CN110085724B - 一种护眼led光源 - Google Patents
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- 239000000843 powder Substances 0.000 claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000741 silica gel Substances 0.000 claims abstract description 8
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 8
- 230000009286 beneficial effect Effects 0.000 claims abstract description 5
- 241000218202 Coptis Species 0.000 claims abstract description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 230000005281 excited state Effects 0.000 description 3
- 230000005283 ground state Effects 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
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Abstract
本发明公开了一种护眼LED光源，包括LED支架、碗杯、点胶区，所述碗杯设置在LED支架上，碗杯内设置有点胶区，该点胶区上设有固晶区，所述固晶区设置有LED芯片，所述点胶区上还覆盖有荧光胶，该荧光胶完全包裹着LED芯片，所述LED支架的正负极通过金线连接，其特征在于：所述荧光胶由荧光粉和硅胶组成，该荧光粉和硅胶的比例为1:4，所述荧光粉为530nm绿粉、585nm黄粉、630nm红粉和670nm红粉按质量比为(14‑18)：(0.5‑1.5)：(2‑4)：(1‑3)的混合物。本发明将高能量蓝光比例做到最低，而有益的蓝光比例基本不改变，同时将CRI值调整到90以上，使物体显色更真实，照射物体还原更逼真，眼睛更舒适。
Description
技术领域
本发明涉及LED制造领域，特别涉及一种护眼LED光源。
背景技术
由于LED技术的迅猛发展，新型的LED照明光源以其节能、环保、耐用等特点越来越被人们所使用，正逐渐取代常规照明光源。但同时，LED光源对视网膜的危害以及对生物日常生活节律的影响也在提示我们要清醒地看到LED照明对人体生物安全方面的风险。
现有的技术方案一：采用高能量蓝光芯片激发荧光粉，将CRI数值做高，实际照射时颜色还原度高，但是其为了提升颜色还原逼真度和光效，使用的高能量蓝光比例较大，而高能量蓝光对人眼伤害最大；技术方案二：使用紫光芯片激发RGB荧光粉，蓝光相对较少，经过适当调整，CRI值较高，引入了紫外线光谱，同时，高能量蓝光比例相对较高，同时成本很高，市场使用率较低；技术方案三：采用的是OLED电流注入型发光显示器，在外加电压的驱动下，空穴和电子分别从正极和负极注入到有机材料中，空穴与电子在有机层中相遇、复合，释放出能量，将能量传递给有机发光物质的分子，使其从基态跃迁到激发态，激发态很不稳定，受激分子从激发态回到基态，辐射跃迁而产生发光现象，此光源光效低、容易破碎，生产时控制比较困难，并且由于尺寸比较大，使用较大功率照明时，结构受到很大限制，不良率非常高，成本昂贵，寿命短。
发明内容
为了克服现有技术的上述缺陷，本发明提供一种护眼LED光源，将高能量蓝光比例做到最低，而有益的蓝光比例基本不改变，同时将CRI值调整到90以上，使物体显色更真实，照射物体还原更逼真，眼睛更舒适。
本发明解决现有技术中的问题所采用的技术方案为：一种护眼LED光源，包括LED支架、碗杯、点胶区，所述碗杯设置在LED支架上，碗杯内设置有点胶区，该点胶区上设有固晶区，所述固晶区设置有LED芯片，所述点胶区上还覆盖有荧光胶，该荧光胶完全包裹着LED芯片，所述LED支架的正负极通过金线连接，其特征在于：所述荧光胶由荧光粉和硅胶组成，该荧光粉和硅胶的比例为1:4，所述荧光粉为530nm绿粉、585nm黄粉、630nm红粉和670nm红粉按质量比为(14-18)：(0.5-1.5)：(2-4)：(1-3)的混合物。
作为本发明的优选方案，所述固晶区的金属片为高导热红铜支架，LED芯片固定在金属表面。
作为本发明的优选方案，所述LED芯片的波长范围为455nm-460nm的蓝光，型号为三安 1734芯片。
作为本发明的优选方案，所述碗杯采用高导热PCT材质，碗杯的杯体可固定胶水成型。
与现有技术相比，本发明具有以下技术效果：
本发明通过所调试的一定比例荧光粉配比，将高能量蓝光比例做到最低，而有益光比例基本不变，同时调整各色粉和LED芯片的波长，将CRI值调整到90以上，使物体显色更真实，照射物体还原更逼真，眼睛更舒适。
附图说明
图1是本发明一种护眼LED光源的结构图；
图2是本发明一种护眼LED光源的光谱图和色品图。
图中标号：1-LED支架；2-固晶区；3-碗杯；4-点胶区；5-金线。
具体实施方式
下面结合附图对本发明的具体实施方式作进一步说明。在此需要说明的是，对于这些实施方式的说明用于帮助理解本发明，但并不构成对本发明的限定。此外，下面所描述的本发明实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互组合。
一种护眼LED光源，包括LED支架、碗杯、点胶区，所述碗杯设置在LED支架上，碗杯内设置有点胶区，该点胶区上设有固晶区，所述固晶区设置有LED芯片，所述点胶区上还覆盖有荧光胶，该荧光胶完全包裹着LED芯片，所述LED支架的正负极通过金线连接，其特征在于：所述荧光胶由荧光粉和硅胶组成，该荧光粉和硅胶的比例为1:4，所述荧光粉为530nm绿粉、585nm黄粉、630nm红粉和670nm红粉按质量比为(14-18)：(0.5-1.5)：(2-4)：(1-3) 的混合物，LED芯片通电激发荧光粉发白光。
作为本发明的优选方案，所述固晶区的金属片为高导热红铜支架，正常工作时热量通过金属传导散热，LED芯片固定在金属表面。
作为本发明的优选方案，所述LED芯片的波长范围为455nm-460nm的蓝光，型号为三安 1734芯片，通过提升芯片波长降低高能量蓝光波长。
作为本发明的优选方案，所述碗杯采用高导热PCT材质，碗杯的杯体可固定胶水成型，提高了产品的作业良率。
如图2光谱图和色品图所示：相关色温：Tc-0.3794；主波长：λd-457.0nm；色纯度：Purity-26.8％；峰值波长：λp-457.0nm；显色指数：Ra＝95.3，R1-96.71、R2-99.63、R3-98.67、 R4-90.50、R5-93.34、R6-95.45、R7-93.95、R8-94.23、R9-96.37、R10-97.57、R11-90.59、 R12-68.36、R13-98.19、R14-99.40、R15-94.88，除了R12之外，R1～R15都在90以上。
如下表数据所示：
市场普通的LED光源有害蓝光比例比本发明的光源高7.3％左右，而有益蓝光基本上保持不变。
最后应说明的是：以上所述仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (1)
1.一种护眼LED光源，包括LED支架、碗杯、点胶区，所述碗杯设置在LED支架上，碗杯内设置有点胶区，该点胶区上设有固晶区，所述固晶区设置有LED芯片，所诉点胶区上还覆盖有荧光胶，该荧光胶完全包裹着LED芯片，所述LED支架的正负极通过金线连接，其特征在于：所述荧光胶由荧光粉和硅胶组成，该荧光粉和硅胶的比例为1:4，所述荧光粉为530nm绿粉、585nm黄粉、630nm红粉和670nm红粉按质量比为(14-18)：(0.5-1.5)：(2-4)：(1-3)的混合物，所述LED芯片的波长范围为455nm-460nm的蓝光；
所述固晶区的金属片为高导热红铜支架，LED芯片固定在金属表面；
所述LED芯片的型号为三安1734芯片；
所述碗杯采用高导热PCT材质，碗杯的杯体可固定胶水成型；
将高能量蓝光比例做到最低，而有益的蓝光比例基本不改变，同时将CRI值调整到90以上，使物体显色更真实，照射物体还原更逼真。
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| CN112038465A (zh) * | 2020-09-08 | 2020-12-04 | 贵溪市清亮照明科技有限公司 | 一种去蓝光led芯片 |
| CN113540315A (zh) * | 2021-06-11 | 2021-10-22 | 东莞市立德达光电科技有限公司 | 一种植物照明led封装方法 |
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| CN207183266U (zh) * | 2017-06-29 | 2018-04-03 | 深圳市斯迈得半导体有限公司 | 一种高显指高亮度的白光led光源器件 |
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