CN110379801A - LED lamp bead, display screen - Google Patents
LED lamp bead, display screen Download PDFInfo
- Publication number
- CN110379801A CN110379801A CN201910598747.4A CN201910598747A CN110379801A CN 110379801 A CN110379801 A CN 110379801A CN 201910598747 A CN201910598747 A CN 201910598747A CN 110379801 A CN110379801 A CN 110379801A
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- Prior art keywords
- lamp bead
- led
- area
- led chip
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 80
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a kind of LED lamp beads, display screen, wherein the LED lamp bead, comprising: lamp bead shell, lamp bead bracket, LED chip, in which: the lamp bead bracket is set to the inside of the lamp bead shell, for carrying LED chip；The LED chip, comprising: red LED chips, green LED chip and blue LED die respectively include the PN junction formed by the area P and the area N in each LED chip, wherein relative to the position in the area N, the area P is located closer to the lamp bead bracket；The anode of the anode of the red LED chips, the anode of green LED chip and blue LED die is mutually indepedent.Using the above scheme, brightness requirement can be met in the lower situation of power consumption.
Description
Technical field
The present invention relates to LED field more particularly to a kind of LED lamp beads, display screen.
Background technique
Nowadays, with business development, LED display (LED, light emitting diode, light emitting diode) is answered
With more and more common, LED display is used for advertisement dispensing and commercial propaganda by businessman.
In the prior art, LED display outdoors with semi-outdoor field, since LED lamp bead itself is for the limitation of brightness,
The clarity of LED display can only achieve pel spacing 3mm.And be to reach brightness requirement, increasing is generallyd use in the prior art
The scheme of electric current meets brightness requirement by increasing mould group electric power.But using the above scheme, power consumption is larger, both increases
Add the use cost of electricity consumption, also shortens the service life of LED display in turn.
Summary of the invention
Goal of the invention: being directed to prior art defect, the present invention is intended to provide a kind of LED lamp bead, display screen, are realized in power consumption
It measures in lower situation, guarantees the high brightness of LED display.
Technical solution: a kind of LED lamp bead is provided in the embodiment of the present invention, comprising: lamp bead shell, lamp bead bracket, LED core
Piece, in which: the lamp bead bracket is set to the inside of the lamp bead shell, for carrying LED chip；The LED chip, packet
Include: red LED chips, green LED chip and blue LED die respectively include in each LED chip being formed by the area P and the area N
PN junction, wherein relative to the position in the area N, the area P is located closer to the lamp bead bracket；The anode of the red LED chips,
The anode of green LED chip and the anode of blue LED die are mutually indepedent.
Specifically, the red LED chips, green LED chip and blue LED die are total to cathode.
Specifically, the area P is not provided with the film for increasing electric conductivity in the LED chip.
Specifically, the material of the lamp bead shell, using white mass.
Specifically, the material of the lamp bead shell, using epoxy resin.
Specifically, the area of the red LED chips is 5 × 8mil2~7 × 11mil2, the face of the green LED chip
Product is 5 × 9mil2~7 × 11mil2, the area of the blue LED die is 4 × 7mil2~7 × 11mil2。
Specifically, the red LED chips, driving current is less than 15mA；The green LED chip, driving current are less than
10mA, the blue LED die, driving current are less than 8mA.
Specifically, the lamp bead bracket is copper product, the connecting line between LED chip is copper wire, gold thread, iron wire or alloy
Line.
Specifically, the lamp bead bracket, in bowl-shape, the LED chip is placed in the rim of a bowl.
A kind of LED display is provided in the embodiment of the present invention, the LED lamp bead including any one of the above.
The utility model has the advantages that compared with prior art, the present invention has the following obvious advantages: in the lower situation of power consumption,
Meet brightness requirement.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of LED lamp bead in the embodiment of the present invention；
Fig. 2 is the position view in the area P and the area N in PN junction in the embodiment of the present invention.
Specific embodiment
Technical solution of the present invention is described further with reference to the accompanying drawing.
In the prior art, common LED module has 320*160,192*192,250*250,256*256 equidimension mould group,
The mould group mean power that one pixel is 4096 is in 40w or more, and the screen of one piece of 100 square meter or so is the case where guaranteeing brightness
Lower electricity consumption maximum power is in 100KW or so, every square meter power consumption 1000W.Power consumption is very huge.Therefore, the embodiment of the present invention
One kind is intended to provide in the case where low power consumption, still can guarantee LED lamp bead, the display screen of brightness requirement.
It refering to fig. 1, is the structural schematic diagram of LED lamp bead in the embodiment of the present invention.
A kind of LED lamp bead is provided in the embodiment of the present invention, comprising: lamp bead shell, lamp bead bracket, LED chip, in which: institute
Lamp bead bracket is stated, the inside of the lamp bead shell is set to, for carrying LED chip；The LED chip, comprising: red LED
Chip, green LED chip and blue LED die respectively include the PN junction formed by the area P and the area N in each LED chip, wherein
Relative to the position in the area N, the area P is located closer to the lamp bead bracket；Anode, the green LED chip of the red LED chips
Anode and blue LED die anode it is mutually indepedent.
In specific implementation, the red LED chips, green LED chip and blue LED die include respective PN
Knot, and in three PN junctions, relative to the position in the area N, the position in the area P is all closer to the lamp bead bracket.
In specific implementation, the principle of luminosity of LED chip is, after the anode load forward voltage to LED chip, the area P
It is injected into the hole in the area N and is injected into the electronics in the area P by the area N, near PN junction, the electronics in the area N and the hole-recombination in the area P are produced
The fluorescence of raw spontaneous radiation.
In the prior art, the structure of the total anode of red LED chips, green LED chip and blue LED die is generallyd use,
That is the anode of the anode of red LED chips, the anode of green LED chip and blue LED die is connected to the same public anode.
In this case, usually public anode volume is larger, the small volume of the cathode of each LED chip connection.Therefore, LED
In chip, relative to the position in the area P connecting with anode, the area N connecting with cathode is located closer to lamp bead bracket.And the area P
It generallys use silicon materials to be made, since public anode has the case where dispersion forward voltage, to enhance electric conductivity, need
Conductive transparent film is added in the area P, and conductive transparent film can largely go up the light for stopping PN junction attachment to generate.LED display
Each upper LED lamp bead hinders the promotion of brightness because of conductive transparent film, leads to LED lamp bead in the prior art, aobvious on the whole
Display screen needs higher power consumption just and can satisfy the demand of brightness.
Referring to Fig.2, its position view for the area P and the area N in PN junction in the embodiment of the present invention, wherein be omitted except the area N,
Other component other than PN junction, the area P and lamp bead bracket.
In specific implementation, the interval between the interval between the area P and PN junction, the area N and PN junction, is light emitting region, can be with
It is the electronics in the area N and the hole-recombination in the area P, generates the region of the fluorescence of spontaneous radiation.
In specific implementation, the area P is relative to the area N closer to lamp bead bracket.In the positive, green of the red LED chips
The anode of color LED chip and the anode of blue LED die are mutually indepedent, i.e., anode, the green LED core of the described red LED chips
When the anode of piece and the anode of blue LED die are connected to independent anode, the volume of each anode can be very small,
Therefore the position in the area P connecting with anode can be provided close at lamp bead bracket, while stops light without adding in the area P
Conductive transparent film, so that the brightness of LED lamp bead is significantly promoted in the case where identical power consumption.It is thereby achieved that
In the lower situation of power consumption, guarantee the high brightness of LED display.Electric cost is reduced, the service life of LED display is extended,
More high definition and gorgeous display effect is presented with semi-outdoor outdoors, realizes the pel spacing for reaching 2.5mm.
In the embodiment of the present invention, the red LED chips, green LED chip and blue LED die are total to cathode.
In specific implementation, the cathode of the red LED chips, the cathode of green LED chip and blue LED die is negative
Pole can connect to public cathode, and the volume of public cathode can be larger, and the position in the area N connecting with public cathode is set to far
At lamp bead bracket.
In specific implementation, the cathode of red LED chips may be typically located at the bottom of red LED chips, therefore, Fig. 1
In do not show the cathode connections of red LED chips, it should be noted that cathode, the green LED core of red LED chips
The cathode of piece and the cathode of blue LED die, three can connect to public cathode, have cathode feature altogether.
In the embodiment of the present invention, in the LED chip, the area P is not provided with the film for increasing electric conductivity.
In the embodiment of the present invention, the material of the lamp bead shell, using white mass.
In the embodiment of the present invention, the material of the lamp bead shell, using epoxy resin.
In specific implementation, lamp bead size can for 1.5mm × 1.5mm, 19mm × 21mm, 18mm × 20mm, 21mm ×
21mm equal-specification.
In compared with the existing technology, using the lamp bead shell of black, extinction heat absorption not only hinders light inside lamp bead, together
When anti-uv-ray it is weak, lead to the LED screen body lost of life.And in present invention implementation, outside the lamp bead using white mass production
Shell is white, will not stop the light generated inside lamp bead, will not extinction heat absorption, anti-uv-ray is strong, in identical power consumption
In the case where can promote the brightness of LED lamp bead.And then realize reduction electric cost, extend the service life of LED display, outdoors
More high definition and gorgeous display effect is presented with semi-outdoor.
In specific implementation, white mass can be epoxy resin.
In the embodiment of the present invention, the area of the red LED chips is 5 × 8mil2~7 × 11mil2, the green LED
The area of chip is 5 × 9mil2~7 × 11mil2, the area of the blue LED die is 4 × 7mil2~7 × 11mil2。
In specific implementation, 1mil=1/1000inch=0.0254mm.The area of LED chip is smaller, may be implemented compared with
The LED lamp bead of small size, and then can reduce the pel spacing on LED display, reach the pel spacing of 2.5mm.
In the embodiment of the present invention, the red LED chips, driving current is less than 15mA；The green LED chip, driving
Electric current is less than 10mA, the blue LED die, and driving current is less than 8mA.
In specific implementation, the driving current of each LED chip may be limited to certain level, to reduce power consumption, subtract
Few electric cost, guarantees the service life of LED display.But simultaneously as LED lamp bead internal structure in the embodiment of the present invention
It improves, may be implemented to be limited under certain level even if the driving current in LED chip, LED lamp bead still can satisfy brightness
It is required that more high definition and gorgeous display effect is presented with semi-outdoor outdoors.
In the embodiment of the present invention, the lamp bead bracket is copper product, and the connecting line between LED chip is copper wire, gold thread, iron
Line or alloy wire.In the embodiment of the present invention, the lamp bead bracket, in bowl-shape, the LED chip is placed in the rim of a bowl.
In specific implementation, using bowl-shape lamp bead bracket, i.e., a side of lamp bead bracket is to other side protrusion, by LED core
Piece is placed in the rim of a bowl, can further optically focused, promote the brightness of LED lamp bead, reduce power consumption, reduce electric cost.Specific
In implementation, the driving of LED lamp bead can be carried out using constant-current source drive chips such as 2153 high brush chips.
A kind of LED display is provided in the embodiment of the present invention, including the LED lamp bead provided in the embodiment of the present invention.
In specific implementation, the LED display provided in the embodiment of the present invention, the LED display function that pixel is 4096
Rate is 18w, and every square metre is 700w, and in the prior art, and the LED display power that pixel is 4096 is 40w, every square metre
For 1000w, power consumption is greatly lowered, reduces electric cost.Simultaneously because conductive transparent film is not added, white material production
The light transmission of lamp bead shell is strong, and has very strong anti-uv-ray.Therefore, the luminous efficiency of lamp bead is high, and brightness can
To reach 4000cd or more.
Claims (10)
1. a kind of LED lamp bead characterized by comprising lamp bead shell, lamp bead bracket, LED chip, in which:
The lamp bead bracket is set to the inside of the lamp bead shell, for carrying LED chip；
The LED chip, comprising: red LED chips, green LED chip and blue LED die are wrapped respectively in each LED chip
Include the PN junction formed by the area P and the area N, wherein relative to the position in the area N, the area P is located closer to the lamp bead bracket；
The anode of the anode of the red LED chips, the anode of green LED chip and blue LED die is mutually indepedent.
2. LED lamp bead according to claim 1, which is characterized in that the red LED chips, green LED chip and blue
LED chip is total to cathode.
3. LED lamp bead according to claim 2, which is characterized in that in the LED chip, the area P is not provided with leading for increasing
The film of electrical property.
4. LED lamp bead according to claim 1, which is characterized in that the material of the lamp bead shell, using white mass.
5. LED lamp bead according to claim 4, which is characterized in that the material of the lamp bead shell, using epoxy resin.
6. LED lamp bead according to claim 1, which is characterized in that the area of the red LED chips is 5 × 8mil2~7
×11mil2, the area of the green LED chip is 5 × 9mil2~7 × 11mil2, the area of the blue LED die is 4 ×
7mil2~7 × 11mil2。
7. LED lamp bead according to claim 1, which is characterized in that the red LED chips, driving current are less than 15mA；
The green LED chip, driving current are less than 10mA, the blue LED die, and driving current is less than 8mA.
8. LED lamp bead according to claim 1, which is characterized in that the lamp bead bracket is copper product, between LED chip
Connecting line be copper wire, gold thread, iron wire or alloy wire.
9. LED lamp bead according to claim 1, which is characterized in that the lamp bead bracket, in bowl-shape, the LED chip is set
In in the rim of a bowl.
10. a kind of LED display, including LED lamp bead described in any one according to claim 1~9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910598747.4A CN110379801A (en) | 2019-07-04 | 2019-07-04 | LED lamp bead, display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910598747.4A CN110379801A (en) | 2019-07-04 | 2019-07-04 | LED lamp bead, display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110379801A true CN110379801A (en) | 2019-10-25 |
Family
ID=68251912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910598747.4A Pending CN110379801A (en) | 2019-07-04 | 2019-07-04 | LED lamp bead, display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110379801A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766450A (en) * | 1993-08-27 | 1995-03-10 | Matsushita Electron Corp | Light emitting diode device and its manufacture |
| US20060071228A1 (en) * | 2004-10-06 | 2006-04-06 | Lumileds Lighting U.S., Llc | Contact and omnidirectional reflective mirror for flip chipped light emitting devices |
| CN105869524A (en) * | 2016-04-29 | 2016-08-17 | 中山市宏晟祥光电照明科技有限公司 | Luminous efficacy enhanced type display screen module provided with LED lamp beads |
| CN107705723A (en) * | 2017-11-24 | 2018-02-16 | 山西高科华烨电子集团有限公司 | All-colour LED surface mount device |
| CN207880765U (en) * | 2017-11-21 | 2018-09-18 | 深圳市鑫业新光电有限公司 | A kind of RGB paster LEDs lamp bead |
| CN210052741U (en) * | 2019-07-04 | 2020-02-11 | 南京宇丰晔禾信息科技有限公司 | LED lamp bead and display screen |
-
2019
- 2019-07-04 CN CN201910598747.4A patent/CN110379801A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766450A (en) * | 1993-08-27 | 1995-03-10 | Matsushita Electron Corp | Light emitting diode device and its manufacture |
| US20060071228A1 (en) * | 2004-10-06 | 2006-04-06 | Lumileds Lighting U.S., Llc | Contact and omnidirectional reflective mirror for flip chipped light emitting devices |
| CN105869524A (en) * | 2016-04-29 | 2016-08-17 | 中山市宏晟祥光电照明科技有限公司 | Luminous efficacy enhanced type display screen module provided with LED lamp beads |
| CN207880765U (en) * | 2017-11-21 | 2018-09-18 | 深圳市鑫业新光电有限公司 | A kind of RGB paster LEDs lamp bead |
| CN107705723A (en) * | 2017-11-24 | 2018-02-16 | 山西高科华烨电子集团有限公司 | All-colour LED surface mount device |
| CN210052741U (en) * | 2019-07-04 | 2020-02-11 | 南京宇丰晔禾信息科技有限公司 | LED lamp bead and display screen |
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