CN110315815A - Porous ceramic plate, preparation method and its application - Google Patents
Porous ceramic plate, preparation method and its application Download PDFInfo
- Publication number
- CN110315815A CN110315815A CN201910221154.6A CN201910221154A CN110315815A CN 110315815 A CN110315815 A CN 110315815A CN 201910221154 A CN201910221154 A CN 201910221154A CN 110315815 A CN110315815 A CN 110315815A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- layer
- raw material
- porous
- ceramic plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 468
- 238000002360 preparation method Methods 0.000 title claims abstract description 45
- 239000010410 layer Substances 0.000 claims abstract description 236
- 239000002994 raw material Substances 0.000 claims abstract description 195
- 239000002344 surface layer Substances 0.000 claims abstract description 101
- 239000011148 porous material Substances 0.000 claims abstract description 68
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 45
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 43
- 238000003475 lamination Methods 0.000 claims abstract description 24
- 210000001161 mammalian embryo Anatomy 0.000 claims abstract description 20
- 210000002257 embryonic structure Anatomy 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 26
- 238000005245 sintering Methods 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000002320 enamel (paints) Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000011572 manganese Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 14
- 239000007789 gas Substances 0.000 description 12
- 229910000428 cobalt oxide Inorganic materials 0.000 description 10
- 238000001179 sorption measurement Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000002562 thickening agent Substances 0.000 description 9
- 229920000609 methyl cellulose Polymers 0.000 description 8
- 239000001923 methylcellulose Substances 0.000 description 8
- 235000010981 methylcellulose Nutrition 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 8
- 239000004926 polymethyl methacrylate Substances 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005265 energy consumption Methods 0.000 description 6
- 229910052573 porcelain Inorganic materials 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 229910017052 cobalt Inorganic materials 0.000 description 5
- -1 ferriferous oxide Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- UBEWDCMIDFGDOO-UHFFFAOYSA-N cobalt(2+);cobalt(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Co+2].[Co+3].[Co+3] UBEWDCMIDFGDOO-UHFFFAOYSA-N 0.000 description 4
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- UPWOEMHINGJHOB-UHFFFAOYSA-N oxo(oxocobaltiooxy)cobalt Chemical compound O=[Co]O[Co]=O UPWOEMHINGJHOB-UHFFFAOYSA-N 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 3
- 239000000292 calcium oxide Substances 0.000 description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VASIZKWUTCETSD-UHFFFAOYSA-N oxomanganese Chemical compound [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- DQMUQFUTDWISTM-UHFFFAOYSA-N O.[O-2].[Fe+2].[Fe+2].[O-2] Chemical compound O.[O-2].[Fe+2].[Fe+2].[O-2] DQMUQFUTDWISTM-UHFFFAOYSA-N 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- TYTHZVVGVFAQHF-UHFFFAOYSA-N manganese(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Mn+3].[Mn+3] TYTHZVVGVFAQHF-UHFFFAOYSA-N 0.000 description 1
- GEYXPJBPASPPLI-UHFFFAOYSA-N manganese(III) oxide Inorganic materials O=[Mn]O[Mn]=O GEYXPJBPASPPLI-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- XVOFZWCCFLVFRR-UHFFFAOYSA-N oxochromium Chemical compound [Cr]=O XVOFZWCCFLVFRR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/26—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on ferrites
- C04B35/2658—Other ferrites containing manganese or zinc, e.g. Mn-Zn ferrites
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/636—Polysaccharides or derivatives thereof
- C04B35/6365—Cellulose or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
- C04B38/06—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof by burning-out added substances by burning natural expanding materials or by sublimating or melting out added substances
- C04B38/063—Preparing or treating the raw materials individually or as batches
- C04B38/0635—Compounding ingredients
- C04B38/0645—Burnable, meltable, sublimable materials
- C04B38/067—Macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3241—Chromium oxides, chromates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3262—Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/77—Density
- C04B2235/775—Products showing a density-gradient
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The present invention provides porous ceramic plate, preparation method and its application.The preparation method is the following steps are included: step (a): complete plural number ceramic raw material, these ceramic raw materials respectively include surface layer ceramic raw material and bottom ceramic raw material, and the average grain diameter for the metal oxide that wherein the surface layer ceramic raw material is included is less than or equal to 20 microns;Step (b): after respectively step is formed in these ceramic raw materials, the plural raw embryo shaped by these ceramic raw materials is respectively obtained;Step (c): these raw embryos being folded and set to form a lamination, which includes the raw embryo of surface layer ceramic raw material forming and the raw embryo of bottom ceramic raw material forming;Step is formed in the lamination, the lamination after obtaining a forming;And, step (d): the lamination after being sintered the forming, to obtain a porous ceramic plate, wherein, the porous ceramic plate includes the mutually folded surface layer ceramic layer and bottom ceramic layer set, and the average pore size of the surface layer ceramic layer is less than the average pore size of the bottom ceramic layer.
Description
Technical field
The present invention relates to a kind of porous ceramic plate, it is particularly applied to the vacuum chuck or non-contact of fixed wafer or work package
The application of the porous ceramic plate of formula application apparatus, the preparation method of the porous ceramic plate and the porous ceramic plate.
Background technique
In the field of manufacture semiconductor, in order to make wafer in the automation transfer of the working processes such as cleaning, cutting, grinding
Maintenance is firm in the process, reduces wafer damages and promotes producing line fluency, is at present most-often used with vacuum chuck absorption wafer
Carrying adsorption tool, and how to make sucker sorption face have high flatness, and then promoted wafer manufacturing method yield at
For considerable subject under discussion.About the preparation method of vacuum chuck, Japanese Patent announces No. 2779968 patent of invention and discloses one
The preparation method of kind vacuum chuck, elder generation forms green compact with ceramic raw material and organic binder etc. and is fired into chuck main body, then grinds
Grinding the chuck main body surface makes its smoothing, then forms one on chuck main body surface with plasma-based chemical vapour deposition technique and does not have
The ceramic membrane of stomata;Though the high vacuum chuck of the available sorption face flatness of the preparation method, however the system of the preparation method
Standby program is cumbersome and high production cost, is unfavorable for business application.
In addition, Japanese Unexamined Patent Publication 2002-373873 invention patent application case discloses a kind of preparation of ceramic base material lamination
Method, shape needed for being initially formed each ceramic base material in a manner of being machined as compositions such as ceramic raw materials are then respectively fired
At ceramic base material, after then carrying out surface treatment and slot treatment to these ceramic base materials, then these are bonded with inorganic bond
Ceramic base material is to obtain the ceramic base material lamination;However the preparation procedure of the preparation method is cumbersome, energy consumption, and if adhesive failure
It then will lead to the removing between ceramic base material.
Furthermore No. 101149350 patent of invention of Korean Patent Laid discloses a kind of with the porous of different pore size size
The preparation method of ceramic double-layer, elder generation carries out support layer compression moulding after being mixed by ceramic material powder and organic bond walk
Suddenly, then the support layer compared with gross porosity diameter is provided in heat-agglomerating;A wherein surface for the support layer made of sintering is coated with mixing
There is the slurry of another ceramic material powder and organic bond, then carrying out heat-agglomerating forms the slurry with smaller aperture due
Adsorption layer, with obtain have different pore size size double-layer porous ceramic layer;However the preparation procedure of the preparation method it is cumbersome,
Energy consumption, and because being coated with adsorption layer slurry on the support layer sintered, therefore adsorption layer slurry can insert the support layer sintered
Hole in, leading to adsorption layer and support layer, there are vapour lock differences, thus the double-layer porous ceramic layer be applied to it is flat comprising air bearing
It is gas barrier to be still unable to meet demand when the contactless transportation systems such as platform, air bearing sliding rail and air-bearing.
Summary of the invention
In view of the technological deficiency of above-mentioned preparation method, the purpose of the present invention is to provide a kind of preparation sides of porous ceramic plate
Method, preparation procedure is simple, can promote productivity effect.
Another object of the present invention is to provide a kind of preparation methods of porous ceramic plate, can be energy saving, reduce production
Cost.
To achieve the aforementioned purpose, the present invention provides a kind of preparation method of porous ceramic plate, and it includes following steps: step
(a): complete plural number ceramic raw material, these ceramic raw materials respectively include surface layer ceramic raw material and bottom ceramic raw material, wherein the table
The average grain diameter for the metal oxide that layer ceramic raw material is included is less than or equal to 20 microns;Step (b): by these ceramic raw materials
After step respectively is formed, the plural raw embryo shaped by these ceramic raw materials is respectively obtained;Step (c): these raw embryos are folded
If forming a lamination, which includes the raw embryo of surface layer ceramic raw material forming and the raw embryo of bottom ceramic raw material forming;
Step is formed in the lamination, the lamination after obtaining a forming;And step (d): the lamination after being sintered the forming, to obtain
Obtain a porous ceramic plate, wherein the porous ceramic plate includes the mutually folded surface layer ceramic layer and bottom ceramic layer set, surface layer ceramics
The average pore size of layer is less than the average pore size of the bottom ceramic layer.
The present invention overlaps again after first the surface layer ceramic raw material and the bottom ceramic raw material are respectively formed, then just into
The once sintered step of row.Thus in addition to can simplify preparation procedure and it is energy saving other than, it is obtained more by the preparation method
Hole ceramic plate does not need additionally to bond using added binding agents between each layer, avoids adhesive failure and makes the porous ceramic plate include
The situation being detached between each layer;In addition, the porous ceramic plate that the preparation method obtains has the characteristic of whole even pore distribution,
And then the porous ceramic plate is made to have the advantages that uniform breathability is good.By limiting metal oxide contained by the ceramic raw material of surface layer
Average particle size range so that the surface layer ceramic layer of the porous ceramic plate has tiny average pore size, even if for adsorbing fixation
When very thin work package (such as wafer), it so that work package is kept flat and indeformable to work package accurately measuring or be added with benefit
Work;Also, the porous ceramic plate is subsequent when being connected with vacuum or to gas system, has by the bottom ceramic layer with system attachment
Biggish average pore size and allow vapour lock to reduce, and then can be reduced consume energy and make the porous ceramic plate and meanwhile reach have rigidly and can be saturating
The effect of gas.If be applied to contactless transportation system, uniform and stable air cushion layer can be provided, keeps the flat of object surface
Smooth degree can apply to the object for carrying high-precision or large area.
Preferably, the average grain diameter for the metal oxide that surface layer ceramic raw material is included used in step (a) be less than or
Equal to 10 microns;It is furthermore preferred that the average grain diameter for the metal oxide that surface layer ceramic raw material is included used in step (a) is situated between
In 0.01 micron between 8 micron ranges.
In a wherein embodiment, plural ceramic raw material is represented by two kinds of ceramic raw materials, in this scheme, plural number pottery
Porcelain raw material is surface layer ceramic raw material and bottom ceramic raw material;In another embodiment, plural ceramic raw material is also denoted as three
Kind ceramic raw material, in this scheme, plural ceramic raw material is surface layer ceramic raw material, the first middle layer ceramic raw material and bottom ceramics
Raw material;In yet another embodiment, plural ceramic raw material is also denoted as four kinds of ceramic raw materials, in this scheme, plural number ceramics
Raw material is surface layer ceramic raw material, the first middle layer ceramic raw material, the second middle layer ceramic raw material and bottom ceramic raw material.The present invention
Ceramic raw material applicatory is illustrated in this, but is not limited to above-mentioned three kinds of embodiments.
Therefore, when these ceramic raw materials are more than two kinds of ceramic raw materials, which further includes being made pottery by the middle layer
Porcelain raw material is formed by an at least middle layer ceramic layer, and the average pore size of the surface layer ceramic layer is less than the flat of the middle layer ceramic layer
Equal aperture, and the average pore size of the middle layer ceramic layer is less than the average pore size of the bottom ceramic layer.For example, when these potteries
When porcelain raw material is three kinds of ceramic raw materials, which can form the first middle layer ceramic layer, surface layer ceramics
The average pore size of layer is less than the average pore size of the first middle layer ceramic layer, and the average pore size of the first middle layer ceramic layer is small
In the average pore size of the bottom ceramic layer;When these ceramic raw materials are four kinds of ceramic raw materials, the first middle layer ceramic material
The first middle layer ceramic layer and the second middle layer ceramic layer, surface layer ceramics can be formed with the second middle layer ceramic material
The average pore size of layer is less than the average pore size of the first middle layer ceramic layer, and the average pore size of the first middle layer ceramic layer is less than
The average pore size of second middle layer, the average pore size of the second middle layer ceramic layer are less than the average hole of the bottom ceramic layer
Diameter.The average pore size of middle layer ceramic layer is finally formed by between the surface layer ceramic layer by the middle layer ceramic raw material
Between the average pore size of the bottom ceramic layer, the ventilation from the bottom ceramic layer to surface layer ceramic layer can be more smooth.
In order to keep the average pore size of each layer ceramic layer in the porous ceramic plate different, it is preferred that these ceramics in step (a)
The average grain diameter for the metal oxide that raw material respectively contains is different;For example, when these ceramic raw materials are two kinds of ceramic raw materials
When, the average grain diameter of metal oxide contained by the surface layer ceramic raw material is less than metal oxide contained by the bottom ceramic raw material
Average grain diameter;When these ceramic raw materials are three kinds of ceramic raw materials, the surface layer ceramic raw material, the first middle layer ceramic raw material
With the average grain diameter of the respective contained metal oxide of the bottom ceramic raw material, from being as low as greatly sequentially the surface layer ceramic raw material institute
Metal contained by metal oxide to the bottom ceramic raw material contained by the metal oxide that contains, the first middle layer ceramic raw material
Oxide;When these ceramic raw materials are four kinds of ceramic raw materials, which the first middle layer ceramic raw material, is somebody's turn to do
The average grain diameter of the respective contained metal oxide of second middle layer ceramic raw material and the bottom ceramic raw material, from as low as greatly sequentially
For metal oxide contained by metal oxide contained by the surface layer ceramic raw material, the first middle layer ceramic raw material, this second
Metal oxide contained by metal oxide contained by middle layer ceramic raw material to the bottom ceramic raw material.Then in step (c)
In, these raw embryos are folded according to the average particle diameter size sequence of metal oxide contained by the ceramic raw material respectively contained and set to form this
Lamination.
In certain embodiments, these ceramic raw materials in the step (a) can further include being easy to be burnt to lose or decompose
And the pore-creating filler of hole is generated, and such as: calcium carbonate (CaCO3), magnesium carbonate (MgCO3), polymethyl methacrylate (Poly
(methyl methacrylate), PMMA) or polystyrene (Polystyrene, PS) etc., but not limited to this.For example,
Only the bottom ceramic raw material adds the middle layer ceramic raw material in aforementioned pore-creating filler or step (a) and should in step (a)
Bottom raw material all adds aforementioned pore-creating filler, to increase average pore size and the hole of bottom ceramic layer and/or middle layer ceramic layer
Gap rate.
In certain embodiments, the plural ceramic raw material in the step (a) can all include thickener, such as: starch
(Starch), methylcellulose (Methyl Cellulose) etc., but not limited to this.Increased by being added in these ceramic raw materials
Thick dose, each ingredient in ceramic raw material can be made to be uniformly mixed, therefore the hole uniformity of the porous ceramic plate can be promoted;In addition,
Thickener is usually that can be burnt the material lost, can also promote the porosity and aeration of the ceramic plate.
According to the present invention, the forming step in step (b) and step (c), which can be used, is injection moulded, is press-formed, being extruded into
Type or calendering formation, but not limited to this.Preferably, the surface layer ceramic raw material and the bottom ceramic raw material respectively make in step (b)
Step is formed with rolling-molding method;Preferably, also step is formed using rolling-molding method in the lamination in step (c).
These ceramic raw materials or lamination are rolled over using horizontal roller roller, not only program is simple, and does not need repeatedly to thicken and can reach each layer
Thickness needed for body.
Preferably, rolling-molding method used in step (b), calendering force is every square centimeter and is greater than 10 milligrams, rolls
Temperature rolls ambient humidity between relative humidity 0 to 100 between 0 DEG C to 100 DEG C.
Preferably, rolling-molding method used in step (c), calendering force is every square centimeter and is greater than 1000 milligrams, presses
Prolong temperature between 15 DEG C to 40 DEG C, rolls ambient humidity between relative humidity 40 to 100.
In certain embodiments, metal oxide contained by the plural ceramic raw material in the step (a) includes iron
(Fe), the oxide of the metals such as manganese (Mn), chromium (Cr), cobalt (Co), magnesium (Mg), calcium (Ca), copper (Cu), aluminium (Al), but be not limited to
This.For example, ferriferous oxide includes ferrous oxide (FeO), di-iron trioxide (Fe2O3) etc., but not limited to this;Mn oxide
Including manganese monoxide (MnO), mangano-manganic oxide (Mn3O4), manganese sesquioxide managnic oxide (Mn2O3), manganese dioxide (MnO2) etc., but be not limited to
This;Chromated oxide includes chromous oxide (CrO), chrome green (Cr2O3), chromium trioxide (CrO3) etc., but not limited to this;Cobalt
Oxide includes cobalt black (CoO), cobalt sesquioxide (Co2O3), cobaltosic oxide (Co3O4) etc., but not limited to this;Copper oxygen
Compound includes cuprous oxide (Cu2O), copper oxide (CuO) etc., but not limited to this.According to metal oxide contained by ceramic raw material
Property, can adjust the properties such as conductivity or the mechanical strength of porous ceramic plate entirety.For example, it in order to adjust conductivity, makes pottery
Porcelain raw material may include the metal oxides such as ferriferous oxide, Cu oxide, Mn oxide, but not limited to this;Preferably, these ceramics
Ferriferous oxide content contained by raw material accounts for the 20 weight % or more of these ceramic raw material gross weights;It is furthermore preferred that these ceramic raw materials
Contained ferriferous oxide content accounts for the 30 weight % to 80 weight % of these ceramic raw material gross weights.Preferably, these ceramic raw materials
Contained copper oxide content accounts for the 0.01 weight % or more of these ceramic raw material gross weights;It is furthermore preferred that these ceramic raw material institutes
The copper oxide content contained accounts for the 0.01 weight % to 50 weight % of these ceramic raw material gross weights.In order to adjust mechanical strength, make pottery
Porcelain raw material may include the metal oxides such as Mn oxide, cobalt/cobalt oxide, magnesium oxide, but not limited to this;Preferably, these ceramics
Mn oxide content contained by raw material accounts for the 0.01 weight % or more of these ceramic raw material gross weights;It is furthermore preferred that these ceramics are former
The contained Mn oxide content of material accounts for the 0.01 weight % to 80 weight % of these ceramic raw material gross weights.Preferably, these ceramics
Cobalt/cobalt oxide content containing cobalt/cobalt oxide contained by raw material accounts for the 0.01 weight % or more of these ceramic raw material gross weights;It is furthermore preferred that
Cobalt/cobalt oxide content contained by these ceramic raw materials accounts for the 0.01 weight % to 50 weight % of these ceramic raw material gross weights.
In certain embodiments, the plural ceramic raw material in the step (a) can not include silicon carbide or other are high hard
Spend particle (such as monocrystalline brill), to avoid the porous ceramic plate eventually formed excessive high hardness and be easy to scratch wafer or work package.
In the case where not influencing the effect of production method of porous ceramic plate of the invention, can also regard different use is needed
It asks, will add other auxiliary additives in these ceramic raw materials, such as is binder, thermal expansion controlling agent, conductivity control agent, quiet
Electric preventing agent, mechanical strength controlling agent or coefficient of friction regulator etc., but not limited to this.
Sintering is that these raw embryos are reacted under high temperature environment, and the bonding agent in ceramic raw material is heated to its glass and is turned
Change and forms homogeneous solid on temperature to combine ceramic raw material;Therefore, bonding agent type is different, also influences the choosing of sintering temperature
It selects.And the environment temperature of sintering process will affect pore size, gas cell distribution, planform and material group in porous ceramic plate
At, and then influence the performance of porous ceramic plate.When sintering temperature is excessively high, thermal stress caused by ceramic plate is too big, is likely to result in burning
Ceramic plate warpage, ceramic plate after knot, which crack, even to be ruptured.Preferably, the sintering temperature in the step (d) is 500 DEG C to 1250
DEG C, it is furthermore preferred that the sintering temperature in the step (d) is 520 DEG C to 950 DEG C.The sintering temperature of above range can lower the energy
Consumption, while the yield of resulting porous ceramic plate after sintering can be made more to be promoted.
In addition, the present invention separately provides porous ceramic plate obtained by prepared by a kind of preparation method such as previous porous ceramic plate.
Another object of the present invention is to provide a kind of porous ceramic plate, which includes the mutually folded surface layer ceramics set
Layer and bottom ceramic layer, the average pore size of the surface layer ceramic layer are less than the average pore size of the bottom ceramic layer.The porous ceramic plate
Characteristic with whole even pore distribution, and then the porous ceramic plate is made to have the advantages that gas permeability is good, it can solve and commonly use
Porous ceramic plate vapour lock height leads to the problem of energy consumption.
In certain embodiments, which further includes an at least middle layer ceramic layer, the middle layer ceramic layer
Between the surface layer ceramic layer and the bottom ceramic layer;The average pore size of the surface layer ceramic layer is less than the middle layer ceramic layer
Average pore size, the average pore size of the middle layer ceramic layer are less than the average pore size of the bottom ceramic layer.
In certain embodiments, for the porosity of the surface layer ceramic layer of the porous ceramic plate between 15% to 60%, this is more
The porosity of the bottom ceramic layer of hole ceramic plate is between 30% to 90%.Preferably, the hole of the surface layer ceramic layer of the porous ceramic plate
Rate is between 20% to 50%, and the porosity of the bottom ceramic layer of the porous ceramic plate is between 35% to 65%.
In certain embodiments, the whole porosity of the porous ceramic plate is between 30% to 85%.Preferably, this is porous
The whole porosity of ceramic plate is between 30% to 70%.
In certain embodiments, the average pore size of the surface layer ceramic layer of the porous ceramic plate between 0.05 micron (μm) extremely
10 μm, the average pore size of the bottom ceramic layer of the porous ceramic plate is between 5 μm to 3000 μm.Preferably, the surface layer of the porous ceramic plate
The average pore size of ceramic layer is between 0.3 μm to 5 μm, and the average pore size of the bottom ceramic layer of the porous ceramic plate is between 20 μm to 1500
μm.It is furthermore preferred that the average pore size of the surface layer ceramic layer of the porous ceramic plate is between 0.3 μm to 2 μm, the bottom of the porous ceramic plate is made pottery
The average pore size of enamel coating is between 30 μm to 1000 μm.
The overall thickness of the porous ceramic plate, which is greater than 200 μm, can provide better support force, therefore, in some specific embodiments
In, the overall thickness of the porous ceramic plate is between 200 μm to 20000 μm.Preferably, the thickness of the surface layer ceramic layer of the porous ceramic plate is situated between
In 20 μm to 10000 μm;It is furthermore preferred that the thickness of the surface layer ceramic layer of the porous ceramic plate is between 30 μm to 5000 μm;It is more excellent again
Choosing, the thickness of the surface layer ceramic layer of the porous ceramic plate is between 50 μm to 2000 μm.
In order to promote conductivity, it is preferred that the total content of ferriferous oxide contained by the porous ceramic plate accounts for the porous ceramic plate
The 10 weight % or more of gross weight.It is furthermore preferred that the total content of ferriferous oxide contained by the porous ceramic plate accounts for the total of the porous ceramic plate
The 30 weight % or more of weight.
In the case where not influencing the effect of porous ceramic plate of the invention, which can also be surface-treated,
Such as: fluororesin processing, anodized, electroless metal or electroplating processes etc., but not limited to this.
In certain embodiments, the shape of the porous ceramic plate can be round, rectangular, polygon, semi-cylindrical shaped or circle
Tubular etc., but not limited to this.
In certain embodiments, which further includes the plural gas passage through surface layer and bottom, each gas
The width in body channel is 0.1 μm to 3000 μm.
Another object of the present invention is to provide a kind of vacuum chucks comprising just like previous porous ceramic plate and a bottom
Plate, the bottom plate have the surface being connected with the porous ceramic plate.
It in certain embodiments, include plural vacuum tank on the backplate surface being connected with the porous ceramic plate.
Another object of the present invention is to provide a kind of contactless application apparatus comprising a porous ceramic plate as the aforementioned
And an ontology, the ontology is towards including an at least air channel on a surface of the porous ceramic plate.For example, this is contactless
Application apparatus can be contactless transportation system or Precision measurement platform, but not limited to this.
When the air channel that the contactless application apparatus is included is connect with Vacuum generating system, the air channel is
For vacuum tank, it is possible to provide suction;It is described when the air channel that the contactless application apparatus is included to gas system with connecting
Air channel is to air drain, it is possible to provide thrust;In addition, can also by interval setting vacuum tank with provided up simultaneously to air drain it is flat
The suction and thrust of weighing apparatus, thus provide stable air cushion layer, maintain work package can steadily, and be not easy to be removed from the body.
The contactless transportation system is because having zero frictional force, zero consume, being not necessary to use lubricating oil and high speed, flat
The advantages that steady, the problems such as reducing the collision or scratch of transport process, and reduce because contactless the machine of electrostatic produced by friction
Meeting promotes manufacturing method yield, is suitble to transport in high precision or the object of large area, such as large size liquid crystal display etc., but not
It is limited to this.The contactless transportation system includes air floating platform, air bearing sliding rail or air-bearing etc., but not limited to this.
The Precision measurement platform due to stablize because having uniform air cushion layer and can provide stable Floating Height, maintain work
Workpiece is not shaken, and regulates and controls plane precision to a few micrometers hereinafter, buckling problem caused by overcoming because of work package weight itself,
Offer more accurately positions and smaller operating error, can be applied to the design of large-scale detection platform.
Detailed description of the invention
Fig. 1 is the sectional schematic diagram of the embodiment of the present invention 1.
Fig. 2 is the SEM photograph of the surface layer ceramic layer of the embodiment of the present invention 1.
Fig. 3 is the SEM photograph of the bottom ceramic layer of the embodiment of the present invention 1.
Fig. 4 is the SEM photograph of the bottom ceramic layer of the embodiment of the present invention 2.
Fig. 5 is the SEM photograph of the embodiment of the present invention 3.
Fig. 6 is the sectional schematic diagram of the embodiment of the present invention 4.
Fig. 7 is the SEM photograph of the bottom ceramic layer of the embodiment of the present invention 4.
Fig. 8 is the SEM photograph of the embodiment of the present invention 5.
Fig. 9 is the side schematic view of the embodiment of the present invention 6.
Figure 10 is the schematic diagram that the embodiment of the present invention 6 adsorbs work package.
Figure 11 is the side schematic view of the embodiment of the present invention 7.
Figure 12 is the side schematic view of the embodiment of the present invention 8.
Specific embodiment
Hereinafter, those skilled in the art can easily understand the attainable advantage of institute of the invention from following embodiment
And effect.It is therefore understood that narration proposed in this paper is merely illustrative preferred embodiment rather than for limiting to this
The range of invention, without departing from the spirit and scope of the present invention, various modifications can be carried out, change to implement or
Using the contents of the present invention.
After following example 1 completes the production of porous ceramic plate to embodiment 5, porous ceramic plate is measured using Archimedes method
Porosity, another scanning electron microscope (the Scanning Electron for using model Hitachi FlexSEM 1000
Microscope, SEM) observe the type looks of the porous ceramic plate.
The preparation method of the porous ceramic plate of embodiment 1
Firstly, complete surface layer ceramic raw material and bottom ceramic raw material: the surface layer ceramic raw material includes the first as thickener
Base cellulose and ferriferous oxide, Mn oxide, chromated oxide metal oxide, and ferriferous oxide accounts for surface layer ceramic raw material
Gross weight 30 weight %, Mn oxide accounts for 40 weight % of the gross weight of surface layer ceramic raw material;Metal oxygen in the ceramic raw material of surface layer
For the partial size of compound between 0.3 μm to 1.5 μm, average grain diameter is 0.5 μm;The bottom ceramic raw material includes the methyl as thickener
Cellulose and ferriferous oxide, Mn oxide, chromated oxide metal oxide, and to account for bottom ceramic raw material total for ferriferous oxide
30 weight % of weight, Mn oxide account for 40 weight % of the gross weight of bottom ceramic raw material;Metal oxide in bottom ceramic raw material
Partial size between 3 μm to 15 μm, average grain diameter is 8 μm, is greater than the average grain diameter of metal oxide in the ceramic raw material of surface layer.
Then, the surface layer ceramic raw material and the bottom ceramic raw material are respectively rolled over rolling-molding method roller and is shaped, obtained
The rectangular raw embryo shaped to a surface layer ceramic raw material and the rectangular raw embryo of bottom ceramic raw material forming.
The raw embryo shaped by surface layer ceramic raw material is placed in the raw embryo shaped by bottom ceramic raw material again
Top, two raw embryos are stacked to form a lamination after, which is rolled over rolling-molding method roller and is shaped, lamination after obtaining a forming,
It can be cut and be processed again before sintering or after sintering according to required shape.
Lamination after the forming is sintered 7 hours with 950 DEG C of temperature, and obtaining one includes surface layer ceramic layer 110 and bottom
The double-layer porous ceramic plate 10 of layer ceramic layer 120, section structure is as shown in Figure 1.
The overall thickness of the double-layer porous ceramic plate 10 of embodiment 1 be 5000 μm, wherein surface layer ceramic layer 110 with a thickness of 500
μm.In addition, the total content for the ferriferous oxide that double-layer porous ceramic plate 10 is included accounts on the basis of the gross weight of double-layer porous ceramic plate 10
30 weight %, the total content of Mn oxide account for 40 weight %.
Referring to FIG. 1, comprising plural metal oxide particle 111 and plural hole 112 in surface layer ceramic layer 110, and
Include plural metal oxide particle 121 and plural hole 122 in bottom ceramic layer 120.
Fig. 2, Fig. 3 are please referred to, is learnt through scanning electron microscope observation, the average pore size of surface layer ceramic layer 110 is 0.5
μm, the average pore size of bottom ceramic layer 120 is 5 μm.
It is learnt through measuring, the porosity of surface layer ceramic layer 110 is about 36%, and the porosity of bottom ceramic layer 120 is about
45%, and the whole porosity of double-layer porous ceramic plate 10 is about 44%.
The preparation method of the porous ceramic plate of embodiment 2
The step of preparation method of embodiment 2 is to the preparation method of embodiment 1 is similar, and difference is: bottom ceramics are former
The PMMA ball as pore-creating filler is added in material, accounts for 7 weight % of the gross weight of bottom ceramic raw material.Because the bottom ceramics are former
Pore-creating filler is added in material, therefore makes the bottom ceramic layer of double-layer porous ceramic plate after sintering in addition to originally because ceramic raw material stacks simultaneously
It is formed by outside hole after sintering, burns mistake there are also pore creating material and be formed by larger hole, not only make the average hole of bottom ceramic layer
Diameter increases, and the porosity of bottom ceramic layer is also significantly increased, reduces vapour lock.The double-layer porous ceramic plate of embodiment 2, surface layer ceramics
The average pore size of layer is 0.5 μm and its porosity is about 36%;Referring to FIG. 4, the average pore size of bottom ceramic layer is 8 μm,
And its porosity is about 55%, and the whole porosity of double-layer porous ceramic plate is about 53%.
The preparation method of the porous ceramic plate of embodiment 3
The step of preparation method of embodiment 3 is to the preparation method of embodiment 1 is similar, and difference is: embodiment 1 and reality
It is different with bottom ceramic raw material or content to apply the surface layer ceramic raw material that example 3 respectively selects.The surface layer ceramic raw material includes as increasing
Thick dose of methylcellulose and ferriferous oxide, Mn oxide, chromated oxide metal oxide, and ferriferous oxide accounts for surface layer
30 weight % of ceramic raw material gross weight, Mn oxide account for 40 weight % of the gross weight of surface layer ceramic raw material;In the ceramic raw material of surface layer
For the partial size of metal oxide between 3 μm to 15 μm, average grain diameter is 8 μm.The bottom ceramic raw material and the surface layer ceramic raw material phase
Seemingly, difference is only that the PMMA ball as pore-creating filler is added in the bottom ceramic material, accounts for the gross weight of bottom ceramic raw material
7 weight %.Because pore-creating filler is added in the bottom ceramic raw material, therefore it is being sintered the bottom ceramic layer of double-layer porous ceramic plate
Afterwards, it, because ceramic raw material stacks and other than being formed by hole after being sintered, burns to lose there are also pore creating material in addition to originally and is formed by large hole
Hole not only increases the average pore size of bottom ceramic layer, and the porosity of bottom ceramic layer is also significantly increased, reduces vapour lock.It please join
Fig. 5 is examined, the double-layer porous ceramic plate of embodiment 3, the average pore size of surface layer ceramic layer is 5 μm and its porosity is about 45%;
The average pore size of bottom ceramic layer is 8 μm and its porosity is about 55%, and the whole porosity of double-layer porous ceramic plate is about
52%.
The preparation method of the porous ceramic plate of embodiment 4
Firstly, complete surface layer ceramic raw material, middle layer ceramic raw material and bottom ceramic raw material: the surface layer ceramic raw material includes
As the silica and aluminium oxide of binder, the methylcellulose as thickener and ferriferous oxide, Mn oxide, chromium oxygen
Compound, cobalt/cobalt oxide, calcium oxide, magnesium oxide, aluminum oxide metal oxide, wherein ferriferous oxide account for surface layer ceramics
20 weight % of the gross weight of raw material, chromated oxide account for 15 weight % of the gross weight of surface layer ceramic raw material;It is golden in the ceramic raw material of surface layer
Belong to the partial size of oxide between 0.3 μm to 1.5 μm, average grain diameter is 0.5 μm.The middle layer ceramic raw material includes to be used as binder
Silica and aluminium oxide, the methylcellulose as thickener and ferriferous oxide, Mn oxide, chromated oxide, cobalt oxide
Compound, calcium oxide, magnesium oxide, aluminum oxide metal oxide, wherein ferriferous oxide accounts for middle layer ceramic raw material gross weight
20 weight %, chromated oxide accounts for 15 weight % of the gross weight of surface layer ceramic raw material;Metal oxide in middle layer ceramic raw material
Partial size between 3 μm to 15 μm, average grain diameter is 8 μm.The bottom ceramic raw material includes the silica as binder, conduct
The methylcellulose and ferriferous oxide of thickener, Mn oxide, chromated oxide, cobalt/cobalt oxide, calcium oxide, magnesium oxide,
The metal oxide of aluminum oxide, wherein ferriferous oxide accounts for 20 weight % of surface layer ceramic raw material gross weight;In bottom ceramic raw material
For the partial size of metal oxide between 20 μm to 100 μm, average grain diameter is 60 μm.
Then, by the surface layer ceramic raw material, the middle layer ceramic raw material and the bottom ceramic raw material respectively with pressure
Prolong method of forming roller roll over forming, obtain a surface layer ceramic raw material forming raw embryo, a middle layer ceramic raw material forming raw embryo, and
The raw embryo of one bottom ceramic raw material forming.
The raw embryo shaped by middle layer ceramic raw material is placed in the raw embryo shaped by bottom ceramic raw material
Top;Then, then by the raw embryo shaped by surface layer ceramic raw material it is placed in the life shaped by middle layer ceramic raw material
The top of embryo is stacked after forming a lamination by three raw embryos, which is rolled over rolling-molding method roller and is shaped, after obtaining a forming
Lamination.
Lamination after the forming is sintered 7 hours with 950 DEG C of temperature, and obtaining one includes surface layer ceramic layer 110, centre
Three layers of porous ceramic plate 10 ' of layer ceramic layer 130 and bottom ceramic layer 120, section structure are as shown in Figure 6.
The overall thickness of three layers of porous ceramic plate 10 ' is 5000 μm, wherein surface layer ceramic layer with a thickness of 500 μm, and it is intermediate
Layer ceramic layer with a thickness of 500 μm.In addition, on the basis of the gross weight of three layers of porous ceramic plate 10 ', three layers of porous ceramic plate 10 ' include
Ferriferous oxide content account for 20 weight %.
Referring to FIG. 6, comprising plural metal oxide particle 111 and plural hole 112 in surface layer ceramic layer 110, it is intermediate
Comprising including multiple in plural metal oxide particle 131 and plural hole 132 and bottom ceramic layer 120 in layer ceramic layer 130
Number metal oxide particle 121 and plural hole 122.
Through learning that the porosity of surface layer ceramic layer 110 is about 36%, middle layer ceramic layer such as method same as before observation
130 porosity is about 45%, and the porosity of bottom ceramic layer 120 is 55%, and the whole porosity of three layers of porous ceramic plate 10 '
It is about 53%.
Through learning such as method same as before measurement, the average pore size of surface layer ceramic layer 110 is 0.5 μm, middle layer ceramics
The average pore size of layer 130 is 5 μm, referring to FIG. 7, the average pore size of bottom ceramic layer 120 is 40 μm.
The preparation method of the porous ceramic plate of embodiment 5
The step of preparation method of embodiment 5 is to the preparation method of embodiment 4 is similar, and difference is: embodiment 4 and reality
It is different to apply the example 5 surface layer ceramic raw materials not selected, middle layer ceramic raw material and bottom ceramic raw material or content.Embodiment 5
Surface layer ceramic raw material is identical as the surface layer ceramic raw material of embodiment 1;The middle layer ceramic raw material of embodiment 5 includes to be used as thickener
Methylcellulose and ferriferous oxide, Mn oxide, chromated oxide metal oxide, and ferriferous oxide account for middle layer pottery
30 weight % of porcelain raw material gross weight, Mn oxide account for 40 weight % of the gross weight of middle layer ceramic raw material;Middle layer ceramic raw material
For the partial size of middle metal oxide between 3 μm to 15 μm, average grain diameter is 8 μm, is greater than metal oxide in the ceramic raw material of surface layer
Average grain diameter;The bottom ceramic raw material of embodiment 5 includes as the methylcellulose of thickener, as pore-creating filler
PMMA ball and ferriferous oxide, Mn oxide, chromated oxide metal oxide, and to account for bottom ceramic raw material total for ferriferous oxide
30 weight % of weight, Mn oxide account for 40 weight % of the gross weight of bottom ceramic raw material;Metal oxide in bottom ceramic raw material
Partial size between 3 μm to 15 μm, average grain diameter is 8 μm, is greater than the average grain diameter of metal oxide in the ceramic raw material of surface layer;Separately
Outside, the content of PMMA ball contained by embodiment 5 is greater than 7 weight % of the gross weight of the bottom ceramic raw material, and its partial size is relatively implemented
The partial size for the PMMA ball that example 2 uses is bigger.Referring to FIG. 8, three layers of porous ceramic plate of embodiment 5, surface layer ceramic layer are averaged
Aperture is 0.5 μm, and the average pore size of middle layer ceramic layer is 5 μm, and the average pore size of bottom ceramic layer is 40 μm, surface layer ceramics
The porosity of layer is about 36%, and the porosity of middle layer ceramic layer is about 45%, and the porosity of bottom ceramic layer is about 55%,
And the whole porosity of three layers of porous ceramic plate is about 52%.
The vacuum chuck of embodiment 6
Referring to FIG. 9, embodiment 6 is a vacuum chuck comprising the porous ceramic plate 10 of embodiment 1 and a bottom plate 20,
The bottom plate 20 has the surface 201 being connected with porous ceramic plate 10.It include plural vacuum on the surface 201 of the bottom plate 20
Slot 22 and a vacuum line 21, these vacuum tanks 22 are connected with vacuum line 21.Referring to FIG. 10, the vacuum chuck is also
It may include fixing component 40, the position to the porous ceramic plate 10 of fixation.
Fig. 9, Figure 10 are please referred to, using the bottom plate of the vacuum chuck of a Vacuum generating system (not shown) and embodiment 6
20 vacuum line 21 is connected.The negative-pressure sucking provided by Vacuum generating system, is dispersed to the plural vacuum tank 22 of bottom plate 20, and
Across the plural hole that porous ceramic plate 10 is included, the uniform suction of plural number is formd, it is not only adsorbable, fix a work package 30,
The work package 30 can maintain steadily, to avoid damage work package 30.
The Precision measurement platform of embodiment 7
Figure 11 is please referred to, embodiment 7 is a Precision measurement platform comprising the porous ceramic plate 10 of embodiment 1 and one
Body 50, the ontology 50 have towards a surface 501 of porous ceramic plate 10.Include plural vacuum tank 22 on the surface 501 with
And plural number gives air drain 24;These vacuum tanks 22 are connected with a vacuum line 21, these give 23 phase of air pipe with one to air drain 24
Connection.Be connected using a Vacuum generating system (not shown) with vacuum line 21, at the same by one to gas system (not shown) with
It is connected to air pipe 23.The negative-pressure sucking provided by Vacuum generating system, is dispersed to the plural vacuum tank 22 of ontology 50, and pass through
The plural hole that porous ceramic plate 10 is included forms the uniform suction of plural number;And the thrust by being provided to gas system, it is dispersed to this
These of body 50 give air drain 24, and pass through the plural hole that porous ceramic plate 10 is included, and form the uniform thrust of plural number.By
Every setting vacuum tank and the suction and thrust that are formed simultaneously to air drain, stable air cushion layer is provided.
The contactless transportation system of embodiment 8
Please refer to Figure 12, embodiment 8 is a contactless transportation system comprising the porous ceramic plate 10 of embodiment 1 and
One ontology 50 ', the ontology 50 ' have the surface 501 towards porous ceramic plate 10 ".The surface 501 " on include to air drain
24, it should be connected with one to air pipe 23 to air drain 24.The thrust that gas generates is provided to gas system (not shown) by one, and
Across the plural hole that porous ceramic plate 10 is included, the uniform thrust of plural number is formd, stable air cushion layer is provided and fortune is provided
Send effect.
Experimental result discussion
Compared with existing preparation method, preparation method of the invention keeps manufacturing method easy because step is simple, easy to operate
In control, and then promote the production yield for preparing porous ceramic plate;And it is once sintered because only carrying out, not only it can simplify preparation procedure also
It can be energy saving;In addition, because being disposably sintered so that embodiment 1 to embodiment 5 porous ceramic plate entirety hole point
Cloth is uniform, has fine air permeability, and then promote the quality of porous ceramic plate.
The surface layer ceramic layer of porous ceramic plate through the invention has lesser average pore size, even if very thin for fixation
When work package (such as wafer), it so that work package is kept flat indeformable, be conducive to work package accurately measuring or processing;And
And this porous ceramic plate is subsequent when being connected with vacuum system, by the bottom ceramic layer there is biggish average pore size to allow vapour lock
Reduce, energy consumption can be reduced and enough support forces are provided.In addition, because surface layer ceramic layer has lesser average pore size, when its work
When for absorption platform, because air leakage is low, therefore the work package being adsorbed in local absorption can be applied to be not required to be completely covered on absorption
On platform.Also, because the middle layer that porous ceramic plate of the invention is compounded with tool larger aperture in the lower layer of surface layer ceramic layer is ceramic
Layer and/or bottom ceramic layer, therefore can provide larger support force and larger adsorption capacity, it takes into account and reduces vapour lock and maintain whole ceramic plate
Rigidity reaches larger adsorption capacity, reduces energy consumption, avoids porous ceramic plate from keeping vapour lock excessive due to being integrally all tiny aperture, surface
The problem of adsorption capacity lowers.
Although preceding description has illustrated many feature, advantages of the invention and composition of the invention and characteristic details,
This only belongs to illustratively illustrate.All in the range represented by the general connotation of claims of the present invention, according to this hair
Variations in detail made by bright principle refers in particular to the change of shape, size and element setting, still falls in the scope of the present invention.
Claims (13)
1. a kind of preparation method of porous ceramic plate, it includes following steps:
Step a): complete plural number ceramic raw material, these ceramic raw materials respectively include surface layer ceramic raw material and bottom ceramic raw material,
In the average grain diameter of the surface layer ceramic raw material metal oxide that is included be less than or equal to 20 microns;Contained by these ceramic raw materials
Ferriferous oxide content account for the 20 weight % or more of these ceramic raw material gross weights;
Step b): after respectively step is formed in these ceramic raw materials, the plural number shaped by these ceramic raw materials is respectively obtained
Raw embryo;
Step c): these raw embryos being folded and set to form a lamination, which includes the raw embryo of surface layer ceramic raw material forming and be somebody's turn to do
The raw embryo of bottom ceramic raw material forming;Step is formed in the lamination, the lamination after obtaining a forming;And
Step d): the lamination after being sintered the forming, to obtain a porous ceramic plate, wherein the porous ceramic plate includes mutually folded sets
One surface layer ceramic layer and a bottom ceramic layer;Between 0.3 micron to 10 microns, which makes pottery the average pore size of the surface layer ceramic layer
The average pore size of enamel coating is between 20 microns to 3000 microns;The whole porosity of the porous ceramic plate is between 30% to 85%.
2. the preparation method of porous ceramic plate according to claim 1, wherein the oxidation of metal contained by the surface layer ceramic raw material
The average grain diameter of object is less than the average grain diameter of metal oxide contained by the bottom ceramic raw material.
3. the preparation method of porous ceramic plate according to claim 1, wherein the bottom ceramic raw material adds pore-creating filling
Agent.
4. the preparation method of porous ceramic plate according to claim 1, wherein these ceramic raw materials respectively use in step b)
Rolling-molding method is to be formed step.
5. the preparation method of porous ceramic plate according to claim 4, wherein the lamination uses rolling-molding method in step c)
Step is formed.
6. the preparation method of porous ceramic plate according to any one of claim 1 to 5, wherein the plural number in step a)
Ceramic raw material further includes an at least middle layer ceramic raw material;And
In step d), which further includes that an at least middle layer ceramic layer, the average pore size of the surface layer ceramic layer is less than
The average pore size of the middle layer ceramic layer, the average pore size of the middle layer ceramic layer are less than the average pore size of the bottom ceramic layer.
7. the preparation method of porous ceramic plate according to any one of claim 1 to 5, wherein the sintering in step d)
Temperature is 500 DEG C to 1250 DEG C.
8. a kind of porous ceramic plate comprising the mutually folded surface layer ceramic layer and bottom ceramic layer set;Wherein, the surface layer ceramic layer
Average pore size is between 0.3 micron to 10 microns, and the average pore size of the bottom ceramic layer is between 20 microns to 3000 microns;This is porous
The whole porosity of ceramic plate is between 30% to 85%;Ferriferous oxide content contained by the porous ceramic plate accounts for the gross weight of the porous ceramic plate
20 weight % or more.
9. porous ceramic plate according to claim 8, wherein the porous ceramic plate further includes an at least middle layer ceramic layer, should
Middle layer ceramic layer is located between the surface layer ceramic layer and the bottom ceramic layer;The average pore size of the surface layer ceramic layer is less than in this
The average pore size of interbed ceramic layer, the average pore size of the middle layer ceramic layer are less than the average pore size of the bottom ceramic layer.
10. porous ceramic plate according to claim 8, wherein the porosity of the surface layer ceramic layer, should between 15% to 60%
The porosity of bottom ceramic layer is between 30% to 90%.
11. the porous ceramic plate according to any one of claim 8 to 10, wherein the overall thickness of the porous ceramic plate is between 200
Micron is to 20000 microns, and the thickness of the surface layer ceramic layer is between 20 microns to 10000 microns.
12. a kind of vacuum chuck comprising a porous ceramic plate and a bottom according to any one of claim 8 to 11
Plate, the bottom plate have the surface being connected with the porous ceramic plate.
13. a kind of contactless application apparatus comprising a porous ceramic plate according to any one of claim 8 to 11 with
And an ontology, the ontology towards the surface of the porous ceramic plate include an at least air channel.
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CN115724682A (en) * | 2021-09-02 | 2023-03-03 | 台湾中国砂轮企业股份有限公司 | Air floating assembly and manufacturing method thereof |
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TW201942095A (en) | 2019-11-01 |
TWI656108B (en) | 2019-04-11 |
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