CN110113867B - Heat radiation structure and mobile terminal - Google Patents
Heat radiation structure and mobile terminal Download PDFInfo
- Publication number
- CN110113867B CN110113867B CN201910470903.9A CN201910470903A CN110113867B CN 110113867 B CN110113867 B CN 110113867B CN 201910470903 A CN201910470903 A CN 201910470903A CN 110113867 B CN110113867 B CN 110113867B
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- circuit board
- region
- pipeline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation structure and a mobile terminal, wherein the heat dissipation structure comprises a circuit board, a heating device and a heat dissipation part, an accommodating space and a heat dissipation pipeline are arranged in the circuit board, the heating device is arranged in the accommodating space, the heat dissipation pipeline is an annular pipeline, the heat dissipation part is arranged in the heat dissipation pipeline, and at least one part of the heat dissipation part is heat dissipation liquid. In the heat dissipation structure disclosed by the invention, the heating device is embedded on the circuit board, the heat dissipation pipeline is arranged in the circuit board, the heat dissipation part is arranged in the heat dissipation pipeline, and at least one part of the heat dissipation part is heat dissipation liquid, so that the heat dissipation part can flow in the annular heat dissipation pipeline, further takes away heat generated by the heating device during working, and the temperature of the heat dissipation structure is reduced. Because heating device and heat dissipation part all inlay and establish on the circuit board, consequently heating device and heat dissipation part can utilize the space that the circuit board occupy, and can not additionally occupy space for heat radiation structure's thickness reduces to this thickness that reduces mobile terminal.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a heat dissipation structure and a mobile terminal.
Background
With the continuous development of the mobile terminal industry, the ultra-thin technology has become one of the development directions of the mobile terminal. The ultra-thinness of the mobile terminal means that more components and parts are contained in a narrow space inside the mobile terminal, a large amount of heat can be generated during the operation of the components and parts, and if the heat cannot be dissipated in time, the mobile terminal is easy to damage during the operation.
A plurality of heat generating devices are generally integrated on a circuit board of the mobile terminal, and as the functions of the mobile terminal are upgraded, the power of the heat generating devices is increased, and the generated heat is higher and higher. In order to prevent the heating device from being damaged due to overhigh temperature, a heat radiating part can be added around the heating device, and the heat generated by the heating device can be led out through the heat radiating part, so that the heating device is prevented from being damaged.
However, the heat sink needs to be additionally added, and thus the heat sink occupies a certain space, resulting in an increase in thickness of the mobile terminal.
Disclosure of Invention
The invention discloses a heat dissipation structure and a mobile terminal, and aims to solve the problem that the thickness of the mobile terminal is large.
In order to solve the problems, the invention adopts the following technical scheme:
a heat dissipation structure comprises a circuit board, a heating device and a heat dissipation portion, wherein an accommodating space and a heat dissipation pipeline are arranged in the circuit board, the heating device is arranged in the accommodating space, the heat dissipation pipeline is an annular pipeline, the heat dissipation portion is arranged in the heat dissipation pipeline, and at least one part of the heat dissipation portion is heat dissipation liquid.
A mobile terminal comprises the heat dissipation structure.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the heat dissipation structure disclosed by the invention, the heating device is embedded on the circuit board, the heat dissipation pipeline is arranged in the circuit board, the heat dissipation part is arranged in the heat dissipation pipeline, and at least one part of the heat dissipation part is heat dissipation liquid, so that the heat dissipation part can flow in the annular heat dissipation pipeline, further takes away heat generated by the heating device during working, and the temperature of the heat dissipation structure is reduced. Because heating device and heat dissipation part all inlay and establish on the circuit board, consequently heating device and heat dissipation part can utilize the space that the circuit board occupy, and can not additionally occupy space for heat radiation structure's thickness reduces to this thickness that reduces mobile terminal.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of an internal structure of a heat dissipation structure according to an embodiment of the present invention;
FIG. 2 is a functional schematic diagram of the structure shown in FIG. 1;
fig. 3 to fig. 5 are schematic views of partial structures of a heat dissipation portion in the heat dissipation structure according to different embodiments;
fig. 6 is a schematic view of an internal structure of a heat dissipation structure according to another embodiment of the disclosure;
fig. 7 is a cross-sectional view taken along a-a of fig. 6.
Description of reference numerals:
100-circuit board, 110-circuit, 120-first pad, 130-second pad, 140-third pad, 150-liquid injection port, 160-glue cap, 170-first area, 180-second area, 191-main pipeline, 192-branch pipeline, 193-first part, 194-second part, 200-heating device, 210-first surface, 220-second surface, 300-heat dissipation part, 400-electromagnetic pump, 410-fourth pad, 420-fifth pad and 430-coil.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 and 2, an embodiment of the present invention discloses a heat dissipation structure, which may be applied in a mobile terminal, and specifically may include a circuit board 100, a heat generating device 200, and a heat dissipation portion 300. The circuit board 100 is provided with a circuit 110 therein, the circuit board 100 may be a multi-layer structure provided with a plurality of layers of circuits 110, each layer of circuits 110 may be connected together by punching, and the surface of the circuit board 100 may be provided with a first pad 120, and the first pad 120 may be connected with the circuit 110 by punching. Alternatively, the circuit board 100 may be a main board of the mobile terminal.
An accommodation space and a heat dissipation pipe are also provided in the circuit board 100. The heat generating device 200 is disposed in the accommodating space, the second pad 130 and the third pad 140 are disposed on the surface of the circuit board 100, and the second pad 130 and the third pad 140 are electrically connected to the heat generating device 200 through a punching manner, so as to electrically connect the heat generating device 200. In the embodiment shown in fig. 1, the heat generating device 200 is completely embedded inside the circuit board 100; in the embodiment shown in fig. 6, a part of the heat generating device 200 is completely embedded inside the circuit board 100, and another part is exposed with respect to the circuit board 100. The heat generating device 200 may be a chip or other device that generates heat during operation.
The heat dissipation pipe may be an annular pipe, the heat dissipation portion 300 is disposed in the heat dissipation pipe, and at least a portion of the heat dissipation portion 300 is a heat dissipation liquid, so that at least a portion of the heat dissipation portion 300 may circulate in the heat dissipation pipe. The heat dissipation part 300 can be liquid at normal temperature, and can be poured into the heat dissipation pipeline in a pouring mode, at this time, the circuit board 100 is provided with a liquid pouring port 150, the liquid pouring port 150 is communicated with the heat dissipation pipeline, a liquid manufacturing material (for example, liquid metal) of the heat dissipation part 300 can enter the heat dissipation pipeline through the liquid pouring port 150, and a rubber cap 160 can be arranged above the liquid pouring port 150, so that the sealing of the liquid pouring port 150 is realized.
In the heat dissipation structure disclosed in the embodiment of the present invention, the heating device 200 is embedded on the circuit board 100, the circuit board 100 is internally provided with a heat dissipation pipe, the heat dissipation pipe is internally provided with the heat dissipation portion 300, and at least a part of the heat dissipation portion 300 is a heat dissipation liquid, so that the heat dissipation portion 300 can flow in the annular heat dissipation pipe, and further take away heat generated by the heating device 200 during operation, thereby reducing the temperature of the heat dissipation structure. Because the heating device 200 and the heat dissipation part 300 are both embedded on the circuit board 100, the heating device 200 and the heat dissipation part 300 can utilize the space occupied by the circuit board 100 without additionally occupying the space, so that the thickness of the heat dissipation structure is reduced, and the thickness of the mobile terminal is reduced.
Optionally, the accommodating space may be separated from the heat dissipation pipe, so that the heat generating device 200 and the heat dissipation portion 300 may not be in direct contact, but in order to improve the heat dissipation effect, the accommodating space may be communicated with the heat dissipation pipe, so that the heat dissipation portion 300 may be in direct contact with the heat generating device 200, and then the heat generated by the heat generating device 200 may be more rapidly conducted out through the heat dissipation portion 300.
In an alternative embodiment, the circuit board 100 has a first region 170 and a second region 180, the first region 170 and the second region 180 are disposed adjacent to each other, the heat generating device 200 is disposed in the first region 170, and a portion of the heat dissipating part 300 is disposed in the first region 170 and another portion is disposed in the second region 180. In other words, the first region 170 is a region where the heat generating device 200 is disposed, and the second region 180 is not provided with the heat generating device 200, so the temperature of the first region 170 is relatively higher than that of the second region 180. The heat dissipation part 300 can flow between the first region 170 and the second region 180, so that heat of the first region 170 can be carried to the second region 180 with relatively low temperature by the heat dissipation part 300, the heat dissipation part 300 cools at the second region 180, so that heat carried by the heat dissipation part 300 is more rapidly dissipated at the second region 180, and when the heat dissipation part 300 flows to the first region 170 again, the temperature of the heat dissipation part 300 is lower, so that the temperature of the first region 170 can be better reduced. Therefore, the arrangement mode has better heat dissipation effect.
Further, as shown in fig. 3-4, the heat dissipation duct may specifically include a first portion 193 and a second portion 194, the first portion 193 being located in the first region 170 described above, and the second portion 194 being located in the second region 180 described above. In the thickness direction of the circuit board 100 (i.e., the X direction in fig. 1 and 6), the projection area of the first portion 193 is larger than the projection area of the second portion 194, so that more heat dissipation materials are distributed at the position of the heat generating device 200, thereby better achieving heat dissipation.
Alternatively, as shown in FIG. 3, different portions of the heat dissipation conduit may be sized differently in cross-section to form the first portion 193 and the second portion 194 as previously described. In another embodiment, as shown in fig. 4, the first portion 193 may be provided in a bent structure such that more heat dissipation material is distributed at the position of the heat generating device 200. For example, the first portion 193 may be configured in an S-shaped configuration or other circuitous configuration.
As shown in fig. 5, in order to enhance the heat dissipation effect, the heat dissipation pipe may include a main pipe 191 and a plurality of branch pipes 192, each of the plurality of branch pipes 192 communicates with the main pipe 191, and the plurality of branch pipes 192 are located in the first region 170. Because the number of the branch pipes 192 is large, the plurality of branch pipes 192 can simultaneously take away the heat of the first region 170, so that the heat dissipation effect of the heat dissipation portion 300 is better. The specific number of the branch pipes 192 may be determined according to the specific structure, size and the like of the heat generating device 200, and is not limited herein.
Of course, the specific structure of the heat dissipation portion 300 is not limited to the above-mentioned structures, and in the specific embodiment, the structure of the heat dissipation portion 300 may be flexibly set according to the specific structure of the heat generating device 200, so as to achieve the purpose of quickly taking away the heat generated by the heat generating device 200.
In an optional embodiment, the heat dissipation structure may further include an electromagnetic pump 400, where the electromagnetic pump 400 specifically includes a fourth pad 410, a fifth pad 420, and a coil 430, where the fourth pad 410 and the fifth pad 420 are disposed on the surface of the circuit board 100, and both of the pads may be connected to two ends of the coil 430 in a punching manner, so as to achieve the purpose of connecting the coil 430 with power. The coil 430 is disposed in the circuit board 100, and at least a portion of the heat sink 300 is disposed in the coil 430. Alternatively, the coil 430 may be implemented by providing a spiral line structure in the circuit board 100. When current is applied to the coil 430, a magnetic field is generated around the coil 430, and the heat dissipation portion 300 is subjected to a force applied by the magnetic field, so as to flow in the heat dissipation pipe more rapidly. Therefore, the electromagnetic pump 400 can increase the flow speed of the heat dissipation part 300 in the heat dissipation pipeline, so as to accelerate heat exchange, and the heat dissipation effect of the heat dissipation part 300 is better.
Specifically, the heat generating device 200 has a first face 210 and a second face 220 disposed facing away from each other in the thickness direction of the circuit board 100, and the heat dissipation portion 300 may extend from the first face 210 to the second face 220, the first face 210 and the second face 220 having an area larger than that of the other faces of the heat generating device 200. That is, the heat dissipation part 300 forms a circulation loop in a plane perpendicular to the first surface 210 and the second surface 220, so that the heat dissipation part 300 can be arranged corresponding to the first surface 210 and the second surface 220 of the heat generating device 200 and the side surface of the heat generating device 200, and therefore the heat dissipation part 300 can simultaneously conduct heat of the first surface 210, the second surface 220 and the side surface of the heat generating device 200, so that the heat generating device 200 is not easily damaged due to local heat accumulation. Therefore, with this structure, the heat generating device 200 is less likely to be damaged by overheating.
In another embodiment, when the heat generating device 200 has the first face 210 and the second face 220 disposed opposite to each other in the thickness direction of the circuit board 100, the first face 210 is provided with at least one heat sink 300, and/or the second face 220 is provided with at least one heat sink 300. That is, at least one heat sink member 300 may be provided only on the first surface 210, or at least one heat sink member 300 may be provided only on the second surface 220, or at least one heat sink member 300 may be provided on the first surface 210 while at least one heat sink member 300 is provided on the second surface 220. With such a structure, the single heat sink 300 forms a circulation loop in a plane parallel to the first surface 210 and the second surface 220, and the single heat sink 300 can more quickly dissipate heat at the local part of the heat generating device 200, so that the temperature at the local part of the heat generating device 200 is more quickly reduced. This arrangement is particularly suitable for a case where a part of the surface of the heat generating device 200 is exposed with respect to the circuit board 100 (specifically, refer to the structures shown in fig. 6 and 7), and thus the arrangement can simplify the structure of the heat sink member 300.
Alternatively, the heat dissipation portion 300 may have only conductivity, or may have both conductivity and magnetism. When the latter structure is adopted, the heat dissipation portion 300 itself is opened to play the role of electromagnetic shielding, and the heat dissipation structure does not need to be provided with an electromagnetic shielding structure alone, so that the structure of the heat dissipation structure is simpler, and the space occupied by the heat dissipation structure is smaller. Alternatively, the liquid metal from which the heat sink member 300 is made may be an alloy of metals such as gallium, indium, and tin.
Based on the heat dissipation structure described in any of the above embodiments, an embodiment of the present invention further discloses a mobile terminal, which includes the heat dissipation structure described in any of the above embodiments.
The mobile terminal disclosed by the embodiment of the invention can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the mobile terminal may also be other devices, and the embodiment of the present invention is not limited thereto.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. A heat dissipation structure is characterized by comprising a circuit board (100), a heating device (200) and a heat dissipation part (300), wherein an accommodating space and a heat dissipation pipeline are arranged in the circuit board (100), the heating device (200) is arranged in the accommodating space, the heat dissipation pipeline is an annular pipeline, the heat dissipation part (300) is arranged in the heat dissipation pipeline, and at least one part of the heat dissipation part (300) is heat dissipation liquid;
the heat generating device (200) has a first face (210) and a second face (220) that are arranged facing away from each other in a thickness direction of the circuit board (100), wherein the first face (210) is provided with at least one of the heat dissipating sections (300), and the second face (220) is provided with at least one of the heat dissipating sections (300);
the heat dissipation part (300) has conductivity and magnetism, and the heat dissipation part (300) forms an electromagnetic shielding structure.
2. The heat dissipation structure according to claim 1, wherein the accommodation space communicates with the heat dissipation pipe.
3. The heat dissipation structure according to claim 1, wherein the circuit board (100) has a first region (170) and a second region (180), the first region (170) and the second region (180) are adjacently disposed, the heat generating device (200) is disposed in the first region (170), and a part of the heat dissipation portion (300) is disposed in the first region (170) and another part is disposed in the second region (180).
4. The heat dissipation structure according to claim 3, wherein the heat dissipation duct includes a first portion (193) and a second portion (194), the first portion (193) is located in the first region (170), the second portion (194) is located in the second region (180), and a projected area of the first portion (193) is larger than a projected area of the second portion (194) in a thickness direction of the circuit board (100).
5. The heat dissipation structure of claim 4, wherein the first portion (193) is a bent structure.
6. The heat dissipation structure according to claim 3, wherein the heat dissipation duct includes a trunk duct (191) and a plurality of branch ducts (192), each of the plurality of branch ducts (192) communicating with the trunk duct (191), the plurality of branch ducts (192) being located at the first region (170).
7. The heat dissipation structure of claim 1, further comprising an electromagnetic pump (400), the electromagnetic pump (400) comprising a coil (430), the coil (430) being disposed within the circuit board (100), at least a portion of the heat dissipation portion (300) being located within the coil (430).
8. The heat dissipation structure according to claim 1, wherein the heat generating device (200) has a first face (210) and a second face (220) that are disposed facing away from each other in a thickness direction of the circuit board (100), and the heat dissipation portion (300) extends from the first face (210) to the second face (220).
9. A mobile terminal characterized by comprising the heat dissipation structure of any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910470903.9A CN110113867B (en) | 2019-05-31 | 2019-05-31 | Heat radiation structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910470903.9A CN110113867B (en) | 2019-05-31 | 2019-05-31 | Heat radiation structure and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110113867A CN110113867A (en) | 2019-08-09 |
| CN110113867B true CN110113867B (en) | 2021-03-02 |
Family
ID=67493390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910470903.9A Active CN110113867B (en) | 2019-05-31 | 2019-05-31 | Heat radiation structure and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110113867B (en) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6989991B2 (en) * | 2004-05-18 | 2006-01-24 | Raytheon Company | Thermal management system and method for electronic equipment mounted on coldplates |
| CN100557798C (en) * | 2004-12-13 | 2009-11-04 | 大金工业株式会社 | Power model and manufacture method thereof and air conditioner |
| CN101594739A (en) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | Device embedded circuit board heat abstractor and processing method |
| US9894802B2 (en) * | 2014-05-29 | 2018-02-13 | Ge-Hitachi Nuclear Energy Americas Llc | Passive system of powering and cooling with liquid metal and method thereof |
| CN105491785A (en) * | 2014-10-10 | 2016-04-13 | 先丰通讯股份有限公司 | Phase-change heat conduction circuit board module and circuit board structure thereof |
| CN105188260B (en) * | 2015-11-02 | 2018-11-06 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embeds runner liquid cooling heat-exchanger rig |
| EP3182045B1 (en) * | 2015-12-14 | 2023-01-25 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with embedded heat pipe and method of manufacturing |
| US10104805B2 (en) * | 2016-05-09 | 2018-10-16 | The United States Of America As Represented By The Secretary Of The Army | Self cooling stretchable electrical circuit having a conduit forming an electrical component and containing electrically conductive liquid |
| KR102617349B1 (en) * | 2016-12-02 | 2023-12-26 | 삼성전자주식회사 | Printed circuit board, and solid state drive apparatus having the same |
| CN206525073U (en) * | 2017-01-22 | 2017-09-26 | 北京态金科技有限公司 | Liquid metal heat radiation device |
| DE102017210237A1 (en) * | 2017-06-20 | 2018-12-20 | Siemens Aktiengesellschaft | Circuit carrier for an electronic circuit and method for its production |
| CN207491291U (en) * | 2017-10-10 | 2018-06-12 | 吉安市博智实业有限公司 | A kind of folder foil base circuit board with self heat dissipation function |
| CN108184305B (en) * | 2017-12-28 | 2020-04-03 | 安徽宏实光机电高科有限公司 | Liquid cooling heat exchange device with embedded runner of printed circuit board |
| CN208338009U (en) * | 2018-07-09 | 2019-01-04 | 四川超声印制板有限公司 | A kind of embedded cooling device of printed board |
-
2019
- 2019-05-31 CN CN201910470903.9A patent/CN110113867B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110113867A (en) | 2019-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5901040A (en) | Heat sink and Faraday Cage assembly for a semiconductor module and a power converter | |
| KR100895005B1 (en) | Liquid metal thermal interface for an integrated circuit device | |
| US20060133043A1 (en) | Heat spreader with multiple stacked printed circuit boards | |
| US20130301221A1 (en) | Thermal management system and method between heat generating chip and housing in electronic apparatus | |
| CN102157474A (en) | Wafer level stack die package | |
| US20190206839A1 (en) | Electronic device package | |
| US6639798B1 (en) | Automotive electronics heat exchanger | |
| CN112954949B (en) | Network equipment power supply and heat dissipation system for network equipment power supply | |
| JP2017511646A (en) | mobile computer | |
| CN112566445A (en) | Cooling device for electronic hardware of edge computing and heterogeneous computing | |
| JP2014528172A (en) | Method and apparatus for connecting chips embedded in a printed circuit board | |
| CN110113867B (en) | Heat radiation structure and mobile terminal | |
| KR20090083709A (en) | Printed circuit board, semiconductor package, card and system | |
| CN204425880U (en) | Portable electronic devices and detachable auxiliary heat dissipation module thereof | |
| US20160095249A1 (en) | Printed circuit board and electronic component package having the same | |
| US20060021747A1 (en) | Liquid cooling structure for electronic device | |
| US10950522B2 (en) | Electronic device | |
| CN201174855Y (en) | Radiator assembly | |
| JP2016054175A (en) | Semiconductor device | |
| US9402331B2 (en) | Integrated circuit chip comprising electronic device and electronic system | |
| JP2010514197A (en) | Semiconductor integrated circuit having heat radiation pattern | |
| CN209592015U (en) | Board structure | |
| EP1934670B1 (en) | Magneto-hydrodynamic heat sink | |
| CN107710883B (en) | Printed circuit board heat dissipation system using high-conductivity heat dissipation pad | |
| CN108630637A (en) | Heat dissipation member and chip package with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |