CN110429057B - Wafer taking and delivering method for dry etching machine - Google Patents
Wafer taking and delivering method for dry etching machine Download PDFInfo
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- CN110429057B CN110429057B CN201910711544.1A CN201910711544A CN110429057B CN 110429057 B CN110429057 B CN 110429057B CN 201910711544 A CN201910711544 A CN 201910711544A CN 110429057 B CN110429057 B CN 110429057B
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- 238000000034 method Methods 0.000 title claims abstract description 85
- 238000001312 dry etching Methods 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 claims abstract description 46
- 238000004140 cleaning Methods 0.000 claims abstract description 26
- 239000011521 glass Substances 0.000 claims description 7
- 238000012163 sequencing technique Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a piece taking and delivering method of a dry etching machine, which realizes that different process cavities of a production line of the dry etching machine produce different products and improves the flexibility of the production line of the dry etching machine; meanwhile, the tact time of the whole production line is improved, the waiting time of a mechanical arm/a cleaning machine table/a dry etching machine is reduced, and the production efficiency is improved; moreover, the device supports independent production of multiple process cavities, so that when one process cavity carries out PM which is not required to be stopped by the whole machine, other process cavities can normally produce, and the maintenance time of a dry etching machine table is reduced; therefore, the method and the device realize the maximum balance between the independent production of the process cavity and the lift time promotion, and realize the requirements of improving the production efficiency of a factory, reducing the cost and flexibly promoting the production efficiency of the factory.
Description
Technical Field
The invention relates to the technical field of dry etching machine production lines, in particular to a sheet taking and conveying method of a dry etching machine.
Background
The dry etching machine is a key multi-process chamber machine in the panel process, and a contradiction exists between the improvement of the tact time and the independent production of different products by each process chamber.
In the production process of the existing dry etching machine, the production line of the dry etching machine consists of a panel transplanter, a mechanical arm, a cleaning machine and the dry etching machine, wherein the process is that the panel is cleaned from the transplanter to the cleaning machine through the mechanical arm, then the mechanical arm sends the panel to the dry etching machine for dry etching, and finally the mechanical arm sends the panel back to the transplanter. Each secondary slice is initiated by the dry etcher and informs the robot of the desired product type. The control logic of the robot arm is controlled by the BC system.
When different products (experimental products used when PM is contained) are produced in each process cavity, because an advanced cleaning machine is needed, a mechanical arm cannot predict which product the dry etching machine will be used next time, and only can wait for the machine table of the dry etching machine to clearly inform the required product type, so that the cleaning machine waits when no wafer is produced in the dry etching machine every time, and the dry etching machine waits to be idle when the cleaning machine cleans, and tact time is reduced. When the tact time is to be increased, each process chamber in the dry etching machine can only produce the same product, which reduces the production flexibility of the dry etching machine, and if one process chamber performs PM running on the experimental product, other process chambers wait for idling, which wastes the productivity of the dry etching machine.
Therefore, the key to achieve the balance of improving the tact time and the production independence of each process chamber is the optimization of the wafer taking and sending logic of the mechanical arm.
The design provides a systematic logic solution for taking and sending the wafer by the mechanical arm, so that the independent production of multiple process cavities is realized, the high production rhythm of each device in the production line of the dry etching machine is ensured, the waiting time of the device is reduced, the tact time is improved, and finally the contradiction between tact time improvement and independent production of each process cavity is solved.
In order to solve the above problems, the present invention develops a wafer picking and delivering method for a dry etching machine.
Disclosure of Invention
The invention aims to solve the problems and provide a wafer taking and delivering method of a dry etching machine.
The invention realizes the purpose through the following technical scheme:
the wafer taking and delivering method of the dry etching machine comprises the following steps:
A. the dry etching machine table reports the state and type information of each process cavity to a BC system, and each process cavity is provided with an ID serial number;
B. the BC system lists the process cavities in the running/waiting state as effective process cavities, lists the process cavities in the non-running/waiting state as invalid process cavities, sorts the effective process cavities according to the ID serial numbers, obtains corresponding process cavity type sorting according to the sorting, and serves as a basis for the mechanical arm to take corresponding types of products from the panel transplanter according to the sorting circulation of the types;
C. when the panel to be produced is taken from the panel transplanter, the panel to be produced on the panel transplanter is compared one by one according to the sequencing of the types of the effective processing cavities, if a corresponding type product exists, the panel is taken out, and if no corresponding type product exists, the panel is moved to the next type comparison according to the sequencing;
D. if a corresponding type product exists, the mechanical arm directly takes out the panel to be produced from the panel transplanter to an inlet of a cleaning machine table in advance to wait, the wafer exchange is carried out when the production in the cleaning machine table is finished and the wafer needs to be placed in a dry etching machine, and the wafer exchange step is as follows: and a panel taken out of the panel transplanter is placed into the cleaning machine table by one arm of the mechanical arm, the panel taken out of the cleaning machine table is placed into the dry etching machine by the other arm of the robot, the finished panel to be discharged in the dry etching machine is taken out and sent back to the panel transplanter, and then the panel to be produced is taken out in advance and waits at the inlet of the cleaning machine table.
Specifically, if the process chamber state changes from running/waiting to non-running/waiting in the production process, the effective process chamber and the corresponding process chamber type are deleted from the type sequence; if the process chamber state is changed from non-operation/waiting to operation/waiting in the production process, the process chamber and the corresponding process chamber type are added into the type sequence.
Specifically, the panel is composed of a plurality of layers of circuits, different products are named according to each layer of circuit, different products are distinguished by using types, type information is automatically carried to each piece of panel glass by an MES system according to different circuit layers of the whole production of the panel, and the type information needs to be automatically changed when different circuit layers are produced; and then downloading the type information to the BC system along with the data of each piece of panel glass when the panel is transported to a panel transplanter, so that the BC system acquires the type information of each piece of panel.
The invention has the beneficial effects that:
the method of the invention realizes that different process cavities of the dry etching machine production line produce different products, and improves the flexibility of the dry etching machine production line; meanwhile, the tact time of the whole production line is improved, the waiting time of a mechanical arm/a cleaning machine table/a dry etching machine is reduced, and the production efficiency is improved;
moreover, the device supports independent production of multiple process cavities, so that when one process cavity carries out PM which is not required to be stopped by the whole machine, other process cavities can normally produce, and the maintenance time of a dry etching machine table is reduced;
therefore, the method and the device realize the maximum balance between the independent production of the process cavity and the lift time promotion, and realize the requirements of improving the production efficiency of a factory, reducing the cost and flexibly promoting the production efficiency of the factory.
Drawings
FIG. 1 is a schematic structural view of a water-encountering test device according to the present invention;
in the figure: 1. a panel transplanter; 2. a robot arm; 3. cleaning the machine table; 4. a dry etching machine; 41. a process chamber.
Detailed Description
The invention will be further described with reference to the accompanying drawings in which:
the BC system actively controls the mechanical arm 2 to take and send the film through the acquired information.
And (3) taking a piece logic:
A. the machine of the dry etching machine 4 reports the state and type information of each process cavity 41 to the BC system, and each process cavity 41 is provided with an ID serial number;
B. the BC system arranges the process cavities 41 in the running/waiting state as effective process cavities 41, arranges the process cavities 41 in the non-running/waiting state as ineffective process cavities 41, sorts the effective process cavities 41 according to the ID serial numbers, acquires the sort of the corresponding process cavities 41 according to the sort, and the BC system is used as the basis for the mechanical arm 2 to fetch the corresponding type of products from the panel transplanter 1 according to the sort cycle;
C. when the panels to be produced are taken out from the panel transplanter 1, the panels to be produced on the panel transplanter 1 are compared one by one according to the sorting of the types of the effective processing cavities 41, if the corresponding type of products exists, the panels are taken out, and if the corresponding type of products does not exist, the panels are moved to the next type comparison according to the sorting; and analogizing in turn, and sequencing the circulating effective Chamber types to perform slice extraction;
and sending a film logic:
D. if a corresponding type of product exists, the mechanical arm 2 directly takes out the panel to be produced from the panel transplanter 1 in advance to an inlet of the cleaning machine table 3 for waiting, and the wafer exchange is carried out when the production in the cleaning machine table 3 is finished and the wafer needs to be placed in the dry etching machine 4, wherein the wafer exchange step is as follows: the panel taken out of the panel transplanter 1 is placed into the cleaning machine table 3 by one arm of the mechanical arm 2, the panel taken out of the cleaning machine table 3 is placed into the dry etching machine 4 by the other arm of the robot, the finished panel to be discharged in the dry etching machine 4 is taken out and returned to the panel transplanter 1, and then the panel to be produced is taken out in advance and waits at the inlet of the cleaning machine table 3. The production of the dry etching machine 4 production line is performed in this cycle.
If the status of the process chamber 41 changes from running/waiting to non-running/waiting during the production process, the valid process chamber 41 and the corresponding process chamber 41 type are deleted from the type sequence; if the status of a process chamber 41 changes from non-RUN/IDEL to RUN/wait during the manufacturing process, the process chamber 41 and the corresponding process chamber 41 type are added to the type sequence.
The panel is composed of a plurality of layers of circuits, different products are named according to each layer of circuit, different products are distinguished by using types, type information is automatically carried to each piece of panel glass by an MES system according to different circuit layers of the whole production of the panel, and the type information needs to be automatically changed when different circuit layers are produced; then, when the panel is transported to the panel transplanter 1, the type information is downloaded to the BC system along with the data of each piece of panel glass, so that the BC system acquires the type information of each piece of panel.
The types of the process chambers 41 of the dry etcher 4 are the same according to product classification, and are also distinguished by using the types (the number and naming of the specific types are determined according to different panel technologies), each process chamber 41 can be set to be any type, and the type information is an attribute of each process chamber 41. The number and the name of the types can realize the functions of addition, modification, deletion and the like so as to provide self-defined operation for engineering personnel. The process chamber 41 is configured to provide manual and automatic settings, default to manual settings, and automatic settings reserved for use by other equipment of the dry etcher 4 under particular conditions. When the type of each process chamber 41 is changed, a new type needs to be reported to the BC system in time, so that the BC system can obtain the latest type information of the process chamber 41 in time.
As shown in fig. 1, in the present application:
BC system: the system is directly communicated with equipment, and is a core hub for communication between the equipment and between the equipment and other systems. And the flow direction and transmission of Glass in the equipment are controlled by receiving an instruction of an MES system, so that the production automation of a production line is realized.
The process chamber 41: a process chamber 41 in the machine of the dry etcher 4.
A cleaning machine: and the cleaning machine table 3 is used for cleaning the panel.
The dry etcher 4 is used for dry removal of excess material from the panel.
MES system: the system is used for helping enterprises actively collect and monitor production data generated in the manufacturing process from order taking, production and flow control to product completion so as to ensure the production quality of products.
PM: the machine station performs preventive maintenance.
The robot arm 2 is used for carrying panels and is controlled by the BC system.
Tack time: the time interval between two products produced by the same tool, in seconds(s), is usually used to count the tool throughput, and a smaller value indicates a greater tool throughput.
Chamber type.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The wafer taking and delivering method of the dry etching machine is characterized by comprising the following steps of:
A. the dry etching machine table reports the state and type information of each process cavity to a BC system, and each process cavity is provided with an ID serial number;
B. the BC system lists the process cavities in the running/waiting state as effective process cavities, lists the process cavities in the non-running/waiting state as invalid process cavities, sorts the effective process cavities according to the ID serial numbers, obtains corresponding process cavity type sorting according to the sorting, and serves as a basis for the mechanical arm to take corresponding types of products from the panel transplanter according to the sorting circulation of the types;
C. when the panel to be produced is taken from the panel transplanter, the panel to be produced on the panel transplanter is compared one by one according to the sequencing of the types of the effective processing cavities, if a corresponding type product exists, the panel is taken out, and if no corresponding type product exists, the panel is moved to the next type comparison according to the sequencing;
D. if a corresponding type product exists, the mechanical arm directly takes out the panel to be produced from the panel transplanter to an inlet of a cleaning machine table in advance to wait, the wafer exchange is carried out when the production in the cleaning machine table is finished and the wafer needs to be placed in a dry etching machine, and the wafer exchange step is as follows: and a panel taken out of the panel transplanter is placed into the cleaning machine table by one arm of the mechanical arm, the panel taken out of the cleaning machine table is placed into the dry etching machine by the other arm of the robot, the finished panel to be discharged in the dry etching machine is taken out and sent back to the panel transplanter, and then the panel to be produced is taken out in advance and waits at the inlet of the cleaning machine table.
2. The wafer taking and delivering method of the dry etching machine according to claim 1, wherein: if the process cavity state is changed from running/waiting to non-running/waiting in the production process, deleting the effective process cavity and the corresponding process cavity type from the type sequence; if the process chamber state is changed from non-operation/waiting to operation/waiting in the production process, the process chamber and the corresponding process chamber type are added into the type sequence.
3. The wafer taking and delivering method of the dry etching machine according to claim 1, wherein: the panel is composed of a plurality of layers of circuits, different products are named according to each layer of circuit, different products are distinguished by using types, type information is automatically carried to each piece of panel glass by an MES system according to different circuit layers of the whole production of the panel, and the type information needs to be automatically changed when different circuit layers are produced; and then downloading the type information to the BC system along with the data of each piece of panel glass when the panel is transported to a panel transplanter, so that the BC system acquires the type information of each piece of panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910711544.1A CN110429057B (en) | 2019-08-02 | 2019-08-02 | Wafer taking and delivering method for dry etching machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910711544.1A CN110429057B (en) | 2019-08-02 | 2019-08-02 | Wafer taking and delivering method for dry etching machine |
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| CN110429057A CN110429057A (en) | 2019-11-08 |
| CN110429057B true CN110429057B (en) | 2021-05-18 |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW518645B (en) * | 2001-09-24 | 2003-01-21 | Powerchip Semiconductor Corp | Method and system of automatic wafer manufacture quality control |
| TW200418122A (en) * | 2003-03-14 | 2004-09-16 | Applied Materials Inc | Method for controlling a machine for processing wafers |
| CN105336642B (en) * | 2014-07-23 | 2018-08-24 | 北京北方华创微电子装备有限公司 | The method and device of semiconductor equipment cavity state display control |
| CN105470102B (en) * | 2014-09-04 | 2018-08-14 | 中芯国际集成电路制造(上海)有限公司 | A method of improving reative cell service efficiency |
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