CN110316949A - A kind of method of femto-second laser glass-cutting - Google Patents
A kind of method of femto-second laser glass-cutting Download PDFInfo
- Publication number
- CN110316949A CN110316949A CN201810264916.6A CN201810264916A CN110316949A CN 110316949 A CN110316949 A CN 110316949A CN 201810264916 A CN201810264916 A CN 201810264916A CN 110316949 A CN110316949 A CN 110316949A
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- CN
- China
- Prior art keywords
- groove
- substrate
- femto
- laser
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
A kind of method that the present invention discloses femto-second laser glass-cutting comprising following steps: step 1: substrate is fixed on machine table；Step 2: opening a V-groove in substrate surface with unification short focal length lens using femtosecond laser, the bottom of V-groove, which is formed, introduces stress concentration point；Step 3: being moved again along the length direction of V-groove using femtosecond laser with unification long focal length lens, and form discrete active region in substrate internal focus from bottom to top along the depth direction of V-groove；Step 4: being moved using micro flames nozzle along V-groove length direction, under micro flames heating, seif-citing rate centrostigma splits substrate from top to down along the depth direction of V-groove.The present invention reduces the difficulty that process flow and side polish, and save process time.
Description
Technical field
The present invention relates to laser application field more particularly to a kind of methods of femto-second laser glass-cutting.
Background technique
When the prior art carries out glass-cutting, glass structure defect is easily caused, influences the cutting yield of glass, and cut
Glass edge is sharp keen, needs further deburring processing.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of methods of femto-second laser glass-cutting.
The technical solution adopted by the present invention is that:
A kind of method of femto-second laser glass-cutting comprising following steps:
Step 1: substrate is fixed on machine table；
Step 2: opening a V-groove in substrate surface with unification short focal length lens using femtosecond laser, the bottom of V-groove, which is formed, draws
Enter stress concentration point；
Step 3: being moved again along the length direction of V-groove using femtosecond laser with unification long focal length lens, and along the depth of V-groove
Degree direction forms discrete active region in substrate internal focus from bottom to top；
Step 4: being moved using micro flames nozzle along V-groove length direction, substrate is under micro flames heating, seif-citing rate centrostigma edge
The depth direction of V-groove splits from top to down.
Further, the substrate thickness chosen in step 1 is not more than 5mm.
Further, substrate is glass substrate, sapphire substrate or quartz crystal substrate.
Further, femtosecond laser is projeced into substrate surface, the coke of aspherical mirror after focusing by aspherical mirror in step 2
Away from for 3-10 mm.
Further, the width of V-groove is 3-5 μm in step 2, and the depth of V-groove is 5-10 μm.
Further, the focal length of telephoto lens is 20-50 mm in step 3.
Further, the diameter of the nozzle flame of micro flames nozzle is 1-2mm in step 4.
The invention adopts the above technical scheme, femtosecond laser cutting technique is combined with micro flames, using femtosecond laser
Device follows femtosecond laser cutter to carry out flame polish to glass-cutting crack and is formed as glass cutting tool with flame
More smooth side wall.Femtosecond laser main function is to form stress concentration point, the cracking direction of guiding substrate.The work of micro flames
With being, by heating, sufficiently large thermal stress is formed inside substrate, substrate is promoted to split；The cutting of micro flames heating simultaneously
Face makes cut surface under surface tension effects, forms smooth surface, plays the role of polishing.The present invention reduces process flows
And the difficulty of side polishing, save process time.
Detailed description of the invention
The present invention is described in further details below in conjunction with the drawings and specific embodiments；
Fig. 1 is a kind of flow diagram of the method for femto-second laser glass-cutting of the present invention；
Fig. 2 is a kind of cut state schematic diagram of the step 2 of the method for femto-second laser glass-cutting of the present invention；
Fig. 3 is a kind of cut state schematic diagram of the step 3 of the method for femto-second laser glass-cutting of the present invention；
Fig. 4 is a kind of cut state schematic diagram of the step 4 of the method for femto-second laser glass-cutting of the present invention；
Fig. 5 is status diagram when a kind of cutting of method of femto-second laser glass-cutting of the present invention is completed.
Specific embodiment
As shown in one of Fig. 1-5, the invention discloses a kind of methods of femto-second laser glass-cutting comprising following step
It is rapid:
Step 1: substrate 1 is fixed on machine table；
Step 2: opening a V-groove 11, the bottom of V-groove 11 on 1 surface of substrate with unification short focal length lens using femtosecond laser
It is formed and introduces stress concentration point；
Step 3: the length direction using femtosecond laser with unification long focal length lens again along V-groove 11 moves, and along V-groove 11
Depth direction form discrete active region 12 in 1 internal focus of substrate from bottom to top；
Step 4: being moved using micro flames nozzle along 11 length direction of V-groove, substrate 1 under micro flames heating, concentrate by seif-citing rate
Point splits from top to down along the depth direction of V-groove 11.
Further, 1 thickness of substrate chosen in step 1 is not more than 5mm.
Further, substrate 1 is glass substrate 1, sapphire substrate 1 or quartz crystal substrate 1.
Further, femtosecond laser is projeced into 1 surface of substrate after focusing by aspherical mirror in step 2, aspherical mirror
Focal length is 3-10 mm.
Further, the width of V-groove 11 is 3-5 μm in step 2, and the depth of V-groove is 5-10 μm.
Further, the focal length of telephoto lens is 20-50 mm in step 3.
Further, the diameter of the nozzle flame of micro flames nozzle is 1-2mm in step 4.
The invention adopts the above technical scheme, femtosecond laser cutting technique is combined with micro flames, using femtosecond laser
Device follows femtosecond laser cutter to carry out flame polish to glass-cutting crack and is formed as glass cutting tool with flame
More smooth side wall.Femtosecond laser main function is to form stress concentration point, the cracking direction of guiding substrate 1.Micro flames
Effect is, by heating, forms sufficiently large thermal stress inside substrate 1, substrate 1 is promoted to split；Micro flames heating simultaneously
Cut surface makes cut surface under surface tension effects, forms smooth surface, plays the role of polishing.The present invention reduces techniques
Process and the difficulty of side polishing, save process time.
Claims (7)
1. a kind of method of femto-second laser glass-cutting, it is characterised in that: itself the following steps are included:
Step 1: substrate is fixed on machine table；
Step 2: opening a V-groove in substrate surface with unification short focal length lens using femtosecond laser, the bottom of V-groove, which is formed, draws
Enter stress concentration point；
Step 3: being moved again along the length direction of V-groove using femtosecond laser with unification long focal length lens, and along the depth of V-groove
Degree direction forms discrete active region in substrate internal focus from bottom to top；
Step 4: being moved using micro flames nozzle along V-groove length direction, substrate is under micro flames heating, seif-citing rate centrostigma edge
The depth direction of V-groove splits from top to down, completes cutting.
2. a kind of method of femto-second laser glass-cutting according to claim 1, it is characterised in that: chosen in step 1
Substrate thickness be not more than 5mm.
3. a kind of method of femto-second laser glass-cutting according to claim 1, it is characterised in that: substrate is glass base
Piece, sapphire substrate or quartz crystal substrate.
4. a kind of method of femto-second laser glass-cutting according to claim 1, it is characterised in that: femtosecond in step 2
Laser is projeced into substrate surface after focusing by aspherical mirror, the focal length of aspherical mirror is 3-10 mm.
5. a kind of method of femto-second laser glass-cutting according to claim 1, it is characterised in that: V-groove in step 2
Width be 3-5 μm, the depth of V-groove is 5-10 μm.
6. a kind of method of femto-second laser glass-cutting according to claim 1, it is characterised in that: focal length in step 3
The focal length of camera lens is 20-50 mm.
7. a kind of method of femto-second laser glass-cutting according to claim 1, it is characterised in that: small fire in step 4
The diameter of the nozzle flame of flame nozzle is 1-2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810264916.6A CN110316949A (en) | 2018-03-28 | 2018-03-28 | A kind of method of femto-second laser glass-cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810264916.6A CN110316949A (en) | 2018-03-28 | 2018-03-28 | A kind of method of femto-second laser glass-cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110316949A true CN110316949A (en) | 2019-10-11 |
Family
ID=68109962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810264916.6A Pending CN110316949A (en) | 2018-03-28 | 2018-03-28 | A kind of method of femto-second laser glass-cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110316949A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1769987A (en) * | 2004-11-05 | 2006-05-10 | Lg.菲利浦Lcd株式会社 | Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus and substrate cutting method using the substrate cutting apparatus |
| CN101037291A (en) * | 2000-06-21 | 2007-09-19 | 肖特股份公司 | Method and device for producing glass panes of any desired contour from sheet glass |
| KR20110139007A (en) * | 2010-06-22 | 2011-12-28 | 한국과학기술원 | Cutting Method through Nano Void Array Formation by Femtosecond Laser |
| CN106536119A (en) * | 2014-07-09 | 2017-03-22 | 高质激光有限公司 | Processing of material using non-circular laser beams |
| CN106966580A (en) * | 2017-04-28 | 2017-07-21 | 武汉理工大学 | A kind of method of femtosecond laser glass-cutting |
-
2018
- 2018-03-28 CN CN201810264916.6A patent/CN110316949A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101037291A (en) * | 2000-06-21 | 2007-09-19 | 肖特股份公司 | Method and device for producing glass panes of any desired contour from sheet glass |
| CN1769987A (en) * | 2004-11-05 | 2006-05-10 | Lg.菲利浦Lcd株式会社 | Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus and substrate cutting method using the substrate cutting apparatus |
| KR20110139007A (en) * | 2010-06-22 | 2011-12-28 | 한국과학기술원 | Cutting Method through Nano Void Array Formation by Femtosecond Laser |
| CN106536119A (en) * | 2014-07-09 | 2017-03-22 | 高质激光有限公司 | Processing of material using non-circular laser beams |
| CN106966580A (en) * | 2017-04-28 | 2017-07-21 | 武汉理工大学 | A kind of method of femtosecond laser glass-cutting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191011 |
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| RJ01 | Rejection of invention patent application after publication |