CN110055027B - Middle-folding refractive index LED packaging silicone rubber material and preparation method thereof - Google Patents
Middle-folding refractive index LED packaging silicone rubber material and preparation method thereof Download PDFInfo
- Publication number
- CN110055027B CN110055027B CN201910363233.0A CN201910363233A CN110055027B CN 110055027 B CN110055027 B CN 110055027B CN 201910363233 A CN201910363233 A CN 201910363233A CN 110055027 B CN110055027 B CN 110055027B
- Authority
- CN
- China
- Prior art keywords
- refractive index
- component
- parts
- methyl phenyl
- hydrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 64
- 239000000463 material Substances 0.000 title claims abstract description 57
- 239000004945 silicone rubber Substances 0.000 title claims abstract description 52
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims abstract description 30
- -1 methyl phenyl vinyl Chemical group 0.000 claims abstract description 109
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229920002050 silicone resin Polymers 0.000 claims abstract description 61
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 57
- 239000001257 hydrogen Substances 0.000 claims abstract description 57
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229920002545 silicone oil Polymers 0.000 claims abstract description 43
- 239000003054 catalyst Substances 0.000 claims abstract description 32
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 32
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 23
- 239000003112 inhibitor Substances 0.000 claims abstract description 20
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 16
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 16
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 22
- 238000000227 grinding Methods 0.000 claims description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 16
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 13
- 238000003756 stirring Methods 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 6
- 239000012258 stirred mixture Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 claims description 3
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- JQZGUQIEPRIDMR-UHFFFAOYSA-N 3-methylbut-1-yn-1-ol Chemical compound CC(C)C#CO JQZGUQIEPRIDMR-UHFFFAOYSA-N 0.000 claims description 2
- 239000005046 Chlorosilane Substances 0.000 claims description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims description 2
- MOSXLDGILGBOSZ-UHFFFAOYSA-N ethenyl-methyl-phenylsilicon Chemical compound C=C[Si](C)C1=CC=CC=C1 MOSXLDGILGBOSZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical class O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000002834 transmittance Methods 0.000 abstract description 9
- 238000004383 yellowing Methods 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 description 19
- 239000000377 silicon dioxide Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 1
- 206010024769 Local reaction Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The middle-folding refractive index LED packaging silicone rubber material consists of a component A and a component B; the component A contains methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, methyl phenyl vinyl silicone oil with the refractive index of 1.48-1.52, platinum catalyst, inhibitor and modified nano silicon dioxide; the component B contains methyl phenyl hydrogen-containing silicone oil with the refractive index of 1.46-1.50, methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, methyl hydrogen-containing silicone resin, a tackifier and a centralized crosslinking agent. The invention also provides a preparation method of the LED packaging silicone rubber material with the middle refractive index. The LED packaging silicone rubber material with the middle refractive index has the advantages of ultrahigh transparency, high light transmittance, high heat resistance, high mechanical property, high yellowing resistance, moderate thixotropy and leveling property, high bonding property and high hardness after curing.
Description
Technical Field
The invention relates to the technical field of packaging silicon rubber materials, in particular to an LED packaging silicon rubber material with a middle refractive index and a preparation method thereof.
Background
Light Emitting Diodes (LEDs), as novel solid-state light sources, have the advantages of high efficiency, energy conservation, long service life, fast response, etc., and have been applied in a number of fields, such as: general illumination lamps, automotive light sources, traffic lights, and the like. The main encapsulating materials used for the LED encapsulation which are popular at present are epoxy resin, methyl silicone rubber with a refractive index of 1.41, methyl phenyl silicone rubber with a refractive index of 1.54, and the like. However, epoxy resin has the disadvantages of large internal stress, poor sulfuration resistance, easy yellowing at high temperature and the like, and is not suitable for application of high-power LEDs. The methyl silicone rubber with low refractive index has low hardness and poor anti-vulcanization effect due to the structure of the methyl silicone rubber, and the requirement of a high-power LED is difficult to meet. The high-refractive-index methyl phenyl silicone rubber is easy to cause ring opening of a benzene ring at high temperature and under the irradiation of ultraviolet light due to too high phenyl content, so that the colloid is yellowed or cracked, and the high-refractive-index methyl phenyl silicone rubber is not suitable for a high-power LED.
With the continuous progress of the production technology of the high-power white light LED, the requirement on the packaging material is increasingly increased. The packaging material not only has high mechanical strength, good thermal stability and transparency, but also can improve the light extraction efficiency of the LED chip. The existing packaging adhesive is difficult to meet the requirements of novel high-power LEDs, so that the development of the LED packaging adhesive capable of meeting the requirements of the high-power LEDs is urgent.
Disclosure of Invention
The invention aims to solve the technical problem of providing a middle-folding refractive index LED packaging silicone rubber material and a preparation method thereof. The technical scheme is as follows:
a middle-folding refractive index LED packaging silicon rubber material is characterized by consisting of a component A and a component B;
the component A comprises the following components in parts by weight: 40-60 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 30-50 parts of methyl phenyl vinyl silicone oil with the refractive index of 1.48-1.52, 0.05-0.2 part of platinum catalyst, 0.05-0.2 part of inhibitor and 8-15 parts of modified nano silicon dioxide;
the component B comprises the following components in parts by weight: 20-40 parts of methyl phenyl hydrogen-containing silicone oil with the refractive index of 1.46-1.50, 20-50 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 5-10 parts of methyl hydrogen-containing silicone resin, 4-10 parts of tackifier and 10-30 parts of centralized cross-linking agent;
the weight ratio of the component A to the component B is (1-3) to 1.
In a preferable embodiment, the mass fraction of phenyl groups in the methylphenyl vinyl silicon resin with the refractive index of 1.46-1.50 in the component A and the component B is 10-30%, the mass fraction of vinyl groups is 0.5-1.5%, and the viscosity is 7000-14000 mPa.s. The methyl phenyl vinyl silicone resin is used as a main component of the silicone rubber, and can form a three-dimensional structure with chain extenders such as methyl hydrogen-containing silicone resin and the like in the reaction process, so that the mechanical strength and hardness of the silicone rubber material are greatly improved.
In a preferred embodiment, the methylphenyl vinyl silicone oil with the refractive index of 1.48-1.52 comprises 25-40% of phenyl, 0.1-0.7% of vinyl and 15000-20000 mPa.s. The high-viscosity methyl phenyl vinyl silicone oil has longer molecular chains, can improve the toughness of the silicone rubber material and improve the high-temperature resistance of the silicone rubber material.
In a preferred embodiment, the platinum catalyst is one or more of a tetrahydrofuran-coordinated platinum catalyst, a methylvinylsiloxane-coordinated platinum catalyst, a diethyl phthalate-coordinated platinum catalyst, and an aminohydroxypolysiloxane-coordinated platinum catalyst.
In a preferred embodiment, the inhibitor is one or more of ethynylcyclohexanol, silanized alkynol, methylbutynol, propylethynylol, dimethylacetylene alcohol and diethyl maleate. The inhibitor forms a conjugate center with the platinum catalyst at low temperature to inhibit the catalytic action of the platinum catalyst; the inhibitor volatilizes under the high temperature condition and is separated from the platinum catalyst, so that the hydrosilylation reaction can be smoothly carried out. The existence of the inhibitor can prolong the storage time of the product and improve the storage stability of the product.
In a preferable scheme, the modified nano-silica is one or a compound of more of silazane-modified nano-silica, phenylsiloxane-modified nano-silica and chlorosilane-modified nano-silica. The refractive index of the modified nano silicon dioxide is between 1.45 and 1.50, is very close to that of the middle-folding silicone oil, and is in a completely transparent state when added into the whole system, so that the transmittance of the silicone rubber can be greatly improved. Moreover, the modified nano-silica is hydrophobic nano-silica, has good compatibility with a system and good dispersibility, and cannot generate agglomeration in the system.
In a preferable embodiment, the methylphenyl hydrogen-containing silicone oil with the refractive index of 1.46-1.50 has the mass fraction of phenyl groups of 10-30%, the mass fraction of hydrogen groups of 0.05-0.5% and the viscosity of 100-1000 mPa.s. The methyl phenyl hydrogen-containing silicone oil with low hydrogen content is used as a cross-linking agent, so that the toughness of the whole system can be enhanced, and the toughness and temperature resistance of the silicone rubber material can be improved. The methyl phenyl hydrogen-containing silicone oil has low hydrogen content, can release heat relatively uniformly in the reaction process, has relatively stable reaction, and can effectively inhibit the nonuniform reaction caused by over-quick local reaction.
In a preferable scheme, the methyl hydrogen-containing silicone resin is hydrogen-containing MQ silicone resin, the mass fraction of hydrogen radicals of the methyl hydrogen-containing silicone resin is 0.5-1%, and the viscosity of the methyl hydrogen-containing silicone resin is 100-300mPa. The methyl hydrogen-containing silicone resin can effectively improve the strength, rigidity, hardness and bonding strength of the silicone rubber material.
In a preferred embodiment, the tackifier is one or a mixture of two of the following substances represented by the structural formula (1) and the following substances represented by the structural formula (2):
(1)
(2)
the tackifier is an interface reinforcing agent with excellent performance, improves the adhesion capability between a silicon rubber material and an interface, and has good adhesive property for metal, PPA, silver coating, sapphire, ceramic and PCB.
In a preferred embodiment, the centralized crosslinking agent is one or a mixture of two of the following substances represented by the structural formula (3) and the following substances represented by the structural formula (4):
(3)
(4)
the concentrated crosslinking agent can improve the crosslinking density in a system, generate concentrated crosslinking, improve the strength of a silica gel system and further improve the hardness of the silica gel system.
The invention also provides a preparation method of the LED packaging silicone rubber material with the middle refractive index, which is characterized by comprising the following steps:
(1) preparation of component A
(1-1) preparing the following raw materials by weight: 40-60 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 30-50 parts of methyl phenyl vinyl silicone oil with the refractive index of 1.48-1.52, 0.05-0.2 part of platinum catalyst, 0.05-0.2 part of inhibitor and 8-15 parts of modified nano silicon dioxide;
(1-2) adding the methyl phenyl vinyl silicone resin, the methyl phenyl vinyl silicone oil, the platinum catalyst, the inhibitor and the modified nano silicon dioxide prepared in the step (1-1) into a stirrer, and stirring until the mixture is uniformly mixed; then grinding the uniformly stirred mixture (grinding can be carried out by using a roller machine), and monitoring the viscosity of the mixture by using a rheometer; stopping grinding when the viscosity of the mixture is 150-300Pa.s to obtain a component A;
(2) preparation of component B
(2-1) preparing the following raw materials by weight: 20-40 parts of methyl phenyl hydrogen-containing silicone oil with the refractive index of 1.46-1.50, 20-50 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 5-10 parts of methyl hydrogen-containing silicone resin, 4-10 parts of tackifier and 10-30 parts of centralized cross-linking agent;
(2-2) adding the methyl phenyl hydrogen-containing silicone oil, the methyl phenyl vinyl silicone resin, the methyl hydrogen-containing silicone resin, the tackifier and the centralized crosslinking agent prepared in the step (2-1) into a stirrer, and stirring until the components are uniformly mixed to obtain a component B;
(3) preparation of
Respectively storing the component A prepared in the step (1) and the component B prepared in the step (2); when the LED is required to be packaged, uniformly mixing the component A prepared in the step (1) and the component B prepared in the step (2) according to the weight ratio of (1-3) to 1, and then carrying out vacuum defoaming for 10-30min to obtain the LED packaging silicone rubber material with the middle refractive index.
Dispensing or encapsulating the LED packaging silicone rubber material with the middle refractive index obtained in the step (3) on a to-be-packaged piece, heating for 1-2 h at the temperature of 80-120 ℃, and then heating for 3-5 h at the temperature of 150-200 ℃ for curing to finish packaging.
The LED packaging silicone rubber material with the middle refractive index has ultrahigh transparency and light transmittance, good heat resistance and high mechanical property; because the content of the phenyl is lower, the adhesive has better yellowing resistance, moderate thixotropy and leveling property and stronger bonding property. The refractive index of the middle-folding refractive index LED packaging silicon rubber material is 1.45-1.48, the viscosity is 150-300Pa.s, the thixotropic index is 3-6, and the hardness after curing is higher (45-75D). The preparation method of the middle-folding refractive index LED packaging silicone rubber material is simple and convenient to operate, easy to obtain raw materials, easy to control, pollution-free, mild in condition and convenient to industrialize.
Detailed Description
Example 1
In this embodiment, the preparation method of the middle-refractive index LED packaging silicone rubber material includes the following steps:
(1) preparation of component A
(1-1) preparing the following raw materials by weight: 40 parts of methyl phenyl vinyl silicone resin (the refractive index of the methyl phenyl vinyl silicone resin is 1.46, the mass fraction of phenyl is 10%, the mass fraction of vinyl is 0.5%, and the viscosity of the methyl phenyl vinyl silicone resin is 14000 mPa.s), 50 parts of methyl phenyl vinyl silicone oil (the refractive index of the methyl phenyl vinyl silicone oil is 1.48, the mass fraction of phenyl is 25%, the mass fraction of vinyl is 0.7%, and the viscosity of the methyl phenyl vinyl silicone oil is 15000 mPa.s), 0.05 parts of platinum catalyst (all platinum catalyst coordinated with diethyl phthalate), 0.05 parts of inhibitor (all ethynyl cyclohexanol), and 9.9 parts of modified nano-silica (all nano-silica modified by phenyl siloxane);
(1-2) adding the methyl phenyl vinyl silicone resin, the methyl phenyl vinyl silicone oil, the platinum catalyst, the inhibitor and the modified nano silicon dioxide prepared in the step (1-1) into a stirrer, and stirring until the mixture is uniformly mixed; then grinding the uniformly stirred mixture (grinding can be carried out by using a roller machine), and monitoring the viscosity of the mixture by using a rheometer; stopping grinding when the viscosity of the mixture is 200 Pa.s to obtain a component A;
(2) preparation of component B
(2-1) preparing the following raw materials by weight: 40 parts of methyl phenyl hydrogen-containing silicone oil (the refractive index is 1.46, the mass fraction of phenyl is 10%, the mass fraction of hydrogen radicals is 0.05%, and the viscosity is 1000 mPa.s), 20 parts of methyl phenyl vinyl silicone resin (the refractive index is 1.46, the mass fraction of phenyl is 10%, the mass fraction of vinyl is 0.5%, and the viscosity is 14000 mPa.s), 5 parts of methyl hydrogen-containing silicone resin (all hydrogen-containing MQ silicone resins, the mass fraction of hydrogen radicals is 1%, and the viscosity is 100 mPa.s), 10 parts of tackifier, and 25 parts of centralized crosslinking agent;
the tackifiers in this example were all represented by the following structural formula (1):
(1)
the centralized crosslinking agents in this example are all represented by the following structural formula (3):
(3)
(2-2) adding the methyl phenyl hydrogen-containing silicone oil, the methyl phenyl vinyl silicone resin, the methyl hydrogen-containing silicone resin, the tackifier and the centralized crosslinking agent prepared in the step (2-1) into a stirrer, and stirring until the components are uniformly mixed to obtain a component B;
(3) preparation of
Respectively storing the component A prepared in the step (1) and the component B prepared in the step (2); when the LED is required to be packaged, uniformly mixing the component A prepared in the step (1) and the component B prepared in the step (2) according to the weight ratio of 1:1, and then performing vacuum defoaming for 30min to obtain the LED packaging silicone rubber material with the middle refractive index.
Dispensing or encapsulating the middle-folding refractive index LED packaging silicone rubber material obtained in the step (3) on a to-be-packaged piece, heating for 1h at the temperature of 80 ℃, and then heating for 3 h at the temperature of 200 ℃ for curing to complete packaging.
Example 2
In this embodiment, the preparation method of the middle-refractive index LED packaging silicone rubber material includes the following steps:
(1) preparation of component A
(1-1) preparing the following raw materials by weight: 47 parts of methyl phenyl vinyl silicone resin (the refractive index of the methyl phenyl vinyl silicone resin is 1.48, the mass fraction of phenyl is 15%, the mass fraction of vinyl is 0.8%, and the viscosity is 10000 mPa.s), 42 parts of methyl phenyl vinyl silicone oil (the refractive index of the methyl phenyl vinyl silicone oil is 1.50, the mass fraction of phenyl is 35%, the mass fraction of vinyl is 0.4%, and the viscosity is 17000 mPa.s), 0.1 part of platinum catalyst (all platinum catalysts coordinated by methyl vinyl siloxane), 0.1 part of inhibitor (all methyl butinol), and 10.8 parts of modified nano-silica (all nano-silica modified by silazane);
(1-2) adding the methyl phenyl vinyl silicone resin, the methyl phenyl vinyl silicone oil, the platinum catalyst, the inhibitor and the modified nano silicon dioxide prepared in the step (1-1) into a stirrer, and stirring until the mixture is uniformly mixed; then grinding the uniformly stirred mixture (grinding can be carried out by using a roller machine), and monitoring the viscosity of the mixture by using a rheometer; stopping grinding when the viscosity of the mixture is 250 Pa.s to obtain a component A;
(2) preparation of component B
(2-1) preparing the following raw materials by weight: 30 parts of methyl phenyl hydrogen-containing silicone oil (the refractive index is 1.48, the mass fraction of phenyl is 20%, the mass fraction of hydrogen radicals is 0.25%, and the viscosity is 500 mPa.s), 35 parts of methyl phenyl vinyl silicone resin (the refractive index is 1.50, the mass fraction of phenyl is 30%, the mass fraction of vinyl is 1.5%, and the viscosity is 7000 mPa.s), 7.5 parts of methyl hydrogen-containing silicone resin (all hydrogen-containing MQ silicone resins, the mass fraction of hydrogen radicals is 0.75%, and the viscosity is 200 mPa.s), 7 parts of tackifier, and 10.5 parts of centralized crosslinking agent;
the tackifiers in this example were all represented by the following structural formula (1):
(1)
the centralized crosslinking agents in this example are all represented by the following structural formula (4):
(4)
(2-2) adding the methyl phenyl hydrogen-containing silicone oil, the methyl phenyl vinyl silicone resin, the methyl hydrogen-containing silicone resin, the tackifier and the centralized crosslinking agent prepared in the step (2-1) into a stirrer, and stirring until the components are uniformly mixed to obtain a component B;
(3) preparation of
Respectively storing the component A prepared in the step (1) and the component B prepared in the step (2); when the LED is required to be packaged, uniformly mixing the component A prepared in the step (1) and the component B prepared in the step (2) according to the weight ratio of 2:1, and then performing vacuum defoaming for 20 min to obtain the LED packaging silicone rubber material with the middle refractive index.
Dispensing or encapsulating the middle-folding refractive index LED packaging silicone rubber material obtained in the step (3) on a to-be-packaged piece, heating for 1.5 h at the temperature of 100 ℃, and then heating for 3 h at the temperature of 180 ℃ for curing to complete packaging.
Example 3
In this embodiment, the preparation method of the middle-refractive index LED packaging silicone rubber material includes the following steps:
(1) preparation of component A
(1-1) preparing the following raw materials by weight: 51 parts of methyl phenyl vinyl silicone resin (the refractive index of the methyl phenyl vinyl silicone resin is 1.46, the mass fraction of phenyl is 10%, the mass fraction of vinyl is 0.9%, and the viscosity of the methyl phenyl vinyl silicone resin is 12000 mPa.s), 38 parts of methyl phenyl vinyl silicone oil (the refractive index of the methyl phenyl vinyl silicone oil is 1.50, the mass fraction of phenyl is 35%, the mass fraction of vinyl is 0.45%, and the viscosity of the methyl phenyl vinyl silicone oil is 18000 mPa.s), 0.17 part of platinum catalyst (all platinum catalyst coordinated with diethyl phthalate), 0.17 part of inhibitor (all ethynyl cyclohexanol), and 10.66 parts of modified nano-silica (5.66 parts of silazane-modified nano-silica and 5 parts of chlorosilane-modified nano-silica);
(1-2) adding the methyl phenyl vinyl silicone resin, the methyl phenyl vinyl silicone oil, the platinum catalyst, the inhibitor and the modified nano silicon dioxide prepared in the step (1-1) into a stirrer, and stirring until the mixture is uniformly mixed; then grinding the uniformly stirred mixture (grinding can be carried out by using a roller machine), and monitoring the viscosity of the mixture by using a rheometer; stopping grinding when the viscosity of the mixture is 200 Pa.s to obtain a component A;
(2) preparation of component B
(2-1) preparing the following raw materials by weight: 27 parts of methyl phenyl hydrogen-containing silicone oil (the refractive index is 1.47, the mass fraction of phenyl is 15%, the mass fraction of hydrogen radicals is 0.35%, and the viscosity is 1000 mPa.s), 38 parts of methyl phenyl vinyl silicone resin (the refractive index is 1.46, the mass fraction of phenyl is 10%, the mass fraction of vinyl is 0.9%, and the viscosity is 12000 mPa.s), 8 parts of methyl hydrogen-containing silicone resin (all hydrogen-containing MQ silicone resins, the mass fraction of hydrogen radicals is 1%, and the viscosity is 150 mPa.s), 7 parts of tackifier, and 20 parts of centralized cross-linking agent;
the tackifiers in this example were all represented by the following structural formula (2):
(2)
the centralized crosslinking agents in this example are all represented by the following structural formula (3):
(3)
(2-2) adding the methyl phenyl hydrogen-containing silicone oil, the methyl phenyl vinyl silicone resin, the methyl hydrogen-containing silicone resin, the tackifier and the centralized crosslinking agent prepared in the step (2-1) into a stirrer, and stirring until the components are uniformly mixed to obtain a component B;
(3) preparation of
Respectively storing the component A prepared in the step (1) and the component B prepared in the step (2); when the LED is required to be packaged, uniformly mixing the component A prepared in the step (1) and the component B prepared in the step (2) according to the weight ratio of 1.5:1, and performing vacuum defoaming for 30min to obtain the LED packaging silicone rubber material with the middle refractive index.
Dispensing or encapsulating the middle-folding refractive index LED packaging silicone rubber material obtained in the step (3) on a to-be-packaged piece, heating for 1h at 120 ℃, and then heating for 3 h at 200 ℃ for curing to complete packaging.
Example 4
In this embodiment, the preparation method of the middle-refractive index LED packaging silicone rubber material includes the following steps:
(1) preparation of component A
(1-1) preparing the following raw materials by weight: 56 parts of methyl phenyl vinyl silicone resin (the refractive index of which is 1.50, the mass fraction of phenyl is 30%, the mass fraction of vinyl is 1.5%, and the viscosity is 7000 mPa.s), 30 parts of methyl phenyl vinyl silicone oil (the refractive index of which is 1.52, the mass fraction of phenyl is 40%, the mass fraction of vinyl is 0.1%, and the viscosity is 20000 mPa.s), 0.2 parts of platinum catalyst (all platinum catalysts coordinated by tetrahydrofuran), 0.2 parts of inhibitor (all diethyl maleate), and 13.9 parts of modified nano-silica (all nano-silica modified by chlorosilane);
(1-2) adding the methyl phenyl vinyl silicone resin, the methyl phenyl vinyl silicone oil, the platinum catalyst, the inhibitor and the modified nano silicon dioxide prepared in the step (1-1) into a stirrer, and stirring until the mixture is uniformly mixed; then grinding the uniformly stirred mixture (grinding can be carried out by using a roller machine), and monitoring the viscosity of the mixture by using a rheometer; stopping grinding when the viscosity of the mixture is 300Pa.s to obtain a component A;
(2) preparation of component B
(2-1) preparing the following raw materials by weight: 20 parts of methyl phenyl hydrogen-containing silicone oil (the refractive index is 1.50, the mass fraction of phenyl is 30%, the mass fraction of hydrogen radicals is 0.5%, and the viscosity is 100 mPa.s), 50 parts of methyl phenyl vinyl silicone resin (the refractive index is 1.50, the mass fraction of phenyl is 30%, the mass fraction of vinyl is 1.5%, and the viscosity is 7000 mPa.s), 10 parts of methyl hydrogen-containing silicone resin (all hydrogen-containing MQ silicone resins, the mass fraction of hydrogen radicals is 1%, and the viscosity is 300 mPa.s), 4 parts of tackifier, and 16 parts of centralized cross-linking agent;
the tackifiers in this example were all represented by the following structural formula (2):
(2)
the centralized crosslinking agents in this example are all represented by the following structural formula (4):
(4)
(2-2) adding the methyl phenyl hydrogen-containing silicone oil, the methyl phenyl vinyl silicone resin, the methyl hydrogen-containing silicone resin, the tackifier and the centralized crosslinking agent prepared in the step (2-1) into a stirrer, and stirring until the components are uniformly mixed to obtain a component B;
(3) preparation of
Respectively storing the component A prepared in the step (1) and the component B prepared in the step (2); when the LED is required to be packaged, uniformly mixing the component A prepared in the step (1) and the component B prepared in the step (2) according to the weight ratio of 3:1, and then performing vacuum defoaming for 30min to obtain the LED packaging silicone rubber material with the middle refractive index.
Dispensing or encapsulating the middle-folding refractive index LED packaging silicone rubber material obtained in the step (3) on a to-be-packaged piece, heating for 1h at the temperature of 120 ℃, and then heating for 5 h at the temperature of 150 ℃ for curing to complete packaging.
The following performance tests were performed on the middle-refractive index LED package silicone rubber materials described in examples 1 to 4:
testing the viscosity; using TA company AR1500ex viscometer at 0.5s-1And 5.0s-1The viscosity Vis1 and Vis2 are measured at the speed, wherein Vis1 is the viscosity of the silicone rubber material for the LED packaging with the medium-refractive index, and the thixotropic index is the ratio Vis1/Vis 2.
Testing the light transmittance; the middle-folding refractive index LED packaging silicon rubber materials of the examples 1-4 are made into thin sheet test samples of 20mm x 2mm, and a spectrophotometer is used for testing the light transmittance of the samples when the wavelength of incident light is 450 nm; and simultaneously, respectively aging the sample in a constant-temperature oven at 250 ℃ for 1000h and in a constant-temperature oven at 300 ℃ for 8h, and testing the light transmittance attenuation value of the sample when the wavelength of incident light is 450nm by using a spectrophotometer.
Testing the heat resistance performance of the adhesive force; the middle refractive index LED encapsulation silicone rubber materials of examples 1 to 4 were respectively dispensed on the aluminum substrate, the PET film, the ceramic filament support, and the sapphire filament support, and cured and molded to obtain a shear sample of the aluminum substrate and a peel sample of the PET film.
Testing hardness; the middle-fold refractive index LED package silicone rubber materials of examples 1-4 were cured and molded, cut into prescribed size samples according to GB/T531-1999, and tested for Shore D (or Shore A) hardness.
Testing the refractive index; the refractive index of the LED package silicone rubber materials of examples 1-4 was measured using an Abbe refractometer.
Comparative example 1
A commercially available low-folding silicone rubber material is subjected to the following performance tests: testing the viscosity; testing the light transmittance; testing the heat resistance performance of the adhesive force; testing hardness; testing refractive index. The test method was the same as in examples 1 to 4.
Comparative example 2
A commercially available high-folding silicone rubber material is subjected to the following performance tests: testing the viscosity; testing the light transmittance; testing the heat resistance performance of the adhesive force; testing hardness; testing refractive index. The test method was the same as in examples 1 to 4.
The results of the above tests are shown in the following table one.
Watch 1
As can be seen from the table I, the LED packaging silicone rubber material with the medium refractive index has higher hardness, shear strength and peel strength and better adhesive force to a base material compared with a low refractive index silicone rubber material and a high refractive index silicone rubber material. The initial light transmittance of the middle-folding refractive index LED packaging silicon rubber material is far higher than that of the low-folding silicon rubber material, and the light attenuation resistance and yellowing resistance of the middle-folding refractive index LED packaging silicon rubber material are far better than those of the high-folding silicon rubber. Therefore, the LED packaging silicon rubber material with the middle refractive index has a good application prospect in the market.
Claims (6)
1. A middle-folding refractive index LED packaging silicon rubber material is characterized by consisting of a component A and a component B;
the component A comprises the following components in parts by weight: 40-60 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 30-50 parts of methyl phenyl vinyl silicone oil with the refractive index of 1.48-1.52, 0.05-0.2 part of platinum catalyst, 0.05-0.2 part of inhibitor and 8-15 parts of modified nano silicon dioxide;
the component B comprises the following components in parts by weight: 20-40 parts of methyl phenyl hydrogen-containing silicone oil with the refractive index of 1.46-1.50, 20-50 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 5-10 parts of methyl hydrogen-containing silicone resin, 4-10 parts of tackifier and 10-30 parts of centralized cross-linking agent;
the weight ratio of the component A to the component B is (1-3) to 1;
the centralized crosslinking agent is one or a mixture of two of the following substances shown in a structural formula (3) and a structural formula (4):
the mass fraction of phenyl groups of the methyl phenyl vinyl silicon resin with the refractive index of 1.46-1.50 in the component A and the component B is 10-30%, the mass fraction of vinyl groups is 0.5-1.5%, and the viscosity is 7000-14000 mPa.s;
the methyl phenyl vinyl silicone oil with the refractive index of 1.48-1.52 comprises 25-40% of phenyl, 0.1-0.7% of vinyl and 15000-20000 mPa.s;
the mass fraction of phenyl groups of the methylphenyl hydrogen-containing silicone oil with the refractive index of 1.46-1.50 is 10-30%, the mass fraction of hydrogen groups is 0.05-0.5%, and the viscosity is 100-1000 mPa.s.
2. The middle-folding refractive index LED packaging silicone rubber material as claimed in claim 1, wherein: the platinum catalyst is one or a compound of a plurality of tetrahydrofuran coordinated platinum catalysts, methyl vinyl siloxane coordinated platinum catalysts, diethyl phthalate coordinated platinum catalysts and amino hydroxyl polysiloxane coordinated platinum catalysts; the inhibitor is one or more of ethynylcyclohexanol, silanized alkynol, methylbutynol, propyl ethynyl alcohol, dimethyl ethynyl alcohol and diethyl maleate.
3. The middle-folding refractive index LED packaging silicone rubber material as claimed in claim 1, wherein: the modified nano silicon dioxide is one or a compound of more of silazane modified nano silicon dioxide, phenylsiloxane modified nano silicon dioxide and chlorosilane modified nano silicon dioxide.
4. The middle-folding refractive index LED packaging silicone rubber material as claimed in claim 1, wherein: the methyl hydrogen-containing silicon resin is hydrogen-containing MQ silicon resin, the mass fraction of hydrogen radical is 0.5-1%, and the viscosity is 100-300 mPa.s.
5. The middle-folding refractive index LED packaging silicone rubber material as claimed in claim 1, wherein: the tackifier is one or a mixture of two of the following substances shown in a structural formula (1) and a structural formula (2):
6. the preparation method of the middle-folding refractive index LED packaging silicone rubber material as claimed in claim 1, characterized by comprising the following steps:
(1) preparation of component A
(1-1) preparing the following raw materials by weight: 40-60 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 30-50 parts of methyl phenyl vinyl silicone oil with the refractive index of 1.48-1.52, 0.05-0.2 part of platinum catalyst, 0.05-0.2 part of inhibitor and 8-15 parts of modified nano silicon dioxide;
(1-2) adding the methyl phenyl vinyl silicone resin, the methyl phenyl vinyl silicone oil, the platinum catalyst, the inhibitor and the modified nano silicon dioxide prepared in the step (1-1) into a stirrer, and stirring until the mixture is uniformly mixed; then grinding the uniformly stirred mixture, and monitoring the viscosity of the mixture by using a rheometer; stopping grinding when the viscosity of the mixture is 150-300Pa.s to obtain a component A;
(2) preparation of component B
(2-1) preparing the following raw materials by weight: 20-40 parts of methyl phenyl hydrogen-containing silicone oil with the refractive index of 1.46-1.50, 20-50 parts of methyl phenyl vinyl silicone resin with the refractive index of 1.46-1.50, 5-10 parts of methyl hydrogen-containing silicone resin, 4-10 parts of tackifier and 10-30 parts of centralized cross-linking agent;
(2-2) adding the methyl phenyl hydrogen-containing silicone oil, the methyl phenyl vinyl silicone resin, the methyl hydrogen-containing silicone resin, the tackifier and the centralized crosslinking agent prepared in the step (2-1) into a stirrer, and stirring until the components are uniformly mixed to obtain a component B;
(3) preparation of
Respectively storing the component A prepared in the step (1) and the component B prepared in the step (2); when the LED is required to be packaged, uniformly mixing the component A prepared in the step (1) and the component B prepared in the step (2) according to the weight ratio of (1-3) to 1, and then carrying out vacuum defoaming for 10-30min to obtain the LED packaging silicone rubber material with the middle refractive index.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910363233.0A CN110055027B (en) | 2019-04-30 | 2019-04-30 | Middle-folding refractive index LED packaging silicone rubber material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910363233.0A CN110055027B (en) | 2019-04-30 | 2019-04-30 | Middle-folding refractive index LED packaging silicone rubber material and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110055027A CN110055027A (en) | 2019-07-26 |
| CN110055027B true CN110055027B (en) | 2022-01-11 |
Family
ID=67322002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910363233.0A Active CN110055027B (en) | 2019-04-30 | 2019-04-30 | Middle-folding refractive index LED packaging silicone rubber material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110055027B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110511723B (en) * | 2019-08-23 | 2021-04-02 | 复旦大学 | Liquid crystal display device bonded organic silicon adhesive and preparation method thereof |
| CN111117479A (en) * | 2019-12-26 | 2020-05-08 | 江西贝特利新材料有限公司 | Special organic silicon explosion-proof protective coating applied to glass material and preparation and use methods thereof |
| CN110951412B (en) * | 2019-12-26 | 2021-10-26 | 深圳市安品有机硅材料有限公司 | Organic silicon tackifying material and preparation method and application thereof |
| CN112029293A (en) * | 2020-09-15 | 2020-12-04 | 沅陵县成瑞祥粉体材料科技有限公司 | Electron tube packaging silicon rubber |
| CN112322251B (en) * | 2020-10-27 | 2021-12-07 | 复旦大学 | Thermosetting yellowing-resistant full-lamination special material and preparation method and application thereof |
| CN112420892B (en) * | 2020-10-28 | 2021-11-16 | 吉安市木林森半导体材料有限公司 | Ultraviolet LED lamp bead bonded by silazane and preparation method thereof |
| CN112538334B (en) * | 2020-12-09 | 2022-05-27 | 成都硅宝科技股份有限公司 | Organic silicon packaging material for photovoltaic module and preparation method thereof |
| CN113105745A (en) * | 2021-04-21 | 2021-07-13 | 东莞市溢美材料科技有限公司 | Preparation method of high-hardness high-strength liquid molded silicone rubber composition |
| CN113683893B (en) * | 2021-08-19 | 2022-09-20 | 江苏矽时代材料科技有限公司 | Low-density high-hardness high-toughness organic silicon SMC resin composition, and preparation method and application thereof |
| CN114752344B (en) * | 2022-02-18 | 2024-02-23 | 航天科工防御技术研究试验中心 | Preparation method and application of wide-temperature adhesive |
| CN115011304B (en) * | 2022-07-25 | 2023-12-05 | 惠州市华利新材料有限公司 | Optical bonding pouring sealant and preparation method thereof |
| CN115895274A (en) * | 2022-11-24 | 2023-04-04 | 惠州市众恺新材料有限公司 | High-reflection organic silicon composite material composition and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105219100A (en) * | 2015-11-12 | 2016-01-06 | 三友（天津）高分子技术有限公司 | A kind of organic silicon resin encapsulant for LED and preparation method thereof |
| CN107312339A (en) * | 2017-06-28 | 2017-11-03 | 广州惠利电子材料有限公司 | White-light LED encapsulation silica gel and its preparation method and application |
| CN109554159A (en) * | 2018-11-13 | 2019-04-02 | 汕头市骏码凯撒有限公司 | A kind of LED silicone insulation crystal-bonding adhesive and preparation method thereof |
| CN109628061A (en) * | 2018-11-12 | 2019-04-16 | 烟台德邦科技有限公司 | Medium-refractive-index vulcanization-resistant LED packaging silica gel |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665623B (en) * | 2009-10-15 | 2011-07-06 | 成都拓利化工实业有限公司 | Double-component addition self-adhesive silicon rubber |
| CN106010427B (en) * | 2016-06-28 | 2019-03-29 | 烟台德邦科技有限公司 | A kind of resistance to vulcanization LED packaging silicon rubber of high refractive index high tenacity |
-
2019
- 2019-04-30 CN CN201910363233.0A patent/CN110055027B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105219100A (en) * | 2015-11-12 | 2016-01-06 | 三友（天津）高分子技术有限公司 | A kind of organic silicon resin encapsulant for LED and preparation method thereof |
| CN107312339A (en) * | 2017-06-28 | 2017-11-03 | 广州惠利电子材料有限公司 | White-light LED encapsulation silica gel and its preparation method and application |
| CN109628061A (en) * | 2018-11-12 | 2019-04-16 | 烟台德邦科技有限公司 | Medium-refractive-index vulcanization-resistant LED packaging silica gel |
| CN109554159A (en) * | 2018-11-13 | 2019-04-02 | 汕头市骏码凯撒有限公司 | A kind of LED silicone insulation crystal-bonding adhesive and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| MQ硅树脂对加成型室温硫化硅橡胶性能的影响;戚云霞等;《山东化工》;20051230;第34卷(第06期);全文 * |
| 加成型硅橡胶隔热及力学改性的研究进展;王晓晴等;《弹性体》;20170425;第27卷(第02期);全文 * |
| 气相法白炭黑补强加成型RTV硅橡胶的研究;舒本勤等;《合成材料老化与应用》;20080915;第37卷(第03期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110055027A (en) | 2019-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110055027B (en) | Middle-folding refractive index LED packaging silicone rubber material and preparation method thereof | |
| CN102965069B (en) | A kind of resistance to sulfuration LED silica gel | |
| CN103013431B (en) | High-refractivity LED (Light-Emitting Diode) package silica gel | |
| CN103725249B (en) | A kind of high index of refraction LED packaging silicon rubber | |
| CN110183979B (en) | Multilayer composite film and use thereof | |
| CN103665879B (en) | A kind of high-power LED encapsulation silicone gel composition | |
| CN106010427B (en) | A kind of resistance to vulcanization LED packaging silicon rubber of high refractive index high tenacity | |
| CN102153863A (en) | Resin composition for encapsulating optical semiconductor element and optical semiconductor device | |
| CN103627178A (en) | Liquid silicone rubber composition for LED (Light Emitting Diode) packaging and preparation method of composition | |
| CN105315675A (en) | Ultraviolet light-curing composition | |
| CN105176483A (en) | High-refractive-index, high-toughness and vulcanization-resistant LED packaging silicone rubber | |
| Pan et al. | Synthesis of epoxy-modified methyl phenyl silicone resins for LED encapsulation | |
| CN104882529B (en) | A kind of fast packing method of COB types LED chip | |
| CN110268019A (en) | Curable silicon-ketone composition | |
| CN109266302A (en) | A kind of high refractive index LED packaging silicon rubber of modification | |
| CN106221237A (en) | A kind of LED encapsulation organic silica gel and preparation method thereof | |
| CN106995530B (en) | Siloxane epoxides, curable silicone compositions and uses thereof | |
| CN107502279B (en) | High-temperature-resistant thixotropic LED packaging adhesive and preparation method thereof | |
| CN109280536B (en) | LED packaging silica gel with high cohesiveness and high sulfuration resistance and preparation method thereof | |
| CN109749699B (en) | Silica gel composition, application thereof and LED support packaging material | |
| CN109294514A (en) | A kind of LED chip organosilicon crystal-bonding adhesive | |
| CN112251190B (en) | LED packaging adhesive composition | |
| CN111410932B (en) | Methyl organosilicon adhesive with excellent flexibility and strong adhesion for LED | |
| CN114276778A (en) | Organic silicon adhesive for packaging LED chip | |
| TWI814986B (en) | Resin composition for wafer-level optical semiconductor devices, and wafer-level optical semiconductor devices using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |