CN110091250A - PCD bistrique and its processing method - Google Patents
PCD bistrique and its processing method Download PDFInfo
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- CN110091250A CN110091250A CN201910363486.8A CN201910363486A CN110091250A CN 110091250 A CN110091250 A CN 110091250A CN 201910363486 A CN201910363486 A CN 201910363486A CN 110091250 A CN110091250 A CN 110091250A
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- 238000003672 processing method Methods 0.000 title abstract description 13
- 238000003754 machining Methods 0.000 claims abstract description 81
- 239000002131 composite material Substances 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000003466 welding Methods 0.000 claims abstract description 32
- 230000008569 process Effects 0.000 claims abstract description 22
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- 238000000227 grinding Methods 0.000 claims description 182
- 239000010432 diamond Substances 0.000 claims description 58
- 229910003460 diamond Inorganic materials 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 34
- 239000000843 powder Substances 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 238000005498 polishing Methods 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 15
- 229910017052 cobalt Inorganic materials 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 6
- 239000000839 emulsion Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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Abstract
The present invention is suitable for PCD tooling cost field, discloses the processing method and PCD bistrique of PCD bistrique, wherein the processing method of PCD bistrique includes the following steps: preparation process, prepares PCD composite host blank and bistrique matrix；PCD composite host blank is welded in one end of bistrique matrix by welding step, obtains PCD bistrique blank；Laser machining process, laser roughing and laser finishing are successively carried out to PCD bistrique blank, PCD compound bistrique main body is formed to process PCD body blank, laser power used by laser roughing is greater than laser power used by laser finishes, and the rough machined machining allowance of laser is greater than the machining allowance of laser finishing.The present invention processes PCD bistrique using laser processing mode, the processing efficiency and dimensional accuracy of PCD bistrique is greatly improved, and the surface quality of PCD bistrique is good.
Description
Technical Field
The invention relates to the technical field of PCD cutter processing, in particular to a processing method of a PCD grinding head and the PCD grinding head manufactured by the processing method.
Background
The traditional diamond grinding head adopts hard alloy or steel as a substrate, then diamonds are electroplated, the grade is distinguished according to the granularity of the diamonds, the finer the granularity is, the better the grinding head processing effect is, but the abrasive resistance of the grinding head is worse, the service life is short, and for the grinding head with a special shape, the coating thickness is difficult to control uniformly, so the size precision and the profile precision of the grinding head are difficult to ensure.
In order to solve the above problems, the prior art proposes to replace the traditional diamond grinding head with a PCD grinding head. The PCD grinding head is a grinding head made of PCD (polycrystalline diamond) materials, and the processing difficulty is very high because the hardness of the PCD materials is very high (the hardness of the polycrystalline diamond is as high as 10000HV, is the hardest material in artificial substances in the world at present and is much higher than the hardness of hard alloy and engineering ceramics). The existing processing mode adopts two modes of grinding or linear cutting, however, the PCD grinding head processed by adopting the two traditional processing modes has the following defects in specific application, and the defects are embodied as follows:
1) in the scheme of processing the PCD grinding head by adopting the grinding mode, the PCD grinding head is irregular in shape, so that a special diamond grinding wheel needs to be customized for grinding, the processing efficiency is very low, and the processing cost is very high. In addition, in the grinding process, due to the influence of abrasion of the grinding wheel, the machining size precision of the PCD grinding head is difficult to guarantee. And the stress is large in the grinding process, microcracks can appear in the grinding head, and therefore the service life of the PCD grinding head can be influenced.
2) In the scheme of processing the PCD grinding head by adopting the linear cutting mode, the PCD grinding head is irregular in shape, and can cause interference during linear cutting, so that the PCD grinding head cannot be processed, linear cutting can be used in the grinding head processing of a simple shape, but the processed grinding head is not high in shape and size precision, the surface quality of the processed grinding head is difficult to meet the requirement, and the surface quality of a processed material cannot be guaranteed when the grinding head is used.
Along with the higher and higher requirements on the surface quality of the processed material, the requirements on the PCD grinding head are also more and more strict, and the reasonable processing method is selected, so that not only can good production benefit be obtained, but also a client can obtain an ideal grinding head and qualified quality of a processed product, and further a client company can obtain good benefit, and the advantages of the PCD grinding head in the processing of high-quality products are fully exerted.
Therefore, the PCD grinding head can not meet the use requirement by the existing process, and a new processing technology is urgently needed for processing the PCD grinding head so as to improve the dimensional precision and the surface quality of the PCD grinding head.
Disclosure of Invention
The invention aims to provide a PCD grinding head processing method, which aims to solve the technical problems of low dimensional accuracy and low processing efficiency of a PCD grinding head processed by the existing PCD grinding head processing method.
In order to achieve the purpose, the invention provides the following scheme: the machining method of the PCD grinding head comprises the following steps:
preparing a PCD composite body blank and a grinding head substrate;
welding, namely welding the PCD composite main body blank to one end of the grinding head substrate to obtain a PCD grinding head blank;
and laser processing, namely performing laser rough machining and laser fine machining on the PCD grinding head blank in sequence to process the PCD main body blank into a PCD composite grinding head main body, wherein the laser power adopted by the laser rough machining is greater than that adopted by the laser fine machining, and the processing allowance of the laser rough machining is greater than that of the laser fine machining.
Optionally, the machining allowance of the laser finish machining is 0.01 mm-0.03 mm; and/or the presence of a gas in the atmosphere,
the processing moving speed of the laser rough processing is the same as that of the laser fine processing, and the processing moving speed of the laser rough processing and that of the laser fine processing are both 50 mm/min-200 mm/min.
Optionally, the laser rough machining is performed under conditions including: the power of the laser is 24-28.5W, the emission speed of the laser is 2000-3000 mm/s, the emission frequency of the laser is 60-80 KHz, and the light spot delay time of the laser is 100-300 mus;
the implementation conditions of the laser finishing comprise: the power of the laser is 9W-12W, the emitting speed of the laser is 3000 mm/s-4000 mm/s, the emitting frequency of the laser is 100 KHz-120 KHz, and the light spot delay time of the laser is 100 mus-300 mus.
Optionally, the laser finishing is performed under conditions including: the power of the laser is 9W, the emission speed of the laser is 3000mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 100 mus, the processing moving speed is 100mm/min, and the processing allowance is 0.015 mm; or,
the implementation conditions of the laser finishing comprise: the power of the laser is 10.5W, the emission speed of the laser is 3000mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 100 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.015 mm; or,
the implementation conditions of the laser finishing comprise: the power of the laser is 10.5W, the emission speed of the laser is 3500mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 150 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.02 mm; or,
the implementation conditions of the laser finishing comprise: the power of the laser is 12W, the emission speed of the laser is 4000mm/s, the frequency of the laser is 120KHz, the light spot delay time of the laser is 200 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.02 mm.
Optionally, the preparation of the PCD blank in the preparing step comprises: selecting a PCD composite substrate, and cutting the PCD composite substrate into a PCD composite body blank by utilizing linear cutting.
Optionally, the PCD composite substrate is a cylindrical component with a diameter of 13mm ± 2mm and a height of 8mm ± 2mm, and the PCD composite body blank is a cylindrical component with a diameter of 3mm ± 1mm and a height of 8mm ± 2 mm; and/or the presence of a gas in the atmosphere,
the PCD composite substrate comprises a hard alloy base and a polycrystalline diamond composite layer, wherein one end of the hard alloy base is used for being welded with a grinding head base body, the polycrystalline diamond composite layer is arranged at the other end of the hard alloy base and is formed by adding metal cobalt into polycrystalline diamond powder and sintering, the height of the polycrystalline diamond composite layer is 3-4 mm, the thermal stability of the polycrystalline diamond composite layer is larger than or equal to 750 ℃, in addition, in the polycrystalline diamond composite layer, the average grain size of the polycrystalline diamond powder is 2 mu m, and the volume content of the polycrystalline diamond powder is 92%.
Optionally, the welding step comprises: welding the PCD composite main body blank to one end of the grinding head substrate in a vacuum welding mode; and/or the presence of a gas in the atmosphere,
the method also comprises a clamping step between the welding step and the laser rough machining step: and (2) putting the welded PCD grinding head blank into a cold pressing collet chuck, putting the cold pressing collet chuck with the PCD grinding head blank into a cold pressing handle, and pressing the PCD grinding head blank on a cold press.
Optionally, the machining method of the PCD grinding head further comprises a polishing step after the laser machining step: and polishing the PCD grinding head after the laser rough machining is finished.
Optionally, the polishing step is implemented by: and polishing the PCD grinding head after the laser rough machining is finished by using diamond emulsion with the granularity of 0.5 mu m.
The PCD grinding head is manufactured by the processing method of the PCD grinding head.
According to the PCD grinding head and the processing method thereof provided by the invention, the laser processing PCD grinding head is used for replacing the existing linear cutting mode and grinding processing mode, the processing speed of the PCD grinding head is improved, the production period of the PCD grinding head is shortened, the processing cost of the PCD grinding head is reduced, and good surface quality and dimensional accuracy of the PCD grinding head are obtained. In addition, in the laser processing process, the laser rough processing is carried out by adopting the laser with larger power to process larger processing allowance, and then the laser fine processing is carried out by adopting the laser with smaller power to process smaller processing allowance, so that the processing efficiency is favorably improved, the surface quality and the size precision of the PCD grinding head finally obtained by processing are favorably improved, and the processing comprehensive effect is better. Specifically, the surface roughness of the PCD grinding head machined by the laser is close to or even better than that of the PCD grinding head machined by the existing grinding, and the problems of abrasion of a grinding wheel and large stress in the grinding process do not exist in the laser machining process, so that compared with the PCD grinding head machined by the existing grinding, the machining size precision of the PCD grinding head machined by the laser is greatly improved, microcracks do not appear in the PCD grinding head, and the service life of the PCD grinding head is effectively prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Figure 1 is a schematic structural view of a PCD grinding head provided by an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1, a PCD grinding head 100 according to an embodiment of the present invention includes a grinding head substrate 120 and a PCD composite grinding head body 110 provided at one end of the grinding head substrate 120, wherein the PCD grinding head 100 is manufactured by a method of processing a PCD grinding head 100 described below. The PCD grinding head 100 provided by the embodiment of the invention is formed by laser processing, has high processing efficiency, low processing cost, small surface roughness, high dimensional precision, high profile degree and long service life, can meet the requirements of customers on the high-quality PCD grinding head 100, and is favorable for fully exerting the advantages of the PCD grinding head 100 in the processing of high-quality products.
Preferably, the PCD composite grinding head body 110 includes a hard alloy base 111 having one end welded to the grinding head base 120, and a polycrystalline diamond composite layer 112 disposed at the other end of the hard alloy base 111, the polycrystalline diamond composite layer 112 is formed by adding metallic cobalt to polycrystalline diamond powder and sintering the polycrystalline diamond composite layer under the condition of ultrahigh pressure and high temperature, the height of the polycrystalline diamond composite layer 112 is 3-4 mm, the thermal stability of the polycrystalline diamond composite layer 112 is greater than or equal to 750 ℃, in the polycrystalline diamond composite layer 112, the average particle size of the polycrystalline diamond powder is 2 μm, and the volume content of the polycrystalline diamond powder is 92%. The volume content of the polycrystalline diamond powder specifically refers to a volume ratio of the polycrystalline diamond powder in the material used to prepare the polycrystalline diamond composite layer 112. The average grain size of the polycrystalline diamond powder specifically refers to the average grain size of the polycrystalline diamond powder for preparing the polycrystalline diamond composite layer 112, and in this embodiment, the average grain size of the polycrystalline diamond powder is designed to be relatively small, so that the surface roughness of a product processed by the polycrystalline diamond composite layer 112 is relatively small, and the improvement of the surface precision of the product processed by the PCD grinding head 100 is facilitated. The cemented carbide base 111 is made of cemented carbide, which has good welding properties. The polycrystalline diamond composite layer 112 is formed by adding a certain amount of metal cobalt into polycrystalline diamond (PCD) micro powder and sintering the metal cobalt and the hard alloy base 111 under the condition of ultrahigh pressure and high temperature, and has extremely high hardness.
The processing method of the PCD grinding head 100 provided by the embodiment of the invention comprises the following steps:
a preparation step of preparing a PCD composite body blank and a grinding head substrate 120;
welding, namely welding the PCD composite main body blank to one end of the grinding head substrate 120 to obtain a PCD grinding head blank;
and a laser processing step of sequentially performing laser rough processing and laser finish processing on the PCD grinding head blank to process the PCD main body blank into the PCD composite grinding head main body 110, wherein the laser power adopted by the laser rough processing is greater than that adopted by the laser finish processing, and the processing allowance of the laser rough processing is greater than that of the laser finish processing.
According to the processing method of the PCD grinding head 100 provided by the embodiment of the invention, the laser is used for processing the PCD grinding head 100, so that the processing rate of the PCD grinding head 100 is improved, the production period of the PCD grinding head 100 is shortened, the processing cost of the PCD grinding head 100 is reduced, and good surface quality and dimensional accuracy of the PCD grinding head 100 are obtained. In addition, in the laser processing process, the laser with high power is firstly adopted for rough processing to process larger processing allowance, and then the laser with low power is adopted for fine processing to process smaller processing allowance, so that the processing efficiency is favorably improved, the surface quality and the dimensional accuracy of the finally processed PCD grinding head 100 are favorably improved, and the processing comprehensive effect is good.
Preferably, the preparation of the PCD blank in the preparing step comprises: and selecting a PCD composite substrate, and cutting the PCD composite substrate by utilizing linear cutting to form a PCD composite body blank. Here, the PCD composite substrate is cut by adopting a wire-electrode cutting slow-moving wire to form a PCD composite main body blank, and the processing efficiency is high.
Preferably, the PCD composite substrate is a cylindrical component with a diameter of 13mm ± 2mm and a height of 8mm ± 2mm, and the PCD composite body blank is a cylindrical component with a diameter of 3mm ± 1mm and a height of 8mm ± 2 mm. And cylindrical parts are adopted, so that clamping and processing track design are facilitated. As a preferred embodiment of this example, the PCD composite substrate had a diameter of 13mm and a height of 8mm, and the PCD composite body blank had a diameter of 3mm and a height of 8 mm.
Preferably, the PCD composite substrate comprises a hard alloy base and a polycrystalline diamond composite layer, one end of the hard alloy base is used for being welded with the grinding head base body 120, the polycrystalline diamond composite layer is arranged at the other end of the hard alloy base and is formed by adding metal cobalt into polycrystalline diamond powder and sintering, the height of the polycrystalline diamond composite layer is 3-4 mm, the thermal stability of the polycrystalline diamond composite layer is larger than or equal to 750 ℃, in addition, in the polycrystalline diamond composite layer, the average grain size of the polycrystalline diamond powder is 2 microns, and the volume content of the polycrystalline diamond powder is 92%. The PCD composite substrate is formed by adding a certain amount of metal cobalt into polycrystalline diamond (PCD) micro powder and sintering the metal cobalt and a hard alloy base under the condition of ultrahigh pressure and high temperature, and on one hand, the PCD composite substrate has good welding performance by utilizing the good welding performance of the hard alloy base so as to be conveniently welded with the grinding head base body 120 and the welding does not influence the polycrystalline diamond composite layer; and on the other hand, the polycrystalline diamond composite layer can have extremely high hardness.
Preferably, the welding step comprises: and welding the PCD composite main body blank to one end of the grinding head substrate 120 in a vacuum welding mode. Vacuum welding is welding under vacuum condition. Here, the PCD composite main body blank is welded on the grinding head substrate 120 in a vacuum welding manner, so that the oxidation phenomenon in the welding process can be reduced, and the void ratio in the welding process can be reduced, thereby being beneficial to improving the welding quality of the PCD composite main body blank and the grinding head substrate 120, and effectively improving the stability and reliability of the welding of the PCD composite main body blank and the grinding head substrate 120.
Preferably, a clamping step is further included between the welding step and the laser rough machining step: and (3) putting the welded PCD grinding head blank into a cold pressing collet chuck, putting the cold pressing collet chuck with the PCD grinding head blank into a cold pressing knife handle, and pressing the PCD grinding head blank on a cold press. Here, adopt PG handle of a knife (handle of a knife) series frock clamping PCD bistrique blank, its clamping precision is high, has effectively got rid of the phenomenon that clamping error influences PCD bistrique 100 processing, does benefit to the whole precision of guaranteeing PCD bistrique 100 behind the laser beam machining and can reach the requirement.
Preferably, after clamping the PCD grinding head blank on the laser processing device, the laser processing is performed as follows: firstly, detecting the position distance of a PCD grinding head blank by using a laser detector; drawing the shape of a laser spot according to the design shape and size of the PCD grinding head 100; setting laser processing parameters, and according to the set laser processing parameters, processing the surface of the PCD grinding head 100 by adopting laser, and directly removing redundant materials of the PCD composite main body blank to obtain the PCD grinding head 100; the surface quality and the dimensional accuracy of the PCD grinding head 100 were examined. The surface quality of the PCD grinding head 100 may be adjusted by adjusting laser processing parameters and spot forms during the laser processing process to meet design requirements for different morphologies.
Preferably, the machining moving speed of the laser rough machining and the machining moving speed of the laser finish machining are the same. The processing moving speed of the laser processing specifically refers to the relative moving speed of a laser emitter and a processed workpiece (PCD grinding head blank) along a processing track in the laser processing process. Here, setting the machining moving speed of the laser rough machining and the machining moving speed of the laser finish machining to be the same can be advantageous to simplify the control system of the laser machining. In the embodiment, in the laser processing process, the laser emitter is fixed, and the PCD grinding head blank moves relative to the laser emitter along the processing track; of course, in specific applications, as an alternative embodiment, during the laser processing, the PCD grinding head blank may also be configured to be stationary, and the laser emitter may be configured to move along the processing trajectory relative to the PCD grinding head blank.
More preferably, the machining moving speed of the laser rough machining and the machining moving speed of the laser finish machining are both 50mm/min to 200 mm/min. The processing moving speed of laser rough processing and the processing moving speed of laser fine processing are set to be 50 mm/min-200 mm/min, so that the processing efficiency of laser processing can be ensured, the surface quality of processing can be ensured, and the processing comprehensive performance is better. As a preferred embodiment, the machining moving speed of the laser rough machining and the machining moving speed of the laser fine machining may be set to 50mm/min, 100mm/min, 150mm/min, 200mm/min, etc.
Preferably, the machining allowance of the laser fine machining is 0.01 mm-0.03 mm. Here, the laser-finished machining allowance is set to be 0.01mm to 0.03mm, so that the surface roughness of the PCD grinding stones 100 obtained by machining can be made small.
Preferably, the laser rough machining is performed under conditions including: the power of the laser is 24-28.5W, the emission speed of the laser is 2000-3000 mm/s, the emission frequency of the laser is 60-80 KHz, and the light spot delay time of the laser is 100-300 mus; the implementation conditions of the laser finishing comprise: the power of the laser is 9W-12W, the emission speed of the laser is 3000 mm/s-4000 mm/s, the emission frequency of the laser is 100 KHz-120 KHz, the light spot delay time of the laser is 100 mus-300 mus, and the machining allowance of the laser fine machining is 0.01 mm-0.03 mm. The laser power specifically refers to the output power of the laser emitter, and the laser spot delay time specifically refers to the formation time of the laser spot. Here, through carrying out optimal design to the laser parameter in laser rough machining and the laser finish machining process, can make laser beam machining have great machining efficiency, and the PCD bistrique 100 surface roughness that processes out can reach Ra and is less than or equal to 0.1, and size precision is steerable within 0.005mm, and the profile tolerance is steerable within 0.003mm, and processing surface quality, size precision and profile tolerance have all been improved greatly. In a specific application, suitable laser parameters can be selected within the above laser parameter ranges for processing according to various inherent properties of the PCD grinding head 100 material.
Preferably, the machining method of the PCD grinding head 100 further includes, after the laser machining step, a polishing step: polishing the PCD grinding head 100 after the laser rough machining is completed. The provision of the polishing step may be advantageous to further improve the surface smoothness of the PCD grinding stone 100.
Preferably, the polishing step is carried out by: and polishing the PCD grinding head 100 after the laser rough machining is finished by using diamond emulsion with the granularity of 0.5 mu m. Here, polishing the PCD grinding head 100 with the diamond emulsion with the granularity of 0.5 μm can effectively clean up the scraps on the surface of the PCD grinding head 100 after laser processing, so as to achieve the purpose of improving the surface smoothness of the PCD grinding head 100, and no tool mark is added on the surface of the PCD grinding head 100 after polishing.
Preferably, a detection step is further included between the laser processing step and the polishing step: the surface roughness of the PCD grinding head 100 is checked with a first detection instrument; and detecting the size precision and the profile precision of the grinding head by using a second detection instrument, and polishing after the surface roughness and the size precision are qualified. As a preferred embodiment of the embodiment, in the detection process, the surface roughness of the PCD grinding head 100 is detected by using a Japanese import Ginz instrument, the dimensional precision and the contour precision of the grinding head are detected by using a German Zoller instrument, and the detection data are accurate and reliable.
As a preferred embodiment of the present invention, the PCD grinding head 100 shown in fig. 1 is processed as follows:
cutting a PCD composite base material with the diameter of 013mm and the height of 8mm by using a linear cutting slow-moving wire to obtain a cylindrical PCD composite main body blank with the diameter of 03mm and the height of 8 mm; and then welding the PCD composite body blank to the hard alloy grinding head substrate 120 by using a vacuum welding method.
Putting the welded PCD grinding head blank into a cold pressing collet chuck, putting the welded PCD grinding head blank into a cold pressing knife handle together, and pressing the welded PCD grinding head blank on a cold press; detecting the position size of a PCD grinding head blank by using a probe on laser processing equipment, importing data obtained by detection into a laser processing system, and adjusting the spot shape of laser according to the shape of the PCD grinding head 100; then setting laser parameters according to the processing requirements, wherein the laser parameters of laser rough processing are set as follows: the laser power is controlled to be 24W-28.5W, the laser speed is controlled to be 2000 mm/s-3000 mm/s, the laser frequency is controlled to be 60 KHz-80 KHz, and the light spot delay is 100 mus-300 mus; in addition, in the programming system, the processing speed is set to be 50 mm/min-200 mm/min, after the program parameters are set, the laser system is started, and laser equipment can carry out laser rough processing according to the setting.
In order to obtain higher surface quality, laser rough machining is completed, and then laser fine machining is added, and the parameters of the laser are readjusted to be as follows: the power of the laser is 9W, the emission speed of the laser is 3000mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 100 mus, the processing moving speed is 100mm/min, and the processing allowance is 0.015 mm; or the power of the laser is 10.5W, the emission speed of the laser is 3000mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 100 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.015 mm; or the power of the laser is 10.5W, the emission speed of the laser is 3500mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 150 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.02 mm; or the power of the laser is 12W, the emission speed of the laser is 4000mm/s, the frequency of the laser is 120KHz, the light spot delay time of the laser is 200 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.02 mm.
After the laser finish machining is completed, the PCD grinding head 100 is taken down to perform surface roughness, dimensional accuracy and contour accuracy detection.
After the surface roughness, the dimensional accuracy and the profile tolerance are all detected to be qualified, the PCD grinding head 100 is polished: the PCD grinding head 100 was polished with 0.5 μm diamond emulsion.
The results of comparing the PCD grinding head 100 produced by the preferred embodiment with the existing PCD grinding head produced by grinding are shown in the following table:
it can be seen from the comparison data in the table above that, the laser processing mode is adopted to replace the linear cutting mode and the grinding processing mode in the prior art, the laser processing is applicable to the processing of complex shapes, the surface roughness of the PCD grinding head 100 obtained by the laser processing is consistent with the grinding processing, and the laser processing method greatly improves the size precision, the profile tolerance and the processing efficiency of the PCD grinding head 100, so that a client can obtain the ideal PCD grinding head 100 and the qualified quality of the processed product, a client company can obtain good benefits, and the advantages of the PCD grinding head 100 in the processing of high-quality products are fully exerted.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
- The machining method of the PCD grinding head is characterized by comprising the following steps:preparing a PCD composite body blank and a grinding head substrate;welding, namely welding the PCD composite main body blank to one end of the grinding head substrate to obtain a PCD grinding head blank;and laser processing, namely performing laser rough machining and laser fine machining on the PCD grinding head blank in sequence to process the PCD main body blank into a PCD composite grinding head main body, wherein the laser power adopted by the laser rough machining is greater than that adopted by the laser fine machining, and the processing allowance of the laser rough machining is greater than that of the laser fine machining.
- 2. The method for machining a PCD grinding head according to claim 1, wherein the machining allowance of the laser finish machining is 0.01mm to 0.03 mm; and/or the presence of a gas in the atmosphere,the processing moving speed of the laser rough processing is the same as that of the laser fine processing, and the processing moving speed of the laser rough processing and that of the laser fine processing are both 50 mm/min-200 mm/min.
- 3. The method of machining a PCD grinding head according to claim 2, wherein the laser rough machining is performed under conditions including: the power of the laser is 24-28.5W, the emission speed of the laser is 2000-3000 mm/s, the emission frequency of the laser is 60-80 KHz, and the light spot delay time of the laser is 100-300 mus;the implementation conditions of the laser finishing comprise: the power of the laser is 9W-12W, the emitting speed of the laser is 3000 mm/s-4000 mm/s, the emitting frequency of the laser is 100 KHz-120 KHz, and the light spot delay time of the laser is 100 mus-300 mus.
- 4. A method of machining a PCD grinding head according to claim 3, wherein the conditions under which the laser finishing is performed include: the power of the laser is 9W, the emission speed of the laser is 3000mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 100 mus, the processing moving speed is 100mm/min, and the processing allowance is 0.015 mm; or,the implementation conditions of the laser finishing comprise: the power of the laser is 10.5W, the emission speed of the laser is 3000mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 100 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.015 mm; or,the implementation conditions of the laser finishing comprise: the power of the laser is 10.5W, the emission speed of the laser is 3500mm/s, the frequency of the laser is 100KHz, the light spot delay time of the laser is 150 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.02 mm; or,the implementation conditions of the laser finishing comprise: the power of the laser is 12W, the emission speed of the laser is 4000mm/s, the frequency of the laser is 120KHz, the light spot delay time of the laser is 200 mus, the processing moving speed is 150mm/min, and the processing allowance is 0.02 mm.
- 5. A method of machining a PCD grinding head according to any one of claims 1 to 4, wherein the preparation of the PCD blank in the preparing step includes: selecting a PCD composite substrate, and cutting the PCD composite substrate into a PCD composite body blank by utilizing linear cutting.
- 6. The method of fabricating a PCD grinding head according to claim 5, wherein the PCD composite substrate is a cylindrical part with a diameter of 13mm ± 2mm and a height of 8mm ± 2mm, and the PCD composite body blank is a cylindrical part with a diameter of 3mm ± 1mm and a height of 8mm ± 2 mm; and/or the presence of a gas in the atmosphere,the PCD composite substrate comprises a hard alloy base and a polycrystalline diamond composite layer, wherein one end of the hard alloy base is used for being welded with a grinding head base body, the polycrystalline diamond composite layer is arranged at the other end of the hard alloy base and is formed by adding metal cobalt into polycrystalline diamond powder and sintering, the height of the polycrystalline diamond composite layer is 3-4 mm, the thermal stability of the polycrystalline diamond composite layer is larger than or equal to 750 ℃, in addition, in the polycrystalline diamond composite layer, the average grain size of the polycrystalline diamond powder is 2 mu m, and the volume content of the polycrystalline diamond powder is 92%.
- 7. A method of machining a PCD grinding head according to any one of claims 1 to 4, wherein the welding step comprises: welding the PCD composite main body blank to one end of the grinding head substrate in a vacuum welding mode; and/or the presence of a gas in the atmosphere,the method also comprises a clamping step between the welding step and the laser rough machining step: and (2) putting the welded PCD grinding head blank into a cold pressing collet chuck, putting the cold pressing collet chuck with the PCD grinding head blank into a cold pressing handle, and pressing the PCD grinding head blank on a cold press.
- 8. A method of machining a PCD grinding head according to any one of claims 1 to 4, wherein the method of machining a PCD grinding head further comprises a polishing step after the laser machining step: and polishing the PCD grinding head after the laser rough machining is finished.
- 9. A method of machining a PCD grinding head according to claim 8, wherein the polishing step is carried out by: and polishing the PCD grinding head after the laser rough machining is finished by using diamond emulsion with the granularity of 0.5 mu m.
- A PCD grinding head comprising a grinding head substrate and a PCD composite grinding head body provided at one end of the grinding head substrate, wherein the PCD grinding head is manufactured by the method for manufacturing a PCD grinding head according to any one of claims 1 to 9.
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