CN110280914B - Laser ultrasonic technology assisted pulse laser boring device and method - Google Patents
Laser ultrasonic technology assisted pulse laser boring device and method Download PDFInfo
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- CN110280914B CN110280914B CN201910434176.0A CN201910434176A CN110280914B CN 110280914 B CN110280914 B CN 110280914B CN 201910434176 A CN201910434176 A CN 201910434176A CN 110280914 B CN110280914 B CN 110280914B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention discloses a laser ultrasonic technology assisted pulse laser drilling device and a method, which relate to the field of laser drilling and comprise a vibration module, a first pulse laser, a computer, a second pulse laser controller, a second pulse laser, an ultrasonic detector and a vibration module controller; the method is characterized in that before, during and after a workpiece is processed by a first pulse laser, a second pulse laser is used for acting on the lower surface of the workpiece to excite ultrasonic waves, the ultrasonic waves generate ultrasonic vibration to assist laser drilling, and a vibration module is used for generating ultrasonic vibration, so that a focus of the focused laser output by the first pulse laser vibrates up and down according to a certain frequency. The invention effectively relieves the problems of thicker recasting layer, larger heat affected zone and microcrack existing in the prior pulse laser drilling, ensures that the workpiece has higher processing quality, can improve the drilling depth and greatly improves the processing efficiency.
Description
Technical Field
The invention relates to the field of laser drilling, in particular to a device and a method for assisting pulse laser drilling by a laser ultrasonic technology.
Background
Laser drilling is a very important laser processing application technology, and a laser beam is focused by a focusing lens to obtain a light spot with a small diameter, so that a high temperature is formed at the focal point. Under the action of the pulsed laser, the material is continuously melted and evaporated. Finally, the gas and the plasma formed by punching can generate high pressure to blow the impurities out of the holes to form micropores. Compared with the traditional mechanical drilling mode, the laser drilling has unique advantages and irreplaceable functions, such as high efficiency, high precision, no mechanical stress, no tool loss and the like, and becomes one of the key technologies in the field of modern micro-hole machining.
However, in the pulse laser drilling process, the material undergoes a complex process of high-temperature melting and cooling condensation, and a recast layer, a heat affected zone and microcracks are finally formed on the inner wall of the micropore, which is extremely disadvantageous to the quality of parts, and also limits the wide application of pulse laser drilling in industry. Chinese patent publication No. CN103521933A, a laser-induced shock wave assisted laser drilling method, discloses a laser-induced shock wave assisted laser drilling method, in which high-energy pulse laser is applied to the upper surface of a workpiece to generate a molten pool on the upper surface of the workpiece, then the high-energy pulse laser on the lower side of the workpiece passes through a constraining layer and acts on an absorbing layer to induce plasma explosion to generate shock waves, the shock waves are propagated upwards along the workpiece and generate disturbance at a solid-liquid interface, a tensile stress is generated at the solid-liquid interface, the tensile stress forces a molten material to separate from the workpiece, so that the molten material is crushed and ejected out of a hole. The patent adopts a laser-induced shock wave method to accelerate the removal of melts and further improve the punching efficiency and quality, but the method disclosed by the patent needs to arrange a constraint layer on the lower side of a workpiece, the process is relatively complex, and the damage can be caused to the substrate of the workpiece. Chinese patent publication No. CN107790897A, an ultrasonic vibration assisted laser drilling method and apparatus, provides an ultrasonic vibration assisted laser drilling method and apparatus in which ultrasonic vibration generated by an ultrasonic vibration generating unit is applied to a workpiece in a direction perpendicular to a workpiece processing surface while laser drilling is performed. The invention is beneficial to discharging the molten material in the hole during laser drilling and improves the micropore quality. However, the ultrasonic vibration is not directly applied to the workpiece, but is transmitted to the workpiece by using an aqueous medium as an ultrasonic transmission medium, which causes the loss of ultrasonic energy and reduces the auxiliary effect of the ultrasonic vibration, and the ultrasonic frequency is also low.
Disclosure of Invention
The invention provides a device and a method for assisting pulse laser drilling by a laser ultrasonic technology, aiming at solving the problems of thicker recasting layer, larger heat affected zone and microcrack existing in the conventional pulse laser drilling.
The technical scheme of the invention is as follows: the device comprises a vibration module, a first reflecting plane mirror, a first beam expander, a first pulse laser controller, a computer, a second pulse laser controller, a second pulse laser, a second beam expander, a second reflecting plane mirror, a beam splitter, a workpiece, an ultrasonic detector, a clamp, a working platform controller and a vibration module controller;
the first reflecting plane mirror is positioned at the top, and a vibration module, a workpiece, a beam splitter and a second reflecting plane mirror are sequentially arranged right below the first reflecting plane mirror; the workpiece is fixed on the clamp, and the clamp is fixed on the working platform; the ultrasonic detector is arranged on the upper side of the workpiece and is not contacted with the workpiece; one end of the working platform controller is connected with the working platform, and the other end of the working platform controller is connected with the computer; one end of the vibration module controller is connected with the vibration module, and the other end of the vibration module controller is connected with the computer; the ultrasonic detector is connected with the computer.
The first pulse laser, the first beam expander, the first reflecting plane mirror and the vibration module are sequentially positioned on the same light path; one end of the first pulse laser controller is connected with the first pulse laser, and the other end of the first pulse laser controller is connected with the computer;
the second pulse laser, the second beam expander, the second reflecting plane mirror and the beam splitter are sequentially positioned on the same light path; and one end of the second pulse laser controller is connected with the second pulse laser, and the other end of the second pulse laser controller is connected with a computer.
In the above scheme, the vibration module comprises a base, a guide rail, a sliding block, a piezoelectric ceramic ultrasonic vibrator and a focusing lens; the piezoelectric ceramic ultrasonic vibrator is of a hollow structure, a laser beam can penetrate through the piezoelectric ceramic ultrasonic vibrator, and the upper side of the piezoelectric ceramic ultrasonic vibrator is fixedly arranged on the base; the sliding block can slide on the guide rail and is of a hollow structure, a laser beam can penetrate through the sliding block, and the upper side of the sliding block is arranged on the lower side of the piezoelectric ceramic ultrasonic vibrator; the focusing lens is mounted on a slider.
In the above scheme, the first reflecting plane mirror forms an angle of 45 degrees with the horizontal direction; and laser beams emitted by the first pulse laser sequentially pass through the first beam expander, the first reflecting plane mirror and the vibration module to be focused on the upper surface of the workpiece.
In the above scheme, the second reflecting plane mirror forms an angle of 135 degrees with the horizontal direction; and the laser beam emitted by the second pulse laser sequentially passes through the second beam expander, the second reflecting plane mirror and the beam splitter and acts on the lower surface of the workpiece.
Before a first pulse laser device processes a workpiece, in the processing process and a period of time after processing, on one hand, a second pulse laser device is adopted to act on the lower surface of the workpiece to excite ultrasonic waves, the ultrasonic waves generate ultrasonic vibration to assist laser drilling, and on the other hand, a vibration module is adopted to generate ultrasonic vibration, so that the focus of the focused laser output by the first pulse laser device vibrates up and down according to a certain frequency; in addition, an ultrasonic detector is adopted to detect the ultrasonic signal energy acting on the workpiece in real time and transmit the ultrasonic signal energy back to the computer. The method specifically comprises the following steps:
s1, preprocessing the upper surface and the lower surface of the workpiece;
s2, fixing the workpiece on a clamp, and fixing the clamp on the working platform;
s3, controlling the movable working platform by using the working platform controller, adjusting the position of the workpiece, and setting all the processing positions of the workpiece by using the computer;
s4, finishing the setting of all the machining parameters of all the machining positions at one time through a computer and a corresponding controller; setting output parameters of a pulse laser beam output by a first pulse laser for processing through a first pulse laser controller; setting output parameters of a pulse laser beam output by the second pulse laser for generating ultrasonic vibration through a second pulse laser controller; setting working parameters of the vibration module through a vibration module controller;
s5, opening the vibration module and the ultrasonic detector, opening the second pulse laser to output laser beams to act on the lower surface of the workpiece, wherein the acting time is controlled by a computer;
s6, after acting for a period of time, opening the first pulse laser to output a pulse laser beam, and applying the laser beam to the processing position on the workpiece through the vibration module to form a small hole in the processing area of the workpiece;
s7, after the small hole processing is finished, the first pulse laser is closed, and the second pulse laser (8), the vibration module and the ultrasonic detector are closed after a period of time;
s8, controlling the movable working platform to move to the next position by using the working platform controller;
and S9, repeating the steps S5-S8, and processing the next position of the workpiece until the processing of all the positions is finished.
In the above scheme, the first pulse laser is a high power laser that outputs laser power density for processing>107W/cm2(ii) a The laser power density value output by the second pulse laser is lower than the damage threshold of the material on the lower surface of the processed workpiece, the material is not melted enough due to the fact that the material is locally heated up due to the fact that the laser beam radiation energy is absorbed on the lower surface of the processed workpiece, and the lower surface of the workpiece is guaranteed to be completely free of damage.
In the above scheme, in the actual processing, various coatings (such as water or oil) can be coated on the lower surface of the workpiece for improving the absorption coefficient of the lower surface of the workpiece. Meanwhile, in actual processing, the energy of the ultrasonic signal can also be improved by setting the second pulse laser to output a laser beam with a narrower pulse width.
In the scheme, the frequency of the ultrasonic waves excited by the second pulse laser acting on the lower surface of the workpiece can reach GHz level.
In the above scheme, the vibration frequency of the vibration module is greater than 20kHz, that is, the up-and-down vibration frequency of the focus of the focused laser output by the first pulse laser is greater than 20 kHz.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, heat energy is generated on the lower surface of the workpiece through laser irradiation, so that high-frequency ultrasonic waves are excited based on a thermoelastic mechanism to generate ultrasonic vibration for assisting laser drilling; the second pulse laser generates heat to excite ultrasonic waves, so that the removal of a melt in the laser drilling process can be promoted, the laser drilling efficiency is improved, the thickness of a recast layer of the inner wall of the micropore is reduced, the generation of microcracks on the inner wall is reduced, and the quality of the micropore is improved; in addition, the frequency of ultrasonic waves excited by laser below the workpiece can reach GHz level, and the ultrasonic-assisted laser drilling quality can be obviously improved.
2. The laser acts on the lower surface of the workpiece, the output laser power density is lower than the damage threshold of the surface of the material of the processed workpiece, the material of the surface of the processed workpiece is not melted enough because the local temperature of the material is raised due to the absorption of the radiation energy of the laser beam, and the lower surface of the workpiece can be ensured to be completely undamaged; in addition, the more laser beams are applied to the lower surface of the workpiece through the beam splitter, the wider the beam distribution range is, and the ultrasonic vibration excited by the laser beam is more uniform and wider in range.
3. The vibration module is adopted to generate ultrasonic vibration, so that the focus of the focused laser output by the first pulse laser vibrates up and down according to a certain frequency, and the vibration frequency is more than 20kHz, therefore, the focus can act on the inside of a workpiece in the laser drilling process, the laser energy can not act on the workpiece in a centralized manner, the drilling efficiency is obviously improved, and the heat affected zone is reduced.
4. The invention not only applies ultrasonic vibration on the workpiece, but also applies ultrasonic vibration on the laser processing head, and finally leads to the synchronous improvement of the laser drilling quality and efficiency. In addition, the ultrasonic signal energy in the workpiece is detected by the ultrasonic detector and returns to the computer in real time, so that the ultrasonic intensity in the workpiece in the ultrasonic auxiliary machining process can be known in real time, and a reference basis is provided for optimization of machining parameters.
5. The invention has higher automation degree, and can realize automatic processing only by positioning the workpiece and programming through a computer.
Drawings
Fig. 1 is a schematic diagram of a pulsed laser drilling device assisted by laser ultrasonic technology according to an embodiment of the present invention.
In the figure, 1, a vibration module, 2, a first reflection plane mirror, 3, a first beam expander, 4, a first pulse laser, 5, a first pulse laser controller, 6, a computer, 7, a second pulse laser controller, 8, a second pulse laser, 9, a second beam expander, 10, a second reflection plane mirror, 11, a beam splitter, 12, a workpiece, 13, an ultrasonic detector, 14, a clamp, 15, a working platform, 16, a working platform controller and 17, a vibration module controller.
Fig. 2 is a schematic diagram of a vibration module of a laser ultrasonic technology-assisted pulse laser drilling device according to an embodiment of the present invention.
In the figure, 18 is a base, 19 is a guide rail, 20 is a sliding block, 21 is a piezoelectric ceramic ultrasonic vibrator, and 22 is a focusing lens.
FIG. 3 is a schematic diagram of a process for removing a punched material by a laser ultrasonic technology-assisted pulse laser punching method according to the present invention.
In the figure, 23. first laser beam, 24. melt, 25. heat affected zone, 12. workpiece, 26. ultrasonic vibration, 27. second laser beam after beam splitter.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and detailed description, but the scope of the present invention is not limited thereto.
The first embodiment is as follows:
a pulse laser perforating device assisted by a laser ultrasonic technology is characterized by comprising a vibration module 1, a first reflecting plane mirror 2, a first beam expander 3, a first pulse laser 4, a first pulse laser controller 5, a computer 6, a second pulse laser controller 7, a second pulse laser 8, a second beam expander 9, a second reflecting plane mirror 10, a beam splitter 11, a workpiece 12, an ultrasonic detector 13, a clamp 14, a working platform 15, a working platform controller 16 and a vibration module controller 17;
the first reflecting plane mirror 2 is positioned at the uppermost part, and a vibration module 1, a workpiece 12, a beam splitter 11 and a second reflecting plane mirror 10 are sequentially arranged right below the first reflecting plane mirror 2; the workpiece 12 is fixed on a clamp 14, and the clamp 14 is fixed on a working platform 15; the ultrasonic detector 13 is arranged on the upper side of the workpiece 12 and is not in contact with the workpiece 12; one end of the working platform controller 16 is connected with the working platform 15, and the other end is connected with the computer 6; one end of the vibration module controller 17 is connected with the vibration module 1, and the other end is connected with the computer 6; the ultrasound probe 13 is connected to the computer 6.
The first pulse laser 4, the first beam expander 3, the first reflecting plane mirror 2 and the vibration module 1 are sequentially positioned on the same light path; one end of the first pulse laser controller 5 is connected with the first pulse laser 4, and the other end is connected with the computer 6;
the second pulse laser 8, the second beam expander 9, the second reflecting plane mirror 10 and the beam splitter 11 are sequentially positioned on the same light path; one end of the second pulse laser controller 7 is connected with the second pulse laser 8, and the other end is connected with the computer 6. The second pulse laser generates heat to excite ultrasonic waves, so that the removal of a melt in the laser drilling process can be promoted, the laser drilling efficiency is improved, the thickness of a recast layer of the inner wall of the micropore is reduced, the generation of microcracks on the inner wall is reduced, and the quality of the micropore is improved;
the vibration module 1 comprises a base 18, a guide rail 19, a sliding block 20, a piezoelectric ceramic ultrasonic vibrator 21 and a focusing lens 22; the piezoelectric ceramic ultrasonic vibrator 21 is a hollow structure, a laser beam can pass through the piezoelectric ceramic ultrasonic vibrator, and the upper side of the piezoelectric ceramic ultrasonic vibrator is fixedly arranged on the base 18; the sliding block 20 can slide on the guide rail 19 and is of a hollow structure, a laser beam can pass through the sliding block 20, and the upper side of the sliding block 20 is arranged on the lower side of the piezoelectric ceramic ultrasonic vibrator 21; the focusing lens 22 is mounted on the slider 20.
The first reflecting plane mirror 2 forms an angle of 45 degrees with the horizontal direction; the laser beam emitted by the first pulse laser 4 sequentially passes through the first beam expander 3, the first reflecting plane mirror 2 and the vibration module 1 and is focused on the upper surface of the workpiece 12.
The second reflecting plane mirror 10 forms an angle of 135 degrees with the horizontal direction; the laser beam emitted by the second pulse laser 8 sequentially passes through a second beam expander 9, a second reflecting plane mirror 10 and a beam splitter 11 and is applied to the lower surface of a workpiece 12; the more laser beams which act on the lower surface of the workpiece after passing through the beam splitter, the wider the beam distribution range, and the more uniform and wider the range of the excited ultrasonic vibration.
Example two:
before a first pulse laser 4 outputs a first laser beam 23 to process a workpiece 12, in the process of processing and a period of time after processing, on one hand, a second pulse laser 8 is adopted to output a second laser beam, the second laser beam 27 after passing through a beam splitter acts on the lower surface of the workpiece 12, partial energy is absorbed by the surface of a material and is converted into heat energy, the temperature of the surface of the material is rapidly increased, and then the material is expanded. Form strain field and stress field through the thermoelastic effect to arouse high-frequency ultrasonic wave, the ultrasonic wave produces ultrasonic vibration and assists laser beam drilling, promotes getting rid of melt among the laser beam drilling, improves the efficiency of punching, reduces recasting layer thickness and microcrack, improves the quality of punching. On the other hand, the vibration module controller 17 controls the piezoelectric ceramic ultrasonic vibrator 21 to work, and the sliding block 20 is driven by the piezoelectric ceramic ultrasonic vibrator 21 to move up and down along the guide rail 19 in the vertical direction, so that the focusing lens 22 is forced to move up and down in the vertical direction, and finally the focused focus is caused to move up and down in the vertical direction at a movement frequency of more than 20 kHz. Thus, the focal point can act on the inner part of the workpiece 12 in the laser drilling process, and the laser energy can not act on the workpiece 12 in a concentrated manner, so that the drilling efficiency is improved and the heat affected zone is reduced. In addition, the ultrasonic signal energy acting on the workpiece 12 is detected in real time by the ultrasonic detector 13 and transmitted back to the computer 6.
The method specifically comprises the following steps:
s1, preprocessing the upper surface and the lower surface of the workpiece 12;
s2, fixing the workpiece 12 on the clamp 14, and fixing the clamp 14 on the working platform 15;
s3, controlling the movable working platform 15 by the working platform controller 16, adjusting the position of the workpiece 12, and setting all the processing positions of the workpiece 12 by the computer 6;
s4, finishing the setting of all the machining parameters of all the machining positions at one time through the computer 6 and the corresponding controllers; setting output parameters of a pulse laser beam for processing output by the first pulse laser 4 by the first pulse laser controller 5; setting output parameters of a pulse laser beam for generating ultrasonic vibration output by a second pulse laser 8 through a second pulse laser controller 7; setting working parameters of the vibration module 1 through a vibration module controller 17;
s5, opening the vibration module 1 and the ultrasonic detector 13, opening the second pulse laser 8 to output laser beams to act on the lower surface of the workpiece 12, wherein the acting time is controlled by the computer 6;
s6, after acting for a period of time, opening the first pulse laser 4 to output a pulse laser beam, and applying the laser beam to the processing position on the workpiece 12 through the vibration module 1 to form a small hole in the processing area of the workpiece 12;
s7, after the small hole processing is finished, the first pulse laser 4 is closed, and the second pulse laser 8, the vibration module 1 and the ultrasonic detector 13 are closed after a period of time;
s8, controlling the movable working platform 15 to move to the next position by using the working platform controller 16;
and S9, repeating the steps S5-S8, and processing the next position of the workpiece 12 until the processing of all the positions is finished.
The first pulse laser 4 is a high power laser that outputs a laser power density for processing>107W/cm2(ii) a The laser power density value output by the second pulse laser 8 is lower than the damage threshold of the material on the lower surface of the processed workpiece 12, and the material on the lower surface of the processed workpiece 12 is not melted enough due to the local temperature rise of the material caused by the absorption of the radiation energy of the laser beam, so that the lower surface of the workpiece 12 is ensured to be completely undamaged.
In actual machining, various coatings such as water or oil may be applied to the lower surface of the workpiece 12 to increase the absorption coefficient of the lower surface of the workpiece. Meanwhile, in actual processing, setting the second pulse laser 8 to output a laser beam with a narrower pulse width can also improve the energy of the ultrasonic signal.
The frequency of the ultrasonic wave excited by the second pulse laser 8 acting on the lower surface of the workpiece 12 can reach GHz level.
The vibration frequency of the vibration module 1 is greater than 20kHz, that is, the up-and-down vibration frequency of the focus of the focused laser output by the first pulse laser 4 is greater than 20 kHz.
The above technical solutions represent the preferred embodiments of the present invention, and those skilled in the art can modify some functions to embody the principles of the present invention and fall within the scope of the present patent.
Claims (11)
1. A pulse laser punching device assisted by a laser ultrasonic technology is characterized by comprising a vibration module (1), a first reflecting plane mirror (2), a first pulse laser (4), a first pulse laser controller (5), a computer (6), a second pulse laser controller (7), a second pulse laser (8), a second reflecting plane mirror (10), an ultrasonic detector (13) and a vibration module controller (17); the first reflecting plane mirror (2) is positioned at the uppermost part, and a vibration module (1), a workpiece (12) and a second reflecting plane mirror (10) are sequentially arranged right below the first reflecting plane mirror (2); the workpiece (12) is arranged on the clamp (14), and the clamp (14) is arranged on the working platform (15); the ultrasonic detector (13) is arranged on the upper side of the workpiece (12) and is not in contact with the workpiece (12); one end of the working platform controller (16) is connected with the working platform (15), and the other end is connected with the computer (6); one end of the vibration module controller (17) is connected with the vibration module (1), and the other end of the vibration module controller is connected with the computer (6); the ultrasonic detector (13) is connected with the computer (6); the first pulse laser (4), the first reflecting plane mirror (2) and the vibration module (1) are sequentially positioned on the same light path; one end of the first pulse laser controller (5) is connected with the first pulse laser (4), and the other end of the first pulse laser controller is connected with the computer (6); the second pulse laser (8) and the second reflecting plane mirror (10) are sequentially positioned on the same light path; one end of the second pulse laser controller (7) is connected with the second pulse laser (8), and the other end of the second pulse laser controller is connected with the computer (6).
2. The laser ultrasonic technology-assisted pulse laser drilling device according to claim 1, wherein the vibration module (1) comprises a base (18), a guide rail (19), a sliding block (20), a piezoceramic ultrasonic vibrator (21) and a focusing lens (22); the piezoelectric ceramic ultrasonic vibrator (21) is of a hollow structure, a laser beam can penetrate through the hollow structure, and the upper end face of the piezoelectric ceramic ultrasonic vibrator is arranged on the base (18); the sliding block (20) can slide up and down along the guide rail (19) and is of a hollow structure, a laser beam can penetrate through the sliding block, and the upper side of the sliding block (20) is installed on the lower side of the piezoelectric ceramic ultrasonic vibrator (21); a focusing lens (22) is mounted on the slider (20).
3. The laser ultrasonic technology-assisted pulse laser drilling device according to claim 1, wherein laser light emitted by the first pulse laser (4) is expanded by the first beam expander (3), and laser light emitted by the second pulse laser (8) is expanded by the second beam expander (9).
4. A laser-ultrasound-assisted pulsed laser drilling device according to claim 3, characterized in that the second reflecting plane mirror (10) is oriented at 135 ° to the horizontal; and the laser beam emitted by the second pulse laser (8) sequentially passes through the second beam expander (9), the second reflecting plane mirror (10) and the beam splitter (11) and acts on the lower surface of the workpiece (12).
5. A laser-ultrasound-assisted pulsed laser drilling device according to claim 3, characterized in that the first reflecting plane mirror (2) is oriented at 45 ° to the horizontal; the laser beam emitted by the first pulse laser (4) sequentially passes through the first beam expander (3), the first reflecting plane mirror (2) and the vibration module (1) and is focused on the upper surface of the workpiece (12).
6. A method of perforating by a laser-assisted ultrasonic pulsed laser drilling device according to any of claims 1 to 5, characterized in that before, during and for a while after the workpiece (12) is machined by the first pulsed laser (4), the second pulsed laser (8) is used to excite ultrasonic waves on the lower surface of the workpiece (12), and the ultrasonic waves generate ultrasonic vibrations to assist the laser drilling; ultrasonic vibration is generated by adopting the vibration module (1), so that a focus of the focused laser output by the first pulse laser (4) vibrates up and down according to a certain frequency; in addition, an ultrasonic detector (13) is adopted to detect the ultrasonic signal energy acting on the workpiece (12) in real time and transmit the ultrasonic signal energy back to the computer (6); the method specifically comprises the following steps:
s1, preprocessing the upper surface and the lower surface of the workpiece (12);
s2, arranging the workpiece (12) on a clamp (14), and arranging the clamp (14) on a working platform (15);
s3, controlling the movable working platform (15) by using the working platform controller (16) so as to adjust the position of the workpiece (12), and setting all the machining positions of the workpiece (12) through the computer (6);
s4, finishing the setting of all the machining parameters of all the machining positions at one time through the computer (6) and the corresponding controllers; specifically, the output parameter of the pulse laser beam for processing output by the first pulse laser (4) is set by the first pulse laser controller (5); setting output parameters of a pulse laser beam for generating ultrasonic vibration output by a second pulse laser (8) through a second pulse laser controller (7); setting working parameters of the vibration module (1) through a vibration module controller (17);
s5, turning on the vibration module (1) and the ultrasonic detector (13), turning on the second pulse laser (8) to output a laser beam to act on the lower surface of the workpiece (12), wherein the acting time is controlled by the computer (6);
s6, after the action is carried out for a period of time, the first pulse laser (4) is opened to output pulse laser beams, the laser beams act on the processing position of the workpiece (12) through the vibration module (1), and small holes are formed in the processing area of the workpiece (12);
s7, after the small hole machining is finished, the first pulse laser (4) is closed, and the second pulse laser (8), the vibration module (1) and the ultrasonic detector (13) are closed after a period of time;
s8, controlling the movable working platform (15) to move to the next position by using the working platform controller (16);
and S9, repeating the steps S5-S8, and processing the next position of the workpiece (12) until the processing of all the positions is finished.
7. A method of drilling in a laser-assisted, ultrasonic pulsed laser drilling device according to claim 6, characterized in that the first pulsed laser (4) is a high power laser, which outputs a laser power density for machining>107W/cm2(ii) a The laser power density value output by the second pulse laser (8) is lower than the damage threshold of the material on the lower surface of the processed workpiece (12), the material on the lower surface of the processed workpiece (12) is not melted enough due to the fact that the material absorbs the radiation energy of the laser beam to cause the local temperature rise, and the lower surface of the workpiece (12) is ensured to be completely undamaged.
8. A method of perforating by a laser-assisted ultrasonic pulsed laser perforating device as claimed in claim 6, characterized in that, in the actual machining, various coatings are applied to the lower surface of the workpiece (12) in order to increase the absorption coefficient of the lower surface of the workpiece.
9. A method for perforating a laser-assisted ultrasonic pulsed laser perforating device as claimed in claim 6, characterized in that the second pulsed laser (8) is arranged to excite the workpiece (12) with an ultrasonic frequency of the order of GHz.
10. The method for perforating a hole by using a laser ultrasonic technology-assisted pulse laser perforating device as claimed in claim 6, characterized in that the vibration frequency of the vibration module (1) is greater than 20kHz, namely the up-and-down vibration frequency of the focus of the focused laser output by the first pulse laser (4) is greater than 20 kHz.
11. A method of drilling in a laser-assisted, pulsed laser drilling device according to claim 8, characterized in that the lower surface of the workpiece (12) is coated with water or oil.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910434176.0A CN110280914B (en) | 2019-05-23 | 2019-05-23 | Laser ultrasonic technology assisted pulse laser boring device and method |
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| CN201910434176.0A CN110280914B (en) | 2019-05-23 | 2019-05-23 | Laser ultrasonic technology assisted pulse laser boring device and method |
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| CN111889896B (en) * | 2020-07-02 | 2022-05-03 | 松山湖材料实验室 | Ingot stripping method by ultrasonic-laser cooperation |
| CN112024991B (en) * | 2020-08-24 | 2021-06-01 | 长春工业大学 | Thermal-elastic excitation-ultrasonic impact collaborative cutting system and method |
| CN112276345B (en) * | 2020-10-10 | 2021-06-01 | 深圳市韵腾激光科技有限公司 | Laser processing system and method for monitoring laser power change |
| CN113601018A (en) * | 2021-07-08 | 2021-11-05 | 深圳信息职业技术学院 | Laser polishing method and laser polishing equipment |
| CN114833471B (en) * | 2022-04-08 | 2023-07-04 | 大连理工大学 | Coaxial ultrasonic-assisted ultra-fast laser hole making unit and method |
| CN114939741B (en) * | 2022-04-13 | 2023-06-23 | 大连理工大学 | Ultrasonic jet assisted femtosecond laser rotary-cut composite machining equipment and method for turbine blade air film cooling hole |
| CN118549445A (en) * | 2024-06-25 | 2024-08-27 | 十堰市计量检定测试所 | Laser detection equipment for nondestructive test |
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