CN110121769A - Light emission diode package member component and light emitting diode bulb including it - Google Patents
Light emission diode package member component and light emitting diode bulb including it Download PDFInfo
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- CN110121769A CN110121769A CN201880005535.4A CN201880005535A CN110121769A CN 110121769 A CN110121769 A CN 110121769A CN 201880005535 A CN201880005535 A CN 201880005535A CN 110121769 A CN110121769 A CN 110121769A
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- Prior art keywords
- light emission
- diode package
- package member
- emission diode
- connecting wire
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to light emission diode package member component and including its light emitting diode bulb.The light emitting diode package assembly of an embodiment according to the present invention, it include: multiple light emission diode package members, respectively include substrate, light emitting diode matrix and a pair of electrodes pad, the light emitting diode matrix by be mounted on substrate an at least surface and be electrically connected multiple light-emitting diode chip for backlight unit constitute, the pair of electronic pads are arranged in the both ends of substrate and are electrically connected with light emitting diode matrix；And connecting wire connects the electronic pads of one end between two light emission diode package members adjacent to each other.Between two light emission diode package members adjacent to each other, the electronic pads of the other end are separated from each other, and multiple light emission diode package members are electrically connected in series, and connecting wire is one-piece type with electronic pads.
Description
Technical field
The present invention relates to light emitting diode package assembly and including this its light emitting diode bulb.
Background technique
In the past, it was widely used using the incandescent lamp of filament as lighting device.In general, the incandescent lamp using filament is pressed
Following principle work: after being put into tungsten filament in the glass lamp of vacuum, when applying power supply, tungsten filament is heated to high temperature and leads to
Excess temperature radiation obtains light.
Previous incandescent lamp is since its most energy is discharged in the form of heat, and only portion of energy is converted into light, therefore
Thermal efficiency pole bottom, and since the service life of filament itself is short, therefore, it is difficult to use for a long time.
Recently, the emitting LED (LED:Light emitting diode) that the service life is long and energy efficiency is high is
It is used in lighting device.
Summary of the invention
Technical problem
Present invention contemplates that the project solved is to provide, a kind of service life is long, fever is low, thus the hair with high business efficiency
Optical diode package assembling and emitting LED light bulb including it.
Present invention contemplates that solve another project be, provide one kind can by reduce manufacturing process, manufacturing time with
And material cost and improve productive light emitting diode package assembly and the light emitting diode bulb including it.
Present invention contemplates that the another project solved is, provide a kind of different direction can shine and Xiang Quanfang to each other
To equably luminous light emitting diode package assembly and including its light emitting diode bulb.
Technical solution
An embodiment according to the present invention, a kind of light emission diode package member component, comprising: multiple LED packages
Part respectively includes substrate, light emitting diode matrix and a pair of electrodes pad, and the light emitting diode matrix is by being mounted on the substrate
An at least surface and multiple light-emitting diode chip for backlight unit for being electrically connected constitute, the pair of electronic pads are arranged in the base
It the both ends of plate and is electrically connected with the light emitting diode matrix；And connecting wire, in two light emitting diodes adjacent to each other
Between packaging part, the electronic pads of one end are connected.Between two light emission diode package members adjacent to each other, the other end
Electronic pads are separated from each other, and the multiple light emission diode package member is electrically connected in series, and the connecting wire is with the electronic pads
It is one-piece type.
According to another embodiment of the present invention, a kind of light emission diode package member component, comprising: the first light emitting diode envelope
Piece installing and the second light emission diode package member respectively include transparent substrate, light emitting diode matrix, wavelength conversion layer, anode electricity
Polar cushion and cathode electrode pad, the light emitting diode matrix is by being arranged on a surface of the transparent substrate and being connected in series
Multiple light-emitting diode chip for backlight unit constitute, the wavelength conversion layer cover the transparent substrate a surface and the light-emitting diodes
Pipe array, the anode electrode pad is connected to one end of the light emitting diode matrix and the cathode electrode pad is connected to institute
State the other end of light emitting diode matrix；And a connecting wire, connect the anode of first light emission diode package member
The cathode electrode pad of electronic pads and second light emission diode package member.The connecting wire and first light emitting diode
The cathode electrode pad of the anode electrode pad of packaging part and second light emission diode package member is integrally constituted type.Also, institute
The anode electrode pad of the cathode electrode pad and second light emission diode package member of stating the first light emission diode package member is separated by
Separation.
According to still another embodiment of the invention, a kind of light emission diode package member component, comprising: the first light emitting diode envelope
Piece installing respectively includes transparent substrate, light emitting diode matrix, wavelength conversion layer, anode electricity to the 4th light emission diode package member
Polar cushion and cathode electrode pad, the light emitting diode matrix is by being arranged on a surface of the transparent substrate and being connected in series
Multiple light-emitting diode chip for backlight unit constitute, the wavelength conversion layer cover the transparent substrate a surface and the light-emitting diodes
Pipe array, the anode electrode pad is connected to one end of the light emitting diode matrix and the cathode electrode pad is connected to institute
State the other end of light emitting diode matrix；And first connecting wire, connect the anode of first light emission diode package member
The cathode electrode pad of electronic pads and second light emission diode package member；Second connecting wire connects described second luminous two
The cathode electrode pad of the anode electrode pad of pole pipe packaging part and the third light emission diode package member；And third connection is led
Line connects the anode electrode of third light emission diode package member and the cathode electrode pad of the 4th light emission diode package member.It is described
The anode electrode pad and cathode electrode pad of first connecting wire, the second connecting wire and third connecting wire and connection are configured to
It is one-piece type.Also, the cathode electrode pad of first light emission diode package member and the 4th light emission diode package member
Anode electrode pad is separated by with other electronic pads to be separated.
According to still another embodiment of the invention, a kind of light emitting diode bulb, comprising: basic courses department is formed with and external electrical
A pair of external electrodes of source connection；At least one light emission diode package member component, comprising: multiple light emission diode package members and
Connecting wire, the multiple light emission diode package member respectively includes substrate, light emitting diode matrix and a pair of electrodes pad, described
Light emitting diode matrix by be mounted on the substrate an at least surface and be electrically connected multiple light-emitting diode chip for backlight unit constitute,
The pair of electronic pads are connected respectively to the both ends of the light emitting diode matrix, and the connecting wire is the multiple luminous by making
The mode that diode encapsulating parts are electrically connected in series connects adjacent multiple light emission diode package members；At least a pair of of lead-in wire, electricity
Connect the external electrode of the basic courses department and the company not over the connecting wire of the light emission diode package member component
The electronic pads connect；And translucency lid, the light emission diode package member component and the pair of lead-in wire are surrounded, and
And one end is in conjunction with the basic courses department.The connecting wire and the electronic pads for being connected to the connecting wire are one-piece type.
According to still another embodiment of the invention, a kind of hair including multiple light emission diode package members and connecting wire is provided
Optical diode packaging part component.Multiple light emission diode package members respectively include: substrate；Light emitting diode matrix, by being mounted on
An at least surface for the substrate and the multiple light-emitting diode chip for backlight unit being electrically connected composition；And a pair of electrodes pad, difference cloth
It sets the both ends in the substrate and is electrically connected with the light emitting diode matrix.Also, connecting wire will be arranged in the multiple
The electronic pads of one end of light emission diode package member are electrically connected.Here, the electronic pads of the connecting wire and connection
It is one-piece type.Multiple electrically in parallel connections of light emission diode package member.
According to still another embodiment of the invention, provide a kind of light emitting diode bulb, comprising: basic courses department, be formed with
Multiple external electrodes of external power supply connection；At least one light emission diode package member component, including multiple light emitting diodes envelope
Piece installing and connecting wire；Multiple lead-in wires, be electrically connected the basic courses department the external electrode and the LED package
Part component；And translucency lid, surround the light emission diode package member component and the multiple lead-in wire, and one end with
The basic courses department combines,
Light emission diode package member component includes multiple light emission diode package members and connecting wire.Multiple light emitting diodes
Packaging part respectively include: substrate；Light emitting diode matrix, by being mounted on an at least surface for the substrate and being electrically connected more
A light-emitting diode chip for backlight unit is constituted；And a pair of electrodes pad, be arranged in the both ends of the substrate and with the light-emitting diodes
The electrical connection of pipe array.Also, connecting wire will be arranged in the electronic pads of one end of the multiple light emission diode package member
Electrical connection.Here, the connecting wire and the electronic pads of connection are one-piece type, the multiple light emission diode package member quilts
Electrically in parallel connection.
Technical effect
According to an embodiment of the invention, light emission diode package member component and the light emitting diode bulb including it pass through
Tungsten filament is substituted using light emission diode package member, since its service life is long, fever is low, business efficiency can be improved.
According to another embodiment of the present invention, light emission diode package member component will be by that independently will constitute each hair in the past
The metal material between electronic pads abandoned when optical diode packaging part is used as the connecting wire between light emission diode package member,
So as to improve stock utilization.Also, by the way that this light emission diode package member component is applied to LED light lamp
Bubble, it is convenient to omit the Joining Technology between light emission diode package member, therefore the system of reduction light emitting diode bulb can be passed through
It makes technique, manufacturing time and material cost and improves productivity.
According to still another embodiment of the invention, light emission diode package member component can use bending section to each luminous two
The light emission direction of pole pipe packaging part is variously changed, so that light emitting diode bulb be allow equably to shine to omnidirection.
Detailed description of the invention
Fig. 1 to Fig. 6 is the manufacturing method for showing the light emission diode package member component of first embodiment according to the present invention
And the exemplary diagram of the light emission diode package member component according to the manufacturing method.
Fig. 7 is the exemplary diagram for showing the light emitting diode bulb of first embodiment according to the present invention.
Fig. 8 to Figure 10 is the manufacturing method for showing the light emission diode package member component of second embodiment according to the present invention
With the exemplary diagram according to its light emission diode package member component.
Figure 11 is the exemplary diagram for showing the light emitting diode bulb of second embodiment according to the present invention.
Figure 12 is another exemplary diagram for showing the light emission diode package member component of second embodiment according to the present invention.
Figure 13 is another exemplary diagram for showing the light emission diode package member component of second embodiment according to the present invention.
Figure 14 is another exemplary diagram for showing the light emitting diode bulb of third embodiment according to the present invention.
Figure 15 and Figure 16 is the manufacturer for showing the light emission diode package member component of third embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
Figure 17 and Figure 18 is the light emitting diode bulb for showing fourth embodiment according to the present invention and the 5th embodiment
Exemplary diagram.
Figure 19 and Figure 20 is the manufacturer for showing the light emission diode package member component of fourth embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
Figure 21 is the exemplary diagram for showing the light emitting diode bulb of sixth embodiment according to the present invention.
Figure 22 to Figure 26 is the manufacturer for showing the light emission diode package member component of seventh embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
Figure 27 is the exemplary diagram for showing the light emitting diode bulb of seventh embodiment according to the present invention.
Figure 28 and Figure 29 is the manufacturer for showing the light emission diode package member component of the 8th embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
Figure 30 is the exemplary diagram for showing the light emitting diode bulb of the 8th embodiment according to the present invention.
Figure 31 and Figure 32 is the manufacturer for showing the light emission diode package member component of the 9th embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
Figure 33 is the exemplary diagram for showing the light emitting diode bulb of the 9th embodiment according to the present invention.
Specific embodiment
By following detailed description of relevant to attached drawing and preferred embodiment, the purpose of the present invention, specific advantages and
Novel feature will become more apparent.Embodiment explained below is to sufficiently convey this hair to those skilled in the art
Bright thought and provide as example.Therefore, the present invention is not limited to embodiment explained below, can also have in the form of other
Body.In the present specification, it should be noted that, when assigning appended drawing reference to the constituent element of each attached drawing, for identical
Constituent element, even if marking on different attached drawings, also as far as possible to which imparts identical appended drawing references.Also, " first ",
The terms such as " second ", " surface ", " another surface ", " upper surface ", " lower surface ", " top ", " lower part " are used for a structure
It is distinguished at element and another constituent element, constituent element is not limited to the term.
Hereinafter, will be explained in more detail with reference to the drawing the embodiment of the present invention.
An embodiment according to the present invention, a kind of light emission diode package member component, comprising: multiple LED packages
Part respectively includes substrate, light emitting diode matrix and a pair of electrodes pad, and the light emitting diode matrix is by being mounted on the substrate
An at least surface and multiple light-emitting diode chip for backlight unit for being electrically connected constitute, the pair of electronic pads are arranged in the base
It the both ends of plate and is electrically connected with the light emitting diode matrix；And connecting wire, in two light emitting diodes adjacent to each other
Between packaging part, the electronic pads of one end are connected.Between two light emission diode package members adjacent to each other, the other end
Electronic pads are separated from each other, and the multiple light emission diode package member is electrically connected in series, and the connecting wire is with the electronic pads
It is one-piece type.
The light emission diode package member component includes two light emission diode package members, described two light emitting diode envelopes
The electronic pads of piece installing one end are connected by the connecting wire, and the electronic pads of the other end are separated from each other.
The light emission diode package member component includes three or more light emission diode package members.At this point, being located at two sides
The electronic pads at the both ends of other light emission diode package members other than two light emission diode package members at end pass through described respectively
Connecting wire is connect with adjacent light emission diode package member different from each other.Also, two for being located at the two side ends shine
Diode encapsulating parts include not electronic pads in conjunction with the connecting wire.
It further include the polar label (Mark) for distinguishing the electronic pads of the multiple light emission diode package member.
The connecting wire further include: the first bending section, by make connection two light emission diode package members it is closer to each other
Mode be bent.
The electronic pads of the light emission diode package member further include: the second bending section, by the connecting wire and base for making connection
The close mode of plate is bent.
The substrate of each of the multiple light emission diode package member is light-transmitting substrate.
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the base
An at least surface for plate and the light emitting diode matrix.
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the base
Two surfaces of plate and the light emitting diode matrix.
Each of the multiple light emission diode package member issues white light.
According to another embodiment of the present invention, a kind of light emission diode package member component, comprising: the first light emitting diode envelope
Piece installing and the second light emission diode package member respectively include transparent substrate, light emitting diode matrix, wavelength conversion layer, anode electricity
Polar cushion and cathode electrode pad, the light emitting diode matrix is by being arranged on a surface of the transparent substrate and being connected in series
Multiple light-emitting diode chip for backlight unit constitute, the wavelength conversion layer cover the transparent substrate a surface and the light-emitting diodes
Pipe array, the anode electrode pad is connected to one end of the light emitting diode matrix and the cathode electrode pad is connected to institute
State the other end of light emitting diode matrix；And a connecting wire, connect the anode of first light emission diode package member
The cathode electrode pad of electronic pads and second light emission diode package member.The connecting wire and first light emitting diode
The cathode electrode pad of the anode electrode pad of packaging part and second light emission diode package member is integrally constituted type.Described first
The anode electrode pad of the cathode electrode pad of light emission diode package member and second light emission diode package member is separated by separation.
The connecting wire includes: at least one first bending section, is configured to be bent perpendicular to long axis direction.
It is connected to the anode electrode pad and second hair of first light emission diode package member of the connecting wire
The cathode electrode pad of optical diode packaging part has been respectively also formed perpendicular to curved second bending section of long axis direction.
According to still another embodiment of the invention, a kind of light emission diode package member component, comprising: the first light emitting diode envelope
Piece installing respectively includes transparent substrate, light emitting diode matrix, wavelength conversion section, anode electricity to the 4th light emission diode package member
Polar cushion and cathode electrode pad, the light emitting diode matrix is by being arranged on a surface of the transparent substrate and being connected in series
Multiple light-emitting diode chip for backlight unit constitute, the wavelength conversion layer cover the transparent substrate a surface and the light-emitting diodes
Pipe array, the anode electrode pad is connected to one end of the light emitting diode matrix and the cathode electrode pad is connected to institute
State the other end of light emitting diode matrix；First connecting wire connects the anode electrode of first light emission diode package member
The cathode electrode pad of pad and second light emission diode package member；Second connecting wire connects second light emitting diode
The cathode electrode pad of the anode electrode pad of packaging part and the third light emission diode package member；And third connecting wire, even
Connect the anode electrode of third light emission diode package member and the cathode electrode pad of the 4th light emission diode package member.Described first connects
The anode electrode pad and cathode electrode pad for connecing conducting wire, the second connecting wire and third connecting wire and connection are integrally constituted
Type.Also, the anode of the cathode electrode pad of first light emission diode package member and the 4th light emission diode package member
Electronic pads are separated by with other electronic pads to be separated.
The connecting wire respectively include: the first bending section is configured to be bent perpendicular to long axis direction.
According to still another embodiment of the invention, a kind of light emitting diode bulb, comprising: basic courses department is formed with and external electrical
A pair of external electrodes of source connection；At least one light emission diode package member component, including multiple light emission diode package members and
Connecting wire, the multiple light emission diode package member respectively includes light emitting diode matrix and a pair of electrodes pad, described to shine
Diode array is made of the multiple light-emitting diode chip for backlight unit being electrically connected, and the pair of electronic pads are connected to described luminous two
The both ends of pole pipe array, the connecting wire connect phase in the way of being electrically connected in series the multiple light emission diode package member
Adjacent multiple light emission diode package members；At least a pair of of lead-in wire is electrically connected the external electrode of the basic courses department and described shines
The electronic pads of diode encapsulating parts component connected not over the connecting wire；And translucency lid, it surrounds
The light emission diode package member component and the pair of lead-in wire, and one end is in conjunction with the basic courses department.The connection is led
Line and the electronic pads for being connected to the connecting wire are one-piece type.
The light emission diode package member component includes two light emission diode package members.At this point, described two luminous two
The electronic pads of one end of pole pipe packaging part are connected by the connecting wire, and the electronic pads of the other end divide each other
From.
The light emission diode package member component includes three or more light emission diode package members.At this point, in addition to being located at
The electronic pads at the both ends of other light emission diode package members other than two light emission diode package members of two side ends are distinguished
It is connect by the connecting wire with adjacent light emission diode package member different from each other.Also, it is located at the two side ends
Two light emission diode package members include not electronic pads in conjunction with the connecting wire.
It is also formed with the polar label (Mark) of the electronic pads for distinguishing the multiple light emission diode package member.
The label is formed at least one electronic pads of each light emission diode package member.
The connecting wire further include by make connection two light emission diode package member modes closer to each other it is curved
First bending section, to make two light emission diode package members of the connection different direction irradiation light to each other.
The electronic pads of the light emission diode package member further include by the mode for keeping the connecting wire and substrate of connection close
Curved second bending section, so that each light emission diode package member be made to irradiate to the top of the light emitting diode bulb
Light.
The substrate of each of the multiple light emission diode package member is light-transmitting substrate.
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the base
An at least surface for plate and the light emitting diode matrix.
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the base
Two surfaces of plate and the light emitting diode matrix.
The lead-in wire is not connect with the connecting wire with the other end in the multiple light emission diode package member
The electronic pads connection.
The light emitting diode bulb, further includes: supporting table is arranged in the inside of the translucency lid, from the base
Plinth portion extends to upper direction.
The connecting wire supports or is bonded to the upper of the supporting table by the top of the supporting table or upper surface
Portion or upper surface.
The light emission diode package member component is multiple, each of the multiple light emission diode package member component
It is distinguished and is electrically connected to the substrate.
According to still another embodiment of the invention, a kind of light emission diode package member component includes multiple LED packages
Part and connecting wire.The multiple light emission diode package member respectively include: substrate；Light emitting diode matrix, by being mounted on
It states an at least surface for substrate and the multiple light-emitting diode chip for backlight unit being electrically connected is constituted；And a pair of electrodes pad, it is respectively arranged
The substrate both ends and be electrically connected with the light emitting diode matrix.Also, the connecting wire will be arranged in described more
The electronic pads of one end of a light emission diode package member are electrically connected.Here, the electrode of the connecting wire and connection
Pad is one-piece type, the multiple electrically in parallel connection of light emission diode package member.
The electronic pads for being arranged in the other end of the multiple light emission diode package member are separated from each other.
The connecting wire further include: the first bending section, by making the LED package connecting with the connecting wire
Part mode closer to each other is bent.
Also, the electronic pads being connect with the connecting wire further include: the second bending section, by making the substrate and institute
Connecting wire mode closer to each other is stated to be bent.
It is also formed on the substrate for distinguishing polar label (Mark).
The substrate is light-transmitting substrate.
The light emission diode package member further include: wavelength conversion section is formed as at least surface for covering the substrate
With the light emitting diode matrix.
The multiple light emission diode package member issues white light.
The light emission diode package member component further include: connecting wire is formed in the multiple LED package
The other end of part will be arranged in the electronic pads electrical connection of the other end of the multiple light emission diode package member.
Here, be formed in the other end of the multiple light emission diode package member the connecting wire and connection it is described
Electronic pads are one-piece type.
Also, the connecting wire for being formed in the other end of the multiple light emission diode package member is also formed with by making
Curved first bending section of the adjacent light emission diode package member being connect with connecting wire mode closer to each other.
According to still another embodiment of the invention, a kind of light emitting diode bulb, comprising: basic courses department is formed with and external electrical
Multiple external electrodes of source connection；At least one light emission diode package member component, including multiple light emission diode package members and
Connecting wire；Multiple lead-in wires are electrically connected the external electrode and the light emission diode package member component of the basic courses department；
And translucency lid, surround the light emission diode package member component and the multiple lead-in wire, and one end and the base
Plinth portion combines.
The light emission diode package member component includes multiple light emission diode package members and connecting wire.The multiple hair
Optical diode packaging part respectively include: substrate, light emitting diode matrix are mounted on an at least surface for the substrate, and by
Multiple light-emitting diode chip for backlight unit of electrical connection are constituted；And a pair of electrodes pad, be arranged in the both ends of the substrate and with institute
State light emitting diode matrix electrical connection.Also, the connecting wire will be arranged in the one of the multiple light emission diode package member
The electronic pads electrical connection at end.Here, the connecting wire and the electronic pads of connection are one-piece type, and the multiple
The electrically in parallel connection of light emission diode package member.
The connecting wire further include: the first bending section, by making the adjacent light-emitting diodes connecting with the connecting wire
Pipe packaging part mode closer to each other is bent.
The electronic pads being connect with the connecting wire further include: the second bending section, by making the substrate and the company
Conducting wire mode closer to each other is connect to be bent.
It is also formed on the substrate for distinguishing polar label (Mark).
The substrate is light-transmitting substrate.
The light emission diode package member further include: wavelength conversion section is formed as at least surface for covering the substrate
With the light emitting diode matrix.
The multiple light emission diode package member issues white light.
It further include the supporting table for being arranged in the inside of the translucency lid and extending from the basic courses department to upper direction.
The connecting wire by the top of the supporting table or upper surface support or be bonded to the supporting table top or on
Surface.
The electronic pads for being arranged in the other end of the multiple light emission diode package member are separated from each other.At this point, described
Lead-in wire is connected respectively to the electronic pads for the other end for being arranged in the light emission diode package member.
The light emission diode package member component further include: connecting wire is formed in the multiple LED package
The other end of part, and the electronic pads electrical connection of the other end of the multiple light emission diode package member will be arranged in.
Here, be formed in the other end of the multiple light emission diode package member the connecting wire and connection it is described
Electronic pads are one-piece type.
Also, the connecting wire for being formed in the other end of the multiple light emission diode package member is also formed with by making
Curved first bending section of the adjacent light emission diode package member being connect with connecting wire mode closer to each other.
Also, the connecting wire of the lead-in wire and the other end for being formed in the multiple light emission diode package member
Connection.
The light emission diode package member component is multiple.Herein, further includes: connecting line, by the multiple light-emitting diodes
The electrical connection of pipe packaging part component.The connecting line is described with one end for being formed in the multiple light emission diode package member component
Connecting wire electrical connection, so that the multiple light emission diode package member component is electrically connected in series.
Fig. 1 to Fig. 6 is the manufacturing method for showing the light emission diode package member component of first embodiment according to the present invention
With the exemplary diagram according to its light emission diode package member component.
With reference to Fig. 1, multiple light emission diode package members 40 are provided.Although being not shown, light emitting diode envelope
Piece installing 40 is arranged in will be on the plate (plate) that carry out subsequent technique.Each light emission diode package member 40 includes light emitting diode
Array 32 and the substrate 31 for being equipped with light emitting diode matrix 32.Also, light emission diode package member 40 can also include wavelength
Transformation component 34.Although light emission diode package member 40 does not include wavelength conversion section 34 in Fig. 2, wavelength conversion is hereafter formd
Portion 34.
In an embodiment of the present invention, light emitting diode matrix 32 is by 33 structure of multiple light-emitting diode chip for backlight unit that is connected in series
At.For example, in each of multiple light-emitting diode chip for backlight unit 33, anode (anode) electrode of itself and adjacent luminous two
Cathode (cathode) electrode of pole pipe chip 33 is electrically connected by wire bonding (Wire bonding).At this point, in light-emitting diodes
In pipe array 32, arranges the anode electrode of light-emitting diode chip for backlight unit 33 at one end and be arranged in the another of the opposite direction as one end
The cathode electrode of the light-emitting diode chip for backlight unit 33 of one end is the state for not carrying out wire bonding.In the following description, it will send out
Arrange that the anode electrode of light-emitting diode chip for backlight unit 33 at one end is expressed as light emitting diode matrix 32 in light diode array 32
Anode electrode or light emission diode package member 40 anode electrode.Also, it will be arranged in light emitting diode matrix 32 another
The cathode electrode of the light-emitting diode chip for backlight unit 33 of one end is expressed as the cathode electrode or light-emitting diodes of light emitting diode matrix 32
The cathode electrode of pipe packaging part 40.
Light emission diode package member 40 includes the multiple light-emitting diode chip for backlight unit 33 being connected in series one is shown in Fig. 1
A light emitting diode matrix 32.However, light emission diode package member 40 may include multiple light emitting diode matrixs 32.For example,
Light emission diode package member 40 may include multiple light emitting diode matrixs 32, and multiple light emitting diode matrixs 32 can be with string
Connection, mode mixed with parallel connection in parallel or in series connect.
Substrate 31 can be the light-transmitting substrate formed by translucency material.In the situation that substrate 31 is light-transmitting substrate
Under, the light issued from light emitting diode matrix 32 can also not only be passed through by the front surface of light emitting diode matrix 32
It is issued below substrate 31.Here, being the reverse side for being equipped with the face of light emitting diode matrix 32 below substrate 31.After,
Front surface can be expressed as by upper surface according to the arrangement form of constituting portion in explanation, lower surface is expressed as rear surface.For example,
The material of substrate 31 can be glass.
According to an embodiment of the invention, multiple light emission diode package members 40 are arranged as and adjacent LED package
Part 40 has opposite polar sites.That is, multiple light emission diode package members 40 are arranged as and adjacent LED package
Part 40 is opposite with the position of the anode electrode of light emitting diode matrix 32 and cathode electrode.
With reference to Fig. 2, lead frame 10 is disposed on multiple light emission diode package members 10.Lead frame 10 has even
Multiple electrode pads 12 are connect on conducting wire 11 to side or the other side structure outstanding.For example, lead frame 10 is by conductions such as copper, aluminium
Property metal is formed.
Although of the invention for ease of description, lead frame 10 is divided into connecting wire 11 and electronic pads 12 are said
It is bright, but connecting wire 11 and electronic pads 12 are same materials, and be formed by same technique it is one-piece type.For example, conducting wire
Frame 10 can be formed and carrying out punching press (Punching) technique on the plate in metal material.Alternatively, lead frame 10 can
It is formed by such a way that the injection molten metal in mold (mold) solidifies.As long as in addition, connecting wire 11 and electrode
Pad 12 is formed as one type, then lead frame 10 can be formed in a variety of ways according to the selection of those skilled in the art.
Lead frame 10 is arranged in one end and the other end of light emission diode package member 40.At this point, the two of substrate 31
The upper surface at end respectively with the following table face contact of electronic pads 12.
Electronic pads 12 divide into first electrode pad 13 and second electrode pad 14.First electrode pad 13 is anode electrode pad, the
Two electronic pads 14 are cathode electrode pads.
First electrode pad 13 is connect with the anode electrode of light emitting diode matrix 32, second electrode pad 14 and light emitting diode
The cathode electrode of array 32 connects.First electrode pad 13 and second electrode pad 14 will become light emission diode package member 40 hereafter
Part constitute.
At least part in multiple electrode pads 12 could be formed with label (Mark) 16.Label 16 is in order to hereafter
It distinguishes polar anode electrode and cathode electrode as 40 both ends of light emission diode package member and is formed.That is, label 16 is
In order to distinguish the mark of first electrode pad 13 and second electrode pad 14.Also, light emission diode package member 40 or hair hereafter
When optical diode packaging part component 110 is connect with external power supply, label 16 can also play positive (+) of differentiation and external power supply
The effect for the electronic pads 12 that power supply is connected with the power supply of negative (-).
In an embodiment of the present invention, label 16 is formed in first electrode pad 13.Therefore, lead frame 10 has and is formed with
The first electrode pad 13 of label 16 and the second electrode pad 14 for not forming label 16 are alternately arranged at the structure of connecting wire 11.
The position for forming label 16 can be variously changed.As another embodiment, label 16 can be formed in
Two electronic pads 14.As another embodiment, label 16 can be respectively formed at first electrode pad 13 and the second electricity with different shape
Polar cushion 14.
Label 16 can be carved structure, communicating structure with yin or can be confirmed with ink mark etc. with visual manner any
Method and form are formed.
It arranges after lead frame 10 on multiple light emission diode package members 40, to light emission diode package member 40 and leads
Wire frame 10 carries out wire bonding.The anode electrode of each light emission diode package member 40 passes through first electrode pad 13 and lead electricity
Connection.Also, the cathode electrode of each light emission diode package member 40 is electrically connected by second electrode pad 14 and lead.
Referring to Fig. 3, wavelength conversion section 34 is formed about light emitting diode matrix 32.Wavelength conversion section 34 to from shine two
The wavelength for the light that pole pipe chip 33 issues is converted to issue the light of different colours.Wavelength conversion section 34 is by including fluorophor
Resin is formed.
Fig. 4 is the side section (A1-A2) of Fig. 3.Referring to Fig. 4, wavelength conversion section 34, which is formed about, is disposed with light-emitting diodes
The upper and lower surfaces of the substrate 31 of pipe array 32.Alternatively, although wavelength conversion section 34 is formed about light emitting diode battle array
Column 32, but the upper surface of substrate 31 can be made only in.As long as that is, wavelength conversion section 34 is around light emitting diode matrix 32
Mode is formed, then can be formed as any form according to the selection of those skilled in the art.
In an embodiment of the present invention, light emission diode package member 40 can issue white light or user it is desired other
The light of color.The light issued from light emitting diode matrix 32 wavelength conversion when passing through wavelength conversion section 34, so as to issue
The light of white light or other desired colors of user.At this point, in the case of substrate 31 is light-transmitting substrate, if wavelength becomes
The lower surface that portion 34 is formed about substrate 31 is changed, then light emission diode package member 40 can also be sent out by the lower surface of substrate 31
The light of the desired color of user out.
As another embodiment, the light issued from light emitting diode matrix 32 can be white light or user is desired
Light.In this case, it can be omitted wavelength conversion section 34 in light emission diode package member 40.Light emitting diode matrix 32 can
It is constituted in such a way that mixing issues the light-emitting diode chip for backlight unit 33 of the light of different colours, to issue white light or user's expectation
Color light.Alternatively, each light-emitting diode chip for backlight unit 33 can be multiple light-emitting diodes that mixing issues the light of different colours
The structure of tube chip, to issue the light of white light or the desired color of user.
Fig. 5 shows the cutting line C of lead frame 10.Cutting line C is to indicate when carrying out cutting technique, lead frame 10
The line for the part cut.
In an embodiment of the present invention, cutting line C-shaped becomes in the multiple light emission diode package members 40 for making to be arranged side by side
It is arranged in the light emission diode package member 40 of two side ends and does not form the two sides separation of the lead frame 10 of electronic pads 12.
Also, cutting line C-shaped becomes from the electronic pads 12 being connected with one end of two light emission diode package members 40 adjacent to each other
Cut connecting wire 11 in outside.
6 light emission diode package members 40 shown in fig. 5 are divided into the first light emission diode package member 41 to the 6th hair
Optical diode packaging part 46 and be illustrated.For example, cutting line C-shaped becomes the first electricity in the second light emission diode package member 42
Between polar cushion 13 and the second electrode pad 14 of third light emission diode package member 43 and in the 4th light emission diode package member 44
Connecting wire 11 is cut between first electrode pad 13 and the second electrode pad 14 of the 5th light emission diode package member 45.Also, it cuts
Secant C-shaped become the electronic pads 12 that are connect with the other end of two light emission diode package members 40 of cutting and connecting wire 11 it
Between.
If executing cutting technique along cutting line C, at least one light emission diode package member component 110 can be from lead frame
Frame 10 separates.
Fig. 6 is to carry out cutting technique and the light emission diode package member group isolated from lead frame 10 along the cutting line C of Fig. 5
Part 110.Light emission diode package member component 110 according to first embodiment includes that two series connection of light emission diode package member 40 connect
The structure connect.Light emission diode package member component 110 includes two light emission diode package members 40, connecting wire 11 and electrode
Pad 12.
The second electrode pad 14 of light emission diode package member 40 and the first electrode pad of another light emission diode package member 40
13 are formed as one type with connecting wire 11.Therefore, two light emitting diodes envelope of light emission diode package member component 110 is constituted
Piece installing 40 is connected in series.After, for the convenience of explanation, two light emission diode package members 40 are divided into the first light-emitting diodes
Pipe packaging part 41 and the second light emission diode package member 42 and be illustrated.
In the past, multiple light emission diode package members were separately separated with lead frame.Therefore, multiple luminous in order to be electrically connected
Diode encapsulating parts need such as lead constituting portion, and this composition portion needs are separately fabricated.
However, if an embodiment according to the present invention, the first light emission diode package member 41 and the second light emitting diode
Packaging part 42 is arranged as that electrode direction is opposite each other, and is electrically connected to each other by the connecting wire of lead frame 10 11.
Therefore, it can be saved in the manufacturing method of the light emission diode package member component 110 of embodiment according to the present invention
Slightly technique of the production for the individual constituting portion of the connection between light emission diode package member 40.Also, in light emitting diode
It can be omitted in the manufacturing method of packaging part component 110 and light emission diode package member 40 be electrically connected using separately fabricated constituting portion
The technique connect.That is, in the past in order to which being electrically connected so that between multiple light emission diode package members 40 has used lead.However, according to
The embodiment of the present invention does not need the lead for the electrical connection between multiple light emission diode package members 40, and does not need
The technique that lead is connected to light emission diode package member 40.Due to simplifying the manufacture of light emission diode package member component 110
Technique, and reduce manufacturing time and material cost, therefore finally also improve and utilize light emission diode package member component 110
The productivity of the light bulb of manufacture.
Fig. 7 is the exemplary diagram for showing the light emitting diode bulb of first embodiment according to the present invention.
Light emitting diode bulb 100 according to first embodiment includes basic courses department 120, supporting table 130, light emitting diode envelope
Piece installing component 110, lead-in wire 140 and translucency lid 150.
Basic courses department 120 be in order to connect with external power supply and with socket (Socket) combine structure.In basic courses department 120
Lateral surface is formed with the first external electrode 121 and the second external electrode 122 being electrically connected with socket.
Translucency lid 150 is formed as being combined with basic courses department 120, thus covering such as supporting table 130, LED package
The interior structural component of the light emitting diode bulbs 100 such as part component 110 and lead-in wire 140.
Translucency cover plate 150 by make the light issued from light emission diode package member component 110 penetrate translucency material shape
At.For example, translucency lid 150 is formed by glass.
Supporting table 130 is located at the inside of basic courses department 120 and translucency lid 150, and supports light emission diode package member
Component 110.The lower part of supporting table 130 is located at the inside of basic courses department 120, and the top of supporting table 130 is formed as to basic courses department 120
Top is elongatedly prominent.
As an embodiment, supporting table 130 can with translucency lid 150 it is one-piece type formed.In this case, it props up
Support platform 130 is fixed to translucency lid 150.Also, if translucency lid 150 and basic courses department 120 combine, supporting table
130 lower part will be located at the inside of basic courses department 120.As another embodiment, supporting table 130 can be formed as and translucency lid
150 be not one-piece type to be separately formed portion.At this point, the lower part of supporting table 130 can be fixed on the inside of basic courses department 120.It can be with
Supporting table 130 and translucency lid 150 are whether one-piece type to be still separately formed according to the selection of those skilled in the art
Portion, and the method for the supporting table 130 accordingly inside that is fixed on basic courses department 120 and translucency lid 150 are variously changed.
Supporting table 130 is formed by the isolation material of translucency.Supporting table 130 can be by material identical with translucency lid 150
Matter is formed.For example, supporting table 130 can be formed by glass.
There are two light emission diode package member components 110 for the inside arrangement of translucency lid 150.Here, light emitting diode
Packaging part component 110 includes the light emission diode package member for two first embodiments being connected in series by connecting wire 11
40。
Light emission diode package member component 110 is glued to supporting table 130 and opposite with the medial surface of translucency lid 150
It erects on ground.The connecting wire 11 of light emission diode package member component 110 is glued to the top of supporting table 130.At this point, connecting
There are binder (not shown) between lead 11 and supporting table 130.Binder is formed by transparent bonding substance.For example, binder
It can be transparent adhesive tape (Paste).
Also, two light emission diode package member components 110 are arranged as different directions to each other and shine.In reality of the invention
It applies in example, two light emission diode package member components 110 are arranged as opposite to one another.Also, two light emission diode package member groups
Part 110 may be arranged to tilt by lead-in wire 140 gently towards upper direction.Therefore.Light emitting diode bulb 100 not only may be used
Can also shine to upper direction to lateral emitting.
Although being illustrated in the present invention with two light emission diode package member components 110 for example, light-emitting diodes
The quantity of pipe packaging part component 110 is not limited to this.The quantity of light emission diode package member component 110 can change, and send out
The arragement construction of optical diode packaging part component 110 can also change according to the quantity of light emission diode package member component 110.
Lead-in wire 140 is connect with the external electrode of light emission diode package member component 110 and basic courses department 120 respectively.Pass through
Lead-in wire 140, the external power supply for being applied to the external electrode of basic courses department 120 are applied to light emission diode package member component 110.Example
Such as, the first external electrode 121 and lead-in wire 140 and light-emitting diodes that the power supply of positive (+) of external power supply passes through basic courses department 120
The first electrode pad 13 of pipe packaging part component 110 connects.Also, the power supply of negative (-) of external power supply pass through basic courses department 120 the
Two external electrodes 122 and lead-in wire 140 and connect with the second electrode pad 14 of light emission diode package member component 110.
At least part perforation supporting table 130 of lead-in wire 140 and by external electrode and light emission diode package member component
110 connections.Therefore, lead-in wire 140 can be fixed to not move by supporting table 130, and be protected.
Lead-in wire 140 can be the Dumet wire (dumet for covering on its surface with copper as center line using Fe-Ni alloy
wire).However, lead-in wire 140 is not limited to Dumet wire, the material of lead-in wire 140 can be any one in conductive metal
It is a.Also, lead-in wire 140, which can have, can support light emission diode package member component 110 as the intensity of following degree,
That is, light emission diode package member component 110 is with to upper direction, obliquely state is fixed.
Previous filament bulb fever is high, and so that filament is tapered and end-of-life due to high heating temperature.
Also, when filament bulb applies electric current suddenly under the normal temperature state of closing, often there is the case where filament breaking.However, root
The light-emitting diode chip for backlight unit for applying that the service life is long, fever is low is used according to the light emitting diode bulb 100 of the embodiment of the present invention
Light emission diode package member component 110 replaces tungsten filament.Therefore, light emitting diode bulb 100 is due to lower calorific value and long-life,
Than previous filament bulb in economic aspect Advantage height.
The light emitting diode bulb 100 of embodiment according to the present invention is electric each other using multiple light emission diode package members 40
The light emission diode package member component 110 of connection.Therefore, in light emitting diode bulb 100, with light emission diode package member 40
Quantity independently, each light emission diode package member component 110 only needs respectively and outside the first external electrode 121 and second
Each lead-in wire 140 that portion's electrode 122 connects.Therefore, even if the quantity of light emission diode package member 40 increases, according to this hair
The light emitting diode bulb 100 of bright embodiment does not need additional lead-in wire 140 yet, therefore is advantageous in terms of cost.
After, the structure or duplicate theory that are identical with the first embodiment omission in the explanation for other embodiments
It is bright.The content of omission can be referring to figs. 1 to the explanation of Fig. 7.
Fig. 8 to Figure 10 is the manufacturing method for showing the light emission diode package member component of second embodiment according to the present invention
With the exemplary diagram according to its light emission diode package member component.
Referring to Fig. 8, multiple light emission diode package members 40 are installed in lead frame 10.At this point, LED package
Part 40 is arranged as in lead frame 10, and electrode position is opposite in every two light emission diode package member 40.For example, adjacent two
It is identical with the position of cathode electrode that light emission diode package member 40 is arranged as anode electrode.Also, it is arranged side by side in their one
Two light emission diode package members 40 of side are arranged as anode electrode and the position of cathode electrode is opposite with them.For the ease of saying
It is bright, the multiple light emission diode package members 40 for being arranged in lead frame 10 in Fig. 8 into Figure 10 are divided into the first hair in order
Optical diode packaging part 41 is illustrated to the 8th light emission diode package member 48.
In an embodiment of the present invention, cutting line C-shaped, which becomes, makes two light emission diode package member components 210 offset one from another
Ground separation.For example, cutting line C forms the connection in the 4th light emission diode package member 44 and the 5th light emission diode package member 45
Conducting wire 11, so that the 4th light emission diode package member 44 and the 5th light emission diode package member 45 are separated from each other.
Also, cutting line C forms the first electrode pad 13 and the 4th light-emitting diodes in third light emission diode package member 43
It shines between the first electrode pad 13 of pipe packaging part 44 with the first electrode pad 13 of the 7th light emission diode package member 47 and the 8th
Connecting wire 11 between the first electrode pad 13 of diode encapsulating parts 48.
Also, cutting line C forms the first electrode pad 13 and the second light-emitting diodes in the first light emission diode package member 41
It shines between the first electrode pad 13 of pipe packaging part 42 with the first electrode pad 13 of the 5th light emission diode package member 45 and the 6th
Connecting wire 11 between the first electrode pad 13 of diode encapsulating parts 46.
Also, cutting line C-shaped, which becomes, makes the first light emission diode package member 41, the 5th light emission diode package member 45, the
The first electrode pad 13 of four light emission diode package members 44 and the 8th light emission diode package member 48 is separated from connecting wire 11.
Also, cutting line C-shaped, which becomes, makes the second light emission diode package member 42, third light emission diode package member 43, the
The second electrode pad 14 of six light emission diode package members 46 and the 7th light emission diode package member 47 is separated with connecting wire 11.
If along Fig. 8 cutting line C execute cutting technique, as shown in figure 9, light emission diode package member component 210 from
Lead frame 10 separates.At this point, in isolated light emission diode package member component 210, two light emission diode package members 40
It is connected in series by connecting wire 11.Also, light emission diode package member component 210 is sealed by adjacent light emitting diode
What piece installing 40 was constituted, but shone by what the light emission diode package member 40 of two odd bits arrangement or two even bits arranged
Diode encapsulating parts 40 are constituted.Therefore, the spacing between two light emission diode package members 40 can be longer than first embodiment.
Also, in the embodiment of the present invention, bending section 50 is formed in lead frame 10.It is led to connect bending section 50
Line 11 and electronic pads 12 are bent at a predetermined angle and are formed.
As long as bending section 50 can be bent connecting wire 11 and electronic pads 12, can be formed with any form and method.
For example, bending section 50 can be and a part progress half-etching (half etching) by connecting wire 11 and electronic pads 12
It is formed.Alternatively, bending section 50 can be formed as including that at least one of a part for penetrating through connecting wire 11 and electronic pads 12 is passed through
Through-hole.Alternatively, bending section 50 can be by impression that connecting wire 11 and a part of electronic pads 12 are pressurizeed with sharp object
It is formed.
Bending section 50 includes being formed in the first bending section 51 of connecting wire 11 and being formed in connect with connecting wire 11
Second bending section 52 of electronic pads 12.First bending section 51 can be formed between electronic pads 12 in connecting wire 11, and
Length direction along light emission diode package member 40 is formed.That is, the first bending section 51 is with the long axis side perpendicular to connecting wire 11
It is formed to curved mode.Also, the second bending section 52 is on electronic pads 12 along the width direction of light emission diode package member 40
It is formed.That is, the second bending section 52 is formed in such a way that the long axis direction perpendicular to electronic pads 12 is curved.Here, light emitting diode
The length of packaging part 40 is to be formed with the distance between first electrode pad 13 and the two sides of second electrode pad 14.Also, it shines
The two of light emission diode package member 40 of the width of diode encapsulating parts 40 between first electrode pad 13 and second electrode pad 14
The distance between side.Therefore, the length direction of light emission diode package member 40 is the length with light emission diode package member 40
Parallel rectilinear direction, the width direction of light emission diode package member 40 are the width parallels with light emission diode package member 40
Rectilinear direction.
Referring to Fig.1 0, in light emission diode package member component 210, connecting wire 11 can be made by the first bending section 51
It bends right and left between two light emission diode package members 40.Due on the basis of the first bending section 51, connecting wire 11 or so
Bending, therefore can change the position of two light emission diode package members 40 or the side surface direction of light institute direction.Therefore, first
Light emission diode package member 41 and the second light emission diode package member 42 different side surface direction can shine to each other.Here,
The luminous direction of light emission diode package member 40 is the direction of the mounting surface institute direction of the substrate 31 of light emission diode package member 40.
I.e., it is possible to make to be equipped with the first light emission diode package member 41 and the second light emission diode package member by the first bending section 51
The mounting surface of the substrate 31 of 42 light-emitting diode chip for backlight unit 31 side surface direction different toward each other.Here, side surface direction is hair
The width direction of optical diode packaging part 40.In an embodiment of the present invention, connecting wire 11 can make the first hair by bending
The mounting surface of the substrate 31 of optical diode packaging part 41 and the second light emission diode package member 41 is closer to each other.
Also, electronic pads 12 can be made upward by the second bending section 52 in light emission diode package member component 210
Portion direction or the bending of lower part direction.Since electronic pads 12 are curved to upper direction or lower part direction due to the second bending section 52
It is bent, thus it is possible to vary the up and down direction of the mounting surface institute direction of the substrate 31 of light emission diode package member 40.Therefore, first luminous two
Pole pipe packaging part 41 can issue more light to upper direction, and the second light emission diode package member 42 can be sent out in direction to the lower part
More light out.
By this first bending section 51 and the second bending section 52, connecting wire 11 and electronic pads 12 can be bent and be made
Different direction shines two light emission diode package members 40 to each other.Therefore, light emission diode package member component 210 can incite somebody to action
Light disperses and issues light to top and the bottom direction, rather than concentrates light only in side surface direction and issue.
In the present embodiment, for ease of description, by the mounting surface institute direction of the substrate 31 of light emission diode package member 40
Direction be expressed as the directions of luminous 40 directions in direction or light emission diode package member of light emission diode package member 40.So
And this statement is merely for convenience and purposes of illustration of, and is not to be limited to light emission diode package member 40 of the invention only in one side
It shines.Light emission diode package member 40 of the invention shines in the case of substrate 31 is light-transmitting substrate to omnidirection, this is right
Those skilled in the art are obvious.After, identical statement will be also used in other embodiments.
Figure 11 is the exemplary diagram for showing the light emitting diode bulb of second embodiment according to the present invention.
Light emitting diode bulb 200 according to the second embodiment includes two light emitting diode envelopes according to the second embodiment
Piece installing component 210.
Light emission diode package member component 210 is bonded to the upper surface of supporting table 130 due to the lower surface of connecting wire 11
And it is erected at the inside of translucency lid 150.At this point, constituting the first light emitting diode of light emission diode package member component 210
Packaging part 41 and the second light emission diode package member 42 are arranged as being bent sides different toward each other by connecting wire 11
Direction.Also, since electronic pads 12 are bent, the first light emission diode package member 41 is arranged towards upper direction, and second shines
Diode encapsulating parts 42 are arranged towards lower part direction.
In light emitting diode bulb 200, this two light emission diode package member components 210 are arranged as opposite to one another.
It shines as a result, four light emission diode package members 40 may be arranged to different directions to each other.Therefore, implementation according to the present invention
The light emitting diode bulb 200 of example can not only shine to the side surface direction of translucency lid 150, can also to upper direction and
Lower part direction equably shines.
Figure 12 is the exemplary diagram of the light emission diode package member component of second embodiment according to the present invention.
With reference to Figure 12, according to second embodiment, light emission diode package member component 210 has the first LED package
The structure of part 41 and the different towards each other side surface direction of the second light emission diode package member 42.At this point it is possible to by the first hair is made
The mounting surface of optical diode packaging part 41 and the respective substrate 31 of the second light emission diode package member 42 mode closer to each other, even
Conducting wire 11 is connect to be bent in the first bending section 51.
Also, light emission diode package member component 210 has by making the first light emission diode package member 41 and second shine
Diode encapsulating parts 42 make the curved structure of electronic pads 12 connecting with connecting wire 11 towards the mode of upper direction.
The light emission diode package member component 210 of this structure is applied to the light emission diode package member 200 such as Figure 11
When, it can also not only shine to the lateral emitting of translucency lid 150 to upper direction.
Figure 13 is the another embodiment for showing the light emission diode package member component of second embodiment according to the present invention.
It, can be by making the first light-emitting diodes in light emission diode package member component 210 according to the second embodiment with reference to Figure 13
The mode of pipe packaging part 41 and the different toward each other side surface direction of the second light emission diode package member 42, connecting wire 11 is
The bending of one bending section 51.At this point, can be by making the first light emission diode package member 41 and the second light emission diode package member 42 respectively
Substrate 31 mounting surface mode away from each other, connecting wire 11 is bent.
It, can be by making the first light emission diode package member 41 and second shine also, in light emission diode package member component 210
Towards the mode of upper direction, connection gasket 12 is bent the mounting surface of the substrate 31 of diode encapsulating parts 41 in the second bending section 52.
In this case, more light can be issued to the side surface direction and upper direction of light emission diode package member component 210.
Figure 14 is the exemplary diagram for showing the light emitting diode bulb of third embodiment according to the present invention.
There is the light emission diode package member component 210 of Figure 13 in the application of light emitting diode bulb 300.
Two light emission diode package member components 210 are by being bonded to supporting table 130 for the rear surface of connecting wire 11
Top, to be erected inside translucency lid 150.Here, the rear surface of connecting wire 11 is connecting wire 11 in such as Figure 13
When ground is bent from the first bending section 51, a surface closer to each other.Also, it is viscous in two light emission diode package member components 210
For knot in supporting table, the connecting wire 11 of each light emission diode package member component 210 is arranged as rear surface toward each other.
Upper contact of the arrangement of this light emission diode package member component 210 due to connecting wire 11 and supporting table 130
Area it is big, therefore light emission diode package member component 210 can be firmly secured at supporting table 130.
Also, according to an embodiment of the invention, the top of the supporting table 130 of light emitting diode bulb 300 can have greatly
Perimeter.The perimeter on the top of supporting table 130, which has, is bonded to supporting table 130 in two light emission diode package member components 210
When top, degree that each connecting wire 11 or each light emission diode package member component 210 can be made not to contact each other
Size.
It is thus possible to improve the contact area between light emission diode package member component 210 and supporting table 130, to make
Light emission diode package member component 210 is more stably mounted to supporting table 130.
Also, it is insulated from each other since two light emission diode package member components 210 are not in contact with each other.It therefore, can be with
Omit the additional megohmite insulant for making to insulate between two light emission diode package member components 210.
By the various embodiments of light emission diode package member component 210 according to the second embodiment, illustrate to lead to
Cross the light emission direction that bending section 50 adjusts each light emission diode package member 40.Further, it is thus identified that bending section can be passed through
50 and adjust the direction of the light issued from light emission diode package member component 210 and light emitting diode bulb 200,300, range,
Distribution etc..
Figure 15 and Figure 16 be the manufacturing method of the light emission diode package member component of third embodiment according to the present invention with
And the exemplary diagram of the light emission diode package member component according to it.
Referring to Fig.1 5, multiple light emission diode package members 40 are disposed in lead frame 10.Multiple LED packages
Part 40 is arranged as opposite with the position of the anode electrode of adjacent light emission diode package member 40 and cathode electrode.
For example, the light emission diode package member 40 for being arranged in odd bits may be disposed so that in lead frame 10 in Figure 15
One side direction is disposed with cathode electrode, and is disposed with anode electrode in another side direction.Also, it is arranged in luminous the two of even bit
Pole pipe packaging part 40, which may be disposed so that, is disposed with anode electrode in a side direction of lead frame 10, and is disposed in another side direction
Cathode electrode.
In an embodiment of the present invention, 4 light emission diode package members 40 being arranged side by side become a light emitting diode
Packaging part component 310.Therefore, cutting line C-shaped becomes every four light emission diode package members 40, the side of lead frame 10 and another
It is cut side.Also, cutting line C-shaped becomes on the basis of a light emission diode package member component 310 and cuts the second hair
The side of lead frame 10 between optical diode packaging part 42 and third light emission diode package member 43.Also, cutting line C-shaped
It is sealed as between the first light emission diode package member 41 of cutting and the second light emission diode package member 42 with third light emitting diode
The other side of lead frame 10 between piece installing 43 and the 4th light emission diode package member 44.Also, cutting line C-shaped, which becomes, makes the
The first electrode pad 13 of one light emission diode package member 41 and the 4th light emission diode package member 44 is separated with lead frame 10.
Also, in an embodiment of the present invention, in the second light emission diode package member 42 and third LED package
The side of lead frame 10 between part 43 is formed with the first bending section 51.Also, in 41 He of the first light emission diode package member
Between second light emission diode package member 42 and third light emission diode package member 43 and the 4th light emission diode package member 44 it
Between the other side of lead frame 10 be formed with the first bending section 51.It, can if executing cutting technique according to this cutting line C
Form light emission diode package member component 310 according to the third embodiment as shown in figure 16.In light emission diode package member group
In part 310, the first electricity of the second electrode pad 14 of the first light emission diode package member 41 and the second light emission diode package member 42
Polar cushion 13 is connected by connecting wire 11.Therefore, the first light emission diode package member 41 and the second light emission diode package member 42 string
Connection connection.
Also, the of the second electrode pad 14 of the second light emission diode package member 42 and third light emission diode package member 43
One electronic pads 13 are connected by connecting wire 11.Therefore, the second light emission diode package member 42 and third light emission diode package member
43 are connected in series.
Also, the of the second electrode pad 14 of third light emission diode package member 43 and the 4th light emission diode package member 44
One electronic pads 13 are connected by connecting wire 11.Therefore, third light emission diode package member 43 and the 4th light emission diode package member
44 are connected in series.
Therefore, 41 to the 4th light emitting diode of the first light emission diode package member of light emission diode package member component 310
Packaging part 44 is connected in series.
Figure 17 and Figure 18 is the light emitting diode bulb for showing fourth embodiment according to the present invention and the 5th embodiment
Exemplary diagram.
It include according to the third embodiment according to the light emitting diode bulb 400,500 of fourth embodiment and the 5th embodiment
Light emission diode package member component 310.
In light emission diode package member component 310, it is bent connecting wire 11 by the first bending section 51, thus four
Light emission diode package member 40 is arranged as quadrangular form.If the light-emitting diodes that light emission diode package member component 310 includes
The quantity of pipe packaging part 40 changes, then light emission diode package member 40 may be arranged to other polygon prism forms.
It can make light emission diode package member 400,500 by the light emission diode package member component 310 of this structure
It equably shines to all side surface directions.
The first electrode 13 not connecting with connecting wire 11 in light emission diode package member component 310 passes through lead-in wire
140 and connect with the first external electrode 121 of basic courses department 120.Also, in light emission diode package member component 310 not with
The second electrode pad 14 that connecting wire 11 connects can be connected by lead-in wire 140 and the second external electrode 122 of basic courses department 120
It connects.The first electrode pad 13 and second electrode pad 14 connecting with lead-in wire 140 are located under light emission diode package member component 310
Portion.
With reference to Figure 17, according in the light emitting diode bulb 400 of fourth embodiment, light emission diode package member component 310
It is erected inside translucency lid 150 by lead-in wire 140.First light emission diode package member, 41 to the 4th light emitting diode
Packaging part 44 passes through the superposed connecting wire 11 of light emission diode package member component 310 and the connecting wire positioned at lower part
11 and support each other.At this point, lead-in wire 140, which can be formed to have, can support the strong of light emission diode package member component 310
Degree.The structure and lead-in wire 140 of this light emission diode package member component 310, light emission diode package member component can be passed through
310 can also be erected at the inside of translucency lid 150 even if the top of the cylindricality state without supporting table 130 and be fixed.
With reference to Figure 18, in the light emitting diode bulb 500 according to the 5th embodiment, light emission diode package member component
310 are bonded in supporting table 130 and are erected inside translucency lid 150.Light emission diode package member component 310 is located at top
Connecting wire 11 top of supporting table 130 is bonded in by binder.
Also, light emitting diode bulb 500 can use lead-in wire 140 as fourth embodiment and support light-emitting diodes
The lower part of pipe packaging part component 310.In this case, the top of light emission diode package member component 310 passes through supporting table 130
And be fixed, lower part is supported by lead-in wire 140, therefore can be more firmly fixed on inside translucency lid 150.
Figure 19 and Figure 20 is the manufacturer for showing the light emission diode package member component of fourth embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
Referring to Fig.1 9, multiple light emission diode package members 40 are installed in lead frame 10.
Lead frame 10 includes two inner spaces 15 for being disposed with multiple light emission diode package members 40, and in two
Portion space 15 is the shared structure for forming connecting wire 11 between them.Electronic pads 12 are respectively and two inner spaces 15
Between the connecting wire 11 that is formed and the connecting wire 11 opposite with the side of the connecting wire 11 and the other side be integrally formed.
Multiple light emission diode package members 40 are arranged side by side two inner spaces 15.An inner space will be arranged in
15 light emission diode package member 40 divides into the first light emission diode package member 41, will be arranged in the hair of another inner space 15
Optical diode packaging part 40 is divided into the second light emission diode package member 42 and is illustrated.Multiple light emission diode package members 40
Anode electrode and cathode electrode are arranged as towards identical direction.
Cutting line C-shaped becomes the electronic pads for making the first light emission diode package member 41 and the second light emission diode package member 42
12 separate with the two sides of lead frame 10.Also, cutting line C-shaped becomes the light emission diode package member in an inner space 15
Connecting wire 11 between 40 and adjacent light emission diode package member 40 is cut.At this point, passing through two inner spaces 15
The first light emission diode package member 41 and the second light emission diode package member 42 being arranged side by side are by being located at two inner spaces
Connecting wire 11 between 15 and connect.That is, cutting line C-shaped becomes, in 41 He of the first light emission diode package member of same column
Second light emission diode package member 42 separates in the state of connected with lead frame 10.
Also, it could be formed with the second bending section between the connecting wire 11 and electronic pads 12 between two inner spaces 15
52。
With reference to Figure 20, show and carry out cutting technique along cutting line C, thus separated with lead frame 10 according to the 4th
The light emission diode package member component 410 of embodiment.
According in the light emission diode package member component 410 of fourth embodiment, the of the first light emission diode package member 41
The first electrode pad 13 of two electronic pads 14 and the second light emission diode package member 42 is electrically connected by connecting wire 11.Accordingly,
According to the light emission diode package member component 410 of fourth embodiment by being connected in series and being arranged as the first light-emitting diodes of a column
Pipe packaging part 41 and the second light emission diode package member 42 are constituted.
Figure 21 is the exemplary diagram for showing the light emitting diode bulb of sixth embodiment according to the present invention.
Light emitting diode bulb 600 according to sixth embodiment includes the light emission diode package member according to fourth embodiment
Component 410.
Light emission diode package member component 410 is respectively formed in the electronic pads 12 being connected with the two sides of connecting wire 11
Two bending sections 52.In light emission diode package member component 410, direction is curved to the lower part in each second bending section 52 for electronic pads 12
It is bent.Therefore, there are two the opposite side sides toward each other of light emission diode package member 40 for the tool of light emission diode package member component 410
To structure.
In an embodiment of the present invention, two light emission diode package member components for including by light emitting diode bulb 600
410 divide into the first light emission diode package member component 411 and the second light emission diode package member component 412 is illustrated.
The connecting wire 11 of first light emission diode package member component 411 is located at the upper surface of supporting table 130 and bonding
In the upper surface of supporting table 130.At this point, in the connecting wire 11 and supporting table 130 of the first light emission diode package member component 411
Between there are insulating properties binders 610.If the first light emission diode package member component 411 is glued to supporting table 130, the
Two light emission diode package members 40 of one light emission diode package member component 411 be arranged as on the basis of supporting table 130 and to
Reciprocal side surface direction shines.
The connecting wire 11 of second light emission diode package member component 412 is located at upper surface and the first hair of supporting table 130
The upper surface of the connecting wire 11 of optical diode packaging part component 411.At this point, 412 cloth of the second light emission diode package member component
It is set to its connecting wire 11 and the connecting wire 11 of the first light emission diode package member component 411 is staggered.Second light emitting diode
The upper surface of the connecting wire 11 of packaging part component 412 and the connecting wire 11 of the first light emission diode package member component 411 it
Between there are insulating properties binders 610.Also, in the connecting wire 11 and supporting table of the second light emission diode package member component 412
There may also be insulating properties binders 610 between 130 upper surface.Two hairs of the second light emission diode package member component 412
Optical diode packaging part 40 is arranged as on the basis of supporting table 130 and opposite side surface direction shines to each other.
Also, by making the nonoverlapping mode of light emission diode package member 40 arrange the first light emission diode package member component
411 and the second light emission diode package member component 412.Therefore, light emitting diode bulb 600, which will include, is arranged towards each other not
Multiple light emission diode package members 40 of same side surface direction, therefore can equably be sent out by the side of translucency lid 150
Light.
Also, the curved angle of electronic pads 12 can be variously changed in light emission diode package member component 410.
For example, as shown in figure 21, light emission diode package member component 410 can have light emission diode package member 40 and incline to upper direction
Oblique structure.Therefore, because light emitting diode bulb 600 not only can be to the lateral emitting of translucency lid 150, it can also be to
Upper direction shines, and finally, can equably shine to the side surface direction and upper direction of translucency lid 150.
Figure 22 to Figure 26 is the manufacturer for showing the light emission diode package member component of seventh embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
According to an embodiment of the invention, multiple light emission diode package members 40 are arranged as and adjacent LED package
The polar sites having the same of part 40.That is, multiple light emission diode package members 40 may be arranged to all light emitting diode matrixs
32 anode electrode and cathode electrode are towards the same direction.
With reference to Figure 23, lead frame 20 is disposed on multiple light emission diode package members 40.Lead frame 20 can have
Have in 12 connecting wire 11 of multiple electrode pads to side or the other side structure outstanding.Lead frame 20 is arranged in hair
One end of optical diode packaging part 40 and the other end.At this point, the upper surface at the both ends of substrate 31 will be respectively and under electronic pads 12
Surface contact.
Electronic pads 12 divide into first electrode pad 13 and second electrode pad 14.First electrode pad 13 is anode electrode pad, the
Two electronic pads 14 are cathode electrode pads.That is, first electrode pad 13 is connect with the anode electrode of light emitting diode matrix 32, the second electricity
Polar cushion 14 is connect with the cathode electrode of light emitting diode matrix 32.
At least part in multiple electrode pads 12 is formed with label (Mark) 16.In an embodiment of the present invention, it marks
Note 16 is formed in first electrode pad 13.After arranging lead frame 20 on multiple light emission diode package members 40, to light-emitting diodes
Pipe packaging part 40 and lead frame 20 execute wire bonding.The anode electrode of each light emission diode package member 40 passes through the first electricity
Polar cushion 13 and lead and be electrically connected.Also, the cathode electrode of each light emission diode package member 40 passes through 14 He of second electrode pad
Lead and be electrically connected.
Referring to Figure 24, wavelength conversion section 34 is formed in the way of around light emitting diode matrix 32.
Figure 25 shows the cutting line C of lead frame 20.Cutting line C is to indicate when executing cutting technique, lead frame
The line of 20 parts cut.
For ease of description, the multiple light emission diode package members 40 for being arranged in lead frame 20 are divided into order
One light emission diode package member 41 to the 6th light emission diode package member 46 and be illustrated.
In an embodiment of the present invention, it is connected in parallel with three light emission diode package members 40 by connecting wire 11
Mode forms cutting member C.For example, cutting line C is so that third light emission diode package member 43 and the 4th light emission diode package member
The connection that 44 isolated modes are formed between third light emission diode package member 43 and the 4th light emission diode package member 44 is led
Line 11.If executing cutting technique, at least one light emission diode package member component 710 and lead frame 20 along cutting line C
Separation.
Figure 26 is to execute cutting technique and the light emission diode package member isolated with lead frame 20 along the cutting line C of Figure 25
Component 710.According to the light emission diode package member component 710 of the 7th embodiment tool, there are three 40 parallel connections of light emission diode package member
The structure of connection.Light emission diode package member component 710 includes three light emission diode package members 40, connecting wire 11 and electrode
Pad 12.Here, first electrode pad 13 and second electrode pad 14 are one-piece type with the connecting wire 11 respectively connecting.
If along cutting line C wire cutting frame 20, as shown in figure 26, the first light emission diode package member 41 to third
The first electrode pad 13 of light emission diode package member 43 is connected by a connecting wire 11.Also, the first light emitting diode
The second electrode pad 14 of packaging part 41 to third light emission diode package member 43 is connected by another connecting wire 11.
Also, in 44 to the 6th light emission diode package member 46 of the 4th light emission diode package member, first electrode pad 13
It is also coupled to a connecting wire 11, and second electrode pad 14 is also coupled to another connecting wire 11.
Therefore, two hairs according to the 7th embodiment of the structure that three light emission diode package members 40 are connected in parallel are formed
Optical diode packaging part component 710.
In the past, multiple light emission diode package members and multiple lead frames were separately separated.Therefore, in order to will it is multiple shine
Diode encapsulating parts electrical connection, needs the constituting portion such as lead, and this composition portion needs separately fabricated.
However, according to an embodiment of the invention, light emission diode package member 40 is not separated with lead frame not instead of respectively,
It is electrically connected to each other using lead frame.
It therefore, can be in the manufacturing method of the light emission diode package member component 710 of an embodiment according to the present invention
Omit technique of the manufacture for the individual constituting portion of the connection between light emission diode package member 40.Also, in light-emitting diodes
In the manufacturing method of pipe packaging part component 710, it can use separately fabricated constituting portion and omit light emission diode package member
The technique of 40 electrical connections.That is, in the past in order to which being electrically connected so that between multiple light emission diode package members 40 uses lead.However,
According to an embodiment of the invention, do not need the lead for being electrically connected multiple light emission diode package members 40, and do not need by
The technique that lead is connected to light emission diode package member 40.Due to the manufacturing process coverlet of light emission diode package member component 710
Purifying, manufacturing time and material cost are reduced, and finally additionally provide the light bulb manufactured using light emission diode package member component 710
Productivity.
After, for the convenience of explanation, two light emission diode package member components 710 are divided into the first light emitting diode
Packaging part 711 and the second light emission diode package member 712 and be illustrated.
Figure 27 is the exemplary diagram for showing the light emitting diode bulb of seventh embodiment according to the present invention.
It include basic courses department 120, supporting table 130, hair according to the light emitting diode bulb 700 of the 7th embodiment with reference to Figure 27
Optical diode packaging part component 710, lead-in wire 140, translucency lid 150 and interconnecting piece 160.
In the inside of translucency lid 150, there are two light emission diode package member components 710 for arrangement.Here, two shine
Diode encapsulating parts component 710 is the first light emission diode package member component 711 and second luminous two according to the 7th embodiment
Pole pipe packaging part component 712.
First light emission diode package member component 711 and the second light emission diode package member component 712 are by being bonded in branch
It supports platform 130 and is straightened in the mode opposite with the medial surface of translucency lid 150 of light-emitting diode chip for backlight unit 33.Also, first
Light emission diode package member component 711 and the second light emission diode package member component 712 may be arranged to make electrode toward each other
Different directions.For example, the first light emission diode package member component 711 may be arranged to second electrode pad 14 towards top side
To the second light emission diode package member component 712 may be arranged to first electrode pad 13 towards upper direction.
At this point, in the first light emission diode package member component 711 and the second light emission diode package member component 712, court
The top of supporting table 130 is bonded in each connecting wire 11 of upper direction.Also, the first light emission diode package member component
711 and second light emission diode package member component 712 may be arranged to directions different to each other shine.For example, first shines
Diode encapsulating parts component 711 and the second light emission diode package member component 712 may be arranged to opposite to one another.Also, first
Light emission diode package member component 711 and the second light emission diode package member component 712 can be arranged as by lead-in wire 140
It is tilted gently towards upper direction.Therefore, light emitting diode bulb 700 not only can be to lateral emitting, can also be to upper direction
It shines.
Although being illustrated in the present invention with two light emission diode package member components 710 for example, light-emitting diodes
The quantity of pipe packaging part component 710 is not limited to this.The quantity of light emission diode package member component 710 can change, and send out
The arragement construction of optical diode packaging part component 710 can also change according to the quantity of light emission diode package member component 710.
Interconnecting piece 160 leads the connection connecting in the first light emission diode package member component 711 with second electrode pad 14
Line 11 and the connecting wire 11 being connect in the second light emission diode package member component 712 with first electrode pad 13 electrical connection.Cause
This, the first light emission diode package member component 711 and the second light emission diode package member component 712 are electrically connected in series.
The connecting wire 11 of first light emission diode package member component 711 connecting with first electrode pad 13 passes through basic courses department
120 the first external electrode 121 and lead-in wire 140 and the positive power supply with external power supply is connect.Also, the second light-emitting diodes
The connecting wire 11 of pipe packaging part component 712 connecting with second electrode pad 14 passes through the second external electrode 122 of basic courses department 120
With lead-in wire 140 and the negative power supply with external power supply is connect.Lead-in wire 140 at least part perforation supporting table 130 and incite somebody to action
First external electrode 121 is connected with the first light emission diode package member component 711 and the second external electrode 122 and second shines
Diode encapsulating parts component 122 is connected.Therefore, lead-in wire 140 is fixed as not moving by supporting table 130, and can obtain
To protection.
Also, lead-in wire 140, which can have, can support light emission diode package member component 710 as the strong of following degree
Degree, that is, the first light emission diode package member component 711 and the second light emission diode package member component 712 to upper direction to incline
Tiltedly state is fixed.
According to the present invention one light emitting diode bulb 700 implemented can pass through the light-emitting diodes according to the 7th embodiment
The structure of pipe packaging part component 710, supporting table 130, lead-in wire 140 and equably shine to side surface direction and upper direction.
After, structure identical with the 7th embodiment or duplicate theory will be omitted in the explanation for other embodiments
It is bright.The content of omission can refer to the explanation of Figure 22 to Figure 27.
Figure 28 and Figure 29 is the manufacturer for showing the light emission diode package member component of the 8th embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to manufacturing method.
Referring to Figure 28, multiple light emission diode package members 40 of arrangement are connect with lead frame 20.LED package
The connection method of part 40 and lead frame 20 can refer to Figure 22 to Figure 25.Multiple light emission diode package members 40 are arranged as anode
Electrode is identical with the position of cathode electrode.
In an embodiment of the present invention, cutting line C-shaped, which becomes, makes three light emission diode package members 40 pass through connecting wire
11 are connected in parallel.For example, cutting line C formed third light emission diode package member 43 and the 4th light emission diode package member 44 it
Between connecting wire 11.Also, the connecting wire 11 between each light emission diode package member 40 is formed with the first bending section
51。
First bending section 51 is formed between electronic pads 12 in connecting wire 11, and along light emission diode package member 40
Length direction is formed.That is, the first bending section 51 is formed in such a way that the long axis direction perpendicular to connecting wire 11 is curved.Here,
The length of light emission diode package member 40 is to be formed with the distance between first electrode pad 13 and the two sides of second electrode pad 14.
Therefore, the length direction of light emission diode package member 40 is parallel to the rectilinear direction of the length of light emission diode package member 40.
First bending section 51 is formed as connecting wire 11 being bent by a predetermined angle.As long as connecting wire 11 can be bent,
Then the first bending section 51 can be formed with any form and method.For example, the first bending section 51 can be by the one of connecting wire 11
Part half-etching (half etching) and formed.Alternatively, the first bending section 51 can be formed completely through the one of connecting wire 11
At least one partial through hole.Alternatively, the first bending section 51 can be formed as using a part of connecting wire 11 sharply
The impression of object pressurization.
Referring to Figure 28, the first bending section 51 is formed in the connecting wire 11 between each light emission diode package member 40, and
It is formed in a manner of making connecting wire 11 bend right and left.
Along cutting line C wire cutting frame 20, then it will form two light emission diode package member components 810.
First light emission diode package member component 811 has the first light emission diode package member 41 to third light emitting diode
The structure that packaging part 43 is connected in parallel by connecting wire 11.First light emission diode package member 41 is to third light emitting diode
The first electrode pad 13 of packaging part 43 is all connected to a connecting wire 11, and second electrode pad 14 is connected to another connection
Conducting wire 11.
Also, it is sent out in the second light emission diode package member component 812 with the 4th light emission diode package member 44 to the 6th
The structure that optical diode packaging part 46 is connected in parallel by connecting wire 11.4th light emission diode package member 44 to the 6th hair
The first electrode pad 13 of optical diode packaging part 46 is all connected to a connecting wire 11, and second electrode pad 14 is connected to
Another connecting wire 11.
If by the two light emission diode package member components 810 separated with lead frame 20 along the of connecting wire 11
The bending of one bending section 51, then become light emission diode package member component 810 shown in Figure 29.
Referring to Figure 29, it is bent connecting wire 11 along the first bending section 51, then is included in a light emission diode package member group
Three light emission diode package members 40 of part 810 may be arranged to side surface directions different toward each other.Therefore, each luminous two
Pole pipe packaging part 40 different side surface direction can shine to each other.Here, the direction that light emission diode package member 40 shines is
The direction of the mounting surface institute direction of the substrate 31 of light emitting diode matrix 32 is installed in light emission diode package member 40.And
And side surface direction is the width direction of light emission diode package member 40.The width of light emission diode package member 40 is first electrode
The distance between the two sides of light emission diode package member 40 between pad 13 and second electrode pad 14.Therefore, light emitting diode
The width direction of packaging part 40 is the rectilinear direction with the width parallel of light emission diode package member 40.
In the light emission diode package member component 810 of the 8th embodiment according to the present invention, pass through the first bending section 51
It is bent connecting wire 11, so that the rear surface for being arranged in the light emission diode package member 40 at both ends is closer to each other.Here, rear surface
It is the reverse side of the mounting surface of substrate 31.
In this way, the first bending can be passed through in the light emission diode package member component 810 of embodiment according to the present invention
Portion 51 forms each light emission diode package member 40 in such a way that side surface directions different to each other shines.
The light emission diode package member component 810 of 8th embodiment according to the present invention has by making the hair for being arranged in both ends
The rear surface of the optical diode packaging part 40 curved structure of mode connecting wire 11 closer to each other.However, in contrast to this, hair
Optical diode packaging part component 810 can also be by keeping the mounting surface for the light emission diode package member 40 for being arranged in both ends closer to each other
The curved structure of mode connecting wire 11.
Figure 30 is the exemplary diagram for showing the light emitting diode bulb of the 8th embodiment according to the present invention.
It include two hairs according to the 8th embodiment according to the light emitting diode bulb 800 of the 8th embodiment referring to Figure 30
Optical diode packaging part component 810.
First light emission diode package member component 811 may be arranged to make second electrode pad 14 towards upper direction, and second
Light emission diode package member component 812 may be arranged to make first electrode pad 13 towards upper direction.
At this point, in the first light emission diode package member component 811 and the second light emission diode package member component 812, court
The top of supporting table 130 is bonded to each connecting wire 11 of upper direction.
Also, the first light emission diode package member component 811 and the second light emission diode package member component 812 pass through connection
Portion 160 and be serially connected.
According to the 8th embodiment, the first luminous light emission diode package member group of the side surface direction for being formed as different to each other
Part 811 and the second light emission diode package member component 812 are arranged as opposite to one another.Finally, 6 light emitting diodes be may be arranged to
Packaging part 40 surrounds supporting table 130.Therefore, light emitting diode bulb 800 can by entire side, rather than surface and
Equably shine.
Also, lead-in wire 140 can support the lower part of light emission diode package member component 810, so that as shown in figure 30
Light emission diode package member component 810 is maintained to the inclined state of upper direction.Due to 810 cloth of light emission diode package member component
It is set to upper direction and tilts, light emitting diode bulb 800 can also shine to upper direction.
Therefore, the light emitting diode bulb 800 of embodiment according to the present invention can pass through the hair according to the 8th embodiment
The structure of optical diode packaging part component 810, supporting table 130, lead-in wire 140 and equably sent out to side surface direction and upper direction
Light.
As another embodiment, using by keeping the mounting surface for the light emission diode package member 40 for being arranged in both ends closer to each other
The curved light emission diode package member component 810 of mode connecting wire 11, can also make only preset range shine hair
Optical diode light bulb 800.
Figure 31 and Figure 32 is the manufacturer for showing the light emission diode package member component of the 9th embodiment according to the present invention
The exemplary diagram of method and the light emission diode package member component according to it.
Referring to Figure 31, multiple light emission diode package members 40 be arranged as every three light emission diode package members 40 on the contrary
Arrange the position of anode electrode and cathode electrode.That is, in the first light emission diode package member 41 to third LED package
In part 43, the side direction along lead frame 20 is disposed with cathode electrode, is disposed with anode electrode along another side direction.Also,
In 44 to the 6th light emission diode package member 46 of the 4th light emission diode package member, the side direction along lead frame 20 is arranged
There is anode electrode, another side direction is disposed with cathode electrode.
Between the side of lead frame 20, third light emission diode package member 43 and the 4th light emission diode package member 44
It is formed with cutting line C.Also, the other side of lead frame 20 is formed with cutting line C, so that all electronic pads 12 and connecting wire
11 separation.
Also, it is formed between the connecting wire of the side of lead frame 20 11, each light emission diode package member 40
First bending section 51.Also, the electronic pads 12 connecting with connecting wire 11 are formed with the second bending section 52.Second bending section 52 exists
Electronic pads 12 are formed along the width direction of light emission diode package member 40.That is, the second bending section 51 is formed as along electronic pads 12
Long axis direction is perpendicularly bent toward.First bending section 51 is formed as being bent connecting wire 11, and the second bending section 52 is formed
For for meander electrode pad 12.
Cutting is executed along cutting line C, along the first bending section 51 and the second bending section 52 bending connecting wire 11 and electrode
Pad 12 then will form the light emission diode package member component 910 according to Figure 32.
In the light emission diode package member component 910 according to the 9th embodiment, three light emission diode package members 40 are borrowed
It helps a connecting wire 11 and is connected in parallel.In the first light emission diode package member component 911, a connecting wire 11 only connects
It is connected to second electrode pad 14, first electrode pad 13 is separated from each other.Also, in the second light emission diode package member component 912, one
A connecting wire 11 is only connected with first electrode pad 13, and second electrode pad 14 is separated from each other.
Also, it can lead in the first light emission diode package member component 911 and the second light emission diode package member component 912
It crosses the first bending section 51 and connecting wire 11 is made to bend right and left.
In the embodiment of the present invention, the first light emission diode package member component 911, with the first light emission diode package member
41 and the rear surface mode closer to each other of third light emission diode package member 43 be bent connecting wire 11.Also, second
In light emission diode package member component 912, with the 4th light emission diode package member 44 and the 6th light emission diode package member 46
Rear surface mode closer to each other is bent connecting wire 11.Also, in the first light emission diode package member component 911 and second
In light emission diode package member component 912, the light emission diode package member 40 for respectively including can be toward different directions from each other
It shines.
Also, in the first light emission diode package member component 911 and the second light emission diode package member component 912, electricity
Polar cushion 12 can be bent by the second bending section 52 to upper direction or lower part direction.
In the embodiment of the present invention, the first light emission diode package member component 911, the first light emission diode package member 41
Second electrode 14 to third light emission diode package member 43 distinguishes up and down direction bendings different to each other.Also, second
In light emission diode package member component 912, the of the 4th light emission diode package member 44 to the 6th light emission diode package member 46
One electronic pads 13 also distinguish up and down direction bendings different to each other.Therefore, in the first light emission diode package member component 911
In second light emission diode package member component 912, the light emission diode package member 40 that respectively includes can be different upper to each other
Lower direction shines.
Figure 33 is the exemplary diagram for showing the light emitting diode bulb of the 9th embodiment according to the present invention.
Light emitting diode bulb 900 according to the 9th embodiment includes the light emission diode package member according to the 9th embodiment
Component 910.
First light emission diode package member component 911 and the second light emission diode package member component 912 are bonded to supporting table
130 top and be fixed to supporting table 130.Also, the first light emission diode package member component 911 and the second light emitting diode envelope
Piece installing component 912 is arranged as opposite to one another.
Interconnecting piece 160 seals the connecting wire 11 of the first light emission diode package member component 911 and the second light emitting diode
The connecting wire 11 of piece installing component 912 is electrically connected.Therefore, the first light emission diode package member component 911 and the second light-emitting diodes
Pipe packaging part component 912 is connected in series by interconnecting piece 160.
The first electrode pad 13 of first light emission diode package member component 911 passes through lead-in wire 140 and basic courses department 120
The connection of first external electrode 121.Also, the second electrode pad 14 of the second light emission diode package member component 912 passes through lead-in wire
140 and connect with the second external electrode 122 of basic courses department 120.
The light emitting diode of first light emission diode package member component 911 and the second light emission diode package member component 912
Packaging part 40 can different direction shines to each other.Therefore, not only according to the light emitting diode bulb 900 of the 9th embodiment
It can equably can also shine as upper direction and lower part direction to the lateral emitting of translucency lid 150.
It include three light-emitting diodes with light emission diode package member component when illustrating that various embodiments of the invention carry out
The situation of pipe packaging part is illustrated for example.However, the LED package that light emission diode package member component includes
The quantity of part is not limited to this, and can change the quantity of light emission diode package member according to the selection of those skilled in the art.
It include two to four luminous two with light emission diode package member component when illustrating multiple embodiments of the invention
It is illustrated for the situation of pole pipe packaging part.However, the LED package that light emission diode package member component includes
The quantity of part is not limited to this.Light emission diode package member component can be changed according to the selection of those skilled in the art includes
Light emission diode package member quantity.
More than, although various embodiments of the invention are illustrated, the present invention is not limited to above-mentioned a variety of implementations
Example and feature can carry out various deformation and be changed in the range of not departing from the technical idea of claims according to the present invention
Become.
Claims (48)
1. a kind of light emission diode package member component, comprising:
Multiple light emission diode package members respectively include substrate, light emitting diode matrix and a pair of electrodes pad, the light-emitting diodes
Pipe array by be mounted on the substrate an at least surface and be electrically connected multiple light-emitting diode chip for backlight unit constitute, it is the pair of
Electronic pads are arranged in the both ends of the substrate and are electrically connected with the light emitting diode matrix；And
Connecting wire connects the electronic pads of one end between two light emission diode package members adjacent to each other,
Between two light emission diode package members adjacent to each other, the electronic pads of the other end are separated from each other,
The multiple light emission diode package member is electrically connected in series,
The connecting wire is one-piece type with the electronic pads.
2. light emission diode package member component as described in claim 1, wherein the light emission diode package member component includes
Two light emission diode package members,
The electronic pads of described two light emission diode package member one end are connected by the connecting wire, the institute of the other end
Electronic pads are stated to be separated from each other.
3. light emission diode package member component as described in claim 1, wherein the light emission diode package member component includes
Three or more light emission diode package members,
The electricity at the both ends of other light emission diode package members other than being located at two light emission diode package members of two side ends
Polar cushion is connect with adjacent light emission diode package member different from each other respectively by the connecting wire,
Two light emission diode package members positioned at two side ends include not electronic pads in conjunction with the connecting wire.
4. light emission diode package member component as described in claim 1, wherein
The connecting wire further include: the first bending section, by the side for keeping two light emission diode package members of connection closer to each other
Formula bending.
5. light emission diode package member component as described in claim 1, further includes:
Second bending section is bent by the close mode of the connecting wire and substrate that make connection.
6. light emission diode package member component as described in claim 1, wherein
The substrate of each of the multiple light emission diode package member is light-transmitting substrate.
7. light emission diode package member component as described in claim 1, wherein
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the substrate
An at least surface and the light emitting diode matrix.
8. light emission diode package member component as claimed in claim 6, wherein
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the substrate
Two surfaces and the light emitting diode matrix.
9. a kind of light emission diode package member component, comprising:
First light emission diode package member and the second light emission diode package member respectively include transparent substrate, light emitting diode battle array
Column, wavelength conversion layer anode electrode pad and cathode electrode pad, the light emitting diode matrix is by being arranged in the transparent substrate
On one surface and multiple light-emitting diode chip for backlight unit of series connection are constituted, and the wavelength conversion layer covers the transparent substrate
One surface and the light emitting diode matrix, the anode electrode pad is connected to one end of the light emitting diode matrix, described
Cathode electrode pad is connected to the other end of the light emitting diode matrix；And
One connecting wire connects the anode electrode pad and second light emitting diode of first light emission diode package member
The cathode electrode pad of packaging part,
The anode electrode pad and second light emitting diode of the connecting wire and first light emission diode package member seal
The cathode electrode pad of piece installing is integrally constituted type,
The anode electrode of the cathode electrode pad of first light emission diode package member and second light emission diode package member
Pad is separated by separation.
10. light emission diode package member component as claimed in claim 9, wherein
The connecting wire includes: at least one first bending section, is configured to be bent perpendicular to long axis direction.
11. light emission diode package member component as claimed in claim 9, wherein
It is connected to the anode electrode pad and described second luminous two of first light emission diode package member of the connecting wire
The cathode electrode pad of pole pipe packaging part has been respectively also formed perpendicular to curved second bending section of long axis direction.
12. a kind of light emission diode package member component, comprising:
First light emission diode package member to the 4th light emission diode package member respectively includes transparent substrate, light emitting diode battle array
Column, wavelength conversion layer, anode electrode pad and cathode electrode pad, the light emitting diode matrix is by being arranged in the transparent substrate
On one surface and multiple light-emitting diode chip for backlight unit of series connection are constituted, and the wavelength conversion layer covers the transparent substrate
One surface and the light emitting diode matrix, the anode electrode pad is connected to one end of the light emitting diode matrix, described
Cathode electrode pad is connected to the other end of the light emitting diode matrix；And
Connect the anode electrode pad of first light emission diode package member and the cathode of second light emission diode package member
First connecting wire of electronic pads connects the anode electrode pad and the third luminous two of second light emission diode package member
Second connecting wire of the cathode electrode pad of pole pipe packaging part, and connection third light emission diode package member anode electrode and
The third connecting wire of the cathode electrode pad of 4th light emission diode package member,
The anode electrode pad and cathode electrode of first connecting wire, the second connecting wire and third connecting wire and connection
Pad is integrally constituted type,
The anode electrode of the cathode electrode pad of first light emission diode package member and the 4th light emission diode package member
Pad is separated by with other electronic pads to be separated.
13. light emission diode package member component as claimed in claim 12, wherein
The connecting wire includes: the first bending section, is respectively structured as being bent perpendicular to long axis direction.
14. a kind of light emitting diode bulb, comprising:
Basic courses department is formed with and is connected with external power source a pair of external electrodes；
At least one light emission diode package member component respectively includes multiple light emission diode package members and connecting wire, institute
It states multiple light emission diode package members and respectively includes substrate, light emitting diode matrix and a pair of electrodes pad, the light-emitting diodes
Pipe array by be mounted on the substrate an at least surface and be electrically connected multiple light-emitting diode chip for backlight unit constitute, it is the pair of
Electronic pads are connected respectively to the both ends of the light emitting diode matrix, and the connecting wire is sealed by making the multiple light emitting diode
The mode that piece installing is electrically connected in series connects adjacent multiple light emission diode package members；
At least a pair of of lead-in wire, is electrically connected the external electrode of the basic courses department and not over the light emission diode package member group
The connecting wire of part and the electronic pads connected；And
Translucency lid surrounds the light emission diode package member component and the pair of lead-in wire, and one end and the base
Plinth portion combines,
The connecting wire with the electronic pads for being connected to the connecting wire be it is one-piece type,
The multiple electrically in parallel connection of light emission diode package member.
15. light emitting diode bulb as claimed in claim 14, wherein
The light emission diode package member component includes two light emission diode package members,
The electronic pads of one end of described two light emission diode package members are connected by the connecting wire, the other end
The electronic pads are separated from each other.
16. light emitting diode bulb as claimed in claim 14, wherein
The light emission diode package member component includes three or more light emission diode package members,
The electricity at the both ends of other light emission diode package members other than being located at two light emission diode package members of two side ends
Polar cushion is connect with adjacent light emission diode package member different from each other respectively by the connecting wire,
Two light emission diode package members positioned at two side ends include not electronic pads in conjunction with the connecting wire.
17. light emitting diode bulb as claimed in claim 14, wherein
The connecting wire further includes by two light emission diode package member modes closer to each other curved first for making connection
Bending section, to make two light emission diode package members of the connection different direction irradiation light to each other.
18. light emitting diode bulb as claimed in claim 14, wherein
The electronic pads of the light emission diode package member further include second bending close by the connecting wire and substrate that make connection
Portion, to make top irradiation light of each light emission diode package member to the light emitting diode bulb.
19. light emitting diode bulb as claimed in claim 14, wherein
The substrate of each of the multiple light emission diode package member is light-transmitting substrate.
20. light emitting diode bulb as claimed in claim 14, wherein
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the substrate
An at least surface and the light emitting diode matrix.
21. light emitting diode bulb as claimed in claim 14, wherein
Each of the multiple light emission diode package member further include: wavelength conversion section is formed as covering the substrate
Two surfaces and the light emitting diode matrix.
22. light emitting diode bulb as claimed in claim 14, wherein
The institute that the lead-in wire is not connect with the connecting wire with the other end in the multiple light emission diode package member
State electronic pads connection.
23. light emitting diode bulb as claimed in claim 14, further includes:
Supporting table is arranged in the inside of the translucency lid, extends from the basic courses department to upper direction,
The connecting wire is supported by the top of the supporting table or upper surface.
24. light emitting diode bulb as claimed in claim 14, further includes:
Supporting table is arranged in the inside of the translucency lid, extends from the basic courses department to upper direction,
The top or upper surface of the supporting table are bonded with the connecting wire.
25. light emitting diode bulb as claimed in claim 14, wherein
The light emission diode package member component be it is multiple,
Each of the multiple light emission diode package member component is distinguished and is electrically connected to the basic courses department.
26. a kind of light emission diode package member component, comprising:
Multiple light emission diode package members respectively include substrate, light emitting diode matrix, a pair of electrodes pad, the light-emitting diodes
Pipe array by be mounted on the substrate an at least surface and be electrically connected multiple light-emitting diode chip for backlight unit constitute, it is the pair of
Electronic pads are arranged in the both ends of the substrate and are electrically connected with the light emitting diode matrix；And
Connecting wire will be arranged in the electronic pads electrical connection of one end of the multiple light emission diode package member,
The connecting wire and the electronic pads of connection be it is one-piece type,
The multiple electrically in parallel connection of light emission diode package member.
27. light emission diode package member component as claimed in claim 26, wherein
The electronic pads for being arranged in the other end of the multiple light emission diode package member are separated from each other.
28. light emission diode package member component as claimed in claim 26, wherein
The connecting wire further include: the first bending section is sealed by the adjacent light emitting diode for making to connect with the connecting wire
Piece installing mode closer to each other is bent.
29. light emission diode package member component as claimed in claim 26, wherein
The electronic pads being connect with the connecting wire further include: the second bending section, by make the substrate and it is described connection lead
Line mode closer to each other is bent.
30. light emission diode package member component as claimed in claim 26, wherein
The substrate is light-transmitting substrate.
31. light emission diode package member component as claimed in claim 26, wherein
The light emission diode package member further include: wavelength conversion section is formed as at least surface for covering the substrate and institute
State light emitting diode matrix.
32. light emission diode package member component as claimed in claim 26, further includes:
Connecting wire is formed in the other end of the multiple light emission diode package member, will be arranged in the multiple light-emitting diodes
The electronic pads of the other end of pipe packaging part are electrically connected.
33. light emission diode package member component as claimed in claim 32, wherein
The electronic pads of the connecting wire and connection that are formed in the other end of the multiple light emission diode package member are
It is one-piece type.
34. light emission diode package member component as claimed in claim 32, wherein
The connecting wire for being formed in the other end of the multiple light emission diode package member is also formed with by making and the company
Connect the adjacent light emission diode package member of conducting wire connection curved first bending section of mode closer to each other.
35. a kind of light emitting diode bulb, comprising:
Basic courses department is formed with and is connected with external power source multiple external electrodes；
At least one light emission diode package member component, including multiple light emission diode package members and connecting wire are described more
A light emission diode package member respectively includes substrate, light emitting diode matrix and first electrode pad, the light emitting diode battle array
It arranges at least surface by being mounted on the substrate and the multiple light-emitting diode chip for backlight unit being electrically connected is constituted, the pair of electrode
Pad is arranged in the both ends of the substrate and is electrically connected with the light emitting diode matrix, and the connecting wire will be arranged in institute
State the electronic pads electrical connection of one end of multiple light emission diode package members；
Multiple lead-in wires are electrically connected the external electrode and the light emission diode package member component of the basic courses department；And
Translucency lid surrounds the light emission diode package member component and the multiple lead-in wire, and one end and the base
Plinth portion combines,
The connecting wire and the electronic pads of connection be it is one-piece type,
The multiple electrically in parallel connection of light emission diode package member.
36. light emitting diode bulb as claimed in claim 35, wherein
The connecting wire further include: the first bending section is sealed by the adjacent light emitting diode for making to connect with the connecting wire
Piece installing mode closer to each other is bent.
37. light emitting diode bulb as claimed in claim 35, wherein
The electronic pads being connect with the connecting wire further include: the second bending section, by make the substrate and it is described connection lead
Line mode closer to each other is bent.
38. light emitting diode bulb as claimed in claim 35, wherein
The substrate is light-transmitting substrate.
39. light emitting diode bulb as claimed in claim 35, in which:
The light emission diode package member further include: wavelength conversion section is formed as at least surface for covering the substrate and institute
State light emitting diode matrix.
40. light emitting diode bulb as claimed in claim 35, further includes:
Supporting table is arranged in the inside of the translucency lid, extends from the basic courses department to upper direction,
The connecting wire by the top of the supporting table or upper surface support or be bonded to the supporting table top or
Person upper surface.
41. light emitting diode bulb as claimed in claim 35, wherein
The electronic pads for being arranged in the other end of the multiple light emission diode package member are separated from each other.
42. light emitting diode bulb as claimed in claim 41, wherein
The lead-in wire is connected respectively to the electronic pads for the other end for being arranged in the light emission diode package member.
43. light emitting diode bulb as claimed in claim 35, further includes:
Connecting wire is formed in the other end of the multiple light emission diode package member, and will be arranged in the multiple shine
The electronic pads of the other end of diode encapsulating parts are electrically connected.
44. light emitting diode bulb as claimed in claim 43, wherein
The electronic pads of the connecting wire and connection that are formed in the other end of the multiple light emission diode package member are
It is one-piece type.
45. light emitting diode bulb as claimed in claim 43, wherein
The connecting wire for being formed in the other end of the multiple light emission diode package member is also formed with by making and the company
Connect the adjacent light emission diode package member of conducting wire connection curved first bending section of mode closer to each other.
46. light emitting diode bulb as claimed in claim 43, wherein
The lead-in wire is connect with the connecting wire for the other end for forming the multiple light emission diode package member.
47. light emitting diode bulb as claimed in claim 35, wherein
The light emission diode package member component is multiple.
48. light emitting diode bulb as claimed in claim 47, further includes:
The multiple light emission diode package member component is electrically connected by connecting line,
The connecting line is electrically connected with the connecting wire for being formed in the multiple light emission diode package member component one end, from
And the multiple light emission diode package member component is electrically connected in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410413711.5A CN118315518A (en) | 2017-04-21 | 2018-04-19 | Lighting device |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170051795A KR101916373B1 (en) | 2017-04-21 | 2017-04-21 | Led package set and led bulb including the same |
| KR10-2017-0051795 | 2017-04-21 | ||
| KR10-2017-0051796 | 2017-04-21 | ||
| KR1020170051796A KR101916371B1 (en) | 2017-04-21 | 2017-04-21 | Led package set and led bulb including the same |
| PCT/KR2018/004534 WO2018194386A1 (en) | 2017-04-21 | 2018-04-19 | Led package set and led bulb comprising same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410413711.5A Division CN118315518A (en) | 2017-04-21 | 2018-04-19 | Lighting device |
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| Publication Number | Publication Date |
|---|---|
| CN110121769A true CN110121769A (en) | 2019-08-13 |
| CN110121769B CN110121769B (en) | 2024-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880005535.4A Active CN110121769B (en) | 2017-04-21 | 2018-04-19 | Light emitting diode package assembly and light emitting diode bulb comprising same |
| CN202410413711.5A Pending CN118315518A (en) | 2017-04-21 | 2018-04-19 | Lighting device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410413711.5A Pending CN118315518A (en) | 2017-04-21 | 2018-04-19 | Lighting device |
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| WO (1) | WO2018194386A1 (en) |
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| US10234079B1 (en) * | 2018-05-07 | 2019-03-19 | Ledvance Llc | Self-supporting filament light emitting diode light engine lamp assembly |
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| KR101108984B1 (en) * | 2009-12-03 | 2012-01-31 | (주) 아모엘이디 | Multi-chip LED package and method of manufacturing a multi-chip LED package |
| JP2012129542A (en) * | 2010-03-11 | 2012-07-05 | Panasonic Corp | Light emitting module, light source device, liquid crystal display device, and manufacturing method of the light emitting module |
| CN103000652A (en) * | 2011-09-14 | 2013-03-27 | 隆达电子股份有限公司 | Solid-state light source module and solid-state light source array |
| US20130271987A1 (en) * | 2012-04-13 | 2013-10-17 | Cree, Inc. | Gas cooled led lamp |
| CN104094423A (en) * | 2012-01-31 | 2014-10-08 | 首尔半导体株式会社 | Light emitting diode package |
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|---|---|---|---|---|
| US20070247851A1 (en) * | 2006-04-21 | 2007-10-25 | Villard Russel G | Light Emitting Diode Lighting Package With Improved Heat Sink |
| KR101781043B1 (en) * | 2010-12-27 | 2017-09-25 | 엘지이노텍 주식회사 | Light-emitting element array |
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2018
- 2018-04-19 CN CN201880005535.4A patent/CN110121769B/en active Active
- 2018-04-19 CN CN202410413711.5A patent/CN118315518A/en active Pending
- 2018-04-19 WO PCT/KR2018/004534 patent/WO2018194386A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101108984B1 (en) * | 2009-12-03 | 2012-01-31 | (주) 아모엘이디 | Multi-chip LED package and method of manufacturing a multi-chip LED package |
| JP2012129542A (en) * | 2010-03-11 | 2012-07-05 | Panasonic Corp | Light emitting module, light source device, liquid crystal display device, and manufacturing method of the light emitting module |
| CN103000652A (en) * | 2011-09-14 | 2013-03-27 | 隆达电子股份有限公司 | Solid-state light source module and solid-state light source array |
| CN104094423A (en) * | 2012-01-31 | 2014-10-08 | 首尔半导体株式会社 | Light emitting diode package |
| US20130271987A1 (en) * | 2012-04-13 | 2013-10-17 | Cree, Inc. | Gas cooled led lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018194386A1 (en) | 2018-10-25 |
| CN110121769B (en) | 2024-04-26 |
| CN118315518A (en) | 2024-07-09 |
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