CN110323324B - LED board and display device - Google Patents
LED board and display device Download PDFInfo
- Publication number
- CN110323324B CN110323324B CN201910515771.7A CN201910515771A CN110323324B CN 110323324 B CN110323324 B CN 110323324B CN 201910515771 A CN201910515771 A CN 201910515771A CN 110323324 B CN110323324 B CN 110323324B
- Authority
- CN
- China
- Prior art keywords
- pad
- gap
- positive
- negative
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 abstract description 45
- 238000012423 maintenance Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 239000003292 glue Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 6
- 238000004590 computer program Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED (light-emitting diode) board and a display device, which are used for solving the problem of low production efficiency in the production process of a MiniLED board in the prior art. The LED plate comprises a substrate and an LED chip formed on the substrate, wherein a bonding pad assembly corresponding to the LED chip is arranged on the substrate, the LED chip and the bonding pad assembly are mutually corresponding, at least two sizes of bonding pad gaps are formed between a positive bonding pad group and a negative bonding pad group contained in the bonding pad assembly, and the LED chip is welded on the bonding pad assembly through one size of the bonding pad gaps. Because the pad gaps with at least two sizes exist, the pad gap with one size can be selected from the pad gaps with at least two sizes, and the LED chip is welded on the pad component through the pad gap with one selected size, so that poor welding is reduced, and the production efficiency is improved; when in maintenance, the gap between the other welding discs is directly maintained, so that the maintenance difficulty is reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to an LED (light emitting diode) plate and a display device.
Background
The Mini LED (Mini Light Emitting Diode) has become a current hot spot in LCD (Liquid Crystal Display) Display as a backlight, which is different from the conventional backlight scheme adopting a Light guide plate side-in type in Liquid Crystal Display, and a large amount of Mini LED Crystal grains are adopted as a backlight source, so that the scheme has the advantages of adjustable regional brightness, high color rendering and high contrast, and can achieve an 8K Display effect. Multi-segmented dynamic backlighting due to high peak brightness LEDs facilitates improved display contrast and high dynamic range. Therefore, the Mini LED is used as a backlight technology in a variety of fields such as televisions, mobile phones, and in-vehicle displays.
The Mini LED chip needs to be soldered to the substrate to form the Mini LED panel. In the welding process, if the pad pitch for welding the Mini LED chip is equal to the pad pitch for welding the Mini LED chip, poor welding of cold joint or continuous welding is less; if the pad pitch on the substrate is smaller than or larger than the pad pitch of the Mini LED chip, poor welding of cold joint or continuous welding occurs, and the production efficiency is seriously influenced.
Because the allowable error of the pad pitch in the manufacturing process of the substrate is +/-20%, the substrate batches are different, and the pad pitch of the substrate may be equal to, smaller than or larger than that of the Mini LED chip.
In addition, after the Mini LED chip is pasted, glue dispensing protection is needed, if the LED board is poor, glue on the LED chip needs to be removed when the poor LED board is repaired, and then the LED board is welded again, so that the maintenance difficulty is further increased, and the production efficiency is influenced.
In summary, the production efficiency is low in the production process of the existing Mini LED board.
Disclosure of Invention
The invention provides an LED plate and a display device, which are used for solving the problem of low production efficiency in the production process of a Mini LED plate in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, an embodiment of the present invention provides an LED board, where the LED board includes a substrate and an LED chip formed on the substrate, and a pad assembly corresponding to the LED chip is disposed on the substrate; wherein, in a pair of LED chip and the bonding pad subassembly that corresponds each other:
the welding pad assembly comprises a positive welding pad group and a negative welding pad group, wherein welding pad gaps of at least two sizes are formed between the positive welding pad group and the negative welding pad group;
the LED chip is welded on the welding disc component through a welding disc gap with one size.
The LED plate comprises a substrate and an LED chip formed on the substrate, wherein the substrate is provided with a pad assembly corresponding to the LED chip, the LED chip and the pad assembly are mutually corresponding, the pad assembly comprises a positive pad group and a negative pad group, pad gaps of at least two sizes are formed between the positive pad group and the negative pad group, and the LED chip is welded on the pad assembly through the pad gap of one size. Because the positive electrode bonding pad group and the negative electrode bonding pad group in each bonding pad assembly form bonding pad gaps with at least two sizes, the bonding pad gap with one size can be selected from the bonding pad gaps with at least two sizes, and the LED chip is welded on the bonding pad assembly through the bonding pad gap with one selected size, so that poor welding is reduced, and the production efficiency is improved; in addition, glue on the LED chip is not required to be removed during maintenance, and a new LED chip is directly welded on the welding disc assembly through other welding disc gaps, so that the maintenance difficulty is reduced, and the production efficiency is improved.
Further, in the pad assembly, the positive pad group includes a first positive pad and a second positive pad, and the negative pad group includes a first negative pad and a second negative pad, wherein a second pad gap formed by the second positive pad and the second negative pad is set to be 75% -85% of a first pad gap formed by the first positive pad and the first negative pad; or
The second pad gap is set to be 115% to 125% of the first pad gap.
The LED board comprises two groups of bonding pads, the gaps of the two groups of bonding pads are different, so that in the welding process, one group of bonding pads in the two groups of gaps can be selected for welding, a group of bonding pads closest to the gaps of the bonding pads of the LED chip is selected, the occurrence of poor welding is reduced, and the production efficiency is improved.
Further, in the pad assembly, the positive pad group includes a first positive pad, a second positive pad and a third positive pad, and the negative pad group includes a first negative pad, a second negative pad and a third negative pad, wherein a second pad gap formed by the second positive pad and the second negative pad is smaller than a first pad gap formed by the first positive pad and the first negative pad, and a third pad gap formed by the third positive pad and the third negative pad is larger than the first pad gap.
According to the LED board, the bonding pad assembly comprises three groups of bonding pads, the gap between the second group of bonding pads is smaller than the gap between the first group of bonding pads, the gap between the third group of bonding pads is larger than the gap between the first group of bonding pads, a group of bonding pads closest to the gap between the LED bonding pads can be selected for welding from the three groups of bonding pads in the welding process, the phenomenon of poor welding is reduced, and therefore production efficiency is improved.
Further, the second pad gap is set to be 75% -85% of the first pad gap;
the third pad gap is set to be 115% to 125% of the first pad gap.
In the LED board, since the allowable error of the substrate is ± 20% in the manufacturing process, the second pad gap may be set to 75% to 85% of the first pad gap, and the third pad gap may be set to 115% to 125% of the first pad gap, so that the three sets of pad gaps are closer to the pad gaps of the LEDs.
Further, the first positive pad, the second positive pad and the third positive pad are arranged on the same straight line; or
The first negative electrode bonding pad, the second negative electrode bonding pad and the third negative electrode bonding pad are arranged on the same straight line.
Above-mentioned LED board, when a bonding pad subassembly has three kinds of pad clearances, all anodal bonding pads in three kinds of pad clearances can be on same straight line, or all negative pole bonding pads in three kinds of pad clearances can be on same straight line to make things convenient for welding process to confirm the pad clearance.
Further, the first positive electrode bonding pad and the first negative electrode bonding pad are symmetrically arranged by taking a straight line as a symmetrical line;
the second anode bonding pad and the second cathode bonding pad are symmetrically arranged;
the third positive electrode bonding pad and the third negative electrode bonding pad are symmetrically arranged.
According to the LED board, when three pad gaps exist in one pad assembly, the positive pad and the negative pad in any pad gap can be symmetrically arranged by taking a straight line as a symmetrical line, so that the pad gaps can be conveniently determined in the welding process.
Further, the first positive pad, the second positive pad and the third positive pad are connected by a trace; and/or
The first negative electrode bonding pad, the second negative electrode bonding pad and the third negative electrode bonding pad are connected through wiring.
In the LED board and the bonding pad assembly with three bonding pad gaps, all the positive bonding pads are connected together, and all the negative bonding pads are connected together, specifically, the positive bonding pads and the negative bonding pads can be connected through routing, so that the LEDs can be welded to one group of bonding pads selected from the bonding pad assembly for welding.
Further, in the pad assembly, the positive pad group includes a positive pad, the negative pad group includes a first negative pad, a second negative pad and a third negative pad, wherein a second pad gap formed by the positive pad and the second negative pad is smaller than a first pad gap formed by the positive pad and the first negative pad, and a third pad gap formed by the positive pad and the third negative pad is larger than the first pad gap.
Above-mentioned LED board, among the pad subassembly, can include an anodal pad, three negative pole pad, constitute three kinds of pad clearances between anodal pad and the three negative pole pad, wherein, second pad clearance is less than first pad clearance, and third pad clearance is greater than first pad clearance to can select a group to weld from three groups of pads, select a set of pad that is closest to LED pad clearance, reduce the bad phenomenon of welding and take place, thereby improve production efficiency.
Further, any one of the pads in the pad assembly is rectangular and/or trapezoidal.
The LED board has two pad shapes, which can be rectangular, trapezoidal or a combination of rectangular and trapezoidal shapes.
In a second aspect, an embodiment of the present invention provides a method for manufacturing an LED board, where the method includes:
determining a chip pad gap between an anode pad and a cathode pad in an LED chip and at least two sizes of pad gaps formed between an anode pad group and a cathode pad group in a pad assembly corresponding to the LED chip, wherein the pad assembly is arranged on a substrate and corresponds to the LED chip; the welding disc assembly comprises the positive welding disc set and the negative welding disc set;
selecting a pad gap closest to the chip pad gap in the pad assembly to correspond to the chip pad gap according to the determined chip pad gap and the pad gap in the pad assembly;
and welding the LED chip on the welding disc component through the selected welding disc gap which is closest to the chip welding disc gap.
The method comprises the steps of firstly determining a chip pad gap between an anode pad and a cathode pad of an LED chip and a pad gap with at least two sizes formed by an anode pad group and a cathode pad group in a pad component corresponding to the LED, then selecting the pad gap closest to the chip pad gap in the pad component according to the determined chip pad gap and the pad gap in the pad component, and finally welding the LED chip on the pad component through the selected pad gap closest to the chip pad gap. Because the positive electrode pad group and the negative electrode pad group in each pad assembly form at least two sizes of pad gaps, one size of pad gap can be selected from the at least two sizes of pad gaps, the selected one size of pad gap is closest to the chip pad gap, and the LED chip is welded on the substrate through the selected pad gap closest to the chip pad gap, so that poor welding is reduced, and the production efficiency is improved; in addition, because the bonding pad assembly has bonding pad gaps with at least two sizes, glue on the LED chip is not required to be removed during maintenance, and a new LED chip is directly welded on the bonding pad assembly through other bonding pad gaps, so that the welding difficulty is reduced, and the production efficiency is improved.
In a third aspect, an embodiment of the present invention provides a display device, which includes the LED board provided in the technical solution of the first aspect.
The display device comprises the LED board in the first aspect, so poor welding and maintenance difficulty can be reduced, and production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic diagram of a Mini LED backlight display circuit;
FIG. 2 is a schematic diagram of a pad and a pad gap on a substrate;
FIG. 3 is a schematic structural diagram of an LED board according to the present invention;
FIG. 4 is a first pad layout according to an embodiment of the present invention;
FIG. 5 is a second pad layout according to an embodiment of the present invention;
FIG. 6 shows a third pad configuration provided in accordance with an embodiment of the present invention;
FIG. 7 is a fourth pad layout according to an embodiment of the present invention;
fig. 8 is a fifth pad layout manner according to the embodiment of the present invention;
fig. 9 shows a sixth pad configuration provided in the embodiment of the present invention;
fig. 10 shows a seventh pad configuration according to the embodiment of the present invention;
fig. 11 shows an eighth pad configuration according to the embodiment of the present invention;
fig. 12 shows a ninth pad layout according to an embodiment of the invention;
fig. 13 shows a tenth pad layout according to the embodiment of the invention;
fig. 14 shows an eleventh pad layout manner according to the embodiment of the invention;
fig. 15 shows a twelfth pad layout manner according to the embodiment of the invention;
fig. 16 shows a thirteenth pad layout manner according to the embodiment of the present invention;
fig. 17 is a schematic flow chart of a method for manufacturing an LED board according to an embodiment of the present invention.
Icon: 1-a substrate; 2-LED chip; 10-a pad assembly; 100-positive electrode pad group; 101-negative electrode pad group.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The Mini LED backlight board is arranged in a subarea mode, the Mini LEDs in the subarea are connected in series, and the subareas are connected in parallel, if one Mini LED is not welded well, all the Mini LEDs in the subarea are not lighted.
Fig. 1 is a schematic structural diagram of a schematic diagram of a Mini LED backlight display circuit. In fig. 1, only a part of the schematic diagram of the Mini LED backlight circuit is shown, and as can be seen from fig. 1, the Mini LED backlight display circuit is divided into four zones, each zone is connected in parallel, and 4 Mini LEDs are connected in series in each zone.
The main reason why the Mini LED in the Mini LED backlight board is not bright is due to cold joint and continuous joint caused by gap (gap) size error between the bonding pads on the substrate, so that the production efficiency is greatly reduced. If the Mini LED on the LED board is not bright, the Mini LED board needs to be repaired, and when a bad LED board is repaired, glue on the Mini LED chip needs to be removed and then welded again because glue dispensing protection is needed after the Mini LED chip is pasted and installed, so that the maintenance difficulty is further increased, and the production efficiency is also influenced.
Fig. 2 is a schematic diagram of a pad and a pad gap on a substrate. As shown in fig. 2, one LED chip corresponds to one group of pads, and includes one positive pad and one negative pad, and a pad gap between the positive pad and the negative pad is fixed. If the gap of the bonding pad has errors, the LED chip can only be welded on the group of bonding pads, so that the welding reject ratio is increased, the production efficiency is reduced, and when the defects are repaired, the LED chip on the bonding pad can only be removed, and a new LED chip is welded on the group of bonding pads.
If an LED chip can correspond to at least two groups of bonding pads on the substrate, and a bonding pad gap with at least two sizes is formed between the at least two groups of bonding pads, then in the welding process of the LED chip, a group of bonding pads can be selected from the two groups of bonding pads for welding, so that poor welding caused by bonding pad errors on the substrate can be reduced, when poor repairing is carried out, new LED chips can be directly welded on the bonding pad component through other bonding pad gaps, the difficulty of poor repairing can be reduced, and the production efficiency is improved.
The application scenario described in the embodiment of the present application is for more clearly illustrating the technical solution of the embodiment of the present application, and does not form a limitation on the technical solution provided in the embodiment of the present application, and it can be known by a person skilled in the art that with the occurrence of a new application scenario, the technical solution provided in the embodiment of the present application is also applicable to similar technical problems.
To address the above scenario, a schematic structural diagram of an LED board is provided for the present application, and specifically as shown in fig. 3, the LED board includes: the LED chip module comprises a substrate 1 and an LED chip 2 formed on the substrate, wherein a pad component 10 corresponding to the LED chip 2 is arranged on the substrate 1; wherein, in a pair of LED chip 2 and pad assembly 10 corresponding to each other:
the pad assembly 10 comprises a positive pad group 100 and a negative pad group 101, wherein pad gaps of at least two sizes are formed between the positive pad group 100 and the negative pad group 101;
the LED chip 2 is bonded to the pad assembly 10 through one of the pad gaps.
The LED board provided by the above embodiment of the invention, as shown in fig. 3, includes a substrate 1 and an LED chip 2 formed on the substrate 1, a pad assembly 10 corresponding to the LED chip 2 is disposed on the substrate 1, and in a pair of the LED chip 2 and the pad assembly 10 corresponding to each other, the pad assembly 10 includes a positive pad set 100 and a negative pad set 101, a pad gap of at least two sizes is formed between the positive pad set 100 and the negative pad set 101, and the LED chip 2 is soldered on the pad assembly 10 through the pad gap of one size. Because the positive electrode pad group 100 and the negative electrode pad group 101 in each pad assembly 10 form at least two sizes of pad gaps, when welding, one size of pad gap can be selected from the at least two sizes of pad gaps, and the LED chip is welded on the pad assembly through the selected pad gap, thereby reducing poor welding and improving production efficiency; in addition, when the defective products are maintained, glue on the LED chips does not need to be removed, and a group of bonding pads which are not welded with the LED chips are directly selected for welding, so that the welding difficulty is reduced, and the production efficiency is improved.
The LED board provided by the embodiment of the invention can be an LED display panel and also can be an LED lamp panel.
In a specific embodiment, the positive pad group in the pad assembly 10 may include a positive pad 1 and a positive pad 2, the negative pad group may include a negative pad 1 and a negative pad 2, the positive pad 1 and the negative pad 1 form a pad gap 1, and the positive pad 2 and the negative pad 2 form a pad gap 2, where the pad gap 1 is set to be 75% to 85% of the pad gap 2, or the pad gap 1 is set to be 115% to 125% of the pad gap 2.
Because the bonding pad gaps with two different sizes exist, the bonding pad gap with one size can be selected, and the bonding pad gap is the same as or similar to the gap between the anode bonding pad and the cathode bonding pad of the LED chip, so that poor welding can be reduced, and the production efficiency can be improved; meanwhile, when the defective products are maintained, glue on the LEDs is not required to be removed, and another group of bonding pads are directly selected for welding, so that the maintenance difficulty is reduced, and the production efficiency is improved.
Specifically, the pad gap 1 may be set to 75% to 85% of the pad gap 2; or the pad gap 1 may be set to 115% to 125% of the pad gap 2.
Because the allowable error of the substrate in the production process is +/-20%, the pad gap 2 can be set to be in a standard size in the substrate manufacturing process, and then the pad gap 1 is set to be 75% -85% of the pad gap 2, so that the pad gap 2 can be prevented from being larger than the standard size in the substrate manufacturing process, and the LED chip can be welded to the pad component through the pad gap 2 when the LED chip is welded;
the pad gap 1 is set to be 115% to 125% of the pad gap 2, so that the pad gap 2 can be prevented from being made smaller than a standard size in the substrate manufacturing process, and the LED chip can be welded to the pad assembly through the pad gap 2 when the LED chip is welded.
The positive electrode pad group may further include three positive electrode pads, the negative electrode pad group includes three negative electrode pads, the positive electrode pad group includes two positive electrode pads, the negative electrode pad group includes three negative electrode pads, for example, the positive electrode pad group includes three positive electrode pads, and the negative electrode pad group includes three negative electrode pads.
In a specific embodiment, the positive pad group in the pad assembly 10 may include a positive pad 1, a positive pad 2, and a positive pad 3, the negative pad group may include a negative pad 1, a negative pad 2, and a negative pad 3, the positive pad 1 and the negative pad 1 form a pad gap 1, the positive pad 2 and the negative pad 2 form a pad gap 2, and the positive pad 3 and the negative pad 3 form a pad gap 3, where the pad gap 1 is greater than the pad gap 2, and the pad gap 3 is less than the pad gap 2.
Because the bonding pad gaps with three different sizes exist, the bonding pad gap with one size can be selected, and the bonding pad gap is the same as or close to the gap between the anode bonding pad and the cathode bonding pad of the LED chip, so that poor welding can be reduced, and the production efficiency can be improved; meanwhile, when the defective products are maintained, glue on the LEDs is not required to be removed, and a group of pads which are not welded are directly selected for welding, so that the maintenance difficulty is reduced, and the production efficiency is improved.
Specifically, the pad gap 3 may be set to 75% to 85% of the pad gap 2; the pad gap 1 may be set to 115% to 125% of the pad gap 2.
Three positive electrode bonding pads and three negative electrode bonding pads are arranged, because the substrate allows the error to be +/-20% in the production process, three groups of bonding pads can be arranged, the bonding pad gap 2 can be set to be a bonding pad gap with a standard size, the bonding pad gap 1 can be set to be a bonding pad gap which is 20% larger than the bonding pad gap 2 (the bonding pad gap with the standard size), and the bonding pad gap 3 can be set to be a bonding pad gap which is 20% smaller than the bonding pad gap 2 (the bonding pad gap with the standard size), so that when the LED chip is welded, a group of bonding pad gaps which are the same as or similar to the positive electrode bonding pads and the negative electrode bonding pad gaps of.
In implementation, three positive pads included in the positive pad group in the pad assembly 10 may be disposed on the same straight line, three negative pads included in the negative pad group may also be disposed on the same straight line, three positive pads in the positive pad group and three negative pads in the negative pad group may also be disposed symmetrically with respect to a straight line as a symmetric line, for example, with respect to a straight line as a symmetric line, the positive pad 1 and the negative pad 1 are disposed symmetrically, the positive pad 2 and the negative pad 2 are disposed symmetrically, and the positive pad 3 and the negative pad 3 are disposed symmetrically.
After the setting modes of the positive electrode pad group and the negative electrode pad group are determined, the connection mode of three positive electrode pads in the positive electrode pad group and the connection mode of three negative electrode pads in the negative electrode pad group are also determined.
The positive pad 1, the positive pad 2 and the positive pad 3 can be connected through wires, and the negative pad 1, the negative pad 2 and the negative pad 3 can also be connected through wires, wherein the wires can be connected by short wires or long wires.
The following respectively illustrates the arrangement of three positive pads and three negative pads and the routing connection.
As shown in fig. 4, a first pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 4, the positive pad 1, the positive pad 2 and the positive pad 3 are on the same straight line, a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through short wires, and the three negative electrode bonding pads are also connected through short wires.
As shown in fig. 5, a second pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 5, the positive pad 1, the positive pad 2 and the positive pad 3 are on the same straight line, a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through short wires, and the three negative electrode bonding pads are also connected through long wires.
As shown in fig. 6, a third pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 6, the positive pad 1, the positive pad 2 and the positive pad 3 are on the same straight line, a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through long wires, and the three negative electrode bonding pads are also connected through short wires.
As shown in fig. 7, a fourth pad configuration is provided according to an embodiment of the present invention.
In fig. 7, the positive pad 1, the positive pad 2 and the positive pad 3 are on the same straight line, a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through long wires, and the three negative electrode bonding pads are also connected through long wires.
The above is exemplified by three positive electrode pads on the same straight line, and of course, three negative electrode pads may also be on the same straight line. The three negative electrode pads are on the same straight line and the three positive electrode pads are on the same straight line in the same mode, for reference, the three positive electrode pads are on the same straight line for example, and the details are not repeated here.
The three positive electrode bonding pads or the three negative electrode bonding pads can be arranged on the same straight line, and can also be symmetrically arranged by taking the straight line as a symmetrical line and the positive electrode bonding pad 1 and the negative electrode bonding pad 1; the positive electrode bonding pad 2 and the negative electrode bonding pad 2 are symmetrically arranged; the positive electrode pad 3 and the negative electrode pad 3 are symmetrically arranged. The following examples are given.
As shown in fig. 8, a fifth pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 8, a straight line L is taken as a symmetry line, the positive pad 1 and the negative pad 1 are symmetrically arranged, the positive pad 2 and the negative pad 2 are symmetrically arranged, and the positive pad 3 and the negative pad 3 are symmetrically arranged, wherein a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through short wires, and the three negative electrode bonding pads are also connected through short wires.
As shown in fig. 9, a sixth pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 9, a straight line L is taken as a symmetry line, a positive pad 1 and a negative pad 1 are symmetrically arranged, a positive pad 2 and a negative pad 2 are symmetrically arranged, and a positive pad 3 and a negative pad 3 are symmetrically arranged, wherein a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through long wires, and the three negative electrode bonding pads are also connected through long wires.
As shown in fig. 10, a seventh pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 10, a straight line L is taken as a symmetry line, a positive pad 1 and a negative pad 1 are symmetrically arranged, a positive pad 2 and a negative pad 2 are symmetrically arranged, and a positive pad 3 and a negative pad 3 are symmetrically arranged, wherein a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through long wires, and the three negative electrode bonding pads are connected through short wires.
As shown in fig. 11, an eighth pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 11, a straight line L is taken as a symmetry line, a positive pad 1 and a negative pad 1 are symmetrically arranged, a positive pad 2 and a negative pad 2 are symmetrically arranged, and a positive pad 3 and a negative pad 3 are symmetrically arranged, wherein a pad gap 1 is formed between the positive pad 1 and the negative pad 1, a pad gap 2 is formed between the positive pad 2 and the negative pad 2, a pad gap 3 is formed between the positive pad 3 and the negative pad 3, the pad gap 1 is larger than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2. The three positive electrode bonding pads are connected through short wires, and the three negative electrode bonding pads are connected through long wires.
The above description exemplifies that in one pad assembly 10, the positive electrode pad group includes three positive electrode pads, and the negative electrode pad group also includes three negative electrode pads. In a pad assembly 10, the positive pad set may further include a positive pad, and the negative pad set may also include a negative pad.
When the positive electrode pad set includes one positive electrode pad, the negative electrode pad set may include at least one negative electrode pad, as exemplified below.
As shown in fig. 12, a ninth pad layout manner is provided in the embodiment of the present invention.
In fig. 12, there are one positive pad and three negative pads, namely a negative pad 1, a negative pad 2, and a negative pad 3, and a pad gap 1 is formed between the positive pad and the negative pad 1, a pad gap 2 is formed between the positive pad and the negative pad 2, and a pad gap 3 is formed between the positive pad and the negative pad 3. Pad gap 1 is larger than pad gap 2 and pad gap 3 is smaller than pad gap 2. The three negative electrode bonding pads are connected through short wires.
As shown in fig. 13, a tenth pad configuration is provided in accordance with an embodiment of the present invention.
In fig. 13, there are one positive pad and three negative pads, that is, a negative pad 1, a negative pad 2, and a negative pad 3, and a pad gap 1 is formed between the positive pad and the negative pad 1, a pad gap 2 is formed between the positive pad and the negative pad 2, and a pad gap 3 is formed between the positive pad and the negative pad 3. Pad gap 1 is larger than pad gap 2 and pad gap 3 is smaller than pad gap 2. The three negative electrode bonding pads are connected through long wires.
It should be noted here that, when there is only one positive electrode pad, if there are at least two negative electrode pads, the arrangement of the at least two negative electrode pads may be determined according to the shape of the positive electrode pad, as long as there are pad gaps of at least two sizes between the positive electrode pad and the negative electrode pad group.
The above description has been made with one positive electrode pad and three negative electrode pads, but of course, one negative electrode pad and three positive electrode pads may be used. The case of one negative electrode bonding pad and three positive electrode bonding pads can be referred to as a positive electrode bonding pad and a description of three negative electrode bonding pads, which are not described herein again.
In addition, when there is one positive electrode pad and one negative electrode pad, there may be a pad gap of at least two sizes between the positive electrode pad and the negative electrode pad, as will be exemplified below.
As shown in fig. 14, an eleventh pad layout manner according to the embodiment of the present invention is provided.
In fig. 14, there are one positive pad and one negative pad, and pad gaps of three sizes are formed between the positive pad and the negative pad, where the pad gap 1, the pad gap 2, and the pad gap 3 are provided, and the pad gap 1 is greater than the pad gap 2, and the pad gap 3 is smaller than the pad gap 2.
It should be noted that, the number of the positive electrode pads in the positive electrode pad group and the number of the negative electrode pads in the negative electrode pad group are not limited in the embodiments of the present invention, as long as at least two sizes of pad gaps can be formed between the positive electrode pad group and the negative electrode pad group, and the numbers of the pads are only illustrated by way of example.
In the above examples, the shape of the pad is described as a rectangle, but in the embodiment, the shape of the pad is not limited to a rectangle, and may be a trapezoid, or a combination of a rectangle and a trapezoid. The rectangular shape and the trapezoidal shape are also only examples, and in practical application, any shape can be adopted, and the shape of the bonding pad is not limited in the application.
Different pad shapes are exemplified below.
As shown in fig. 15, a twelfth pad arrangement mode according to the embodiment of the present invention is provided.
In fig. 15, the positive electrode pad group includes a positive electrode pad 1, a positive electrode pad 2, and a positive electrode pad 3, the negative electrode pad group includes a negative electrode pad 1, a negative electrode pad 2, and a negative electrode pad 3, the positive electrode pad and the negative electrode pad are both trapezoidal in shape, a pad gap 1 is formed between the positive electrode pad 1 and the negative electrode pad 1, a pad gap 2 is formed between the positive electrode pad 2 and the negative electrode pad 2, a pad gap 3 is formed between the positive electrode pad 3 and the negative electrode pad 3, the pad gap 1 is greater than the pad gap 2, the pad gap 3 is smaller than the pad gap 2, the positive electrode pads are connected by short wires, and the negative electrode pads are also connected by short wires.
As shown in fig. 16, a thirteenth pad arrangement manner is provided for the embodiment of the present invention.
In fig. 16, the positive electrode pad group includes a positive electrode pad 1, a positive electrode pad 2, and a positive electrode pad 3, the negative electrode pad group includes a negative electrode pad 1, a negative electrode pad 2, and a negative electrode pad 3, the positive electrode pad is trapezoidal, the negative electrode pad is rectangular, a pad gap 1 is formed between the positive electrode pad 1 and the negative electrode pad 1, a pad gap 2 is formed between the positive electrode pad 2 and the negative electrode pad 2, a pad gap 3 is formed between the positive electrode pad 3 and the negative electrode pad 3, the pad gap 1 is greater than the pad gap 2, the pad gap 3 is smaller than the pad gap 2, the positive electrode pads are connected by short wires, and the negative electrode pads are also connected by short wires.
It should be noted that, when the pads are trapezoidal, the pads may be connected by long traces in addition to short traces, which is not illustrated here.
Based on the same inventive concept, the embodiment of the invention also provides a method for manufacturing the LED board, and the method for manufacturing the LED board corresponds to the LED board of the embodiment of the invention, and the principle of the method for manufacturing the LED board for solving the problem is similar to that of the LED board, so the method for manufacturing the LED board can be implemented by referring to the implementation of the LED board, and repeated parts are not described again.
As shown in fig. 17, a method for manufacturing an LED board according to an embodiment of the present invention includes:
s1700, determining a chip pad gap between an anode pad and a cathode pad in an LED chip and a pad gap with at least two sizes formed between an anode pad group and a cathode pad group in a pad assembly corresponding to the LED chip, wherein the pad assembly is arranged on a substrate and corresponds to the LED chip; the welding disc assembly comprises the positive welding disc set and the negative welding disc set;
s1701, selecting a pad gap which is closest to the chip pad gap in the pad assembly to correspond to the chip pad gap according to the determined chip pad gap and the pad gap in the pad assembly;
and S1702, welding the LED chip on the bonding pad assembly through the selected bonding pad gap closest to the bonding pad gap of the chip.
In the embodiment of the invention, firstly, the chip pad gap between the anode pad and the cathode pad of the LED chip and the pad gap with at least two sizes formed by the anode pad group and the cathode pad group in the pad component corresponding to the LED are determined, then the pad gap closest to the chip pad gap in the pad component is selected according to the determined chip pad gap and the pad gap in the pad component, and finally the LED chip is welded on the pad component through the selected pad gap closest to the chip pad gap. Because the positive electrode pad group and the negative electrode pad group in each pad assembly form at least two sizes of pad gaps, one size of pad gap can be selected from the at least two sizes of pad gaps, the selected one size of pad gap is closest to the chip pad gap, and the LED chip is welded on the substrate through the selected pad gap closest to the chip pad gap, so that poor welding is reduced, and the production efficiency is improved; in addition, because the bonding pad assembly has bonding pad gaps with at least two sizes, glue on the LED chip is not required to be removed during maintenance, and a new LED chip is directly welded on the bonding pad assembly through other bonding pad gaps, so that the welding difficulty is reduced, and the production efficiency is improved.
In the preparation process of the LED plate, the size of a gap between an anode bonding pad and a cathode bonding pad of an LED chip to be welded can be input into a chip mounting device, then the chip mounting device determines the bonding pad gaps with at least two sizes formed between an anode bonding pad group and a cathode bonding pad group in a bonding pad component corresponding to the LED chip, and one bonding pad gap closest to the bonding pad gap of the chip is selected, namely the size of the bonding pad gap of the chip is closest to the size of the bonding pad gap, so that the welding reject ratio can be reduced, and the production efficiency is improved.
The closest approach here may be that the pad gap in the pad assembly is the same as the pad gap in the chip pad assembly, and if the pad gap in the pad assembly is not the same as the chip pad gap, then a pad gap of the pad gap size in the pad assembly closest to the chip pad gap size is selected.
After the paster is finished, the LED board after being welded is coated with glue, then the LED board is inspected, if the LED chip is not bright, the LED chip which is not bright needs to be maintained, a new LED chip can be welded into the welding disc assembly through other welding disc gaps, therefore, the glue on the LED chip which is not bright does not need to be removed, the maintenance difficulty is reduced, and the production efficiency is improved.
For example, three groups of pads, an group a pad, a group B pad and a group C pad exist in the pad assembly, wherein a first pad gap is formed between a positive pad and a negative pad in the group a pad, a second pad gap is formed between a positive pad and a negative pad in the group B pad, and a third pad gap is formed between a positive pad and a negative pad in the group C pad.
It should be noted that, since the repair is generally performed manually, even if the second pad gap of the group B pad or the third pad gap of the group C pad is different from or not closest to the gap between the positive electrode pad and the negative electrode pad of the LED chip, the group B pad or the group C pad can be used because there is a slight difference between the second pad gap and the third pad gap and the chip pad gap.
Based on the same inventive concept, the embodiment of the present invention further provides a display device, and since the display device corresponds to the LED board of the embodiment of the present invention, and the principle of the display device for solving the problem is similar to that of the LED board, the implementation of the display device can refer to the implementation of the LED board, and repeated details are omitted.
It should be noted that the LED panel of the present invention can be used as a light source and a liquid crystal display panel to jointly form a display device, or can be used independently as a display panel to be used as an LED display screen, and a single mini LED chip is used as a pixel point.
The present application is described above with reference to block diagrams and/or flowchart illustrations of methods, apparatus (systems) and/or computer program products according to embodiments of the application. It will be understood that one block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, and/or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer and/or other programmable data processing apparatus, create means for implementing the functions/acts specified in the block diagrams and/or flowchart block or blocks.
Accordingly, the subject application may also be embodied in hardware and/or in software (including firmware, resident software, micro-code, etc.). Furthermore, the present application may take the form of a computer program product on a computer-usable or computer-readable storage medium having computer-usable or computer-readable program code embodied in the medium for use by or in connection with an instruction execution system. In the context of this application, a computer-usable or computer-readable medium may be any medium that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The LED board is characterized by comprising a substrate and LED chips formed on the substrate, wherein the substrate is provided with a pad component corresponding to the LED chips; wherein, in a pair of LED chip and the bonding pad subassembly that corresponds each other:
the welding pad assembly comprises a positive welding pad group and a negative welding pad group, wherein welding pad gaps of at least two sizes are formed between the positive welding pad group and the negative welding pad group;
the LED chip is welded on the welding disc component through a welding disc gap with one size.
2. The LED board of claim 1, wherein in the pad assembly, the positive pad set comprises a first positive pad and a second positive pad, and the negative pad set comprises a first negative pad and a second negative pad, wherein a second pad gap of the second positive pad and the second negative pad is set to 75% to 85% of a first pad gap of the first positive pad and the first negative pad; or
The second pad gap is set to be 115% to 125% of the first pad gap.
3. The LED board of claim 1, wherein in the pad assembly, the positive pad set comprises a first positive pad, a second positive pad, and a third positive pad, and the negative pad set comprises a first negative pad, a second negative pad, and a third negative pad, wherein a second pad gap of the second positive pad and the second negative pad is smaller than a first pad gap of the first positive pad and the first negative pad, and a third pad gap of the third positive pad and the third negative pad is larger than the first pad gap.
4. The LED board of claim 3, wherein the second pad gap is set to 75% to 85% of the first pad gap;
the third pad gap is set to be 115% to 125% of the first pad gap.
5. The LED board of claim 4, wherein the first positive electrode pad, the second positive electrode pad, and the third positive electrode pad are disposed on a same straight line; or
The first negative electrode bonding pad, the second negative electrode bonding pad and the third negative electrode bonding pad are arranged on the same straight line.
6. The LED board according to claim 4, wherein the first positive electrode pad and the first negative electrode pad are symmetrically arranged with a straight line as a symmetry line;
the second anode bonding pad and the second cathode bonding pad are symmetrically arranged;
the third positive electrode bonding pad and the third negative electrode bonding pad are symmetrically arranged.
7. The LED board of claim 5 or 6, wherein the first positive pad, the second positive pad, and the third positive pad are connected by a trace; and/or
The first negative electrode bonding pad, the second negative electrode bonding pad and the third negative electrode bonding pad are connected through wiring.
8. The LED board of claim 1, wherein in the pad assembly, the positive pad set comprises a positive pad, and the negative pad set comprises a first negative pad, a second negative pad, and a third negative pad, wherein a second pad gap of the positive pad and the second negative pad is smaller than a first pad gap of the positive pad and the first negative pad, and a third pad gap of the positive pad and the third negative pad is larger than the first pad gap.
9. The LED board of claim 7, wherein any one of the pads in the pad assembly is rectangular and/or trapezoidal.
10. A display device, characterized in that the display device comprises:
the LED board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910515771.7A CN110323324B (en) | 2019-06-14 | 2019-06-14 | LED board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910515771.7A CN110323324B (en) | 2019-06-14 | 2019-06-14 | LED board and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110323324A CN110323324A (en) | 2019-10-11 |
| CN110323324B true CN110323324B (en) | 2021-06-04 |
Family
ID=68119563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910515771.7A Active CN110323324B (en) | 2019-06-14 | 2019-06-14 | LED board and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110323324B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113497073B (en) * | 2020-03-18 | 2022-10-21 | 重庆康佳光电技术研究院有限公司 | LED display convenient to repair and repair method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017157645A (en) * | 2016-02-29 | 2017-09-07 | Ｓｈマテリアル株式会社 | Lead frame for multi-row type LED |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006008454B4 (en) * | 2005-02-21 | 2011-12-22 | Samsung Electronics Co., Ltd. | Pad structure, pad layout structure, semiconductor device, and pad layout method |
| KR100798896B1 (en) * | 2007-06-07 | 2008-01-29 | 주식회사 실리콘웍스 | Pad layout structure of semiconductor chip |
| CN201957337U (en) * | 2010-12-08 | 2011-08-31 | 深圳富泰宏精密工业有限公司 | Circuit board |
| US8581250B2 (en) * | 2010-12-23 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus of fabricating a pad structure for a semiconductor device |
| US9129962B1 (en) * | 2014-05-07 | 2015-09-08 | Mediatek Inc. | Bonding pad arrangment design for multi-die semiconductor package structure |
| KR102334547B1 (en) * | 2014-06-17 | 2021-12-03 | 삼성디스플레이 주식회사 | Array substrate and method for mounting integrated circuit using the same |
| CN106658940A (en) * | 2016-10-31 | 2017-05-10 | 努比亚技术有限公司 | Ball grid array printed circuit board |
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
-
2019
- 2019-06-14 CN CN201910515771.7A patent/CN110323324B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017157645A (en) * | 2016-02-29 | 2017-09-07 | Ｓｈマテリアル株式会社 | Lead frame for multi-row type LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110323324A (en) | 2019-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100392575B1 (en) | Liquid crystal display device and manufacturing method thereof | |
| JP4796293B2 (en) | Manufacturing method of lighting device | |
| CN102736341B (en) | A kind of display panels and restorative procedure thereof | |
| CN102122478B (en) | Display, detection system and detection method for junction impedance thereof | |
| CN109656058A (en) | A kind of backlight module and its display device | |
| CN102087451A (en) | Active matrix substrate, display device, and active matrix substrate inspecting method | |
| CN110824766A (en) | Backlight structure, manufacturing method thereof and display device | |
| US20090190330A1 (en) | Light source assembly and liquid crystal display having the same | |
| CN105676495A (en) | Detecting unit, array substrate, liquid crystal display device and detecting method | |
| CN110323324B (en) | LED board and display device | |
| CN104154454B (en) | Direct type backlight module with light bars located on back side of backboard | |
| CN109683413B (en) | Array substrate and broken line repairing method thereof | |
| JP4106193B2 (en) | Liquid crystal display device and manufacturing method thereof | |
| CN202758557U (en) | Light-emitting diode (LED) dot matrix module and LED display screen | |
| CN101489349A (en) | Printed circuit board, method of mounting surface mounted devices on the printed circuit board and liquid crystal display including the printed circuit board | |
| CN104090435B (en) | The restorative procedure of a kind of display floater and display floater | |
| US20150146122A1 (en) | Trace Structure, Repair Method and Liquid Crystal Panel Thereof | |
| CN109491166B (en) | Array substrate | |
| CN113113526A (en) | Small-size LED transparent display screen and production method thereof | |
| CN112086026A (en) | Display panel and display device | |
| KR102092070B1 (en) | Method for inspecting display apparatus | |
| CN101285972B (en) | Joining method, display apparatus and display | |
| CN112201188A (en) | Display device and automatic detection method for binding of source chip thereof | |
| CN114913820A (en) | Mini-LED partition design method | |
| CN103676246B (en) | A kind of liquid crystal panel line defect restorative procedure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 266555 Qingdao economic and Technological Development Zone, Shandong, Hong Kong Road, No. 218 Applicant after: Hisense Visual Technology Co., Ltd. Address before: 266555 Qingdao economic and Technological Development Zone, Shandong, Hong Kong Road, No. 218 Applicant before: QINGDAO HISENSE ELECTRONICS Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |