CN110347293B - Bonding process of touch device - Google Patents
Bonding process of touch device Download PDFInfo
- Publication number
- CN110347293B CN110347293B CN201910650727.7A CN201910650727A CN110347293B CN 110347293 B CN110347293 B CN 110347293B CN 201910650727 A CN201910650727 A CN 201910650727A CN 110347293 B CN110347293 B CN 110347293B
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- panel
- bonding
- adhesive
- liquid optical
- pyrolysis
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a bonding process of a touch device, which comprises the following steps: providing a first panel, and bonding a UV de-bonding adhesive strip or a pyrolysis adhesive strip to the edge of the first panel, wherein the UV de-bonding adhesive strip or the pyrolysis adhesive strip encloses to form a shielding part, and the shielding part is provided with a glue filling opening; providing a second panel, laminating and attaching the second panel and the first panel, wherein an accommodating cavity is formed by the first panel, the shielding part and the second panel, and liquid optical cement is filled into the accommodating cavity from the glue filling port; carrying out UV curing treatment on the liquid optical adhesive, and debonding the UV debonding adhesive strips or the pyrolysis adhesive strips; and removing the UV de-bonding strips or the pyrolysis bonding strips. The bonding process of the touch device utilizes the UV de-bonding strip or the shielding part formed by the de-bonding strip to limit the flowing position of the liquid optical cement, so as to prevent the overflow of the cement. And, reserve the space at the laminating edge of first panel and second panel, satisfy product design demand.
Description
Technical Field
The invention relates to the technical field of touch panel preparation, in particular to a bonding process of a touch device.
Background
In the manufacturing process of the touch panel, the cover plate and the Film sensor (touch sensor) are usually bonded by using liquid optical cement, wherein in the bonding process, three modes of Dispensing, Slit Coat and Underfill are mainly adopted for coating the liquid optical cement, but the three liquid optical cement coating modes can not effectively control the flowing position of the cement, and can not meet the requirements of margin reservation of the bonding surface, glue overflow control and the like.
Disclosure of Invention
Therefore, it is necessary to provide a bonding process for a touch device to solve the problem that the liquid optical adhesive coating process cannot effectively control the flowing position of the adhesive material.
The invention provides a bonding process of a touch device, which comprises the following steps:
providing a first panel, and bonding a UV de-bonding adhesive strip or a pyrolysis adhesive strip to the edge of the first panel, wherein the UV de-bonding adhesive strip or the pyrolysis adhesive strip encloses to form a shielding part, and the shielding part is provided with a glue filling opening;
providing a second panel, laminating and attaching the second panel and the first panel, wherein an accommodating cavity is formed by the first panel, the shielding part and the second panel, and liquid optical cement is filled into the accommodating cavity from the glue filling port;
carrying out UV curing treatment on the liquid optical adhesive, and debonding the UV debonding adhesive strips or the pyrolysis adhesive strips;
and removing the UV de-bonding strips or the pyrolysis bonding strips.
According to the laminating process of the touch device, in the glue filling process, the flow position of the liquid optical glue is limited by the UV de-gluing strip or the shielding part formed by the UV de-gluing strip, so that the glue overflow is prevented. In addition, UV viscose strip or pyrolysis viscose strip are separated and are glued the convenient back and get rid of, and can not appear remaining to reserve the space at the laminating edge of first panel and second panel, satisfy product design demand.
The invention also provides a bonding process of the touch device, which comprises the following steps:
providing a first panel, adhering a UV or pyrolytic adhesive strip to an edge of the first panel and forming an annular structure;
coating liquid optical cement on the area of the first panel, which is positioned in the annular structure;
providing a second panel, and laminating the second panel and the first panel;
carrying out UV curing treatment on the liquid optical cement;
performing de-bonding treatment on the UV de-bonding adhesive tape or the pyrolysis adhesive tape;
and removing the UV de-bonding strips or the pyrolysis bonding strips.
In one embodiment, the step of performing UV curing treatment on the liquid optical adhesive, and the step of performing de-bonding treatment on the UV de-bonding adhesive tape or the pyrolytic adhesive tape includes: and irradiating ultraviolet light on the liquid optical cement and the UV debonding strip to solidify the liquid optical cement and simultaneously debond the UV debonding strip.
In one embodiment, the debonding exposure energy of the UV debonding adhesive strip is 400-3000 mJ/cm2。
In one embodiment, the exposure energy of the liquid optical adhesive is 200-3000 mJ/cm2。
In one embodiment, the step of performing UV curing treatment on the liquid optical adhesive, and the step of performing de-bonding treatment on the UV de-bonding adhesive tape or the pyrolytic adhesive tape includes: and carrying out UV curing treatment on the liquid optical cement, and carrying out heating pyrolysis and adhesion on the pyrolysis adhesive tape.
In one embodiment, the debonding conditions of the pyrolytic adhesive tape are as follows: the temperature is 100-120 ℃, and the duration is more than 1 min.
In one embodiment, the first panel is a cover glass, and the second panel is a touch sensing panel; or, the first panel is a touch panel and the second panel is a display panel.
In one embodiment, the touch device is a 2D touch screen.
In one embodiment, the touch device is a 2D or 3D touch screen.
Drawings
FIG. 1 is a flow chart illustrating a bonding process of a touch device according to a first embodiment;
FIG. 2 is a schematic structural view of a first panel and a shielding portion in the first embodiment;
FIG. 3 is a schematic structural diagram of a first panel and a ring structure of a touch device in a second embodiment;
FIG. 4a is a cross-sectional view of a first panel and a ring structure of a touch device according to another embodiment;
FIG. 4b is a cross-sectional view of the touch device shown in FIG. 4a after dispensing;
FIG. 4c is a cross-sectional view of the touch device shown in FIG. 4b after the first panel and the second panel are bonded together;
fig. 4d is a cross-sectional view of the touch device shown in fig. 4c with the UV release adhesive strips or the thermal release adhesive strips removed.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The glass cover plate of the touch device and the touch sensor are generally bonded by liquid optical cement, and the scheme of the invention is designed aiming at the problem of glue overflow in the bonding process.
In the first embodiment, the bonding is performed by glue filling. Referring to fig. 1, the bonding process of the touch device includes the following steps:
s110: referring to fig. 2, a first panel 10 is provided, a UV debonding adhesive strip or a pyrolytic adhesive strip is bonded to an edge of the first panel 10, the UV debonding adhesive strip or the pyrolytic adhesive strip encloses to form a shielding portion 20, and the shielding portion 20 is provided with a glue filling opening 21;
s120: providing a second panel, laminating the second panel and the first panel 10, wherein the first panel 10, the shielding part 20 and the second panel form an accommodating cavity, and filling liquid optical cement into the accommodating cavity through a glue filling opening 21;
s130: carrying out UV curing treatment on the liquid optical cement;
s140: performing debonding treatment on the UV debonding adhesive tape or the pyrolysis adhesive tape;
s150: and removing the UV viscose stripping or the pyrolysis viscose stripping.
In the bonding process of the touch device, the flow position of the liquid optical cement is limited by the shielding part 20 formed by the UV or pyrolytic adhesive tape in the glue filling process, so that the glue overflow is prevented. In addition, UV viscose strip or pyrolysis viscose strip are separated and are glued the convenient back and get rid of, and can not appear remaining to reserve the space at the laminating edge of first panel 10 and second panel, satisfy product design demand.
Before the attaching process, the UV debonding adhesive strip or the pyrolytic adhesive strip is obtained by cutting, wherein the minimum width of the UV debonding adhesive strip or the pyrolytic adhesive strip is 200 +/-10 mu m, and the thickness of the UV debonding adhesive strip is 25-250 mu m. Wherein, the thickness of the UV debonding adhesive strip or the pyrolytic adhesive strip should be consistent with the width of the preset gap of the attaching edge of the first panel 10 and the second panel.
In one embodiment, steps S130 and S140 are performed simultaneously, specifically, ultraviolet light is irradiated on the liquid optical cement and the UV debonding strip to cure the liquid optical cement and debond the UV debonding strip at the same time. Namely, when the liquid optical cement is subjected to ultraviolet curing treatment, the UV debonding adhesive strips realize debonding, so that the production flow is simplified, and the production efficiency is improved.
It should be noted that the curing energy of the liquid optical adhesive is approximately equal to the debonding exposure energy of the UV debonding adhesive tape.
The liquid optical cement is ultraviolet light hardening resin which can be acrylic, polyurethane, silica gel or epoxy resin, and the exposure energy is 200-3000 mJ/cm2。
The components of the UV debonding glue strip include a base copolymer, a cross-linking agent, an oligomer and a photoinitiator. The debonding exposure energy is 400-3000 mJ/cm2. The principle of debonding of the UV debonding adhesive strip is that after ultraviolet irradiation, the polymer chains therein form a three-dimensional network structure and are hardened, so that the adhesive force is rapidly reduced, and the UV debonding adhesive strip can be conveniently and cleanly stripped.
In other embodiments, steps S130 and S140 are performed separately, specifically, after the liquid optical adhesive is subjected to the UV curing treatment, the pyrolytic adhesive tape is subjected to thermal bonding.
The components of the pyrolysis adhesive tape comprise a basic copolymer, a cross-linking agent and a thermal expansion microcapsule, wherein the pyrolysis adhesive tape is subjected to a heating temperature of 100-120 ℃ and a duration time of more than 1 min. According to the experimental detection result, the higher the heating temperature is, the shorter the heating time is required for debonding. In order to avoid the deformation of the first panel or the second panel caused by the overhigh heating temperature, the heating temperature is controlled within the range of 100-120 ℃, and the heating time is correspondingly prolonged to more than 1 min.
In some embodiments, the first panel 10 is a cover glass and the second panel is a touch sensing panel. In other embodiments, the first panel 10 is a touch panel, which may be a touch sensor structure fabricated on a cover glass, and the second panel is a display panel.
The touch device is a 2D touch screen, and correspondingly, the first panel 10 and the second panel are both of a planar structure, so that liquid optical cement can be conveniently diffused in a containing cavity formed by the first panel 10, the shielding part 20 and the second panel in a surrounding mode.
In the second embodiment, the bonding is performed by dispensing. Specifically, the bonding process of the touch device comprises the following steps:
s200: referring to fig. 3, a first panel 10 is provided, and a UV or thermal release adhesive tape is adhered to an edge of the first panel 10 to form a ring structure 30;
s210: coating liquid optical cement on the first panel 10;
s220: providing a second panel, and laminating the second panel and the first panel 10;
s230: carrying out UV curing treatment on the liquid optical cement;
s240: performing debonding treatment on the UV debonding adhesive tape or the pyrolysis adhesive tape;
s250: and removing the UV viscose stripping or the pyrolysis viscose stripping.
In the above attaching process of the touch device, during dispensing, the UV-release adhesive strip or the ring structure 30 formed by the UV-release adhesive strip limits the flowing position of the liquid optical adhesive, thereby preventing the overflow of the adhesive. After the liquid optical cement is cured, the UV adhesive debonding strips or the pyrolytic adhesive debonding strips are easy to remove and can not be left, so that gaps are reserved at the attaching edges of the first panel 10 and the second panel, and the product design requirements are met.
In one embodiment, steps S230 and S240 are performed simultaneously, specifically, ultraviolet light is irradiated on the liquid optical cement and the UV debonding strip to cure the liquid optical cement and debond the UV debonding strip at the same time. Namely, when the liquid optical cement is subjected to ultraviolet curing treatment, the UV debonding adhesive strips realize debonding, so that the production flow is simplified, and the production efficiency is improved.
The debonding exposure energy of the UV debonding strip is 400-3000 mJ/cm2. The curing energy of the liquid optical cement is approximately equal to the debonding exposure energy of the UV debonding adhesive strips.
In other embodiments, steps S230 and S240 are performed separately, specifically: and after the liquid optical adhesive is subjected to UV curing treatment, the pyrolytic adhesive tape is subjected to heating pyrolysis adhesion.
The components of the pyrolysis adhesive tape comprise a basic copolymer, a cross-linking agent and a thermal expansion microcapsule, wherein the pyrolysis adhesive tape is subjected to a heating temperature of 100-120 ℃ and a duration time of more than 1 min. According to the experimental detection result, the higher the heating temperature is, the shorter the heating time is required for debonding. In order to avoid the deformation of the first panel or the second panel caused by the overhigh heating temperature, the heating temperature is controlled within the range of 100-120 ℃, and the heating time is correspondingly prolonged to more than 1 min.
The touch device is a 2D or 3D touch screen.
For the 3D touch screen, the first panel 10 is a 3D cover plate, and the material of the 3D cover plate may be glass, metal, phenolic resin or other high molecular materials (such as PET, PI, PEN, PC, ABS, etc.).
Referring to fig. 4a, the 3D cover plate includes a main body 11 and bending portions 12 disposed around the main body 11, the bending portions 12 and the main body 11 form an included angle, and the bonding process of the 3D cover plate is as follows:
s200: forming the UV de-glued or de-glued strips into a loop 30 inside the bend 12;
s210: applying a liquid optical glue 40 on the first panel 10 to obtain the structure shown in fig. 4 b;
s220: providing a second panel 50, laminating and attaching the second panel 50 and the first panel 10 to obtain a structure shown in fig. 4 c;
s230: carrying out UV curing treatment on the liquid optical cement 40;
s240: performing debonding treatment on the UV debonding adhesive tape or the pyrolysis adhesive tape;
s250: the UV or pyrolytic adhesive strips are removed to obtain the structure shown in fig. 4d, wherein the first panel 10 and the second panel 50 are bonded together by the liquid optical adhesive 40, and the joint edges of the first panel 10 and the second panel 50 are formed with the gap 60.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A bonding process of a touch device is characterized by comprising the following steps:
providing a first panel, and bonding a UV de-bonding adhesive strip or a pyrolysis adhesive strip to the edge of the first panel, wherein the UV de-bonding adhesive strip or the pyrolysis adhesive strip encloses to form a shielding part, and the shielding part is provided with a glue filling opening;
providing a second panel, laminating and attaching the second panel and the first panel, wherein an accommodating cavity is formed by the first panel, the shielding part and the second panel, and liquid optical cement is filled into the accommodating cavity from the glue filling port;
carrying out UV curing treatment on the liquid optical cement;
performing de-bonding treatment on the UV de-bonding adhesive tape or the pyrolysis adhesive tape;
and removing the UV de-bonding strips or the pyrolysis bonding strips.
2. A bonding process of a touch device is characterized by comprising the following steps:
providing a first panel, adhering a UV or pyrolytic adhesive strip to an edge of the first panel and forming an annular structure;
coating liquid optical cement on the area of the first panel, which is positioned in the annular structure;
providing a second panel, and laminating the second panel and the first panel;
carrying out UV curing treatment on the liquid optical cement;
performing de-bonding treatment on the UV de-bonding adhesive tape or the pyrolysis adhesive tape;
and removing the UV de-bonding strips or the pyrolysis bonding strips.
3. The bonding process according to claim 1 or 2, wherein the step of performing UV curing treatment on the liquid optical adhesive and the step of performing de-bonding treatment on the UV de-bonding adhesive tape or the pyrolytic adhesive tape comprises: and irradiating ultraviolet light on the liquid optical cement and the UV debonding strip to solidify the liquid optical cement and simultaneously debond the UV debonding strip.
4. The bonding process according to claim 3, wherein the debonding exposure energy of the UV debonding adhesive tape is 400-3000 mJ/cm2。
5. The bonding process according to claim 3, wherein the exposure energy of the liquid optical adhesive is 200-3000 mJ/cm2。
6. The bonding process according to claim 1 or 2, wherein the step of performing UV curing treatment on the liquid optical adhesive and the step of performing de-bonding treatment on the UV de-bonding adhesive tape or the pyrolytic adhesive tape comprises: and carrying out UV curing treatment on the liquid optical cement, and carrying out heating pyrolysis and adhesion on the pyrolysis adhesive tape.
7. The bonding process according to claim 6, wherein the debonding conditions of the pyrolytic adhesive tape are as follows: the temperature is 100-120 ℃, and the duration is more than 1 min.
8. The bonding process according to claim 1, wherein the first panel is a cover glass, and the second panel is a touch sensing panel; or, the first panel is a touch panel and the second panel is a display panel.
9. The bonding process according to claim 1, wherein the touch device is a 2D touch screen.
10. The bonding process according to claim 2, wherein the touch device is a 2D or 3D touch screen.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910650727.7A CN110347293B (en) | 2019-07-18 | 2019-07-18 | Bonding process of touch device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910650727.7A CN110347293B (en) | 2019-07-18 | 2019-07-18 | Bonding process of touch device |
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| CN110347293A CN110347293A (en) | 2019-10-18 |
| CN110347293B true CN110347293B (en) | 2022-04-22 |
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| CN111381341B (en) * | 2020-05-18 | 2022-04-12 | 业成科技（成都）有限公司 | Method for attaching lens group |
| CN115132065B (en) * | 2022-07-18 | 2024-04-16 | 业成光电（深圳）有限公司 | Bonding method |
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| CN105739181B (en) * | 2016-04-28 | 2019-01-22 | 武汉华星光电技术有限公司 | The production method of the production method and backlight module of mouth word glue, mouth word glue |
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| CN102529295A (en) * | 2010-12-31 | 2012-07-04 | 比亚迪股份有限公司 | Method for bonding capacitance type touch screen substrate |
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