second coupling hole is formed in the side face of the dielectric block, the second coupling hole is a blind hole, and the second covering layer covers the inner wall of the second coupling hole; the coupling quantity of the port is adjusted by adjusting the size of the diameter D2 of the second coupling hole; and/or the strength of the coupling amount of the port is adjusted by adjusting the depth H2 of the second coupling hole; and/or adjusting the coupling strength of the port by controlling the amount of the metal layer removed from the first metal layer.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
A port coupling amount adjusting method of a dielectric waveguide resonator comprises the following steps: adjusting the coupling strength of the port by controlling the amount of the metal layer of the first covering layer; and/or adjusting the coupling strength of the port by controlling the amount of the metal layer of the second covering layer; and/or the strength of the coupling quantity of the port is adjusted by controlling the width of the connecting layer; and/or the coupling quantity of the port is adjusted by controlling the size of the opening of the hollow area.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
A filter comprises the dielectric waveguide resonator.
The filter has the technical effects brought by the dielectric waveguide resonator, and the beneficial effects are the same as those of the dielectric waveguide resonator, and are not described in detail.
Drawings
Fig. 1 is a schematic structural diagram of a bottom surface of a dielectric waveguide resonator according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a side surface of a dielectric waveguide resonator according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a dielectric waveguide resonator according to an embodiment of the present invention;
FIG. 4 is a schematic view of the structure of FIG. 3 with the dielectric block removed;
fig. 5 is a schematic diagram of a bottom surface and a side surface of a dielectric wave resonator according to an embodiment of the invention;
FIG. 6 is an exploded view of FIG. 5;
fig. 7 is a schematic view of the bottom and side surfaces of a dielectric wave resonator according to another embodiment of the present invention;
fig. 8 is a schematic view of a bottom surface and a side surface of a dielectric wave resonator according to yet another embodiment of the present invention;
fig. 9 is a schematic view of a bottom surface and a side surface of a dielectric wave resonator according to still another embodiment of the present invention;
fig. 10 is a schematic view of the bottom and side surfaces of a dielectric wave resonator according to still another embodiment of the invention.
Reference numerals:
10. a dielectric block; 11. a top surface; 111. a resonant aperture; 12. a hollow-out area; 13. a bottom surface; 131. a first coupling hole; 132. a groove; 14. a side surface; 141. a second coupling hole; 20. a first metal layer; 21. a first cover layer; 22. a second cover layer; 23. a connecting layer; 30. a second metal layer; 40. a coaxial joint; 41. an inner core.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the description of the present invention, it should be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.
In one embodiment, referring to fig. 1-4, a dielectric waveguide resonator includes a dielectric block 10. The dielectric block 10 may be a ceramic body, and a first metal layer 20 and a second metal layer 30 surrounding the first metal layer 20 are disposed on an outer surface of the dielectric block 10. A hollow area 12 exposing the dielectric block 10 is disposed between the first metal layer 20 and the second metal layer 30. The hollowed-out regions 12 are circumferentially disposed around the periphery of the first metal layer 20. The first metal layer 20 includes a first cover layer 21, a second cover layer 22, and a connection layer 23 connecting the first cover layer 21 and the second cover layer 22. The first covering layer 21 covers the bottom surface 13 of the dielectric block 10, and the second covering layer 22 covers the side surface 14 of the dielectric block 10. One part of the connecting layer 23 is located on the bottom surface 13 of the dielectric block 10, and the other part of the connecting layer 23 is located on the side surface 14 of the dielectric block 10. The second cover layer 22 is used for connecting an external port, specifically, a coaxial connector 40 or a signal connector of a PCB board, for example.
It should be understood that, referring to fig. 3, a surface of the dielectric block 10 for forming the resonant hole 111 is a top surface 11, a surface of the dielectric block 10 opposite to the top surface 11 is a bottom surface 13, and a surface of the dielectric block 10 for connecting between the top surface 11 and the bottom surface 13 is a side surface 14.
In the dielectric waveguide resonator, the first metal layer 20 is equivalent to a port, and the first covering layer 21 covers the bottom surface 13 of the dielectric block 10, so that strong port coupling can be realized, conditions are provided for widening the bandwidth of the dielectric waveguide resonator, and the dielectric waveguide resonator can be widely applied to dielectric waveguide resonators with wider bandwidths; in addition, since the second cladding layer 22 is located on the side surface 14 of the dielectric block 10, and the second cladding layer 22 is used for connecting the coaxial connector 40 or the signal connector of the PCB, the design mode is less limited by the external dimension, and more better design options are available in the design of the dielectric waveguide resonator; in addition, the machining, forming and metallization of the product are simpler, and the working hours can be saved; after the connector is assembled with a signal connector of a coaxial cable or a PCB, the coupling amount of a port can be adjusted by removing the first metal layer 20 or the second metal layer 30, so that the product debugging efficiency is higher, and the debugging cost is saved; and secondly, the dielectric waveguide resonator has good consistency, the change of the coupling amount caused by processing errors is small, and the dielectric waveguide resonator is suitable for mass production.
Further, the top surface 11 of the dielectric block 10 is provided with a resonant hole 111, and a portion of the second metal layer 30 completely covers an inner wall of the resonant hole 111. In this manner, the resonance hole 111 provided on the top surface 11 can be used to adjust the resonance frequency of the dielectric waveguide resonator. The resonant hole 111 is correspondingly disposed on the top surface 11 according to requirements, and optionally, the resonant hole 111 may not be disposed on the top surface 11 of the dielectric block 10.
Further, the bottom surface 13 of the dielectric block 10 is provided with a first coupling hole 131. The first coupling hole 131 is a blind hole or a through hole communicating with the resonance hole 111, and the first cover layer 21 covers an inner wall of the first coupling hole 131. Wherein, the larger the diameter D1 of the first coupling hole 131, the stronger the coupling amount of the port; the greater the depth H1 of the first coupling hole 131, the greater the amount of port coupling. When the depth H1 of the first coupling hole 131 is the maximum, i.e. the first coupling hole 131 penetrates through the bottom wall of the resonant hole 111 and is communicated with the resonant hole 111, the first coupling hole 111 is a through hole; when the depth H1 of the first coupling hole 131 is 0, the bottom surface 13 of the dielectric block 10 is a plane.
Further, a groove 132 communicated with the first coupling hole 131 is formed in the bottom surface 13 of the dielectric block 10, and the connecting layer 23 covers an inner wall of the groove 132. Wherein, the deeper the depth of the groove 132, the greater the coupling amount of the port.
Further, a second coupling hole 141 is formed in the side surface 14 of the dielectric block 10, the second coupling hole 141 is a blind hole, and the second covering layer 22 covers an inner wall of the second coupling hole 141. Therefore, the blind hole mode is adopted, so that the inner core 41 of the coaxial connector 40 can be welded in the inner wall of the second coupling hole 141, the welding error is small, and the method is suitable for batch assembly. In addition, the larger the diameter D2 of the second coupling hole 141 is, the stronger the coupling amount of the port is; the greater the depth H2 of the second coupling hole 141, the greater the amount of port coupling. When the depth H2 of the second coupling hole 141 is 0, the side 14 of the dielectric block 10 on which the second cover layer 22 is laid is a plane.
Further, the coaxial connector 40 includes an inner core 41, an insulation cover body and a metal outer skin. The inner core 41 is connected with the second covering layer 22, the insulating sleeve body is sleeved outside the inner core 41, and the metal outer skin is wrapped outside the insulating sleeve body.
In one embodiment, referring to fig. 5 and 6, the bottom surface 13 of the dielectric block 10 is provided with a first coupling hole 131. The first coupling hole 131 is a blind hole. The first cover layer 21 covers the inner wall of the first coupling hole 131. The side surface 14 of the dielectric block 10 on which the second cover layer 22 is laid is a plane. The second cover layer 22 is used to connect with the coaxial connector 40 or the signal connector of the PCB board.
In an embodiment, referring to fig. 7, the bottom surface 13 of the dielectric block 10 is a plane, and the side surface 14 of the dielectric block 10 on which the second cover layer 22 is laid is a plane. The first covering layer 21 covers the bottom surface 13 of the dielectric block 10, and the second covering layer 22 covers the side surface 14 of the dielectric block 10. The second cover layer 22 is used to connect with the coaxial connector 40 or the signal connector of the PCB board.
In one embodiment, referring to fig. 8, the bottom surface 13 of the dielectric block 10 is provided with a first coupling hole 131. The first coupling hole 131 is a through hole communicating with the resonance hole 111. The first cover layer 21 covers the inner wall of the first coupling hole 131. The side surface 14 of the dielectric block 10 on which the second cover layer 22 is laid is a plane. The second cover layer 22 is used to connect with the coaxial connector 40 or the signal connector of the PCB board.
In an embodiment, referring to fig. 9, as compared to fig. 5, in fig. 9, a groove 132 communicating with the first coupling hole 131 is formed on the bottom surface 13 of the dielectric block 10, and the connecting layer 23 covers an inner wall of the groove 132.
In one embodiment, referring to fig. 10, the bottom surface 13 of the dielectric block 10 is provided with a first coupling hole 131. The first coupling hole 131 is a blind hole. The first cover layer 21 covers the inner wall of the first coupling hole 131. The side surface 14 of the dielectric block 10 is provided with a second coupling hole 141, the second coupling hole 141 is a blind hole, and the second covering layer 22 covers the inner wall of the second coupling hole 141.
In one embodiment, the width W1 of a portion of the connection layer 23 on the bottom side 13 of the dielectric block 10 may or may not be the same as the width W2 of another portion of the connection layer 23 on the side 14 of the dielectric block 10.
In an embodiment, referring to fig. 1 to 6, a method for adjusting a port coupling amount of a dielectric waveguide resonator according to any of the above embodiments includes the following steps:
a first coupling hole 131 is formed in the bottom surface 13 of the dielectric block 10, and the first covering layer 21 covers the inner wall of the first coupling hole 131; the coupling strength of the port is adjusted by adjusting the size of the diameter D1 of the first coupling hole 131; and/or the coupling strength of the port is adjusted by adjusting the depth H1 of the first coupling hole 131; and/or adjusting the coupling strength of the port by controlling the amount of the metal layer removed from the first metal layer 20.
Specifically, when the dielectric waveguide resonator is produced, processed and manufactured, the dielectric block 10 is provided; then, a resonant hole 111 is processed on the top surface 11 of the dielectric block 10, and a first coupling hole 131 is processed on the bottom surface 13 of the dielectric block 10, the port coupling amount is adjusted according to the processing diameter D1 and the depth H1 of the first coupling hole 131, and the larger the diameter D1 of the first coupling hole 131 is, the stronger the port coupling amount is; when the depth H1 of the first coupling hole 131 is larger, the coupling amount of the port is stronger; finally, a metal layer is plated on the surface of the dielectric block 10, for example, and the first metal layer 20 and the second metal layer 30 are separated from each other by forming the hollow-out region 12 on the surface of the dielectric block 10. Wherein, the larger the width of the connection layer 23 is, the stronger the coupling amount of the port is; when the distance W3 between the first metal layer 20 and the second metal layer 30 is larger, the coupling amount of the port is stronger, that is, the coupling amount of the port can be controlled by controlling the opening position of the hollow area 12 on the surface of the dielectric block 10.
Further, after the second cover layer 22 is assembled with the coaxial connector 40 or the signal connector of the PCB by connecting with each other, the coupling amount of the port is adjusted by controlling the amount of the metal layer removed from the first metal layer 20, that is, when the actual coupling amount of the port is too large, for example, the first cover layer 21 is removed from the edge close to the hollow area 12 to reduce the area of the first cover layer 21 so as to reduce the coupling amount of the port, or the connection layer 23 is removed from the edge close to the hollow area 12 to reduce the width of the connection layer 23 so as to reduce the coupling amount of the port, or the second cover layer 22 is removed from the edge close to the hollow area 12 to reduce the area of the second cover layer 22 so as to reduce the coupling amount of the port.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
In an embodiment, referring to fig. 1 to 4 and 9, a method for adjusting a port coupling amount of a dielectric waveguide resonator according to any one of the above embodiments includes the following steps:
a first coupling hole 131 is formed in the bottom surface 13 of the dielectric block 10, and the first covering layer 21 covers the inner wall of the first coupling hole 131;
the bottom surface 13 of the dielectric block 10 is provided with a groove 132 communicated with the first coupling hole 131, the connecting layer 23 covers the inner wall of the groove 132, and the coupling amount of the port is adjusted by adjusting the depth of the groove 132.
Specifically, when the dielectric waveguide resonator is produced, processed and manufactured, the dielectric block 10 is provided; then, a resonant hole 111 is processed on the top surface 11 of the dielectric block 10, a first coupling hole 131 and a groove 132 communicated with the first coupling hole 131 are processed on the bottom surface 13 of the dielectric block 10, the port coupling amount is adjusted according to the depth of the groove 132, and when the depth of the groove 132 is larger, the port coupling amount is stronger; finally, a metal layer is plated on the surface of the dielectric block 10, for example, and the first metal layer 20 and the second metal layer 30 are separated from each other by forming the hollow-out region 12 on the surface of the dielectric block 10. Wherein, the larger the width of the connection layer 23 is, the stronger the coupling amount of the port is; when the distance W3 between the first metal layer 20 and the second metal layer 30 is larger, the coupling amount of the port is stronger, that is, the coupling amount of the port can be controlled by controlling the opening position of the hollow area 12 on the surface of the dielectric block 10.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
In an embodiment, referring to fig. 1 to 4 and fig. 10, a method for adjusting a port coupling amount of a dielectric waveguide resonator according to any of the above embodiments includes the following steps:
a second coupling hole 141 is formed in the side surface 14 of the dielectric block 10, the second coupling hole 141 is a blind hole, and the second covering layer 22 covers the inner wall of the second coupling hole 141; the coupling strength of the port is adjusted by adjusting the size of the diameter D2 of the second coupling hole 141; and/or the coupling strength of the port is adjusted by adjusting the depth H2 of the second coupling hole 141; and/or, the coupling strength of the port is adjusted by controlling the amount of the metal layer removed from the second covering layer 22.
Specifically, when the dielectric waveguide resonator is produced, processed and manufactured, the dielectric block 10 is provided; then, a resonant hole 111 is processed on the top surface 11 of the dielectric block 10, and a second coupling hole 141 is processed on the side surface 14 of the dielectric block 10, the port coupling amount is adjusted according to the processing diameter D2 and the depth H2 of the second coupling hole 141, and the port coupling amount is stronger when the diameter D2 of the second coupling hole 141 is larger; when the depth H2 of the second coupling hole 141 is larger, the coupling amount of the port is stronger; finally, a metal layer is plated on the surface of the dielectric block 10, for example, and the first metal layer 20 and the second metal layer 30 are separated from each other by forming the hollow-out region 12 on the surface of the dielectric block 10.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
In an embodiment, referring to fig. 1 to 4 and fig. 6 to 8, a method for adjusting a port coupling amount of a dielectric waveguide resonator according to any of the embodiments includes the following steps:
the coupling strength of the port is adjusted by controlling the amount of the metal layer of the first covering layer 21; and/or, the coupling strength of the port is adjusted by controlling the amount of the metal layer removed from the second covering layer 22; and/or, the strength of the coupling quantity of the port is adjusted by controlling the width of the connecting layer 23; and/or the coupling amount of the port is adjusted by controlling the opening size of the hollow-out area 12.
Specifically, after the dielectric wave resonator is processed, and after the second cover layer 22 is connected and assembled with the coaxial connector 40 or the signal connector of the PCB, the coupling amount of the port is adjusted by controlling the amount of the metal layer of the first metal layer 20 to be removed, that is, when the actual coupling amount of the port is too large, for example, the first cover layer 21 is removed from the edge close to the hollow area 12 to reduce the area of the first cover layer 21, so as to reduce the coupling amount of the port, or the connection layer 23 is removed from the edge close to the hollow area 12 to reduce the width of the connection layer 23, so as to reduce the coupling amount of the port, or the second cover layer 22 is removed from the edge close to the hollow area 12, so as to reduce the area of the second cover layer 22, so as to reduce the coupling amount of the port.
The technical effect of the method for adjusting the port coupling amount of the dielectric waveguide resonator is brought by the dielectric waveguide resonator, and the beneficial effect is the same as that of the dielectric waveguide resonator, and is not repeated.
In one embodiment, a filter comprises a dielectric waveguide resonator as described in any of the above embodiments.
The filter has the technical effects brought by the dielectric waveguide resonator, and the beneficial effects are the same as those of the dielectric waveguide resonator, and are not described in detail.
Specifically, the filter includes a plurality of dielectric waveguide resonators, one or two of the dielectric waveguide resonators are the dielectric waveguide resonator described in any of the above embodiments, and the remaining dielectric waveguide resonators are different from the dielectric waveguide resonators described in the above embodiments, and may be implemented by using an originally designed dielectric waveguide resonator. Thus, when the port coupling amount of the filter is adjusted, the port coupling amount of the dielectric waveguide resonator is adjusted by using the method for adjusting the port coupling amount of the dielectric waveguide resonator described in the above embodiment, that is, the port coupling amount of the filter can be adjusted. The strong coupling of the ports can be realized, conditions are provided for widening the bandwidth of the dielectric waveguide resonator, and the dielectric waveguide resonator can be widely applied to the dielectric waveguide resonator with wider bandwidth; in addition, since the second cladding layer 22 is located on the side surface 14 of the dielectric block 10, and the second cladding layer 22 is used for connecting the coaxial connector 40 or the signal connector of the PCB, the design mode is less limited by the external dimension, and more better design options are available in the design of the dielectric waveguide resonator; in addition, the machining, forming and metallization of the product are simpler, and the working hours can be saved; after the connector is assembled with a signal connector of a coaxial cable or a PCB, the coupling amount of a port can be adjusted by removing the first metal layer 20 or the second metal layer 30, so that the product debugging efficiency is higher, and the debugging cost is saved; and secondly, the dielectric waveguide resonator has good consistency, the change of the coupling amount caused by processing errors is small, and the dielectric waveguide resonator is suitable for mass production.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A dielectric waveguide resonator, comprising:
the dielectric block comprises a dielectric block, wherein a first metal layer and a second metal layer surrounding the periphery of the first metal layer are laid on the outer surface of the dielectric block, a hollow area exposing the dielectric block is arranged between the first metal layer and the second metal layer, the hollow area is arranged around the periphery of the first metal layer in the circumferential direction, the second metal layer covers the rest area of the dielectric block except the hollow area on the periphery of the first metal layer, the first metal layer comprises a first covering layer, a second covering layer and a connecting layer connecting the first covering layer and the second covering layer, the first covering layer covers the bottom surface of the dielectric block, and the second covering layer covers the side surface of the dielectric block; one part of the connecting layer is positioned on the bottom surface of the dielectric block, and the other part of the connecting layer is positioned on the side surface of the dielectric block; the second cover layer is used for connecting an external port.
2. The dielectric waveguide resonator according to claim 1, wherein the top surface of the dielectric block is provided with a resonance hole, and a part of the second metal layer completely covers an inner wall of the resonance hole.
3. The dielectric waveguide resonator according to claim 2, wherein a first coupling hole is formed in a bottom surface of the dielectric block, the first coupling hole is a blind hole or a through hole communicated with the resonance hole, and the first cover layer covers an inner wall of the first coupling hole.
4. The dielectric waveguide resonator according to claim 3, wherein a groove communicating with the first coupling hole is provided on a bottom surface of the dielectric block, and the connection layer covers an inner wall of the groove.
5. The dielectric waveguide resonator according to any one of claims 1 to 4, wherein a second coupling hole is formed in a side surface of the dielectric block, the second coupling hole is a blind hole, and the second cover layer covers an inner wall of the second coupling hole.
6. A method of adjusting a port coupling amount of a dielectric waveguide resonator according to claim 1, comprising the steps of: the bottom surface of the dielectric block is provided with a first coupling hole, and the first covering layer covers the inner wall of the first coupling hole; the coupling quantity of the port is adjusted by adjusting the size of the diameter D1 of the first coupling hole; and/or the strength of the coupling amount of the port is adjusted by adjusting the depth H1 of the first coupling hole; and/or adjusting the coupling strength of the port by controlling the amount of the metal layer removed from the first metal layer.
7. A method of adjusting a port coupling amount of a dielectric waveguide resonator according to claim 1, comprising the steps of: the bottom surface of the dielectric block is provided with a first coupling hole, and the first covering layer covers the inner wall of the first coupling hole; the bottom surface of the medium block is provided with a groove communicated with the first coupling hole, the connecting layer covers the inner wall of the groove, and the coupling amount of the port is adjusted by adjusting the depth of the groove.
8. A method of adjusting a port coupling amount of a dielectric waveguide resonator according to claim 1, comprising the steps of: a second coupling hole is formed in the side face of the dielectric block, the second coupling hole is a blind hole, and the second covering layer covers the inner wall of the second coupling hole; the coupling quantity of the port is adjusted by adjusting the size of the diameter D2 of the second coupling hole; and/or the strength of the coupling amount of the port is adjusted by adjusting the depth H2 of the second coupling hole; and/or adjusting the coupling strength of the port by controlling the amount of the metal layer removed from the first metal layer.
9. A method of adjusting a port coupling amount of a dielectric waveguide resonator according to any one of claims 1 to 5, comprising the steps of:
adjusting the coupling strength of the port by controlling the amount of the metal layer of the first covering layer; and/or adjusting the coupling strength of the port by controlling the amount of the metal layer of the second covering layer; and/or the strength of the coupling quantity of the port is adjusted by controlling the width of the connecting layer; and/or the coupling quantity of the port is adjusted by controlling the size of the opening of the hollow area.
10. A filter comprising a dielectric waveguide resonator according to any one of claims 1 to 5.
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| CN113451726A (en) * | 2021-07-16 | 2021-09-28 | 大富科技(安徽)股份有限公司 | Port coupling structure and filter |
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